US2446331A - Electrodeposition of aluminum - Google Patents
Electrodeposition of aluminum Download PDFInfo
- Publication number
- US2446331A US2446331A US522375A US52237544A US2446331A US 2446331 A US2446331 A US 2446331A US 522375 A US522375 A US 522375A US 52237544 A US52237544 A US 52237544A US 2446331 A US2446331 A US 2446331A
- Authority
- US
- United States
- Prior art keywords
- aluminum
- bath
- pyridinium
- chloride
- electrodeposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052782 aluminium Inorganic materials 0.000 title description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title description 18
- 238000004070 electrodeposition Methods 0.000 title description 5
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 26
- 239000000203 mixture Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- ABFDKXBSQCTIKH-UHFFFAOYSA-M 1-ethylpyridin-1-ium;bromide Chemical compound [Br-].CC[N+]1=CC=CC=C1 ABFDKXBSQCTIKH-UHFFFAOYSA-M 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- AMFMJCAPWCXUEI-UHFFFAOYSA-M 1-ethylpyridin-1-ium;chloride Chemical compound [Cl-].CC[N+]1=CC=CC=C1 AMFMJCAPWCXUEI-UHFFFAOYSA-M 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- -1 aluminum halide Chemical class 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000011876 fused mixture Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- VLXNIJYKZDUDTN-UHFFFAOYSA-N ethene;pyridin-1-ium;dichloride Chemical compound [Cl-].[Cl-].C=C.C1=CC=[NH+]C=C1.C1=CC=[NH+]C=C1 VLXNIJYKZDUDTN-UHFFFAOYSA-N 0.000 description 1
- NNGXPHNZXAIRIL-UHFFFAOYSA-N ethene;pyridine Chemical compound C=C.C1=CC=NC=C1.C1=CC=NC=C1 NNGXPHNZXAIRIL-UHFFFAOYSA-N 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011255 nonaqueous electrolyte Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
Definitions
- This invention relates to the electrodeposition of aluminum, and particularly to a process involving the deposition of aluminum on a suitable cathode from an electrolyte comprising a fused or liquid mixture of a suitable aluminum salt with an N-alkyl pyridinium halide.
- a further object of the present invention is to provide a novel electroplating bath which can be successfully employed for electrodeposition of aluminum.
- a still further object of the present invention is to provide a bath for the electrodeposition of aluminum which has a relatively high electrical conductivity, a low voltage requirement, and in which high electrode efflciencies are obtained.
- I employ a bath composed essentially of a fused or liquid mixture of an N-alkyl pyridinium halide and an anhydrous aluminum halide, preferably aluminum chloride.
- I have successfully employed solutions of anhydrous aluminum chloride in various anhydrous fused pyridinium compounds, particularly ethyl pyridinium bromide, ethyl pyridinium chloride, ethylene dipyridinium dlbromide, and ethylene dipyridinium dichloride.
- the bath is prepared by mixing the aluminum salt and the pyridinium compound together, melting the mixture by heating, if desired.
- the addition of the aluminum chloride causes a conslderabie amount of heat to be generated, and in some instances no additional heating is necessary.
- the bath composition should be such that the pyridinium cation is not reduced at the cathode.
- the aluminum salt concentration must be sumciently high, having regard to the actual conditions of electrolysis in each instance,
- the electrolyte is maintained at a sufllciently high temperature so that it is in a fused condition, and, more especially, at a temperature at which good plates are obtained.
- ethyl pyridinium bromide temperatures in the range from 40 C. to 150 C. depending on the composition of the bath, have been found useful for plating.
- the preferred temperature for the aforementioned eutectic mixture is approximately 125 0. Too low a temperature results in low conductivity and produces spongy deposits. At higher temperatures aluminum chloride will distill from the bath and decomposition of the electrolyte can occur. With other pyridinium compounds different temperatures.
- a cell of glass, porcelain, or other inert material may be used; or the containermay be made of aluminum and can then serve as the anode.
- the cell is made of other metals, any moisture which is present may result in corrosion of the metal by moist hydrogen halide. This can carry the metal'halide into solution and may result in the formation of a plate consisting of an aluminum alloy. Under certain conditions these alloy plates may not be disadvantageous and accordingly the term aluminum as used here and in the claims is to be considered as including such alloys in which aluminum forms the major constituent.
- the anode employed consists, of course, of aluminum; the cathode is the article to be plated.
- a zinc article should not be employed inasmuch as zinc reacts with the bath.
- In removing the plated object from the bath, care must be taken to remove the adhering liquid before absorption of moisture from the atmosphere can occur. for this will generate hydrogen chloride which will attack the aluminum plate.
- One method of achieving this is to rinse the plate in a such as benzene, immediately after removal.
- relatively low voltages can be employed.
- relatively low voltages are essential to successful operation, for too high a voltage can produce organic decomposition at the electrodes.
- two to three volts was employed; in cells of other design, lower voltages were successfully used.
- the optimum cathode current density for baths of this type is approximately 0.5 ampJdmF. Variation in the current density affects the type of plate produced. For example, those obtained at current densities much lower than 0.5 amp./dm. were usually white and dull, whereas at current densities somewhat higher than this value they were usually gray and dull. At the preferred current density bright and shiny plates were usually obtained. If the current density becomes too high, a black deposit appears at the cathode.
- the anode should be as large as or larger than the cathode object, and the electrodes should be so arranged in the cell that the resistance of the cell is not too high and the current distribution on the cathode is uniform.
- a plating mixture containing 63.0 mol per cent of aluminum chloride (taken as A1013) and 37.0 mol per cent of ethyl pyridinium chloride was prepared by adding the aluminum chloride to the molten pyridinium salt.
- the mixture was transferred to an-aluminum pot which served both as the container and the anode. This was fitted with a suitably designed top to prevent absorption of moisture by the bath.
- the temperature of the plating bath was maintained at 125 C. by immersing the aluminum pot in a large oil bath.
- a nonaqueous electrolyte for use in the electro-depositlon of aluminum as a bright, adherent deposit that consists essentially of a fused mixture of (1) about 2 mols of aluminum chloride and (2) 1 mol of ethyl pyridinium chloride.
Description
Patented Au g. 3, 1948 2,446,331 ELECTRODEPOSITION OF ALUMINUM Frank H. Hurley, Portland, reg., assignor to The William Marsh Rice Institute for the Advancement of Literature, .Science and Art, a corporation of Texas No Drawing. Application February 14, 1944, Serial No. 522,375
1 2 Claims.
This invention relates to the electrodeposition of aluminum, and particularly to a process involving the deposition of aluminum on a suitable cathode from an electrolyte comprising a fused or liquid mixture of a suitable aluminum salt with an N-alkyl pyridinium halide.
It has long been recognized that aluminum possesses many unique properties particularly with respect to corrosion resistance. However, the low tensile strength and especially the low elastic limit of pure aluminum render it rather unsatisfactory as a structuralmaterial for many purposes. Therefore the possibility of electroplating aluminum on steel and on other common metals promises a wider range of mechanical substances, particularly in chemical construction work. The appearance of many articles would also be improved if they could be plated with aluminum.
It is in general the broad object of the present invention to provide a process enabling aluminum to be electroplated on various dissimilar common metals.
A further object of the present invention is to provide a novel electroplating bath which can be successfully employed for electrodeposition of aluminum.
A still further object of the present invention is to provide a bath for the electrodeposition of aluminum which has a relatively high electrical conductivity, a low voltage requirement, and in which high electrode efflciencies are obtained.
In my process for the electroplating with aluminum of dissimilar metals such as iron. copper, brass, bronze, lead and tin, I employ a bath composed essentially of a fused or liquid mixture of an N-alkyl pyridinium halide and an anhydrous aluminum halide, preferably aluminum chloride. I have successfully employed solutions of anhydrous aluminum chloride in various anhydrous fused pyridinium compounds, particularly ethyl pyridinium bromide, ethyl pyridinium chloride, ethylene dipyridinium dlbromide, and ethylene dipyridinium dichloride.
The bath is prepared by mixing the aluminum salt and the pyridinium compound together, melting the mixture by heating, if desired. The addition of the aluminum chloride causes a conslderabie amount of heat to be generated, and in some instances no additional heating is necessary. Generally the bath composition should be such that the pyridinium cation is not reduced at the cathode. The aluminum salt concentration must be sumciently high, having regard to the actual conditions of electrolysis in each instance,
that this does not occur. I have found that one should employ a bath containing approximately two mols of aluminum chloride (taken as AlCl: herein and in the claims) to one moi of halide or nitrogen (taken as N) in the pyridinium salt. With ethyl pyridinium bromide this approximate value represents an eutectic composition corresponding to a 2 to 1 mol ratio of aluminum chloride to ethyl pyridinium bromide. The ethyl pyridinium bromide content can, however, vary between about 46 mol per cent and 30 mol per cent. In any case, if the aluminum chloride concentration is too low, the aforementioned reduction of the pyridinium cation occurs at the cathode, while if the aluminum chloride concentration is too high, the plate will contain what appears to be occluded aluminum chloride.
In operation, the electrolyte is maintained at a sufllciently high temperature so that it is in a fused condition, and, more especially, at a temperature at which good plates are obtained. With ethyl pyridinium bromide, temperatures in the range from 40 C. to 150 C. depending on the composition of the bath, have been found useful for plating. The preferred temperature for the aforementioned eutectic mixture is approximately 125 0. Too low a temperature results in low conductivity and produces spongy deposits. At higher temperatures aluminum chloride will distill from the bath and decomposition of the electrolyte can occur. With other pyridinium compounds different temperatures.
are required, generally above C.
As a container for the bath a cell of glass, porcelain, or other inert material may be used; or the containermay be made of aluminum and can then serve as the anode. If the cell is made of other metals, any moisture which is present may result in corrosion of the metal by moist hydrogen halide. This can carry the metal'halide into solution and may result in the formation of a plate consisting of an aluminum alloy. Under certain conditions these alloy plates may not be disadvantageous and accordingly the term aluminum as used here and in the claims is to be considered as including such alloys in which aluminum forms the major constituent.
The anode employed consists, of course, of aluminum; the cathode is the article to be plated. A zinc article should not be employed inasmuch as zinc reacts with the bath.
In=removing the plated object from the bath, care must be taken to remove the adhering liquid before absorption of moisture from the atmosphere can occur. for this will generate hydrogen chloride which will attack the aluminum plate. One method of achieving this is to rinse the plate in a such as benzene, immediately after removal.
It is a feature of the present invention that relatively low voltages can be employed. In fact, relatively low voltages are essential to successful operation, for too high a voltage can produce organic decomposition at the electrodes. In cells in which the anode and cathode were about 1% inches apart, two to three volts was employed; in cells of other design, lower voltages were successfully used.
The optimum cathode current density for baths of this type is approximately 0.5 ampJdmF. Variation in the current density affects the type of plate produced. For example, those obtained at current densities much lower than 0.5 amp./dm. were usually white and dull, whereas at current densities somewhat higher than this value they were usually gray and dull. At the preferred current density bright and shiny plates were usually obtained. If the current density becomes too high, a black deposit appears at the cathode.
To obtain the proper conditions of current density and voltage, a suitably designed cell must be employed. In general. the anode should be as large as or larger than the cathode object, and the electrodes should be so arranged in the cell that the resistance of the cell is not too high and the current distribution on the cathode is uniform.
The following specific operating example is set forth by way of further illustrating the invention and not by way of limitation.
A plating mixture containing 63.0 mol per cent of aluminum chloride (taken as A1013) and 37.0 mol per cent of ethyl pyridinium chloride was prepared by adding the aluminum chloride to the molten pyridinium salt. The mixture was transferred to an-aluminum pot which served both as the container and the anode. This was fitted with a suitably designed top to prevent absorption of moisture by the bath. The cathodes, which could be inserted through the top, consisted of suitably cleaned sheets of steel and other metals. 5 cm. wide and 14 cm. long with a depth of immersion in the plating liquid of 3.5 cm. The temperature of the plating bath was maintained at 125 C. by immersing the aluminum pot in a large oil bath.
solvent miscible with the bath,
Plating tests of several different sorts were made with this bath, using steel cathodes. In one set of tests using voltages ranging from 0.2 to,0.6 volt, the following results were obtained at different current densities, when the total quantity of electricity was held constant:
1. 1.00 amp./dm.=uniform gray plate, somewhat granular 2.0.90 amp./dm. less uniform, granular in spots 3. 0.63 amp./dm. -uniform plate. white in color 4. 0.46 amp/rimfi-shiny, adherent plate 5. 0.30 amp/dmF-partly shiny. partly dull plate consisting essentially of a fused mixture of (1) about 2 mols of aluminum chloride and '(2) 1 mol of ethyl pyridinium chloride.
2. A nonaqueous electrolyte for use in the electro-depositlon of aluminum as a bright, adherent deposit that consists essentially of a fused mixture of (1) about 2 mols of aluminum chloride and (2) 1 mol of ethyl pyridinium chloride.
FRANK H. HURLEY.
REFERENCES CITED The following references are of record in the Chemical Abstracts, vol. 32. No. 18, Sept. 20, 1938, col. 6956.
Elektrochemie Nichtwassriger Losungen, by Paul Walden, pp. 194, 200, 239.
Journal of American Chemical Society, vol. 19 (1897), p. 563. 4
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US522375A US2446331A (en) | 1944-02-14 | 1944-02-14 | Electrodeposition of aluminum |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US522375A US2446331A (en) | 1944-02-14 | 1944-02-14 | Electrodeposition of aluminum |
Publications (1)
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US2446331A true US2446331A (en) | 1948-08-03 |
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Family Applications (1)
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US522375A Expired - Lifetime US2446331A (en) | 1944-02-14 | 1944-02-14 | Electrodeposition of aluminum |
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Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2568508A (en) * | 1949-02-03 | 1951-09-18 | Gerald C Montague | Motor block attaching means for motor stands |
US2796392A (en) * | 1951-08-01 | 1957-06-18 | Milton H Lietzke | Process and electrolyte for the electrodeposition of zirconium |
US4463072A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries containing room-temperature molten 1,2,3-trialkylimidazolium halide non-aqueous electrolyte |
US4463071A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries using room-temperature molten non-aqueous electrolytes containing 1,2,3-trialkylimidazolium halides or 1,3-dialkylimidazolium halide |
US4747916A (en) * | 1987-09-03 | 1988-05-31 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and process for the same |
US4904355A (en) * | 1988-04-26 | 1990-02-27 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
US4906342A (en) * | 1988-04-26 | 1990-03-06 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
US4966660A (en) * | 1987-07-13 | 1990-10-30 | Nisshin Steel Co., Ltd. | Process for electrodeposition of aluminum on metal sheet |
US5041194A (en) * | 1989-05-18 | 1991-08-20 | Mitsubishi Petrochemical Co., Ltd. | Aluminum electroplating method |
US5074973A (en) * | 1989-05-23 | 1991-12-24 | Nisshin Steel Co. Ltd. | Non-aqueous electrolytic aluminum plating bath composition |
US5827602A (en) * | 1995-06-30 | 1998-10-27 | Covalent Associates Incorporated | Hydrophobic ionic liquids |
US6350721B1 (en) | 1998-12-01 | 2002-02-26 | Schlumberger Technology Corporation | Fluids and techniques for matrix acidizing |
US20040206622A1 (en) * | 2001-07-25 | 2004-10-21 | Katsuji Kawakami | Apparatus for plating treatment |
US20040238352A1 (en) * | 2000-10-20 | 2004-12-02 | The University Of Alabama | Production, refining and recycling of lightweight and reactive metals in ionic liquids |
WO2004106288A2 (en) | 2003-06-02 | 2004-12-09 | Merck Patent Gmbh | Ionic liquids containing guanidinium cations |
US20050131118A1 (en) * | 2002-08-16 | 2005-06-16 | Roger Moulton | Ionic liquids containing a sulfonate anion |
US7053232B2 (en) | 2002-08-16 | 2006-05-30 | Sachem, Inc. | Lewis acid ionic liquids |
US20060169590A1 (en) * | 2003-03-04 | 2006-08-03 | Hebditch David J | Process for separating metals |
DE102008014028A1 (en) | 2008-03-13 | 2009-09-17 | Doris Dr. Kunz | Preparing imidazolium salts, preferably 1,3-disubstiuted imidazolium salts, useful e.g. as precursors of N-heterocyclic carbenes, comprises reducing 1,3-disubstituted-2-alkoxyimidazolium salts with hydrides and/or hydride donors |
DE102008031480A1 (en) | 2008-07-03 | 2010-01-07 | Merck Patent Gmbh | Salts containing a Pyrimidincarbonsäure derivative |
US20120189778A1 (en) * | 2011-01-26 | 2012-07-26 | Riewe Curtis H | Coating method using ionic liquid |
US9631290B2 (en) | 2011-10-07 | 2017-04-25 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Room temperature electrodeposition of actinides from ionic solutions |
US9803283B1 (en) | 2013-10-18 | 2017-10-31 | Hrl Laboratories, Llc | Method of electroless deposition of aluminum or aluminum alloy, an electroless plating composition, and an article including the same |
US10208391B2 (en) | 2014-10-17 | 2019-02-19 | Ut-Battelle, Llc | Aluminum trihalide-neutral ligand ionic liquids and their use in aluminum deposition |
US10422048B2 (en) | 2014-09-30 | 2019-09-24 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Processes for recovering rare earth elements |
EP2971267B1 (en) * | 2013-03-15 | 2020-10-14 | United Technologies Corporation | Bimetallic zincating processing for enhanced adhesion of aluminum on aluminum alloys |
US11142841B2 (en) | 2019-09-17 | 2021-10-12 | Consolidated Nuclear Security, LLC | Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1911122A (en) * | 1929-08-13 | 1933-05-23 | Ellis Foster Co | Process for the electrodeposition of aluminum from its compounds |
US1939397A (en) * | 1929-04-12 | 1933-12-12 | Ellis Foster Co | Process of electrodeposition of aluminum |
US1960334A (en) * | 1934-05-29 | Process of preparing n-methyl com | ||
US2170375A (en) * | 1937-05-10 | 1939-08-22 | Frank C Mathers | Electrodeposition of aluminum |
-
1944
- 1944-02-14 US US522375A patent/US2446331A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1960334A (en) * | 1934-05-29 | Process of preparing n-methyl com | ||
US1939397A (en) * | 1929-04-12 | 1933-12-12 | Ellis Foster Co | Process of electrodeposition of aluminum |
US1911122A (en) * | 1929-08-13 | 1933-05-23 | Ellis Foster Co | Process for the electrodeposition of aluminum from its compounds |
US2170375A (en) * | 1937-05-10 | 1939-08-22 | Frank C Mathers | Electrodeposition of aluminum |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2568508A (en) * | 1949-02-03 | 1951-09-18 | Gerald C Montague | Motor block attaching means for motor stands |
US2796392A (en) * | 1951-08-01 | 1957-06-18 | Milton H Lietzke | Process and electrolyte for the electrodeposition of zirconium |
US4463072A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries containing room-temperature molten 1,2,3-trialkylimidazolium halide non-aqueous electrolyte |
US4463071A (en) * | 1983-11-30 | 1984-07-31 | Allied Corporation | Secondary batteries using room-temperature molten non-aqueous electrolytes containing 1,2,3-trialkylimidazolium halides or 1,3-dialkylimidazolium halide |
US4966660A (en) * | 1987-07-13 | 1990-10-30 | Nisshin Steel Co., Ltd. | Process for electrodeposition of aluminum on metal sheet |
US4747916A (en) * | 1987-09-03 | 1988-05-31 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and process for the same |
US4906342A (en) * | 1988-04-26 | 1990-03-06 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
US4904355A (en) * | 1988-04-26 | 1990-02-27 | Nisshin Steel Co., Ltd. | Plating bath for electrodeposition of aluminum and plating process making use of the bath |
US5041194A (en) * | 1989-05-18 | 1991-08-20 | Mitsubishi Petrochemical Co., Ltd. | Aluminum electroplating method |
US5074973A (en) * | 1989-05-23 | 1991-12-24 | Nisshin Steel Co. Ltd. | Non-aqueous electrolytic aluminum plating bath composition |
US5827602A (en) * | 1995-06-30 | 1998-10-27 | Covalent Associates Incorporated | Hydrophobic ionic liquids |
US6350721B1 (en) | 1998-12-01 | 2002-02-26 | Schlumberger Technology Corporation | Fluids and techniques for matrix acidizing |
US20040238352A1 (en) * | 2000-10-20 | 2004-12-02 | The University Of Alabama | Production, refining and recycling of lightweight and reactive metals in ionic liquids |
US7347920B2 (en) * | 2000-10-20 | 2008-03-25 | The Board Of Trustees Of The University Of Alabama | Production, refining and recycling of lightweight and reactive metals in ionic liquids |
US20040206622A1 (en) * | 2001-07-25 | 2004-10-21 | Katsuji Kawakami | Apparatus for plating treatment |
US7053232B2 (en) | 2002-08-16 | 2006-05-30 | Sachem, Inc. | Lewis acid ionic liquids |
US20050131118A1 (en) * | 2002-08-16 | 2005-06-16 | Roger Moulton | Ionic liquids containing a sulfonate anion |
US20090200513A1 (en) * | 2002-08-16 | 2009-08-13 | University Of South Alabama | Ionic Liquids Containing a Sulfonate Anion |
US7750166B2 (en) | 2002-08-16 | 2010-07-06 | University Of South Alabama | Ionic liquids containing a sulfonate anion |
US20060169590A1 (en) * | 2003-03-04 | 2006-08-03 | Hebditch David J | Process for separating metals |
WO2004106288A2 (en) | 2003-06-02 | 2004-12-09 | Merck Patent Gmbh | Ionic liquids containing guanidinium cations |
DE102008014028A1 (en) | 2008-03-13 | 2009-09-17 | Doris Dr. Kunz | Preparing imidazolium salts, preferably 1,3-disubstiuted imidazolium salts, useful e.g. as precursors of N-heterocyclic carbenes, comprises reducing 1,3-disubstituted-2-alkoxyimidazolium salts with hydrides and/or hydride donors |
DE102008031480A1 (en) | 2008-07-03 | 2010-01-07 | Merck Patent Gmbh | Salts containing a Pyrimidincarbonsäure derivative |
US20110152292A1 (en) * | 2008-07-03 | 2011-06-23 | Merck Patent Gesellschaft | Salts comprising a pyrimidinecarboxylic acid derivative for cosmetic use |
US20120189778A1 (en) * | 2011-01-26 | 2012-07-26 | Riewe Curtis H | Coating method using ionic liquid |
US9631290B2 (en) | 2011-10-07 | 2017-04-25 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Room temperature electrodeposition of actinides from ionic solutions |
EP2971267B1 (en) * | 2013-03-15 | 2020-10-14 | United Technologies Corporation | Bimetallic zincating processing for enhanced adhesion of aluminum on aluminum alloys |
US9803283B1 (en) | 2013-10-18 | 2017-10-31 | Hrl Laboratories, Llc | Method of electroless deposition of aluminum or aluminum alloy, an electroless plating composition, and an article including the same |
US10711351B1 (en) | 2013-10-18 | 2020-07-14 | Hrl Laboratories, Llc | Electroless plating composition for electroless deposition of aluminum or aluminum alloy and article including electroless deposited aluminum layer |
US10422048B2 (en) | 2014-09-30 | 2019-09-24 | The Board Of Regents Of The Nevada System Of Higher Education On Behalf Of The University Of Nevada, Las Vegas | Processes for recovering rare earth elements |
US10208391B2 (en) | 2014-10-17 | 2019-02-19 | Ut-Battelle, Llc | Aluminum trihalide-neutral ligand ionic liquids and their use in aluminum deposition |
US10781525B2 (en) | 2014-10-17 | 2020-09-22 | Ut-Battelle, Llc | Aluminum trihalide-neutral ligand ionic liquids and their use in aluminum deposition |
US11142841B2 (en) | 2019-09-17 | 2021-10-12 | Consolidated Nuclear Security, LLC | Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates |
US11459658B2 (en) | 2019-09-17 | 2022-10-04 | Consolidated Nuclear Security, LLC | Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates |
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