US2364993A - Process for blackening copper or copper alloy surfaces - Google Patents

Process for blackening copper or copper alloy surfaces Download PDF

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Publication number
US2364993A
US2364993A US470510A US47051042A US2364993A US 2364993 A US2364993 A US 2364993A US 470510 A US470510 A US 470510A US 47051042 A US47051042 A US 47051042A US 2364993 A US2364993 A US 2364993A
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copper
sodium
black
blackening
chlorite
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US470510A
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Walter R Meyer
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63Treatment of copper or alloys based thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal

Definitions

  • the present invention relates to a process and composition for blackening'copper and copper alloys.
  • copper and copper alloy surfaces have been blackened by the so-called oxidizing process in which the surface is cleaned and a copper sulphide film is formed by immersing the surface in solutions of sodium sulphide or ammonium sulphide or other water soluble sulphides. This produced brown or black coatings on the sur-' face.
  • These sulphide films are not stable to oxidation, particularly when exposed to outdoor atmospheres, and have to be protected by subse-* quent treatments, such as lacquering or waxing, to provide aprotective coating thereover which must be renewed from time to time.
  • the surface is washed and then immersed in the dip of the present invention so as to provide the blackened coating.
  • Still another method of blackening'copper and copper alloys involves the used sodium, 'potassium or ammonium persulphates, together with an alkali, such as sodium hydroxide or potassium hydroxide.
  • This method is very unsat isfactory because the persulphates are unstable and the life of the solution is relatively short, i. e.,
  • the present invention overcomes the diflicul ties of the prior process by providing a process and solution for direct oxidation of copper and copper alloy surfaces at low temperatures, less than 250 F., which process does not evolve irritating or harmful fumes, and the solution em-- ployed being stable over a period of days and This is accomplished by providing immersion of the surfaces in a hot aqueous bath of the coloring solution composed of sodium chlorite or potassium chlorite and either sodium hydroxide or potassium hydroxide.
  • the surface may be cleaned and prepared by subjecting it to well known sulphuric acid-nitric acid bright dips, various concentrations of nitric acid and water, or etches containing chromic acid, chromates or dichromates with sulphuric acid.
  • coatings can be obtained in aqueous solutions having concentrations ranging between the following limits: sodium chl0rlte-5 g./l., sodium hydroxide-40 g./l. to sodium chlorite-saturated solution, sodium hydroxide-1000 g./l.
  • concentrations ranging between the following limits: sodium chl0rlte-5 g./l., sodium hydroxide-40 g./l. to sodium chlorite-saturated solution, sodium hydroxide-1000 g./l.
  • concentrations ranging between the following limits: sodium chl0rlte-5 g./l., sodium hydroxide-40 g./l. to sodium chlorite-saturated solution, sodium hydroxide-1000 g./l.
  • the lower range of concentration requires approximately thirty minutes to blacken copper surfaces with the solution. operating at boiling point, whereas copper surfaces blacken in solutions of the high limits in approximately one minute when operated at boiling point.
  • One proportion which has been very successful commercially includes one part by weight sodium chlorite to two parts by weight of sodium hydroxide, and this used at the rate of one to two pounds per gallon of water to form the bath which is most efficiently operated at from 200 F. to the boiling point of the solution.
  • the temperature required for the operation varies with the concentration of the component chemicals, the high concentrations permitting lower temperatures to be used.
  • concentration of sodium hydroxide of 10 g./l. and sodium chlorite at 10 g./l. a black color was obtained upon a copper surface at 175 F. in eighteen minutes, whereas with a concentration-of sodium hydroxide g./l. and sodium chlorite 150 g./l. a black was obtained upon a copper surface in fifteen minutes at 125 F.
  • the concentration of sodium hydroxide g./l. and sodium chlorite 10 g./l. can produce a black surface on copper in ten minutes if the temperature is raised to a boiling point of 216 F.
  • concentration of sodium hydroxide 150 g./l., sodium chlorite 150 g./l., black can be obtained in thirty seconds if the temperature of the bath is raised to the boiling point of the solution, namely. 250 F.
  • the black surfaces produced by the process are cupric oxide. These deep black surfaces are highly desirable in the manufacture of optical equipment, instruments, buttons and many other similar articles. Th appearances of these surfaces may be enhanced to present a greater depth of color by oiling, waxing or lacquering them.
  • the present invention is not limited to coating articles of solid copper or copper alloys, but may be used to coat surfaces of other metals which have been plated with copper or copper alloys when the coating thickness is greater than 0.00005" and the copper content of thealloy is greater than 60%.
  • alkalies having lower pH in solution than sodium or potassium hydroxides such as borax, trisodium phosphate, sodium metasilicate and sodium carbonate, are
  • the process of producing a black surface on copper or copper alloy articles which comprises immersing the surface in a hot aqueous solution consisting essentially of an alkali selected from the group consisting of sodium hydroxide and potassium hydroxide and a chlorite selected from the group consisting of sodium chlorit and potassium chlorite.
  • the process of producing a black surface on copper or copper alloy surfaces which comprises immersing the surface in a hot aqueous solution of sodium chlorite and of an alkali selected from the group consisting of sodium hydroxide and potassium hydroxide, the concentration of the sodium hydroxide or potassium hydroxide and sodium chlorite being between about sodium chlorite-5 g./l., sodium hydroxide or potassium hydroxide-10 g./l. to sodium chlorite-saturated solution, sodium hydroxide or potassium hydroxide1000 g./l.
  • the process of producing a black surface on copper or copper alloy articles which comprises immersin the surface in a hot aqueous solution of sodium hydroxid and sodium chlorite having a concentration between about sodium chlorite-5 g./l., sodium hydroxide-l0 g./l. to sodium chlorite-saturated solution, sodium hy- CIIOXidB-IOOO g./l.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)

Description

, one to eight hours.
.weeks.
Patented Dec. 12, a
PROCESS FOR BLACKENING COPPER OR COPPER ALLOY SURFACES Walter R. Meyeiyflamden, Conn.
' No Drawing. Application December 29, 1942, Serial No. 470,510
, 3 Claims.
The present invention relates to a process and composition for blackening'copper and copper alloys.
Heretoiore, copper and copper alloy surfaces have been blackened by the so-called oxidizing process in which the surface is cleaned and a copper sulphide film is formed by immersing the surface in solutions of sodium sulphide or ammonium sulphide or other water soluble sulphides. This produced brown or black coatings on the sur-' face. These sulphide films are not stable to oxidation, particularly when exposed to outdoor atmospheres, and have to be protected by subse-* quent treatments, such as lacquering or waxing, to provide aprotective coating thereover which must be renewed from time to time.
The surface is washed and then immersed in the dip of the present invention so as to provide the blackened coating.
One of the requirements of the solution for blackening a copper or copper alloy siu'face is that a minimum pH must be exceeded. This min- Another process involves the use of copper salt, v
such as copper sulphate, copper carbonate, or basic copper carbonate with ammonia in a bath. This process is used for applying blue black to hi-ass (copper zinc alloys) in the range of 65-35 to 80-20 copper zinc ratios by weight. In proper operation of this process, when copper carbonate is employed, for example, an excess of copper carbonate is required. Alloys containing higher copper contents than 80%, particularly the pure copper, are not blackened by this process to a deep black, but are colored a grayish black.
Still another method of blackening'copper and copper alloys involves the used sodium, 'potassium or ammonium persulphates, together with an alkali, such as sodium hydroxide or potassium hydroxide. This method, however, is very unsat isfactory because the persulphates are unstable and the life of the solution is relatively short, i. e.,
The present invention overcomes the diflicul ties of the prior process by providing a process and solution for direct oxidation of copper and copper alloy surfaces at low temperatures, less than 250 F., which process does not evolve irritating or harmful fumes, and the solution em-- ployed being stable over a period of days and This is accomplished by providing immersion of the surfaces in a hot aqueous bath of the coloring solution composed of sodium chlorite or potassium chlorite and either sodium hydroxide or potassium hydroxide.
In order to provide a uniform blackened surface by the process of the present invention, the surface may be cleaned and prepared by subjecting it to well known sulphuric acid-nitric acid bright dips, various concentrations of nitric acid and water, or etches containing chromic acid, chromates or dichromates with sulphuric acid.
coatings can be obtained in aqueous solutions having concentrations ranging between the following limits: sodium chl0rlte-5 g./l., sodium hydroxide-40 g./l. to sodium chlorite-saturated solution, sodium hydroxide-1000 g./l. The lower range of concentration requires approximately thirty minutes to blacken copper surfaces with the solution. operating at boiling point, whereas copper surfaces blacken in solutions of the high limits in approximately one minute when operated at boiling point.
These examples are given for copper surfaces. Usually somewhat higher temperatures and concentrations are employed for blackening copper alloys.
It has beeniound that coatings producedin solutions containing high concentrations of sodium hydroxide (above 200 g./l.) have a tan smut covering the black film underneath it. This smut can be easily wiped off exposing the black surfaces.
In normal commercial operation, however, the concentrations are maintained sumciently low so that'the smut does not appear. One proportion which has been very successful commercially includes one part by weight sodium chlorite to two parts by weight of sodium hydroxide, and this used at the rate of one to two pounds per gallon of water to form the bath which is most efficiently operated at from 200 F. to the boiling point of the solution.
In carrying out the process, the temperature required for the operation varies with the concentration of the component chemicals, the high concentrations permitting lower temperatures to be used. For example, with a concentration of sodium hydroxide of 10 g./l. and sodium chlorite at 10 g./l. a black color was obtained upon a copper surface at 175 F. in eighteen minutes, whereas with a concentration-of sodium hydroxide g./l. and sodium chlorite 150 g./l. a black was obtained upon a copper surface in fifteen minutes at 125 F.
By increasing the temperatures, the time required to produce the black surface may be effectively shortened. For example, the concentration of sodium hydroxide g./l. and sodium chlorite 10 g./l. can produce a black surface on copper in ten minutes if the temperature is raised to a boiling point of 216 F., and with the concentration of sodium hydroxide 150 g./l., sodium chlorite 150 g./l., black can be obtained in thirty seconds if the temperature of the bath is raised to the boiling point of the solution, namely. 250 F.
The black surfaces produced by the process are cupric oxide. These deep black surfaces are highly desirable in the manufacture of optical equipment, instruments, buttons and many other similar articles. Th appearances of these surfaces may be enhanced to present a greater depth of color by oiling, waxing or lacquering them.
The present invention is not limited to coating articles of solid copper or copper alloys, but may be used to coat surfaces of other metals which have been plated with copper or copper alloys when the coating thickness is greater than 0.00005" and the copper content of thealloy is greater than 60%.
It has been found that alkalies having lower pH in solution than sodium or potassium hydroxides, such as borax, trisodium phosphate, sodium metasilicate and sodium carbonate, are
ineffective for the present purpose when usedwith sodium chlorite. Also, it has been found that other oxidizing agents, such as potassium permanganate, sodium chlorate, sodium nitrate and sodium nitrite when mixed with caustic soda have proven ineffective to produce the black surface.
Variations and modifications may be made within the scope of this invention and portions of the improvements may be used without others.
I claim:
1. The process of producing a black surface on copper or copper alloy articles which comprises immersing the surface in a hot aqueous solution consisting essentially of an alkali selected from the group consisting of sodium hydroxide and potassium hydroxide and a chlorite selected from the group consisting of sodium chlorit and potassium chlorite.
2. The process of producing a black surface on copper or copper alloy surfaces which comprises immersing the surface in a hot aqueous solution of sodium chlorite and of an alkali selected from the group consisting of sodium hydroxide and potassium hydroxide, the concentration of the sodium hydroxide or potassium hydroxide and sodium chlorite being between about sodium chlorite-5 g./l., sodium hydroxide or potassium hydroxide-10 g./l. to sodium chlorite-saturated solution, sodium hydroxide or potassium hydroxide1000 g./l.
3. The process of producing a black surface on copper or copper alloy articles, which comprises immersin the surface in a hot aqueous solution of sodium hydroxid and sodium chlorite having a concentration between about sodium chlorite-5 g./l., sodium hydroxide-l0 g./l. to sodium chlorite-saturated solution, sodium hy- CIIOXidB-IOOO g./l.
WALTER R. MEYER.
US470510A 1942-12-29 1942-12-29 Process for blackening copper or copper alloy surfaces Expired - Lifetime US2364993A (en)

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Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2437441A (en) * 1945-02-14 1948-03-09 Associated Chemical Company Coloring metal surfaces
US2457480A (en) * 1945-04-19 1948-12-28 Earle B Lewis Blackening copper alloys
US2460897A (en) * 1944-09-14 1949-02-08 Enthone Rendering aluminum and aluminum alloy surfaces corrosion resistant
US2460898A (en) * 1944-11-04 1949-02-08 Enthone Process and composition for coloring copper and copper alloy surfaces
US2460896A (en) * 1944-08-19 1949-02-08 Enthone Composition for blackening copper and copper alloy surfaces
US2475981A (en) * 1946-08-01 1949-07-12 Heatbath Corp Process for blackening copper and copper alloys
US2481854A (en) * 1946-02-14 1949-09-13 Enthone Composition to blacken surfaces of copper and of alloys containing copper
US2573320A (en) * 1949-03-18 1951-10-30 Pyrene Mfg Co Fire extinguisher
US2745898A (en) * 1952-09-20 1956-05-15 Gen Electric Insulated electric conductors
US2884161A (en) * 1952-09-25 1959-04-28 Gen Electric Composite articles of metal and elastomer and method of fabrication
US2963538A (en) * 1957-04-11 1960-12-06 Sanders Associates Inc Flat cables
US3107197A (en) * 1956-04-18 1963-10-15 Int Resistance Co Method of bonding a metal to a plastic and the article produced thereby
US3150016A (en) * 1960-12-27 1964-09-22 Gen Motors Corp Antifriction bearing
US3389061A (en) * 1963-06-04 1968-06-18 Ass Ouvriers Instr Precision Anodization of a copper-nickelmanganese alloy
US4409037A (en) * 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
US4702793A (en) * 1986-03-12 1987-10-27 Etd Technology Inc. Method for manufacturing a laminated layered printed wiring board using a sulfuroxy acid and an oxiding treatment of the metallic wiring patterns to insure the integrity of the laminate product
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
US5106454A (en) * 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5288377A (en) * 1991-06-05 1994-02-22 Macdermid, Incorporated Process for the manufacture of printed circuits using electrophoretically deposited organic resists
US5492595A (en) * 1994-04-11 1996-02-20 Electrochemicals, Inc. Method for treating an oxidized copper film
US5861076A (en) * 1991-07-19 1999-01-19 Park Electrochemical Corporation Method for making multi-layer circuit boards
US5976228A (en) * 1997-09-15 1999-11-02 The Dexter Corporation Reducing agent for forming an acid resistant barrier
US6506314B1 (en) 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
US20080000552A1 (en) * 2006-06-30 2008-01-03 Letize Raymond A Process for increasing the adhesion of a metal surface to a polymer
US20110186221A1 (en) * 2010-02-01 2011-08-04 Ming De Wang Nano-Oxide Process for Bonding Copper/Copper Alloy and Resin
US9345149B2 (en) 2010-07-06 2016-05-17 Esionic Corp. Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
US9763336B2 (en) 2010-07-06 2017-09-12 Atotech Deutschland Gmbh Methods of treating metal surfaces and devices formed thereby
US9942982B2 (en) 1997-08-04 2018-04-10 Continental Circuits, Llc Electrical device with teeth joining layers and method for making the same
JPWO2020049695A1 (en) * 2018-09-06 2021-08-12 Ykk株式会社 Fastener member

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2460896A (en) * 1944-08-19 1949-02-08 Enthone Composition for blackening copper and copper alloy surfaces
US2460897A (en) * 1944-09-14 1949-02-08 Enthone Rendering aluminum and aluminum alloy surfaces corrosion resistant
US2460898A (en) * 1944-11-04 1949-02-08 Enthone Process and composition for coloring copper and copper alloy surfaces
US2437441A (en) * 1945-02-14 1948-03-09 Associated Chemical Company Coloring metal surfaces
US2457480A (en) * 1945-04-19 1948-12-28 Earle B Lewis Blackening copper alloys
US2481854A (en) * 1946-02-14 1949-09-13 Enthone Composition to blacken surfaces of copper and of alloys containing copper
US2475981A (en) * 1946-08-01 1949-07-12 Heatbath Corp Process for blackening copper and copper alloys
US2573320A (en) * 1949-03-18 1951-10-30 Pyrene Mfg Co Fire extinguisher
US2745898A (en) * 1952-09-20 1956-05-15 Gen Electric Insulated electric conductors
US2884161A (en) * 1952-09-25 1959-04-28 Gen Electric Composite articles of metal and elastomer and method of fabrication
US3107197A (en) * 1956-04-18 1963-10-15 Int Resistance Co Method of bonding a metal to a plastic and the article produced thereby
US2963538A (en) * 1957-04-11 1960-12-06 Sanders Associates Inc Flat cables
US3150016A (en) * 1960-12-27 1964-09-22 Gen Motors Corp Antifriction bearing
US3389061A (en) * 1963-06-04 1968-06-18 Ass Ouvriers Instr Precision Anodization of a copper-nickelmanganese alloy
US4409037A (en) * 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
US4702793A (en) * 1986-03-12 1987-10-27 Etd Technology Inc. Method for manufacturing a laminated layered printed wiring board using a sulfuroxy acid and an oxiding treatment of the metallic wiring patterns to insure the integrity of the laminate product
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5106454A (en) * 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
US5288377A (en) * 1991-06-05 1994-02-22 Macdermid, Incorporated Process for the manufacture of printed circuits using electrophoretically deposited organic resists
US5861076A (en) * 1991-07-19 1999-01-19 Park Electrochemical Corporation Method for making multi-layer circuit boards
US5492595A (en) * 1994-04-11 1996-02-20 Electrochemicals, Inc. Method for treating an oxidized copper film
US9942982B2 (en) 1997-08-04 2018-04-10 Continental Circuits, Llc Electrical device with teeth joining layers and method for making the same
US5976228A (en) * 1997-09-15 1999-11-02 The Dexter Corporation Reducing agent for forming an acid resistant barrier
US6506314B1 (en) 2000-07-27 2003-01-14 Atotech Deutschland Gmbh Adhesion of polymeric materials to metal surfaces
US20080000552A1 (en) * 2006-06-30 2008-01-03 Letize Raymond A Process for increasing the adhesion of a metal surface to a polymer
US10375835B2 (en) 2009-07-06 2019-08-06 Atotech Deutchland Gmbh Methods of treating metal surfaces and devices formed thereby
US20110186221A1 (en) * 2010-02-01 2011-08-04 Ming De Wang Nano-Oxide Process for Bonding Copper/Copper Alloy and Resin
US8308893B2 (en) 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin
US9763336B2 (en) 2010-07-06 2017-09-12 Atotech Deutschland Gmbh Methods of treating metal surfaces and devices formed thereby
US9795040B2 (en) 2010-07-06 2017-10-17 Namics Corporation Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
US9345149B2 (en) 2010-07-06 2016-05-17 Esionic Corp. Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
JPWO2020049695A1 (en) * 2018-09-06 2021-08-12 Ykk株式会社 Fastener member
EP3847921A4 (en) * 2018-09-06 2022-03-30 YKK Corporation Fastener member
JP7106655B2 (en) 2018-09-06 2022-07-26 Ykk株式会社 Fastener material

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