US2064184A - Lead-in conductor - Google Patents
Lead-in conductor Download PDFInfo
- Publication number
- US2064184A US2064184A US2064184DA US2064184A US 2064184 A US2064184 A US 2064184A US 2064184D A US2064184D A US 2064184DA US 2064184 A US2064184 A US 2064184A
- Authority
- US
- United States
- Prior art keywords
- lead
- conductor
- copper
- tube
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 title description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 229910052802 copper Inorganic materials 0.000 description 24
- 239000010949 copper Substances 0.000 description 24
- 239000000463 material Substances 0.000 description 22
- 239000011521 glass Substances 0.000 description 18
- NUJOXMJBOLGQSY-UHFFFAOYSA-N Manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910000468 manganese oxide Inorganic materials 0.000 description 8
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese(II,III) oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Inorganic materials [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 6
- ZOMBKNNSYQHRCA-UHFFFAOYSA-J calcium sulfate hemihydrate Chemical compound O.[Ca+2].[Ca+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ZOMBKNNSYQHRCA-UHFFFAOYSA-J 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 239000011507 gypsum plaster Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 4
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- -1 fuller's earth Substances 0.000 description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/825—Apparatus per se, device per se, or process of making or operating same
- Y10S505/884—Conductor
- Y10S505/887—Conductor structure
Definitions
- Claim. (Cl. 176-38) My invention relates to lead-in conductors for incandescent lamps, radio tubes, mercury rectifiers, and the like, and it consists in the combinations, constructions and arrangements herein described and claimed.
- An object of my invention is to provide a leadin conductor which can be quickly fabricated so as to have substantially the same coefilcient of expansion as that of the glass or similar envelope in which it is sealed.
- a further object of the invention is to provide a lead-in conductor which can be fabricated while in a cold state and .which does not necessitate the welding of the various materials which enter into the composition of the conductor.
- Figure 1 is a graph showing the rate of expansion of copper-clad nickel steel-wire, ordinarily lamp glass, platinum and copper.
- Figure 2 is a cross section of the lead-in wire
- Figure 3 is a longitudinal sectional view showing one end of the lead-in wire.
- a tube of copper such as that shown at l in the drawing.
- the copper of which the tube is formed is deoxidized by a treatment with phosphorus and is substantially 99.9 pure.
- the diameter of the tube and the thickness of the walls thereof would vary according to the uses to which the lead wire is to be put. For instance, with a finished lead-in conductor of twentythousandths of an inch outside diameter, I may take a copper tube having an outside diameter of- $102" 62.3% PbO 22.4 NazO 7.0 K20 8.3
- I may use as a filler such materials as manganese oxide, MnaOa, comminuted carbon, plaster of Paris, china clay, fuller's earth, graphite or the like. These materials have different coeflicients of expansion, and thus materials are used which when used with the copper sheath will 5 most nearly approximate the coefiicient of expansion of the glass to which the lead-in wire is being sealed.
- I may fill the tube with a mixture comprising 90% of manganese oxide, 5% graphite and 5% plaster of Paris.
- the filling material of course is in the form of powder and the size of the grains may vary, but I usually prefer to use grains of difierent sizes, for instance, grains of one-hundred sixty to onehundred eighty mesh of the manganese oxide, 15 with grains as small as four-hundred mesh of the other ingredients, although the particular size of the grains is not necessarily essential.
- the filling material shown at 2 in the drawing is first thoroughly mixed and then tightly packed 20 in the tube.
- the end of the tube may then be closed as by soldering, as shown at 3 in Fig. 3, or by fusing the ends of the tube, or in any other suitable manner and the lead-in conductor is then fabricated by swaging, in a swaging device, 5 which device is ordinary and forms no part of the present invention.
- a coating to the lead-in conductor preferably zinc borate, although other forms of borate are useful.
- Zinc borate is non-hygroscopic and when used at a sealing temperature, 45 tends to form a cementing material which is highly efiicient because of its tendency not only to cling to the copper, but because it partakes somewhat of the nature of the glass itself, and virtually formsa part thereof at the fusing temperature. 50
- a lead-in wire formed in accordance with this invention has several advantages. It can be quickly prepared with a choice of filling material which experience has shown will give the finished lead-in conductor substantially the same coefiicient as that of the glass, as stated.
- the filling material being under pressure in the copper sheath, gives a conductor which is not subject to collapse with consequent withdrawal from the edges of the glass, as happens with those conductors made merely of shells or copper or the like.
- lead-in conductor is one which is not easily mutilated because the core is under compression as distinguished from hollow.leadin wires.
- the conductor has a greater degree of flexibility than other lead-in conductors such for instance as the nickel steel wire mentioned above.
- the core is made of materials all having a higher fusing point than the temperature of the sealing.
- the physical characteristics therefore of the materials of the core are not changed and are comparatively unaffected by the sealing heat. For this reason the seal when cold does not have the tendency to open up with consequent leakage of the gas, as is the case with certain of the lead-in conductors heretofore referred to.
- a lead-in conductor comprising an exterior tube of deoxidized copper and a filler comprising a mixture of manganese oxide, graphite and plaster of Paris.
Description
Dec. 15, 1936 EXPANSION OFA MD IMETER LONG IN MILL/ME TE RS E. W. STEVENS LEAD- IN CONDUCTOR Filed Jan. 14, 1955 COPPER V 7' PLATINUM LAMP GLASS COPPER CLAD NIGKEL STEEL WIRE TE MPE RA TURE Patented Dec. 15, 1936 UNITED STATES PATENT OFFICE LEAD-1N CONDUCTOR Elbridge W. Stevens, Baltimore, Md.
Application January 14, 1935, Serial No. 1,811
1 Claim. (Cl. 176-38) My invention relates to lead-in conductors for incandescent lamps, radio tubes, mercury rectifiers, and the like, and it consists in the combinations, constructions and arrangements herein described and claimed.
An object of my invention is to provide a leadin conductor which can be quickly fabricated so as to have substantially the same coefilcient of expansion as that of the glass or similar envelope in which it is sealed.
A further object of the invention is to provide a lead-in conductor which can be fabricated while in a cold state and .which does not necessitate the welding of the various materials which enter into the composition of the conductor.
Other objects and advantages will appear in the following specification, and the novel features of the invention will be particularly pointed out in the appended claim.
My invention is illustrated in the accompanying drawing forming part of this application, in which:
Figure 1 is a graph showing the rate of expansion of copper-clad nickel steel-wire, ordinarily lamp glass, platinum and copper.
Figure 2 is a cross section of the lead-in wire, and,
Figure 3 is a longitudinal sectional view showing one end of the lead-in wire.
In carrying out my invention I make use of a tube of copper, such as that shown at l in the drawing. The copper of which the tube is formed is deoxidized by a treatment with phosphorus and is substantially 99.9 pure. The diameter of the tube and the thickness of the walls thereof would vary according to the uses to which the lead wire is to be put. For instance, with a finished lead-in conductor of twentythousandths of an inch outside diameter, I may take a copper tube having an outside diameter of- $102" 62.3% PbO 22.4 NazO 7.0 K20 8.3
I may use as a filler such materials as manganese oxide, MnaOa, comminuted carbon, plaster of Paris, china clay, fuller's earth, graphite or the like. These materials have different coeflicients of expansion, and thus materials are used which when used with the copper sheath will 5 most nearly approximate the coefiicient of expansion of the glass to which the lead-in wire is being sealed. As an example, I may fill the tube with a mixture comprising 90% of manganese oxide, 5% graphite and 5% plaster of Paris.
The filling material of course is in the form of powder and the size of the grains may vary, but I usually prefer to use grains of difierent sizes, for instance, grains of one-hundred sixty to onehundred eighty mesh of the manganese oxide, 15 with grains as small as four-hundred mesh of the other ingredients, although the particular size of the grains is not necessarily essential.
The filling material shown at 2 in the drawing is first thoroughly mixed and then tightly packed 20 in the tube. The end of the tube may then be closed as by soldering, as shown at 3 in Fig. 3, or by fusing the ends of the tube, or in any other suitable manner and the lead-in conductor is then fabricated by swaging, in a swaging device, 5 which device is ordinary and forms no part of the present invention.
I find, however, that a better product is effected by the use of a swaging machine than by attempting to draw out the tube. In the swaging ma- 0 chine the forces acting inwardly or toward the center form a more uniform product so that eventually a lead-in conductor of twenty-thousandths of an inch in diameter can be made in which the various sections of the tube will be 35 found to be substantially homogeneous.
The example given above has been found to give substantially the same coeflicient of expansion as that of the ordinary glass in an electriclight bulb.
In forming the sealing operation I prefer to apply a coating to the lead-in conductor, preferably zinc borate, although other forms of borate are useful. Zinc borate, however, is non-hygroscopic and when used at a sealing temperature, 45 tends to form a cementing material which is highly efiicient because of its tendency not only to cling to the copper, but because it partakes somewhat of the nature of the glass itself, and virtually formsa part thereof at the fusing temperature. 50
A lead-in wire formed in accordance with this invention has several advantages. It can be quickly prepared with a choice of filling material which experience has shown will give the finished lead-in conductor substantially the same coefiicient as that of the glass, as stated. The filling material being under pressure in the copper sheath, gives a conductor which is not subject to collapse with consequent withdrawal from the edges of the glass, as happens with those conductors made merely of shells or copper or the like.
Furthermore the lead-in conductor is one which is not easily mutilated because the core is under compression as distinguished from hollow.leadin wires. At the same time the conductor has a greater degree of flexibility than other lead-in conductors such for instance as the nickel steel wire mentioned above.
One of the main features of the invention is the fact that the core is made of materials all having a higher fusing point than the temperature of the sealing. The physical characteristics therefore of the materials of the core are not changed and are comparatively unaffected by the sealing heat. For this reason the seal when cold does not have the tendency to open up with consequent leakage of the gas, as is the case with certain of the lead-in conductors heretofore referred to.
While the example given above is a preferred form for glass of a certain quality it is obvious that other ingredients among those named above might be used for the core and that the sheath of copper might be more or less any thickness to suit varying conditions of use.
I claim:-
A lead-in conductor comprising an exterior tube of deoxidized copper and a filler comprising a mixture of manganese oxide, graphite and plaster of Paris.
ELBRIDGE W. STEVENS.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2064184A true US2064184A (en) | 1936-12-15 |
Family
ID=3428378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US2064184D Expired - Lifetime US2064184A (en) | Lead-in conductor |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2064184A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2517023A (en) * | 1943-04-06 | 1950-08-01 | Hartford Nat Bank & Trust Co | Shielding for electric discharge tubes |
| US2718049A (en) * | 1948-01-16 | 1955-09-20 | Lignes Telegraph Telephon | Method of manufacturing bundles of very thin magnetic wires |
| US3185952A (en) * | 1955-07-07 | 1965-05-25 | Amp Inc | Lead connection for printed circuit board |
| US3213188A (en) * | 1960-07-22 | 1965-10-19 | Electro Chimie Metal | Composite electrical conductor for an electrolysis cell used in manufacture of aluminum and method for making same |
| US4456653A (en) * | 1980-05-09 | 1984-06-26 | Ciba-Geigy Corporation | Pin for connecting machine elements with each other |
| US5563369A (en) * | 1990-06-22 | 1996-10-08 | Kabushiki Kaisha Toshiba | Current lead |
-
0
- US US2064184D patent/US2064184A/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2517023A (en) * | 1943-04-06 | 1950-08-01 | Hartford Nat Bank & Trust Co | Shielding for electric discharge tubes |
| US2718049A (en) * | 1948-01-16 | 1955-09-20 | Lignes Telegraph Telephon | Method of manufacturing bundles of very thin magnetic wires |
| US3185952A (en) * | 1955-07-07 | 1965-05-25 | Amp Inc | Lead connection for printed circuit board |
| US3213188A (en) * | 1960-07-22 | 1965-10-19 | Electro Chimie Metal | Composite electrical conductor for an electrolysis cell used in manufacture of aluminum and method for making same |
| US4456653A (en) * | 1980-05-09 | 1984-06-26 | Ciba-Geigy Corporation | Pin for connecting machine elements with each other |
| US4505979A (en) * | 1980-05-09 | 1985-03-19 | Ciba-Geigy Corporation | Pin for connecting machine elements with each other |
| US5563369A (en) * | 1990-06-22 | 1996-10-08 | Kabushiki Kaisha Toshiba | Current lead |
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