US20230135191A1 - Electronic device - Google Patents

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Publication number
US20230135191A1
US20230135191A1 US17/977,228 US202217977228A US2023135191A1 US 20230135191 A1 US20230135191 A1 US 20230135191A1 US 202217977228 A US202217977228 A US 202217977228A US 2023135191 A1 US2023135191 A1 US 2023135191A1
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United States
Prior art keywords
magnet
heat
dissipation plate
heat dissipation
condenser
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Pending
Application number
US17/977,228
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English (en)
Inventor
Yoshihiro Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD. reassignment SHINKO ELECTRIC INDUSTRIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MACHIDA, YOSHIHIRO
Publication of US20230135191A1 publication Critical patent/US20230135191A1/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/008—Variable conductance materials; Thermal switches
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/10—Movable elements, e.g. being pivotable

Definitions

  • the present invention relates to an electronic device.
  • a loop type heat pipe including an evaporator configured to vaporize a working fluid by heat of a heat-generating component and a condenser configured to cool and condense the vaporized working fluid, in which the evaporator and the condenser are connected by a liquid pipe and a vapor pipe configured to form a loop-shaped flow path.
  • the working fluid flows in one direction in the loop-shaped flow path.
  • Certain embodiment provides an electronic device.
  • the electronic device comprises:
  • a loop type heat pipe including a loop-shaped flow path in which a working fluid is enclosed
  • a heat dissipation plate thermally connectable to the loop type heat pipe
  • a support member that movably supports the heat dissipation plate so that a distance between the loop type heat pipe and the heat dissipation plate can be varied in response to a change in magnetic force of the first magnet.
  • the effect capable of varying the heat dissipation performance is exhibited.
  • FIG. 1 A is a schematic cross-sectional view (a cross-sectional view taken along a line 1 - 1 in FIG. 3 ) showing an electronic device of one embodiment.
  • FIG. 1 B is an enlarged cross-sectional view of a part of the electronic device shown in FIG. 1 A .
  • FIG. 2 is a schematic cross-sectional view showing the electronic device of one embodiment.
  • FIG. 3 is a schematic plan view showing the electronic device of one embodiment.
  • FIG. 4 is a schematic cross-sectional view showing the electronic device of one embodiment.
  • FIG. 5 is a schematic cross-sectional view showing an electronic device of a modified embodiment.
  • FIG. 6 is a schematic cross-sectional view showing an electronic device of a modified embodiment.
  • FIG. 7 is a schematic cross-sectional view showing an electronic device of a modified embodiment.
  • FIG. 8 is a schematic cross-sectional view showing an electronic device of a modified embodiment.
  • FIG. 9 is a schematic cross-sectional view showing an electronic device of a modified embodiment.
  • FIG. 10 is a schematic plan view showing an electronic device of a modified embodiment.
  • a direction extending along the X-axis is referred to as ‘X-axis direction’
  • a direction extending along the Y-axis is referred to as ‘Y-axis direction’
  • a direction extending along the Z-axis is referred to as ‘Z-axis direction’.
  • ‘in a top view’ means seeing a target object in the Z-axis direction
  • ‘planar shape’ means a shape of a target object as seen in the Z-axis direction.
  • an electronic device M 1 includes a loop type heat pipe 10 , a heat dissipation plate 30 thermally connectable to an outer surface of the loop type heat pipe 10 , and a support member 40 configured to movably support the heat dissipation plate 30 .
  • the electronic device M 1 includes a first magnet 50 provided in the loop type heat pipe 10 and a second magnet 60 provided in the heat dissipation plate 30 .
  • the electronic device M 1 includes, for example, a heat conductive member 70 provided between the loop type heat pipe 10 and the heat dissipation plate 30 , and a housing 80 .
  • the electronic device M 1 includes, for example, a heat-generating component 16 thermally connected to the loop type heat pipe 10 .
  • the electronic device M 1 includes, for example, a wiring substrate 19 on which the heat-generating component 16 is mounted.
  • the electronic device M 1 is, for example, an electronic device on which the heat-generating component 16 and a device for cooling the heat-generating component 16 are mounted.
  • the device for cooling the heat-generating component 16 known is a heat pipe configured to transport heat by using a phase change of a working fluid.
  • the loop type heat pipe 10 may be exemplified.
  • the heat dissipation plate 30 is movably supported by the support member 40 so that a distance between the outer surface of the loop type heat pipe 10 and the heat dissipation plate 30 can be varied in response to a change in magnetic force of the first magnet 50 .
  • the heat dissipation plate 30 is supported to be movable in the Z-axis direction between a state in which the heat dissipation plate is thermally connected to the outer surface of the loop type heat pipe 10 (refer to FIA. 1 A) and a state in which the heat dissipation plate is not thermally connected to the outer surface of the loop type heat pipe 10 (refer to FIG. 2 ).
  • the housing 80 is formed in a box shape.
  • the housing 80 has, for example, a plurality of wall parts 81 . Note that, in FIGS. 1 A and 2 , only one wall part 81 of the plurality of wall parts 81 is shown.
  • the housing 80 has a structure closed by the plurality of wall parts 81 .
  • the housing 80 is configured to accommodate, for example, electronic components such as the heat-generating component 16 (refer to FIG. 4 ) and the wiring substrate 19 (refer to FIG. 4 ), the loop type heat pipe 10 , the heat dissipation plate 30 , the support member 40 , the first magnet 50 , the second magnet 60 , and the heat conductive member 70 .
  • the loop type heat pipe 10 includes an evaporator 11 , a vapor pipe 12 , a condenser 13 and a liquid pipe 14 .
  • the evaporator 11 and the condenser 13 are connected by the vapor pipe 12 and the liquid pipe 14 .
  • the evaporator 11 has a function of vaporizing a working fluid C to generate vapor Cv.
  • the vapor Cv generated in the evaporator 11 is sent to the condenser 13 via the vapor pipe 12 .
  • the condenser 13 has a function of condensing the vapor Cv of the working fluid C.
  • the condensed working fluid C is sent to the evaporator 11 via the liquid pipe 14 .
  • the vapor pipe 12 and the liquid pipe 14 are configured to form a loop-shaped flow path 15 through which the working fluid C or the vapor Cv is caused to flow. In the flow path 15 , the working fluid C is enclosed.
  • the vapor pipe 12 is formed, for example, by an elongated pipe body.
  • the liquid pipe 14 is formed, for example, by an elongated pipe body.
  • the vapor pipe 12 and the liquid pipe 14 are the same in dimension (i.e., length) in a length direction, for example.
  • the length of the vapor pipe 12 and the length of the liquid pipe 14 may be different from each other.
  • the length of the vapor pipe 12 may be shorter than the length of the liquid pipe 14 .
  • the ‘length direction’ of the evaporator 11 , the vapor pipe 12 , the condenser 13 and the liquid pipe 14 is a direction that coincides with a direction (refer to an arrow in the drawing) in which the working fluid C or vapor Cv flows in each member.
  • the ‘same’ includes not only a case where comparison targets are exactly the same but also a case where there is a slight difference between the comparison targets due to influences of dimensional tolerances and the like.
  • the evaporator 11 is fixed in close contact with the heat-generating component 16 .
  • the evaporator 11 is fixed to an upper surface of the heat-generating component 16 , for example.
  • the evaporator 11 has, for example, a plurality of (four, in the present embodiment) attaching holes 11 X.
  • Each attaching hole 11 X is formed to penetrate through the evaporator 11 in a thickness direction (here, Z-axis direction).
  • the evaporator 11 is fixed to the wiring substrate 19 by, for example, a screw 17 inserted in each attaching hole 11 X and a nut 18 screwed onto the screw 17 .
  • the heat-generating component 16 is mounted on the wiring substrate 19 .
  • the heat-generating component 16 is mounted on the wiring substrate 19 by bumps 16 A, for example.
  • a lower surface of the evaporator 11 is in close contact with the upper surface of the heat-generating component 16 .
  • a semiconductor device such as a CPU (Central Processing Unit) chip or a GPU (Graphics Processing Unit) chip may be used.
  • the working fluid C in the evaporator 11 is vaporized by heat generated by the heat-generating component 16 , and vapor Cv is accordingly generated.
  • the vapor Cv generated in the evaporator 11 is introduced into the condenser 13 via the vapor pipe 12 .
  • the vapor pipe 12 has a pair of pipe walls 12 w provided on both sides in a width direction orthogonal to the length direction of the evaporator 12 , in a top view, and a flow path 12 r provided between the pair of pipe walls 12 w , for example.
  • the flow path 12 r is formed to communicate with an internal space of the evaporator 11 .
  • the flow path 12 r is a part of the loop-shaped flow path 15 .
  • the condenser 13 has a heat dissipation plate 13 p whose area is increased for heat dissipation, and a flow path 13 r provided in the heat dissipation plate 13 p , for example.
  • the flow path 13 r has a flow path r 1 formed to communicate with the flow path 12 r and extending in the Y-axis direction, a flow path r 2 bent from the flow path r 1 and extending in the X-axis direction, and a flow path r 3 bent from the flow path r 2 and extending in the Y-axis direction.
  • the flow path 13 r (flow paths r 1 to r 3 ) is a part of the loop-shaped flow path 15 .
  • the condenser 13 has pipe walls 13 w provided on both sides in a direction orthogonal to a length direction of the flow path 13 r , i.e., flow paths r 1 to r 3 , in the top view.
  • the vapor Cv introduced via the vapor pipe 12 is condensed in the condenser 33 .
  • the working fluid C condensed in the condenser 13 is guided to the evaporator 11 through the liquid pipe 14 .
  • the liquid pipe 14 has a pair of pipe walls 14 w provided on both sides in the width direction orthogonal to the length direction of the liquid pipe 14 , in the top view, and a flow path 14 r provided between the pair of pipe walls 14 w , for example.
  • the flow path 14 r is formed to communicate with the flow path 13 r (specifically, the flow path r 3 ) of the condenser 13 and the internal space of the evaporator 11 .
  • the flow path 14 r is a part of the loop-shaped flow path 15 .
  • the heat generated by the heat-generating component 16 is transferred to the condenser 13 and dissipated in the condenser 13 . Thereby, the heat-generating component is 16 is cooled, and the temperature rise of the heat-generating component 16 is suppressed.
  • the working fluid C a fluid having a high vapor pressure and a high latent heat of vaporization is preferably used. By using such working fluid C, it is possible to effectively cool the heat-generating component 16 by the latent heat of vaporization.
  • the working fluid C ammonia, water, freon, alcohol, acetone or the like can be used, for example.
  • FIGS. 1 A and 2 show a cross section of the loop type heat pipe 10 taken along a line 1 - 1 of FIG. 3 .
  • This cross section is a plane orthogonal to the direction in which the working fluid C flows in the condenser 13 and the liquid pipe 14 .
  • the condenser 13 has a structure where metal layers 21 , 22 and 23 of three layers, for example, are stacked.
  • the condenser 13 has a structure where the metal 22 , which is an inner metal layer, is stacked between the metal layers 21 and 23 , which are a pair of outer metal layers.
  • the inner metal layer of the condenser 13 of the present embodiment is configured by only one metal layer 22 .
  • Each of the metal layers 21 to 23 is a copper (Cu) layer having excellent thermal conductivity.
  • the plurality of metal layers 21 to 23 are directly bonded to each other by solid-phase bonding such as diffusion bonding, pressure welding, friction pressure welding and ultrasonic bonding. Note that, in FIGS. 1 A, 1 B and 2 , the metal layers 21 to 23 are identified by solid lines for easy understanding. For example, when the metal layers 21 to 23 are integrated by diffusion bonding, interfaces of the respective metal layers 21 to 23 may be lost and boundaries may not be clear.
  • the solid-phase bonding is a method of heating and softening bonding target objects in a solid-phase (solid) state without melting the same, and then further heating, plastically deforming and bonding the bonding target objects.
  • the metal layers 21 to 23 are not limited to the copper layers and may also be formed of stainless steel, aluminum, magnesium alloy or the like. In addition, for some of the stacked metal layers 21 to 23 , a material different from the other metal layers may also be used. A thickness of each of the metal layers 21 to 23 may be set to about 50 ⁇ m to 200 ⁇ m, for example. Note that, some of the metal layers 21 to 23 may be each formed to have a thickness different from the other metal layers, and all the metal layers may be formed to have thicknesses different from each other.
  • the condenser 13 is configured by the metal layers 21 to 23 stacked in the Z-axis direction, and has the flow path 13 r and the pair of pipe walls 13 w provided on both sides of the flow path 13 r in the Y-axis direction.
  • the metal layer 22 is stacked between the metal layer 21 and the metal layer 23 .
  • An upper surface of the metal layer 21 is bonded to the metal layer 31 .
  • a lower surface of the metal layer 22 is bonded to the metal layer 23 .
  • the metal layer 22 has a through-hole 22 X penetrating through the metal layer 22 in the thickness direction, and a pair of pipe walls 22 w provided on both sides of the through-hole 22 X in the Y-axis direction.
  • the through-hole 22 X constitutes the flow path 13 r.
  • the metal layer 21 is stacked on the upper surface of the metal layer 22 .
  • the metal layer 21 has pipe walls 21 w provided at positions overlapping the pipe walls 22 w in the top view, and an upper wall 2 l u provided at a position overlapping the flow path 13 r in the top view.
  • a lower surface of the pipe wall 21 w is bonded to an upper surface of the pipe wall 22 w .
  • the upper wall 2 l u is provided between the pair of pipe walls 21 w .
  • a lower surface of the upper wall 21 u is exposed to the flow path 13 r .
  • the upper wall 21 u constitutes the flow path 13 r.
  • the metal layer 23 is stacked on the lower surface of the metal layer 22 .
  • the metal layer 23 has pipe walls 23 w provided at positions overlapping the pipe walls 22 w in the top view, and a lower wall 23 d provided at a position overlapping the flow path 3 r in the top view.
  • An upper surface of the pipe wall 23 w is bonded to a lower surface of the pipe wall 22 w .
  • the lower wall 23 d is provided between the pair of pipe walls 23 w .
  • An upper surface of the lower wall 23 d is exposed to the flow path 13 r . In other words, the lower wall 23 d constitutes the flow path 13 r.
  • the flow path 13 r is configured by the through-hole 22 X of the metal layer 22 .
  • the flow path 13 r is formed by a space surrounded by an inner wall surface of the through-hole 22 X, the lower surface of the upper wall 21 u , and the upper surface of the lower wall 23 d.
  • Each pipe wall 13 w is configured by, for example, the pipe wall 21 w of the metal layer 21 , the pipe wall 22 w of the metal layer 22 , and the pipe wall 23 w of the metal layer 23 .
  • the condenser 13 has a first facing surface 13 A facing the heat dissipation plate 30 .
  • the first facing surface 13 A is configured by, for example, the upper surface of the metal layer 21 in the condenser 13 .
  • ‘facing’ indicates that surfaces or members are located at positions facing each other, and includes not only a case where they are located at positions completely facing each other, but also a case where they are located at positions partially facing each other. Also, in the present specification, ‘facing’ includes both a case where a member different from two parts is interposed between the two parts and a case where no member is interposed between the two parts.
  • the vapor pipe 12 shown in FIG. 3 is formed by the three stacked metal layers 21 to 23 (refer to FIGS. 1 A and 2 ).
  • the flow path 12 r is formed by forming a through-hole penetrating through the metal layer 22 , which is an inner metal layer, in the thickness direction.
  • the liquid pipe 14 is formed by the three stacked metal layers 21 to 23 , similar to the condenser 13 .
  • the flow path 14 r is formed by forming a through-hole 22 Y penetrating through the metal layer 22 , which is an inner metal layer, in the thickness direction.
  • the liquid pipe 14 has the pair of pipe walls 14 w provided on both sides of the flow path 14 r . Each pipe wall 14 w is not formed with a hole or a groove.
  • the liquid pipe 14 may have a porous body, for example.
  • the porous body is configured to have, for example, first bottomed holes concave from the upper surface of the metal layer 22 , which is an inner metal layer, second bottomed holes concave from the lower surface of the metal layer 22 , and pores formed by causing the first bottomed holes and the second bottomed holes to partially communicate with each other.
  • the porous body is configured to guide the working fluid C condensed in the condenser 13 to the evaporator (refer to FIG. 3 ) by a capillary force generated in the porous body 20 , for example.
  • the liquid pipe 14 is provided with an injection port for injecting the working fluid C (refer to FIG. 3 ). However, the injection port is closed by a sealing member, so that an inside of the loop type heat pipe 10 is kept airtight.
  • the evaporator 11 shown in FIG. 3 is formed by the three stacked metal layers 21 to 23 (refer to FIGS. 1 A and 2 ).
  • the evaporator 11 may have a porous body, similar to the liquid pipe 14 , for example.
  • a porous body provided in the evaporator 11 is formed in a comb-teeth shape.
  • a region in which the porous body is not provided has a space.
  • the loop type heat pipe 10 is configured by the three stacked metal layers 21 to 23 (refer to FIG the. 2 A ).
  • the number of the stacked metal layers is not limited to three layers, and may be four or more layers.
  • the first magnet 50 is provided in the condenser 13 of the loop type heat pipe 10 .
  • the condenser 13 is provided with, for example, a plurality of (six, in the present embodiment) first magnets 50 .
  • Each of the first magnets 50 is embedded in the condenser 13 , for example.
  • Each of the first magnets 50 is embedded in the pipe wall 13 w of the condenser 13 , for example.
  • each of the first magnets 50 is provided so as not to overlap the flow path 15 , specifically, the flow path 13 r , in the top view, for example.
  • the first magnets 50 are provided, for example, on both sides of the pair of pipe walls 13 w.
  • each of the first magnets 50 is provided to penetrate through the pipe wall 13 w of the condenser 13 in the thickness direction (here, Z-axis direction), for example.
  • the pipe wall 13 w is provided with a plurality of through-holes 13 X penetrating through the pipe wall 13 w in the thickness direction.
  • Each of the first magnets 50 is accommodated in each through-hole 13 X, for example.
  • a side surface of each of the first magnets 50 is in close contact with an inner surface of each through-hole 13 X, for example.
  • the side surface of each of the first magnets 50 is in close contact with the inner surface of each through-hole 13 X over an entire circumference of the first magnet 50 in a circumferential direction, for example.
  • each of the first magnets 50 and the inner surface of each through-hole 13 X may be in direct contact with each other or may be in contact with each other via an adhesive member or the like.
  • An upper surface of each of the first magnets 50 is exposed from, for example, the upper surface of the metal layer 21 , i.e., the first facing surface 13 A.
  • the upper surface of each of the first magnets 50 is formed flush with the first facing surface 13 A, for example.
  • a lower surface of each of the first magnets 50 is exposed from the lower surface of the metal layer 23 , for example.
  • the lower surface of each of the first magnets 50 is formed flush with the lower surface of the metal layer 23 , for example.
  • a planar shape of each of the first magnets 50 can be formed to have arbitrary shape and size. As shown in FIG. 3 , the planar shape of each of the first magnets 50 of the present embodiment is formed in a circular shape.
  • the plurality of first magnets 50 are provided side by side along one direction (here, X-axis direction) of a plane direction orthogonal to the thickness direction (here, Z-axis direction) of the condenser 13 .
  • the plurality of first magnets 50 are provided spaced apart from each other in the X-axis direction, for example.
  • first magnets 50 are provided spaced apart from each other in the X-axis direction.
  • the first magnet 50 provided on one pipe wall 13 w and the first magnet 50 provided on the other pipe wall 13 w are provided to sandwich the flow path 13 r from both sides in the Y-axis direction.
  • the first magnet 50 provided on one pipe wall 13 w and the first magnet 50 provided on the other pipe wall 13 w are provided at the same positions in the X-axis direction.
  • the first magnet 50 provided on one pipe wall 13 w and the first magnet 50 provided on the other pipe wall 13 w may be provided at positions different from each other in the X-axis direction.
  • the first magnet 50 for example, a ferrite magnet, a neodymium magnet, or the like can be used.
  • the first magnet 50 for example, it is preferably to use a magnet with relatively large demagnetization (reduction in magnetic force) due to heat, i.e., relatively large thermal demagnetization.
  • the first magnet 50 of the present embodiment is a ferrite magnet with large thermal demagnetization.
  • the heat dissipation plate 30 is provided facing the condenser 13 of the loop type heat pipe 10 . That is, the heat dissipation plate 30 is provided at a position overlapping the condenser 13 , in the top view.
  • the heat dissipation plate 30 is provided thermally connectable to the first facing surface 13 A of the condenser 13 , for example.
  • the heat dissipation plate 30 is formed in a flat plate shape, for example.
  • the heat dissipation plate 30 has a rectangular shape in the top view, for example.
  • the planar shape of the heat dissipation plate 30 is formed larger than the planar shape of the condenser 13 , for example.
  • the heat dissipation plate 30 is also called a heat spreader.
  • the heat dissipation plate 30 has, for example, a function of dispersing a density of heat from the condenser 13 when the heat dissipation plate is thermally connected to the first facing surface 13 A of the condenser 13 .
  • a material of the heat dissipation plate 30 a material having favorable thermal conductivity may be used, for example.
  • a substrate made of copper (Cu), silver (Ag), aluminum (Al) or an alloy thereof can be used.
  • a substrate made of ceramics such as alumina or aluminum nitride, or an insulating material or semiconductor material having high thermal conductivity such as silicon may also be used.
  • a thickness of the heat dissipation plate 30 may be set to about 500 ⁇ m to 1000 ⁇ m, for example.
  • the thickness of the heat dissipation plate 30 is formed thicker than an overall thickness of the loop type heat pipe 10 , for example.
  • the heat dissipation plate 30 has a second facing surface 30 A (here, a lower surface) facing the first facing surface 13 A of the condenser 13 , and an opposite surface 30 B (here, an upper surface) provided on an opposite side to the second facing surface 30 A in the thickness direction (here, Z-axis direction) of the heat dissipation plate 30 .
  • the second facing surface 30 A faces the first facing surface 13 A in the Z-axis direction.
  • the second facing surface 30 A is thermally connectable to the first facing surface 13 A via, for example, the heat conductive member 70 .
  • the second magnets 60 is provided in the heat dissipation plate 30 .
  • the heat dissipation plate 30 is provided with, for example, a plurality of second magnets 60 .
  • the heat dissipation plate 30 is provided with the same number (here, six) of second magnets 60 as the first magnets 50 .
  • Each of the second magnets 60 is embedded in the heat dissipation plate 30 , for example.
  • Each of the second magnets 60 is provided to face each of the first magnets 50 in the Z-axis direction.
  • a planar shape of each of the second magnets 60 can be formed to have arbitrary shape and size.
  • the planar shape of each of the second magnets 60 is formed in a circular shape, for example, similar to the planar shape of the first magnet 50 .
  • Each of the second magnets 60 is provided to penetrate through the heat dissipation plate 30 in the thickness direction, for example.
  • the heat dissipation plate 30 is provided with a plurality of through-holes 30 X penetrating through the heat dissipation plate 30 in the thickness direction.
  • Each of the second magnets 60 is accommodated in each through-hole 30 X, for example.
  • a side surface of each of the second magnets 60 is in close contact with an inner surface of each through-hole 30 X, for example.
  • the side surface of each of the second magnets 60 is in close contact with the inner surface of each through-hole 30 X over an entire circumference of the second magnet 60 in a circumferential direction, for example.
  • a lower surface of each of the second magnets 60 is exposed, for example, from the second facing surface 30 A.
  • the lower surface of each of the second magnets 60 is formed flush with the second facing surface 30 A, for example.
  • An upper surface of each of the second magnets 60 is exposed from the opposite surface 30 B of the heat dissipation plate 30 , for example.
  • the upper surface of each of the second magnets 60 is formed flush with the opposite surface 30 B, for example.
  • the first magnet 50 and the second magnet 60 are provided such that the same magnetic poles face each other, for example.
  • the first magnet 50 and the second magnet 60 are provided such that an N pole of the first magnet 50 and an N pole of the second magnet 60 face each other.
  • the N pole is magnetized on an upper part of the first magnet 50 and the N pole is magnetized on a lower part of the second magnet 60 .
  • the first magnet 50 and the second magnet 60 may also be provided such that an S pole of the first magnet 50 and an S pole of the second magnet 60 face each other.
  • the second magnet 60 for example, a ferrite magnet, a neodymium magnet, or the like can be used.
  • a magnet having relatively large thermal demagnetization can be used.
  • the second magnet 60 may be a magnet of the same type as the first magnet 50 or a magnet different from the first magnet 50 .
  • the second magnet 60 of the present embodiment is a ferrite magnet having large thermal demagnetization.
  • a heat conductive material for example, a heat conductive material (TIM: Thermal Interface Material) can be used.
  • TIM Thermal Interface Material
  • soft metal such as indium (In) or silver, silicone gel or an organic resin binder containing a metal filler, graphite, or the like can be used.
  • the heat conductive member 70 has a first end face 70 A facing the first facing surface 13 A of the condenser 13 , and a second end face 70 B facing the second facing surface 30 A of the heat dissipation plate 30 .
  • the heat conductive member 70 is formed so that an adhesive force of the first end face 70 A and an adhesive force of the second end face 70 B are different from each other, for example.
  • any one of the first end face 70 A and the second end face 70 B is an adhesive surface
  • the other of the first end face 70 A and the second end face 70 B is a non-adhesive surface.
  • the second end face 70 B is formed as the adhesive surface. For this reason, the second end face 70 B of the heat conductive member 70 adheres to the second facing surface 30 A of the heat dissipation plate 30 .
  • the first end face 70 A of the heat conductive member 70 does not adhere to the first facing surface 13 A of the condenser 13 .
  • the first end face 70 A of the heat conductive member 70 can contact the first facing surface 13 A so as to be thermally connectable to the first facing surface 13 A of the condenser 13 .
  • a thickness of the heat conductive member plate 70 may be set to about 20 ⁇ m to 100 ⁇ m, for example.
  • the heat conductive member 70 is provided, for example, on a part of the second facing surface 30 A.
  • the heat conductive member 70 is provided so as not to overlap the first magnet 50 in the top view, for example.
  • the heat conductive member 70 is provided so as not to overlap the second magnet 60 in the top view, for example.
  • the heat conductive member 70 is provided to overlap the flow path 13 r in the top view, for example.
  • the heat conductive member 70 is provided to extend in the X-axis direction along the flow path r 2 of the flow path 13 r , for example.
  • the heat conductive member 70 is provided to be sandwiched between the first magnets 50 of two rows in the Y-axis direction, for example.
  • the electronic device M 1 shown in FIGS. 1 A and 2 has the plurality of support members 40 , for example.
  • the plurality of support members 40 are configured to support the heat dissipation plate 30 at a plurality of locations, for example, in the top view. In FIGS. 1 A and 2 , only one support member 40 of the plurality of support members 40 is shown.
  • Each of the support members 40 is connected to the housing 80 , for example.
  • Each of the support members 40 is supported by the wall part 81 of the housing 80 , for example.
  • the support member 40 is configured to support the heat dissipation plate 30 so as to be movable in the Z-axis direction.
  • the support member 40 is configured to support the heat dissipation plate 30 so as to be movable in the Z-axis direction between a state in which the heat dissipation plate 30 is thermally connected to the condenser 13 (refer to FIG. 1 A ) and a state in which the heat dissipation plate 30 is not thermally connected to the condenser 13 (refer to FIG. 2 ).
  • the support member 40 is configured to movably support the heat dissipation plate 30 , so as to be able to vary a distance between the first facing surface 13 A of the condenser 13 and the second facing surface 30 A of the heat dissipation plate 30 in response to a change in magnetic force of the first magnet 50 .
  • the support member 40 is configured to support the heat dissipation plate 30 so as to be movable in the Z-axis direction, in response to a change in repulsive force between the first magnet 50 and the second magnet 60 due to thermal demagnetization, for example.
  • the support member 40 is configured to support the heat dissipation plate 30 so as to be parallel to the wall part 81 , for example.
  • the support member 40 is configured to support the heat dissipation plate 30 so as to be movable in the Z-axis direction while maintaining a posture in which the opposite surface 30 B of the heat dissipation plate 30 is parallel to a lower surface of the wall part 81 , for example.
  • the support member 40 is configured to support the heat dissipation plate 30 so as to be parallel to the condenser 13 , for example.
  • the support member 40 is configured to support the heat dissipation plate 30 so as to be movable in the Z-axis direction while maintaining a posture in which the second facing surface 30 A of the heat dissipation plate 30 is parallel to the first facing surface 13 A of the condenser 13 , for example.
  • the support member 40 has, for example, a Sarrus link mechanism.
  • Each of the supporting members 40 has, for example, a first plate part 41 , a second plate part 42 , and a hinge part 43 configured to connect the first plate part 41 and the second plate part 42 .
  • An upper end of the first plate part 41 is connected to the wall part 81 of the housing 80 .
  • the upper end of the first plate part 41 is rotatably connected to the wall part 81 , for example.
  • a lower end of the first plate part 41 is connected to the hinge part 43 .
  • the lower end of the first plate part 41 is rotatably connected to the hinge part 43 , for example.
  • An upper end of the second plate part 42 is connected to the hinge part 43 .
  • the upper end of the second plate part 42 is rotatably connected to the hinge part 43 .
  • a lower end of the second plate part 42 is connected to the opposite surface 30 B of the heat dissipation plate 30 .
  • the lower end of the second plate part 42 is rotatably connected to the opposite surface 30 B, for example.
  • the first plate part 41 is formed to have the same length as that of the second plate part 42 , for example.
  • Each of the support members 40 is formed so as to be able to vary an angle of the hinge part 43 , i.e., an angle formed by the first plate part 41 and the second plate part 42 , in response to a magnitude of the repulsive force between the first magnet 50 and the second magnet 60 .
  • the first plate part 41 rotates with respect to the wall part 81 and the hinge part 43
  • the second plate part 42 rotates with respect to the heat dissipation plate 30 and the hinge part 43 , so that the angle of the hinge part 43 changes.
  • the heat dissipation plate 30 supported horizontally with respect to the wall part 81 moves in parallel along the Z-axis direction.
  • the angle of the hinge part 43 becomes small
  • the heat dissipation plate 30 moves in parallel along the Z-axis direction so that it comes close to the wall part 81 .
  • the heat dissipation plate 30 moves in parallel along the Z-axis direction while the posture in which the second facing surface 30 A of the heat dissipation plate 30 is parallel to the first facing surface 13 A of the condenser 13 is maintained.
  • the distance between the first facing surface 13 A and the second facing surface 30 A can vary.
  • the electronic device M 1 at a time of a low heat input in which a heat input amount from the heat-generating component 16 (refer to FIG. 3 ) to the loop type heat pipe 10 is equal to or less than a first heat amount will be described.
  • the heat input amount (first heat amount) at the time of the low heat input is, for example, a heat amount within a range in which heat dissipation by the heat dissipation plate 30 is not required.
  • the heat input amount (first heat amount) at the time of the low heat input is a heat amount within a range in which the heat generated by the heat-generating component 16 (refer to FIG. 3 ) does not exceed a heat tolerance of the heat-generating component 16 even in a state in which there is no heat dissipation by the heat dissipation plate 30 .
  • the support member 40 supports the heat dissipation plate 30 in a state of being apart from the condenser 13 .
  • the angle of the hinge part 43 of the support member 40 decreases and the heat dissipation plate 30 moves in parallel along the Z-axis direction so that it comes close to the wall part 81 .
  • the heat dissipation plate 30 is supported by the support member 40 in a state in which the heat conductive member 70 adhering to the second facing surface 30 A is separated from the first facing surface 13 A of the condenser 13 , i.e., in a state in which the heat dissipation plate is not thermally connected to the condenser 13 .
  • the heat dissipation plate 30 is supported by the support member 40 in the state of being thermally disconnected from the condenser 13 .
  • the support member 40 is formed to support the heat dissipation plate 30 in a state in which the heat dissipation plate is not thermally connected to the condenser 13 . In this way, when the heat dissipation plate 30 and the condenser 13 are in the thermally disconnected state, heat dissipation or cooling by the heat dissipation plate 30 is not performed.
  • the electronic device M 1 can be kept warm by using the heat in the loop type heat pipe 10 and the heat-generating component 16 (refer FIG. 3 ).
  • the electronic device M 1 can be kept warm by using the heat in the loop type heat pipe 10 and the heat-generating part 16 (refer FIG. 3 ).
  • the electronic device M 1 at a time of a high heat input in which a heat input amount from the heat-generating component 16 (refer to FIG. 3 ) to the loop type heat pipe 10 is larger than the first heat amount will be described.
  • the heat input amount at the time of the high heat input is, for example, a heat amount within a range in which heat dissipation by the heat dissipation plate 30 is required.
  • the heat input amount at the time of the high heat input is a heat amount in which the heat generated by the heat-generating component 16 (refer to FIG. 3 ) exceeds the heat tolerance of the heat-generating component 16 in a state in which there is no heat dissipation by the heat dissipation plate 30 .
  • the ambient temperature of the first magnet 50 provided in the condenser 13 becomes high. Since the first magnet 50 is exposed to the high temperature, the thermal demagnetization (decrease in magnetic force) in the first magnet 50 becomes larger, as compared with the case of the low heat input. As a result, the repulsive force between the first magnet 50 and the second magnet 60 becomes smaller, as compared with the case of the low heat input.
  • the angle of the hinge part 43 of the support member 40 becomes larger, as compared with the angle at the time of the low heat input, and the heat dissipation plate 30 moves in parallel along the Z-axis direction so that it comes close to the condenser 13 .
  • the heat dissipation plate 30 is supported by the support member 40 in a state in which the heat conductive member 70 adhering to the second facing surface 30 A is in contact with the first facing surface 13 A of the condenser 13 , i.e., in a state in which the heat dissipation plate is thermally connected to the condenser 13 .
  • the first end face 70 A of the heat conductive member 70 is in contact with the first facing surface 13 A of the condenser 13 without a gap, but does not adhere to the first facing surface 13 A.
  • the angle of the hinge part 43 is maintained large, so that the heat dissipation plate 30 is supported by the support member 40 in a state of being thermally connected to the condenser 13 .
  • the support member 40 is formed to support the heat dissipation plate 30 in a state in which the heat dissipation plate is thermally connected to the condenser 13 .
  • the condenser 13 is provided with the first magnet 50
  • the heat dissipation plate 30 is provided with the second magnet 60 facing the first magnet 50
  • the support member 40 configured to movably support the heat dissipation plate 30 between the state in which the heat dissipation plate 30 is thermally connected to the condenser 13 and the state in which the heat dissipation plate is not thermally connected to the condenser, so as to be able to vary the distance between the condenser 13 and the heat dissipation plate 30 , in response to the change in magnetic force of the first magnet 50 .
  • the connection state of the heat dissipation plate 30 to the condenser 13 can be varied, in response to the change in magnetic force of the first magnet 50 .
  • the heat dissipation (cooling) of the heat-generating component 16 is performed only by the loop type heat pipe 10 .
  • the heat dissipation plate 30 is thermally connected to the condenser 13 , the density of heat from the condenser 13 can be dispersed by the heat dissipation plate 30 .
  • the heat dissipation (cooling) of the heat-generating component 16 is performed by the loop type heat pipe 10 and the heat dissipation plate 30 .
  • the heat dissipation performance in the loop type heat pipe 10 and the heat dissipation plate 30 can be improved. Therefore, by varying the connection state of the heat dissipation plate 30 to the condenser 13 in response to the change in magnetic force of the first magnet 50 , the heat dissipation performance of the loop type heat pipe 10 can be varied.
  • the first magnet 50 is exposed to a high temperature, for example, the magnetic force decreases.
  • the magnetic force of the first magnet 50 changes, according to the use situation and the use environment of the loop type heat pipe 10 . Therefore, by varying the connection state of the heat dissipation plate 30 to the condenser 13 in response to the change in magnetic force of the first magnet 50 , it is possible to vary the heat dissipation performance of the loop type heat pipe 10 , in response to the use situation and the use environment of the loop type heat pipe 10 .
  • the heat dissipation plate 30 At the time of the low heat input, the heat dissipation plate 30 is supported in the state of being thermally disconnected from the condenser 13 , in response to the repulsive force between the first magnet 50 and the second magnet 60 .
  • the heat dissipation plate 30 At the time of the high heat input, the heat dissipation plate 30 is supported in the state being thermally connected to the condenser 13 , in response to the thermal demagnetization of the first magnet 50 .
  • the heat dissipation plate 30 is supported in the state of being thermally connected to the condenser 13 , in response to the decrease in repulsive force between the first magnet 50 and the second magnet 60 due to the thermal demagnetization of the first magnet 50 .
  • the heat dissipation performance of the loop type heat pipe 10 can be varied, in response to changes in the use situation and the use environment such as the heat input amount from the heat-generating component 16 .
  • the heat dissipation by the heat dissipation plate 30 is not performed. Thereby, at the time of the low heat input, it is possible to suppress the heat-generating component 16 and the like from being excessively cooled by the heat dissipation plate 30 .
  • the electronic device M 1 can be kept warm by using the heat in the loop type heat pipe 10 and the heat-generating component 16 (refer FIG. 3 ).
  • the heat dissipation by the heat dissipation plate 30 is performed. Thereby, the heat in the condenser 13 can be efficiently dissipated by the heat dissipation plate 30 at the time of the high heat input. For this reason, at the time of the high heat input, the heat-generating component 16 can be efficiently cooled.
  • the first magnet 50 is provided in the condenser 13 of the loop type heat pipe 10 .
  • the first magnet 50 can be provided in the condenser 13 having a large area for heat dissipation. For this reason, an installation area of the first magnet 50 can be easily and widely secured. Further, the first magnet 50 is provided in the condenser 13 , so that heat can be efficiently dissipated to the heat dissipation plate 30 .
  • the heat conductive member 70 is interposed between the first facing surface 13 A of the condenser 13 and the second facing surface 30 A of the heat dissipation plate 30 .
  • the heat conductive member 70 can reduce a contact thermal resistance between the first facing surface 13 A and the second facing surface 30 A, and can smoothly conduct heat from the condenser 13 to the heat dissipation plate 30 . For this reason, when the heat dissipation plate 30 is connected to the condenser 13 via the heat conductive member 70 , the heat in the condenser 13 can be efficiently heat-conducted to the heat dissipation plate 30 via the heat conductive member 70 .
  • the first end face 70 A of the heat conductive member 70 is formed as the non-adhesive surface, and the second end face 70 B of the heat conductive member 70 is formed as the adhesive surface. According to this configuration, for example, the second end face 70 B of the heat conducting member 70 adheres to the second facing surface 30 A of the heat dissipation plate 30 , and the first end face 70 A of the heat conducting member 70 does not adhere to the first facing surface 13 A of the condenser 13 .
  • the heat dissipation plate 30 can be favorably moved so that the heat dissipation plate 30 and the condenser 13 are not thermally connected to each other.
  • the first magnet 50 is embedded in the condenser 13 . According to this configuration, it is possible to favorably suppress the increase in size of the loop type heat pipe 10 in the Z-axis direction due to the first magnet 50 provided.
  • the first magnet 50 is formed to penetrate through the condenser 13 in the thickness direction. According to this configuration, the thickness of the first magnet 50 can be easily formed to be thick.
  • the first magnet 50 is formed to penetrate through the condenser 13 in the thickness direction.
  • the present invention is not limited thereto.
  • the first magnet 50 may be formed so as not to penetrate through the condenser 13 in the thickness direction.
  • the pipe wall 13 w of the condenser 13 is provided with a plurality of concave portions 13 Y.
  • Each concave portion 13 Y is formed so as not to penetrate through the condenser layer 13 in the thickness direction.
  • Each concave portion 13 Y is formed to be concave from the first facing surface 13 A toward the lower surface of the condenser 13 , for example.
  • Each concave portion 13 Y is formed to penetrate through the metal layers 21 and 22 among the metal layers 21 , 22 and 23 in the thickness direction, for example.
  • Each of the first magnets 50 is accommodated in each concave portion 13 Y.
  • the side surface of each of the first magnets 50 is in close contact with an inner surface of each concave portion 13 Y, for example.
  • the side surface of each of the first magnets 50 and the inner surface of each concave portion 13 Y may be in direct contact with each other or may be in contact with each other via an adhesive member or the like.
  • a depth of the concave portion 13 Y shown in FIG. 5 can be changed as appropriate.
  • the concave portion 13 Y may be formed to penetrate through the metal layer 21 among the metal layers 21 , 22 and 23 in the thickness direction.
  • the concave portion 13 Y shown in FIG. 5 may be formed to be concave from the lower surface of the condenser 13 , i.e., the lower surface of the metal layer 23 toward the first facing surface 13 A.
  • the second magnet 60 is formed to penetrate through the heat dissipation plate 30 in the thickness direction.
  • the present invention is not limited thereto.
  • the second magnet 60 may be formed so as not to penetrate through the heat dissipation plate 30 in the thickness direction.
  • the heat dissipation plate 30 is provided with a plurality of concave portions 30 Y.
  • Each concave portion 30 Y is formed so as not to penetrate through the heat dissipation plate 30 in the thickness direction.
  • Each concave portion 30 Y is formed to be concave from the second facing surface 30 A toward the opposite surface 30 B, for example.
  • a bottom surface of each concave portion 30 Y is provided in the middle of the heat dissipation plate 30 in the thickness direction.
  • Each of the second magnets 60 is accommodated in each concave portion 30 Y.
  • each of the second magnets 60 is in close contact with an inner surface of each concave portion 30 Y, for example.
  • the side surface of each of the second magnets 60 and the inner surface of each concave portion 30 Y may be in direct contact with each other or may be in contact with each other via an adhesive member or the like.
  • a depth of the concave portion 30 Y shown in FIG. 5 can be changed as appropriate.
  • the concave portion 30 Y shown in FIG. 5 may be formed to be concave from the opposite surface 30 B toward the second facing surface 30 A.
  • the upper surface of the first magnet 50 is formed to be flush with the first facing surface 13 A.
  • the present invention is not limited thereto.
  • the first magnet 50 may be formed to protrude toward the second facing surface 30 A from the first facing surface 13 A.
  • the upper part of the first magnet 50 protrudes upward from the first facing surface 13 A.
  • a protrusion amount of the first magnet 50 from the first facing surface 13 A is set to be smaller than the thickness of the heat conductive member 70 .
  • the lower surface of the second magnet 60 is formed to be flush with the second facing surface 30 A.
  • the present invention is not limited thereto.
  • the second magnet 60 may be formed to protrude toward the first facing surface 13 A from the second facing surface 30 A.
  • the lower part of the second magnet 60 protrudes downward from the second facing surface 30 A.
  • a protrusion amount of the second magnet 60 from the second facing surface 30 A is set to be smaller than the thickness of the heat conductive member 70 .
  • a total amount obtained by summing the protrusion amount of the first magnet 50 from the first facing surface 13 A and the protrusion amount of the second magnet 60 from the second facing surface 30 A is set to be smaller than the thickness of the heat conductive member 70 .
  • the condenser 13 and the heat dissipation plate 30 can be favorably thermally connected to each other via the heat conductive member 70 .
  • the lower surface of the first magnet 50 is formed to be flush with the lower surface of the condenser 13 .
  • the present invention is not limited thereto.
  • the lower part of the first magnet 50 may be formed to protrude downward from the lower surface of the condenser 13 .
  • the lower part of the first magnet 50 may be formed to be located closer to the first facing surface 13 A side than the lower surface of the condenser 13 .
  • the upper surface of the second magnet 60 is formed to be flush with the opposite surface 30 B of the heat dissipation plate 30 .
  • the present invention is not limited thereto.
  • the upper part of the second magnet 60 may be formed to protrude upward from the opposite surface 30 B.
  • the upper part of the second magnet 60 may be formed to be located closer to the second opposite surface 30 A side than the opposite surface 30 B.
  • the first magnet 50 is provided embedded in the condenser 13 .
  • the present invention is not limited thereto.
  • the first magnet 50 may be provided on an outer surface of the condenser 13 .
  • the first magnet 50 may be provided on the first facing surface 13 A of the condenser 13 .
  • the thickness of the first magnet 50 is formed thinner than the thickness of the heat conductive member 70 .
  • the first magnet 50 of the present modified embodiment is provided so as not to overlap the heat conductive member 70 in the top view. Thereby, even when the first magnet 50 is provided on the first facing surface 13 A, the condenser 13 and the heat dissipation plate 30 can be favorably thermally connected to each other via the heat conductive member 70 .
  • the second magnet 60 is provided embedded in the heat dissipation plate 30 .
  • the present invention is not limited thereto.
  • the second magnet 60 may be provided on an outer surface of the heat dissipation plate 30 .
  • the second magnet 60 may be provided on the second facing surface 30 A of the heat dissipation plate 30 .
  • the thickness of the second magnet 60 is formed thinner than the thickness of the heat conductive member 70 .
  • the second magnet 60 of the present modified embodiment is provided so as not to overlap the heat conductive member 70 in the top view.
  • a total thickness obtained by summing the thickness of the first magnet 50 provided on the first facing surface 13 A and the thickness of the second magnet 60 provided on the second facing surface 30 A is formed to be smaller than the thickness of the heat conductive member 70 .
  • the condenser 13 and the heat dissipation plate 30 can be favorably thermally connected to each other via the heat conductive member 70 .
  • the first magnet 50 may be provided on a lower surface 13 B of the condenser 13 .
  • the first magnet 50 may be provided to overlap the flow path 13 r in the top view.
  • the first magnet 50 may be provided to overlap the heat conductive member 70 in the top view.
  • the first magnet 50 may be provided to partially overlap the second magnet 60 in the top view.
  • the condenser 13 and the heat dissipation plate 30 are thermally connected to each other via the heat conductive member 70 .
  • the present invention is not limited thereto.
  • the condenser 13 and the heat dissipation plate 30 may be thermally connected to each other by directly bringing the first facing surface 13 A of the condenser 13 and the second facing surface 30 A of the heat dissipation plate 30 into contact with each other.
  • the heat conductive member 70 is omitted.
  • the planar shape of the first magnet 50 in the above embodiment is not particularly limited.
  • the planar shape of the first magnet 50 may be formed in an arbitrary shape such as a polygonal shape, a semicircular shape, or an elliptical shape.
  • planar shape of the second magnet 60 in the above embodiment is not particularly limited.
  • the planar shape of the second magnet 60 may be formed in an arbitrary shape such as a polygonal shape, a semicircular shape, or an elliptical shape.
  • the shape of the flow path 13 r in the condenser 13 of the above embodiment is not particularly limited.
  • the flow path 13 r may be formed in a shape having a serpentine part r 4 meandering in an XY plane.
  • the flow path 13 r of the present modified embodiment has a flow path r 1 extending in the Y-axis direction, a serpentine part r 4 extending in the X-axis direction while meandering from an end portion of the flow path r 1 , and a flow path r 3 extending from an end portion of the serpentine part r 4 in the Y-axis direction.
  • the first magnet 50 of the present modified embodiment is provided so as not to overlap the flow path 13 r , for example, in the top view.
  • the first magnets 50 are provided on both sides of the pair of pipe walls 13 w of the condenser 13 .
  • the present invention is not limited thereto.
  • the first magnet 50 may be provided only in one pipe wall 13 w of the pair of pipe walls 13 w.
  • the plurality of first magnets 50 may be formed in different shapes from each other.
  • the plurality of second magnets 60 may be formed in different shapes from each other.
  • the first magnet 50 and the second magnet 60 may be formed in different shapes from each other.
  • the first magnet 50 is provided in the condenser 13 of the loop type heat pipe 10 , and the heat dissipation plate 30 is thermally connected to the condenser 13 .
  • the present invention is not limited thereto.
  • the first magnet 50 may be provided in the liquid pipe 14 and the heat dissipation plate 30 may be thermally connected to the liquid pipe 14 .
  • the first magnet 50 may be provided in the vapor pipe 12 , and the heat dissipation plate 30 may be thermally connected to the vapor pipe 12 .
  • the inner metal layer is configured only by the metal layer 22 of a single layer. That is, the inner metal layer is formed to have a single layer structure.
  • the present invention is not limited thereto.
  • the inner metal layer may also be formed to have a stacked structure where a plurality of metal layers is stacked. In this case, the inner metal layer is configured by a plurality of metal layers stacked between the metal layer 21 and the metal layer 23 .
  • the structure of the support member 40 of the above embodiment can be appropriately changed.
  • the structure of the support member 40 is not particularly limited as long as the support member has a structure capable of movably supporting the heat dissipation plate 30 so that the distance between the outer surface of the loop type heat pipe 10 and the heat dissipation plate 30 can be varied, in response to the change in magnetic force of the first magnet 50 .
  • the support member 40 may be configured by a spring member.

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  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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