US20180021985A1 - Roll type imprint master mold, method of manufacturing the same, and imprint method using the same - Google Patents
Roll type imprint master mold, method of manufacturing the same, and imprint method using the same Download PDFInfo
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- US20180021985A1 US20180021985A1 US15/652,184 US201715652184A US2018021985A1 US 20180021985 A1 US20180021985 A1 US 20180021985A1 US 201715652184 A US201715652184 A US 201715652184A US 2018021985 A1 US2018021985 A1 US 2018021985A1
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- layer
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- resin
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 32
- 239000011347 resin Substances 0.000 claims abstract description 95
- 229920005989 resin Polymers 0.000 claims abstract description 95
- 238000009413 insulation Methods 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 231
- 229920002120 photoresistant polymer Polymers 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000004952 Polyamide Substances 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 12
- 229920002647 polyamide Polymers 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000012774 insulation material Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000012780 transparent material Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000002860 competitive effect Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
- B29C33/428—For altering indicia, e.g. data, numbers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3807—Resin-bonded materials, e.g. inorganic particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
- B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2845/00—Use of polymers of unsaturated cyclic compounds having no unsaturated aliphatic groups in a side-chain, e.g. coumarone-indene resins or derivatives thereof, as mould material
Definitions
- Exemplary embodiments relate to a roll type imprint master mold, a method of manufacturing the roll type imprint master mold, and an imprint method using the roll type imprint master mold. More particularly, exemplary embodiments relate to a roll type imprint master mold for manufacturing a wire grid polarizer, a method of manufacturing the same, and an imprint method using the same.
- a cathode ray tube (CRT) display apparatus has a competitive performance and a competitive price.
- the CRT display apparatus has a weakness in size and portability. Therefore, a display apparatus such as a plasma display apparatus, a liquid crystal display apparatus and an organic light emitting display apparatus has been used where small size, light weight, and low-power-consumption are required.
- the display apparatus may include a polarizer.
- the polarizer may be a wire grid polarizer which is formed by an imprint process. As the display device becomes larger, it is difficult to improve the yield of the imprint process.
- Exemplary embodiments provide a roll type imprint master mold having an improved process yield for a large area imprint process.
- Exemplary embodiments provide a method of manufacturing the roll type imprint master mold.
- Exemplary embodiments provide an imprint method using the roll type imprint master mold.
- a roll type imprint master mold may include a roll body having a cylindrical shape extending in a first direction, a base layer disposed on the roll body to cover a surface of the roll body, and a pattern layer disposed on the base layer, the pattern layer including an inorganic insulation material.
- the pattern layer may include a wire grid polarizer pattern including a plurality of fine protrusions arranged in the first direction at a regular interval, wherein each of the fine protrusions may have a width in the first direction and extend along the base layer perpendicular to the first direction.
- a pitch of the wire grid pattern may be from about 50 nm to about 150 nm.
- the inorganic insulation material may include at least one selected from a group consisting of a silicon oxide (SiOx), silcononitrile (SiNx), and silicon oxynitride (SiON).
- SiOx silicon oxide
- SiNx silcononitrile
- SiON silicon oxynitride
- the base layer may include polyimide (PI) or polyamide (PA).
- the base layer may include a transparent material, and the surface of the roll body may be formed of a metal, on which the base layer is disposed.
- the roll type imprint master mold may further include an adhesive layer disposed between the base layer and the roll body.
- a method of manufacturing a roll type imprint master mold may include: disposing a base layer on a substrate, the substrate including a first area and a second area adjacent to the first area, disposing an inorganic insulation layer on the base layer, forming a first mask pattern on the inorganic insulation layer in the second area, forming a first resin pattern on the inorganic insulation layer in the first area, forming a pattern layer in the first area by etching the inorganic insulation layer using the first resin pattern and the first mask pattern as a mask, removing the first resin pattern and the first mask pattern, forming a second mask pattern on the inorganic insulation layer in the first area, forming a second resin pattern on the inorganic insulation layer in the second area, forming a pattern layer in the second area by etching the inorganic insulation layer using the second resin pattern and the second mask pattern as a mask, removing the second resin pattern and the second mask pattern, separating the base layer from the substrate, and attaching the base layer on which the pattern layer
- the forming of the first resin pattern may include disposing a first resin layer on the inorganic insulation layer in the first area, and forming the first resin pattern from the first resin layer using an imprint mold.
- the forming of the first mask pattern may include disposing a first mask layer on the inorganic insulation layer, disposing a first photoresist pattern on the first mask layer in the second area, and removing a portion of the first mask layer corresponding to the first area by etching the first mask layer using the first photoresist pattern as a mask.
- the forming of the second resin pattern may include disposing a second resin layer on the inorganic insulation layer in the second area, and forming the second resin pattern from the second resin layer using the imprint mold.
- the forming of the second mask pattern may include disposing a second mask layer on the inorganic insulation layer, disposing a second photoresist pattern on the second mask layer in the first area, and removing a portion of the second mask layer corresponding to the second area by etching the second mask layer using the second photoresist pattern as a mask.
- the attaching of the base layer may include attaching the base layer onto an adhesive layer between the roll body and the base layer.
- the inorganic insulation material may include at least one selected from a group consisting of a silicon oxide (SiOx), silcononitrile (SiNx), and silicon oxynitride (SiON).
- SiOx silicon oxide
- SiNx silcononitrile
- SiON silicon oxynitride
- the base layer may include polyimide (PI) or polyamide (PA).
- the base layer may include a transparent material, and a surface of the roll body is formed of a metal, on which the base layer is disposed.
- an imprint method may include disposing a first layer on a substrate, forming an imprint resin layer on the first layer, and forming an imprint resin pattern from the imprint resin layer using a roll type imprint master mold, wherein the roll type imprint master mold may include a roll body having a cylindrical shape extending in a first direction, a base layer disposed on the roll body to cover a surface of the roll body, and a pattern layer disposed on the base layer, the pattern layer including an inorganic insulation material.
- the forming the imprint resin pattern may include radiating an ultraviolet ray to a portion where the roll type imprint master mold makes contact to the imprint resin layer.
- FIG. 1 is a cross-sectional view of a roll type imprint master mold, according to an exemplary embodiment.
- FIG. 2 is a perspective view illustrating a portion of the roll type imprint master mold of FIG. 1 .
- FIGS. 3A, 3B, 3C, 3D, 3E, 3F, 3G, 3H, 3I, 3J, 3K, 3L, 3M, 3N, 3O, 3P, and 3Q are cross-sectional views illustrating a method of manufacturing the roll type imprint master mold of FIG. 1 , according to an exemplary embodiment.
- FIGS. 4A and 4B are plan views illustrating the method of manufacturing the roll type imprint master mold of FIG. 1 , according to an exemplary embodiment.
- FIG. 5 is a cross-sectional view illustrating an imprint method using the roll type imprint master mold of FIG. 1 , according to an exemplary embodiment.
- an element or layer When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, connected to, or coupled to the other element or layer or intervening elements or layers may be present. When, however, an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present.
- “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be construed as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ.
- Like numbers refer to like elements throughout.
- the term “and/or” includes any and all combinations of one or more of the associated listed items.
- first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and/or section from another element, component, region, layer, and/or section. Thus, a first element, component, region, layer, and/or section discussed below could be termed a second element, component, region, layer, and/or section without departing from the teachings of the present disclosure.
- Spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for descriptive purposes, and, thereby, to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the drawings.
- Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features.
- the exemplary term “below” can encompass both an orientation of above and below.
- the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.
- exemplary embodiments are described herein with reference to sectional illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. As such, the regions illustrated in the drawings are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.
- FIG. 1 is a cross-sectional view of a roll type imprint master mold, according to an exemplary embodiment.
- FIG. 2 is a perspective view illustrating a portion of the roll type imprint master mold of FIG. 1 .
- the roll type imprint master mold may include a roll body 10 , a base layer 110 and a pattern layer 122 .
- the roll type imprint master mold may be used for forming a wire grid polarizer of a display apparatus.
- the roll body 10 may have a cylindrical shape extending in a first direction D 1 .
- a base layer 110 may be disposed on a surface 12 of the roll body 10 .
- the base layer 110 may cover the roll body 10 .
- the surface 12 of the roll body 10 may be formed of a metal having high reflectance such as aluminum.
- the base layer 110 may be a flexible transparent resin layer.
- the base layer 110 may include at least one of polyimide (PI), polyamide (PA), and the like.
- the pattern layer 122 may be disposed on the base layer 110 .
- the pattern layer 122 may include a plurality of fine protrusions to form a wire grid pattern.
- the pattern layer 122 may have a wire grid polarizer pattern which includes the plurality of fine protrusions arranged in the first direction D 1 at regular intervals.
- Each of the fine protrusion may have a width in the first direction D 1 , and extend along the base layer 110 and perpendicular to the first direction D 1 .
- the fine protrusions may have a pitch P about 50 nm (nanometers) to about 150 nm.
- the fine protrusion may extend along a circumferential direction of the roll body 10 .
- the fine protrusion may extend in a direction which is perpendicular to the first direction D 1 , and have the width W in the first direction D 1 .
- the pattern layer 122 may include a transparent inorganic insulation layer.
- the pattern layer 122 may include at least one of silicon oxide (SiOx), silcononitrile (SiNx), silicon oxynitride (SiON), etc.
- An adhesive layer may be further disposed between the base layer 110 and the surface 12 of the roll body 10 , so that the base layer 110 on which the pattern layer 122 is disposed may be attached and fixed on the surface 12 of the roll body 10 .
- the adhesive layer may be transparent for passing ultraviolet ray.
- FIGS. 3A, 3B, 3C, 3D, 3E, 3F, 3G, 3H, 3I, 3J, 3K, 3L, 3M, 3N, 3O, 3P and 3Q are cross-sectional views illustrating a method of manufacturing the roll type imprint master mold of FIG. 1 , according to an exemplary embodiment.
- FIGS. 4A and 4B are plan views illustrating the method of manufacturing the roll type imprint master mold of FIG. 1 , according to an exemplary embodiment.
- a base layer 110 may be disposed on a substrate 100 .
- the base layer 110 may include a flexible transparent resin.
- the base layer 110 may be formed by curing a transparent resin after coating the transparent resin on the substrate 100 .
- polyimide or polyamide may be coated on the substrate 100 , and then the coated polyimide or polyamide may be cured to form the base layer 110 .
- a preliminary pattern layer 120 may be disposed on the base layer 110 .
- the preliminary pattern layer 120 may include a transparent inorganic insulation layer.
- the preliminary pattern layer 120 may include at least one of silicon oxide (SiOx), silcononitrile (SiNx), silicon oxynitride (SiON), etc.
- a first mask layer 130 may be disposed on the preliminary pattern layer 120 .
- the first mask layer 130 may include a metal.
- the first mask layer 130 may include at least one of aluminum (Al), molybdenum (Mo), etc.
- the substrate 100 may include a plurality of first areas A 1 and a plurality of second areas A 2 .
- the first area A 1 and the second area A 2 may be alternately arranged in a second direction D 2 on the substrate 100 .
- the second direction D 2 is perpendicular to the first direction D 1 .
- a first photoresist pattern 140 may be disposed on the first mask layer 130 in the second area A 2 .
- a pattern layer in the first area A 1 may be formed by a first imprint lithography process (refer to 1ST IMPRINT of FIG. 4A ), and a pattern layer in the second area A 2 may be formed by a second imprint lithography process (refer to 2ND IMPRINT of FIG. 4B ).
- a first imprint lithography process (refer to 1ST IMPRINT of FIG. 4A )
- a pattern layer in the second area A 2 may be formed by a second imprint lithography process (refer to 2ND IMPRINT of FIG. 4B ).
- a first mask pattern 132 may be formed by patterning the first mask layer 130 . Accordingly, the first layer 120 may be exposed in the first area A 1 , and the first layer 120 may be covered by the first mask pattern 132 in the second area A 2 .
- the first photoresist pattern 140 may be removed.
- a preliminary first resin pattern 140 may be disposed in the first area A 1 .
- the preliminary first resin pattern 140 may be further disposed in at least a portion of the second area A 2 adjacent to the first area A 1 .
- the preliminary first resin pattern 140 may also be disposed on the first mask pattern 132 in an edge portion of the second area A 2 adjacent to the first area A 1 .
- a resin layer may be disposed on the first layer 120 in the first area A 1 . And then, the resin layer may be pressed by an imprint mold. And then, the resin layer may be cured to form the preliminary first resin pattern 140 .
- the imprint mold may be formed on or of a wafer.
- the imprint mold may have protrusion patterns may have a shape and a arrangement having a regular interval to form a wire grid polarizer pattern.
- the protrusion patterns may have a pitch about 50 nm to about 150 nm. The pitch may be defined as sum of width of one of the protrusion pattern and a distance between two adjacent protrusion patterns.
- a residual layer of the preliminary first resin pattern 140 may be removed to form a first resin pattern 142 .
- the preliminary first resin pattern 140 may be wet etched or dry etched to remove the residual layer.
- the first layer 120 may be patterned using the first mask pattern 132 and the first resin pattern 142 .
- the first layer 120 may be etched. Accordingly, a pattern layer 122 may be disposed in the first area A 1 .
- the first mask pattern 132 may be removed. Accordingly, the first layer 120 may be exposed.
- a second mask layer 150 may be disposed on the pattern layer 122 and the first layer 120 in the first area A 1 and the second area A 2 .
- the second mask layer 150 may include a metal.
- the second mask layer 150 may include at least one of aluminum (Al), molybdenum (Mo), etc.
- a second photoresist pattern 160 may be disposed on the second mask layer 150 in the first area A 1 .
- the photoresist pattern 160 may be disposed corresponding to the first area A 1 , and not disposed in the second area A 2 .
- the second photoresist pattern 160 may be disposed in a portion of the second area A 2 , or a portion of the first area A 1 not be filled with the photoresist pattern 160 .
- such a formation error of the pattern layer 122 according to the photo process may be imperceptible to the human eye.
- a second mask pattern 152 may be formed by patterning the second mask layer 150 using the second photoresist pattern 160 . Accordingly, the first layer 120 may be exposed in the second area A 2 , and the pattern layer 122 may be covered by the second mask pattern 152 in the first area A 1 .
- the second photoresist pattern 160 may be removed.
- a preliminary second resin pattern 170 may be disposed on the first layer 120 in the second area A 2 .
- the preliminary second resin pattern 170 may be further disposed in at least a portion of the first area A 1 adjacent to the second area A 2 .
- the preliminary second resin pattern 170 may also be disposed on the second mask pattern 152 in an edge portion of the first area A 1 adjacent to the second area A 2 .
- a resin layer may be disposed on the first layer 120 in the second area A 2 . And then, the resin layer may be pressed by an imprint mold. And then, the resin layer may be cured to form the preliminary second resin pattern 170 .
- the preliminary second resin pattern 170 may be formed using the same method used for the preliminary first resin pattern 140 .
- a residual layer of the preliminary second resin pattern 170 may be removed to form a second resin pattern 172 .
- the preliminary second resin pattern 170 may be wet etched or dry etched to remove the residual layer.
- the first layer 120 may be patterned using the second mask pattern 152 and the second resin pattern 172 .
- the first layer 120 may be etched using the second mask pattern 152 and the second resin pattern 172 as an etching barrier. Accordingly, a pattern layer 122 may be disposed in the second area A 2 .
- the second mask pattern 152 may be removed. Accordingly, the pattern layer 122 in the first area A 1 may be exposed.
- the pattern layer 122 may have a formation error at a boundary between the first area A 1 and the second area A 2 .
- the formation error may be imperceptible to the human eye as described in FIG. 3J .
- the substrate 100 may be separated from the base layer 110 .
- the base layer 110 may be peeled off from the substrate 100 .
- the base layer 110 having the pattern layer 122 may be attached to the surface 12 of the roll body 10 to manufacture the roll type imprint master mold of FIGS. 1 and 2 , according to an exemplary embodiment.
- the base layer 110 is flexible, and the pattern layer 122 includes an inorganic insulation material having sufficient strength. Therefore, the roll type imprint master mold may be manufactured by attaching the base layer 110 having the pattern layer 122 on the roll body 10 .
- FIG. 5 is a cross-sectional view illustrating an imprint method using the roll type imprint master mold of FIG. 1 , according to an exemplary embodiment.
- a first layer 210 may be disposed on a substrate 200 .
- the first layer 210 may be formed of metal.
- the first layer 210 may be used to form the wire grid polarizer of a display apparatus.
- the first layer 120 may include aluminum.
- An imprint resin layer 220 may be disposed on the first layer 210 .
- the imprint resin layer 220 may include photocurable resin.
- the imprint resin layer 220 may be pressed using the roll type imprint master mold. Accordingly, the pattern layer 122 of the roll type imprint master mold may be imprinted onto the imprint resin layer 220 , so that an imprint resin pattern may be formed in the imprint resin layer 220 .
- the roll type imprint master mold may be rotated and rolled on the substrate 200 while moving the substrate 200 in a second direction D 2 .
- An ultraviolet irradiator 300 may radiate ultraviolet ray to the imprint resin layer 220 on which the pattern layer 122 is imprinted, and hardening the imprint resin layer 220 .
- the ultraviolet irradiator 300 may radiate the ultraviolet ray to a portion of the imprint resin layer 220 to where the roll type imprint master mold is contacted. Accordingly, the imprint resin layer 220 including the photocurable resin may be hardened.
- a surface 12 of the roll body 10 of the roll type imprint master mold may be formed of a metal having high reflectance such as aluminum, and the first layer 210 may be formed of a metal such as aluminum.
- the pattern layer 122 and/or the imprint resin layer 220 may transmit through light.
- the ultraviolet ray generated from the ultraviolet irradiator 300 passes the pattern layer 122 and is reflected on the surface 12 of the roll body 10 , and then the light passes the imprint resin layer 220 and is reflected on the first layer 210 , so that the imprint resin layer 220 may be efficiently hardened.
- the roll type imprint master mold includes the inorganic insulation material, so that durability of the roll type imprint master mold may be improved compared to a conventional imprint mold formed of resin.
- the roll type imprint master mold is directly imprinted on the display substrate without an additional film mold according to the imprint method using the roll type imprint master mold, so that process will be simplified compared to a conventional method which includes forming a film mold using an imprint mold and transferring the film mold to the display substrate.
- the surface of the roll body of the roll type imprint master mold is formed of a metal having high reflectance such as aluminum, and the first layer disposed under the imprint resin layer is also formed of a metal, so that radiation efficiency of the ultraviolet ray for hardening the imprint resin layer may be improved.
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Abstract
Description
- This application claims priority from and the benefit of Korean Patent Application No. 10-2016-0091130, filed on Jul. 19, 2016, which is hereby incorporated by reference for all purposes as if fully set forth herein.
- Exemplary embodiments relate to a roll type imprint master mold, a method of manufacturing the roll type imprint master mold, and an imprint method using the roll type imprint master mold. More particularly, exemplary embodiments relate to a roll type imprint master mold for manufacturing a wire grid polarizer, a method of manufacturing the same, and an imprint method using the same.
- Recently, a display apparatus having light weight and small size has been manufactured. A cathode ray tube (CRT) display apparatus has a competitive performance and a competitive price. However the CRT display apparatus has a weakness in size and portability. Therefore, a display apparatus such as a plasma display apparatus, a liquid crystal display apparatus and an organic light emitting display apparatus has been used where small size, light weight, and low-power-consumption are required.
- The display apparatus may include a polarizer. The polarizer may be a wire grid polarizer which is formed by an imprint process. As the display device becomes larger, it is difficult to improve the yield of the imprint process.
- The above information disclosed in this Background section is only for enhancement of understanding of the background of the inventive concept, and, therefore, it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.
- Exemplary embodiments provide a roll type imprint master mold having an improved process yield for a large area imprint process.
- Exemplary embodiments provide a method of manufacturing the roll type imprint master mold.
- Exemplary embodiments provide an imprint method using the roll type imprint master mold.
- Additional aspects will be set forth in the detailed description which follows, and, in part, will be apparent from the disclosure, or may be learned by practice of the inventive concept.
- According to exemplary embodiments, a roll type imprint master mold may include a roll body having a cylindrical shape extending in a first direction, a base layer disposed on the roll body to cover a surface of the roll body, and a pattern layer disposed on the base layer, the pattern layer including an inorganic insulation material.
- The pattern layer may include a wire grid polarizer pattern including a plurality of fine protrusions arranged in the first direction at a regular interval, wherein each of the fine protrusions may have a width in the first direction and extend along the base layer perpendicular to the first direction.
- A pitch of the wire grid pattern may be from about 50 nm to about 150 nm.
- The inorganic insulation material may include at least one selected from a group consisting of a silicon oxide (SiOx), silcononitrile (SiNx), and silicon oxynitride (SiON).
- The base layer may include polyimide (PI) or polyamide (PA).
- The base layer may include a transparent material, and the surface of the roll body may be formed of a metal, on which the base layer is disposed.
- The roll type imprint master mold may further include an adhesive layer disposed between the base layer and the roll body.
- According to exemplary embodiments, a method of manufacturing a roll type imprint master mold may include: disposing a base layer on a substrate, the substrate including a first area and a second area adjacent to the first area, disposing an inorganic insulation layer on the base layer, forming a first mask pattern on the inorganic insulation layer in the second area, forming a first resin pattern on the inorganic insulation layer in the first area, forming a pattern layer in the first area by etching the inorganic insulation layer using the first resin pattern and the first mask pattern as a mask, removing the first resin pattern and the first mask pattern, forming a second mask pattern on the inorganic insulation layer in the first area, forming a second resin pattern on the inorganic insulation layer in the second area, forming a pattern layer in the second area by etching the inorganic insulation layer using the second resin pattern and the second mask pattern as a mask, removing the second resin pattern and the second mask pattern, separating the base layer from the substrate, and attaching the base layer on which the pattern layer is formed onto a roll body having a cylindrical shape.
- The forming of the first resin pattern may include disposing a first resin layer on the inorganic insulation layer in the first area, and forming the first resin pattern from the first resin layer using an imprint mold.
- The forming of the first mask pattern may include disposing a first mask layer on the inorganic insulation layer, disposing a first photoresist pattern on the first mask layer in the second area, and removing a portion of the first mask layer corresponding to the first area by etching the first mask layer using the first photoresist pattern as a mask.
- The forming of the second resin pattern may include disposing a second resin layer on the inorganic insulation layer in the second area, and forming the second resin pattern from the second resin layer using the imprint mold.
- The forming of the second mask pattern may include disposing a second mask layer on the inorganic insulation layer, disposing a second photoresist pattern on the second mask layer in the first area, and removing a portion of the second mask layer corresponding to the second area by etching the second mask layer using the second photoresist pattern as a mask.
- The attaching of the base layer may include attaching the base layer onto an adhesive layer between the roll body and the base layer.
- The inorganic insulation material may include at least one selected from a group consisting of a silicon oxide (SiOx), silcononitrile (SiNx), and silicon oxynitride (SiON).
- The base layer may include polyimide (PI) or polyamide (PA).
- The base layer may include a transparent material, and a surface of the roll body is formed of a metal, on which the base layer is disposed.
- According to exemplary embodiments, an imprint method may include disposing a first layer on a substrate, forming an imprint resin layer on the first layer, and forming an imprint resin pattern from the imprint resin layer using a roll type imprint master mold, wherein the roll type imprint master mold may include a roll body having a cylindrical shape extending in a first direction, a base layer disposed on the roll body to cover a surface of the roll body, and a pattern layer disposed on the base layer, the pattern layer including an inorganic insulation material.
- The forming the imprint resin pattern may include radiating an ultraviolet ray to a portion where the roll type imprint master mold makes contact to the imprint resin layer.
- The foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the claimed subject matter.
- The accompanying drawings, which are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the inventive concept, and, together with the description, serve to explain principles of the inventive concept.
-
FIG. 1 is a cross-sectional view of a roll type imprint master mold, according to an exemplary embodiment. -
FIG. 2 is a perspective view illustrating a portion of the roll type imprint master mold ofFIG. 1 . -
FIGS. 3A, 3B, 3C, 3D, 3E, 3F, 3G, 3H, 3I, 3J, 3K, 3L, 3M, 3N, 3O, 3P, and 3Q are cross-sectional views illustrating a method of manufacturing the roll type imprint master mold ofFIG. 1 , according to an exemplary embodiment. -
FIGS. 4A and 4B are plan views illustrating the method of manufacturing the roll type imprint master mold ofFIG. 1 , according to an exemplary embodiment. -
FIG. 5 is a cross-sectional view illustrating an imprint method using the roll type imprint master mold ofFIG. 1 , according to an exemplary embodiment. - In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various exemplary embodiments. It is apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring various exemplary embodiments.
- In the accompanying figures, the size and relative sizes of layers, films, panels, regions, etc., may be exaggerated for clarity and descriptive purposes. Also, like reference numerals denote like elements.
- When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it may be directly on, connected to, or coupled to the other element or layer or intervening elements or layers may be present. When, however, an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be construed as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
- Although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and/or section from another element, component, region, layer, and/or section. Thus, a first element, component, region, layer, and/or section discussed below could be termed a second element, component, region, layer, and/or section without departing from the teachings of the present disclosure.
- Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for descriptive purposes, and, thereby, to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and/or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.
- The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Moreover, the terms “comprises,” “comprising,” “includes,” and/or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
- Various exemplary embodiments are described herein with reference to sectional illustrations that are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. As such, the regions illustrated in the drawings are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to be limiting.
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense, unless expressly so defined herein.
- Hereinafter, the exemplary embodiments of inventive concepts will be explained in detail with reference to the accompanying drawings.
-
FIG. 1 is a cross-sectional view of a roll type imprint master mold, according to an exemplary embodiment.FIG. 2 is a perspective view illustrating a portion of the roll type imprint master mold ofFIG. 1 . - Referring to
FIGS. 1 and 2 , the roll type imprint master mold may include aroll body 10, abase layer 110 and apattern layer 122. The roll type imprint master mold may be used for forming a wire grid polarizer of a display apparatus. - The
roll body 10 may have a cylindrical shape extending in a first direction D1. Abase layer 110 may be disposed on asurface 12 of theroll body 10. Thebase layer 110 may cover theroll body 10. Thesurface 12 of theroll body 10 may be formed of a metal having high reflectance such as aluminum. - The
base layer 110 may be a flexible transparent resin layer. For example, thebase layer 110 may include at least one of polyimide (PI), polyamide (PA), and the like. - The
pattern layer 122 may be disposed on thebase layer 110. Thepattern layer 122 may include a plurality of fine protrusions to form a wire grid pattern. Thus, thepattern layer 122 may have a wire grid polarizer pattern which includes the plurality of fine protrusions arranged in the first direction D1 at regular intervals. Each of the fine protrusion may have a width in the first direction D1, and extend along thebase layer 110 and perpendicular to the first direction D1. - For example, the fine protrusions may have a pitch P about 50 nm (nanometers) to about 150 nm. The pitch P may be defined as sum of a width W of one of the fine protrusion and a distance S between the fine protrusions disposed adjacent to each other (P=W+S). The fine protrusion may extend along a circumferential direction of the
roll body 10. Thus, the fine protrusion may extend in a direction which is perpendicular to the first direction D1, and have the width W in the first direction D1. - The
pattern layer 122 may include a transparent inorganic insulation layer. For example, thepattern layer 122 may include at least one of silicon oxide (SiOx), silcononitrile (SiNx), silicon oxynitride (SiON), etc. - An adhesive layer may be further disposed between the
base layer 110 and thesurface 12 of theroll body 10, so that thebase layer 110 on which thepattern layer 122 is disposed may be attached and fixed on thesurface 12 of theroll body 10. The adhesive layer may be transparent for passing ultraviolet ray. -
FIGS. 3A, 3B, 3C, 3D, 3E, 3F, 3G, 3H, 3I, 3J, 3K, 3L, 3M, 3N, 3O, 3P and 3Q are cross-sectional views illustrating a method of manufacturing the roll type imprint master mold ofFIG. 1 , according to an exemplary embodiment.FIGS. 4A and 4B are plan views illustrating the method of manufacturing the roll type imprint master mold ofFIG. 1 , according to an exemplary embodiment. - Referring to
FIG. 3A , abase layer 110 may be disposed on asubstrate 100. Thebase layer 110 may include a flexible transparent resin. Thebase layer 110 may be formed by curing a transparent resin after coating the transparent resin on thesubstrate 100. - For example, polyimide or polyamide may be coated on the
substrate 100, and then the coated polyimide or polyamide may be cured to form thebase layer 110. - A
preliminary pattern layer 120 may be disposed on thebase layer 110. Thepreliminary pattern layer 120 may include a transparent inorganic insulation layer. For example, thepreliminary pattern layer 120 may include at least one of silicon oxide (SiOx), silcononitrile (SiNx), silicon oxynitride (SiON), etc. - A
first mask layer 130 may be disposed on thepreliminary pattern layer 120. Thefirst mask layer 130 may include a metal. For example, thefirst mask layer 130 may include at least one of aluminum (Al), molybdenum (Mo), etc. - Referring to
FIGS. 3B, 4A and 4B , thesubstrate 100 may include a plurality of first areas A1 and a plurality of second areas A2. The first area A1 and the second area A2 may be alternately arranged in a second direction D2 on thesubstrate 100. The second direction D2 is perpendicular to the first direction D1. Afirst photoresist pattern 140 may be disposed on thefirst mask layer 130 in the second area A2. - Referring to
FIGS. 4A and 4B , a pattern layer in the first area A1 may be formed by a first imprint lithography process (refer to 1ST IMPRINT ofFIG. 4A ), and a pattern layer in the second area A2 may be formed by a second imprint lithography process (refer to 2ND IMPRINT ofFIG. 4B ). Hereinafter, a detailed method will be described. - Referring to
FIG. 3C , using thefirst photoresist pattern 140, afirst mask pattern 132 may be formed by patterning thefirst mask layer 130. Accordingly, thefirst layer 120 may be exposed in the first area A1, and thefirst layer 120 may be covered by thefirst mask pattern 132 in the second area A2. - Referring to
FIG. 3D , thefirst photoresist pattern 140 may be removed. - Referring to
FIG. 3E , a preliminaryfirst resin pattern 140 may be disposed in the first area A1. The preliminaryfirst resin pattern 140 may be further disposed in at least a portion of the second area A2 adjacent to the first area A1. Thus, the preliminaryfirst resin pattern 140 may also be disposed on thefirst mask pattern 132 in an edge portion of the second area A2 adjacent to the first area A1. - A resin layer may be disposed on the
first layer 120 in the first area A1. And then, the resin layer may be pressed by an imprint mold. And then, the resin layer may be cured to form the preliminaryfirst resin pattern 140. The imprint mold may be formed on or of a wafer. The imprint mold may have protrusion patterns may have a shape and a arrangement having a regular interval to form a wire grid polarizer pattern. The protrusion patterns may have a pitch about 50 nm to about 150 nm. The pitch may be defined as sum of width of one of the protrusion pattern and a distance between two adjacent protrusion patterns. - Referring to
FIG. 3F , a residual layer of the preliminaryfirst resin pattern 140 may be removed to form afirst resin pattern 142. For example, the preliminaryfirst resin pattern 140 may be wet etched or dry etched to remove the residual layer. - Referring to
FIG. 3G , thefirst layer 120 may be patterned using thefirst mask pattern 132 and thefirst resin pattern 142. For example, using thefirst mask pattern 132 and thefirst resin pattern 142 as an etching barrier, thefirst layer 120 may be etched. Accordingly, apattern layer 122 may be disposed in the first area A1. - And then, remaining portions of the
first resin pattern 142 may be removed. - Referring to
FIG. 3H , thefirst mask pattern 132 may be removed. Accordingly, thefirst layer 120 may be exposed. - Referring to
FIG. 3I , asecond mask layer 150 may be disposed on thepattern layer 122 and thefirst layer 120 in the first area A1 and the second area A2. Thesecond mask layer 150 may include a metal. For example, thesecond mask layer 150 may include at least one of aluminum (Al), molybdenum (Mo), etc. - Referring to
FIG. 3J , asecond photoresist pattern 160 may be disposed on thesecond mask layer 150 in the first area A1. Here, thephotoresist pattern 160 may be disposed corresponding to the first area A1, and not disposed in the second area A2. According to accuracy of a photo process, thesecond photoresist pattern 160 may be disposed in a portion of the second area A2, or a portion of the first area A1 not be filled with thephotoresist pattern 160. However, such a formation error of thepattern layer 122 according to the photo process may be imperceptible to the human eye. - Referring to
FIG. 3K , asecond mask pattern 152 may be formed by patterning thesecond mask layer 150 using thesecond photoresist pattern 160. Accordingly, thefirst layer 120 may be exposed in the second area A2, and thepattern layer 122 may be covered by thesecond mask pattern 152 in the first area A1. - Referring to
FIG. 3L , thesecond photoresist pattern 160 may be removed. - Referring to
FIG. 3M , a preliminarysecond resin pattern 170 may be disposed on thefirst layer 120 in the second area A2. The preliminarysecond resin pattern 170 may be further disposed in at least a portion of the first area A1 adjacent to the second area A2. Thus, the preliminarysecond resin pattern 170 may also be disposed on thesecond mask pattern 152 in an edge portion of the first area A1 adjacent to the second area A2. - A resin layer may be disposed on the
first layer 120 in the second area A2. And then, the resin layer may be pressed by an imprint mold. And then, the resin layer may be cured to form the preliminarysecond resin pattern 170. The preliminarysecond resin pattern 170 may be formed using the same method used for the preliminaryfirst resin pattern 140. - Referring to
FIG. 3N , a residual layer of the preliminarysecond resin pattern 170 may be removed to form a second resin pattern 172. For example, the preliminarysecond resin pattern 170 may be wet etched or dry etched to remove the residual layer. - Referring to
FIG. 30 , thefirst layer 120 may be patterned using thesecond mask pattern 152 and the second resin pattern 172. For example, thefirst layer 120 may be etched using thesecond mask pattern 152 and the second resin pattern 172 as an etching barrier. Accordingly, apattern layer 122 may be disposed in the second area A2. - And then, remaining portions of the second resin pattern 172 may be removed.
- Referring to
FIG. 3P , thesecond mask pattern 152 may be removed. Accordingly, thepattern layer 122 in the first area A1 may be exposed. - The
pattern layer 122 may have a formation error at a boundary between the first area A1 and the second area A2. However, the formation error may be imperceptible to the human eye as described inFIG. 3J . - Referring to
FIG. 3Q , thesubstrate 100 may be separated from thebase layer 110. For example, using a laser, thebase layer 110 may be peeled off from thesubstrate 100. Accordingly, thebase layer 110 having thepattern layer 122 may be attached to thesurface 12 of theroll body 10 to manufacture the roll type imprint master mold ofFIGS. 1 and 2 , according to an exemplary embodiment. - The
base layer 110 is flexible, and thepattern layer 122 includes an inorganic insulation material having sufficient strength. Therefore, the roll type imprint master mold may be manufactured by attaching thebase layer 110 having thepattern layer 122 on theroll body 10. -
FIG. 5 is a cross-sectional view illustrating an imprint method using the roll type imprint master mold ofFIG. 1 , according to an exemplary embodiment. - Referring to
FIG. 5 , afirst layer 210 may be disposed on asubstrate 200. Thefirst layer 210 may be formed of metal. Thefirst layer 210 may be used to form the wire grid polarizer of a display apparatus. For example, thefirst layer 120 may include aluminum. An imprint resin layer 220 may be disposed on thefirst layer 210. The imprint resin layer 220 may include photocurable resin. - The imprint resin layer 220 may be pressed using the roll type imprint master mold. Accordingly, the
pattern layer 122 of the roll type imprint master mold may be imprinted onto the imprint resin layer 220, so that an imprint resin pattern may be formed in the imprint resin layer 220. Here, the roll type imprint master mold may be rotated and rolled on thesubstrate 200 while moving thesubstrate 200 in a second direction D2. - An
ultraviolet irradiator 300 may radiate ultraviolet ray to the imprint resin layer 220 on which thepattern layer 122 is imprinted, and hardening the imprint resin layer 220. Theultraviolet irradiator 300 may radiate the ultraviolet ray to a portion of the imprint resin layer 220 to where the roll type imprint master mold is contacted. Accordingly, the imprint resin layer 220 including the photocurable resin may be hardened. - Here, a
surface 12 of theroll body 10 of the roll type imprint master mold may be formed of a metal having high reflectance such as aluminum, and thefirst layer 210 may be formed of a metal such as aluminum. In addition, thepattern layer 122 and/or the imprint resin layer 220 may transmit through light. - Thus, the ultraviolet ray generated from the
ultraviolet irradiator 300 passes thepattern layer 122 and is reflected on thesurface 12 of theroll body 10, and then the light passes the imprint resin layer 220 and is reflected on thefirst layer 210, so that the imprint resin layer 220 may be efficiently hardened. - According to the exemplary embodiments, the roll type imprint master mold includes the inorganic insulation material, so that durability of the roll type imprint master mold may be improved compared to a conventional imprint mold formed of resin. In addition, the roll type imprint master mold is directly imprinted on the display substrate without an additional film mold according to the imprint method using the roll type imprint master mold, so that process will be simplified compared to a conventional method which includes forming a film mold using an imprint mold and transferring the film mold to the display substrate.
- In addition, the surface of the roll body of the roll type imprint master mold is formed of a metal having high reflectance such as aluminum, and the first layer disposed under the imprint resin layer is also formed of a metal, so that radiation efficiency of the ultraviolet ray for hardening the imprint resin layer may be improved.
- Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concepts are not limited to such embodiments, but rather to the broader scope of the presented claims and various obvious modifications and equivalent arrangements.
Claims (20)
Applications Claiming Priority (2)
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KR1020160091130A KR20180009825A (en) | 2016-07-19 | 2016-07-19 | Roll type imprint master mold, manufacturing the same, and imprint method using the same |
KR10-2016-0091130 | 2016-07-19 |
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US20180021985A1 true US20180021985A1 (en) | 2018-01-25 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11868042B2 (en) | 2018-08-31 | 2024-01-09 | Samsung Display Co., Ltd. | Master stamp for nano imprint and method for manufacturing the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102180106B1 (en) | 2019-04-26 | 2020-11-18 | 부산대학교 산학협력단 | Sleeve type roll mold manufacturing method for nano and micro patterning applied to roll to roll imprint lithography |
KR20220025981A (en) | 2020-08-24 | 2022-03-04 | 부산대학교 산학협력단 | Method of increasing nano patterned cylindrical mold using pattern transfer process |
KR20220025982A (en) | 2020-08-24 | 2022-03-04 | 부산대학교 산학협력단 | Replicate method of patterning process for sleeve type roll mold |
KR20230020035A (en) * | 2021-08-02 | 2023-02-10 | 삼성디스플레이 주식회사 | Mask for Deposition |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090189306A1 (en) * | 2008-01-30 | 2009-07-30 | Canon Kabushiki Kaisha | Manufacturing method of structure by imprint |
US20110042352A1 (en) * | 2007-08-03 | 2011-02-24 | Canon Kabushiki Kaisha | Imprint method and processing method of substrate using the imprint method |
US20110064871A1 (en) * | 2008-05-23 | 2011-03-17 | Showa Denko K.K. | Laminated body for manufacturing resin mold, laminated body, resin mold and method for manufacturing magnetic recording medium |
US20120328728A1 (en) * | 2010-01-29 | 2012-12-27 | Hoya Corporation | Mold for imprinting and production method thereof |
US20140017614A1 (en) * | 2012-07-12 | 2014-01-16 | Transfer Devices, Inc. | Method of forming large-area masters for replication of transfer lithography templates |
US20170227696A1 (en) * | 2014-08-04 | 2017-08-10 | Dai Nippon Printing Co., Ltd. | Imprint mold, imprint method, wire grid polarizer, and method for manufacturing wire grid polarizer |
US10281817B2 (en) * | 2016-09-27 | 2019-05-07 | Samsung Display Co., Ltd. | Method of manufacturing imprint master template |
US20190193305A1 (en) * | 2016-05-09 | 2019-06-27 | Dexerials Corporation | Replica master mold, method of manufacturing replica master mold, article, and method of manufacturing formation object |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6080139B2 (en) | 2012-05-31 | 2017-02-15 | エルジー・ケム・リミテッド | Plate, printing apparatus including the same, and printing method using the same |
KR20150095971A (en) | 2014-02-12 | 2015-08-24 | 삼성디스플레이 주식회사 | Master mold, imprint mold and method of manufacturing display device using the imprint mold |
-
2016
- 2016-07-19 KR KR1020160091130A patent/KR20180009825A/en not_active Application Discontinuation
-
2017
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110042352A1 (en) * | 2007-08-03 | 2011-02-24 | Canon Kabushiki Kaisha | Imprint method and processing method of substrate using the imprint method |
US20090189306A1 (en) * | 2008-01-30 | 2009-07-30 | Canon Kabushiki Kaisha | Manufacturing method of structure by imprint |
US20110064871A1 (en) * | 2008-05-23 | 2011-03-17 | Showa Denko K.K. | Laminated body for manufacturing resin mold, laminated body, resin mold and method for manufacturing magnetic recording medium |
US20120328728A1 (en) * | 2010-01-29 | 2012-12-27 | Hoya Corporation | Mold for imprinting and production method thereof |
US20140017614A1 (en) * | 2012-07-12 | 2014-01-16 | Transfer Devices, Inc. | Method of forming large-area masters for replication of transfer lithography templates |
US20170227696A1 (en) * | 2014-08-04 | 2017-08-10 | Dai Nippon Printing Co., Ltd. | Imprint mold, imprint method, wire grid polarizer, and method for manufacturing wire grid polarizer |
US20190193305A1 (en) * | 2016-05-09 | 2019-06-27 | Dexerials Corporation | Replica master mold, method of manufacturing replica master mold, article, and method of manufacturing formation object |
US10281817B2 (en) * | 2016-09-27 | 2019-05-07 | Samsung Display Co., Ltd. | Method of manufacturing imprint master template |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11868042B2 (en) | 2018-08-31 | 2024-01-09 | Samsung Display Co., Ltd. | Master stamp for nano imprint and method for manufacturing the same |
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US10773427B2 (en) | 2020-09-15 |
KR20180009825A (en) | 2018-01-30 |
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