US20170050410A1 - Multi-layer forms and methods of manufacturing the same - Google Patents
Multi-layer forms and methods of manufacturing the same Download PDFInfo
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- US20170050410A1 US20170050410A1 US15/333,165 US201615333165A US2017050410A1 US 20170050410 A1 US20170050410 A1 US 20170050410A1 US 201615333165 A US201615333165 A US 201615333165A US 2017050410 A1 US2017050410 A1 US 2017050410A1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/425—Marking by deformation, e.g. embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/465—Associating two or more layers using chemicals or adhesives
- B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/04—4 layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/12—Paper, e.g. cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2325/00—Polymers of vinyl-aromatic compounds, e.g. polystyrene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
- Y10T156/1041—Subsequent to lamination
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1043—Subsequent to assembly
- Y10T156/1044—Subsequent to assembly of parallel stacked sheets only
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
Definitions
- stations and/or portions 102 - 130 of the apparatus 100 are depicted in a particular order, the stations and/or portions 102 - 130 may be arranged differently. While the apparatus 100 is depicted as having the gluers 110 , 112 being separate from the folders 126 , 128 , in other examples, the gluer(s) and the folding station(s) may be combined.
- a first surface 2124 of the first paper ply 2102 includes imaging 2126 , 2127 and the first paper and poly plies 2102 , 2110 include an embossed area 2128 , 2130 .
- the imaging 2126 , 2127 is used to include personal information on the form (e.g., a person's name, etc.) and/or a barcode and the embossed area 2128 , 2130 identifies a name of a company.
- glue and/or paste may be applied to the imaged portion and/the first side of the paper substrate and a poly web and/or substrate may be mated therewith (blocks 2306 , 2308 ).
- the poly substrate covers approximately one half of the paper substrate (e.g., over the glued portion) and the glue is substantially clear when dried.
- the mated substrates may pass through an embosser that embosses the mated substrates.
- the embosser may be a static embosser and/or a variable embosser that embosses a number(s), a name(s), etc. on a portion of the substrates.
- the embossed area is ink tipped and cured. (blocks 2312 , 2314 ). The ink tipping enables the embossed area to stand out and/or be more visible.
- the cutter 2422 may round the corners of the card, tag and/or form being produced, add one or more lines of weakness to the card, tag and/or form and/or cut and/or remove a waste matrix surrounding the card, tag and/or form being produced.
- the gluer 2424 may apply glue to a back surface of the completed card, tag and/or form (e.g., the smooth back surface opposite the embossed front surface) and the mater 2418 may mate the completed card, tag and/or form with a third substrate 2430 .
- the third substrate 2430 may be a carrier web used to produce a mailer, a mailer insert, a form, etc.
Abstract
Multi-layer forms and methods of producing the same are disclosed. An example apparatus includes means for moving a first substrate in a direction; means for applying adhesive to a first portion of a first side of the first substrate; means for mating a second substrate with the first portion; means for applying adhesive to a third portion of a second side of the first substrate; means for folding the first substrate about a first fold line to couple the third portion to a fourth portion of the second side; means for applying adhesive to a first sub-portion of a second portion of the first side; and means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of a second sub-portion of the second portion and to position the first substrate between the second substrate.
Description
- This patent arises from a continuation of U.S. patent application Ser. No. 14/025,570, filed Sep. 12, 2013. Priority is claimed to U.S. patent application Ser. No. 14/025,570. U.S. patent application Ser. No. 14/025,570 is hereby incorporated herein by reference in its entirety.
- This patent relates to multi-layer forms and, more specifically, to multi-layer forms and methods of producing the same.
- Cards or tags may be produced for identification purposes.
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FIG. 1 depicts an example apparatus that can be used to produce the example multi-layer forms disclosed herein. -
FIGS. 2-12 depict an example multi-layer form at various stages of an example production process. -
FIGS. 13 and 14 depict an example card and/or form in accordance with the teachings of this disclosure. -
FIGS. 15 and 16 depict an example sponsorship tag and/or form in accordance with the teachings of this disclosure. -
FIGS. 17 and 18 depict an example ornament and/or form in accordance with the teachings of this disclosure. -
FIGS. 19 and 20 depict an example luggage tag and/or form in accordance with the teachings of this disclosure. -
FIGS. 21 and 22 depict an example card and key tag and/or form in accordance with the teachings of this disclosure. -
FIG. 23 is a flowchart representation of an example process, which may be implemented using machine readable instructions, to produce the example forms ofFIGS. 2-22 . -
FIG. 24 depicts an example apparatus that can be used to produce an example multi-layer forms disclosed herein. -
FIGS. 25-35 depict an example multi-layer form at various stages of an example production process. -
FIG. 36 is a flowchart representation of an example process, which may be implemented using machine readable instructions, to produce the example forms ofFIGS. 13-22 and 25-35 . -
FIG. 37 shows an example web that can be used to produce the example multi-layer forms disclosed herein. -
FIG. 38 is a block diagram of an example processor platform capable of executing the instructions to implement the flowcharts fFIGS. 23 and 36 to implement the apparatus ofFIGS. 1 and 24 . - Certain examples are shown in the above-identified figures and described in detail below. In describing these examples, like or identical reference numbers are used to identify the same or similar elements. The figures are not necessarily to scale and certain features and certain views of the figures may be shown exaggerated in scale or in schematic for clarity and/or conciseness. Additionally, several examples have been described throughout this specification. Any features from any example may be included with, a replacement for, or otherwise combined with other features from other examples.
- The examples disclosed herein relate to example forms (e.g., mailers, sponsorship tags, ornaments, luggage tags, card and key tags and/or removable inserts) produced in an in-line process. In some examples, the forms are produced using a multi-ply paper card surrounded by and/or positioned between polystyrene (poly). One or more of the plies may be static and/or variably embossed and/or imaged (e.g., static and/or variably imaged) to enable a single print run to produce custom and/or different forms for different customers, recipients, etc. In some examples, the forms may be embossed and/or imaged with a number, a recipient's name, a company's name, advertising material and/or any other indicia. The embossed area may be ink tipped to visually differentiate the embossed area from the rest of the form.
- In some examples, the forms are produced by mating paper web(s) and polystyrene (poly) web(s) and cutting, creasing, scoring, folding and/or gluing one or more of the webs before and/or after the webs are mated. In some examples, the paper web is wider than the poly web. The paper web may be variably imaged on a first side and adhesive and/or paste may be applied to approximately one half of the first side (e.g., over the imaging) to enable the poly web to be adhered to the first side of the paper web and for the poly web to cover half of the first side of the paper web (e.g., over the imaging).
- In some examples, the mated webs travel through an embosser (e.g., opposing rollers) where a portion of the mated webs is embossed with, for example, a number (e.g., static fictitious credit card numbers, a variable number), a company's name or any other indicia. In some examples, the embossed portion corresponds to the front of the form and/or to one half of the poly web. The embossed area may be ink tipped (e.g., U.V. ink tipped) and cured.
- In some examples, adhesive and/or paste is applied to approximately one half of a second side of the paper web and the webs are folded in half to couple the second side of the paper substrate together. In some examples, adhesive and/or paste is then applied to approximately one half of the first side of the paper web (e.g., the half of the first side without the poly) and the webs are folded in half such that the first side of the paper web is coupled together and the poly web forms the front and back surfaces of the form. In some examples, the folded webs are die cut to round the corners of the form and/or perforations are added to enable the form to be easily removed from a waste matrix. The completed forms may then be glued to a carrier and/or another web and/or packaged for shipment. The example form may be a card, a sponsorship and/or luggage tag, a card and key tag, an ornament, etc.
- While the above-example describes the first substrate as being a paper web and the second substrate as being a poly web, the substrates may be any other suitable material such as, for example, a plastic and/or Polyethylene terephthalate (PET) web and a poly web. In such examples, the plastic web may include a plurality of tags (e.g., RFID tags) coupled thereto. Thus, the cards and/or forms produced may include an internal tag and/or intelligent functionality.
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FIG. 1 represents anexample apparatus 100 that can be used to implement the processes disclosed herein to produce the example cards, tags, forms, etc. In some examples, theapparatus 100 may be an in-line process and includes first, second andthird substrate movers gluers maters ink tipper 122; acurer 124;folders cutter 130. While the stations and/or portions 102-130 of theapparatus 100 are depicted in a particular order, the stations and/or portions 102-130 may be arranged differently. While theapparatus 100 is depicted as having thegluers folders - In some examples, during operation, the first substrate mover 102 feeds one or more pieces of first substrate and/or a web of
first substrate 132 into theapparatus 100. In some examples, theimager 106 images a first side of thefirst substrate 132. The images may include personal information (e.g., a name, an address, etc.), brand-related images and/or text, advertisement related images and/or text, instructional images and/or text, etc. However, in other examples, theapparatus 100 does not include theimager 106 and, thus thefirst substrate 132 is imaged at a different location (e.g., thefirst substrate 132 is pre-imaged) and/or thefirst substrate 132 is not imaged. - The
first gluer 108 may apply glue to a first portion of the first surface and themater 116 may mate the first surface portion with asecond substrate 134 such that the first andsecond substrates second substrate 134 is fed to themater 116 by thesecond substrate mover 103. In some examples, thefirst substrate 132 is paper, Polyethylene terephthalate (PET) and/or plastic and thesecond substrate 134 is poly and/or any other type of film. Theembosser 120 receives and embosses the mated webs of thesubstrates embosser 120 is a static embosser that embosses a name, a number, etc. on the mated webs of thesubstrates embosser 120 is a variable embosser. The U.V.ink tipper 122 may apply ink to the embossed area and thecurer 124 may cure the ink. In some examples, ink tipping the embossed area enables the embossed area to be visually differentiated from the surrounding substrate. - The
second gluer 110 may apply glue to a second surface of thefirst substrate 132 and thefirst folder 126 may fold thefirst substrate 132 in half along a first fold such that the second surface of thefirst substrate 132 is coupled together and thesecond substrate 134 is on a first side of the fold (e.g., thefirst folder 126 folds thefirst substrate 132 in half along the first fold where the first fold is adjacent an edge of the second substrate 134). Thesecond gluer 112 may then apply glue to a second portion of the first surface of thefirst substrate 132 and thesecond folder 128 may fold thesubstrates first substrate 132 is coupled together and thesecond substrate 134 forms outward facing surfaces of the card, tag and/or form being produced. In some examples, the second fold line may be substantially parallel to the first fold line. As used herein, the phrase substantially parallel means between about ten degrees of parallel and/or accounts for manufacturing tolerances. In some examples, thesecond substrate 134 forms an exterior surface (e.g., a back surface, a front surface) and/or layers of the produced card, tag and/or form and thefirst substrate 132 forms interior surfaces and/or layers of the produced card, tag and/or form. - The
cutter 130 may round the corners of the card, tag and/or form being produced, add one or more lines of weakness to the card, tag and/or form and/or cut and/or remove a waste matrix surrounding the card, tag and/or form being produced. In some examples, thegluer 114 may apply glue to a back surface of the completed card, tag and/or form (e.g., the smooth back surface opposite the embossed front surface) and themater 118 may mate the completed card, tag and/or form with athird substrate 136. Thethird substrate 136 may be a carrier web used to produce a mailer, a mailer insert, a form, etc. -
FIGS. 2-12 depict different views during a fabrication process to produce anexample card 1200 in accordance with the teachings of this disclosure.FIG. 2 depictsglue 202 applied to afirst portion 203 of afirst surface 204 of thefirst substrate 132 and thesecond substrate 134 about to be coupled to thefirst portion 203.FIG. 3 depicts the first andsecond substrate second substrates FIG. 4 shows theembosser 120 embossing part of thefirst portion 203 such that anembossed area 402 protrudes from thesecond substrate 134.FIG. 5 shows the U.V.ink tipper 122 applying ink to the embossedarea 402 to enable the embossedarea 402 to be visually differentiated from thesecond substrate 134 surrounding the embossedarea 402. -
FIG. 6 showsglue 602 applied to asecond surface 604 of thefirst substrate 132 and thefirst substrate 132 being folded about afirst fold 606 such that thefirst portion 203 of thefirst substrate 132 is coupled to asecond portion 608 of thefirst substrate 132 and anindentation 610 formed by the embossedarea 402 is covered by thesecond portion 608.FIG. 7 shows the first andsecond portions area 402. -
FIG. 8 showsglue 802 applied to thesecond portion 608 of thefirst surface 204 and the first andsecond substrates second fold 804 such that a first half 806 of thesecond portion 608 is coupled to asecond half 808 of thesecond portion 608.FIG. 9 shows a first and/ornon-embossed side 902 of aform 904 andFIG. 10 shows a second and/or embossedside 1002 of theform 904 where theform 904 is to be die-cut to form thecard 1200.FIG. 11 shows awaste matrix 1102 that surrounds thecard 1200 prior to removal andFIG. 12 shows thecard 1200 produced. As shown inFIG. 12 , thecard 1200 has first, second, third and fourthinternal plies first substrate 132 and first and secondexternal plies second substrate 134. In other examples, thecard 1200 may have any number of internal plies and/or any number of external plies. -
FIGS. 13 and 14 depict an example card and/orform 1300 in accordance with the teachings of this disclosure. In the illustrated example, thecard 1300 includes first, second, third and fourth paper plies 1302, 1304, 1306, 1308 positioned between first and second poly plies 1310, 1312. While theexample card 1300 is described as having four paper plies and two poly plies, the example forms disclosed herein may have any other number of paper plies (e.g., 1, 2, 3, 5, etc.) and/or poly plies (e.g., 1, 3, 4, etc.). - As discussed above, the
card 1300 is formed by mating the paper web and/or thefirst substrate 132 and the poly web and/or thesecond substrate 134 and folding the mated webs of thesubstrates second substrate 134 forms the poly plies 1310, 1312 and the paper web and/or thefirst substrate 132 forms the paper plies 1302, 1304, 1306, 1308. During the first folding process performed by thefirst folder 126, thefirst paper ply 1302 is coupled to thesecond paper ply 1304 and thethird paper ply 1306 is coupled to thefourth paper ply 1308. During the second folding process performed by thesecond folder 128, thesecond paper ply 1304 is coupled to thethird paper ply 1306. - As shown in
FIGS. 13 and 14 , afirst surface 1314 of thefirst paper ply 1302 includesimaging 1316 and the first paper and poly plies 1302, 1310 includes an embossedarea 1318. Because the webs and/or thesubstrates second poly ply 1312. In examples in which thecards 1300 are packaged by stacking one card on top of the other, thesecond poly ply 1312 not having static embossing indentations prevents thecards 1300 from sticking to one another and/or being coupled together. In some examples, not having indentations on the back surface of thecard 1300 opposite the embossed front surface enables the back surface to relatively easily receive indicia, be printed on and/or be viewed after embossing the front surface. -
FIGS. 15 and 16 depict anexample card 1500 in accordance with the teachings of this disclosure. In the illustrated example, thecard 1500 includes first, second, third and fourth paper plies 1502, 1504, 1506, 1508 positioned between first and second poly plies 1510, 1512. In some examples,corners card 1500 are formed by die cutting andperforations card 1500 to enable anexample sponsorship tag 1514 to be removed from a surroundingwaste matrix 1516 and/or to define an aperture. As shown inFIG. 15 , afirst surface 1530 of thefirst paper ply 1502 includesimaging 1532 and the first paper and poly plies 1502, 1510 include an embossedarea 1534. -
FIGS. 17 and 18 depict an example ornament and/orform 1700 in accordance with the teachings of this disclosure. In the illustrated example, theornament 1700 includes first, second, third and fourth paper plies 1702, 1704, 1706, 1708 positioned between first and second poly plies 1710, 1712. In some examples, to enable theexample ornament 1700 to be hung, aperforation 1714 is added to theornament 1700 to define acutout 1715. In some examples, aperimeter surface 1716 is formed by die cutting. As shown inFIG. 17 , afirst surface 1718 of thefirst paper ply 1702 includesimaging 1720 and the first paper and poly plies 1702, 1710 include an embossedarea 1722. In this example, theimaging 1720 identifies a family name and the embossedarea 1722 identifies a name of a company. -
FIGS. 19 and 20 depict an example luggage tag and/orform 1900 in accordance with the teachings of this disclosure. In the illustrated example, thetag 1900 includes first, second, third and fourth paper plies 1902, 1904, 1906, 1908 positioned between first and second poly plies 1910, 1912. In some examples, to enable theexample tag 1900 to be coupled to a piece of luggage, aperforation 1913 defines acutout 1914. - As shown in
FIG. 19 , afirst surface 1918 of thefirst paper ply 1902 includesimaging 1920 and the first paper and poly plies 1902, 1910 include an embossedarea 1922. In this example, theimaging 1920 is used to include personal information on the tag (e.g., a person's name, etc.) and the embossedarea 1922 identifies a name of a company. -
FIGS. 21 and 22 depict an example card and/orform 2100 in accordance with the teachings of this disclosure. In the illustrated example, theform 2100 includes first, second, third and fourth paper plies 2102, 2104, 2106, 2108 positioned between first and second poly plies 2110, 2112. In this example, theform 2100 includes acard 2114 and atag 2116. To enable thecard 2114 and thetag 2116 to be removed from a surroundingwaste matrix 2118, theform 2100 definesperforations - As shown in
FIG. 21 , afirst surface 2124 of thefirst paper ply 2102 includesimaging area imaging area -
FIG. 23 depicts an example flow diagram representative of a process that may be implemented using, for example, computer readable instructions that may be carried out in conjunction with paper processing equipment such as die cutters, web presses, etc. to produce the forms disclosed herein and/or any other of the examples disclosed herein. The example processes ofFIG. 23 may be performed using a processor, a controller and/or any other suitable processing device. For example, the example processes ofFIG. 23 may be implemented using coded instructions (e.g., computer readable instructions) stored on a tangible computer readable medium such as a flash memory, a read-only memory (ROM), and/or a random-access memory (RAM). As used herein, the term tangible computer readable medium is expressly defined to include any type of computer readable storage and to exclude propagating signals. Additionally or alternatively, the example process ofFIG. 23 may be implemented using coded instructions (e.g., computer readable instructions) stored on a non-transitory computer readable medium such as a flash memory, a read-only memory (ROM), a random-access memory (RAM), a cache, or any other storage media in which information is stored for any duration (e.g., for extended time periods, permanently, brief instances, for temporarily buffering, and/or for caching of the information). As used herein, the term non-transitory computer readable medium is expressly defined to include any type of computer readable medium and to exclude propagating signals. - Alternatively, some or all of the example processes of
FIG. 23 may be implemented using any combination(s) of application specific integrated circuit(s) (ASIC(s)), programmable logic device(s) (PLD(s)), field programmable logic device(s) (FPLD(s)), discrete logic, hardware, firmware, etc. Also, some or all of the example processes ofFIG. 23 may be implemented manually or as any combination(s) of any of the foregoing techniques, for example, any combination of firmware, software, discrete logic and/or hardware. Further, although the example processes ofFIG. 23 are described with reference to the flow diagram ofFIG. 23 , other methods of implementing the processes ofFIG. 23 may be employed. For example, the order of execution of the blocks may be changed, and/or some of the blocks described may be changed, eliminated, sub-divided, or combined. Additionally, any or all of the example processes ofFIG. 23 may be performed sequentially and/or in parallel by, for example, separate processing threads, processors, devices, discrete logic, circuits, etc. -
FIG. 23 represents an example method of producing the examples disclosed herein. While the processes of the method are depicted as being performed sequentially, one or more of the processes may be performed in parallel, for example. The process may begin by unwinding a substrate and/or paper substrate from a roll and/or moving one or more pieces of the paper substrate into a press and toward an imager that images the paper substrate (blocks 2302, 2304). In some examples, the imager images a portion of a first side of the paper substrate. The images may include brand-related images and/or text, instructional images and/or text, personal information, a barcode, etc. In some examples, glue and/or paste may be applied to the imaged portion and/the first side of the paper substrate and a poly web and/or substrate may be mated therewith (blocks 2306, 2308). In some such examples, the poly substrate covers approximately one half of the paper substrate (e.g., over the glued portion) and the glue is substantially clear when dried. - In some examples, the mated substrates may pass through an embosser that embosses the mated substrates. (block 2310). The embosser may be a static embosser and/or a variable embosser that embosses a number(s), a name(s), etc. on a portion of the substrates. In some examples, the embossed area is ink tipped and cured. (
blocks 2312, 2314). The ink tipping enables the embossed area to stand out and/or be more visible. - In some examples, paste and/or glue is applied to a second side of the paper substrate (e.g., opposite the side where the poly substrate is coupled) and then the paper substrate is folded in half such that the second side of the paper substrate is coupled together. (
blocks 2316, 2318). In some examples, paste and/or glue is then applied to the first side of the paper substrate (e.g., the half of the first side not covered by the poly substrate) and then the paper and poly substrates are folded in half such that the first side of the paper substrate is coupled together and the poly substrate forms the front and the back of the form. (blocks 2320, 2322). - In some examples, to complete the process of producing the example form, a die cutter may cut the form from a surrounding matrix and/or produce one or more lines of weakness through the form. (block 2324). In some examples, the lines of weakness are perforations that define a cutout. The forms produced may then be mated with another web and/or carrier web using paste and/or glue (
blocks 2326, 2328). The carrier web may be used to form a mailer, a mailer insert, a form, etc. -
FIG. 24 represents anexample apparatus 2400 that can be used to implement the processes disclosed herein to produce the example cards, tags, forms, etc. In some examples, theapparatus 2400 may be an in-line process and includes first, second andthird substrate movers embosser 2410;folders maters fuser 2420;cutters gluer 2424. While the stations and/or portions 2402-2424 of theapparatus 2400 are depicted in a particular order, the stations and/or portions 2402-2424 may be arranged differently and/or one or more of the stations and/or portions 2402-2424 may be removed and/or combined. - In some examples, during operation, the
first substrate mover 2402 feeds one or more pieces of first substrate and/or a web offirst substrate 2426 into theapparatus 2400. In some examples, thefirst substrate 2426 is PET and/or any other suitable type of plastic that may or may not have intelligent inlays coupled thereto. In examples in which thefirst substrate 2426 includes inlays (e.g., RFID tags, NFC tags) coupled thereto, thecutter 2421 may die cut the first substrate to form a plurality of holes and/or apertures into which the chips of the inlays are to be positioned after thefirst substrate 2426 is folded during the production process to enable the form and/or card produced to be substantially flat, have a substantially consistent thickness and/or not have a bulge formed by the inlay. In some examples, theimager 2408 images a first side of thefirst substrate 2426. The images may include personal information (e.g., a name, an address, etc.), brand-related images and/or text, advertisement related images and/or text, instructional images and/or text, etc. However, in other examples, theapparatus 2400 does not include theimager 2408 and, thus thefirst substrate 2426 is imaged at a different location (e.g., thefirst substrate 2426 is pre-imaged) and/or thefirst substrate 2426 is not imaged. - The
embosser 2410 receives and embosses thefirst substrate 2426. In some examples, theembosser 2410 is a static embosser that embosses a name, a number, etc. on thefirst substrate 2426. In other examples, theembosser 2410 is a variable embosser that embosses text (e.g., a person's name) and/or a variable number (e.g., a credit card number) on thefirst substrate 2426. - The
first folder 2412 may fold thefirst substrate 2426 in half along a first fold such that a second surface of thefirst substrate 132 is immediately adjacent each other. Thesecond folder 2414 may fold thefirst substrate 2426 in half along a second fold line such that the first surface of thefirst substrate 2426 is immediately adjacent each other. Themater 2416 may mate a second substrate (e.g., poly) 2428 with the opposing exterior surfaces of the foldedfirst substrate 2426 and thefuser 2420 may fuse thesubstrates fuser 2420 heat fuses and/or plastic welds thesubstrates - The
cutter 2422 may round the corners of the card, tag and/or form being produced, add one or more lines of weakness to the card, tag and/or form and/or cut and/or remove a waste matrix surrounding the card, tag and/or form being produced. In some examples, thegluer 2424 may apply glue to a back surface of the completed card, tag and/or form (e.g., the smooth back surface opposite the embossed front surface) and themater 2418 may mate the completed card, tag and/or form with athird substrate 2430. Thethird substrate 2430 may be a carrier web used to produce a mailer, a mailer insert, a form, etc. -
FIGS. 25-35 depict different views during a fabrication process to produce anexample card 3500 in accordance with the teachings of this disclosure.FIG. 25 depicts thefirst substrate 2426 andFIG. 26 shows theembosser 120 an embossedarea 2602 part of afirst portion 2604 of thefirst substrate 2604 such that the embossedarea 2602 protrudes from afirst side 2606 of thefirst substrate 2426. -
FIG. 27 shows thefirst substrate 2426 being folded about afirst fold 2702 such that thefirst portion 2604 of thefirst substrate 2426 is adjacent to asecond portion 2704 of thefirst substrate 2426 and anindentation 2706 formed by the embossedarea 2602 is covered by thesecond portion 2704.FIG. 28 shows the first andsecond portions area 2602. -
FIG. 29 shows thefirst substrate 2426 being folded about asecond fold 2902 such that afirst half 2904 of thesecond portion 2704 is adjacent asecond half 2906 of thesecond portion 2704.FIG. 30 shows a first and/ornon-embossed side 3002 of aform 3004 andFIG. 31 shows a second and/or embossedside 3102 of theform 3004 where theform 3004 is to be die-cut to form thecard 3500.FIG. 32 shows afirst portion 3202 of thesecond substrate 2428 coupled to the first and/ornon-embossed side 3002 of thefirst substrate 2426 andFIG. 33 shows asecond portion 3302 of thesecond substrate 2428 coupled to the second and/or embossedside 3102 of thefirst substrate 2426. -
FIG. 34 shows awaste matrix 3400 that surrounds thecard 3500 prior to removal andFIG. 35 shows thecard 3500 produced. As shown inFIG. 35 , thecard 3500 has first, second, third and fourthinternal plies first substrate 2426 and first and secondexternal plies second substrate 2428. In other examples, thecard 3500 may have any number of internal plies and/or any number of external plies. For example, in some examples, thecard 3500 does not include the external 3510, 3512. In such examples, thecard 3500 is made of thefirst substrate 2426. -
FIG. 36 depicts an example flow diagram representative of a process that may be implemented using, for example, computer readable instructions that may be carried out in conjunction with paper processing equipment such as die cutters, web presses, etc. to produce the forms disclosed herein and/or any other of the examples disclosed herein. The example processes ofFIG. 36 may be performed using a processor, a controller and/or any other suitable processing device. For example, the example processes ofFIG. 36 may be implemented using coded instructions (e.g., computer readable instructions) stored on a tangible computer readable medium such as a flash memory, a read-only memory (ROM), and/or a random-access memory (RAM). As used herein, the term tangible computer readable medium is expressly defined to include any type of computer readable storage and to exclude propagating signals. Additionally or alternatively, the example process ofFIG. 36 may be implemented using coded instructions (e.g., computer readable instructions) stored on a non-transitory computer readable medium such as a flash memory, a read-only memory (ROM), a random-access memory (RAM), a cache, or any other storage media in which information is stored for any duration (e.g., for extended time periods, permanently, brief instances, for temporarily buffering, and/or for caching of the information). As used herein, the term non-transitory computer readable medium is expressly defined to include any type of computer readable medium and to exclude propagating signals. - Alternatively, some or all of the example processes of
FIG. 36 may be implemented using any combination(s) of application specific integrated circuit(s) (ASIC(s)), programmable logic device(s) (PLD(s)), field programmable logic device(s) (FPLD(s)), discrete logic, hardware, firmware, etc. Also, some or all of the example processes ofFIG. 36 may be implemented manually or as any combination(s) of any of the foregoing techniques, for example, any combination of firmware, software, discrete logic and/or hardware. Further, although the example processes ofFIG. 36 are described with reference to the flow diagram ofFIG. 36 , other methods of implementing the processes ofFIG. 36 may be employed. For example, the order of execution of the blocks may be changed, and/or some of the blocks described may be changed, eliminated, sub-divided, or combined. Additionally, any or all of the example processes ofFIG. 36 may be performed sequentially and/or in parallel by, for example, separate processing threads, processors, devices, discrete logic, circuits, etc. -
FIG. 36 represents an example method of producing the examples disclosed herein. While the processes of the method are depicted as being performed sequentially, one or more of the processes may be performed in parallel, for example. The process may begin by unwinding a first substrate and/or plastic/PET substrate from a roll and/or moving one or more pieces of the plastic and/or PET substrate into a press and toward a cutter that forms chip receiving apertures in the first substrate and an imager that images the plastic substrate (blocks 3602, 3604). In some examples, the imager images a portion of a first side of the first substrate. The images may include brand-related images and/or text, instructional images and/or text, personal information, a barcode, etc. - In some examples, the first substrate passes through an embosser that embosses the first substrate. (block 3606). The embosser may be a static embosser and/or a variable embosser that embosses a number(s), a name(s), etc. on a portion of the substrate.
- In some examples, the first substrate is folded in half such that the second side of the first substrate is immediately adjacent one another. (block 3608). In some examples, the first substrate is folded in half again such that the first side of the first substrate is immediately adjacent one another. (block 3610).
- In some examples, the first substrate is mated with the second substrate and/or the poly web and the first and substrates are coupled together. (
blocks 3612, 3614). In some examples, the second substrate includes a bar code, a magnetic strip, etc. to enable, for example, the card produced to be used as a credit card, an access card, an identification card and, more generally, to include and/or convey information. In some examples, the substrates are coupled together by fusing the layers of the first substrate together and/or fusing the first and second substrates together. In some examples, to complete the process of producing the form, a die cutter may cut the form from a surrounding matrix and/or produce one or more lines of weakness through the form. (block 3616). In some examples, the lines of weakness are perforations that define a cutout. The forms produced may then be mated with another web and/or carrier web using paste and/or glue (blocks 3618, 3620). The carrier web may be used to form a mailer, a mailer insert, a form, etc. -
FIG. 37 depicts anexample substrate 3700 that can be used to produce theexample card 3500. As shown, thesubstrate 3700 includes thefold lines apertures 3706. In practice, once thesubstrate 3700 is folded about thefold line 2702,chips 3708 of theinlays 3704 are received within theapertures 3706 to substantially ensure thecard 3500 produced has a substantially consistent thickness and/or to substantially prevent thechips 3708 from being damaged (e.g., thechips 3708 are substantially housed within therespective aperture 3706, thereby protecting the chips 3708). In examples in which thechips 3708 are relatively thick and/or thicker than thesubstrate 3700, more than oneaperture 3706 may be defied such that when thesubstrate 3700 is folded about thefold line 2702, therespective chips 3708 are received in two ormore apertures 3706. -
FIG. 38 is a block diagram of anexample processor platform 3800 capable of executing the instructions ofFIGS. 23, 36 to implement theapparatus 100 ofFIGS. 1, 24 . Theprocessor platform 3800 can be, for example, a server or any other type of computing device. - The
processor platform 3800 of the illustrated example includes aprocessor 3812. Theprocessor 3812 of the illustrated example is hardware. For example, theprocessor 3812 can be implemented by one or more integrated circuits, logic circuits, microprocessors or controllers from any desired family or manufacturer. - The
processor 3812 of the illustrated example includes a local memory 3813 (e.g., a cache). Theprocessor 3812 of the illustrated example is in communication with a main memory including avolatile memory 3814 and anon-volatile memory 3816 via abus 3818. Thevolatile memory 3814 may be implemented by Synchronous Dynamic Random Access Memory (SDRAM), Dynamic Random Access Memory (DRAM), RAMBUS Dynamic Random Access Memory (RDRAM) and/or any other type of random access memory device. Thenon-volatile memory 3816 may be implemented by flash memory and/or any other desired type of memory device. Access to themain memory - The
processor platform 3800 of the illustrated example also includes aninterface circuit 3820. Theinterface circuit 3820 may be implemented by any type of interface standard, such as an Ethernet interface, a universal serial bus (USB), and/or a PCI express interface. - In the illustrated example, one or
more input devices 3822 are connected to theinterface circuit 3820. The input device(s) 3822 permit a user to enter data and commands into theprocessor 3812. One ormore output devices 3824 are also connected to theinterface circuit 3820 of the illustrated example. Theinterface circuit 3820 of the illustrated example, thus, typically includes a graphics driver card. - The
interface circuit 3820 of the illustrated example also includes a communication device such as a transmitter, a receiver, a transceiver, a modem and/or network interface card to facilitate exchange of data with external machines (e.g., computing devices of any kind) via a network 3826 (e.g., an Ethernet connection, a digital subscriber line (DSL), a telephone line, coaxial cable, a cellular telephone system, etc.). - The
processor platform 3800 of the illustrated example also includes one or moremass storage devices 3828 for storing software and/or data. Examples of suchmass storage devices 3828 include floppy disk drives, hard drive disks, compact disk drives, Blu-ray disk drives, RAID systems, and digital versatile disk (DVD) drives. - The coded
instructions 3832 ofFIGS. 23, 36 may be stored in themass storage device 3828, in thevolatile memory 3814, in thenon-volatile memory 3816, and/or on a removable tangible computer readable storage medium such as a CD or DVD. - From the foregoing, it will appreciated that the above disclosed methods, apparatus and articles of manufacture relate to forms and/or forms produced in an in-line process. In some examples, the example forms are produced using a roll of paper that is folded and/or glued one or more times. In other examples, the example forms are produced using a roll of plastic (e.g., PET, plastic film) that is folded and/or fused one or more time times. In example in which the forms are produced using plastic, an inlay and/or tag (e.g., and RFID inlay, an NFC inlay) may be internally positioned within the card produced and/or positioned on and/or carried by the plastic web. Making intelligent cards (e.g., cards including RFID and/or NFC inlays) using an in-line process may significantly reduce the cost of producing such cards.
- In examples in which the example plastic cards are produced without an embedded tag, the example cards may be produced by using a roll of film material that is folded and/or fused. In some such examples, the film is a white material and/or imaged with digital, flexographic, offset and/or other static and/or variable printing technologies. In some examples, an exterior layer of film (e.g., poly film) may be coupled and/or fused to the folded PET layers to substantially protect the imaged data, for example.
- In examples in which the plastic cards are produced with an embedded tag and/or intelligent functionality (e.g., RFID tag, NFC tag and/or another functional component(s)), the example cards are produced with a roll of film having inlays and/or tags positioned thereon where the film is folded and/or fused. In some examples, the inlays and/or tags are positioned on the PET film by printing and/or imaging an antenna on the film and then positioning a chip adjacent the antenna. In some examples, to substantially prevent deformation and/or damage of the card including the intelligent functionality (e.g., RFID tag, NFC tag), the PET film may be die cut to form an aperture into the chip of the tag is received after the PET film is folded.
- An example method includes moving a first substrate in a direction, the first substrate including a first side opposite a second side; applying adhesive to a first portion of the first side, the first portion being spaced apart from a second portion of the first side; mating a second substrate with the first portion; applying adhesive to a third portion of the second side, the third portion being spaced apart from a fourth portion of the second side; folding the first substrate about a first fold line to couple the third portion to the fourth portion; applying adhesive to a fifth portion of the second portion, the fifth portion being spaced apart from a sixth portion of the second portion; and folding the first substrate and the second substrate about a second fold line to couple the fifth portion and the sixth portion and to position the first substrate between the second substrate.
- In some examples, the method includes prior to applying adhesive to the first portion, imaging the first portion. In some examples, the method includes prior to folding the first substrate about the first fold line, embossing the first substrate and the second substrate. In some examples, the second substrate includes an eighth portion and a ninth portion, the first substrate being positioned between the eighth portion and the ninth portion, the eight portion including the embossing and the ninth portion being non-embossed. In some examples, the method includes ink tipping the embossing.
- In some examples, the folding the first substrate and the second substrate about the second fold line is to produce a multi-layer form. In some example, the multi-layer form includes at least one of a card, a tag, an ornament, or a card and key tag. In some examples, the method includes mating the multi-layer form with a third substrate. In some examples, the third substrate includes a carrier web. In some examples, the method includes forming one or more lines of weakness in the multi-layer form. In some examples, the one or more lines of weakness define a removable portion. In some examples, the method includes die-cutting the first and second substrates to separate the multi-layer form from a surrounding waste matrix. In some examples, the first substrate includes paper and the second substrate includes polystyrene. In some examples, the method includes an in-line process.
- An example apparatus includes a first substrate first layer including a first side and a second side; a second substrate first layer including a third side and a fourth side, the second side coupled to the third side, the first substrate first layer and the second substrate first layer being embossed; a second substrate second layer including a fifth side and a sixth side, the fourth side coupled to the fifth side; a first substrate second layer including a seventh side and an eighth side, the seventh side coupled to the sixth side, the first substrate second layer and the second substrate second layer not being embossed.
- In some examples, the third side includes imaging. In some examples, the apparatus includes a line of weakness through the first and second substrate first layers and the first and second substrate second layers to define a card surrounded by a waste matrix. In some examples, the apparatus includes a line of weakness through the first and second substrate first layers and the first and second substrate second layers to define a removable portion. In some examples, the embossing of the first substrate first layer is ink tipped. In some examples, the first substrate includes plastic. In some examples, the first substrate includes an inlay.
- An example method includes moving a first substrate in a direction, the first substrate including a first side opposite a second side, the first side having a first portion and a second portion, the second portion having a first sub-portion and a second sub-portion, the second side having a third portion and a fourth portion; applying adhesive to the first portion of the first side; mating a second substrate with the first portion of the first side; applying adhesive to the third portion of the second side; folding the first substrate about a first fold line to couple the third portion to the fourth portion; applying adhesive to the first sub-portion of the second portion; and folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of the second sub-portion and to position the first substrate between the second substrate.
- In some examples, the method includes, prior to applying adhesive to the first portion, imaging the first portion. In some examples, the method includes prior to folding the first substrate about the first fold line, embossing the first substrate and the second substrate to enable the first substrate and the second substrate to include indicia. In some examples, the second substrate includes a fifth portion and a sixth portion, the first substrate being positioned between the fifth portion and the sixth portion, the fifth portion including the embossing and the sixth portion being non-embossed. In some examples, the method includes ink tipping the embossing. In some examples, the folding the first substrate and the second substrate about the second fold line is to produce a multi-layer form. In some examples, the multi-layer form includes at least one of a card, a tag, an ornament, or a card and key tag. In some examples, the method includes mating the multi-layer form with a third substrate, prior to folding the first substrate about the first fold line, the multi-layer form not being mated to the third substrate. In some examples, the third substrate includes a carrier web.
- In some examples, the method includes forming one or more lines of weakness in the multi-layer form. In some examples, the one or more lines of weakness define a removable portion. In some examples, the method includes die-cutting the first and second substrates to separate the multi-layer form from a surrounding waste matrix, after the multi-layer form is separated from the surrounding waste matrix, a perimeter of the multi-layer form is free of any fold lines. In some examples, the first substrate includes paper and the second substrate includes polystyrene. In some examples, the method includes an in-line process. In some examples, the method includes forming a line of weakness through the first and second substrates to define a card surrounded by a waste matrix. In some examples, the first substrate includes plastic. In some examples, the method includes inlaying the first substrate.
- Although certain example methods, apparatus and articles of manufacture have been described herein, the scope of coverage of this patent is not limited thereto. On the contrary, this patent covers all methods, apparatus and articles of manufacture fairly falling within the scope of the claims of this patent.
Claims (20)
1. An apparatus, comprising:
means for moving a first substrate in a direction, the first substrate comprising a first side opposite a second side, the first side having a first portion and a second portion, the second portion having a first sub-portion and a second sub-portion, the second side having a third portion and a fourth portion;
means for applying adhesive to the first portion of the first side;
means for mating a second substrate with the first portion of the first side;
means for applying adhesive to the third portion of the second side;
means for folding the first substrate about a first fold line to couple the third portion to the fourth portion;
means for applying adhesive to the first sub-portion of the second portion; and
means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of the second sub-portion and to position the first substrate between the second substrate.
2. The apparatus of claim 1 , further comprising means for positioning an inlay on the first substrate or the second substrate.
3. The apparatus of claim 1 , further comprising means for embossing the first substrate and the second substrate to enable the first substrate and the second substrate to include indicia prior to folding the first substrate about the first fold line
4. An apparatus, comprising:
a first substrate first ply comprising a first surface and a second surface;
a second substrate first ply comprising a first surface and a second surface, the second surface of the first substrate first ply coupled to the first surface of the second substrate first ply, the first substrate first ply and the second substrate first ply being embossed;
a second substrate second ply comprising a first surface and a second surface, the second substrate first ply is disposed between the second substrate second ply and the first substrate first ply;
a first substrate second ply comprising a first surface and a second surface, the first surface of the first substrate second ply coupled to the second surface of the second substrate second ply, the first substrate second ply and the second substrate second ply not being embossed.
5. The apparatus of claim 4 , further comprising a line of weakness through the first substrate first ply, the second substrate first ply, the first substrate second ply, and the second substrate second ply to define a removable portion.
6. The apparatus of claim 4 , further comprising a second substrate third ply comprising a first surface and a second surface, the second surface of the second substrate first ply coupled to the first surface of the second substrate third ply.
7. The apparatus of claim 6 , wherein the second substrate third ply is not embossed.
8. The apparatus of claim 7 , further comprising a second substrate fourth ply comprising a first surface and a second surface, the second surface of the second substrate third ply coupled to the first surface of the second substrate fourth ply.
9. The apparatus of claim 8 , wherein the second substrate fourth ply is not embossed.
10. The apparatus of claim 8 , wherein the second surface of the second substrate fourth ply is coupled to the first surface of the second substrate second ply.
11. The apparatus of claim 10 , further comprising a line of weakness through the first substrate first ply, the first substrate second ply, the second substrate first ply, the second substrate second ply, the second substrate third ply, and the second substrate fourth ply to define a removable portion.
12. The apparatus of claim 11 , wherein the removable portion comprises at least one of a card, a tag, an ornament, or a card and key tag.
13. The apparatus of claim 11 , further comprising a perforation through the first substrate first ply, the first substrate second ply, the second substrate first ply, the second substrate second ply, the second substrate third ply, and the second substrate fourth ply to define a cutout.
14. An apparatus, comprising:
a first substrate first layer comprising a first side and a second side;
a second substrate first layer comprising a third side and a fourth side, the second side coupled to the third side, the first substrate first layer and the second substrate first layer being embossed;
a second substrate second layer comprising a fifth side and a sixth side, the fourth side coupled to the fifth side;
a first substrate second layer comprising a seventh side and an eighth side, the seventh side coupled to the sixth side, the first substrate second layer and the second substrate second layer not being embossed.
15. The apparatus of claim 14 , wherein the third side comprises imaging.
16. The apparatus of claim 14 , further comprising a line of weakness through the first and second substrate first layers and the first and second substrate second layers to define a card surrounded by a waste matrix.
17. The apparatus of claim 14 , further comprising a line of weakness through the first and second substrate first layers and the first and second substrate second layers to define a removable portion.
18. The apparatus of claim 14 , wherein the embossing of the first substrate first layer is ink tipped.
19. The apparatus of claim 14 , wherein the first substrate comprises plastic.
20. The apparatus of claim 14 , wherein the first substrate comprises an inlay.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/333,165 US20170050410A1 (en) | 2013-09-12 | 2016-10-24 | Multi-layer forms and methods of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/025,570 US9511561B2 (en) | 2013-09-12 | 2013-09-12 | Multi-layer forms and methods of manufacturing the same |
US15/333,165 US20170050410A1 (en) | 2013-09-12 | 2016-10-24 | Multi-layer forms and methods of manufacturing the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US14/025,570 Continuation US9511561B2 (en) | 2013-09-12 | 2013-09-12 | Multi-layer forms and methods of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
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US20170050410A1 true US20170050410A1 (en) | 2017-02-23 |
Family
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Family Applications (2)
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US14/025,570 Active 2034-03-29 US9511561B2 (en) | 2013-09-12 | 2013-09-12 | Multi-layer forms and methods of manufacturing the same |
US15/333,165 Abandoned US20170050410A1 (en) | 2013-09-12 | 2016-10-24 | Multi-layer forms and methods of manufacturing the same |
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US14/025,570 Active 2034-03-29 US9511561B2 (en) | 2013-09-12 | 2013-09-12 | Multi-layer forms and methods of manufacturing the same |
Country Status (3)
Country | Link |
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US (2) | US9511561B2 (en) |
EP (2) | EP2848422B1 (en) |
CA (2) | CA2861365C (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8713459B2 (en) | 2009-05-29 | 2014-04-29 | Jason Philip Yanchar | Graphical planner |
US9827741B2 (en) * | 2014-05-15 | 2017-11-28 | Multi Packaging Solutions, Inc. | Display device |
GB2576179A (en) * | 2018-08-08 | 2020-02-12 | Asahi Seiko Co Ltd | Card with relief structure |
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US6024278A (en) | 1998-12-22 | 2000-02-15 | Crane Productions, Inc. | Mailable advertising materials |
US6656555B1 (en) | 1999-10-13 | 2003-12-02 | Malessa Partners, L.L.C. | Integrated forms and method of making such forms |
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US8720768B2 (en) | 2009-10-14 | 2014-05-13 | R.R. Donnelley & Sons Company | Multi-ply mailer with multiple detachable elements |
IT1399867B1 (en) | 2010-05-11 | 2013-05-09 | Nampak Healthcare Italy S R L Ora Contego Packaging Italy Srl | ILLUSTRATIVE INSERT FOR MEDICINAL PRODUCTS. |
-
2013
- 2013-09-12 US US14/025,570 patent/US9511561B2/en active Active
-
2014
- 2014-08-29 CA CA2861365A patent/CA2861365C/en active Active
- 2014-08-29 CA CA2953759A patent/CA2953759C/en active Active
- 2014-09-11 EP EP14184435.7A patent/EP2848422B1/en active Active
- 2014-09-11 EP EP16197698.0A patent/EP3150398A1/en not_active Withdrawn
-
2016
- 2016-10-24 US US15/333,165 patent/US20170050410A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4469725A (en) * | 1982-09-14 | 1984-09-04 | Fis Organisation Ag | Identification card |
US5283093A (en) * | 1992-01-21 | 1994-02-01 | Panduit Corp. | Self-laminating identification badge assembly and method of use |
US6066594A (en) * | 1998-09-18 | 2000-05-23 | Polaroid Corporation | Identification document |
US20050189066A1 (en) * | 2003-10-27 | 2005-09-01 | Tom Look | Laminated cards and methods of manufacture for secure applications |
US20110008412A1 (en) * | 2003-10-30 | 2011-01-13 | Cipla Limited | Oral Formulations for 5-HT-Receptor Agonists, Uses and Methods of Treatment Employing The Same |
US20060057325A1 (en) * | 2004-07-15 | 2006-03-16 | Hodsdon Jerry G | Printing stock with a label for making a security badge |
US7636193B2 (en) * | 2006-05-02 | 2009-12-22 | 3M Innovative Properties Company | Visible light-transmissive IR filter with distorted portions |
Also Published As
Publication number | Publication date |
---|---|
CA2953759A1 (en) | 2015-03-12 |
EP2848422B1 (en) | 2017-03-22 |
EP2848422A1 (en) | 2015-03-18 |
CA2861365A1 (en) | 2015-03-12 |
US20150072098A1 (en) | 2015-03-12 |
CA2861365C (en) | 2017-10-24 |
CA2953759C (en) | 2018-07-31 |
US9511561B2 (en) | 2016-12-06 |
EP3150398A1 (en) | 2017-04-05 |
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