US20160346835A1 - Thermal sink systems for cooling a mold assembly - Google Patents
Thermal sink systems for cooling a mold assembly Download PDFInfo
- Publication number
- US20160346835A1 US20160346835A1 US14/889,260 US201414889260A US2016346835A1 US 20160346835 A1 US20160346835 A1 US 20160346835A1 US 201414889260 A US201414889260 A US 201414889260A US 2016346835 A1 US2016346835 A1 US 2016346835A1
- Authority
- US
- United States
- Prior art keywords
- quench plate
- thermal
- mold assembly
- quench
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001816 cooling Methods 0.000 title claims description 14
- 238000010791 quenching Methods 0.000 claims abstract description 191
- 239000012530 fluid Substances 0.000 claims abstract description 113
- 238000004891 communication Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 44
- 238000009413 insulation Methods 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 description 19
- 239000011230 binding agent Substances 0.000 description 15
- 238000013461 design Methods 0.000 description 14
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- -1 but not limited to Substances 0.000 description 10
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- 230000008595 infiltration Effects 0.000 description 9
- 238000001764 infiltration Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
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- 229910019016 NaNO3—KNO3 Inorganic materials 0.000 description 3
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- 238000005219 brazing Methods 0.000 description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910020363 KCl—MgCl2 Inorganic materials 0.000 description 2
- 229910002651 NO3 Inorganic materials 0.000 description 2
- 229910020948 NaCl—MgCl2 Inorganic materials 0.000 description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
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- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
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- 239000004576 sand Substances 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
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- 229910052721 tungsten Inorganic materials 0.000 description 2
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- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910020261 KBF4 Inorganic materials 0.000 description 1
- 229910013618 LiCl—KCl Inorganic materials 0.000 description 1
- 229910011555 LiF—RbF Inorganic materials 0.000 description 1
- 229910011553 LiF—ZrF4 Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910003251 Na K Inorganic materials 0.000 description 1
- 229910021258 NaF—RbF Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JZKFIPKXQBZXMW-UHFFFAOYSA-L beryllium difluoride Chemical class F[Be]F JZKFIPKXQBZXMW-UHFFFAOYSA-L 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
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- 238000004320 controlled atmosphere Methods 0.000 description 1
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- 150000004673 fluoride salts Chemical class 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- JNZGLUUWTFPBKG-UHFFFAOYSA-K magnesium;potassium;trichloride Chemical compound [Mg+2].[Cl-].[Cl-].[Cl-].[K+] JNZGLUUWTFPBKG-UHFFFAOYSA-K 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910001495 sodium tetrafluoroborate Inorganic materials 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical class F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D30/00—Cooling castings, not restricted to casting processes covered by a single main group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
- B22D27/045—Directionally solidified castings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D15/00—Handling or treating discharged material; Supports or receiving chambers therefor
- F27D15/02—Cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F25/00—Component parts of trickle coolers
- F28F25/02—Component parts of trickle coolers for distributing, circulating, and accumulating liquid
- F28F25/06—Spray nozzles or spray pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F3/26—Impregnating
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
- C22C1/1068—Making hard metals based on borides, carbides, nitrides, oxides or silicides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
Definitions
- Rotary drill bits are often used to drill wellbores.
- One type of rotary drill bit is a fixed-cutter drill bit that has a bit body comprising matrix and reinforcement materials, i.e., a “matrix drill bit” as referred to herein.
- Matrix drill bits are typically manufactured by placing powder material into a mold and infiltrating the powder material with a binder material, such as a metallic alloy.
- the various features of the resulting matrix drill bit, such as blades, cutter pockets, and/or fluid-flow passageways, may be provided by shaping the mold cavity and/or by positioning temporary displacement materials within interior portions of the mold cavity.
- a preformed bit blank (or steel mandrel) may be placed within the mold cavity to provide reinforcement for the matrix bit body and to allow attachment of the resulting matrix drill bit with a drill string.
- a quantity of matrix reinforcement material (typically in powder form) may then be placed within the mold cavity with a quantity of the binder material.
- the mold is then placed within a furnace and heated to a desired temperature to allow the binder (e.g., metallic alloy) to liquefy and infiltrate the matrix reinforcement material.
- the furnace typically maintains a desired temperature until the infiltration process is deemed complete, such as when a specific location in the bit reaches a certain temperature.
- the mold is then removed from the furnace and begins to rapidly lose heat to its surrounding environment via heat transfer, such as radiation and/or convection in all directions.
- one or more intermediate regions within the bit body may solidify prior to adjacent regions and thereby stop the flow of molten material to locations where shrinkage porosity is developing.
- shrinkage porosity may result in poor metallurgical bonding at the interface between the bit blank and the molten materials, which can result in the formation of cracks within the bit body that can be difficult or impossible to inspect.
- FIG. 1 is a perspective view of an exemplary fixed-cutter drill bit that may be fabricated in accordance with the principles of the present disclosure.
- FIG. 2 is a cross-sectional view of the drill bit of FIG. 1 .
- FIG. 3 is a cross-sectional side view of an exemplary mold assembly for use in forming the drill bit of FIG. 1 .
- FIGS. 4A-4C are progressive schematic diagrams of an exemplary method of fabricating a drill bit.
- FIGS. 5A-5C are partial cross-sectional side views of exemplary thermal sink systems used to cool the mold assembly of FIG. 3 .
- FIG. 6 is a partial cross-sectional side view of another exemplary thermal sink system used to cool the mold assembly of FIG. 3 .
- FIGS. 7A-7C depict exemplary flow channel designs that may be employed in a quench plate.
- FIGS. 8A and 8B are partial cross-sectional side views of additional exemplary thermal sink systems used to cool the mold assembly of FIG. 3 .
- FIG. 9 is an isometric view of an exemplary quench plate.
- the present disclosure relates to downhole tool manufacturing and, more particularly, to thermal sink systems having impermeable quench plates that prevent the influx of steam or vapor during cooling of infiltrated downhole tools.
- the embodiments described herein provide thermal sink systems that may be used to help cool a mold assembly following an infiltration process for an infiltrated downhole tool.
- the thermal sink systems described herein include a quench plate configured to prevent the mold assembly from being exposed to a thermal fluid that is used to help cool the mold assembly through the quench plate.
- the thermal fluid may either impinge upon the bottom of the quench plate or flow through one or more flow channels defined through the quench plate to exchange thermal energy with the mold assembly across or through the quench plate via thermal conduction.
- the impermeable quench plate may prevent any vapor that may be generated from the thermal fluid from escaping into an insulation enclosure placed about the mold assembly and resting on the quench plate.
- the quench plate may include an insert made of a thermally conductive material that accelerates heat transfer between the mold assembly and the thermal fluid through the quench plate.
- FIG. 1 illustrates a perspective view of an example fixed-cutter drill bit 100 that may be fabricated in accordance with the principles of the present disclosure. It should be noted that, while FIG. 1 depicts a fixed-cutter drill bit 100 , the principles of the present disclosure are equally applicable to any type of downhole tool that may be formed or otherwise manufactured through an infiltration process.
- suitable infiltrated downhole tools include, but are not limited to, oilfield drill bits or cutting tools (e.g., fixed-angle drill bits, roller-cone drill bits, coring drill bits, bi-center drill bits, impregnated drill bits, reamers, stabilizers, hole openers, cutters, cutting elements), non-retrievable drilling components, aluminum drill bit bodies associated with casing drilling of wellbores, drill-string stabilizers, cones for roller-cone drill bits, models for forging dies used to fabricate support arms for roller-cone drill bits, arms for fixed reamers, arms for expandable reamers, internal components associated with expandable reamers, sleeves attached to an uphole end of a rotary drill bit, rotary steering tools, logging-while-drilling tools, measurement-while-drilling tools, side-wall coring tools, fishing spears, washover tools, rotors, stators and/or housings for downhole drilling motors,
- oilfield drill bits or cutting tools e.g
- the fixed-cutter drill bit 100 may include or otherwise define a plurality of cutter blades 102 arranged along the circumference of a bit head 104 .
- the bit head 104 is connected to a shank 106 to form a bit body 108 .
- the shank 106 may be connected to the bit head 104 by welding, brazing, or other fusion methods, such as using submerged arc or metal inert gas arc welding that results in the formation of a weld 110 around a weld groove 112 .
- the shank 106 may further include or otherwise be connected to a threaded pin 114 .
- the drill bit 100 includes five cutter blades 102 , in which multiple recesses or pockets 116 are formed.
- Cutting elements 118 may be fixedly installed within each pocket 116 . This can be done, for example, by brazing each cutting element 118 into a corresponding pocket 116 . As the drill bit 100 is rotated in use, the cutting elements 118 engage the rock and underlying earthen materials, to dig, scrape or grind away the material of the formation being penetrated.
- drilling fluid or “mud” can be pumped downhole through a drill string (not shown) coupled to the drill bit 100 at the threaded pin 114 .
- the drilling fluid circulates through and out of the drill bit 100 at one or more nozzles 120 positioned in nozzle openings 122 defined in the bit head 104 .
- Junk slots 124 are formed between each adjacent pair of cutter blades 102 . Cuttings, downhole debris, formation fluids, drilling fluid, etc., may pass through the junk slots 124 and circulate back to the well surface within an annulus formed between exterior portions of the drill string and the inner wall of the wellbore being drilled.
- FIG. 2 is a cross-sectional side view of the drill bit 100 of FIG. 1 .
- the shank 106 may be securely attached to a metal blank (or mandrel) 202 at the weld 110 and the metal blank 202 extends into the bit body 108 .
- the shank 106 and the metal blank 202 are generally cylindrical structures that define corresponding fluid cavities 204 a and 204 b , respectively, in fluid communication with each other.
- the fluid cavity 204 b of the metal blank 202 may further extend longitudinally into the bit body 108 .
- At least one flow passageway (shown as two flow passageways 206 a and 206 b ) may extend from the fluid cavity 204 b to exterior portions of the bit body 108 .
- the nozzle openings 122 may be defined at the ends of the flow passageways 206 a and 206 b at the exterior portions of the bit body 108 .
- the pockets 116 are formed in the bit body 108 and are shaped or otherwise configured to receive the cutting elements 118 ( FIG. 1 ).
- FIG. 3 is a cross-sectional side view of a mold assembly 300 that may be used to form the drill bit 100 of FIGS. 1 and 2 . While the mold assembly 300 is shown and discussed as being used to help fabricate the drill bit 100 , those skilled in the art will readily appreciate that mold assembly 300 and its several variations described herein may be used to help fabricate any of the infiltrated downhole tools mentioned above, without departing from the scope of the disclosure. As illustrated, the mold assembly 300 may include several components such as a mold 302 , a gauge ring 304 , and a funnel 306 . In some embodiments, the funnel 306 may be operatively coupled to the mold 302 via the gauge ring 304 , such as by corresponding threaded engagements, as illustrated. In other embodiments, the gauge ring 304 may be omitted from the mold assembly 300 and the funnel 306 may instead be operatively coupled directly to the mold 302 , such as via a corresponding threaded engagement, without departing from the scope of the disclosure.
- the mold assembly 300 may further include a binder bowl 308 and a cap 310 placed above the funnel 306 .
- the mold 302 , the gauge ring 304 , the funnel 306 , the binder bowl 308 , and the cap 310 may each be made of or otherwise comprise graphite or alumina (Al 2 O 3 ), for example, or other suitable materials.
- An infiltration chamber 312 may be defined or otherwise provided within the mold assembly 300 . Materials, such as consolidated sand or graphite, may be positioned within the mold assembly 300 at desired locations to form various features of the drill bit 100 ( FIGS. 1 and 2 ).
- consolidated sand legs 314 a and 314 b may be positioned to correspond with desired locations and configurations of the flow passageways 206 a,b ( FIG. 2 ) and their respective nozzle openings 122 ( FIGS. 1 and 2 ).
- a cylindrically-shaped consolidated central displacement 316 may be placed on the legs 314 a,b .
- the number of legs 314 a,b extending from the central displacement 316 will depend upon the desired number of flow passageways and corresponding nozzle openings 122 in the drill bit 100 .
- matrix reinforcement materials 318 may then be placed within the mold assembly 300 .
- matrix reinforcement materials 318 include, but are not limited to, tungsten carbide, monotungsten carbide (WC), ditungsten carbide (W 2 C), macrocrystalline tungsten carbide, other metal carbides, metal borides, metal oxides, metal nitrides, natural and synthetic diamond, and polycrystalline diamond (PCD).
- tungsten carbide monotungsten carbide (WC), ditungsten carbide (W 2 C), macrocrystalline tungsten carbide, other metal carbides, metal borides, metal oxides, metal nitrides, natural and synthetic diamond, and polycrystalline diamond (PCD).
- PCD polycrystalline diamond
- examples of other metal carbides may include, but are not limited to, titanium carbide and tantalum carbide, and various mixtures of such materials may also be used.
- the metal blank 202 may be supported at least partially by the matrix reinforcement materials 318 within the infiltration chamber 312 . More particularly, after a sufficient volume of the matrix reinforcement materials 318 has been added to the mold assembly 300 , the metal blank 202 may then be placed within mold assembly 300 .
- the metal blank 202 may include an inside diameter 320 that is greater than an outside diameter 322 of the central displacement 316 , and various fixtures (not expressly shown) may be used to position the metal blank 202 within the mold assembly 300 at a desired location.
- the matrix reinforcement materials 318 may then be filled to a desired level within the infiltration chamber 312 .
- Binder material 324 may then be placed on top of the matrix reinforcement materials 318 , the metal blank 202 , and the central displacement 316 .
- Various types of binder materials 324 may be used and include, but are not limited to, metallic alloys of copper (Cu), nickel (Ni), manganese (Mn), lead (Pb), tin (Sn), cobalt (Co), phosphorous (P), and silver (Ag).
- metallic alloys of copper (Cu), nickel (Ni), manganese (Mn), lead (Pb), tin (Sn), cobalt (Co), phosphorous (P), and silver (Ag).
- the binder material 324 may be covered with a flux layer (not expressly shown).
- the amount of binder material 324 and optional flux material added to the infiltration chamber 312 should be at least enough to infiltrate the matrix reinforcement materials 318 during the infiltration process.
- some or all of the binder material 324 may be placed in the binder bowl 308 , which may be used to distribute the binder material 324 into the infiltration chamber 312 via various conduits 326 that extend therethrough.
- the cap 310 (if used) may then be placed over the mold assembly 300 , thereby readying the mold assembly 300 for heating.
- FIGS. 4A-4C illustrated are schematic diagrams that sequentially illustrate an example method of heating and cooling the mold assembly 300 of FIG. 3 , in accordance with the principles of the present disclosure.
- the mold assembly 300 is depicted as being positioned within a furnace 402 .
- the temperature of the mold assembly 300 and its contents are elevated within the furnace 402 until the binder material 324 liquefies and is able to infiltrate the matrix reinforcement materials 318 .
- the mold assembly 300 is then removed from the furnace 402 and immediately begins to lose heat by radiating thermal energy to its surroundings while heat is also convected away by cooler air outside the furnace 402 .
- the mold assembly 300 may be transported to and set down upon a thermal sink 404 .
- the radiative and convective heat losses from the mold assembly 300 to the environment continue until an insulation enclosure 406 is lowered around the mold assembly 300 .
- the insulation enclosure 406 may be a rigid shell or structure used to insulate the mold assembly 300 and thereby slow the cooling process.
- the insulation enclosure 406 may include a hook 408 attached to a top surface thereof.
- the hook 408 may provide an attachment location whereby the insulation enclosure 406 may be grasped and/or otherwise attached to for transport. For instance, a chain or wire 410 may be coupled to the hook 408 to lift and move the insulation enclosure 406 , as illustrated.
- the insulation enclosure 406 may include an outer frame 412 , an inner frame 414 , and insulation material 416 arranged between the outer and inner frames 412 , 414 .
- both the outer frame 412 and the inner frame 414 may be made of rolled steel and shaped (i.e., bent, welded, etc.) into the general shape, design, and/or configuration of the insulation enclosure 406 .
- the inner frame 414 may be a metal wire mesh that holds the insulation material 416 between the outer frame 412 and the inner frame 414 .
- the insulation material 416 may be selected from a variety of insulative materials. In at least one embodiment, the insulation material 416 may be a ceramic fiber blanket, such as INSWOOL® or the like.
- the insulation enclosure 406 may enclose the mold assembly 300 such that thermal energy radiating from the mold assembly 300 is dramatically reduced from the top and sides of the mold assembly 300 and is instead directed substantially downward and otherwise toward/into the thermal sink 404 or back towards the mold assembly 300 . With the insulation enclosure 406 positioned over the mold assembly 300 and the thermal sink 404 in operation, the majority of the thermal energy is transferred through the bottom 418 of the mold assembly 300 and into the thermal sink 404 .
- This controlled cooling of the mold assembly 300 and its contents allows an operator to regulate or control the thermal profile of the mold assembly 300 to a certain extent and may help facilitate directional solidification of the molten contents within the mold assembly 300 , where axial solidification of the molten contents dominates radial solidification.
- the face of the drill bit i.e., the end of the drill bit that includes the cutters
- the shank 106 FIG. 1
- the drill bit 100 FIGS. 1 and 2
- Such directional solidification may prove advantageous in reducing the occurrence of voids due to shrinkage porosity, cracks at the interface between the metal blank 202 ( FIGS. 2 and 3 ) and the molten materials, and nozzle cracks.
- the thermal sink 404 may comprise a system that includes a quench plate designed to circulate a fluid (e.g., water) at a reduced temperature relative to the mold assembly 300 (i.e., at or near ambient) to draw thermal energy from the mold assembly 300 and into the circulating fluid, and thereby reduce the temperature of the mold assembly 300 .
- the circulating fluid contacts the bottom 418 of the mold assembly 300 and, as a result, vapor may be generated and escape into the interior of the insulation enclosure 406 and thereby increase the heat transfer from the upper portions of the mold assembly 300 .
- the term “vapor” refers to any gasified liquid including, but not limited to, water vapor in the form of steam. This additional cooling can produce unwanted solidification fronts within the mold assembly 300 , which could result in defects caused by lack of thermal control.
- the embodiments of the present disclosure describe several concepts for reducing or eliminating the influx of vapor into the interior of the insulation enclosure 406 .
- FIGS. 5A-5C illustrated are partial cross-sectional side views of exemplary thermal sink systems 500 that may be used to cool the mold assembly 300 , according to one or more embodiments. More particularly, FIG. 5A depicts a first thermal sink system 500 a , FIG. 5B depicts a second thermal sink system 500 b , and FIG. 5C depicts a third thermal sink system 500 c . Each thermal sink system 500 a - c may be similar in some respects to the thermal sink 404 described above with reference to FIGS. 4B and 4C .
- each thermal sink system 500 a - c may include a quench plate 502 , a table 504 that supports the quench plate 502 , and a fluid reservoir 506 disposed below the quench plate 502 .
- the table 504 may provide or otherwise define one or more shoulders 508 configured to receive and support the quench plate 502 above the fluid reservoir 506 .
- the mold assembly 300 may be positioned on the quench plate 502 such that the bottom 418 is in direct contact with the upper surface of the quench plate 502 , and the insulation enclosure 406 may be disposed about the mold assembly 300 and rest on the quench plate 502 .
- a gap 510 may be defined between the table 504 and the quench plate 502 .
- the quench plate 502 may exhibit a generally square shape, and the gap 510 may also be square to accommodate the shape of the quench plate 502 . In other embodiments, however, the quench plate 502 may exhibit other shapes, such as circular, ovoid, or other polygonal shapes (e.g., rectangular, etc.).
- the quench plate 502 may be configured to prevent exposure of the mold assembly 300 to a thermal fluid 512 used to help cool the mold assembly 300 .
- the thermal fluid 512 may be any suitable fluid or gas including, but not limited to, water, steam, an oil, a coolant (e.g., glycols), a gas (e.g., air, carbon dioxide, argon, helium, oxygen, nitrogen), a molten metal, a molten metal alloy, a fluidized bed, or a molten salt.
- Suitable molten metals or metal alloys used for the thermal fluid 512 may include Pb, Bi, Pb—Bi, K, Na, Na—K, Ga, In, Sn, Li, Zn, or any alloys thereof.
- Suitable molten salts used for the thermal fluid 512 include alkali fluoride salts (e.g., LiF—KF, LiF—NaF—KF, LiF—RbF, LiF—NaF—RbF), BeF 2 salts (e.g., LiF—BeF 2 , NaF—BeF 2 , LiF—NaF—BeF 2 ), ZrF 4 salts (e.g., KF—ZrF 4 , NaF—ZrF 4 , NaF—KF—ZrF 4 , LiF—ZrF 4 , LiF—NaF—ZrF 4 , RbF—ZrF 4 ), chloride-based salts (e.g., LiCl—KCl, KCl—MgCl 2 , NaCl—MgCl 2 , LiCl—KCl—MgCl 2 , KCl—NaCl—MgCl 2 ), fluoroborate-based salt
- One or more nozzles 514 may be positioned within the fluid reservoir 506 and otherwise configured to eject the thermal fluid 512 such that it impinges on a bottom surface 516 of the quench plate 502 .
- the quench plate 502 may be impermeable to the thermal fluid 512 and otherwise prevent the thermal fluid 512 from coming into direct contact with the mold assembly 300 . Instead, the thermal fluid 512 may thermally communicate with the mold assembly 300 across or through the quench plate 502 via thermal conduction and subsequently flow into the fluid reservoir 506 for recycling or disposal.
- the term “thermally communicate,” or any variation thereof refers to the ability to exchange thermal energy between the thermal fluid 512 and the mold assembly 300 and/or its contents, even across the quench plate 502 .
- any vapor that may be generated from contacting the thermal fluid 512 on the bottom surface 516 of the quench plate may either condense into the fluid reservoir 506 or migrate along the bottom surface 516 of the quench plate 502 until eventually locating the gap 510 and escaping into the surrounding environment outside of the insulation enclosure 406 .
- the quench plate 502 may sealingly engage and otherwise form a seal against the shoulder 508 and thereby prevent the efflux of vapor into the surrounding environment.
- a pressure-release line (not shown) may be included to relieve any built-up pressure in the fluid reservoir 506 caused by the vapor.
- the insulation enclosure 406 may prevent any escaping vapor from entering the interior 518 of the insulation enclosure 406 and, upon contacting the cooler air of the surrounding environment, some of the vapor may condense and flow back into the fluid reservoir 506 via the gap 510 . Furthermore, the interior 518 may be sealed off using an appropriate member between the quench plate 502 and insulation enclosure 406 . In such embodiments, the interior 518 may be evacuated to provide a vacuum (and thermal insulation) between the insulation enclosure 406 and the mold assembly 300 .
- the interior 518 may be filled with a controlled atmosphere by flowing in a gas, such as argon or helium, at an elevated temperature to promote directional solidification of the contents of the mold assembly 300 by insulating the upper portions of mold assembly 300 while its bottom portion is cooled via the quench plate 502 .
- a gas such as argon or helium
- the quench plate 502 may be made of a variety of materials that help facilitate thermal energy transfer from the mold assembly 300 to the thermal fluid 512 .
- Suitable materials for the quench plate 502 include, but are not limited to, a ceramic (e.g., oxides, carbides, borides, nitrides, silicides), a metal (e.g., steel, stainless steel, nickel, tungsten, titanium or alloys thereof), alumina, graphite, diamond, graphene, and any combination thereof.
- FIGS. 5A-5C depict various exemplary designs and configurations of the quench plate 502 that may be employed to help cool the mold assembly 300 while simultaneously isolating the mold assembly 300 from the thermal fluid 512 and any vapor generated therefrom.
- the quench plate 502 may comprise a monolithic slab or block of material having a generally uniform thickness.
- a single nozzle 514 may be positioned within the fluid reservoir 506 and otherwise configured to eject the thermal fluid 512 such that it impinges on the bottom surface 516 at or near the center of the quench plate 502 .
- more than one nozzle 514 may be employed, without departing from the scope of the disclosure.
- the quench plate 502 is depicted as an arched member and otherwise narrowing toward its center. More particularly, the thickness of the quench plate 502 may be greater at its outer periphery as compared to the center. As will be appreciated, this configuration provides less mass at or near the center of the quench plate 502 , thereby allowing for quicker heat conduction through the reduced-mass sections.
- FIG. 5B also illustrates a plurality of nozzles 514 (three shown) configured to eject the thermal fluid 512 such that it impinges on the bottom surface 516 across a larger area as compared to the single nozzle 514 of FIG. 5A .
- the bottom surface 516 may be designed in conjunction with the nozzles 514 to facilitate attachment of a cooling film to the bottom surface 516 , eliminate a vapor boundary layer at the bottom surface 516 , and/or promote turbulent flow at the interface between the quench plate 502 and the thermal fluid 512 .
- the quench plate 502 may provide one or more grooves 520 (three shown) defined into the bottom surface 516 thereof.
- the grooves 520 may prove advantageous in providing local zones in the quench plate 502 that provide less mass and thereby allow for quicker heat conduction through the quench plate 502 at those areas.
- the grooves 520 may facilitate attached fluid flow along the bottom surface 516 , thereby enhancing the heat-transfer rate.
- the thermal sink system 500 c may include a nozzle 514 (three shown) aligned with each groove 520 to eject the thermal fluid 512 into the grooves 520 and thereby provide for locally increased heat transfer.
- Each nozzle 514 may be oriented at a specific angle with respect to the bottom surface 516 , such as perpendicular (90°, as shown), 60°, 45°, 30°, 0°, or any orientation within the 0-90° range to optimize fluid flow and heat transfer via the quench plate 502 along bottom surface 516 .
- the quench plate 502 design of FIG. 5C may function as a type of heat exchanger, with the thicker portions of the quench plate 502 between the grooves 520 simulating or otherwise serving as at type of heat-exchanging fins.
- various designs and configurations of the grooves 520 may be integrated into the quench plate 520 as heat-exchanging features that include, but are not limited to, protruding knobs, fins, cylinders, coils, tubes, bundled tubes, concentric tubes, plates, corrugated plates, strips, shells, baffles, channels, micro-channels, finned coils, finned plates, finned strips, louvered fins, wavy fins, pin fins, and the like, or any combination thereof to make the bottom surface 516 of the quench plate 502 operate as a heat exchanger.
- heat-exchanging features may be integrated in other locations on the bottom surface 516 of a quench plate 502 to enhance heat transfer between the quench plate 502 and
- the thermal sink system 600 may be similar in some respects to the thermal sink systems 500 a - c of FIGS. 5A-5C , respectively, and therefore may be best understood with reference thereto, where like numerals represent like components not described again in detail.
- the thermal sink system 600 may include the quench plate 502 , the table 504 that supports the quench plate 502 , and the fluid reservoir 506 disposed below the quench plate 502 .
- the mold assembly 300 may be positioned on the quench plate 502 and the insulation enclosure 406 may be disposed about the mold assembly 300 and rest on the quench plate 502 .
- the thermal sink system 600 may include one or more flow channels 602 defined within and otherwise through the quench plate 502 .
- the flow channel 602 may extend between an inlet 604 a and an outlet 604 b , and a nozzle 514 or other type of piping or conduit may be configured to provide the thermal fluid 512 into the flow channel 602 via the inlet 604 a .
- the thermal fluid 512 may be provided to the inlet 604 a and flowed into the flow channel 602 and subsequently exit the flow channel 602 at the outlet 604 b where it flows into the fluid reservoir 506 for recycling or disposal. While circulating through the flow channel 602 , the thermal fluid 512 may thermally communicate (i.e., exchange thermal energy) with the mold assembly 300 across or through the quench plate 502 via thermal conduction.
- the flow channel 602 may prove advantageous in allowing the thermal fluid 512 to thermally communicate with the mold assembly 300 through the quench plate 502 while simultaneously preventing the thermal fluid 512 from coming into direct contact with the mold assembly 300 . Any vapor that may be generated as the thermal fluid 512 circulates through the flow channel 602 may either condense into the fluid reservoir 506 or migrate along the bottom surface 516 of the quench plate 502 until eventually locating the gap 510 and escaping into the surrounding environment outside of the insulation enclosure 406 .
- the flow channel 602 defined in the quench plate 502 may exhibit various configurations and designs while isolating the mold assembly 300 from contact with the thermal fluid 512 or vapor generated therefrom.
- FIGS. 7A-7C show at least three exemplary designs for the flow channel 602 that may be employed in the quench plate 502 to provide enhanced or more controlled thermal profiles for the mold assembly 300 .
- the flow channel 602 may provide a plurality of branches 702 that extend from a common and/or centralized inlet 604 a . Each of the branches 702 may be fed thermal fluid 512 from the central inlet 604 a and may terminate in a corresponding outlet 604 b.
- the flow channel 602 is depicted as comprising a plurality of flow channels shown as flow channels 602 a , 602 b , and 602 c .
- Each flow channel 602 a - c may be configured to circulate the thermal fluid 512 between an inlet 604 a and an outlet 604 b .
- the flow channels 602 a - c each form a generally angled or triangular flow pathway. It will be appreciated, however, that other designs or configurations of the flow channels 602 a - c may alternatively be employed, without departing from the scope of the disclosure.
- FIG. 7B shows six if the full quench plate 502 were shown past the centerline
- more or less than three flow channels 502 a - c may be employed.
- the flow channel 602 is depicted as a single flow channel 602 that is spiraled or coiled within the quench plate 502 .
- the flow channel 602 may include the inlet 604 a located at or near the center of the quench plate 502 , and the outlet 604 b located adjacent the outer periphery of the quench plate 502 . It will be appreciated that several other designs for the flow channel 602 may be possible and are contemplated as being within the scope of the present disclosure.
- FIGS. 8A and 8B illustrated are partial cross-sectional side views of other exemplary thermal sink systems 800 that may be used to cool the mold assembly 300 , according to one or more embodiments. More particularly, FIG. 8A depicts a first thermal sink system 800 a , and FIG. 8B depicts a second thermal sink system 800 b .
- the thermal sink systems 800 a,b may be similar in some respects to the thermal sink systems 500 a - c and 600 of FIGS. 5A-5C and 6 , respectively, and therefore may be best understood with reference thereto, where like numerals represent like components not described again in detail.
- each thermal sink system 800 a,b may include the quench plate 502 , the table 504 that supports the quench plate 502 , and the fluid reservoir 506 disposed below the quench plate 502 .
- the mold assembly 300 may be positioned on the quench plate 502 and the insulation enclosure 406 may be disposed about the mold assembly 300 and rest on the quench plate 502 .
- the quench plate 502 of the thermal sink systems 800 a,b may comprise a multi-component structure. More particularly, the quench plate 502 may define an aperture 802 configured to receive and seat an insert 804 that forms part of the quench plate 502 . In some embodiments, as illustrated, the aperture 802 may provide a radial shoulder 806 configured to support the insert 804 within the aperture 802 as the quench plate 502 is supported by the table 504 at the shoulder 508 .
- the aperture 802 may receive the insert 804 via a threaded engagement or the insert 804 may be secured within the aperture 802 using one or more mechanical fasteners (e.g., screws, bolts, snap rings, pins, etc.). The use of a compression fitting may be necessary in some cases to provide a complete seal along the interface between the insert 804 and the quench plate 502 . Additionally, an appropriate sealing material or device (e.g., O-ring, etc.) may be positioned between the insert 804 and quench plate 502 to further prevent the thermal fluid 512 or vapor from entering the interior 518 . In at least one embodiment, the insert 804 may be permanently bonded to the quench plate 502 using an appropriate method, such as brazing or welding. Moreover, in some embodiments, as illustrated, the aperture 802 may be defined at or near the center of the quench plate 502 . In other embodiments, however, the aperture 802 may alternatively be defined off-center, without departing from the scope of the disclosure.
- mechanical fasteners e.
- the insert 804 may be made of a variety of materials configured to provide different thermal properties (e.g., thermal conductivity) intended to produce different thermal profiles in the mold assembly 300 during the cooling process. Suitable materials for the insert 804 include, but are not limited to, a ceramic (e.g., oxides, carbides, borides, nitrides, silicides), a metal (e.g., steel, stainless steel, nickel, copper, tungsten, titanium or alloys thereof), alumina, graphite, and any combination thereof. In some embodiments, the insert 804 and the quench plate 502 may be made of the same material. In other embodiments, however, the insert 804 and the quench plate 502 may be made of dissimilar materials.
- a ceramic e.g., oxides, carbides, borides, nitrides, silicides
- a metal e.g., steel, stainless steel, nickel, copper, tungsten, titanium or alloys thereof
- alumina graphite, and any combination
- the material of the insert 804 may prove advantageous in quickly drawing heat out of the mold assembly 300 during operation whereas the material of the quench plate 502 may prove advantageous in retaining heat in the insulation enclosure 406 and/or the interior 518 , thereby promoting directional solidification of the mold assembly 300 and its contents.
- the insert 804 in FIG. 8A is smaller than the insert 804 of FIG. 8B .
- one nozzle 514 is depicted as ejecting the thermal fluid 512 such that it impinges on the bottom surface 516 of the quench plate 502 and, more particularly, on a bottom or underside 808 of the insert 804 .
- a plurality of nozzles 514 are depicted as ejecting the thermal fluid 512 such that it impinges on the underside 808 of the insert 804 .
- thermal energy may be transferred from the mold assembly 300 , through the insert 804 , and to the thermal fluid 512 .
- the quench plate 900 may be similar in some respects to the quench plate 502 described above, and therefore able to prevent exposure of the mold assembly 300 ( FIGS. 5A-5C, 6, 8A-8B ) to the thermal fluid 512 ( FIGS. 5A-5C, 6, 8A-8B ) that is used to cool the mold assembly 300 and any resulting vapor generated by the thermal fluid 512 .
- the quench plate 900 may include one or more backstops 902 (shown as backstops 902 a , 902 b , and 902 c ) to assist in accurate and repeatable locating of the mold assembly 300 during the transfer process from the furnace 402 ( FIG. 4A ) to the quench plate 900 .
- backstops 902 shown as backstops 902 a , 902 b , and 902 c
- Each mold base diameter 904 a - c corresponds generally to a size of the bottom 418 ( FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 ( FIGS. 5A-5C, 6, 8A-8B ), and each mold base diameter 904 a - c provides a different design or type of backstop 902 configured to receive and center the mold assembly 300 on the quench plate 900 .
- first and smallest mold base diameter 904 a illustrates a first backstop 902 a design
- second mold base diameter 904 b illustrates a second backstop 902 b design
- third and largest mold base diameter 904 c illustrates a third backstop 902 c design.
- the first backstop 902 a may include or otherwise provide two or more pegs 906 (three shown) positioned at predetermined locations about the circumference of the first mold base diameter 904 a and otherwise protruding from the upper surface of the quench plate 900 .
- the pegs 906 may be configured to receive the bottom 418 ( FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 ( FIGS. 5A-5C, 6, 8A-8B ) as the mold assembly 300 is moved in the direction A toward the pegs 906 .
- the pegs 906 may be spaced from each other about the circumference of the first mold base diameter 904 a such that the mold assembly 300 is received by the pegs 906 and simultaneously concentrically located on the quench plate 900 around the center 908 .
- one or more of the pegs 906 may be inserted into corresponding apertures defined on the upper surface of the quench plate 900 . In other embodiments, one or more of the pegs 906 may be threaded into such apertures. In yet other embodiments, one or more of the pegs 906 may penetrate the quench plate 900 and may be secured to the quench plate 900 on its underside, such as through the use of a nut and water-tight washer combination.
- the second backstop 902 b may include or otherwise provide two or more blocks 910 (three shown) positioned about the circumference of the second mold base diameter 904 b and otherwise protruding from the upper surface of the quench plate 900 . Similar to the pegs 906 , the blocks 910 may be configured to receive the bottom 418 ( FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 ( FIGS. 5A-5C, 6, 8A-8B ) as the mold assembly 300 is moved in the direction A toward the blocks 910 . The blocks 910 may be spaced from each other about the circumference of the second mold base diameter 904 b such that the mold 300 is received by the blocks 910 and simultaneously located on the quench plate 900 at the center 908 .
- the blocks 910 may be combined into a single arcuate member configured to receive and locate the mold assembly 300 at the center 908 .
- one or more of the blocks 910 may be inserted into corresponding polygonal apertures defined on the upper surface of the quench plate 900 .
- one or more of the blocks 910 may be secured to the upper surface of the quench plate 900 using one or more mechanical fasteners, such as screws or bolts that thread into the upper surface of the quench plate 900 .
- the third backstop 902 c may include an elongate member 912 positioned on the third mold base diameter 904 c . While shown in FIG. 9 as generally straight, in at least one embodiment, the elongate member 912 may be curved or otherwise arcuate in shape. In some embodiments, the elongate member 912 may be anchored to the quench plate 900 using one or more mechanical fasteners 914 (one shown in exploded view), such as bolts, screws, pegs, snap rings, etc. In other embodiments, the elongate member 912 may be anchored to the table 504 ( FIGS. 5A-5C, 6, 8A-8B ) using the same type of mechanical fasteners 916 (one shown in exploded view).
- the elongate member 912 may be configured to receive the bottom 418 ( FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 ( FIGS. 5A-5C, 6, 8A-8B ) as the mold assembly 300 is moved in the direction A toward the elongate member 912 .
- the elongate member 912 may be removed or otherwise movable, such as via an actuation member, to accommodate the insulation enclosure 406 ( FIGS. 5A-5C, 6, 8A-8B ) being lowered onto the upper surface of the quench plate 900 .
- the elongate member 912 may be a recessable member, either via an actuation member or with a curved top surface so that the vertical force from the insulation enclosure 406 may force the elongate member 912 to lower.
- any of the backstops 902 a - c described above may be employed at any of the mold base diameters 904 a - c and in any combination, if desired.
- the various embodiments described and illustrated herein may be combined in any combination, in keeping within the scope of this disclosure. Indeed, variations in the size and configuration of any of the thermal sink systems described herein may be implemented in any of the embodiments, as generally described herein, without departing from the scope of the disclosure.
- a thermal sink system that includes a quench plate having an upper surface for receiving a mold assembly to be cooled, and a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, wherein the quench plate interposes the thermal fluid and the mold assembly and thereby prevents the thermal fluid from contacting the mold assembly.
- a method of cooling a mold assembly that includes positioning the mold assembly on an upper surface of a quench plate, placing a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, and preventing the thermal fluid from contacting the mold assembly with the quench plate.
- each of embodiments A and B may have one or more of the following additional elements in any combination:
- Element 1 wherein the thermal fluid is a fluid selected from the group consisting of water, steam, an oil, a coolant, a gas, a molten metal, a molten metal alloy, a fluidized bed, and a molten salt.
- Element 2 further comprising a table having a shoulder that receives and supports the quench plate, and a fluid reservoir arranged below the quench plate.
- Element 3 wherein the quench plate sealingly engages the table.
- Element 4 further comprising one or more nozzles arranged to eject the thermal fluid such that the thermal fluid impinges on a bottom surface of the quench plate.
- Element 5 wherein the quench plate is arched such that a thickness of the quench plate is greater at an outer periphery as compared to a thickness of the quench plate at a center location.
- Element 6 further comprising one or more grooves defined in a bottom surface of the quench plate.
- Element 7 further comprising one or more nozzles arranged to eject the thermal fluid into the one or more grooves.
- Element 8 further comprising one or more heat-exchanging features defined in a bottom surface of the quench plate.
- Element 9 further comprising one or more flow channels defined in the quench plate for circulating the thermal fluid.
- Element 10 wherein the one or more flow channels comprise a plurality of branches extending from a common inlet.
- Element 11 wherein the one or more flow channels comprise a single, spiraling flow channel.
- Element 12 wherein the quench plate defines an aperture and includes an insert receivable into the aperture.
- Element 13 wherein the insert comprises a thermally conductive material selected from the group consisting of a ceramic, a metal, alumina, graphite, and any combination thereof.
- Element 14 wherein the insert and the quench plate are made of dissimilar materials.
- Element 15 further comprising a backstop to locate the mold assembly at a desired location on the upper surface of the quench plate.
- Element 16 wherein the backstop is at least one of two or more pegs protruding from the upper surface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the upper surface of the quench plate, an elongate member, and an arcuate member.
- Element 17 further comprising an insulation enclosure that rests on the upper surface of the quench plate and provides an interior for receiving the mold assembly, the quench plate further preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure.
- Element 18 further comprising positioning an insulation enclosure over the mold assembly such that the mold assembly is received into an interior of the insulation enclosure and the insulation enclosure rests on the upper surface of the quench plate, and preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure with the quench plate.
- placing the thermal fluid in thermal communication with the mold assembly comprises ejecting the thermal fluid from one or more nozzles such that the thermal fluid impinges on a bottom surface of the quench plate.
- the bottom surface of the quench plate defines one or more grooves, the method further comprising ejecting the thermal fluid from the one or more nozzles into the one or more grooves.
- Element 21 wherein the bottom surface of the quench plate defines one or more heat-exchanging features, the method further comprising placing at least one of the thermal fluid and a fluid reservoir in thermal communication with the mold assembly via conduction through the quench plate.
- Element 22 wherein ejecting the thermal fluid from the one or more nozzles comprises at least one of reducing a vapor boundary layer at the bottom surface of the quench plate, and promoting turbulent flow at the bottom surface of the quench plate.
- placing the thermal fluid in thermal communication with the mold assembly comprises circulating the thermal fluid through one or more flow channels defined in the quench plate.
- Element 24 wherein the quench plate defines an aperture and includes an insert receivable into the aperture, the method further comprising placing the thermal fluid in thermal communication with the mold assembly via conduction through the insert as received in the aperture of the quench plate.
- positioning the mold assembly on the upper surface of the quench plate comprises locating the mold assembly at a desired location on the upper surface of the quench plate with a backstop, wherein the backstop is at least one of two or more pegs protruding from the upper surface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the upper surface of the quench plate, an elongate member, and an arcuate member.
- exemplary combinations applicable to A, B, and C include: Element 2 with Element 3; Element 6 with Element 7; Element 9 with Element 10; Element 9 with Element 11; Element 12 with Element 13; Element 12 with Element 14; Element 15 with Element 16; Element 19 with Element 20; Element 19 with Element 21; and Element 19 with Element 22.
- compositions and methods are described in terms of “comprising,” “containing,” or “including” various components or steps, the compositions and methods can also “consist essentially of” or “consist of” the various components and steps. All numbers and ranges disclosed above may vary by some amount. Whenever a numerical range with a lower limit and an upper limit is disclosed, any number and any included range falling within the range is specifically disclosed. In particular, every range of values (of the form, “from about a to about b,” or, equivalently, “from approximately a to b,” or, equivalently, “from approximately a-b”) disclosed herein is to be understood to set forth every number and range encompassed within the broader range of values.
- the phrase “at least one of” preceding a series of items, with the terms “and” or “or” to separate any of the items, modifies the list as a whole, rather than each member of the list (i.e., each item).
- the phrase “at least one of” allows a meaning that includes at least one of any one of the items, and/or at least one of any combination of the items, and/or at least one of each of the items.
- the phrases “at least one of A, B, and C” or “at least one of A, B, or C” each refer to only A, only B, or only C; any combination of A, B, and C; and/or at least one of each of A, B, and C.
Abstract
Description
- Rotary drill bits are often used to drill wellbores. One type of rotary drill bit is a fixed-cutter drill bit that has a bit body comprising matrix and reinforcement materials, i.e., a “matrix drill bit” as referred to herein. Matrix drill bits are typically manufactured by placing powder material into a mold and infiltrating the powder material with a binder material, such as a metallic alloy. The various features of the resulting matrix drill bit, such as blades, cutter pockets, and/or fluid-flow passageways, may be provided by shaping the mold cavity and/or by positioning temporary displacement materials within interior portions of the mold cavity. A preformed bit blank (or steel mandrel) may be placed within the mold cavity to provide reinforcement for the matrix bit body and to allow attachment of the resulting matrix drill bit with a drill string. A quantity of matrix reinforcement material (typically in powder form) may then be placed within the mold cavity with a quantity of the binder material.
- The mold is then placed within a furnace and heated to a desired temperature to allow the binder (e.g., metallic alloy) to liquefy and infiltrate the matrix reinforcement material. The furnace typically maintains a desired temperature until the infiltration process is deemed complete, such as when a specific location in the bit reaches a certain temperature. Once the designated process time or temperature has been reached, the mold is then removed from the furnace and begins to rapidly lose heat to its surrounding environment via heat transfer, such as radiation and/or convection in all directions.
- This heat loss continues to a large extent until the mold is moved and placed on a cooling or quench plate and an insulation enclosure or “hot hat” is lowered around the mold. The insulation enclosure drastically reduces the rate of heat loss from the top and sides of the mold while heat is drawn from the bottom of the mold through the cooling plate. This controlled cooling of the mold and the infiltrated matrix bit contained therein can facilitate axial solidification dominating radial solidification, which is loosely termed directional solidification. As the molten material of the infiltrated matrix bit cools, there is a tendency for shrinkage that could result in voids forming within the bit body unless the molten material is able to continuously backfill such voids. In some cases, for instance, one or more intermediate regions within the bit body may solidify prior to adjacent regions and thereby stop the flow of molten material to locations where shrinkage porosity is developing. In other cases, shrinkage porosity may result in poor metallurgical bonding at the interface between the bit blank and the molten materials, which can result in the formation of cracks within the bit body that can be difficult or impossible to inspect.
- While the mold is positioned on the quench plate, water is often ejected out of one or more nozzles provided in the quench plate to impinge upon the bottom of the mold and thereby promote directional solidification. As it contacts the heated mold, however, the water can generate a significant amount of steam or vapor that often enters the insulation enclosure and increases heat transfer from the upper section of the mold, possibly by wetting the insulation (thereby increasing its conductivity) or by creating or enhancing convective currents inside the insulation enclosure. This additional cooling can produce multiple solidification fronts, which could result in blank bond-line cracking, apex cracking, binder-rich zones, bevel cracking, and cracking between nozzles.
- The following figures are included to illustrate certain aspects of the present disclosure, and should not be viewed as exclusive embodiments. The subject matter disclosed is capable of considerable modifications, alterations, combinations, and equivalents in form and function, without departing from the scope of this disclosure.
-
FIG. 1 is a perspective view of an exemplary fixed-cutter drill bit that may be fabricated in accordance with the principles of the present disclosure. -
FIG. 2 is a cross-sectional view of the drill bit ofFIG. 1 . -
FIG. 3 is a cross-sectional side view of an exemplary mold assembly for use in forming the drill bit ofFIG. 1 . -
FIGS. 4A-4C are progressive schematic diagrams of an exemplary method of fabricating a drill bit. -
FIGS. 5A-5C are partial cross-sectional side views of exemplary thermal sink systems used to cool the mold assembly ofFIG. 3 . -
FIG. 6 is a partial cross-sectional side view of another exemplary thermal sink system used to cool the mold assembly ofFIG. 3 . -
FIGS. 7A-7C depict exemplary flow channel designs that may be employed in a quench plate. -
FIGS. 8A and 8B are partial cross-sectional side views of additional exemplary thermal sink systems used to cool the mold assembly ofFIG. 3 . -
FIG. 9 is an isometric view of an exemplary quench plate. - The present disclosure relates to downhole tool manufacturing and, more particularly, to thermal sink systems having impermeable quench plates that prevent the influx of steam or vapor during cooling of infiltrated downhole tools.
- The embodiments described herein provide thermal sink systems that may be used to help cool a mold assembly following an infiltration process for an infiltrated downhole tool. The thermal sink systems described herein include a quench plate configured to prevent the mold assembly from being exposed to a thermal fluid that is used to help cool the mold assembly through the quench plate. The thermal fluid may either impinge upon the bottom of the quench plate or flow through one or more flow channels defined through the quench plate to exchange thermal energy with the mold assembly across or through the quench plate via thermal conduction. The impermeable quench plate may prevent any vapor that may be generated from the thermal fluid from escaping into an insulation enclosure placed about the mold assembly and resting on the quench plate. In some cases, the quench plate may include an insert made of a thermally conductive material that accelerates heat transfer between the mold assembly and the thermal fluid through the quench plate.
-
FIG. 1 illustrates a perspective view of an example fixed-cutter drill bit 100 that may be fabricated in accordance with the principles of the present disclosure. It should be noted that, whileFIG. 1 depicts a fixed-cutter drill bit 100, the principles of the present disclosure are equally applicable to any type of downhole tool that may be formed or otherwise manufactured through an infiltration process. For example, suitable infiltrated downhole tools that may be manufactured in accordance with the present disclosure include, but are not limited to, oilfield drill bits or cutting tools (e.g., fixed-angle drill bits, roller-cone drill bits, coring drill bits, bi-center drill bits, impregnated drill bits, reamers, stabilizers, hole openers, cutters, cutting elements), non-retrievable drilling components, aluminum drill bit bodies associated with casing drilling of wellbores, drill-string stabilizers, cones for roller-cone drill bits, models for forging dies used to fabricate support arms for roller-cone drill bits, arms for fixed reamers, arms for expandable reamers, internal components associated with expandable reamers, sleeves attached to an uphole end of a rotary drill bit, rotary steering tools, logging-while-drilling tools, measurement-while-drilling tools, side-wall coring tools, fishing spears, washover tools, rotors, stators and/or housings for downhole drilling motors, blades and housings for downhole turbines, and other downhole tools having complex configurations and/or asymmetric geometries associated with forming a wellbore. - As illustrated in
FIG. 1 , the fixed-cutter drill bit 100 (hereafter “thedrill bit 100”) may include or otherwise define a plurality ofcutter blades 102 arranged along the circumference of abit head 104. Thebit head 104 is connected to ashank 106 to form abit body 108. Theshank 106 may be connected to thebit head 104 by welding, brazing, or other fusion methods, such as using submerged arc or metal inert gas arc welding that results in the formation of aweld 110 around aweld groove 112. Theshank 106 may further include or otherwise be connected to a threadedpin 114. - In the depicted example, the
drill bit 100 includes fivecutter blades 102, in which multiple recesses orpockets 116 are formed.Cutting elements 118 may be fixedly installed within eachpocket 116. This can be done, for example, by brazing eachcutting element 118 into acorresponding pocket 116. As thedrill bit 100 is rotated in use, thecutting elements 118 engage the rock and underlying earthen materials, to dig, scrape or grind away the material of the formation being penetrated. - During drilling operations, drilling fluid or “mud” can be pumped downhole through a drill string (not shown) coupled to the
drill bit 100 at the threadedpin 114. The drilling fluid circulates through and out of thedrill bit 100 at one ormore nozzles 120 positioned innozzle openings 122 defined in thebit head 104.Junk slots 124 are formed between each adjacent pair ofcutter blades 102. Cuttings, downhole debris, formation fluids, drilling fluid, etc., may pass through thejunk slots 124 and circulate back to the well surface within an annulus formed between exterior portions of the drill string and the inner wall of the wellbore being drilled. -
FIG. 2 is a cross-sectional side view of thedrill bit 100 ofFIG. 1 . - Similar numerals from
FIG. 1 that are used inFIG. 2 refer to similar components that are not described again. As illustrated, theshank 106 may be securely attached to a metal blank (or mandrel) 202 at theweld 110 and the metal blank 202 extends into thebit body 108. Theshank 106 and the metal blank 202 are generally cylindrical structures that definecorresponding fluid cavities fluid cavity 204 b of the metal blank 202 may further extend longitudinally into thebit body 108. At least one flow passageway (shown as twoflow passageways fluid cavity 204 b to exterior portions of thebit body 108. Thenozzle openings 122 may be defined at the ends of theflow passageways bit body 108. Thepockets 116 are formed in thebit body 108 and are shaped or otherwise configured to receive the cutting elements 118 (FIG. 1 ). -
FIG. 3 is a cross-sectional side view of amold assembly 300 that may be used to form thedrill bit 100 ofFIGS. 1 and 2 . While themold assembly 300 is shown and discussed as being used to help fabricate thedrill bit 100, those skilled in the art will readily appreciate thatmold assembly 300 and its several variations described herein may be used to help fabricate any of the infiltrated downhole tools mentioned above, without departing from the scope of the disclosure. As illustrated, themold assembly 300 may include several components such as amold 302, agauge ring 304, and afunnel 306. In some embodiments, thefunnel 306 may be operatively coupled to themold 302 via thegauge ring 304, such as by corresponding threaded engagements, as illustrated. In other embodiments, thegauge ring 304 may be omitted from themold assembly 300 and thefunnel 306 may instead be operatively coupled directly to themold 302, such as via a corresponding threaded engagement, without departing from the scope of the disclosure. - In some embodiments, as illustrated, the
mold assembly 300 may further include abinder bowl 308 and acap 310 placed above thefunnel 306. Themold 302, thegauge ring 304, thefunnel 306, thebinder bowl 308, and thecap 310 may each be made of or otherwise comprise graphite or alumina (Al2O3), for example, or other suitable materials. Aninfiltration chamber 312 may be defined or otherwise provided within themold assembly 300. Materials, such as consolidated sand or graphite, may be positioned within themold assembly 300 at desired locations to form various features of the drill bit 100 (FIGS. 1 and 2 ). For example,consolidated sand legs flow passageways 206 a,b (FIG. 2 ) and their respective nozzle openings 122 (FIGS. 1 and 2 ). Moreover, a cylindrically-shaped consolidatedcentral displacement 316 may be placed on thelegs 314 a,b. The number oflegs 314 a,b extending from thecentral displacement 316 will depend upon the desired number of flow passageways andcorresponding nozzle openings 122 in thedrill bit 100. - After the desired materials, including the
central displacement 316 and thelegs 314 a,b, have been installed within themold assembly 300,matrix reinforcement materials 318 may then be placed within themold assembly 300. For some applications, two or more different types ofmatrix reinforcement materials 318 may be deposited in themold assembly 300. Suitablematrix reinforcement materials 318 include, but are not limited to, tungsten carbide, monotungsten carbide (WC), ditungsten carbide (W2C), macrocrystalline tungsten carbide, other metal carbides, metal borides, metal oxides, metal nitrides, natural and synthetic diamond, and polycrystalline diamond (PCD). Examples of other metal carbides may include, but are not limited to, titanium carbide and tantalum carbide, and various mixtures of such materials may also be used. - The
metal blank 202 may be supported at least partially by thematrix reinforcement materials 318 within theinfiltration chamber 312. More particularly, after a sufficient volume of thematrix reinforcement materials 318 has been added to themold assembly 300, themetal blank 202 may then be placed withinmold assembly 300. Themetal blank 202 may include aninside diameter 320 that is greater than anoutside diameter 322 of thecentral displacement 316, and various fixtures (not expressly shown) may be used to position themetal blank 202 within themold assembly 300 at a desired location. Thematrix reinforcement materials 318 may then be filled to a desired level within theinfiltration chamber 312. -
Binder material 324 may then be placed on top of thematrix reinforcement materials 318, themetal blank 202, and thecentral displacement 316. Various types ofbinder materials 324 may be used and include, but are not limited to, metallic alloys of copper (Cu), nickel (Ni), manganese (Mn), lead (Pb), tin (Sn), cobalt (Co), phosphorous (P), and silver (Ag). Various mixtures of such metallic alloys may also be used as thebinder material 324. In some embodiments, thebinder material 324 may be covered with a flux layer (not expressly shown). The amount ofbinder material 324 and optional flux material added to theinfiltration chamber 312 should be at least enough to infiltrate thematrix reinforcement materials 318 during the infiltration process. In some instances, some or all of thebinder material 324 may be placed in thebinder bowl 308, which may be used to distribute thebinder material 324 into theinfiltration chamber 312 viavarious conduits 326 that extend therethrough. The cap 310 (if used) may then be placed over themold assembly 300, thereby readying themold assembly 300 for heating. - Referring now to
FIGS. 4A-4C , with continued reference toFIG. 3 , illustrated are schematic diagrams that sequentially illustrate an example method of heating and cooling themold assembly 300 ofFIG. 3 , in accordance with the principles of the present disclosure. InFIG. 4A , themold assembly 300 is depicted as being positioned within afurnace 402. The temperature of themold assembly 300 and its contents are elevated within thefurnace 402 until thebinder material 324 liquefies and is able to infiltrate thematrix reinforcement materials 318. Once a specific location in themold assembly 300 reaches a certain temperature in thefurnace 402, or themold assembly 300 is otherwise maintained at a particular temperature for a predetermined amount of time, themold assembly 300 is then removed from thefurnace 402 and immediately begins to lose heat by radiating thermal energy to its surroundings while heat is also convected away by cooler air outside thefurnace 402. - As depicted in
FIG. 4B , themold assembly 300 may be transported to and set down upon athermal sink 404. The radiative and convective heat losses from themold assembly 300 to the environment continue until aninsulation enclosure 406 is lowered around themold assembly 300. Theinsulation enclosure 406 may be a rigid shell or structure used to insulate themold assembly 300 and thereby slow the cooling process. In some cases, theinsulation enclosure 406 may include ahook 408 attached to a top surface thereof. Thehook 408 may provide an attachment location whereby theinsulation enclosure 406 may be grasped and/or otherwise attached to for transport. For instance, a chain orwire 410 may be coupled to thehook 408 to lift and move theinsulation enclosure 406, as illustrated. - The
insulation enclosure 406 may include anouter frame 412, aninner frame 414, andinsulation material 416 arranged between the outer andinner frames outer frame 412 and theinner frame 414 may be made of rolled steel and shaped (i.e., bent, welded, etc.) into the general shape, design, and/or configuration of theinsulation enclosure 406. In other embodiments, theinner frame 414 may be a metal wire mesh that holds theinsulation material 416 between theouter frame 412 and theinner frame 414. Theinsulation material 416 may be selected from a variety of insulative materials. In at least one embodiment, theinsulation material 416 may be a ceramic fiber blanket, such as INSWOOL® or the like. - As depicted in
FIG. 4C , theinsulation enclosure 406 may enclose themold assembly 300 such that thermal energy radiating from themold assembly 300 is dramatically reduced from the top and sides of themold assembly 300 and is instead directed substantially downward and otherwise toward/into thethermal sink 404 or back towards themold assembly 300. With theinsulation enclosure 406 positioned over themold assembly 300 and thethermal sink 404 in operation, the majority of the thermal energy is transferred through thebottom 418 of themold assembly 300 and into thethermal sink 404. This controlled cooling of themold assembly 300 and its contents allows an operator to regulate or control the thermal profile of themold assembly 300 to a certain extent and may help facilitate directional solidification of the molten contents within themold assembly 300, where axial solidification of the molten contents dominates radial solidification. Within themold assembly 300, the face of the drill bit (i.e., the end of the drill bit that includes the cutters) may be positioned at the bottom 418 of themold assembly 300 and otherwise adjacent thethermal sink 404 while the shank 106 (FIG. 1 ) may be positioned adjacent the top of themold assembly 300. As a result, the drill bit 100 (FIGS. 1 and 2 ) may be cooled axially upward, from the cutters 118 (FIG. 1 ) toward the shank 106 (FIG. 1 ). Such directional solidification (from the bottom up) may prove advantageous in reducing the occurrence of voids due to shrinkage porosity, cracks at the interface between the metal blank 202 (FIGS. 2 and 3 ) and the molten materials, and nozzle cracks. - The
thermal sink 404 may comprise a system that includes a quench plate designed to circulate a fluid (e.g., water) at a reduced temperature relative to the mold assembly 300 (i.e., at or near ambient) to draw thermal energy from themold assembly 300 and into the circulating fluid, and thereby reduce the temperature of themold assembly 300. The circulating fluid contacts thebottom 418 of themold assembly 300 and, as a result, vapor may be generated and escape into the interior of theinsulation enclosure 406 and thereby increase the heat transfer from the upper portions of themold assembly 300. As used herein, the term “vapor” refers to any gasified liquid including, but not limited to, water vapor in the form of steam. This additional cooling can produce unwanted solidification fronts within themold assembly 300, which could result in defects caused by lack of thermal control. The embodiments of the present disclosure describe several concepts for reducing or eliminating the influx of vapor into the interior of theinsulation enclosure 406. - Referring now to
FIGS. 5A-5C , illustrated are partial cross-sectional side views of exemplary thermal sink systems 500 that may be used to cool themold assembly 300, according to one or more embodiments. More particularly,FIG. 5A depicts a firstthermal sink system 500 a,FIG. 5B depicts a secondthermal sink system 500 b, andFIG. 5C depicts a thirdthermal sink system 500 c. Each thermal sink system 500 a-c may be similar in some respects to thethermal sink 404 described above with reference toFIGS. 4B and 4C . As illustrated, each thermal sink system 500 a-c may include a quenchplate 502, a table 504 that supports the quenchplate 502, and afluid reservoir 506 disposed below the quenchplate 502. The table 504 may provide or otherwise define one ormore shoulders 508 configured to receive and support the quenchplate 502 above thefluid reservoir 506. - The
mold assembly 300 may be positioned on the quenchplate 502 such that the bottom 418 is in direct contact with the upper surface of the quenchplate 502, and theinsulation enclosure 406 may be disposed about themold assembly 300 and rest on the quenchplate 502. Agap 510 may be defined between the table 504 and the quenchplate 502. In some embodiments, the quenchplate 502 may exhibit a generally square shape, and thegap 510 may also be square to accommodate the shape of the quenchplate 502. In other embodiments, however, the quenchplate 502 may exhibit other shapes, such as circular, ovoid, or other polygonal shapes (e.g., rectangular, etc.). - The quench
plate 502 may be configured to prevent exposure of themold assembly 300 to athermal fluid 512 used to help cool themold assembly 300. Thethermal fluid 512 may be any suitable fluid or gas including, but not limited to, water, steam, an oil, a coolant (e.g., glycols), a gas (e.g., air, carbon dioxide, argon, helium, oxygen, nitrogen), a molten metal, a molten metal alloy, a fluidized bed, or a molten salt. Suitable molten metals or metal alloys used for thethermal fluid 512 may include Pb, Bi, Pb—Bi, K, Na, Na—K, Ga, In, Sn, Li, Zn, or any alloys thereof. Suitable molten salts used for thethermal fluid 512 include alkali fluoride salts (e.g., LiF—KF, LiF—NaF—KF, LiF—RbF, LiF—NaF—RbF), BeF2 salts (e.g., LiF—BeF2, NaF—BeF2, LiF—NaF—BeF2), ZrF4 salts (e.g., KF—ZrF4, NaF—ZrF4, NaF—KF—ZrF4, LiF—ZrF4, LiF—NaF—ZrF4, RbF—ZrF4), chloride-based salts (e.g., LiCl—KCl, KCl—MgCl2, NaCl—MgCl2, LiCl—KCl—MgCl2, KCl—NaCl—MgCl2), fluoroborate-based salts (e.g., NaF—NaBF4, KF—KBF4, RbF—RbBF4), or nitrate-based salts (e.g., NaNO3—KNO3, Ca(NO3)2—NaNO3—KNO3, LiNO3—NaNO3—KNO3), and any alloys thereof. - One or
more nozzles 514 may be positioned within thefluid reservoir 506 and otherwise configured to eject thethermal fluid 512 such that it impinges on abottom surface 516 of the quenchplate 502. The quenchplate 502 may be impermeable to thethermal fluid 512 and otherwise prevent thethermal fluid 512 from coming into direct contact with themold assembly 300. Instead, thethermal fluid 512 may thermally communicate with themold assembly 300 across or through the quenchplate 502 via thermal conduction and subsequently flow into thefluid reservoir 506 for recycling or disposal. As used herein, the term “thermally communicate,” or any variation thereof, refers to the ability to exchange thermal energy between thethermal fluid 512 and themold assembly 300 and/or its contents, even across the quenchplate 502. - Any vapor that may be generated from contacting the
thermal fluid 512 on thebottom surface 516 of the quench plate may either condense into thefluid reservoir 506 or migrate along thebottom surface 516 of the quenchplate 502 until eventually locating thegap 510 and escaping into the surrounding environment outside of theinsulation enclosure 406. In some embodiments, however, the quenchplate 502 may sealingly engage and otherwise form a seal against theshoulder 508 and thereby prevent the efflux of vapor into the surrounding environment. In such embodiments, a pressure-release line (not shown) may be included to relieve any built-up pressure in thefluid reservoir 506 caused by the vapor. - The
insulation enclosure 406 may prevent any escaping vapor from entering theinterior 518 of theinsulation enclosure 406 and, upon contacting the cooler air of the surrounding environment, some of the vapor may condense and flow back into thefluid reservoir 506 via thegap 510. Furthermore, the interior 518 may be sealed off using an appropriate member between the quenchplate 502 andinsulation enclosure 406. In such embodiments, the interior 518 may be evacuated to provide a vacuum (and thermal insulation) between theinsulation enclosure 406 and themold assembly 300. Alternatively, the interior 518 may be filled with a controlled atmosphere by flowing in a gas, such as argon or helium, at an elevated temperature to promote directional solidification of the contents of themold assembly 300 by insulating the upper portions ofmold assembly 300 while its bottom portion is cooled via the quenchplate 502. - The quench
plate 502 may be made of a variety of materials that help facilitate thermal energy transfer from themold assembly 300 to thethermal fluid 512. Suitable materials for the quenchplate 502 include, but are not limited to, a ceramic (e.g., oxides, carbides, borides, nitrides, silicides), a metal (e.g., steel, stainless steel, nickel, tungsten, titanium or alloys thereof), alumina, graphite, diamond, graphene, and any combination thereof.FIGS. 5A-5C depict various exemplary designs and configurations of the quenchplate 502 that may be employed to help cool themold assembly 300 while simultaneously isolating themold assembly 300 from thethermal fluid 512 and any vapor generated therefrom. - In
FIG. 5A , for example, the quenchplate 502 may comprise a monolithic slab or block of material having a generally uniform thickness. As illustrated, asingle nozzle 514 may be positioned within thefluid reservoir 506 and otherwise configured to eject thethermal fluid 512 such that it impinges on thebottom surface 516 at or near the center of the quenchplate 502. As will be appreciated, more than onenozzle 514 may be employed, without departing from the scope of the disclosure. - In
FIG. 5B , the quenchplate 502 is depicted as an arched member and otherwise narrowing toward its center. More particularly, the thickness of the quenchplate 502 may be greater at its outer periphery as compared to the center. As will be appreciated, this configuration provides less mass at or near the center of the quenchplate 502, thereby allowing for quicker heat conduction through the reduced-mass sections.FIG. 5B also illustrates a plurality of nozzles 514 (three shown) configured to eject thethermal fluid 512 such that it impinges on thebottom surface 516 across a larger area as compared to thesingle nozzle 514 ofFIG. 5A . In another embodiment, thebottom surface 516 may be designed in conjunction with thenozzles 514 to facilitate attachment of a cooling film to thebottom surface 516, eliminate a vapor boundary layer at thebottom surface 516, and/or promote turbulent flow at the interface between the quenchplate 502 and thethermal fluid 512. - In
FIG. 5C , the quenchplate 502 may provide one or more grooves 520 (three shown) defined into thebottom surface 516 thereof. Thegrooves 520 may prove advantageous in providing local zones in the quenchplate 502 that provide less mass and thereby allow for quicker heat conduction through the quenchplate 502 at those areas. Alternatively, or in addition thereto, thegrooves 520 may facilitate attached fluid flow along thebottom surface 516, thereby enhancing the heat-transfer rate. As illustrated, thethermal sink system 500 c may include a nozzle 514 (three shown) aligned with eachgroove 520 to eject thethermal fluid 512 into thegrooves 520 and thereby provide for locally increased heat transfer. Eachnozzle 514 may be oriented at a specific angle with respect to thebottom surface 516, such as perpendicular (90°, as shown), 60°, 45°, 30°, 0°, or any orientation within the 0-90° range to optimize fluid flow and heat transfer via the quenchplate 502 alongbottom surface 516. - The quench
plate 502 design ofFIG. 5C may function as a type of heat exchanger, with the thicker portions of the quenchplate 502 between thegrooves 520 simulating or otherwise serving as at type of heat-exchanging fins. As will be appreciated, various designs and configurations of thegrooves 520 may be integrated into the quenchplate 520 as heat-exchanging features that include, but are not limited to, protruding knobs, fins, cylinders, coils, tubes, bundled tubes, concentric tubes, plates, corrugated plates, strips, shells, baffles, channels, micro-channels, finned coils, finned plates, finned strips, louvered fins, wavy fins, pin fins, and the like, or any combination thereof to make thebottom surface 516 of the quenchplate 502 operate as a heat exchanger. Alternatively, such heat-exchanging features may be integrated in other locations on thebottom surface 516 of a quenchplate 502 to enhance heat transfer between the quenchplate 502 and thefluid reservoir 506. - Referring now to
FIG. 6 , with continued reference toFIGS. 5A-5C , illustrated is a partial cross-sectional side view of another exemplarythermal sink system 600 that may be used to cool themold assembly 300, according to one or more embodiments. Thethermal sink system 600 may be similar in some respects to the thermal sink systems 500 a-c ofFIGS. 5A-5C , respectively, and therefore may be best understood with reference thereto, where like numerals represent like components not described again in detail. As illustrated, thethermal sink system 600 may include the quenchplate 502, the table 504 that supports the quenchplate 502, and thefluid reservoir 506 disposed below the quenchplate 502. Moreover, themold assembly 300 may be positioned on the quenchplate 502 and theinsulation enclosure 406 may be disposed about themold assembly 300 and rest on the quenchplate 502. - Unlike the thermal sink systems 500 a-c of
FIGS. 5A-5C , however, thethermal sink system 600 may include one ormore flow channels 602 defined within and otherwise through the quenchplate 502. As illustrated, theflow channel 602 may extend between aninlet 604 a and anoutlet 604 b, and anozzle 514 or other type of piping or conduit may be configured to provide thethermal fluid 512 into theflow channel 602 via theinlet 604 a. In operation, thethermal fluid 512 may be provided to theinlet 604 a and flowed into theflow channel 602 and subsequently exit theflow channel 602 at theoutlet 604 b where it flows into thefluid reservoir 506 for recycling or disposal. While circulating through theflow channel 602, thethermal fluid 512 may thermally communicate (i.e., exchange thermal energy) with themold assembly 300 across or through the quenchplate 502 via thermal conduction. - The
flow channel 602 may prove advantageous in allowing thethermal fluid 512 to thermally communicate with themold assembly 300 through the quenchplate 502 while simultaneously preventing thethermal fluid 512 from coming into direct contact with themold assembly 300. Any vapor that may be generated as thethermal fluid 512 circulates through theflow channel 602 may either condense into thefluid reservoir 506 or migrate along thebottom surface 516 of the quenchplate 502 until eventually locating thegap 510 and escaping into the surrounding environment outside of theinsulation enclosure 406. - The
flow channel 602 defined in the quenchplate 502 may exhibit various configurations and designs while isolating themold assembly 300 from contact with thethermal fluid 512 or vapor generated therefrom.FIGS. 7A-7C , for example, show at least three exemplary designs for theflow channel 602 that may be employed in the quenchplate 502 to provide enhanced or more controlled thermal profiles for themold assembly 300. InFIG. 7A , theflow channel 602 may provide a plurality ofbranches 702 that extend from a common and/orcentralized inlet 604 a. Each of thebranches 702 may be fedthermal fluid 512 from thecentral inlet 604 a and may terminate in acorresponding outlet 604 b. - In
FIG. 7B , theflow channel 602 is depicted as comprising a plurality of flow channels shown asflow channels flow channel 602 a-c may be configured to circulate thethermal fluid 512 between aninlet 604 a and anoutlet 604 b. In the illustrated embodiment, theflow channels 602 a-c each form a generally angled or triangular flow pathway. It will be appreciated, however, that other designs or configurations of theflow channels 602 a-c may alternatively be employed, without departing from the scope of the disclosure. Moreover, while only threeflow channels 602 a-c are depicted inFIG. 7B (six if the full quenchplate 502 were shown past the centerline), it will be appreciated that more or less than threeflow channels 502 a-c may be employed. - In
FIG. 7C , theflow channel 602 is depicted as asingle flow channel 602 that is spiraled or coiled within the quenchplate 502. As illustrated, theflow channel 602 may include theinlet 604 a located at or near the center of the quenchplate 502, and theoutlet 604 b located adjacent the outer periphery of the quenchplate 502. It will be appreciated that several other designs for theflow channel 602 may be possible and are contemplated as being within the scope of the present disclosure. - Referring now to
FIGS. 8A and 8B , illustrated are partial cross-sectional side views of other exemplary thermal sink systems 800 that may be used to cool themold assembly 300, according to one or more embodiments. More particularly,FIG. 8A depicts a firstthermal sink system 800 a, andFIG. 8B depicts a secondthermal sink system 800 b. Thethermal sink systems 800 a,b may be similar in some respects to the thermal sink systems 500 a-c and 600 ofFIGS. 5A-5C and 6 , respectively, and therefore may be best understood with reference thereto, where like numerals represent like components not described again in detail. As illustrated, eachthermal sink system 800 a,b may include the quenchplate 502, the table 504 that supports the quenchplate 502, and thefluid reservoir 506 disposed below the quenchplate 502. Moreover, themold assembly 300 may be positioned on the quenchplate 502 and theinsulation enclosure 406 may be disposed about themold assembly 300 and rest on the quenchplate 502. - Unlike the thermal sink systems 500 a-c and 600 of
FIGS. 5A-5C and 6 , however, the quenchplate 502 of thethermal sink systems 800 a,b may comprise a multi-component structure. More particularly, the quenchplate 502 may define anaperture 802 configured to receive and seat aninsert 804 that forms part of the quenchplate 502. In some embodiments, as illustrated, theaperture 802 may provide aradial shoulder 806 configured to support theinsert 804 within theaperture 802 as the quenchplate 502 is supported by the table 504 at theshoulder 508. In other embodiments, theaperture 802 may receive theinsert 804 via a threaded engagement or theinsert 804 may be secured within theaperture 802 using one or more mechanical fasteners (e.g., screws, bolts, snap rings, pins, etc.). The use of a compression fitting may be necessary in some cases to provide a complete seal along the interface between theinsert 804 and the quenchplate 502. Additionally, an appropriate sealing material or device (e.g., O-ring, etc.) may be positioned between theinsert 804 and quenchplate 502 to further prevent thethermal fluid 512 or vapor from entering the interior 518. In at least one embodiment, theinsert 804 may be permanently bonded to the quenchplate 502 using an appropriate method, such as brazing or welding. Moreover, in some embodiments, as illustrated, theaperture 802 may be defined at or near the center of the quenchplate 502. In other embodiments, however, theaperture 802 may alternatively be defined off-center, without departing from the scope of the disclosure. - The
insert 804 may be made of a variety of materials configured to provide different thermal properties (e.g., thermal conductivity) intended to produce different thermal profiles in themold assembly 300 during the cooling process. Suitable materials for theinsert 804 include, but are not limited to, a ceramic (e.g., oxides, carbides, borides, nitrides, silicides), a metal (e.g., steel, stainless steel, nickel, copper, tungsten, titanium or alloys thereof), alumina, graphite, and any combination thereof. In some embodiments, theinsert 804 and the quenchplate 502 may be made of the same material. In other embodiments, however, theinsert 804 and the quenchplate 502 may be made of dissimilar materials. The material of theinsert 804 may prove advantageous in quickly drawing heat out of themold assembly 300 during operation whereas the material of the quenchplate 502 may prove advantageous in retaining heat in theinsulation enclosure 406 and/or the interior 518, thereby promoting directional solidification of themold assembly 300 and its contents. - As illustrated, the
insert 804 inFIG. 8A is smaller than theinsert 804 ofFIG. 8B . InFIG. 8A , onenozzle 514 is depicted as ejecting thethermal fluid 512 such that it impinges on thebottom surface 516 of the quenchplate 502 and, more particularly, on a bottom orunderside 808 of theinsert 804. InFIG. 8B , a plurality of nozzles 514 (four shown) are depicted as ejecting thethermal fluid 512 such that it impinges on theunderside 808 of theinsert 804. As thethermal fluid 512 contacts theinsert 804, thermal energy may be transferred from themold assembly 300, through theinsert 804, and to thethermal fluid 512. - Referring now to
FIG. 9 , with continued reference to the prior figures, illustrated is an isometric view of an exemplary quenchplate 900, according to one or more embodiments. The quenchplate 900 may be similar in some respects to the quenchplate 502 described above, and therefore able to prevent exposure of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B ) to the thermal fluid 512 (FIGS. 5A-5C, 6, 8A-8B ) that is used to cool themold assembly 300 and any resulting vapor generated by thethermal fluid 512. In the illustrated embodiment, the quenchplate 900 may include one or more backstops 902 (shown asbackstops mold assembly 300 during the transfer process from the furnace 402 (FIG. 4A ) to the quenchplate 900. - Three imaginary mold base diameters 904 are depicted on the quench
plate 900 as 904 a, 904 b, and 904 c. Each mold base diameter 904 a-c corresponds generally to a size of the bottom 418 (FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B ), and each mold base diameter 904 a-c provides a different design or type of backstop 902 configured to receive and center themold assembly 300 on the quenchplate 900. More particularly, the first and smallestmold base diameter 904 a illustrates afirst backstop 902 a design, the secondmold base diameter 904 b illustrates asecond backstop 902 b design, and the third and largestmold base diameter 904 c illustrates athird backstop 902 c design. - The
first backstop 902 a may include or otherwise provide two or more pegs 906 (three shown) positioned at predetermined locations about the circumference of the firstmold base diameter 904 a and otherwise protruding from the upper surface of the quenchplate 900. Thepegs 906 may be configured to receive the bottom 418 (FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B ) as themold assembly 300 is moved in the direction A toward thepegs 906. Thepegs 906 may be spaced from each other about the circumference of the firstmold base diameter 904 a such that themold assembly 300 is received by thepegs 906 and simultaneously concentrically located on the quenchplate 900 around thecenter 908. - While three
pegs 906 are shown, it will be appreciated that more or less (i.e., two) than threepegs 906 can be employed, without departing from the scope of the disclosure. In some embodiments, one or more of thepegs 906 may be inserted into corresponding apertures defined on the upper surface of the quenchplate 900. In other embodiments, one or more of thepegs 906 may be threaded into such apertures. In yet other embodiments, one or more of thepegs 906 may penetrate the quenchplate 900 and may be secured to the quenchplate 900 on its underside, such as through the use of a nut and water-tight washer combination. - The
second backstop 902 b may include or otherwise provide two or more blocks 910 (three shown) positioned about the circumference of the secondmold base diameter 904 b and otherwise protruding from the upper surface of the quenchplate 900. Similar to thepegs 906, theblocks 910 may be configured to receive the bottom 418 (FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B ) as themold assembly 300 is moved in the direction A toward theblocks 910. Theblocks 910 may be spaced from each other about the circumference of the secondmold base diameter 904 b such that themold 300 is received by theblocks 910 and simultaneously located on the quenchplate 900 at thecenter 908. While threeblocks 910 are shown, it will be appreciated that more or less (i.e., two) than threeblocks 910 can be employed, without departing from the scope of the disclosure. In other embodiments, theblocks 910 may be combined into a single arcuate member configured to receive and locate themold assembly 300 at thecenter 908. In some embodiments, one or more of theblocks 910 may be inserted into corresponding polygonal apertures defined on the upper surface of the quenchplate 900. In other embodiments, one or more of theblocks 910 may be secured to the upper surface of the quenchplate 900 using one or more mechanical fasteners, such as screws or bolts that thread into the upper surface of the quenchplate 900. - The
third backstop 902 c may include anelongate member 912 positioned on the thirdmold base diameter 904 c. While shown inFIG. 9 as generally straight, in at least one embodiment, theelongate member 912 may be curved or otherwise arcuate in shape. In some embodiments, theelongate member 912 may be anchored to the quenchplate 900 using one or more mechanical fasteners 914 (one shown in exploded view), such as bolts, screws, pegs, snap rings, etc. In other embodiments, theelongate member 912 may be anchored to the table 504 (FIGS. 5A-5C, 6, 8A-8B ) using the same type of mechanical fasteners 916 (one shown in exploded view). Theelongate member 912 may be configured to receive the bottom 418 (FIGS. 5A-5C, 6, 8A-8B ) of the mold assembly 300 (FIGS. 5A-5C, 6, 8A-8B ) as themold assembly 300 is moved in the direction A toward theelongate member 912. Once themold assembly 300 is located on the quenchplate 900 around thecenter 908, theelongate member 912 may be removed or otherwise movable, such as via an actuation member, to accommodate the insulation enclosure 406 (FIGS. 5A-5C, 6, 8A-8B ) being lowered onto the upper surface of the quenchplate 900. In other embodiments, however, theelongate member 912 may be a recessable member, either via an actuation member or with a curved top surface so that the vertical force from theinsulation enclosure 406 may force theelongate member 912 to lower. - As will be appreciated, any of the backstops 902 a-c described above may be employed at any of the mold base diameters 904 a-c and in any combination, if desired. Moreover, it will be appreciated that the various embodiments described and illustrated herein may be combined in any combination, in keeping within the scope of this disclosure. Indeed, variations in the size and configuration of any of the thermal sink systems described herein may be implemented in any of the embodiments, as generally described herein, without departing from the scope of the disclosure.
- Embodiments disclosed herein include:
- A. A thermal sink system that includes a quench plate having an upper surface for receiving a mold assembly to be cooled, and a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, wherein the quench plate interposes the thermal fluid and the mold assembly and thereby prevents the thermal fluid from contacting the mold assembly.
- B. A method of cooling a mold assembly that includes positioning the mold assembly on an upper surface of a quench plate, placing a thermal fluid in thermal communication with the mold assembly via conduction through the quench plate, and preventing the thermal fluid from contacting the mold assembly with the quench plate.
- Each of embodiments A and B may have one or more of the following additional elements in any combination: Element 1: wherein the thermal fluid is a fluid selected from the group consisting of water, steam, an oil, a coolant, a gas, a molten metal, a molten metal alloy, a fluidized bed, and a molten salt. Element 2: further comprising a table having a shoulder that receives and supports the quench plate, and a fluid reservoir arranged below the quench plate. Element 3: wherein the quench plate sealingly engages the table. Element 4: further comprising one or more nozzles arranged to eject the thermal fluid such that the thermal fluid impinges on a bottom surface of the quench plate. Element 5: wherein the quench plate is arched such that a thickness of the quench plate is greater at an outer periphery as compared to a thickness of the quench plate at a center location. Element 6: further comprising one or more grooves defined in a bottom surface of the quench plate. Element 7: further comprising one or more nozzles arranged to eject the thermal fluid into the one or more grooves. Element 8: further comprising one or more heat-exchanging features defined in a bottom surface of the quench plate. Element 9: further comprising one or more flow channels defined in the quench plate for circulating the thermal fluid. Element 10: wherein the one or more flow channels comprise a plurality of branches extending from a common inlet. Element 11: wherein the one or more flow channels comprise a single, spiraling flow channel. Element 12: wherein the quench plate defines an aperture and includes an insert receivable into the aperture. Element 13: wherein the insert comprises a thermally conductive material selected from the group consisting of a ceramic, a metal, alumina, graphite, and any combination thereof. Element 14: wherein the insert and the quench plate are made of dissimilar materials. Element 15: further comprising a backstop to locate the mold assembly at a desired location on the upper surface of the quench plate. Element 16: wherein the backstop is at least one of two or more pegs protruding from the upper surface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the upper surface of the quench plate, an elongate member, and an arcuate member. Element 17: further comprising an insulation enclosure that rests on the upper surface of the quench plate and provides an interior for receiving the mold assembly, the quench plate further preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure.
- Element 18: further comprising positioning an insulation enclosure over the mold assembly such that the mold assembly is received into an interior of the insulation enclosure and the insulation enclosure rests on the upper surface of the quench plate, and preventing vapor generated by the thermal fluid from migrating into the interior of the insulation enclosure with the quench plate. Element 19: wherein placing the thermal fluid in thermal communication with the mold assembly comprises ejecting the thermal fluid from one or more nozzles such that the thermal fluid impinges on a bottom surface of the quench plate. Element 20: wherein the bottom surface of the quench plate defines one or more grooves, the method further comprising ejecting the thermal fluid from the one or more nozzles into the one or more grooves. Element 21: wherein the bottom surface of the quench plate defines one or more heat-exchanging features, the method further comprising placing at least one of the thermal fluid and a fluid reservoir in thermal communication with the mold assembly via conduction through the quench plate. Element 22: wherein ejecting the thermal fluid from the one or more nozzles comprises at least one of reducing a vapor boundary layer at the bottom surface of the quench plate, and promoting turbulent flow at the bottom surface of the quench plate. Element 23: wherein placing the thermal fluid in thermal communication with the mold assembly comprises circulating the thermal fluid through one or more flow channels defined in the quench plate. Element 24: wherein the quench plate defines an aperture and includes an insert receivable into the aperture, the method further comprising placing the thermal fluid in thermal communication with the mold assembly via conduction through the insert as received in the aperture of the quench plate. Element 25: wherein positioning the mold assembly on the upper surface of the quench plate comprises locating the mold assembly at a desired location on the upper surface of the quench plate with a backstop, wherein the backstop is at least one of two or more pegs protruding from the upper surface of the quench plate, one or more blocks protruding from the upper surface of the quench plate, an arcuate block member protruding from the upper surface of the quench plate, an elongate member, and an arcuate member.
- By way of non-limiting example, exemplary combinations applicable to A, B, and C include: Element 2 with Element 3; Element 6 with Element 7; Element 9 with Element 10; Element 9 with Element 11; Element 12 with Element 13; Element 12 with Element 14; Element 15 with Element 16; Element 19 with Element 20; Element 19 with Element 21; and Element 19 with Element 22.
- Therefore, the disclosed systems and methods are well adapted to attain the ends and advantages mentioned as well as those that are inherent therein. The particular embodiments disclosed above are illustrative only, as the teachings of the present disclosure may be modified and practiced in different but equivalent manners apparent to those skilled in the art having the benefit of the teachings herein. Furthermore, no limitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particular illustrative embodiments disclosed above may be altered, combined, or modified and all such variations are considered within the scope of the present disclosure. The systems and methods illustratively disclosed herein may suitably be practiced in the absence of any element that is not specifically disclosed herein and/or any optional element disclosed herein. While compositions and methods are described in terms of “comprising,” “containing,” or “including” various components or steps, the compositions and methods can also “consist essentially of” or “consist of” the various components and steps. All numbers and ranges disclosed above may vary by some amount. Whenever a numerical range with a lower limit and an upper limit is disclosed, any number and any included range falling within the range is specifically disclosed. In particular, every range of values (of the form, “from about a to about b,” or, equivalently, “from approximately a to b,” or, equivalently, “from approximately a-b”) disclosed herein is to be understood to set forth every number and range encompassed within the broader range of values. Also, the terms in the claims have their plain, ordinary meaning unless otherwise explicitly and clearly defined by the patentee. Moreover, the indefinite articles “a” or “an,” as used in the claims, are defined herein to mean one or more than one of the element that it introduces. If there is any conflict in the usages of a word or term in this specification and one or more patent or other documents that may be incorporated herein by reference, the definitions that are consistent with this specification should be adopted.
- As used herein, the phrase “at least one of” preceding a series of items, with the terms “and” or “or” to separate any of the items, modifies the list as a whole, rather than each member of the list (i.e., each item). The phrase “at least one of” allows a meaning that includes at least one of any one of the items, and/or at least one of any combination of the items, and/or at least one of each of the items. By way of example, the phrases “at least one of A, B, and C” or “at least one of A, B, or C” each refer to only A, only B, or only C; any combination of A, B, and C; and/or at least one of each of A, B, and C.
Claims (27)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/US2014/068026 WO2016089362A1 (en) | 2014-12-02 | 2014-12-02 | Thermal sink systems for cooling a mold assembly |
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US20160346835A1 true US20160346835A1 (en) | 2016-12-01 |
Family
ID=56092126
Family Applications (1)
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US14/889,260 Abandoned US20160346835A1 (en) | 2014-12-02 | 2014-12-02 | Thermal sink systems for cooling a mold assembly |
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US (1) | US20160346835A1 (en) |
WO (1) | WO2016089362A1 (en) |
Cited By (3)
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US20160305191A1 (en) * | 2014-06-25 | 2016-10-20 | Halliburton Energy Services, Inc. | Insulation enclosure with compliant independent members |
CN109128109A (en) * | 2018-07-28 | 2019-01-04 | 宁国市金优机械配件有限公司 | A kind of cooling device for ironcasting with remote manipulator |
US11027368B2 (en) | 2017-08-02 | 2021-06-08 | General Electric Company | Continuous additive manufacture of high pressure turbine |
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