US20160143170A9 - Graphic Formation via Material Ablation - Google Patents
Graphic Formation via Material Ablation Download PDFInfo
- Publication number
- US20160143170A9 US20160143170A9 US13/784,746 US201313784746A US2016143170A9 US 20160143170 A9 US20160143170 A9 US 20160143170A9 US 201313784746 A US201313784746 A US 201313784746A US 2016143170 A9 US2016143170 A9 US 2016143170A9
- Authority
- US
- United States
- Prior art keywords
- ablation
- coating
- trench
- surface layer
- ablation trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0252—Labels, e.g. for identification, markings or configuration store
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/028—Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
- G06F3/0202—Constructional details or processes of manufacture of the input device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12361—All metal or with adjacent metals having aperture or cut
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
- Y10T428/12396—Discontinuous surface component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
- Y10T428/12826—Group VIB metal-base component
- Y10T428/12847—Cr-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
- Y10T428/12826—Group VIB metal-base component
- Y10T428/12847—Cr-base component
- Y10T428/12854—Next to Co-, Fe-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Definitions
- Many products include some form of graphic ornamentation, such as for decoration, to identify a source of a product (e.g., a logo), to indicate functionality associated with a product, and so on.
- graphic ornamentation such as for decoration
- a source of a product e.g., a logo
- a variety of techniques can be utilized to apply graphics to a product.
- a graphic can be applied via a printed item that is adhered to a surface of a product using a suitable adhesive.
- a suitable adhesive for instance, a decal. While decals can be convenient to produce and apply, they can often be easily damaged and/or removed.
- a graphic applied with a coating may also be easily damaged, and thus detract from the appearance of the graphic.
- Screen printing is another technique that can be employed to apply a graphic to a product. While screen printing is useful in certain scenarios, it can introduce complexity into a production process that can increase product cost and/or production time for bringing a product to market. Thus, many current techniques for applying graphics suffer from a number of drawbacks.
- specifications are provided (e.g., via user input) for a graphic to be applied to a surface of an object.
- the graphic for instance, can be some form of an image, such as a logo, a visual pattern and/or design, a word and/or phrase, artwork, and so on.
- the object can be configured as an instance of a wide variety of different objects, such as a computing device (e.g., a mobile computing device), a toy, a vehicle, and/or any other object that includes a surface upon which a graphic can be applied.
- a computing device e.g., a mobile computing device
- a toy e.g., a vehicle
- an ablation trench in the shape of the graphic can be applied to a surface of the object.
- the ablation trench is generated by removing material from the surface of the object in the shape of the graphic, such as via laser ablation.
- an object can include a surface layer and one or more sublayers of materials.
- the object can be plated with different layers, such as metals, metal alloys, resins, and so forth.
- the ablation trench can penetrate into a surface layer to form a particular graphic.
- the ablation trench can penetrate the surface layer of the object and into an intermediate layer. For instance, a lowermost portion (e.g., bottom) of the ablation trench can penetrate into the intermediate layer, without penetrating a lower layer beneath the intermediate layer.
- this can enable a coating that will adhere to the ablation trench (e.g., the material of the intermediate layer) to be applied to the ablation trench and the object surface.
- the coating for instance, can be a thin coating that can be applied to the ablation trench and the surrounding surface of the object.
- the coating can provide various properties to the ablation trench and the surrounding surface, such as color tinting, scratch resistance, fingerprint resistance, and so on.
- height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same coating.
- FIG. 1 is an illustration of an environment in an example implementation that is operable to employ the techniques described herein in accordance with one or more embodiments.
- FIG. 2 depicts an example implementation scenario of techniques discussed herein in accordance with one or more embodiments.
- FIG. 3 depicts an example implementation scenario of techniques discussed herein in accordance with one or more embodiments.
- FIG. 4 depicts a magnified sectional view of an object processed according to techniques discussed herein and in accordance with one or more embodiments.
- FIG. 5 depicts an example implementation scenario of techniques discussed herein in accordance with one or more embodiments.
- FIG. 6 illustrates a flow diagram that describes steps in a method in accordance with one or more embodiments.
- FIG. 7 illustrates an example system including various components of an example device that can be implemented as any type of computing device as described with reference to FIG. 1 to implement embodiments of the techniques described herein.
- specifications are provided (e.g., via user input) for a graphic to be applied to a surface of an object.
- the graphic for instance, can be some form of an image, such as a logo, a visual pattern and/or design, a word and/or phrase, artwork, and so on.
- the object can be configured as an instance of a wide variety of different objects, such as a computing device (e.g., a mobile computing device), a toy, a vehicle, and/or any other object that includes a surface upon which a graphic can be applied.
- a computing device e.g., a mobile computing device
- a toy e.g., a vehicle
- an ablation trench in the shape of the graphic can be applied to a surface of the object.
- the ablation trench is generated by removing material from the surface of the object in the shape of the graphic, such as via laser ablation.
- an object can include a surface layer and one or more sublayers of materials.
- the object can be plated with different layers, such as metals, metal alloys, resins, and so forth.
- the ablation trench can penetrate into a surface layer to form a particular graphic.
- the ablation trench can penetrate the surface layer of the object and into an intermediate layer. For instance, a lowermost portion (e.g., bottom) of the ablation trench can penetrate into the intermediate layer, without penetrating a lower layer beneath the intermediate layer.
- this can enable a coating that will adhere to the ablation trench (e.g., the material of the intermediate layer) to be applied to the ablation trench and the object surface.
- the coating for instance, can be a thin coating that can be applied to the ablation trench and the surrounding surface of the object.
- the coating can provide various properties to the ablation trench and the surrounding surface, such as color tinting, scratch resistance, fingerprint resistance, and so on.
- height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same coating.
- Example Environment discusses an example environment that may employ techniques described herein. Embodiments discussed herein are not limited to the example environment, and the example environment is not limited to embodiments discussed herein.
- Example Implementation Scenarios discusses some example implementation scenarios in accordance with one or more embodiments.
- Example Procedure describes an example procedure in accordance with one or more embodiments.
- FIG. 1 is an illustration of an environment 100 in an example implementation that is operable to employ the techniques described herein.
- the environment 100 includes a control device 102 , which can be configured as a computing device that is capable of performing various operations.
- One example implementation of the control device 102 is discussed below with reference to FIG. 6 .
- the control device 102 includes and/or is operably associated with an ablation device 104 , which is configured to remove material from an object surface and/or other layer according to techniques discussed herein.
- the ablation device 104 can include a mechanism capable of generating a laser that can be controlled to remove material from an object.
- a variety of other ablation mechanisms and/or techniques may be employed within the spirit and scope of the claimed embodiments.
- the control device 102 further includes and/or is further operably associated with a coating device 106 , which is representative of functionality to apply various types of coatings to objects.
- a coating device 106 which is representative of functionality to apply various types of coatings to objects.
- suitable coatings which may be applied via the coating device 106 include thin films (e.g., via physical vapor deposition (PVD), chemical vapor deposition (CVD), and so on), anti-fingerprint (AFP) coatings (e.g., lipophobic and/or hydrophobic coatings), nano-coatings, and so on.
- PVD physical vapor deposition
- CVD chemical vapor deposition
- AFP anti-fingerprint
- I/O module 108 is configured to receive various types of input, such as input from a user, another device, a data storage medium, and so on.
- input to the I/O module 108 can include specifications for a graphic to be applied to an object.
- the specifications can include dimensions for a graphic, such as width, length, ablation depth, and so on.
- Input to the I/O module 108 may also include coating specifications, such as coating type, color specifications, coating depth, and so on.
- the ablation control module 110 represents functionality to control various operations of the ablation device 104 .
- the ablation control module 110 can represent a driver that provides an interface to the ablation device 104 from the I/O module 108 .
- a coating control module 112 is further included, which represents functionality to control operation of the coating device 106 .
- the coating control module 112 can represent a driver that provides an interface to the coating device 106 from the I/O module 108 .
- the environment 100 further includes an object 114 , which is representative of an instance of various physical objects upon which graphics can be applied according to techniques discussed herein.
- the object 114 can be configured as a wide variety of different objects, such as a computing device (e.g., a mobile computing device), a toy, a vehicle, and/or any other object that includes a surface upon which a graphic can be applied.
- the object 114 is processed by the control device 102 to produce a marked object 116 .
- the marked object 116 includes a surface 118 upon which a graphic 120 is applied according to techniques discussed herein.
- the I/O module 108 receives input (e.g., user input) that includes specifications for the graphic 120 , e.g., ablation coordinates to be applied to the surface 118 .
- the specifications are passed to the ablation control module 110 , which controls operation of the ablation device 104 to remove material from the surface 118 .
- Control of the ablation device 104 can include control of various operational attributes, such as laser power (e.g., flux), laser pulse duration and/or frequency, physical movement of the ablation device 104 relative to the surface 118 , and so forth.
- the ablation trench 122 represents a perforation in a surface plane of the surface 118 caused by the removal of the material.
- depth of the ablation trench 122 can be specified to attain various visual and/or physical properties for the marked object 116 and/or the graphic 120 .
- the surface 118 may be coated by the coating device 106 with one or more types of coatings.
- application of a coating can tint and/or color the surface 118 and the graphic 120 .
- Application of a coating can also increase surface durability, such as by providing resistance to fingerprinting, scratch resistance, and so on.
- FIG. 2 illustrates an example implementation scenario 200 according to techniques described herein.
- the upper portion of the scenario 200 illustrates a side view of an object 202 with a surface 204 . Also illustrated is a partial cutaway view of the object 202 , which reveals layering of material beneath the surface 204 .
- the object 202 includes a surface layer 206 , the top portion of which forms the surface 204 . Beneath the surface layer 206 is a substrate 208 .
- the substrate 208 can form at least a portion of an internal portion of the object 202 , such as a housing for the object.
- the substrate 208 can form an internal surface of a chassis for the mobile computing device.
- the substrate 208 and the surface layer 206 can be formed from various materials, such as metals, alloys, compounds, resins, and so forth.
- the substrate 208 is formed from a magnesium alloy.
- substrates formed from other materials may be employed as well, such as different metals and/or metal alloys, resins, plastics, and so on.
- the surface 204 is ablated (e.g., using the ablation device 104 ) to generate an ablation trench 210 .
- the ablation trench 210 is created by removing material from the surface layer 206 to create a perforation in the surface 204 .
- the ablation trench 210 in its entirety corresponds to a pre-specified graphic.
- the ablation trench 210 can correspond to a shape for a particular graphic, such as the graphic 120 discussed above with reference to environment 100 .
- FIG. 3 illustrates an example implementation scenario 300 according to techniques described herein.
- the upper portion of the scenario 300 illustrates a side view of an object 302 with a surface 304 . Also illustrated is a partial cutaway view of the object 302 , which reveals layering of material beneath the surface 304 .
- the object 302 includes a surface layer 306 , the top portion of which forms the surface 304 . Beneath the surface layer 306 are a first sublayer 308 and a second sublayer 310 .
- the second sublayer 310 is placed on a substrate 312 .
- the substrate 312 can form at least a portion of an internal portion of the object 302 , such as a housing for the object.
- the substrate 312 can form an internal surface of a chassis for the mobile computing device.
- the substrate 312 , the surface layer 306 , and the sublayers 308 , 310 can be formed from various materials, such as metals, alloys, compounds, resins, and so forth.
- the substrate 312 is formed from a magnesium alloy.
- substrates formed from other materials may be employed as well, such as different metals and/or metal alloys.
- the substrate 312 can be treated to improve adhesion properties for subsequent layers.
- the substrate 312 can be treated using a zincate process (e.g., a double zincate process) to deposit zinc on the surface of the substrate 312 prior to application of the second sublayer 310 to the substrate 312 .
- Zinc deposition on the substrate 312 can improve adhesion of the second sublayer 310 to the substrate 312 .
- the surface layer 306 and the sublayers 308 , 310 are adhered to the substrate 312 , such as utilizing various types of deposition and/or plating processes.
- the second sublayer 310 is formed from copper, such as from one or more forms of elemental copper, copper compounds, and so on.
- the first sublayer 308 is formed from nickel, such as from one or more forms of elemental nickel, nickel compounds, and so on.
- the surface layer 306 can be formed from chromium, such as from one or more forms of elemental chromium, chromium compounds, and so on.
- the surface layer 306 , the first sublayer 308 , and the second sublayer 310 can be adhered to the substrate 312 to form distinct layers of different materials.
- the surface layer 306 , the first sublayer 308 , and the second sublayer 310 can be applied according to various thicknesses and thickness variations. For instance, consider the following example specifications for each of the respective layers.
- Second sublayer 310 (1) Second sublayer 310 :
- the different thicknesses may be employed in accordance with the claimed embodiments. Further, the thicknesses of the different layers may be independently varied to obtain different variations of thicknesses between the different layers. In at least some embodiments, a layer or layers may be omitted.
- the surface 304 is ablated (e.g., using the ablation device 104 ) to generate an ablation trench 314 .
- the ablation trench 314 is created by removing material from the surface layer 306 and one or more of the sublayers to create a perforation in the surface 304 .
- the ablation trench 314 in its entirety corresponds to a pre-specified graphic.
- the ablation trench 314 can correspond to a shape for a particular graphic, such as the graphic 130 discussed above with reference to environment 100 .
- the ablation trench 314 passes through the surface layer 306 and into the first sublayer 308 , without penetrating an interface between the first sublayer 308 and the second sublayer 310 .
- the depth of the ablation trench 314 is such that a bottom the ablation trench 314 is within the first sublayer 308 , and such that the second sublayer 310 remains covered (e.g., sealed) by the first sublayer 308 .
- the ablation trench penetrates the first sublayer 308 at a depth range of 2 ⁇ -4 ⁇ . However, different penetration depths may be employed according to various embodiments.
- FIG. 4 illustrates a magnified section 400 of the side view of the object 302 , discussed above. Included as part of the section 400 are the surface 304 , the surface layer 308 , and the first sublayer 308 . Further illustrated is an ablation trench 402 .
- the ablation trench 402 includes surface variations 404 that result in varying depth for the ablation trench 402 .
- the surface variations 404 can cause the penetration depth of the ablation trench 402 into the first sublayer 308 to vary between 1 ⁇ -4 ⁇ .
- the surface variations 404 can cause variations in optical properties of a graphic generated using the ablation trench 402 .
- the surface variations 404 can increase the number and variation in reflective surfaces such that variations in light reflection and/or scattering occur.
- the surface variations 404 can be caused by variations in ablation.
- the ablation control module 110 can vary the power, distance (e.g., from the surface 304 ), and/or the angle of the ablation device 104 during an ablation process, thus resulting in the surface variations 404 .
- Variations in power for instance, can be caused by pulsing the ablation device 104 (e.g., laser pulsing) at different power levels during an ablation process.
- FIG. 5 illustrates an example implementation scenario 500 according to techniques described herein.
- the scenario 500 describes example ways of coating ablated objects, such as discussed above with reference to the scenarios 200 - 400 .
- the partial cutaway view of the object 302 as illustrated in FIG. 3 is presented, including the ablation trench 314 generated via ablation of portions of the object 302 .
- a first coating layer 502 is applied to the surface 304 .
- the first coating layer 502 can be a thin film, such as applied via PVD, CVD, and so forth.
- the first coating layer 502 can be applied using a chrome carbide PVD to achieve a particular color and/or tint for the first coating layer 502 .
- Other materials may additionally or alternatively be employed for the first coating layer 502 , such as titanium carbide, zirconium carbide, and/or other metal carbides, metal nitride coatings, and so forth.
- the first coating layer 502 can optionally include tinting and/or coloring that can change the optical appearance of the surface 304 .
- the first coating layer 502 can be applied to the surface 304 , including the ablation trench 314 , at an approximately consistent thickness.
- the first coating layer can be applied at a thickness that ranges from 0.4 ⁇ -1.2 ⁇ .
- the first coating layer 502 can be applied such that the surface 304 and the ablation trench 314 are uniformly colored.
- a second coating layer 504 is applied on top of the first coating layer 502 .
- the second coating layer 504 can be a protective material, such as an AFP coating, a scratch-resistance coating, a nano-coating, and so forth.
- the second coating layer 504 can be applied as a protectant for the first coating layer 502 and/or other layers, such as to prevent fingerprint adhesion, resist surface scratching, and so forth.
- the second coating layer 504 can be applied to the first coating layer 502 at an approximately uniform thickness.
- the thickness of the second coating layer 504 can range from 0.25 ⁇ -1.50 ⁇ .
- color measurement of the surface 304 and the ablation trench 314 when coated with the first coating layer 502 and the second coating layer 504 can indicate that the surface 304 and the ablation trench 314 are the same color.
- Differences in surface height between the surface 304 and the ablation trench 314 can result in differences in light reflection properties. For instance, specular and/or other reflection properties in response to incident light on the surface 304 and the ablation trench 314 can differ, causing visual color tonal differences between the surfaces. This can cause visually perceptible color differences between a graphic applied via the ablation trench 314 and a surrounding surface (e.g., the surface 304 ), even though the ablation trench 314 and the surrounding surface are coated with the same color.
- Surface variations in the ablation trench 314 may also contribute to differences in color perception between the surface 304 and the ablation trench 314 . As referenced above, such surface variations can cause variable light reflection and/or scattering properties in the ablation trench 314 . Such variable light properties can result in a visual perception of variation in color between the surface 304 and the ablation trench 314 , even though both may be coated with a uniformly colored coating.
- FIG. 5 is a flow diagram that describes steps in a method in accordance with one or more embodiments.
- Step 600 receives specifications for a graphic to be applied to a surface of an object.
- the I/O module 108 can receive input that includes various specifications for a graphic, such as a pattern for a graphic in terms of x and y coordinates.
- the specifications may also include an ablation depth and/or variations in ablation depth to be used to apply the graphic to the surface.
- Step 602 ablates the surface of the object based on the specifications to generate an ablation trench that corresponds to the graphic.
- the specifications can be provided from the I/O module 108 to the ablation control module 110 , which controls operation of the ablation device 104 to ablate the surface according to the specifications.
- the object can include multiple layers of material layered on top of a substrate.
- the ablation trench can penetrate a surface layer in the shape of the specified graphic.
- the trench depth can be specified such that a lowermost portion of the trench penetrates an intermediate layer without penetrating one or more lower layers.
- Step 604 coats the ablation trench and surrounding surface of the object with a finish coating.
- specifications for one or more coatings to be applied can be provided to the I/O module 108 , which can provide the coating specifications to the coating control module 112 .
- the coating control module 112 can control operation of the coating device 106 to apply a coating to the ablation trench and surrounding surfaces. Examples of finish coatings are discussed above, such as PVDs, AFPs, and so forth. As also discussed above, a finish coating can be tinted such that coloring is applied to the surface of the object and the ablation trench.
- FIG. 7 illustrates an example system generally at 700 that includes an example computing device 702 that is representative of one or more computing systems and/or devices that may implement the various techniques described herein.
- the computing device 702 may be, for example, be configured to assume a mobile configuration through use of a housing formed and size to be grasped and carried by one or more hands of a user, illustrated examples of which include a mobile phone, mobile game and music device, and tablet computer although other examples are also contemplated.
- the example computing device 702 as illustrated includes a processing system 704 , one or more computer-readable media 706 , and one or more I/O interface 708 that are communicatively coupled, one to another.
- the computing device 702 may further include a system bus or other data and command transfer system that couples the various components, one to another.
- a system bus can include any one or combination of different bus structures, such as a memory bus or memory controller, a peripheral bus, a universal serial bus, and/or a processor or local bus that utilizes any of a variety of bus architectures.
- a variety of other examples are also contemplated, such as control and data lines.
- the processing system 704 is representative of functionality to perform one or more operations using hardware. Accordingly, the processing system 704 is illustrated as including hardware element 710 that may be configured as processors, functional blocks, and so forth. This may include implementation in hardware as an application specific integrated circuit or other logic device formed using one or more semiconductors.
- the hardware elements 710 are not limited by the materials from which they are formed or the processing mechanisms employed therein.
- processors may be comprised of semiconductor(s) and/or transistors (e.g., electronic integrated circuits (ICs)).
- processor-executable instructions may be electronically-executable instructions.
- the computer-readable media 706 is illustrated as including memory/storage 712 .
- the memory/storage 712 represents memory/storage capacity associated with one or more computer-readable media.
- the memory/storage component 712 may include volatile media (such as random access memory (RAM)) and/or nonvolatile media (such as read only memory (ROM), Flash memory, optical disks, magnetic disks, and so forth).
- the memory/storage component 712 may include fixed media (e.g., RAM, ROM, a fixed hard drive, and so on) as well as removable media (e.g., Flash memory, a removable hard drive, an optical disc, and so forth).
- the computer-readable media 706 may be configured in a variety of other ways as further described below.
- Input/output interface(s) 708 are representative of functionality to allow a user to enter commands and information to computing device 702 , and also allow information to be presented to the user and/or other components or devices using various input/output devices.
- input devices include a keyboard, a cursor control device (e.g., a mouse), a microphone (e.g., for voice input), a scanner, touch functionality (e.g., capacitive or other sensors that are configured to detect physical touch), a camera (e.g., which may employ visible or non-visible wavelengths such as infrared frequencies to recognize movement as gestures that do not involve touch), and so forth.
- Examples of output devices include a display device (e.g., a monitor or projector), speakers, a printer, a network card, tactile-response device, and so forth.
- the computing device 702 may be configured in a variety of ways to support user interaction.
- the computing device 702 is further illustrated as being communicatively and physically coupled to an input device 714 that is physically and communicatively removable from the computing device 702 .
- an input device 714 that is physically and communicatively removable from the computing device 702 .
- the input device 714 includes one or more keys 716 , which may be configured as pressure sensitive keys, mechanically switched keys, and so forth.
- the input device 714 is further illustrated as include one or more modules 718 that may be configured to support a variety of functionality.
- the one or more modules 718 may be configured to process analog and/or digital signals received from the keys 716 to determine whether a keystroke was intended, determine whether an input is indicative of resting pressure, support authentication of the input device 714 for operation with the computing device 702 , and so on.
- modules include routines, programs, objects, elements, components, data structures, and so forth that perform particular tasks or implement particular abstract data types.
- module generally represent software, firmware, hardware, or a combination thereof.
- the features of the techniques described herein are platform-independent, meaning that the techniques may be implemented on a variety of commercial computing platforms having a variety of processors.
- Computer-readable media may include a variety of media that may be accessed by the computing device 702 .
- computer-readable media may include “computer-readable storage media” and “computer-readable signal media.”
- Computer-readable storage media may refer to media and/or devices that enable persistent storage of information in contrast to mere signal transmission, carrier waves, or signals per se. Thus, computer-readable storage media excludes signals per se.
- the computer-readable storage media includes hardware such as volatile and non-volatile, removable and non-removable media and/or storage devices implemented in a method or technology suitable for storage of information such as computer readable instructions, data structures, program modules, logic elements/circuits, or other data.
- Examples of computer-readable storage media may include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, hard disks, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or other storage device, tangible media, or article of manufacture suitable to store the desired information and which may be accessed by a computer.
- Computer-readable signal media may refer to a signal-bearing medium that is configured to transmit instructions to the hardware of the computing device 702 , such as via a network.
- Signal media typically may embody computer readable instructions, data structures, program modules, or other data in a modulated data signal, such as carrier waves, data signals, or other transport mechanism.
- Signal media also include any information delivery media.
- modulated data signal means a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal.
- communication media include wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared, and other wireless media.
- hardware elements 710 and computer-readable media 706 are representative of modules, programmable device logic and/or fixed device logic implemented in a hardware form that may be employed in some embodiments to implement at least some aspects of the techniques described herein, such as to perform one or more instructions.
- Hardware may include components of an integrated circuit or on-chip system, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a complex programmable logic device (CPLD), and other implementations in silicon or other hardware.
- ASIC application-specific integrated circuit
- FPGA field-programmable gate array
- CPLD complex programmable logic device
- hardware may operate as a processing device that performs program tasks defined by instructions and/or logic embodied by the hardware as well as a hardware utilized to store instructions for execution, e.g., the computer-readable storage media described previously.
- software, hardware, or executable modules may be implemented as one or more instructions and/or logic embodied on some form of computer-readable storage media and/or by one or more hardware elements 710 .
- the computing device 702 may be configured to implement particular instructions and/or functions corresponding to the software and/or hardware modules. Accordingly, implementation of a module that is executable by the computing device 702 as software may be achieved at least partially in hardware, e.g., through use of computer-readable storage media and/or hardware elements 710 of the processing system 704 .
- the instructions and/or functions may be executable/operable by one or more articles of manufacture (for example, one or more computing devices 702 and/or processing systems 704 ) to implement techniques, modules, and examples described herein.
- aspects of the methods may be implemented in hardware, firmware, or software, or a combination thereof.
- the methods are shown as a set of blocks that specify operations performed by one or more devices and are not necessarily limited to the orders shown for performing the operations by the respective blocks. Further, an operation shown with respect to a particular method may be combined and/or interchanged with an operation of a different method in accordance with one or more implementations.
- aspects of the methods can be implemented via interaction between various entities discussed above with reference to the environment 100 and/or the example implementation scenarios discussed above.
Abstract
Description
- This application claims priority under 35 USC 119(b) to International Application No. PCT/CN2012/083074 filed Oct. 17, 2012, the disclosure of which is incorporated in its entirety.
- Many products include some form of graphic ornamentation, such as for decoration, to identify a source of a product (e.g., a logo), to indicate functionality associated with a product, and so on. A variety of techniques can be utilized to apply graphics to a product.
- For instance, a graphic can be applied via a printed item that is adhered to a surface of a product using a suitable adhesive. One example of such as graphic is a decal. While decals can be convenient to produce and apply, they can often be easily damaged and/or removed.
- Various types of coatings (e.g., paint or other liquid coating) can also be utilized to apply graphics. A graphic applied with a coating may also be easily damaged, and thus detract from the appearance of the graphic.
- Screen printing is another technique that can be employed to apply a graphic to a product. While screen printing is useful in certain scenarios, it can introduce complexity into a production process that can increase product cost and/or production time for bringing a product to market. Thus, many current techniques for applying graphics suffer from a number of drawbacks.
- This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
- Techniques for graphic formation via material ablation described. In at least some implementations, specifications are provided (e.g., via user input) for a graphic to be applied to a surface of an object. The graphic, for instance, can be some form of an image, such as a logo, a visual pattern and/or design, a word and/or phrase, artwork, and so on. Further, the object can be configured as an instance of a wide variety of different objects, such as a computing device (e.g., a mobile computing device), a toy, a vehicle, and/or any other object that includes a surface upon which a graphic can be applied. Based on the specifications for the graphic, an ablation trench in the shape of the graphic can be applied to a surface of the object. In at least some implementations, the ablation trench is generated by removing material from the surface of the object in the shape of the graphic, such as via laser ablation.
- In at least some embodiments, an object can include a surface layer and one or more sublayers of materials. For instance, the object can be plated with different layers, such as metals, metal alloys, resins, and so forth. When an ablation trench is generated in the object, the ablation trench can penetrate into a surface layer to form a particular graphic. Alternatively or additionally, the ablation trench can penetrate the surface layer of the object and into an intermediate layer. For instance, a lowermost portion (e.g., bottom) of the ablation trench can penetrate into the intermediate layer, without penetrating a lower layer beneath the intermediate layer. In at least some implementations, this can enable a coating that will adhere to the ablation trench (e.g., the material of the intermediate layer) to be applied to the ablation trench and the object surface. The coating, for instance, can be a thin coating that can be applied to the ablation trench and the surrounding surface of the object. The coating can provide various properties to the ablation trench and the surrounding surface, such as color tinting, scratch resistance, fingerprint resistance, and so on.
- In at least some implementations, height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same coating.
- The detailed description is described with reference to the accompanying figures. In the figures, the left-most digit(s) of a reference number identifies the figure in which the reference number first appears. The use of the same reference numbers in different instances in the description and the figures may indicate similar or identical items. Entities represented in the figures may be indicative of one or more entities and thus reference may be made interchangeably to single or plural forms of the entities in the discussion.
-
FIG. 1 is an illustration of an environment in an example implementation that is operable to employ the techniques described herein in accordance with one or more embodiments. -
FIG. 2 depicts an example implementation scenario of techniques discussed herein in accordance with one or more embodiments. -
FIG. 3 depicts an example implementation scenario of techniques discussed herein in accordance with one or more embodiments. -
FIG. 4 depicts a magnified sectional view of an object processed according to techniques discussed herein and in accordance with one or more embodiments. -
FIG. 5 depicts an example implementation scenario of techniques discussed herein in accordance with one or more embodiments. -
FIG. 6 illustrates a flow diagram that describes steps in a method in accordance with one or more embodiments. -
FIG. 7 illustrates an example system including various components of an example device that can be implemented as any type of computing device as described with reference toFIG. 1 to implement embodiments of the techniques described herein. - Techniques for graphic formation via material ablation described. In at least some implementations, specifications are provided (e.g., via user input) for a graphic to be applied to a surface of an object. The graphic, for instance, can be some form of an image, such as a logo, a visual pattern and/or design, a word and/or phrase, artwork, and so on. Further, the object can be configured as an instance of a wide variety of different objects, such as a computing device (e.g., a mobile computing device), a toy, a vehicle, and/or any other object that includes a surface upon which a graphic can be applied. Based on the specifications for the graphic, an ablation trench in the shape of the graphic can be applied to a surface of the object. In at least some implementations, the ablation trench is generated by removing material from the surface of the object in the shape of the graphic, such as via laser ablation.
- In at least some embodiments, an object can include a surface layer and one or more sublayers of materials. For instance, the object can be plated with different layers, such as metals, metal alloys, resins, and so forth. When an ablation trench is generated in the object, the ablation trench can penetrate into a surface layer to form a particular graphic. Alternatively or additionally, the ablation trench can penetrate the surface layer of the object and into an intermediate layer. For instance, a lowermost portion (e.g., bottom) of the ablation trench can penetrate into the intermediate layer, without penetrating a lower layer beneath the intermediate layer. In at least some implementations, this can enable a coating that will adhere to the ablation trench (e.g., the material of the intermediate layer) to be applied to the ablation trench and the object surface. The coating, for instance, can be a thin coating that can be applied to the ablation trench and the surrounding surface of the object. The coating can provide various properties to the ablation trench and the surrounding surface, such as color tinting, scratch resistance, fingerprint resistance, and so on.
- In at least some implementations, height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same coating.
- In the following discussion, a section entitled “Example Environment” discusses an example environment that may employ techniques described herein. Embodiments discussed herein are not limited to the example environment, and the example environment is not limited to embodiments discussed herein. Next, a section entitled “Example Implementation Scenarios” discusses some example implementation scenarios in accordance with one or more embodiments. Following this, a section entitled “Example Procedure” describes an example procedure in accordance with one or more embodiments. Finally, an example system and device are discussed that may implement various techniques described herein.
- Example Environment
-
FIG. 1 is an illustration of anenvironment 100 in an example implementation that is operable to employ the techniques described herein. Theenvironment 100 includes acontrol device 102, which can be configured as a computing device that is capable of performing various operations. One example implementation of thecontrol device 102 is discussed below with reference toFIG. 6 . - The
control device 102 includes and/or is operably associated with anablation device 104, which is configured to remove material from an object surface and/or other layer according to techniques discussed herein. For instance, theablation device 104 can include a mechanism capable of generating a laser that can be controlled to remove material from an object. A variety of other ablation mechanisms and/or techniques may be employed within the spirit and scope of the claimed embodiments. - The
control device 102 further includes and/or is further operably associated with acoating device 106, which is representative of functionality to apply various types of coatings to objects. Examples of suitable coatings which may be applied via thecoating device 106 include thin films (e.g., via physical vapor deposition (PVD), chemical vapor deposition (CVD), and so on), anti-fingerprint (AFP) coatings (e.g., lipophobic and/or hydrophobic coatings), nano-coatings, and so on. - An input/output (I/O)
module 108 and anablation control module 110 are further included. The I/O module 108 is configured to receive various types of input, such as input from a user, another device, a data storage medium, and so on. In at least some implementations, input to the I/O module 108 can include specifications for a graphic to be applied to an object. For instance, the specifications can include dimensions for a graphic, such as width, length, ablation depth, and so on. Input to the I/O module 108 may also include coating specifications, such as coating type, color specifications, coating depth, and so on. - The
ablation control module 110 represents functionality to control various operations of theablation device 104. In at least some implementations, theablation control module 110 can represent a driver that provides an interface to theablation device 104 from the I/O module 108. - A
coating control module 112 is further included, which represents functionality to control operation of thecoating device 106. For instance, thecoating control module 112 can represent a driver that provides an interface to thecoating device 106 from the I/O module 108. - The
environment 100 further includes anobject 114, which is representative of an instance of various physical objects upon which graphics can be applied according to techniques discussed herein. Theobject 114, for instance, can be configured as a wide variety of different objects, such as a computing device (e.g., a mobile computing device), a toy, a vehicle, and/or any other object that includes a surface upon which a graphic can be applied. - Further illustrated in the
environment 100 is that theobject 114 is processed by thecontrol device 102 to produce amarked object 116. Themarked object 116 includes asurface 118 upon which a graphic 120 is applied according to techniques discussed herein. - For instance, the I/
O module 108 receives input (e.g., user input) that includes specifications for the graphic 120, e.g., ablation coordinates to be applied to thesurface 118. The specifications are passed to theablation control module 110, which controls operation of theablation device 104 to remove material from thesurface 118. Control of theablation device 104 can include control of various operational attributes, such as laser power (e.g., flux), laser pulse duration and/or frequency, physical movement of theablation device 104 relative to thesurface 118, and so forth. - Removal of the material creates an
ablation trench 122 in thesurface 118 in the shape of the graphic 120. Theablation trench 122 represents a perforation in a surface plane of thesurface 118 caused by the removal of the material. As detailed below, depth of theablation trench 122 can be specified to attain various visual and/or physical properties for themarked object 116 and/or the graphic 120. - After ablation of the
surface 118 to create the graphic 120, thesurface 118 may be coated by thecoating device 106 with one or more types of coatings. In at least some implementations, application of a coating can tint and/or color thesurface 118 and the graphic 120. Application of a coating can also increase surface durability, such as by providing resistance to fingerprinting, scratch resistance, and so on. - Example Implementation Scenarios
- This section discusses some example implementations scenarios in accordance with various embodiments.
-
FIG. 2 illustrates anexample implementation scenario 200 according to techniques described herein. The upper portion of thescenario 200 illustrates a side view of anobject 202 with asurface 204. Also illustrated is a partial cutaway view of theobject 202, which reveals layering of material beneath thesurface 204. In this example, theobject 202 includes asurface layer 206, the top portion of which forms thesurface 204. Beneath thesurface layer 206 is asubstrate 208. - In at least some implementations, the
substrate 208 can form at least a portion of an internal portion of theobject 202, such as a housing for the object. For instance, with reference to a mobile computing device implementation, thesubstrate 208 can form an internal surface of a chassis for the mobile computing device. - The
substrate 208 and thesurface layer 206 can be formed from various materials, such as metals, alloys, compounds, resins, and so forth. In this particular example, thesubstrate 208 is formed from a magnesium alloy. However, substrates formed from other materials may be employed as well, such as different metals and/or metal alloys, resins, plastics, and so on. - Proceeding to the lower portion of the
scenario 200, thesurface 204 is ablated (e.g., using the ablation device 104) to generate anablation trench 210. Theablation trench 210 is created by removing material from thesurface layer 206 to create a perforation in thesurface 204. Although only a cross section of theablation trench 210 is illustrated, theablation trench 210 in its entirety corresponds to a pre-specified graphic. For instance, theablation trench 210 can correspond to a shape for a particular graphic, such as the graphic 120 discussed above with reference toenvironment 100. -
FIG. 3 illustrates anexample implementation scenario 300 according to techniques described herein. The upper portion of thescenario 300 illustrates a side view of anobject 302 with asurface 304. Also illustrated is a partial cutaway view of theobject 302, which reveals layering of material beneath thesurface 304. In this example, theobject 302 includes asurface layer 306, the top portion of which forms thesurface 304. Beneath thesurface layer 306 are afirst sublayer 308 and asecond sublayer 310. Thesecond sublayer 310 is placed on asubstrate 312. In at least some implementations, thesubstrate 312 can form at least a portion of an internal portion of theobject 302, such as a housing for the object. For instance, with reference to a mobile computing device implementation, thesubstrate 312 can form an internal surface of a chassis for the mobile computing device. - The
substrate 312, thesurface layer 306, and thesublayers substrate 312 is formed from a magnesium alloy. However, substrates formed from other materials may be employed as well, such as different metals and/or metal alloys. - In at least some embodiments, the
substrate 312 can be treated to improve adhesion properties for subsequent layers. For instance, thesubstrate 312 can be treated using a zincate process (e.g., a double zincate process) to deposit zinc on the surface of thesubstrate 312 prior to application of thesecond sublayer 310 to thesubstrate 312. Zinc deposition on thesubstrate 312 can improve adhesion of thesecond sublayer 310 to thesubstrate 312. - Further to the
scenario 300, thesurface layer 306 and thesublayers substrate 312, such as utilizing various types of deposition and/or plating processes. For instance, in at least one embodiment thesecond sublayer 310 is formed from copper, such as from one or more forms of elemental copper, copper compounds, and so on. Further, thefirst sublayer 308 is formed from nickel, such as from one or more forms of elemental nickel, nickel compounds, and so on. Thesurface layer 306 can be formed from chromium, such as from one or more forms of elemental chromium, chromium compounds, and so on. Thus, in a least some implementations, thesurface layer 306, thefirst sublayer 308, and thesecond sublayer 310 can be adhered to thesubstrate 312 to form distinct layers of different materials. - Further to one or more embodiments, the
surface layer 306, thefirst sublayer 308, and thesecond sublayer 310 can be applied according to various thicknesses and thickness variations. For instance, consider the following example specifications for each of the respective layers. - (1) Second sublayer 310:
-
- (a) applied to the
substrate 312 at 30 micrometers (“μ”) thickness, with a tolerance of +15μ and −15μ; or - (b) applied to the
substrate 312 at up to 1500μ, thickness.
- (a) applied to the
- (2) First sublayer 308:
-
- (a) applied to the
second sublayer 310 at 9μ, thickness, with a tolerance of +/−5μ; or - (b) applied to the
second sublayer 310 at up to 45μ, thickness.
- (a) applied to the
- (3) Surface layer 306:
-
- (a) applied to the
first sublayer 308 at 0.1μ-0.3μ, thickness; or - (b) applied to the
first sublayer 308 at up to 1.50μ thickness.
- (a) applied to the
- The specifications indicated above are provided for purpose of example only, the different thicknesses may be employed in accordance with the claimed embodiments. Further, the thicknesses of the different layers may be independently varied to obtain different variations of thicknesses between the different layers. In at least some embodiments, a layer or layers may be omitted.
- Proceeding to the lower portion of the
scenario 300, thesurface 304 is ablated (e.g., using the ablation device 104) to generate anablation trench 314. Theablation trench 314 is created by removing material from thesurface layer 306 and one or more of the sublayers to create a perforation in thesurface 304. Although only a cross section of theablation trench 314 is illustrated, theablation trench 314 in its entirety corresponds to a pre-specified graphic. For instance, theablation trench 314 can correspond to a shape for a particular graphic, such as the graphic 130 discussed above with reference toenvironment 100. - In this particular example, the
ablation trench 314 passes through thesurface layer 306 and into thefirst sublayer 308, without penetrating an interface between thefirst sublayer 308 and thesecond sublayer 310. Thus, the depth of theablation trench 314 is such that a bottom theablation trench 314 is within thefirst sublayer 308, and such that thesecond sublayer 310 remains covered (e.g., sealed) by thefirst sublayer 308. In at least some implementations, the ablation trench penetrates thefirst sublayer 308 at a depth range of 2μ-4μ. However, different penetration depths may be employed according to various embodiments. -
FIG. 4 illustrates a magnifiedsection 400 of the side view of theobject 302, discussed above. Included as part of thesection 400 are thesurface 304, thesurface layer 308, and thefirst sublayer 308. Further illustrated is anablation trench 402. - In this particular example, the
ablation trench 402 includessurface variations 404 that result in varying depth for theablation trench 402. For instance, thesurface variations 404 can cause the penetration depth of theablation trench 402 into thefirst sublayer 308 to vary between 1μ-4μ. In implementations where a coating is applied to the ablation trench 402 (as discussed below), thesurface variations 404 can cause variations in optical properties of a graphic generated using theablation trench 402. For instance, thesurface variations 404 can increase the number and variation in reflective surfaces such that variations in light reflection and/or scattering occur. - In at least some implementations, the
surface variations 404 can be caused by variations in ablation. For instance, theablation control module 110 can vary the power, distance (e.g., from the surface 304), and/or the angle of theablation device 104 during an ablation process, thus resulting in thesurface variations 404. Variations in power, for instance, can be caused by pulsing the ablation device 104 (e.g., laser pulsing) at different power levels during an ablation process. - Having discussed an example implementation scenario that employs object ablation, consider now an example implementation scenario for object coating.
-
FIG. 5 illustrates anexample implementation scenario 500 according to techniques described herein. Thescenario 500 describes example ways of coating ablated objects, such as discussed above with reference to the scenarios 200-400. In the upper portion of thescenario 500, the partial cutaway view of theobject 302 as illustrated inFIG. 3 is presented, including theablation trench 314 generated via ablation of portions of theobject 302. - Proceeding to the lower portion of the
scenario 500, several coating layers are applied to thesurface 304, such as via thecoating device 106 discussed above with reference toenvironment 100. In this particular example, afirst coating layer 502 is applied to thesurface 304. In an example implementation, thefirst coating layer 502 can be a thin film, such as applied via PVD, CVD, and so forth. For instance, thefirst coating layer 502 can be applied using a chrome carbide PVD to achieve a particular color and/or tint for thefirst coating layer 502. Other materials may additionally or alternatively be employed for thefirst coating layer 502, such as titanium carbide, zirconium carbide, and/or other metal carbides, metal nitride coatings, and so forth. Thefirst coating layer 502 can optionally include tinting and/or coloring that can change the optical appearance of thesurface 304. - The
first coating layer 502 can be applied to thesurface 304, including theablation trench 314, at an approximately consistent thickness. For instance, the first coating layer can be applied at a thickness that ranges from 0.4μ-1.2μ. Thus, thefirst coating layer 502 can be applied such that thesurface 304 and theablation trench 314 are uniformly colored. - Further to the
scenario 500, asecond coating layer 504 is applied on top of thefirst coating layer 502. Thesecond coating layer 504 can be a protective material, such as an AFP coating, a scratch-resistance coating, a nano-coating, and so forth. For instance, thesecond coating layer 504 can be applied as a protectant for thefirst coating layer 502 and/or other layers, such as to prevent fingerprint adhesion, resist surface scratching, and so forth. - According to one or more embodiments, the
second coating layer 504 can be applied to thefirst coating layer 502 at an approximately uniform thickness. For instance, the thickness of thesecond coating layer 504 can range from 0.25μ-1.50μ. - In at least some implementations, color measurement of the
surface 304 and theablation trench 314 when coated with thefirst coating layer 502 and the second coating layer 504 (e.g., using a suitable color meter) can indicate that thesurface 304 and theablation trench 314 are the same color. Differences in surface height between thesurface 304 and theablation trench 314, however, can result in differences in light reflection properties. For instance, specular and/or other reflection properties in response to incident light on thesurface 304 and theablation trench 314 can differ, causing visual color tonal differences between the surfaces. This can cause visually perceptible color differences between a graphic applied via theablation trench 314 and a surrounding surface (e.g., the surface 304), even though theablation trench 314 and the surrounding surface are coated with the same color. - Surface variations in the ablation trench 314 (e.g., as discussed above), may also contribute to differences in color perception between the
surface 304 and theablation trench 314. As referenced above, such surface variations can cause variable light reflection and/or scattering properties in theablation trench 314. Such variable light properties can result in a visual perception of variation in color between thesurface 304 and theablation trench 314, even though both may be coated with a uniformly colored coating. - The example thicknesses and tolerances discussed above are presented for purpose of example only, and a wide variety of different layer thicknesses and tolerances can be employed within the spirit and scope of the claimed embodiments.
- Example Procedure
- The following discussion describes an example procedure in accordance with one or more embodiments. In portions of the following discussion, reference will be made to the
environment 100 and the implementation scenarios discussed above. -
FIG. 5 is a flow diagram that describes steps in a method in accordance with one or more embodiments. Step 600 receives specifications for a graphic to be applied to a surface of an object. For example, the I/O module 108 can receive input that includes various specifications for a graphic, such as a pattern for a graphic in terms of x and y coordinates. The specifications may also include an ablation depth and/or variations in ablation depth to be used to apply the graphic to the surface. - Step 602 ablates the surface of the object based on the specifications to generate an ablation trench that corresponds to the graphic. For instance, the specifications can be provided from the I/
O module 108 to theablation control module 110, which controls operation of theablation device 104 to ablate the surface according to the specifications. - As discussed above, the object can include multiple layers of material layered on top of a substrate. Further, the ablation trench can penetrate a surface layer in the shape of the specified graphic. The trench depth can be specified such that a lowermost portion of the trench penetrates an intermediate layer without penetrating one or more lower layers.
- Step 604 coats the ablation trench and surrounding surface of the object with a finish coating. For instance, specifications for one or more coatings to be applied can be provided to the I/
O module 108, which can provide the coating specifications to thecoating control module 112. Thecoating control module 112 can control operation of thecoating device 106 to apply a coating to the ablation trench and surrounding surfaces. Examples of finish coatings are discussed above, such as PVDs, AFPs, and so forth. As also discussed above, a finish coating can be tinted such that coloring is applied to the surface of the object and the ablation trench. - Example System and Device
-
FIG. 7 illustrates an example system generally at 700 that includes anexample computing device 702 that is representative of one or more computing systems and/or devices that may implement the various techniques described herein. Thecomputing device 702 may be, for example, be configured to assume a mobile configuration through use of a housing formed and size to be grasped and carried by one or more hands of a user, illustrated examples of which include a mobile phone, mobile game and music device, and tablet computer although other examples are also contemplated. - The
example computing device 702 as illustrated includes aprocessing system 704, one or more computer-readable media 706, and one or more I/O interface 708 that are communicatively coupled, one to another. Although not shown, thecomputing device 702 may further include a system bus or other data and command transfer system that couples the various components, one to another. A system bus can include any one or combination of different bus structures, such as a memory bus or memory controller, a peripheral bus, a universal serial bus, and/or a processor or local bus that utilizes any of a variety of bus architectures. A variety of other examples are also contemplated, such as control and data lines. - The
processing system 704 is representative of functionality to perform one or more operations using hardware. Accordingly, theprocessing system 704 is illustrated as includinghardware element 710 that may be configured as processors, functional blocks, and so forth. This may include implementation in hardware as an application specific integrated circuit or other logic device formed using one or more semiconductors. Thehardware elements 710 are not limited by the materials from which they are formed or the processing mechanisms employed therein. For example, processors may be comprised of semiconductor(s) and/or transistors (e.g., electronic integrated circuits (ICs)). In such a context, processor-executable instructions may be electronically-executable instructions. - The computer-
readable media 706 is illustrated as including memory/storage 712. The memory/storage 712 represents memory/storage capacity associated with one or more computer-readable media. The memory/storage component 712 may include volatile media (such as random access memory (RAM)) and/or nonvolatile media (such as read only memory (ROM), Flash memory, optical disks, magnetic disks, and so forth). The memory/storage component 712 may include fixed media (e.g., RAM, ROM, a fixed hard drive, and so on) as well as removable media (e.g., Flash memory, a removable hard drive, an optical disc, and so forth). The computer-readable media 706 may be configured in a variety of other ways as further described below. - Input/output interface(s) 708 are representative of functionality to allow a user to enter commands and information to
computing device 702, and also allow information to be presented to the user and/or other components or devices using various input/output devices. Examples of input devices include a keyboard, a cursor control device (e.g., a mouse), a microphone (e.g., for voice input), a scanner, touch functionality (e.g., capacitive or other sensors that are configured to detect physical touch), a camera (e.g., which may employ visible or non-visible wavelengths such as infrared frequencies to recognize movement as gestures that do not involve touch), and so forth. Examples of output devices include a display device (e.g., a monitor or projector), speakers, a printer, a network card, tactile-response device, and so forth. Thus, thecomputing device 702 may be configured in a variety of ways to support user interaction. - The
computing device 702 is further illustrated as being communicatively and physically coupled to an input device 714 that is physically and communicatively removable from thecomputing device 702. In this way, a variety of different input devices may be coupled to thecomputing device 702 having a wide variety of configurations to support a wide variety of functionality. In this example, the input device 714 includes one ormore keys 716, which may be configured as pressure sensitive keys, mechanically switched keys, and so forth. - The input device 714 is further illustrated as include one or
more modules 718 that may be configured to support a variety of functionality. The one ormore modules 718, for instance, may be configured to process analog and/or digital signals received from thekeys 716 to determine whether a keystroke was intended, determine whether an input is indicative of resting pressure, support authentication of the input device 714 for operation with thecomputing device 702, and so on. - Various techniques may be described herein in the general context of software, hardware elements, or program modules. Generally, such modules include routines, programs, objects, elements, components, data structures, and so forth that perform particular tasks or implement particular abstract data types. The terms “module,” “functionality,” and “component” as used herein generally represent software, firmware, hardware, or a combination thereof. The features of the techniques described herein are platform-independent, meaning that the techniques may be implemented on a variety of commercial computing platforms having a variety of processors.
- An implementation of the described modules and techniques may be stored on or transmitted across some form of computer-readable media. The computer-readable media may include a variety of media that may be accessed by the
computing device 702. By way of example, and not limitation, computer-readable media may include “computer-readable storage media” and “computer-readable signal media.” - “Computer-readable storage media” may refer to media and/or devices that enable persistent storage of information in contrast to mere signal transmission, carrier waves, or signals per se. Thus, computer-readable storage media excludes signals per se. The computer-readable storage media includes hardware such as volatile and non-volatile, removable and non-removable media and/or storage devices implemented in a method or technology suitable for storage of information such as computer readable instructions, data structures, program modules, logic elements/circuits, or other data. Examples of computer-readable storage media may include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, hard disks, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or other storage device, tangible media, or article of manufacture suitable to store the desired information and which may be accessed by a computer.
- “Computer-readable signal media” may refer to a signal-bearing medium that is configured to transmit instructions to the hardware of the
computing device 702, such as via a network. Signal media typically may embody computer readable instructions, data structures, program modules, or other data in a modulated data signal, such as carrier waves, data signals, or other transport mechanism. Signal media also include any information delivery media. The term “modulated data signal” means a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, communication media include wired media such as a wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared, and other wireless media. - As previously described,
hardware elements 710 and computer-readable media 706 are representative of modules, programmable device logic and/or fixed device logic implemented in a hardware form that may be employed in some embodiments to implement at least some aspects of the techniques described herein, such as to perform one or more instructions. Hardware may include components of an integrated circuit or on-chip system, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a complex programmable logic device (CPLD), and other implementations in silicon or other hardware. In this context, hardware may operate as a processing device that performs program tasks defined by instructions and/or logic embodied by the hardware as well as a hardware utilized to store instructions for execution, e.g., the computer-readable storage media described previously. - Combinations of the foregoing may also be employed to implement various techniques described herein. Accordingly, software, hardware, or executable modules may be implemented as one or more instructions and/or logic embodied on some form of computer-readable storage media and/or by one or
more hardware elements 710. Thecomputing device 702 may be configured to implement particular instructions and/or functions corresponding to the software and/or hardware modules. Accordingly, implementation of a module that is executable by thecomputing device 702 as software may be achieved at least partially in hardware, e.g., through use of computer-readable storage media and/orhardware elements 710 of theprocessing system 704. The instructions and/or functions may be executable/operable by one or more articles of manufacture (for example, one ormore computing devices 702 and/or processing systems 704) to implement techniques, modules, and examples described herein. - Discussed herein are a number of methods that may be implemented to perform techniques discussed herein. Aspects of the methods may be implemented in hardware, firmware, or software, or a combination thereof. The methods are shown as a set of blocks that specify operations performed by one or more devices and are not necessarily limited to the orders shown for performing the operations by the respective blocks. Further, an operation shown with respect to a particular method may be combined and/or interchanged with an operation of a different method in accordance with one or more implementations. Aspects of the methods can be implemented via interaction between various entities discussed above with reference to the
environment 100 and/or the example implementation scenarios discussed above. - Although the example implementations have been described in language specific to structural features and/or methodological acts, it is to be understood that the implementations defined in the appended claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as example forms of implementing the claimed features.
Claims (20)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2012/083074 WO2014059618A1 (en) | 2012-10-17 | 2012-10-17 | Graphic formation via material ablation |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2012/083074 Continuation WO2014059618A1 (en) | 2012-10-17 | 2012-10-17 | Graphic formation via material ablation |
Publications (3)
Publication Number | Publication Date |
---|---|
US20140248506A1 US20140248506A1 (en) | 2014-09-04 |
US20160143170A9 true US20160143170A9 (en) | 2016-05-19 |
US9661770B2 US9661770B2 (en) | 2017-05-23 |
Family
ID=50487438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/784,746 Active 2034-11-22 US9661770B2 (en) | 2012-10-17 | 2013-03-04 | Graphic formation via material ablation |
Country Status (2)
Country | Link |
---|---|
US (1) | US9661770B2 (en) |
WO (1) | WO2014059618A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9432070B2 (en) | 2012-10-16 | 2016-08-30 | Microsoft Technology Licensing, Llc | Antenna placement |
US9793073B2 (en) | 2012-03-02 | 2017-10-17 | Microsoft Technology Licensing, Llc | Backlighting a fabric enclosure of a flexible cover |
US9870066B2 (en) | 2012-03-02 | 2018-01-16 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
US9904327B2 (en) | 2012-03-02 | 2018-02-27 | Microsoft Technology Licensing, Llc | Flexible hinge and removable attachment |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9426905B2 (en) | 2012-03-02 | 2016-08-23 | Microsoft Technology Licensing, Llc | Connection device for computing devices |
USRE48963E1 (en) | 2012-03-02 | 2022-03-08 | Microsoft Technology Licensing, Llc | Connection device for computing devices |
US9360893B2 (en) | 2012-03-02 | 2016-06-07 | Microsoft Technology Licensing, Llc | Input device writing surface |
US9075566B2 (en) | 2012-03-02 | 2015-07-07 | Microsoft Technoogy Licensing, LLC | Flexible hinge spine |
US20130300590A1 (en) | 2012-05-14 | 2013-11-14 | Paul Henry Dietz | Audio Feedback |
US9073123B2 (en) | 2012-06-13 | 2015-07-07 | Microsoft Technology Licensing, Llc | Housing vents |
WO2014059625A1 (en) | 2012-10-17 | 2014-04-24 | Microsoft Corporation | Metal alloy injection molding overflows |
EP2908970B1 (en) | 2012-10-17 | 2018-01-03 | Microsoft Technology Licensing, LLC | Metal alloy injection molding protrusions |
US9424048B2 (en) | 2014-09-15 | 2016-08-23 | Microsoft Technology Licensing, Llc | Inductive peripheral retention device |
ES2570252A1 (en) * | 2014-11-14 | 2016-05-17 | Bsh Electrodomesticos Espana Sa | Method for manufacturing a domestic appliance component comprising a laser-generated marking, a protective coating produced thereon and a domestic appliance component (Machine-translation by Google Translate, not legally binding) |
KR102398581B1 (en) | 2015-04-21 | 2022-05-17 | 삼성전자주식회사 | Housing, manufacturing method thereof, and electronic device having it |
US11167581B2 (en) | 2018-04-06 | 2021-11-09 | Proof Authentication Corporation | Authentication hologram |
Family Cites Families (350)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1100331A (en) | 1964-03-05 | 1968-01-24 | Chloride Overseas Ltd | Improvements relating to moulds for thin castings |
US3879586A (en) | 1973-10-31 | 1975-04-22 | Essex International Inc | Tactile keyboard switch assembly with metallic or elastomeric type conductive contacts on diaphragm support |
US4065649A (en) | 1975-06-30 | 1977-12-27 | Lake Center Industries | Pressure sensitive matrix switch having apertured spacer with flexible double sided adhesive intermediate and channels optionally interposed between apertures |
US4046975A (en) | 1975-09-22 | 1977-09-06 | Chomerics, Inc. | Keyboard switch assembly having internal gas passages preformed in spacer member |
CA1104182A (en) | 1977-06-24 | 1981-06-30 | Peter Strandwitz | Touch switch |
JPS54101176A (en) | 1978-01-26 | 1979-08-09 | Shinetsu Polymer Co | Contact member for push switch |
US4261042A (en) | 1978-03-28 | 1981-04-07 | Canon Kabushiki Kaisha | Key signal entering device for thin electronic apparatus |
US4365130A (en) | 1979-10-04 | 1982-12-21 | North American Philips Corporation | Vented membrane switch with contaminant scavenger |
US4317011A (en) | 1980-01-21 | 1982-02-23 | Chicago Decal Company | Membrane touch switch |
US4323740A (en) | 1980-02-04 | 1982-04-06 | Rogers Corporation | Keyboard actuator device and keyboard incorporating the device |
US4317013A (en) | 1980-04-09 | 1982-02-23 | Oak Industries, Inc. | Membrane switch with universal spacer means |
JPS56159134A (en) | 1980-05-12 | 1981-12-08 | Ricoh Co Ltd | Mold for injection molding |
US4375018A (en) | 1980-06-16 | 1983-02-22 | Sheldahl, Inc. | Membrane switch having adhesive label as edge seal |
US4559426A (en) | 1980-11-03 | 1985-12-17 | Oak Industries Inc. | Membrane switch and components having means for preventing creep |
JPS5810335U (en) | 1981-07-15 | 1983-01-22 | 信越ポリマ−株式会社 | Thin keyboard device |
US4492829A (en) | 1982-02-25 | 1985-01-08 | Rogers Corporation | Tactile membrane keyboard with asymmetrical tactile key elements |
US4510353A (en) | 1983-01-31 | 1985-04-09 | Arrow Display Company, Inc. | Method and kit for construction of custom prototype membrane switch panel |
JPS6098231U (en) | 1983-12-10 | 1985-07-04 | アルプス電気株式会社 | membrane switch |
US4588187A (en) | 1984-06-27 | 1986-05-13 | Wico Corporation | Port expansion adapter for video game port |
US4651133A (en) | 1984-12-24 | 1987-03-17 | At&T Technologies, Inc. | Method and apparatus for capacitive keyboard scanning |
JPH0195596A (en) | 1987-10-08 | 1989-04-13 | Casio Comput Co Ltd | Small-sized electronic equipment |
US5021638A (en) | 1987-08-27 | 1991-06-04 | Lucas Duraltih Corporation | Keyboard cover |
JP2871802B2 (en) | 1990-04-19 | 1999-03-17 | アルプス電気株式会社 | Illuminated key top |
US6001199A (en) | 1990-10-24 | 1999-12-14 | Hunter Douglas Inc. | Method for manufacturing a fabric light control window covering |
US5138119A (en) | 1991-03-15 | 1992-08-11 | Lucas Duralith Corporation | Backlit tactile keyboard with improved tactile and electrical characteristics |
US5220521A (en) | 1992-01-02 | 1993-06-15 | Cordata Incorporated | Flexible keyboard for computers |
US6344791B1 (en) | 1998-07-24 | 2002-02-05 | Brad A. Armstrong | Variable sensor with tactile feedback |
US5331443A (en) | 1992-07-31 | 1994-07-19 | Crown Roll Leaf, Inc. | Laser engraved verification hologram and associated methods |
US5283559A (en) | 1992-09-21 | 1994-02-01 | International Business Machines Corp. | Automatic calibration of a capacitive touch screen used with a fixed element flat screen display panel |
US5363075A (en) | 1992-12-03 | 1994-11-08 | Hughes Aircraft Company | Multiple layer microwave integrated circuit module connector assembly |
WO1995012208A2 (en) | 1993-10-26 | 1995-05-04 | Marketing Partners, Gesellschaft für Marketing-Projecting und Marketing-Services mbH | Flat input keyboard for data processing machines or the like and process for producing the same |
US5681220A (en) | 1994-03-18 | 1997-10-28 | International Business Machines Corporation | Keyboard touchpad combination in a bivalve enclosure |
JPH07313733A (en) | 1994-05-25 | 1995-12-05 | Nintendo Co Ltd | Electronic game machine, main body device and manipulator to be used for the same |
US5649306A (en) | 1994-09-16 | 1997-07-15 | Motorola, Inc. | Portable radio housing incorporating diversity antenna structure |
US5548477A (en) | 1995-01-27 | 1996-08-20 | Khyber Technologies Corporation | Combination keyboard and cover for a handheld computer |
US5618232A (en) | 1995-03-23 | 1997-04-08 | Martin; John R. | Dual mode gaming device methods and systems |
US5828770A (en) | 1996-02-20 | 1998-10-27 | Northern Digital Inc. | System for determining the spatial position and angular orientation of an object |
US5781406A (en) | 1996-03-05 | 1998-07-14 | Hunte; Stanley G. | Computer desktop keyboard cover with built-in monitor screen & wrist-support accessory |
US5940065A (en) | 1996-03-15 | 1999-08-17 | Elo Touchsystems, Inc. | Algorithmic compensation system and method therefor for a touch sensor panel |
WO1997040482A1 (en) | 1996-04-24 | 1997-10-30 | Logitech, Inc. | Touch and pressure sensing method and apparatus |
US5745376A (en) | 1996-05-09 | 1998-04-28 | International Business Machines Corporation | Method of detecting excessive keyboard force |
TW338816B (en) | 1996-08-09 | 1998-08-21 | Sony Co Ltd | Input aparatus |
US5818361A (en) | 1996-11-07 | 1998-10-06 | Acevedo; Elkin | Display keyboard |
US6178443B1 (en) | 1996-12-20 | 2001-01-23 | Intel Corporation | Method and apparatus for propagating user preferences across multiple computer environments |
US5807175A (en) | 1997-01-15 | 1998-09-15 | Microsoft Corporation | Dynamic detection of player actuated digital input devices coupled to a computer port |
US5874697A (en) | 1997-02-14 | 1999-02-23 | International Business Machines Corporation | Thin keyboard switch assembly with hinged actuator mechanism |
JPH10326124A (en) | 1997-05-26 | 1998-12-08 | Hitachi Ltd | Portable information terminal equipment |
JPH1120848A (en) | 1997-06-30 | 1999-01-26 | Nec Corp | Opening/closing hinge structure of housing |
TW389918B (en) | 1997-08-24 | 2000-05-11 | Sony Computer Entertainment Inc | Game apparatus, game machine manipulation device, game system and interactive communication method for game apparatus |
TW388894B (en) | 1997-10-09 | 2000-05-01 | Nissha Printing | High strength touch panel and manufacturing method therefor |
US6005209A (en) | 1997-11-24 | 1999-12-21 | International Business Machines Corporation | Thin keyboard having torsion bar keyswitch hinge members |
US6040823A (en) | 1997-12-02 | 2000-03-21 | Cts | Computer keyboard having top molded housing with rigid pointing stick integral and normal to front surface of housing as one unit part to be used with strain sensors in navigational control |
US6061644A (en) | 1997-12-05 | 2000-05-09 | Northern Digital Incorporated | System for determining the spatial position and orientation of a body |
EP1717682B1 (en) | 1998-01-26 | 2017-08-16 | Apple Inc. | Method and apparatus for integrating manual input |
US6022012A (en) | 1998-03-12 | 2000-02-08 | Hewlett-Packard Company | Modular automatic document feeder for a flat bed input device |
US6898315B2 (en) | 1998-03-23 | 2005-05-24 | Microsoft Corporation | Feature extraction for real-time pattern recognition using single curve per pattern analysis |
FR2777441B1 (en) | 1998-04-21 | 2000-09-15 | Kreon Ind | SYSTEM FOR REVEALING A THREE-DIMENSIONAL SHAPE, IN PARTICULAR A PLANT VOUCH, AND METHOD FOR MAKING A SHOE OR AN ORTHOPEDIC SOLE IMPLEMENTING THE SYSTEM |
US5971635A (en) | 1998-05-11 | 1999-10-26 | Music Sales Corporation | Piano-style keyboard attachment for computer keyboard |
US6603408B1 (en) | 1998-06-01 | 2003-08-05 | Brenda Lewellen Gaba | Flexible membrane keyboard |
US7268774B2 (en) | 1998-08-18 | 2007-09-11 | Candledragon, Inc. | Tracking motion of a writing instrument |
US6704864B1 (en) | 1999-08-19 | 2004-03-09 | L.V. Partners, L.P. | Automatic configuration of equipment software |
US6044717A (en) | 1998-09-28 | 2000-04-04 | Xerox Corporation | Pressure and force profile sensor and method for detecting pressure |
US6042075A (en) | 1998-11-10 | 2000-03-28 | Burch, Jr.; Warren E. | Computer copy holder for keyboard drawer |
US6279060B1 (en) | 1998-12-04 | 2001-08-21 | In-System Design, Inc. | Universal serial bus peripheral bridge simulates a device disconnect condition to a host when the device is in a not-ready condition to avoid wasting bus resources |
US6254105B1 (en) | 1999-04-02 | 2001-07-03 | Elo Touchsystems, Inc. | Sealing system for acoustic wave touchscreens |
JP2001018048A (en) | 1999-06-30 | 2001-01-23 | Sony Corp | Injection-formation of low melting point metallic material, injection-forming apparatus and box body |
US6147859A (en) | 1999-08-18 | 2000-11-14 | Ops, Inc. | Modular external peripheral housing |
US6532147B1 (en) | 1999-09-24 | 2003-03-11 | International Business Machines Corporation | Flexible monitor/display on mobile device |
US7123292B1 (en) | 1999-09-29 | 2006-10-17 | Xerox Corporation | Mosaicing images with an offset lens |
US6725318B1 (en) | 2000-02-29 | 2004-04-20 | Microsoft Corporation | Automated selection between a USB and PS/2 interface for connecting a keyboard to a computer |
US6543949B1 (en) | 2000-03-23 | 2003-04-08 | Eugene B. Ritchey | Keyboard support apparatus |
US6861961B2 (en) | 2000-03-30 | 2005-03-01 | Electrotextiles Company Limited | Foldable alpha numeric keyboard |
US6962454B1 (en) | 2000-04-04 | 2005-11-08 | Costello Pamella A | Keyboard protective cover |
US6313731B1 (en) | 2000-04-20 | 2001-11-06 | Telefonaktiebolaget L.M. Ericsson | Pressure sensitive direction switches |
US6970957B1 (en) | 2000-04-24 | 2005-11-29 | Microsoft Corporation | Dynamically configuring resources for cycle translation in a computer system |
US6449147B2 (en) | 2000-05-01 | 2002-09-10 | Patent Category Corp. | Collapsible structures having enhancements |
LU90578B1 (en) | 2000-05-05 | 2001-11-06 | Iee Sarl | Sensor mat for vehicle |
US6511378B1 (en) | 2000-05-05 | 2003-01-28 | Intel Corporation | Method of identifying game controllers in multi-player game |
JP2002041231A (en) | 2000-05-17 | 2002-02-08 | Hitachi Ltd | Display unit of screen entry type |
EP1282852A1 (en) | 2000-05-18 | 2003-02-12 | Eleksen Limited | Data input device |
US6774888B1 (en) | 2000-06-19 | 2004-08-10 | International Business Machines Corporation | Personal digital assistant including a keyboard which also acts as a cover |
US6468672B1 (en) * | 2000-06-29 | 2002-10-22 | Lacks Enterprises, Inc. | Decorative chrome electroplate on plastics |
DE60142101D1 (en) | 2000-08-11 | 2010-06-24 | Alps Electric Co Ltd | Input device with key input operation and coordinate input operation |
US6329617B1 (en) | 2000-09-19 | 2001-12-11 | Lester E. Burgess | Pressure activated switching device |
US6784869B1 (en) | 2000-11-15 | 2004-08-31 | The Boeing Company | Cursor and display management system for multi-function control and display system |
US6600121B1 (en) | 2000-11-21 | 2003-07-29 | Think Outside, Inc. | Membrane switch |
US6617536B2 (en) | 2000-11-29 | 2003-09-09 | Yazaki Corporation | Dome switch |
US7289083B1 (en) | 2000-11-30 | 2007-10-30 | Palm, Inc. | Multi-sided display for portable computer |
JP3617958B2 (en) | 2001-03-07 | 2005-02-09 | 株式会社東芝 | Housing for display device |
DE10116556A1 (en) | 2001-04-03 | 2002-10-10 | Siemens Ag | Input device, in particular for a mobile phone, module with an input device and method for production |
US6819316B2 (en) | 2001-04-17 | 2004-11-16 | 3M Innovative Properties Company | Flexible capacitive touch sensor |
WO2002095896A2 (en) | 2001-05-18 | 2002-11-28 | Microlab, Inc. | Apparatus utilizing latching micromagnetic switches |
US20020195177A1 (en) | 2001-06-21 | 2002-12-26 | The Aerospace Corporation | Conductive shape memory metal deployment latch hinge deployment method |
US6585435B2 (en) | 2001-09-05 | 2003-07-01 | Jason Fang | Membrane keyboard |
CN1303508C (en) | 2001-11-09 | 2007-03-07 | 美蓓亚株式会社 | Touch panel assembly |
US7907394B2 (en) | 2001-11-19 | 2011-03-15 | Otter Products, Llc | Protective enclosure for touch screen device |
US6685369B2 (en) | 2001-12-10 | 2004-02-03 | Andy Lien | Housing assembly for membrane keyboard |
US6950950B2 (en) | 2001-12-28 | 2005-09-27 | Hewlett-Packard Development Company, L.P. | Technique for conveying overload conditions from an AC adapter to a load powered by the adapter |
LU90871B1 (en) | 2001-12-28 | 2003-06-30 | Iee Sarl | Flexible keyboard |
US7126498B2 (en) | 2002-02-27 | 2006-10-24 | Digit Wireless, Llc | Keypad construction |
JP2003257282A (en) | 2002-03-04 | 2003-09-12 | Alps Electric Co Ltd | Sheet with movable contact |
GB2386346B (en) | 2002-03-12 | 2005-06-15 | Eleksen Ltd | Flexible foldable keyboard |
US6882337B2 (en) | 2002-04-18 | 2005-04-19 | Microsoft Corporation | Virtual keyboard for touch-typing using audio feedback |
US7542052B2 (en) | 2002-05-31 | 2009-06-02 | Hewlett-Packard Development Company, L.P. | System and method of switching viewing orientations of a display |
US6856506B2 (en) | 2002-06-19 | 2005-02-15 | Motion Computing | Tablet computing device with three-dimensional docking support |
US6776546B2 (en) | 2002-06-21 | 2004-08-17 | Microsoft Corporation | Method and system for using a keyboard overlay with a touch-sensitive display screen |
US7126588B2 (en) | 2002-06-27 | 2006-10-24 | Intel Corporation | Multiple mode display apparatus |
KR100460956B1 (en) | 2002-07-03 | 2004-12-09 | 삼성전자주식회사 | A Keyboard of a personal digital assistant |
AU2003223068A1 (en) | 2002-07-16 | 2004-02-02 | Nokia Corporation | Flexible cover for a mobile telephone |
US7051149B2 (en) | 2002-08-29 | 2006-05-23 | Lite-On Technology Corporation | Method for transceiving non-USB device by an adapter and apparatus using the same |
US6824321B2 (en) | 2002-09-19 | 2004-11-30 | Siemens Communications, Inc. | Keypad assembly |
US7253723B2 (en) | 2003-05-19 | 2007-08-07 | Donnelly Corporation | Mirror assembly |
US6813143B2 (en) | 2002-10-21 | 2004-11-02 | Nokia Corporation | Mobile device featuring 90 degree rotatable front cover for covering or revealing a keyboard |
US7559834B1 (en) | 2002-12-02 | 2009-07-14 | Microsoft Corporation | Dynamic join/exit of players during play of console-based video game |
WO2004061592A2 (en) | 2002-12-16 | 2004-07-22 | Microsoft Corporation | Systems and methods for interfacing with computer devices |
US7194662B2 (en) | 2003-02-28 | 2007-03-20 | International Business Machines Corporation | Method, apparatus and program storage device for providing data path optimization |
US6864573B2 (en) | 2003-05-06 | 2005-03-08 | Daimlerchrysler Corporation | Two piece heat sink and device package |
US7502803B2 (en) | 2003-05-28 | 2009-03-10 | Hewlett-Packard Development Company, L.P. | System and method for generating ACPI machine language tables |
US7083295B1 (en) | 2003-05-30 | 2006-08-01 | Global Traders And Suppliers, Inc. | Electroluminescent bags |
ATE494644T1 (en) | 2003-06-12 | 2011-01-15 | Research In Motion Ltd | MULTI-ELEMENT ANTENNA WITH FLOATING PARASITIC ANTENNA ELEMENT |
DE10327453A1 (en) | 2003-06-18 | 2005-01-27 | Bayer Materialscience Ag | Composite systems for the production of decorated plastic molded parts and a method for producing the composite systems |
US7007125B2 (en) | 2003-06-24 | 2006-02-28 | International Business Machines Corporation | Pass through circuit for reduced memory latency in a multiprocessor system |
KR20060066061A (en) | 2003-07-23 | 2006-06-15 | 가부시키가이샤 소니 컴퓨터 엔터테인먼트 | Communication device, game system, connection establishment method, communication method, adapter device, and communication system |
US20050059489A1 (en) | 2003-09-12 | 2005-03-17 | Kim Taek Sung | Motion sensing applications |
US7256768B2 (en) | 2003-09-16 | 2007-08-14 | Microsoft Corporation | Computer keyboard with quantitatively force-sensing keys |
CN1291822C (en) | 2003-09-29 | 2006-12-27 | 和椿科技股份有限公司 | System and method for generating cutting path automatically |
US7543393B2 (en) | 2003-12-16 | 2009-06-09 | Renishaw Plc | Method of calibrating a scanning system |
US7277087B2 (en) | 2003-12-31 | 2007-10-02 | 3M Innovative Properties Company | Touch sensing with touch down and lift off sensitivity |
US7620244B1 (en) | 2004-01-06 | 2009-11-17 | Motion Computing, Inc. | Methods and systems for slant compensation in handwriting and signature recognition |
JP4486395B2 (en) | 2004-04-08 | 2010-06-23 | ポリマテック株式会社 | Key sheet and key sheet fixing structure |
US8117651B2 (en) | 2004-04-27 | 2012-02-14 | Apple Inc. | Method and system for authenticating an accessory |
WO2005111986A2 (en) | 2004-05-07 | 2005-11-24 | Infinium Labs, Inc. | Multi-position multi-level user interface system |
JP4245512B2 (en) | 2004-05-24 | 2009-03-25 | アルプス電気株式会社 | Input device |
US7042713B2 (en) | 2004-05-26 | 2006-05-09 | Texas Instruments Incorporated | Slide case with pivotable stand member for handheld computing device |
US20050264653A1 (en) | 2004-05-27 | 2005-12-01 | Starkweather James A | Portable electronic device with adjustable image capture orientation and method therefore |
WO2005119404A1 (en) | 2004-06-01 | 2005-12-15 | Beech Technology Incorporated | Portable, folding and separable multi-display computing system |
US7733326B1 (en) | 2004-08-02 | 2010-06-08 | Prakash Adiseshan | Combination mouse, pen-input and pen-computer device |
US7724242B2 (en) | 2004-08-06 | 2010-05-25 | Touchtable, Inc. | Touch driven method and apparatus to integrate and display multiple image layers forming alternate depictions of same subject matter |
KR100651938B1 (en) | 2004-08-16 | 2006-12-06 | 엘지전자 주식회사 | apparatus, method and medium for controlling image orientation |
US7667962B2 (en) | 2004-08-20 | 2010-02-23 | Mullen Jeffrey D | Wireless devices with flexible monitors and keyboards |
US7636921B2 (en) | 2004-09-01 | 2009-12-22 | Ati Technologies Inc. | Software and methods for previewing parameter changes for a graphics display driver |
EP1796918A1 (en) * | 2004-09-03 | 2007-06-20 | Koninklijke Philips Electronics N.V. | Method and apparatus for application of a pattern, element and device provided with such a pattern |
TWI265431B (en) | 2004-09-07 | 2006-11-01 | Acer Inc | Notebook computer with antenna array module |
US7256996B2 (en) | 2004-10-14 | 2007-08-14 | Bountiful Wifi Llc | Wireless router |
US7392410B2 (en) | 2004-10-15 | 2008-06-24 | Dell Products L.P. | Power adapter having power supply identifier information functionality |
CN100500778C (en) | 2004-11-23 | 2009-06-17 | 鸿富锦精密工业(深圳)有限公司 | Anti-fingeprinting surface coating |
US7823214B2 (en) | 2005-01-07 | 2010-10-26 | Apple Inc. | Accessory authentication for electronic devices |
US8369795B2 (en) | 2005-01-12 | 2013-02-05 | Microsoft Corporation | Game console notification system |
US7639876B2 (en) | 2005-01-14 | 2009-12-29 | Advanced Digital Systems, Inc. | System and method for associating handwritten information with one or more objects |
GB0503291D0 (en) | 2005-02-17 | 2005-03-23 | Eleksen Ltd | Mobile communication |
US7499037B2 (en) | 2005-03-29 | 2009-03-03 | Wells Gardner Electronics Corporation | Video display and touchscreen assembly, system and method |
CN1854944B (en) * | 2005-04-20 | 2011-02-09 | Jds尤尼弗思公司 | Patterned structures with optically variable effects |
US7928964B2 (en) | 2005-04-22 | 2011-04-19 | Microsoft Corporation | Touch input data handling |
US20070072474A1 (en) | 2005-04-27 | 2007-03-29 | Nigel Beasley | Flexible power adapter systems and methods |
US8532587B2 (en) | 2005-06-03 | 2013-09-10 | Hewlett-Packard Development Company, L.P. | Usage mode-based antenna selection |
US7337085B2 (en) | 2005-06-10 | 2008-02-26 | Qsi Corporation | Sensor baseline compensation in a force-based touch device |
US7447934B2 (en) | 2005-06-27 | 2008-11-04 | International Business Machines Corporation | System and method for using hot plug configuration for PCI error recovery |
GB0515175D0 (en) | 2005-07-25 | 2005-08-31 | Plastic Logic Ltd | Flexible resistive touch screen |
US20070062089A1 (en) | 2005-08-31 | 2007-03-22 | Homer Steven S | Display device |
KR100723903B1 (en) | 2005-11-11 | 2007-06-04 | 후지쯔 가부시끼가이샤 | Electronic apparatus |
JP4694388B2 (en) | 2006-02-28 | 2011-06-08 | 任天堂株式会社 | Input device using touch panel |
US7656392B2 (en) | 2006-03-24 | 2010-02-02 | Synaptics Incorporated | Touch sensor effective area enhancement |
JP2007272341A (en) | 2006-03-30 | 2007-10-18 | Toshiba Corp | Arithmetic device, arithmetic device system, and power control method |
JP5105767B2 (en) | 2006-04-26 | 2012-12-26 | 株式会社東芝 | Information processing apparatus and operation control method thereof |
US20070260892A1 (en) | 2006-05-08 | 2007-11-08 | Paul Christopher R | System and method for authenticating a power source |
JP4216865B2 (en) | 2006-05-29 | 2009-01-28 | 株式会社東芝 | Information equipment that can communicate |
US7827426B2 (en) | 2006-06-05 | 2010-11-02 | Tte Technology Inc. | Low power mode override system and method |
US20080005423A1 (en) | 2006-06-06 | 2008-01-03 | Robert Alan Jacobs | Method and device for acting on stylus removal |
US7326864B2 (en) | 2006-06-07 | 2008-02-05 | International Business Machines Corporation | Method and apparatus for masking keystroke sounds from computer keyboards |
US8169421B2 (en) | 2006-06-19 | 2012-05-01 | Cypress Semiconductor Corporation | Apparatus and method for detecting a touch-sensor pad gesture |
DE102006037431A1 (en) * | 2006-08-09 | 2008-04-17 | Ovd Kinegram Ag | Production of multi-layer bodies useful in element for security- and value document such as banknotes and credit cards, by forming a relief structure in an area of replication layer and applying a layer on carrier and/or replication layer |
CN200947406Y (en) | 2006-08-16 | 2007-09-12 | 达方电子股份有限公司 | Keyboard assembly device |
JP2008061342A (en) | 2006-08-30 | 2008-03-13 | Mitsumi Electric Co Ltd | Electronic system, electronic device, and power supply device |
US7813715B2 (en) | 2006-08-30 | 2010-10-12 | Apple Inc. | Automated pairing of wireless accessories with host devices |
WO2008038293A2 (en) * | 2006-09-27 | 2008-04-03 | Yissum Research Development Company Of The Hebrew University Of Jerusalem | Electrochemical co-deposition of sol-gel films |
US8046619B2 (en) | 2006-10-03 | 2011-10-25 | Avaya Inc. | Apparatus and methods for data distribution devices having selectable power supplies |
KR101330121B1 (en) | 2006-10-30 | 2013-11-26 | 삼성전자주식회사 | Computer system and control method |
US7973771B2 (en) | 2007-04-12 | 2011-07-05 | 3M Innovative Properties Company | Touch sensor with electrode array |
US20080151478A1 (en) | 2006-12-21 | 2008-06-26 | Jr-Jiun Chern | Hinge for laptop computer |
US8026904B2 (en) | 2007-01-03 | 2011-09-27 | Apple Inc. | Periodic sensor panel baseline adjustment |
US8130203B2 (en) | 2007-01-03 | 2012-03-06 | Apple Inc. | Multi-touch input discrimination |
US8054296B2 (en) | 2007-01-03 | 2011-11-08 | Apple Inc. | Storing baseline information in EEPROM |
US8462109B2 (en) | 2007-01-05 | 2013-06-11 | Invensense, Inc. | Controlling and accessing content using motion processing on mobile devices |
KR20080064424A (en) | 2007-01-05 | 2008-07-09 | 삼성전자주식회사 | Portable communication device with flexible display |
US20080238884A1 (en) | 2007-03-29 | 2008-10-02 | Divyasimha Harish | Edge sensors forming a touchscreen |
US7946774B2 (en) | 2007-04-16 | 2011-05-24 | The Matias Corporation | Folding keyboard with numeric keypad |
US7639329B2 (en) | 2007-05-01 | 2009-12-29 | Nitto Denko Corporation | Liquid crystal panel and liquid crystal display apparatus |
WO2008137553A1 (en) | 2007-05-01 | 2008-11-13 | Hewlett-Packard Development Company, L.P. | Bi-directional control of power adapter and load |
US7884807B2 (en) | 2007-05-15 | 2011-02-08 | Synaptics Incorporated | Proximity sensor and method for indicating a display orientation change |
EP2148238A4 (en) | 2007-05-18 | 2012-04-25 | Sega Kk Dba Sega Corp | Digitizer function-equipped liquid crystal display device, information processing electronic device, and game device |
US8416197B2 (en) | 2007-06-15 | 2013-04-09 | Ricoh Co., Ltd | Pen tracking and low latency display updates on electronic paper displays |
US8059101B2 (en) | 2007-06-22 | 2011-11-15 | Apple Inc. | Swipe gestures for touch screen keyboards |
US8078787B2 (en) | 2007-06-22 | 2011-12-13 | Apple Inc. | Communication between a host device and an accessory via an intermediate device |
US8086781B2 (en) | 2007-06-22 | 2011-12-27 | Apple Inc. | Serial pass-through device |
US20080316002A1 (en) | 2007-06-25 | 2008-12-25 | Brunet Peter T | Pre-configuration of user preferences |
US8065624B2 (en) | 2007-06-28 | 2011-11-22 | Panasonic Corporation | Virtual keypad systems and methods |
JP4442648B2 (en) | 2007-06-28 | 2010-03-31 | ミツミ電機株式会社 | Panel switch manufacturing method and panel switch |
US8014138B2 (en) | 2007-07-05 | 2011-09-06 | Daley Iii Charles A | Bag computer manual character input device and cover |
KR101354372B1 (en) | 2007-07-31 | 2014-01-23 | 삼성전자주식회사 | Reinforce for printed circuit board and integrated circuit package using the same |
US8146005B2 (en) | 2007-08-07 | 2012-03-27 | International Business Machines Corporation | Creating a customized avatar that reflects a user's distinguishable attributes |
US8099144B2 (en) | 2007-08-20 | 2012-01-17 | Google Inc. | Electronic device with hinge mechanism |
US7932890B2 (en) | 2007-08-30 | 2011-04-26 | Citizen Electronics Co., Ltd. | Lightguide plate and electronic device |
CN101388482A (en) | 2007-09-10 | 2009-03-18 | 耀登科技股份有限公司 | Antenna mounting method for notebook type computer |
JP4643624B2 (en) | 2007-09-21 | 2011-03-02 | 株式会社東芝 | ANTENNA DEVICE AND ELECTRONIC DEVICE |
KR100938684B1 (en) | 2007-10-16 | 2010-01-25 | 코오롱글로텍주식회사 | Electronic fabric and preparing thereof |
US9723709B2 (en) | 2007-10-22 | 2017-08-01 | Todd Steigerwald | Method for assigning control channels |
US20090262492A1 (en) | 2007-10-26 | 2009-10-22 | Seal Shield, Llc | Submersible keyboard |
US8488306B2 (en) | 2007-11-08 | 2013-07-16 | Sideline, Inc. | Secondary computing device display system |
US8232977B2 (en) | 2007-11-14 | 2012-07-31 | N-Trig Ltd. | System and method for detection with a digitizer sensor |
US20120094257A1 (en) | 2007-11-15 | 2012-04-19 | Electronic Brailler | Remote braille education system and device |
US20090140985A1 (en) | 2007-11-30 | 2009-06-04 | Eric Liu | Computing device that determines and uses applied pressure from user interaction with an input interface |
US20100250988A1 (en) | 2007-12-27 | 2010-09-30 | Panasonic Corporation | Video display system, display device, plug-in module and power control method of plug-in module |
TWI356433B (en) | 2007-12-27 | 2012-01-11 | Htc Corp | Keyboard module and electronic apparatus |
US20090174679A1 (en) | 2008-01-04 | 2009-07-09 | Wayne Carl Westerman | Selective Rejection of Touch Contacts in an Edge Region of a Touch Surface |
US8456438B2 (en) | 2008-01-04 | 2013-06-04 | Tactus Technology, Inc. | User interface system |
US8154527B2 (en) | 2008-01-04 | 2012-04-10 | Tactus Technology | User interface system |
US8403576B2 (en) | 2008-01-07 | 2013-03-26 | Google Inc. | Keyboard for hand held computing device |
CA2749234A1 (en) | 2008-01-11 | 2009-07-16 | Sang-Kyu Ryu | Foldable keyboard for portable computer |
JP5171282B2 (en) | 2008-01-21 | 2013-03-27 | キヤノン株式会社 | Image shake correction apparatus, imaging apparatus, optical apparatus, and image shake correction apparatus control method |
US8464078B2 (en) | 2008-01-22 | 2013-06-11 | Hewlett-Packard Development Company, L.P. | Delay circuit with reset feature |
US8310444B2 (en) | 2008-01-29 | 2012-11-13 | Pacinian Corporation | Projected field haptic actuation |
JP4384228B2 (en) | 2008-01-31 | 2009-12-16 | 株式会社東芝 | Mold and method for producing cast product |
CN101513812B (en) * | 2008-02-21 | 2013-11-13 | 比亚迪股份有限公司 | Method and control device for manufacturing product shell patterns |
JP2009251895A (en) | 2008-04-04 | 2009-10-29 | Sony Corp | Power exchange device, power exchange method, program, and power exchange system |
KR101051311B1 (en) | 2008-04-22 | 2011-07-22 | 한국과학기술원 | Textile Input Device |
US8159399B2 (en) | 2008-06-03 | 2012-04-17 | Apple Inc. | Antenna diversity systems for portable electronic devices |
JP2009296377A (en) | 2008-06-05 | 2009-12-17 | Toshiba Corp | Electronic apparatus |
US8154524B2 (en) | 2008-06-24 | 2012-04-10 | Microsoft Corporation | Physics simulation-based interaction for surface computing |
WO2009155951A1 (en) | 2008-06-27 | 2009-12-30 | Nokia Corporation | Portable electronic device with a plurality of hinged configurations and associated method |
US20090321490A1 (en) | 2008-06-27 | 2009-12-31 | Microsoft Corporation | Laptop computer carrier |
US7975348B2 (en) | 2008-06-27 | 2011-07-12 | Shin Zu Shing Co., Ltd. | Pivoting slide hinge |
US7817428B2 (en) | 2008-06-27 | 2010-10-19 | Greer Jr David Randall | Enclosure with integrated heat wick |
US8842076B2 (en) | 2008-07-07 | 2014-09-23 | Rockstar Consortium Us Lp | Multi-touch touchscreen incorporating pen tracking |
US9335868B2 (en) | 2008-07-31 | 2016-05-10 | Apple Inc. | Capacitive sensor behind black mask |
US20100038821A1 (en) | 2008-08-18 | 2010-02-18 | Microsoft Corporation | Tactile Enhancement For Input Devices |
US20100045609A1 (en) | 2008-08-20 | 2010-02-25 | International Business Machines Corporation | Method for automatically configuring an interactive device based on orientation of a user relative to the device |
US8536471B2 (en) | 2008-08-25 | 2013-09-17 | N-Trig Ltd. | Pressure sensitive stylus for a digitizer |
JP5079646B2 (en) | 2008-08-26 | 2012-11-21 | 新光電気工業株式会社 | Semiconductor package, manufacturing method thereof, and semiconductor device |
TWI367442B (en) | 2008-08-27 | 2012-07-01 | Au Optronics Corp | Touch panel |
US20100051432A1 (en) | 2008-09-04 | 2010-03-04 | Goda Technology Co., Ltd. | Membrane type computer keyboard |
US8023261B2 (en) | 2008-09-05 | 2011-09-20 | Apple Inc. | Electronic device assembly |
US8382059B2 (en) | 2008-09-09 | 2013-02-26 | Zero Chroma, LLC | Holder for electronic device with support |
US7978281B2 (en) | 2008-09-16 | 2011-07-12 | General Dynamics Land Systems | Low stress mounting support for ruggedized displays |
US8059039B2 (en) | 2008-09-25 | 2011-11-15 | Apple Inc. | Clutch barrel antenna for wireless electronic devices |
US8688037B2 (en) | 2008-09-26 | 2014-04-01 | Hewlett-Packard Development Company, L.P. | Magnetic latching mechanism for use in mating a mobile computing device to an accessory device |
US20100085321A1 (en) | 2008-10-03 | 2010-04-08 | Mark Stephen Pundsack | Small touch sensitive interface allowing selection of multiple functions |
EP2863289A1 (en) | 2008-11-18 | 2015-04-22 | Studer Professional Audio GmbH | Input device and method of detecting a user input with an input device |
WO2010060211A1 (en) | 2008-11-28 | 2010-06-03 | Nortel Networks Limited | Method and apparatus for controling a camera view into a three dimensional computer-generated virtual environment |
US7945717B2 (en) | 2008-12-09 | 2011-05-17 | Symbol Technologies, Inc. | Method and apparatus for providing USB pass through connectivity |
US9684375B2 (en) | 2008-12-12 | 2017-06-20 | Immersion Corporation | Systems and methods for stabilizing a haptic touch panel or touch surface |
US8674941B2 (en) | 2008-12-16 | 2014-03-18 | Dell Products, Lp | Systems and methods for implementing haptics for pressure sensitive keyboards |
US8250001B2 (en) | 2008-12-18 | 2012-08-21 | Motorola Mobility Llc | Increasing user input accuracy on a multifunctional electronic device |
US8248371B2 (en) | 2008-12-19 | 2012-08-21 | Verizon Patent And Licensing Inc. | Accelerometer sensitive soft input panel |
CN101465107B (en) | 2008-12-31 | 2010-12-08 | 华为终端有限公司 | Display device and terminal using the same, and display method |
US8441441B2 (en) | 2009-01-06 | 2013-05-14 | Qualcomm Incorporated | User interface for mobile devices |
WO2010080698A1 (en) | 2009-01-07 | 2010-07-15 | Audiovox Corporation | Laptop computer antenna device |
US8902191B2 (en) | 2009-01-28 | 2014-12-02 | Synaptics Incorporated | Proximity sensing for capacitive touch sensors |
BRPI0920480A2 (en) | 2009-01-30 | 2015-12-22 | Hewlett Packard Development Co | integrated circuit connection structure and integrated circuit connection method |
CN101807134B (en) | 2009-02-13 | 2011-12-07 | 太瀚科技股份有限公司 | Electromagnetic induction system and unilateral coordinate positioning method |
TWI406004B (en) | 2009-02-19 | 2013-08-21 | Largan Precision Co Ltd | Imaging optical lens assembly |
US8229509B2 (en) | 2009-02-27 | 2012-07-24 | Microsoft Corporation | Protective shroud for handheld device |
CN102388003B (en) | 2009-03-02 | 2014-11-19 | 苹果公司 | Techniques for strengthening glass covers for portable electronic devices |
US8565829B2 (en) | 2009-03-02 | 2013-10-22 | Lg Electronics Inc. | Mobile terminal with detachably coupled sub-device |
NO332210B1 (en) | 2009-03-23 | 2012-07-30 | Cisco Systems Int Sarl | Interface unit between video conferencing codec and interactive whiteboard |
WO2010105336A1 (en) | 2009-03-18 | 2010-09-23 | Sierra Wireless, Inc. | Multiple antenna system for wireless communication |
JP5493739B2 (en) | 2009-03-19 | 2014-05-14 | ソニー株式会社 | Sensor device and information processing device |
JP2010257325A (en) | 2009-04-27 | 2010-11-11 | Sony Corp | Control system, operation device, and control method |
US8246467B2 (en) | 2009-04-29 | 2012-08-21 | Apple Inc. | Interactive gaming with co-located, networked direction and location aware devices |
WO2010135260A2 (en) | 2009-05-18 | 2010-11-25 | Boston-Power, Inc. | Energy efficient and fast charge modes of a rechargeable battery |
JP2010272384A (en) | 2009-05-22 | 2010-12-02 | Panasonic Corp | Sheet with movable contact and method for manufacturing the same |
US8861737B2 (en) | 2009-05-28 | 2014-10-14 | Qualcomm Incorporated | Trust establishment from forward link only to non-forward link only devices |
KR20100128702A (en) | 2009-05-29 | 2010-12-08 | 삼성전자주식회사 | A mobile terminal having two touch screen display panels |
US9058063B2 (en) | 2009-05-30 | 2015-06-16 | Sony Computer Entertainment Inc. | Tracking system calibration using object position and orientation |
US9383881B2 (en) | 2009-06-03 | 2016-07-05 | Synaptics Incorporated | Input device and method with pressure-sensitive layer |
US20100315348A1 (en) | 2009-06-11 | 2010-12-16 | Motorola, Inc. | Data entry-enhancing touch screen surface |
US20100325155A1 (en) | 2009-06-23 | 2010-12-23 | James Skinner | Systems and Methods for Providing Access to Various Files Across a Network |
US20100331059A1 (en) | 2009-06-30 | 2010-12-30 | Jeffrey Apgar | Apparatus with swivel hinge and associated method |
US8568184B2 (en) | 2009-07-15 | 2013-10-29 | Apple Inc. | Display modules |
US9430078B2 (en) | 2009-08-12 | 2016-08-30 | Google Technology Holdings LLC | Printed force sensor within a touch screen |
US8632864B2 (en) * | 2009-08-24 | 2014-01-21 | Lacks Industries, Inc. | Decorative surface finish and method of forming same |
CN102002712A (en) * | 2009-09-03 | 2011-04-06 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
EP2481209A1 (en) | 2009-09-22 | 2012-08-01 | Tenebraex Corporation | Systems and methods for correcting images in a multi-sensor system |
EP2491475A4 (en) | 2009-10-19 | 2015-03-11 | Bayer Ip Gmbh | Flexure assemblies and fixtures for haptic feedback |
CN102096490A (en) | 2009-12-09 | 2011-06-15 | 华硕电脑股份有限公司 | Method for controlling touch module and electronic device |
US20120256959A1 (en) | 2009-12-30 | 2012-10-11 | Cywee Group Limited | Method of controlling mobile device with touch-sensitive display and motion sensor, and mobile device |
US8069356B2 (en) | 2010-01-06 | 2011-11-29 | Apple Inc. | Accessory power management |
US8213168B2 (en) | 2010-01-06 | 2012-07-03 | Apple Inc. | Assembly of a display module |
US8432368B2 (en) | 2010-01-06 | 2013-04-30 | Qualcomm Incorporated | User interface methods and systems for providing force-sensitive input |
US8756445B2 (en) | 2010-01-06 | 2014-06-17 | Apple Inc. | Providing power to an accessory during portable computing device hibernation |
US8543745B2 (en) | 2010-01-06 | 2013-09-24 | Apple Inc. | Accessory for a portable computing device |
WO2011088147A2 (en) | 2010-01-12 | 2011-07-21 | Sensitronics, LLC | Method and apparatus for multi-touch sensing |
US8396661B2 (en) | 2010-01-26 | 2013-03-12 | Hewlett-Packard Development Company, L.P. | Using relative position data in a mobile computing device |
US20110179864A1 (en) | 2010-01-27 | 2011-07-28 | Stmicroelectronics, Inc. | Dual accelerometer detector for clamshell devices |
ITPD20100002U1 (en) | 2010-02-03 | 2011-08-04 | Ursus S P A | PERFECT STRUCTURE OF TELESCOPIC LOOP |
US20110193787A1 (en) | 2010-02-10 | 2011-08-11 | Kevin Morishige | Input mechanism for providing dynamically protruding surfaces for user interaction |
US20110205372A1 (en) | 2010-02-25 | 2011-08-25 | Ivan Miramontes | Electronic device and method of use |
US20110242138A1 (en) | 2010-03-31 | 2011-10-06 | Tribble Guy L | Device, Method, and Graphical User Interface with Concurrent Virtual Keyboards |
US20110248920A1 (en) | 2010-04-09 | 2011-10-13 | Microsoft Corporation | Keyboard with hinged keys and display functionality |
US20110261001A1 (en) | 2010-04-23 | 2011-10-27 | Jin Liu | Apparatus and method for impact resistant touchscreen display module |
WO2011146575A2 (en) | 2010-05-20 | 2011-11-24 | Salman Sajid | Combination protective case and stand for a tablet device and keyboard |
US8173893B2 (en) | 2010-05-28 | 2012-05-08 | Yao-Hung Huang | Electronic device case |
CN201725304U (en) | 2010-05-28 | 2011-01-26 | 深圳富泰宏精密工业有限公司 | Touch type transparent keyboard |
WO2011156275A2 (en) | 2010-06-07 | 2011-12-15 | Targus Group International, Inc. | Portable electronic device case accessories and related systems and methods |
US20110304577A1 (en) | 2010-06-11 | 2011-12-15 | Sp Controls, Inc. | Capacitive touch screen stylus |
US8674959B2 (en) | 2010-06-28 | 2014-03-18 | Intel Corporation | Dynamic bezel for a mobile device |
USD659139S1 (en) | 2010-07-08 | 2012-05-08 | Zagg Intellectual Property Holding Co., Inc. | Protective cover, including keyboard, for mobile computing device |
US8754862B2 (en) | 2010-07-11 | 2014-06-17 | Lester F. Ludwig | Sequential classification recognition of gesture primitives and window-based parameter smoothing for high dimensional touchpad (HDTP) user interfaces |
US8780002B2 (en) | 2010-07-15 | 2014-07-15 | Sony Corporation | Multiple-input multiple-output (MIMO) multi-band antennas with a conductive neutralization line for signal decoupling |
US8378857B2 (en) | 2010-07-19 | 2013-02-19 | Apple Inc. | Illumination of input device |
TW201205626A (en) | 2010-07-30 | 2012-02-01 | Primax Electronics Ltd | Dual force sensing keyboard |
TW201207698A (en) | 2010-08-05 | 2012-02-16 | Young Lighting Technology Corp | Touch keyboard and electronic device |
KR20130043229A (en) | 2010-08-17 | 2013-04-29 | 구글 인코포레이티드 | Touch-based gesture detection for a touch-sensitive device |
US8561207B2 (en) | 2010-08-20 | 2013-10-15 | Apple Inc. | Authenticating a multiple interface device on an enumerated bus |
US8638549B2 (en) | 2010-08-24 | 2014-01-28 | Apple Inc. | Electronic device display module |
TWM395866U (en) | 2010-08-25 | 2011-01-01 | Li-Yin Ho | Fixing structure for input device |
CN108681424B (en) | 2010-10-01 | 2021-08-31 | Z124 | Dragging gestures on a user interface |
US20120092279A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Touch sensor with force-actuated switched capacitor |
JP5794809B2 (en) | 2010-10-29 | 2015-10-14 | ミネベア株式会社 | Input device |
US9363005B2 (en) | 2010-11-05 | 2016-06-07 | Apple Inc. | Adaptive antenna diversity system |
KR101777376B1 (en) | 2010-11-08 | 2017-09-11 | 삼성전자주식회사 | Data storage device and driving method thereof |
US8400431B2 (en) | 2010-11-22 | 2013-03-19 | Integrated Device Technology Inc. | Method to improve performance of a proportional area weighted sensor for two-dimensional locations on a touch screen |
US8467186B2 (en) | 2010-12-07 | 2013-06-18 | Adonit Co. Ltd. | Tablet PC cover with integral keyboard |
KR20120063652A (en) | 2010-12-08 | 2012-06-18 | 삼성전자주식회사 | Antenna device for potable terminal |
JP5656599B2 (en) | 2010-12-09 | 2015-01-21 | キヤノン株式会社 | Switch unit |
US8681501B2 (en) | 2010-12-17 | 2014-03-25 | Aruba Networks, Inc. | Heat dissipation unit for a wireless network device |
JP5310715B2 (en) | 2010-12-28 | 2013-10-09 | ブラザー工業株式会社 | Image recording apparatus and program |
USD636397S1 (en) | 2010-12-28 | 2011-04-19 | Andrew Green | Computer stand |
CN102582159B (en) * | 2011-01-14 | 2015-10-21 | 永恒科技有限公司 | Sheet material that double-color surface is provided and forming method thereof |
US9335793B2 (en) | 2011-01-31 | 2016-05-10 | Apple Inc. | Cover attachment with flexible display |
US8665160B2 (en) | 2011-01-31 | 2014-03-04 | Apple Inc. | Antenna, shielding and grounding |
WO2012128893A1 (en) | 2011-02-24 | 2012-09-27 | Cypress Semiconductor Corporation | Single layer touch sensor |
US8896488B2 (en) | 2011-03-01 | 2014-11-25 | Apple Inc. | Multi-element antenna structure with wrapped substrate |
JP4960515B1 (en) | 2011-03-18 | 2012-06-27 | 株式会社東芝 | Electronics |
US8521942B2 (en) | 2011-03-21 | 2013-08-27 | Microsoft Corporation | HID over simple peripheral buses |
US20120274811A1 (en) | 2011-04-28 | 2012-11-01 | Dmitry Bakin | Imaging devices having arrays of image sensors and precision offset lenses |
WO2012162386A1 (en) | 2011-05-23 | 2012-11-29 | 360Brandvision, LLC | Accessory for reflecting an image from a display screen of a portable electronic device |
US8748767B2 (en) | 2011-05-27 | 2014-06-10 | Dell Products Lp | Sub-membrane keycap indicator |
CN102955588A (en) | 2011-08-17 | 2013-03-06 | 天津富纳源创科技有限公司 | Touch-control type keyboard and manufacturing method thereof |
US8907752B2 (en) | 2011-09-12 | 2014-12-09 | Justin Richard Wodrich | Integrated inductive charging in protective cover |
US20130076635A1 (en) | 2011-09-26 | 2013-03-28 | Ko Ja (Cayman) Co., Ltd. | Membrane touch keyboard structure for notebook computers |
US8515496B2 (en) | 2011-12-15 | 2013-08-20 | Amazon Technologies, Inc. | Antenna deployment switching for data communication of a user device |
US9870066B2 (en) | 2012-03-02 | 2018-01-16 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
US9460029B2 (en) | 2012-03-02 | 2016-10-04 | Microsoft Technology Licensing, Llc | Pressure sensitive keys |
US9064654B2 (en) | 2012-03-02 | 2015-06-23 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
US20130229366A1 (en) | 2012-03-02 | 2013-09-05 | Rajesh Manohar Dighde | Support for an Optically Bonded Display Device |
US9073123B2 (en) | 2012-06-13 | 2015-07-07 | Microsoft Technology Licensing, Llc | Housing vents |
US8654030B1 (en) | 2012-10-16 | 2014-02-18 | Microsoft Corporation | Antenna placement |
EP2908970B1 (en) | 2012-10-17 | 2018-01-03 | Microsoft Technology Licensing, LLC | Metal alloy injection molding protrusions |
WO2014059625A1 (en) | 2012-10-17 | 2014-04-24 | Microsoft Corporation | Metal alloy injection molding overflows |
WO2014059619A1 (en) | 2012-10-17 | 2014-04-24 | Microsoft Corporation | Object profile for object machining |
-
2012
- 2012-10-17 WO PCT/CN2012/083074 patent/WO2014059618A1/en active Application Filing
-
2013
- 2013-03-04 US US13/784,746 patent/US9661770B2/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9793073B2 (en) | 2012-03-02 | 2017-10-17 | Microsoft Technology Licensing, Llc | Backlighting a fabric enclosure of a flexible cover |
US9870066B2 (en) | 2012-03-02 | 2018-01-16 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
US9904327B2 (en) | 2012-03-02 | 2018-02-27 | Microsoft Technology Licensing, Llc | Flexible hinge and removable attachment |
US10963087B2 (en) | 2012-03-02 | 2021-03-30 | Microsoft Technology Licensing, Llc | Pressure sensitive keys |
US9432070B2 (en) | 2012-10-16 | 2016-08-30 | Microsoft Technology Licensing, Llc | Antenna placement |
Also Published As
Publication number | Publication date |
---|---|
US20140248506A1 (en) | 2014-09-04 |
US9661770B2 (en) | 2017-05-23 |
WO2014059618A1 (en) | 2014-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9661770B2 (en) | Graphic formation via material ablation | |
US9890074B2 (en) | Electronic device, glass cover and method of manufacturing glass cover | |
TWI573064B (en) | Display panel structure with concealed blind hole and its making method | |
US20100000668A1 (en) | Method for forming an embossed holographic pattern | |
JP2010100052A (en) | Housing and method for manufacturing the same | |
KR20140000549A (en) | Apparatus and method for manufacturing housing | |
KR20180084014A (en) | thin decoration layer cover unit | |
US20110033637A1 (en) | Method and apparatus for printing on a surface | |
EP2808167B1 (en) | Method of manufacturing case frame | |
CN101365306B (en) | Window plate structure of display panel and manufacturing method therefor | |
JP2007169310A (en) | Coating agent and portable electronic instrument | |
JP2019111834A (en) | Decorative member | |
JP3211875U (en) | Decorative material | |
JPH0342271A (en) | Manufacture of transfer material | |
JP2007326264A (en) | Metallic tone decorative molded object | |
KR20150034456A (en) | Film for protecting LCD surface and method for manufacturing the same | |
JPWO2019244229A1 (en) | Methods and equipment for forming structures, sheets and antifouling paint layers | |
US9249494B2 (en) | Method for producing metal film of touch panel | |
CN110008788A (en) | Electronic device and its fingerprint identification module | |
TW201931201A (en) | Electronic device and fingerprint identification module thereof | |
CN114554754B (en) | Electronic equipment and preparation method of metal workpiece | |
US20220413549A1 (en) | Single surface top covers for information handling systems | |
US10369827B2 (en) | Transfer film | |
US20190241008A1 (en) | Hot foil logo | |
US20160326664A1 (en) | Treating a Substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MICROSOFT CORPORATION, WASHINGTON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MCCORMACK, MARK THOMAS;MASTER, RAJ N.;LANE, MICHAEL JOSEPH;AND OTHERS;SIGNING DATES FROM 20121120 TO 20130218;REEL/FRAME:029947/0671 |
|
AS | Assignment |
Owner name: MICROSOFT TECHNOLOGY LICENSING, LLC, WASHINGTON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICROSOFT CORPORATION;REEL/FRAME:034747/0417 Effective date: 20141014 Owner name: MICROSOFT TECHNOLOGY LICENSING, LLC, WASHINGTON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MICROSOFT CORPORATION;REEL/FRAME:039025/0454 Effective date: 20141014 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |