US20160126492A1 - Encapsulation film for organic light emitting display device, method of manufacturing the same, and organic light emitting display device using the same - Google Patents

Encapsulation film for organic light emitting display device, method of manufacturing the same, and organic light emitting display device using the same Download PDF

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Publication number
US20160126492A1
US20160126492A1 US14/829,148 US201514829148A US2016126492A1 US 20160126492 A1 US20160126492 A1 US 20160126492A1 US 201514829148 A US201514829148 A US 201514829148A US 2016126492 A1 US2016126492 A1 US 2016126492A1
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Prior art keywords
adhesive layer
light emitting
organic light
emitting display
film
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Abandoned
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US14/829,148
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English (en)
Inventor
Se Ung KYOUNG
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LG Display Co Ltd
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LG Display Co Ltd
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Application filed by LG Display Co Ltd filed Critical LG Display Co Ltd
Assigned to LG DISPLAY CO., LTD. reassignment LG DISPLAY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KYOUNG, SE UNG
Publication of US20160126492A1 publication Critical patent/US20160126492A1/en
Priority to US15/801,621 priority Critical patent/US10424758B2/en
Abandoned legal-status Critical Current

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Definitions

  • the present invention relates to an encapsulation film for organic light emitting display apparatuses, a method of manufacturing the same, and an organic light emitting display apparatus using the same. More particularly, the present invention relates to an encapsulation film for organic light emitting display apparatuses, a method of manufacturing the same, and an organic light emitting display apparatus using the same, in which degrees of cure of an outer portion and a center portion of an adhesive layer are differently set. Thus, reliability and productivity of the organic light emitting display apparatus are enhanced.
  • Organic light emitting display apparatuses which self-emitting display apparatuses, are display apparatuses using the principle that an organic emission layer is disposed between two electrodes, an electron and a hole are injected from the two electrodes into the organic emission layer, and light is emitted by a combination of the injected electron and hole. Since the organic light emitting display apparatuses do not use a separate light source, unlike liquid crystal display (LCD) apparatuses, the organic light emitting display apparatus may be manufactured to be light and thin. Also, the organic light emitting display apparatuses have low power consumption because of a low driving voltage and are good in response time and viewing angle. Thus, they are being researched as next-generation display apparatuses.
  • the organic light emitting display apparatuses are categorized into a top emission type, a bottom emission type, and a dual emission type depending on a direction where light is emitted. Also, the organic light emitting display apparatuses are categorized into an active matrix type and a passive matrix type depending on a driving mode.
  • Organic light emitting display apparatus are vulnerable to water (H 2 O) or oxygen (O 2 ).
  • H 2 O water
  • O 2 oxygen
  • an organic light emitting device which includes an anode, an organic emission layer, and a cathode
  • a metal electrode is oxidized, or the organic emission layer is deteriorated, causing problems of a reduction in lifetime and various defects such as a dark spot, pixel shrinkage, and/or the like.
  • a side encapsulation method using a shield cap formed of metal or glass, or a front encapsulation method where an adhesive layer is coated all over an organic light emitting device is being used.
  • the front encapsulation method which enables a thickness of an organic light emitting display apparatus to be thinned and may be applied to flexible organic light emitting display apparatuses is being much researched recently.
  • an upper substrate may use a metal layer.
  • organic light emitting display apparatuses each include a lower substrate, on which an organic light emitting device is disposed, and an upper substrate disposed on the organic light emitting device.
  • the upper substrate may use an opaque metal layer.
  • the upper substrate of the organic light emitting display apparatus uses a metal layer, lightening and thinning are more easily made than a structure using a glass substrate, and thus, a weight and a thickness of the organic light emitting display apparatus are reduced. Therefore, a structure which enables a thin metal layer to be applied to the organic light emitting display apparatus is being continuously researched.
  • a bottom emission type organic light emitting display apparatus using the front encapsulation method may be manufactured by bonding a substrate, on which an organic light emitting device is disposed, to a metal layer with an adhesive layer adhered thereto.
  • the adhesive layer is disposed between the substrate and the metal layer and fixes the substrate to the metal layer in a face seal method.
  • the adhesive layer seals the organic light emitting device to protect the organic light emitting device against the penetration of external water or oxygen.
  • the adhesive layer is formed of a curing resin which is low in viscosity, namely, is good in flowability, and for this reason, the adhesive layer stretches due to heat and pressure in a process of bonding the substrate to the metal layer. Since the flowability of the adhesive layer enables a step height of the substrate including the organic light emitting device to be covered, the flowability is an important factor for sealing the organic light emitting device, but since the adhesive layer more stretches or expands than a design value in a process of sealing an outer portion of the adhesive layer, it is difficult to accurately seal the adhesive layer.
  • the pad electrically connected to the organic light emitting device is disposed at the outer portion of the substrate and is connected to the external circuit unit (for example, a flexible printed circuit board with a driver integrated circuit (IC) mounted thereon) that supplies various signals to the organic light emitting device.
  • the external circuit unit for example, a flexible printed circuit board with a driver integrated circuit (IC) mounted thereon
  • the metal layer adhered to the adhesive layer is first fixed to a jig having a plate shape, and a process of bonding the metal layer to the substrate including the organic light emitting device is performed.
  • the jig is detached from the metal layer.
  • the adhesive layer stretches to the jig through the metal layer, a portion of the adhesive layer clings to the jig.
  • the portion of the adhesive layer clinging to the jig is not easily removed in a general cleaning process.
  • the jig is reused in a manufacturing process, and a plurality of metal layers having various sizes are repeatedly fixed to and detached from the jig.
  • a portion of the adhesive layer clinging to the jig moves and clings to another metal layer, or the adhesive layer hinders the jig from being detached from the other metal layer.
  • a portion of the adhesive layer clings to another metal layer a surface of the metal layer is damaged by a foreign material, causing a reduction in reliability of the organic light emitting display apparatus.
  • the jig cannot be detached from the metal layer, and for this reason, the metal layer itself is damaged in a manufacturing process.
  • the jig is used to fix a panel or the like in addition to fixing the metal layer, a portion of the adhesive layer clings to a glass substrate of the panel, causing a defective screen of the panel.
  • the inventors of the present invention have recognized the above-described problems, and by researching on a structure and method for controlling a flowability of an outer portion of the adhesive layer, the inventors have invented an encapsulation film, having a new structure, for organic light emitting display apparatuses, a method of manufacturing the same, and an organic light emitting display apparatus using the same, in which reliability and productivity of the organic light emitting display apparatus are enhanced.
  • the present invention is directed to provide an encapsulation film for organic light emitting display apparatuses, a method of manufacturing the same, and an organic light emitting display apparatus using the same that substantially obviate one or more problems due to limitations and disadvantages of the related art.
  • An aspect of the present invention is directed to provide an encapsulation film for organic light emitting display apparatuses and a method of manufacturing the same, in which viscosities of an outer portion and a center portion of an adhesive layer are differently set, and thus, a driving defect is prevented from occurring in a process of manufacturing the organic light emitting display apparatus, and a water blocking function of the adhesive layer is prevented from being deteriorated due to water or oxygen which penetrates into the adhesive layer for a process standby time.
  • Another aspect of the present invention is directed to provide an organic light emitting display apparatus in which an outer portion of an adhesive layer is set higher in degree of cure than a center portion of the adhesive layer, and thus, a driving defect is prevented from occurring because the adhesive layer stretches in a manufacturing process, and various defects are prevented from being caused by a jig, thereby enhancing reliability and productivity of the organic light emitting display apparatus.
  • Another aspect of the present invention is directed to provide a method of manufacturing an encapsulation film for organic light emitting display apparatuses, which simplifies a manufacturing process and shortens a process tack time by simultaneously performing a process of removing a portion of an adhesive layer and a process of increasing a viscosity of a portion of the adhesive layer, thereby contributing to enhance productivity.
  • an encapsulation film for an organic light emitting display apparatus including an adhesive layer that is disposed between a metal layer and a protective layer and includes a first portion and a second portion.
  • a viscosity of the second portion of the adhesive layer is higher than a viscosity of the first portion of the adhesive layer. Accordingly, a driving defect that occurs in a process of manufacturing an organic light emitting display apparatus and an incidence of deterioration of a water blocking function of the adhesive layer are effectively reduced.
  • a structure including a first film having metal properties and a second film having adhesive properties.
  • the second film having adhesive properties is adhered to one surface of the first film having metal properties.
  • the second film includes an area having relatively lower viscosity and another area that has relatively high viscosity and surrounds an outer portion of the area having relatively lower viscosity, and the second film enables roll-to-roll processing to be performed.
  • the first film and the second film are provided as one body to function as an encapsulation part for organic light emitting display apparatuses. Accordingly, a process of manufacturing an organic light emitting display apparatus is simplified, and the manufacturing cost is effectively reduced.
  • an organic light emitting display apparatus including an organic light emitting device on a substrate, an adhesive layer configured to seal the organic light emitting device, and a metal layer on the adhesive layer.
  • the adhesive layer includes a first portion and a second portion. A degree of cure of the second portion is higher than a degree of cure of the first portion. Since an outer portion of an adhesive layer is set higher in degree of cure than a center portion of the adhesive layer, and thus, a driving defect is prevented from occurring because the adhesive layer stretches in a manufacturing process, and various defects are prevented from being caused by a jig, thereby enhancing reliability and productivity of the organic light emitting display apparatus.
  • a method of manufacturing an encapsulation film for organic light emitting display apparatuses including laminating a base metal layer and a base adhesive layer, forming an adhesive layer including a first portion, and a second portion that is higher in viscosity than the first portion by removing a cut portion of the base adhesive layer with a first laser, and forming a metal layer by removing a cut portion of the base metal layer with a second laser.
  • the second portion is formed simultaneously with removing the cut portion of the base adhesive layer, and thus, a manufacturing process is simplified, and productivity is effectively enhanced.
  • FIG. 1A is a plan view illustrating an encapsulation film for organic light emitting display apparatuses, according to an embodiment of the present invention
  • FIG. 1B is a cross-sectional view taken along line I-I′ of FIG. 1A ;
  • FIG. 2A is a plan view illustrating an encapsulation film for organic light emitting display apparatuses, according to another embodiment of the present invention.
  • FIG. 2B is a cross-sectional view taken along line II-II′ of FIG. 2A ;
  • FIG. 3 is a flowchart for describing a method of manufacturing an encapsulation film for organic light emitting display apparatuses, according to an embodiment of the present invention.
  • FIGS. 4 to 7 are cross-sectional views and perspective views describing a method of manufacturing an encapsulation film for organic light emitting display apparatuses according to an embodiment of the present invention.
  • FIG. 1A is a plan view illustrating an encapsulation film 10 for organic light emitting display apparatuses, according to an embodiment of the present invention
  • FIG. 1B is a cross-sectional view taken along line I-I′ of FIG. 1A .
  • the encapsulation film 10 may include a metal layer 13 , an adhesive layer 14 , and a protective layer 15 .
  • the adhesive layer 14 may be disposed between the metal layer 13 and the protective layer 15 and may include a first portion 14 a and a second portion 14 b .
  • the first portion 14 a may be referred to as a first area
  • the second portion 14 b may be referred to as a second area.
  • the adhesive layer 14 may be formed of a photocurable resin, a thermocurable resin, or the like, and for example, may be formed of at least one of epoxy, phenol, amino, rubber, unsaturated polyester, silicone, acryl, vinyl, olefin, polyimide, and/or the like.
  • Resins available for the adhesive layer 14 may have benefits and disadvantages. Therefore, a resin applied to the adhesive layer 14 may be selected by taking into account electrical, mechanical, and chemical characteristics and may also be selected by further taking into account performance and cost.
  • the second portion 14 b of the adhesive layer 14 may surround the first portion 14 a . That is, the second portion 14 b may correspond to an outer portion of the adhesive layer 14 , and the first portion 14 a may correspond to a center portion of the adhesive layer 14 .
  • a viscosity of the first portion 14 a and a viscosity of the second portion 14 b of the adhesive layer 14 may be differently set.
  • the viscosity of the second portion 14 b of the adhesive layer 14 may be set higher than that of the first portion 14 a .
  • the viscosity of the second portion 14 b being high set may be effective for controlling a flowability of the adhesive layer 14 .
  • the second portion 14 b of the adhesive layer 14 may control the adhesive layer so as not to excessively stretch.
  • the second portion 14 b of the adhesive layer 14 may be higher in degree of cure “D” than the first portion 14 a .
  • the first portion 14 a may be in a non-cured state where a resin is not yet cured, namely, the resin does not undergo a curing process, and may be low in viscosity.
  • the second portion 14 b may be in a cured state where a resin has undergone the curing process and may be high in viscosity.
  • the degree of cure “D” may be defined as the following Equation (1):
  • H 1 denotes heat that is generated while a sample in a non-cured state is completely cured
  • H 2 denotes heat that is generated while a sample to be measured is completely cured
  • a sample 1 may be formed of a material “A” and may be in a non-cured state where the curing process is not yet performed
  • a sample 2 may be formed of the material “A” and may be in a state where the curing process has been performed for a certain time.
  • a degree of cure of the sample 1 is as follows.
  • a degree of cure of the sample 2 may be “60%((100 ⁇ 40)/100*100)”. That is, as a sample is more cured, the degree of cure “D” may be measured to have a higher value.
  • the degree of cure “D” of the second portion 14 b may be higher than that of the first portion 14 a .
  • reaction energy of the first portion 14 a may be higher than that of the second portion 14 b . Since the first portion 14 is hardly cured, the first portion 14 a may include residual reaction energy to be cured later. However, since the second portion 14 b is almost cured, the second portion 14 b may hardly include residual reaction energy to be cured later.
  • the heat “H 1 ” or “H 2 ” or residual reaction energy for calculating the degree of cure “D” may have a value that is obtained by measuring the first portion 14 a and second portion 14 b of the adhesive layer 14 in differential scanning calorimetry (DSC).
  • the first portion 14 a may be in a non-cured state or may be very slowly cured even for a standby time. Therefore, a degree of cure “D” of the first portion 14 a may be about 0.1% to about 15% depending on a place where the encapsulation film 10 is kept and a time for which the encapsulation film 10 is kept.
  • the second portion 14 b may be in a cured state, and a degree of cure “D” of the second portion 14 b may be about 95% to about 100%. In other words, the degree of cure of the second portion 14 b may be equal to or greater than 95% and equal to or less than 100%.
  • the second portion 14 b may be in a completely cured state, where the degree of cure “D” is 100%, depending on a curing method and a manufacturing process. A more detailed method of manufacturing the encapsulation film 10 may be described below in detail with reference to FIGS. 3 to 7 .
  • the second portion 14 b of the adhesive layer 14 may be in a cured state and may completely surround the first portion 14 a . Therefore, external water or oxygen which penetrates into the adhesive layer 14 for a process standby time in a process of manufacturing an organic light emitting display apparatus is reduced. In detail, a side surface of the adhesive layer 14 may be exposed to the atmosphere as-is, and thus, the adhesive layer 14 is much affected by the penetration of water or oxygen. If the second portion 14 b corresponding to the side surface and an outer portion of the adhesive layer 14 is previously cured, a bonding force between particles of the side surface is strengthened. Therefore, it is difficult for water or oxygen to penetrate through the side surface and outer portion of the adhesive layer 14 , and thus, water penetration speed is lowered. Accordingly, when the second portion 14 b of the adhesive layer 14 is in a cured state and completely surrounds the first portion 14 a , an incidence of a reduction in a water blocking function of the adhesive layer 14 is minimized.
  • the metal layer 13 may act as a substrate of the organic light emitting display apparatus.
  • each of the adhesive layer 14 and the metal layer 13 may function as an encapsulation part of the organic light emitting display apparatus.
  • the metal layer 13 may be formed of one of iron (Fe), nickel (Ni), aluminum (Al), copper (Cu), tungsten (W), and/or the like, or may be formed by a combination thereof.
  • a thickness of the metal layer 13 may be about 1 ⁇ m to about 1,000 ⁇ m. Referring to FIGS. 1A and 1B , an area of the metal layer 13 may be broader than that of the adhesive layer 14 .
  • a surface size of the metal layer 13 may have a larger value than that of the adhesive layer 14 .
  • an area of the metal layer 13 is broader than that of the adhesive layer 14 , the adhesive layer 14 is more effectively supported and protected.
  • the metal layer 13 may be used as a margin area for a case where the adhesive layer 14 stretches due to pressure caused by bonding.
  • the protective layer 15 may support and protect the adhesive layer 14 until the encapsulation film 10 is applied to the organic light emitting display apparatus.
  • the protective layer 15 may be formed of a polymer material, and for example, may be one of a polyethylene film, a lypropylene film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, a polyurethane film, an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, a polyimide film, and/or the like.
  • the second portion 14 b corresponding to the outer portion of the adhesive layer 14 is higher in viscosity than the first portion 14 a corresponding to the center portion of the adhesive layer 14 , it is easy to control a flowability of the adhesive layer 14 , and the water blocking function of the adhesive layer 14 is prevented from being deteriorated due to water or oxygen which penetrates into the inside through the side surface of the adhesive layer 14 .
  • FIG. 2A is a plan view illustrating an encapsulation film for organic light emitting display apparatuses, according to another embodiment of the present invention
  • FIG. 2B is a cross-sectional view taken along line II-II′ of FIG. 2A
  • elements corresponding to the elements described above with reference to FIGS. 1A and 1B are not repeated in describing an organic light emitting display apparatus 100 including the encapsulation film 10 of FIGS. 1A and 1B .
  • the present embodiment may be construed with reference to the descriptions of FIGS. 1A and 1B .
  • the organic light emitting display apparatus 100 may include a substrate 110 , an organic light emitting device 120 , an adhesive layer 140 , and a metal layer 130 .
  • the substrate 110 may be formed of a transparent glass material, and when the organic light emitting display apparatus 100 is a flexible organic light emitting display apparatus, the substrate 110 may be formed of a flexible material such as plastic or the like.
  • the substrate 110 as illustrated in FIGS. 2A and 2B , may have an area which is broader than that of the metal layer 130 .
  • An external circuit unit may be connected to an outer portion of the substrate 110 , and a pad 160 for supplying various signals to the organic light emitting device 120 may be disposed at the outer portion. Light emitted from the organic light emitting device 120 may be transferred to the outside through the substrate 110 .
  • the organic light emitting device 120 may be disposed on the substrate 110 and may include two electrodes and an organic emission layer disposed therebetween.
  • the organic emission layer may be formed in a single emission layer structure that emits one light, or may be formed in a multi-emission layer structure that emits white light.
  • the present embodiment is not limited thereto. In other embodiments, the organic emission layer may be formed in various stacked structures depending on a design of the organic light emitting device 120 .
  • the adhesive layer 140 may be disposed on the organic light emitting device 120 and may include a first portion 140 a and a second portion 140 b.
  • the adhesive layer 140 may be formed of a photocurable resin or a thermocurable resin.
  • the adhesive layer 140 may use a material that is cured in a visible light range, for example, a wavelength range of about 380 nm to about 800 nm. The reason is because when the adhesive layer 140 disposed on the organic light emitting device 120 is cured by irradiating light, light in an infrared range damages the organic light emitting device 120 .
  • the adhesive layer 140 may use a material that is cured at a temperature (for example, a temperature of about 200 degrees C. or less) that does not damage the organic light emitting device 120 .
  • the first portion 140 a of the adhesive layer 140 may seal the organic light emitting device 120 .
  • the first portion 140 a may cover a step height of the substrate 110 on which the organic light emitting device 120 is disposed, and thus protects the organic light emitting device 120 from an external impact or the penetration of water or oxygen.
  • a degree of cure of the second portion 140 b of the adhesive layer 140 may be higher than that of the first portion 140 a . Also, reaction energy of the second portion 140 b of the adhesive layer 140 may be higher than that of the first portion 140 a . This will be described below in more detail.
  • the metal layer 130 to which the adhesive layer 140 is adhered may be bonded to the substrate 110 , on which the organic light emitting device 120 is disposed, by heat and pressure.
  • the adhesive layer 140 may include a center portion in a non-cured state and an outer portion in a cured state.
  • a process of curing the adhesive layer 140 may be performed.
  • a curing temperature may be a temperature which does not damage the organic light emitting device 120 , and for example, the curing process may be performed for about three hours at about 100 degrees C. That is, in the curing process, a temperature applied to the adhesive layer 140 may be limited, and a curing time may also be limited in consideration of a process tack time.
  • the first portion 140 a corresponding to the center portion of the adhesive layer 140 in a non-cured state may be cured to only a degree of having characteristic for sealing the organic light emitting device 120 .
  • the second portion 140 b corresponding to an outer portion of the adhesive layer 140 in a cured state may be almost completely cured by heat which is additionally supplied thereto in a state where the second portion 140 b is cured to a certain degree. Therefore, a degree of cure of the first portion 140 a may be about 90% to about 95%, and a degree of cure of the second portion 140 b may be about 98% to about 100%.
  • the degree of cure of the first portion 140 a may be equal to or greater than 90% and equal to or less than 95%
  • the degree of cure of the second portion 140 b may be equal to or greater than 98% and equal to or less than 100%.
  • the second portion 140 b may be in a completely cured state, where the degree of cure is 100%, depending on a method of curing the encapsulation film and a process of manufacturing the encapsulation film. Also, residual reaction energy may be changed due to a difference between the degree of cure of the first portion 140 a and the degree of cure of the second portion 140 b . That is, reaction energy of the first portion 140 a may be measured higher than that of the second portion 140 b.
  • the second portion 140 b of the adhesive layer 140 may surround the first portion 140 a .
  • water or oxygen which penetrates into the adhesive layer 140 for a process standby time in a manufacturing process is reduced.
  • water or oxygen may penetrate through a side surface of the adhesive layer 140 .
  • the degree of cure of the second portion 140 b corresponding to the side surface and outer portion of the adhesive layer 140 is very high, an incidence of water or oxygen penetration is reduced, and the organic light emitting device 120 is more effectively protected.
  • the second portion 140 b may be more opaque than the first portion 140 a due to the difference between the degree of cure of the first portion 140 a and the degree of cure of the second portion 140 b .
  • the second portion 140 b may be black.
  • a width D 1 of the second portion 140 b may be about 1 ⁇ m to about 300 ⁇ m.
  • the width D 1 of the second portion 140 b is less than 1 ⁇ m, it is difficult to sufficiently control a flowability of the adhesive layer 140 .
  • the second portion 140 b may be adhered to the substrate 110 in a state of being cured to a certain degree, and an adhesive force between the second portion 140 b and the substrate 110 may be lower than an adhesive force between the first portion 140 a and the substrate 110 .
  • the adhesive force between the second portion 140 b and the substrate 110 may be weakened, and for this reason, water or oxygen penetrates into the organic light emitting device 120 through an interface between the adhesive layer 140 and the substrate 110 .
  • the second portion 140 b does not overlap the organic light emitting device 120 , external water or oxygen which penetrates through the interface between the adhesive layer 140 and the substrate 110 is reduced, and the organic light emitting device 120 is more effectively protected.
  • the metal layer 130 may have an area which is broader than that of the adhesive layer 140 . That is, when seen through a cross-sectional surface, a side surface of the metal layer 130 may protrude further than the side surface of the adhesive layer 140 . Therefore, the adhesive layer 140 is more effectively supported and protected.
  • the metal layer 130 may be used as a margin area for a case where the adhesive layer 140 stretches due to pressure caused by bonding. Also, as described above, each of the adhesive layer 140 and the metal layer 130 may function as an encapsulation part of the organic light emitting display apparatus 100 .
  • the adhesive layer 140 since the degree of cure of the second portion 140 b corresponding to the outer portion of the adhesive layer 140 is higher than that of the first portion 140 a corresponding to the center portion of the adhesive layer 140 , the adhesive layer 140 may be controlled not to excessively stretch, and the adhesive layer 140 may cover a portion of a pad 160 which is disposed at an outer portion of the substrate 110 , thereby reducing a driving defect.
  • FIG. 3 is a flowchart describing a method of manufacturing an encapsulation film 10 for organic light emitting display apparatuses, according to an embodiment of the present invention.
  • FIGS. 4 to 7 are cross-sectional views and perspective views describing a method of manufacturing the encapsulation film 10 for organic light emitting display apparatuses, according to an embodiment of the present invention. In describing the present embodiment, detailed descriptions of elements which are the same as or correspond to the preceding embodiment are not provided.
  • a base metal layer 73 and a base adhesive layer 74 may be laminated in operation S 310 .
  • the base metal layer 73 rolled up around a second roller R 2 and the base adhesive layer 74 and a base protective layer 75 rolled up around a first roller R 1 may be laminated by a third roller R 3 and a fourth roller R 4 in order for the base metal layer 73 to face the base adhesive layer 74 .
  • the laminated base metal layer 73 , base adhesive layer 74 , and base protective layer 75 may configure a base encapsulation film 70 , which may be rolled up around a fifth roller R 5 .
  • Such a method may be referred to as a roll-to-roll method.
  • a process of manufacturing the encapsulation film 70 may be performed through the roll-to-roll method where a layer is unrolled from one roller and is rolled up around another roller, and thus, a process tact time and productivity are enhanced.
  • an adhesive layer may be formed by removing a cut portion C 1 of the base adhesive layer 74 with a first laser L 1 .
  • the adhesive layer may include a first portion and a second portion which is higher in viscosity than the first portion.
  • the first laser L 1 may be irradiated onto the base protective layer 75 of the base encapsulation film 70 rolled up around the fifth roller R 5 .
  • the cut portion C 1 of the base adhesive layer 74 and a portion of the base protective layer 75 corresponding to the cut portion C 1 of the base adhesive layer 74 may be removed together.
  • the cut portion C 1 of the base adhesive layer 74 may determine a shape of the encapsulation film 10 which is finally manufactured.
  • the cut portion C 1 of the base adhesive layer 74 is illustrated in a tetragonal shape, but is not limited thereto. In other embodiments, the cut portion C 1 of the base adhesive layer 74 may have various sizes and shapes.
  • FIG. 5B illustrates a cross-sectional view taken along line III-III′ of FIG. 5A .
  • the cut portion C 1 of the base adhesive layer 74 and a portion of the base protective layer 75 may be removed by the first laser L 1 , and simultaneously, a side surface contacting the cut portion C 1 of the base adhesive layer 74 may be cured by the first laser L 1 . That is, the base adhesive layer 74 may be separated into an adhesive layer 14 and a remaining adhesive layer 14 R by the first laser L 1 , and the base protective layer 75 may be separated into a protective layer 15 and a remaining protective layer 15 R by the first laser L 1 .
  • the adhesive layer 14 may be divided into a first portion 14 a in a non-cured state and a second portion 14 b in a cured state. Accordingly, a viscosity of the second portion 14 b of the adhesive layer 14 may be higher than that of the first portion 14 a.
  • the second portion 14 b of the adhesive layer 14 may be formed on all side surfaces and outer portions of the adhesive layer corresponding to the cut portion C 1 of the base adhesive layer 74 and thus may surround the first portion 14 a.
  • the first laser L 1 may remove the base adhesive layer 74 and the base protective layer 75 which are each formed of a resin, and may be a gas laser.
  • the gas laser may use a gas as an illuminator of a laser, and for example, may use a He—Ne gas, a CO 2 gas, or the like.
  • a width D 1 of the second portion 14 b of the adhesive layer 14 may be about 1 ⁇ m to about 300 ⁇ m and may be adjusted by an intensity of the first laser L 1 .
  • the intensity of the first laser L 1 may be adjusted by using an irradiation time, the amount of supplied gas, an irradiation speed, a voltage, and/or the like.
  • the second portion 14 b of the adhesive layer 14 may be completely cured by the first laser L 1 .
  • a temperature of a cut side surface may instantaneously rise to a maximum of 1,500 degrees C., and thus, the second portion 14 b may be completely cured.
  • the second portion 14 b of the adhesive layer 14 may have the form of soot which has black due to a high temperature.
  • the metal layer 13 may be formed by removing a cut portion C 2 of the base metal layer 73 with a second layer L 2 .
  • the second laser L 2 may be irradiated to correspond to the cut portion C 2 of the base metal layer 73 .
  • An irradiation area of the second laser L 2 may correspond to an irradiation area of the first laser L 1 , and the cut portion C 2 of the base metal layer 73 may be removed by the second laser L 2 .
  • the second laser L 2 may remove a metal material, and for example, may be an optical fiber laser or the like.
  • FIG. 6B illustrates a cross-sectional view taken along line III-III′ of FIG. 6A .
  • the base metal layer 73 may be separated into a metal layer 13 and a remaining metal layer 13 R by the second laser L 2 . Therefore, as illustrated in FIG. 7 , an encapsulation film 10 including the metal layer 13 , the adhesive layer 14 , and the protective layer 15 may be finished.
  • a width of the cut portion C 2 of the base metal layer 73 may be formed more narrow than that of the cut portion C 1 of the base adhesive layer 74 , and thus, an area of the metal layer 13 of the encapsulation film 10 may be formed broader than that of the adhesive layer 14 .
  • the first laser L 1 may be determined based on a material characteristic of the base adhesive layer 74
  • the second laser L 2 may be determined based on a material characteristic of the base metal layer 73
  • the first laser L 1 may determine a width of the cut portion C 1 of the base adhesive layer 74
  • the second laser L 2 may determine a width of the cut portion C 2 of the base metal layer 73 . That is, it is difficult for cut portions of different layers to have different widths in a one-time laser process. Therefore, when a laser process is performed at least twice, a side surface of the metal layer 13 may be more stably formed to protrude further than a side surface of the adhesive layer 14 .
  • the metal layer and the adhesive layer that each function as the encapsulation part of the organic light emitting display apparatus may be manufactured as an integrated encapsulation film.
  • the encapsulation film 10 which includes the adhesive layer 14 and the metal layer 13 may be adhered to the organic light emitting device at a time or simultaneously without forming the adhesive layer 14 and the metal layer 13 .
  • the process of manufacturing the organic light emitting display apparatus is simplified, and the cost of materials is reduced.
  • the second portion 14 b may be completely cured by adjusting an intensity of the first laser L 1 , and thus, the encapsulation film 10 reduces water or oxygen which penetrates into the adhesive layer 14 in the process of manufacturing the organic light emitting display apparatus, and prevents the water blocking function of the adhesive layer 14 from being deteriorated.
  • the encapsulation film 10 manufactured by the manufacturing method according to an embodiment of the present invention may be referred to as a structure which includes a first film having metal properties and a second film having adhesive properties.
  • the metal layer 13 of the encapsulation film 10 may be the first film having metal properties
  • the adhesive layer 14 may be the second film having adhesive properties.
  • the structure which includes the first film and the second film may be configured as an integrated type to function as the encapsulation part for organic light emitting display apparatuses.
  • the first film may be adhered to one surface of the second film, and the second film may include an area 14 a having relatively low viscosity and an area 14 b which has relatively high viscosity and surrounds an outer portion of the area 14 a having relatively low viscosity.
  • the second film may be implemented in order for roll-to-roll processing to be performed, and the area 14 b where the viscosity of the second film is relatively high may be formed through heat or light curing in performing a laser cutting process on the structure.
  • a dimension of the area 14 b having relatively high viscosity may be designed based on at least one of a condition of the laser cutting process, a condition for functioning as the encapsulation part for organic light emitting display apparatuses, and a characteristic condition of the second film.
  • the area 14 b having relatively high viscosity may have a dimension which enables flowability to be controlled in order for the structure to function as the encapsulation part for organic light emitting display apparatuses, a dimension where an adhesive characteristic of the structure is not considerably reduced, or a dimension for minimizing a penetration characteristic of external water or oxygen.
  • the area 14 b having relatively high viscosity may have a dimension based on the condition of the laser cutting process, for example, a laser irradiation time, the amount of supplied gas, an irradiation speed, a voltage, and/or the like.
  • the area 14 b having relatively high viscosity may have a dimension based on a characteristic of the second film, for example, a material of the second film.
  • a side surface of the first film may protrude further than the side surface of the second film so as to effectively support and protect the second film and provide a margin area where the second film stretches due to heat or pressure in a bonding process of the second film.
  • FIGS. 4 to 7 a method of manufacturing the encapsulation film 10 with the two lasers L 1 and L 2 and a method of completely curing a portion of the adhesive layer 14 with a laser have been described, but another curing method may be used based on a process environment and a process condition.
  • a metal bar having high heat conductivity may be disposed to correspond to a size of the second portion 14 b of the adhesive layer 14 , and the second portion 14 b may be cured by applying heat to the metal bar.
  • the curing method is difficult to adjust an accurate width of the second portion 14 b , but is easy to adjust the degree of cure of the second portion 14 b . Therefore, the curing method may be applied to a case of desiring to accurately adjust the degree of cure of the second portion 14 b to a desired value.
  • an area having relatively high viscosity may be formed through heat or light curing in the laser cutting process.
  • a side surface of a first film may be configured to protrude further than a side surface of a second film, and thus, the second film is effectively supported and protected, and a margin area for a case where the second film stretches due to heat or pressure in a bonding process of the second film may be provided.
  • a dimension of an area having relatively high viscosity may be designed based on at least one of a condition of a laser cutting process, a characteristic for functioning as an encapsulation part for organic light emitting display apparatuses, and a characteristic of the second film.
  • an adhesive layer may include a first area and a second area which is higher in viscosity than the first area, and the second area of the adhesive layer may surround the first area of the adhesive layer.
  • a degree of cure of the second area of the adhesive layer may be higher than a degree of cure of the first area.
  • reaction energy of the first area of the adhesive layer may be higher than reaction energy of the second area of the adhesive layer.
  • a degree of cure of the second area of the adhesive layer may be 95% to 100%.
  • an area of a metal layer may be broader than an area of an adhesive layer.
  • reaction energy of a first portion of an adhesive layer may be higher than reaction energy of a second portion of the adhesive layer.
  • a degree of cure of the second portion of the adhesive layer may be 98% to 100%.
  • the second portion of the adhesive layer may be more opaque than the first portion of the adhesive layer.
  • the second portion of the adhesive layer may not overlap an organic light emitting device.
  • a width of the second portion of the adhesive layer may be 1 ⁇ m to 300 ⁇ m.
  • a side surface of a metal layer may protrude further than a side surface of the adhesive layer.
  • the metal layer and the adhesive layer may be simultaneously adhered to the organic light emitting device.
  • a second portion may be formed to surround a first portion.
  • an irradiation area of a second laser may correspond to an irradiation area of a first laser.
  • the first laser may use a gas laser
  • the second laser may use an optical fiber laser
  • a width of a cut portion of a base metal layer may be narrower than a width of a cut portion of a base adhesive layer.
  • an area of a metal layer may be broader than an area of an adhesive layer.
  • a water blocking function of the adhesive layer is prevented from being deteriorated due to water or oxygen which penetrates into the adhesive layer for a process standby time.
  • a process of removing a portion of the adhesive layer and a process of increasing a viscosity of a portion of the adhesive layer are simultaneously performed, thereby simplifying a manufacturing process and enhancing productivity.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
US14/829,148 2014-10-29 2015-08-18 Encapsulation film for organic light emitting display device, method of manufacturing the same, and organic light emitting display device using the same Abandoned US20160126492A1 (en)

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CN108807486A (zh) * 2018-06-26 2018-11-13 武汉华星光电半导体显示技术有限公司 一种显示面板的制备方法及显示装置
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EP3016164B1 (de) 2019-10-23
KR20160052955A (ko) 2016-05-13
KR102271696B1 (ko) 2021-07-01
EP3016164A1 (de) 2016-05-04
US20180145276A1 (en) 2018-05-24
CN105575996A (zh) 2016-05-11
CN105575996B (zh) 2019-10-18
US10424758B2 (en) 2019-09-24

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