US20150210538A1 - Mems package structure - Google Patents
Mems package structure Download PDFInfo
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- US20150210538A1 US20150210538A1 US14/167,819 US201414167819A US2015210538A1 US 20150210538 A1 US20150210538 A1 US 20150210538A1 US 201414167819 A US201414167819 A US 201414167819A US 2015210538 A1 US2015210538 A1 US 2015210538A1
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- United States
- Prior art keywords
- mems
- package structure
- sealant
- chip
- lid
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Definitions
- the present invention generally relates to a chip package structure. More particularly, the present invention relates to a microelectromechanical system (MEMS) package structure.
- MEMS microelectromechanical system
- Microelectromechanical system is a microelectromechanical device fabricated in a microminiaturized package structure, and the fabricating technique thereof is quite similar to the technique of fabricating integrated circuits (ICs). However, interactions, for example, about mechanics, optics, or magnetic force between the MEMS device and surrounding environment are more than that of the conventional IC.
- the MEMS device may include micro-sized electromechanical components (for example, switches, mirrors, capacitors, accelerometers, sensors, capacitive sensors, or actuators etc.), and the MEMS device may be integrated with the IC in a manner of single block, thereby greatly modifying insertion loss or electrical isolation effect of the overall solid-state device.
- micro-sized electromechanical components for example, switches, mirrors, capacitors, accelerometers, sensors, capacitive sensors, or actuators etc.
- the MEMS device may be integrated with the IC in a manner of single block, thereby greatly modifying insertion loss or electrical isolation effect of the overall solid-state device.
- the MEMS device is extremely fragile and may be impacted by slight static electricity or surface tension at any moment to cause failure. Therefore, in order to prevent the MEMS device from contaminations or damages, usually the MEMS device is sealed in a space between the chip and the lid.
- FIG. 1 is a schematic view of a conventional MEMS package structure.
- a conventional MEMS package structure 10 comprises a cover plate 12 , a chip 14 , a sealant 16 and MEMS devices 18 .
- the cover plate 12 is fixed on the chip 14 with the sealant 16 , such that the MEMS devices 18 are sealed in a space between the chip 14 and the cover plate 12 .
- the sealant 16 may crack and the moisture may permeate into the space between the chip 14 and the cover plate 12 easily after using a period of time in high humidity environment due to a large gap between the cover plate 12 and the chip 14 , thereby affecting the normal operation of the MEMS devices 18 .
- the present invention is directed to a MEMS package structure which provides better moisture resistance property.
- the present invention provides a microelectromechanical system (MEMS) package structure comprising a chip, a MEMS device, a lid, a sealant and a first moisture barrier.
- the chip comprises an active surface.
- the MEMS device is disposed on the active surface.
- the lid covers on the chip and comprising a recess, wherein the MEMS device is in the recess.
- the sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device.
- the first moisture barrier is coated around the chip, the sealant and the lid.
- the MEMS package structure further comprises a first substrate, a second substrate and a second moisture barrier.
- the first substrate has a cavity, wherein the chip, the MEMS device, the lid, the sealant and the first moisture barrier are disposed in the cavity.
- the second substrate is disposed on the first substrate to cover the cavity.
- the second moisture barrier is sealed at a boundary zone between the first substrate and the second substrate.
- the MEMS package structure further comprises a molding compound, disposed in the cavity and sealed around the first moisture barrier.
- a projective region of the molding compound formed on the first moisture barrier covers that of the sealant formed on the first moisture barrier.
- the MEMS package structure further comprises a moisture absorption element, disposed in the cavity.
- the second substrate has an area covering the sealant.
- the recess has a top surface opposite to the active surface, and a distance between the top surface and the active surface is larger than mirror tilt height.
- a thickness of the sealant is approximately from 1 micrometer to 10 micrometer.
- the MEMS device comprises a mirror, a switch, a capacitor, an accelerometer, a sensor or an actuator.
- a material of the sealant comprises epoxy resin.
- the MEMS package structure of the present invention applies the lid having the recess for accommodating the MEMS device so as to reduce the height of the peripheral gap between the chip and the lid, the sealant disposed between the peripheral gap seals the recess, so that the MEMS package structure of the present invention provides better moisture resistance property.
- the first moisture barrier coated around the chip, the lid and the sealant provides a double protection to prevent the moisture from permeating to the recess.
- the second moisture barrier provides a third protection to seal the chip, the MEMS device, the lid, the sealant and the first moisture barrier in the cavity enclosed by the first substrate and the second substrate.
- the molding compound disposed in the cavity is glued around the first moisture barrier to provide a fourth protection.
- the moisture absorption element disposed in the cavity provides a fifth protection to absorb the moisture in the cavity.
- FIG. 1 is a schematic view of a conventional MEMS package structure.
- FIG. 2 is a schematic view of a MEMS package structure according to an embodiment of the invention.
- FIG. 3 is a schematic view of a MEMS package structure according to another embodiment of the invention.
- FIG. 4 is a schematic view of a MEMS package structure according to still another embodiment of the invention.
- FIG. 2 is a schematic view of a MEMS package structure according to an embodiment of the invention.
- a microelectromechanical system (MEMS) package structure 100 of the embodiment comprises a chip 110 , at least one MEMS device 120 , a lid 130 , a sealant 140 and a first moisture barrier 150 .
- the chip 110 comprises an active surface 112 .
- the chip 110 is, for example, an optical sensor chip such as a charge couple device (CCD) or a complementary metal-oxide-semiconductor (CMOS), and the active surface 112 is, for example, a photo sensitive region. But the types of the chip 110 and the active surface 112 are not limited thereto.
- the MEMS devices 120 are disposed on the active surface 112 .
- the MEMS devices 120 are mirrors, but the MEMS devices 120 also can be switches, capacitors, accelerometers, sensors or actuators, the type of the MEMS 120 device is not limited thereto.
- the lid 130 is transparent, so that an external light beam (not shown) is capable of passing through the lid 130 to the MEMS devices 120 and the active surface 112 of the chip 110 .
- the lid 130 covers on the chip 110 and comprises a recess 132 , and the MEMS device 120 is in the recess 132 .
- the recess 132 has a top surface 132 a opposite to the active surface 112 .
- a distance D between the top surface 132 a and the active surface 112 is larger than mirror tilt height, for example 10 micrometer, and a height H of a peripheral gap between the chip 110 and the lid 130 is approximately from 1 micrometer to 10 micrometer. That is, the height H of the peripheral gap between the chip 110 and the lid 130 is less than the distance D between the top surface 132 a and the active surface 112 .
- the sealant 140 is disposed at the peripheral gap between the chip 110 and the lid 130 so as to seal the recess 132 .
- a thickness of the sealant 140 is less than a height of the MEMS device 120 .
- the thickness of the sealant 140 is limited by the height H of the peripheral gap between the chip 110 and the lid 130 . Therefore, the thickness of the sealant 140 is approximately from 1 micrometer to 10 micrometer varied with the height H of the peripheral gap between the chip 110 and the lid 130 .
- the sealant 140 is an organic polymer compound, for example, an epoxy resin.
- the molecular structure of the organic compound has many hydrophilic groups, thus having the ability to block the external contamination and moisture, but the molecular structure cannot totally block the reaction of the hydrophilic groups and the moisture. Therefore, in the embodiment, the first moisture barrier 150 is coated around the chip 110 , the sealant 140 and the lid 130 so as to effectively block the reaction of the hydrophilic groups of the sealant 140 and the moisture, and further enhance the impermeability of the recess 132 . In this manner, the MEMS devices 120 are able to operate normally in the MEMS package structure 100 .
- the first moisture barrier 150 can be formed by the chemical vapor deposition (CVD) or physical vapor deposition (PVD) technique, but the forming method of the first moisture barrier 150 is not limited thereto.
- a material of the first moisture barrier 150 can be an inorganic insulating material with a higher compaction, for example, silica, silicon nitride, silicon oxynitride, or other nitride, oxide, and oxynitride which do not contain the hydrophilic group, so the moisture resistance of the first moisture barrier 150 is stronger than that of the sealant 140 . That is, the inorganic insulating material does not have the hydrophilic group, and will not react with the moisture, thereby effectively isolating the moisture. Hence, the first moisture barrier 150 is able to provide a double protection, so that a permeating probability of the moisture can be lowered.
- the MEMS package structure 100 of the embodiment Comparing to the conventional MEMS package structure 10 , the MEMS package structure 100 of the embodiment has the small peripheral gap between the chip 110 and the lid 130 , the sealant 140 seals the small peripheral gap between the chip 110 and the lid 130 , and the first moisture barrier 150 is coated around the chip 110 , the lid 130 and the sealant 140 . Therefore, the MEMS package structure 100 of the embodiment provides better moisture resistance property.
- FIG. 3 is a schematic view of a MEMS package structure according to another embodiment of the invention.
- the MEMS package structure 200 of the embodiment further comprises a first substrate 260 , a second substrate 270 and a second moisture barrier 280 .
- the first substrate 260 has a cavity 262 .
- a chip 210 , a MEMS device 220 , a lid 230 , a sealant 240 and a first moisture barrier 250 are disposed in the cavity 262 .
- the second substrate 270 is disposed on the first substrate 260 to cover the cavity 262 , and the second moisture barrier 280 is sealed at a boundary zone between the first substrate 260 and the second substrate 270 .
- the first substrate 260 , the second substrate 270 and the second moisture barrier 280 are capable of providing a third protection so as to prevent moisture from permeating to the recess 232 and causing the MEMS devices 220 malfunction.
- the second substrate 270 is transparent, so that an external light beam (not shown) is capable of passing through.
- the second substrate 270 has an area 272 covering the sealant 240 , and the area 272 is a black area in the embodiment.
- a projective region of the area 272 formed on the chip 210 covers a projective region of the sealant 240 formed on the chip 210 . Therefore, the area 272 blocks the external light beam from emitting to the sealant 240 , so that a degradation probability of the sealant 240 can be lowered.
- FIG. 4 is a schematic view of a MEMS package structure according to still another embodiment of the invention.
- the MEMS package structure 300 of the embodiment further comprises a molding compound 390 and a moisture absorption element 395 .
- the molding compound 390 is disposed in the cavity 362 and glued around the first moisture barrier 350 .
- a projective region of the molding compound 390 formed on the first moisture barrier 350 covers that of the sealant 340 formed on the first moisture barrier 350 . That is, the molding compound 390 is able to provide a fourth protection for enhancing the physical structures of the sealant 340 and the first moisture barrier 350 so as to lower the cracking probability of the sealant 340 and the first moisture barrier 350 .
- the moisture absorption element 395 is disposed in the cavity 362 enclosed by the first substrate 360 and the second substrate 370 to provide a fifth protection.
- the moisture permeating to the cavity 362 would be absorbed by the moisture absorption element 395 before entering to the recess 332 so as to keep the MEMS devices 320 operating normally.
- the MEMS package structure of the present invention applies the lid having the recess for accommodating the MEMS device so as to reduce the height of the peripheral gap between the chip and the lid, the sealant disposed between the peripheral gap seals the recess, so that the MEMS package structure of the present invention provides better moisture resistance property.
- the first moisture barrier coated around the chip, the lid and the sealant provides the double protection to prevent the moisture from permeating to the recess.
- the second moisture barrier provides the third protection to seal the chip, the MEMS device, the lid, the sealant and the first moisture barrier in the cavity enclosed by the first substrate and the second substrate.
- the molding compound disposed in the cavity is glued around the first moisture barrier to provide the fourth protection.
- the moisture absorption element disposed in the cavity provides the fifth protection to absorb the moisture in the cavity.
Abstract
Description
- 1. Field of the Invention
- The present invention generally relates to a chip package structure. More particularly, the present invention relates to a microelectromechanical system (MEMS) package structure.
- 2. Description of Related Art
- Microelectromechanical system (MEMS) is a microelectromechanical device fabricated in a microminiaturized package structure, and the fabricating technique thereof is quite similar to the technique of fabricating integrated circuits (ICs). However, interactions, for example, about mechanics, optics, or magnetic force between the MEMS device and surrounding environment are more than that of the conventional IC.
- The MEMS device may include micro-sized electromechanical components (for example, switches, mirrors, capacitors, accelerometers, sensors, capacitive sensors, or actuators etc.), and the MEMS device may be integrated with the IC in a manner of single block, thereby greatly modifying insertion loss or electrical isolation effect of the overall solid-state device. However, in the macroscopic world of the entire package structure, the MEMS device is extremely fragile and may be impacted by slight static electricity or surface tension at any moment to cause failure. Therefore, in order to prevent the MEMS device from contaminations or damages, usually the MEMS device is sealed in a space between the chip and the lid.
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FIG. 1 is a schematic view of a conventional MEMS package structure. Referring toFIG. 1 , a conventionalMEMS package structure 10 comprises acover plate 12, achip 14, asealant 16 andMEMS devices 18. Thecover plate 12 is fixed on thechip 14 with thesealant 16, such that theMEMS devices 18 are sealed in a space between thechip 14 and thecover plate 12. - However, in the conventional
MEMS package structure 10, although the space between thechip 14 and thecover plate 12 is sealed by thesealant 16, thesealant 16 may crack and the moisture may permeate into the space between thechip 14 and thecover plate 12 easily after using a period of time in high humidity environment due to a large gap between thecover plate 12 and thechip 14, thereby affecting the normal operation of theMEMS devices 18. - Accordingly, the present invention is directed to a MEMS package structure which provides better moisture resistance property.
- The present invention provides a microelectromechanical system (MEMS) package structure comprising a chip, a MEMS device, a lid, a sealant and a first moisture barrier. The chip comprises an active surface. The MEMS device is disposed on the active surface. The lid covers on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is coated around the chip, the sealant and the lid.
- According to an embodiment of the present invention, the MEMS package structure further comprises a first substrate, a second substrate and a second moisture barrier. The first substrate has a cavity, wherein the chip, the MEMS device, the lid, the sealant and the first moisture barrier are disposed in the cavity. The second substrate is disposed on the first substrate to cover the cavity. The second moisture barrier is sealed at a boundary zone between the first substrate and the second substrate.
- According to an embodiment of the present invention, the MEMS package structure further comprises a molding compound, disposed in the cavity and sealed around the first moisture barrier.
- According to an embodiment of the present invention, a projective region of the molding compound formed on the first moisture barrier covers that of the sealant formed on the first moisture barrier.
- According to an embodiment of the present invention, the MEMS package structure further comprises a moisture absorption element, disposed in the cavity.
- According to an embodiment of the present invention, the second substrate has an area covering the sealant.
- According to an embodiment of the present invention, the recess has a top surface opposite to the active surface, and a distance between the top surface and the active surface is larger than mirror tilt height.
- According to an embodiment of the present invention, a thickness of the sealant is approximately from 1 micrometer to 10 micrometer.
- According to an embodiment of the present invention, the MEMS device comprises a mirror, a switch, a capacitor, an accelerometer, a sensor or an actuator.
- According to an embodiment of the present invention, a material of the sealant comprises epoxy resin.
- Based on the above-mentioned description, the MEMS package structure of the present invention applies the lid having the recess for accommodating the MEMS device so as to reduce the height of the peripheral gap between the chip and the lid, the sealant disposed between the peripheral gap seals the recess, so that the MEMS package structure of the present invention provides better moisture resistance property. In addition, the first moisture barrier coated around the chip, the lid and the sealant provides a double protection to prevent the moisture from permeating to the recess. Besides, the second moisture barrier provides a third protection to seal the chip, the MEMS device, the lid, the sealant and the first moisture barrier in the cavity enclosed by the first substrate and the second substrate. Moreover, the molding compound disposed in the cavity is glued around the first moisture barrier to provide a fourth protection. Furthermore, the moisture absorption element disposed in the cavity provides a fifth protection to absorb the moisture in the cavity.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
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FIG. 1 is a schematic view of a conventional MEMS package structure. -
FIG. 2 is a schematic view of a MEMS package structure according to an embodiment of the invention. -
FIG. 3 is a schematic view of a MEMS package structure according to another embodiment of the invention. -
FIG. 4 is a schematic view of a MEMS package structure according to still another embodiment of the invention. - Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
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FIG. 2 is a schematic view of a MEMS package structure according to an embodiment of the invention. Referring toFIG. 2 , a microelectromechanical system (MEMS)package structure 100 of the embodiment comprises achip 110, at least oneMEMS device 120, alid 130, a sealant 140 and afirst moisture barrier 150. Thechip 110 comprises anactive surface 112. Thechip 110 is, for example, an optical sensor chip such as a charge couple device (CCD) or a complementary metal-oxide-semiconductor (CMOS), and theactive surface 112 is, for example, a photo sensitive region. But the types of thechip 110 and theactive surface 112 are not limited thereto. - The
MEMS devices 120 are disposed on theactive surface 112. In the embodiment, theMEMS devices 120 are mirrors, but theMEMS devices 120 also can be switches, capacitors, accelerometers, sensors or actuators, the type of theMEMS 120 device is not limited thereto. - The
lid 130 is transparent, so that an external light beam (not shown) is capable of passing through thelid 130 to theMEMS devices 120 and theactive surface 112 of thechip 110. As shown inFIG. 2 , thelid 130 covers on thechip 110 and comprises arecess 132, and theMEMS device 120 is in therecess 132. Therecess 132 has atop surface 132 a opposite to theactive surface 112. In the embodiment, a distance D between thetop surface 132 a and theactive surface 112 is larger than mirror tilt height, for example 10 micrometer, and a height H of a peripheral gap between thechip 110 and thelid 130 is approximately from 1 micrometer to 10 micrometer. That is, the height H of the peripheral gap between thechip 110 and thelid 130 is less than the distance D between thetop surface 132 a and theactive surface 112. - The sealant 140 is disposed at the peripheral gap between the
chip 110 and thelid 130 so as to seal therecess 132. As shown inFIG. 2 , a thickness of the sealant 140 is less than a height of theMEMS device 120. The thickness of the sealant 140 is limited by the height H of the peripheral gap between thechip 110 and thelid 130. Therefore, the thickness of the sealant 140 is approximately from 1 micrometer to 10 micrometer varied with the height H of the peripheral gap between thechip 110 and thelid 130. - It should be noted that the sealant 140 is an organic polymer compound, for example, an epoxy resin. The molecular structure of the organic compound has many hydrophilic groups, thus having the ability to block the external contamination and moisture, but the molecular structure cannot totally block the reaction of the hydrophilic groups and the moisture. Therefore, in the embodiment, the
first moisture barrier 150 is coated around thechip 110, the sealant 140 and thelid 130 so as to effectively block the reaction of the hydrophilic groups of the sealant 140 and the moisture, and further enhance the impermeability of therecess 132. In this manner, theMEMS devices 120 are able to operate normally in theMEMS package structure 100. - In this embodiment, the
first moisture barrier 150 can be formed by the chemical vapor deposition (CVD) or physical vapor deposition (PVD) technique, but the forming method of thefirst moisture barrier 150 is not limited thereto. In addition, a material of thefirst moisture barrier 150 can be an inorganic insulating material with a higher compaction, for example, silica, silicon nitride, silicon oxynitride, or other nitride, oxide, and oxynitride which do not contain the hydrophilic group, so the moisture resistance of thefirst moisture barrier 150 is stronger than that of the sealant 140. That is, the inorganic insulating material does not have the hydrophilic group, and will not react with the moisture, thereby effectively isolating the moisture. Hence, thefirst moisture barrier 150 is able to provide a double protection, so that a permeating probability of the moisture can be lowered. - Comparing to the conventional
MEMS package structure 10, theMEMS package structure 100 of the embodiment has the small peripheral gap between thechip 110 and thelid 130, the sealant 140 seals the small peripheral gap between thechip 110 and thelid 130, and thefirst moisture barrier 150 is coated around thechip 110, thelid 130 and the sealant 140. Therefore, theMEMS package structure 100 of the embodiment provides better moisture resistance property. -
FIG. 3 is a schematic view of a MEMS package structure according to another embodiment of the invention. ReferringFIG. 3 , a difference between aMEMS package structure 200 of the embodiment and theMEMS package structure 100 of the above embodiment is that, theMEMS package structure 200 of the embodiment further comprises afirst substrate 260, asecond substrate 270 and asecond moisture barrier 280. In detail, thefirst substrate 260 has acavity 262. Achip 210, aMEMS device 220, alid 230, asealant 240 and afirst moisture barrier 250 are disposed in thecavity 262. Thesecond substrate 270 is disposed on thefirst substrate 260 to cover thecavity 262, and thesecond moisture barrier 280 is sealed at a boundary zone between thefirst substrate 260 and thesecond substrate 270. - Hence, in the
MEMS package structure 200, thefirst substrate 260, thesecond substrate 270 and thesecond moisture barrier 280 are capable of providing a third protection so as to prevent moisture from permeating to therecess 232 and causing theMEMS devices 220 malfunction. - In addition, in the embodiment, the
second substrate 270 is transparent, so that an external light beam (not shown) is capable of passing through. Thesecond substrate 270 has anarea 272 covering thesealant 240, and thearea 272 is a black area in the embodiment. In other words, a projective region of thearea 272 formed on thechip 210 covers a projective region of thesealant 240 formed on thechip 210. Therefore, thearea 272 blocks the external light beam from emitting to thesealant 240, so that a degradation probability of thesealant 240 can be lowered. -
FIG. 4 is a schematic view of a MEMS package structure according to still another embodiment of the invention. ReferringFIG. 4 , a difference between aMEMS package structure 300 of the embodiment and theMEMS package structure 200 of the above embodiment is that, theMEMS package structure 300 of the embodiment further comprises amolding compound 390 and amoisture absorption element 395. Themolding compound 390 is disposed in thecavity 362 and glued around thefirst moisture barrier 350. As shown inFIG. 4 , a projective region of themolding compound 390 formed on thefirst moisture barrier 350 covers that of thesealant 340 formed on thefirst moisture barrier 350. That is, themolding compound 390 is able to provide a fourth protection for enhancing the physical structures of thesealant 340 and thefirst moisture barrier 350 so as to lower the cracking probability of thesealant 340 and thefirst moisture barrier 350. - Besides, the
moisture absorption element 395 is disposed in thecavity 362 enclosed by thefirst substrate 360 and thesecond substrate 370 to provide a fifth protection. The moisture permeating to thecavity 362 would be absorbed by themoisture absorption element 395 before entering to therecess 332 so as to keep theMEMS devices 320 operating normally. - In sum, the MEMS package structure of the present invention applies the lid having the recess for accommodating the MEMS device so as to reduce the height of the peripheral gap between the chip and the lid, the sealant disposed between the peripheral gap seals the recess, so that the MEMS package structure of the present invention provides better moisture resistance property. In addition, the first moisture barrier coated around the chip, the lid and the sealant provides the double protection to prevent the moisture from permeating to the recess. Besides, the second moisture barrier provides the third protection to seal the chip, the MEMS device, the lid, the sealant and the first moisture barrier in the cavity enclosed by the first substrate and the second substrate. Moreover, the molding compound disposed in the cavity is glued around the first moisture barrier to provide the fourth protection. Furthermore, the moisture absorption element disposed in the cavity provides the fifth protection to absorb the moisture in the cavity.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (10)
Priority Applications (3)
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US14/167,819 US9102513B1 (en) | 2014-01-29 | 2014-01-29 | MEMS package structure |
US14/743,678 US9409766B2 (en) | 2014-01-29 | 2015-06-18 | MEMS package structure and manufacturing method thereof |
US15/199,604 US9624097B2 (en) | 2014-01-29 | 2016-06-30 | Manufacturing method thereof |
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US14/167,819 US9102513B1 (en) | 2014-01-29 | 2014-01-29 | MEMS package structure |
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US14/743,678 Continuation-In-Part US9409766B2 (en) | 2014-01-29 | 2015-06-18 | MEMS package structure and manufacturing method thereof |
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US9102513B1 US9102513B1 (en) | 2015-08-11 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20160090298A1 (en) * | 2014-09-25 | 2016-03-31 | Analog Devices, Inc. | Packages for stress-sensitive device dies |
US9533878B2 (en) | 2014-12-11 | 2017-01-03 | Analog Devices, Inc. | Low stress compact device packages |
US20170276930A1 (en) * | 2015-03-26 | 2017-09-28 | Seiko Epson Corporation | Electro-optical device, manufacturing method thereof, and electronic apparatus |
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