US20130292803A1 - Chip structure and wafer structure - Google Patents
Chip structure and wafer structure Download PDFInfo
- Publication number
- US20130292803A1 US20130292803A1 US13/932,712 US201313932712A US2013292803A1 US 20130292803 A1 US20130292803 A1 US 20130292803A1 US 201313932712 A US201313932712 A US 201313932712A US 2013292803 A1 US2013292803 A1 US 2013292803A1
- Authority
- US
- United States
- Prior art keywords
- stress buffer
- wafer
- substrate
- chip
- buffer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present application relates to a semiconductor structure and a process of fabricating a semiconductor. More particularly, the present application relates to a chip structure, a wafer structure, and a process of fabricating a chip.
- a thinning process is often performed on a wafer formed by carrying out a semiconductor integrated circuit fabricating process, such that a thickness of the wafer is reduced. After the thinning process is performed on the wafer, a ratio of the area to the thickness of the wafer is increased. Therefore, during subsequent processes of picking up and placing the wafer, transporting the wafer by using a machine, and cutting the wafer, the wafer is apt to be cracked. As a result, it is necessary for the thinned wafer to be adhered to and supported by a holder, which is conducive to the subsequent processes. Nonetheless, the wafer should still be removed from the holder after the cutting process is performed, and chip cracks are also prone to occur during and after removal of the wafer from the holder.
- the present application is directed to a chip structure having a stress buffer layer.
- the present application is further directed to a wafer structure having a stress buffer layer.
- the stress buffer layer acts as a supporting structure of a thinned substrate and is capable of preventing a wafer from being cracked or precluding cracks from extending during implementation of a cutting process.
- the present application is further directed to a process of fabricating a chip.
- chip units having both conductive through holes and stress buffer rings can be formed.
- a chip structure having a substrate and a stress buffer layer is provided.
- the substrate has a first surface and a second surface opposite to the first surface.
- the stress buffer layer is disposed on the periphery of the substrate and located in at least one of the first surface and the second surface of the substrate.
- a wafer structure having a substrate and a stress buffer layer is further provided.
- the substrate has a first surface, a second surface opposite to the first surface, and a plurality of cutting paths dividing the substrate into a plurality of chip units.
- the stress buffer layer surrounds each of the chip units and is disposed on at least one of the first surface and the second surface of the substrate.
- a process of fabricating a chip is further provided.
- a wafer is provided.
- the wafer has a first surface and a second surface opposite to each other.
- a plurality of blind holes is then formed on the first surface of the wafer.
- an insulating layer and an electroplating seed layer are formed on the first surface and on walls of the blind holes.
- the electroplating seed layer covers the insulating layer.
- a patterned mask is formed on the electroplating seed layer located above the first surface.
- a conductive material is formed in the blind holes by performing an electroplating process so as to form a plurality of conductive blind holes.
- a plurality of stress buffer rings are formed on a portion of the electroplating seed layer located above the first surface.
- the conductive blind holes are respectively located in the stress buffer rings.
- a process of fabricating a chip is further provided.
- a wafer is provided.
- the wafer has a first surface and a second surface opposite to each other.
- a plurality of holes is then formed on the first surface of the wafer.
- an electroplating seed layer is formed on the first surface and on walls of the holes.
- a first patterned mask is formed on the electroplating seed layer located above the first surface.
- a conductive material is formed in the holes by performing an electroplating process so as to form a plurality of conductive holes.
- the first patterned mask and a portion of the electroplating seed layer located below the first patterned mask are then removed.
- a second patterned mask is formed on the first surface of the wafer.
- the first surface is etched with use of the second patterned mask as an etching mask so as to form a plurality of insulating ring areas and a plurality of stress buffer ring areas.
- the insulating ring areas respectively expose side walls of the conductive holes, and the insulating ring areas are respectively located in the stress buffer ring areas.
- an insulating material is disposed in the insulating ring areas and the stress buffer ring areas to form a plurality of insulating rings and a plurality of stress buffer rings.
- the wafer structure of the present application is equipped with a stress buffer layer. Therefore, after a thinning process is carried out, the stress buffer layer not only can serve as a supporting structure for preventing the wafer structure from being cracked when the thinned wafer structure is picked up, placed, and transported by a machine, but also can preclude the wafer from being cracked or preclude cracks from extending to chip areas located at respective sides of adjacent cutting paths when the wafer structure is cut and divided into a plurality of chip structures. As such, cutting yield can be improved.
- FIG. 1A is a schematic cross-sectional view of a wafer structure according to an embodiment of the present invention.
- FIG. 1B contains a schematic top view and a schematic partially-enlarged view of the wafer structure depicted in FIG. 1A .
- FIG. 1C is a schematic top view illustrating a chip structure which is formed by cutting the wafer structure depicted in FIG. 1A .
- FIG. 2 is a schematic cross-sectional view of a wafer structure according to another embodiment of the present invention.
- FIG. 3 is a schematic cross-sectional view of a wafer structure according to still another embodiment of the present invention.
- FIG. 4 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention.
- FIG. 5 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention.
- FIGS. 6A to 6G illustrate a process of fabricating a chip according to an embodiment of the present invention.
- FIGS. 7A to 7K illustrate a process of fabricating a chip according to an embodiment of the present invention.
- FIG. 1A is a schematic cross-sectional view of a wafer structure according to an embodiment of the present invention.
- FIG. 1B contains a schematic top view and a schematic partially-enlarged view of the wafer structure depicted in FIG. 1A .
- FIG. 1C is a schematic top view illustrating a chip structure which is formed by cutting the wafer structure depicted in FIG. 1A .
- a wafer structure 100 a includes a substrate 110 and a stress buffer layer 120 a.
- the substrate 110 has a first surface 112 , a second surface 114 opposite to the first surface 112 , and a plurality of cutting paths 116 dividing the substrate 110 into a plurality of chip units C.
- the cutting paths 116 are defined by an area of the first surface 112 of the substrate 110 which is not covered by a passivation layer (not shown), and said area does not include pad regions (not shown) exposed by the passivation layer.
- the stress buffer layer 120 a is disposed on the cutting paths 116 and surrounds each of the chip units C.
- the stress buffer layer 120 a is located in at least one of the first surface 112 and the second surface 114 of the substrate 110 .
- the stress buffer layer 120 a protrudes from the first surface 112 of the substrate 110
- the stress buffer layer 120 a is a lattice-like pattern formed by stress buffer rings 122 connected to one another.
- the stress buffer rings 122 are integrally formed, and a first surface 112 of the substrate 110 is an active surface.
- a material of the stress buffer layer 120 a includes metal, glass, or a polymer material, and the metal discussed herein is copper preferably.
- the stress buffer layer 120 a can also be formed by individual stress buffer rings 122 respectively surrounding the chip units C. Therefore, the stress buffer layer 120 a shown in FIGS. 1A and 1B are exemplary and are not to limit the present invention.
- the wafer structure 100 a of the present embodiment has the stress buffer layer 120 a . Therefore, when a thinning process is performed on the wafer structure 100 a to reduce the entire thickness of the wafer structure 100 a , the stress buffer layer 120 a can serve as a supporting structure for preventing the thinned wafer structure 100 a from being cracked when the thinned wafer structure 100 a is picked up, placed, and transported by a machine. Besides, referring to FIGS.
- the stress buffer layer 120 a can also preclude cracks from extending to the chip units C located at respective sides of the adjacent cutting paths 116 . As such, cutting yield can be improved.
- a width of the cutting paths 116 is greater than or equal to a width of the stress buffer layer 120 a
- a width of the cutting tool (not shown) is less than the width of the stress buffer layer 120 a . That is to say, when the wafer structure 100 a is cut by the cutting tool along the cutting paths 116 and divided into the chip structures 200 , each of the chip structures 200 includes the stress buffer layer 120 a located in the periphery of the substrate 110 of each of the chip structures 200 .
- FIG. 2 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention.
- a wafer structure 100 b depicted in FIG. 2 is similar to the wafer structure 100 a depicted in FIG. 1A , while the difference therebetween lies in that a stress buffer layer 120 b of the wafer structure 100 b depicted in FIG. 2 is embedded in the first surface 112 of the substrate 110 .
- FIG. 3 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention.
- a wafer structure 100 c depicted in FIG. 3 is similar to the wafer structure 100 a depicted in FIG. 1A , while the difference therebetween lies in that a stress buffer layer 120 c of the wafer structure 100 c depicted in FIG. 3 protrudes from the second surface 114 of the substrate 110 .
- the second surface 114 is a non-active surface.
- FIG. 4 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention.
- a wafer structure 100 d depicted in FIG. 4 is similar to the wafer structure 100 a depicted in FIG. 1A , while the difference therebetween lies in that a stress buffer layer 120 d of the wafer structure 100 d depicted in FIG. 4 is embedded in the second surface 114 of the substrate 110 .
- the second surface 114 is a non-active surface.
- FIG. 5 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention.
- a wafer structure 100 e depicted in FIG. 5 is similar to the wafer structure 100 a depicted in FIG. 1A , while the difference therebetween lies in that the wafer structure 100 e depicted in FIG. 5 further includes a plurality of conductive through holes 130 , and a plurality of active circuits 118 are located on the first surface 112 .
- the conductive through holes 130 penetrate the second surface 114 of the substrate 110 and connect the active circuits 118 .
- the stress buffer layer 120 a is located on an area outside the active circuits 118 .
- the first surface 112 is an active surface
- the second surface 114 is a non-active surface. Namely, the wafer structure 100 e having active devices is described in the present embodiment.
- the wafer structures 100 a - 100 e and the chip structures 200 are described in above embodiments of the present invention, while a process of fabricating a chip is not discussed herein yet.
- two embodiments are provided hereinafter for demonstrating the process of fabricating the chip according to the present application.
- thinned wafers 300 and 500 are respectively taken as an example, and the process of fabricating the chip is elaborated with reference to FIGS. 6 A- 6 G and FIGS. 7A-7K .
- FIGS. 6A to 6G illustrate a process of fabricating a chip according to an embodiment of the present invention.
- FIG. 6E contains a schematic top view and a schematic partially-enlarged view of the process of fabricating the chip as shown in FIG. 6D .
- a wafer 300 having a first surface 300 a and a second surface 300 b opposite to each other is provided at first.
- a photolithography and anisotropic etching process is performed on the first surface 300 a of the wafer 300 to form a plurality of holes 310 a .
- an insulating layer 320 and an electroplating seed layer 330 covering the insulating layer 320 are formed on the first surface 300 a and on walls of the holes 310 a.
- a patterned mask 340 is formed on the electroplating seed layer 330 located above the first surface 300 a of the wafer 300 .
- the patterned mask 340 does not cover the holes 310 a.
- a conductive material is then formed in the holes 310 a by performing an electroplating process on the electroplating seed layer 330 , such that a plurality of conductive holes 310 b are formed. Meanwhile, a plurality of stress buffer rings 350 are formed on a portion of the electroplating seed layer 330 located above the first surface 300 a of the wafer 300 .
- the conductive holes 310 b are respectively located in the stress buffer rings 350 .
- the patterned mask 340 and a portion of the electroplating seed layer 330 located below the patterned mask 340 are removed. So far, the conductive holes 310 b and the stress buffer rings 350 protruding from the first surface 300 a are completely formed on the wafer 300 .
- a thinning process is performed on the second surface 300 b of the wafer 300 until the conductive holes 310 b are exposed, such that the conductive holes 310 b are transformed into a plurality of conductive through holes 310 c .
- the wafer 300 is cut along the stress buffer rings 350 to form a plurality of chip units 400 .
- the stress buffer rings 350 are located on the first surface 300 a of the wafer 300 in the present embodiment. Therefore, when the thinning process is performed on the wafer 300 to reduce the entire thickness of the wafer 300 , the stress buffer rings 350 can serve as supporting structures for preventing the thinned wafer 300 from being cracked when the thinned wafer 300 is picked up, placed, and transported by a machine. Additionally, when the wafer 300 is cut along the stress buffer rings 350 and divided into a plurality of chip units 400 , the stress buffer rings 350 can also preclude the wafer 300 from being cracked due to stress or preclude the cracks from extending to the adjacent chip units 400 . Thereby, cutting yield can be improved.
- the wafer 300 is a dummy wafer. Therefore, functions and types of the first surface 300 a and the second surface 300 b are substantially the same.
- a surface of the wafer having the active circuits is an active surface, the conductive through holes connect the active circuits, and the stress buffer rings are located on an area outside the active circuits, which is still construed as a part of the technical proposal of the present application and does not depart from the protection range of the invention.
- Relative positions of the active circuits and the conductive through holes are similar to those of the active circuits 118 and the conductive through holes 130 illustrated in FIG. 5 .
- the wafer can be directly cut along the stress buffer rings to form a plurality of chip units having the active devices in no need of performing a thinning process.
- the holes 310 a are formed on the first surface 300 a of the wafer 300 by implementing a photolithography and etching process. Thereafter, the stress buffer rings 350 protruding from the first surface 300 a and the conductive holes 310 b in the holes 310 a are formed by performing an electroplating process and using the patterned mask 340 . A thinning process is then performed on the wafer 300 , and the wafer 300 is cut along the stress buffer rings 350 to form a plurality of chip units 400 .
- each of the chip units 400 of the present embodiment has the conductive through holes 310 c and the stress buffer rings 350 protruding from the first surface 300 a , and the stress buffer rings 350 can improve yield of cutting the wafer 300 during the process of fabricating the chip.
- FIGS. 7A to 7K illustrate a process of fabricating a chip according to an embodiment of the present invention.
- FIG. 7H contains a schematic top view and a schematic partially-enlarged view of the process of fabricating the chip as shown in FIG. 7I .
- a wafer 500 having a first surface 500 a and a second surface 500 b opposite to each other is provided at first.
- a photolithography and anisotropic etching process is performed on the first surface 500 a of the wafer 500 to form a plurality of holes 510 a .
- an electroplating seed layer 520 is formed on the first surface 500 a and on walls of the holes 510 a.
- a first patterned mask 540 a is formed on the electroplating seed layer 520 located above the first surface 500 a of the wafer 500 .
- the first patterned mask 540 a does not cover the holes 510 a.
- a conductive material is formed in the holes 510 a by performing an electroplating process on the electroplating seed layer 520 , such that a plurality of conductive holes 510 b are formed.
- the first patterned mask 540 a and a portion of the electroplating seed layer 520 located below the first patterned mask 540 a are then removed to expose the first surface 500 a of the wafer 500 and partial surfaces of the holes 510 b.
- a second patterned mask 540 b is formed on the first surface 500 a of the wafer 500 .
- the second patterned mask 540 b does not cover the holes 510 b.
- the first surface 500 a is then etched by using the second patterned mask 540 b as an etching mask to form a plurality of insulating ring areas I and a plurality of stress buffer ring areas S.
- the insulating ring areas I respectively expose side walls of the conductive holes 510 b
- the insulating ring areas I are respectively located in the stress buffer ring areas S.
- the second patterned mask 540 b is removed.
- an insulating material 570 is disposed in the insulating ring areas I and the stress buffer ring areas S.
- the insulating material 570 is, for example, glass or polymer.
- a portion of the insulating material 570 is removed, such that the insulating material 570 is substantially flush with the first surface 500 a of the wafer 500 , and that a plurality of insulating rings 550 and a plurality of stress buffer rings 560 are formed. So far, the stress buffer rings 560 embedded in the first surface 500 a and the conductive holes 510 b are completely formed on the wafer 500 .
- a thinning process is performed on the second surface 500 b of the wafer 500 until the conductive holes 510 b are exposed, such that the conductive holes 510 b are transformed into a plurality of conductive through holes 510 c .
- the wafer 500 is cut along the stress buffer rings 560 to form a plurality of chip units 600 .
- the stress buffer rings 560 are embedded in the first surface 500 a of the wafer 500 according to the present embodiment. Therefore, when the thinning process is performed on the wafer 500 to reduce the entire thickness of the wafer 500 , the stress buffer rings 560 can serve as supporting structures for preventing the thinned wafer 500 from being cracked when the thinned wafer 500 is picked up, placed, and transported by a machine. Additionally, when the wafer 500 is cut along the stress buffer rings 560 and divided into a plurality of chip units 600 , the stress buffer rings 560 can also preclude the wafer 500 from being cracked due to stress or preclude the cracks from extending to the adjacent chip units 600 . Thereby, cutting yield can be improved.
- the wafer 500 is a dummy wafer. Therefore, functions and types of the first surface 500 a and the second surface 500 b are substantially the same.
- a surface of the wafer having the active circuits is an active surface, the conductive through holes connect the active circuits, and the stress buffer rings are located on an area outside the active circuits, which is still construed as a part of the technical proposal of the present application and does not depart from the protection range of the invention.
- Relative positions of the active circuits and the conductive through holes are similar to those of the active circuits 118 and the conductive through holes 130 illustrated in FIG. 5 .
- the wafer can be directly cut along the stress buffer rings to form a plurality of chip units having the active devices in no need of performing a thinning process.
- the holes 510 a , the insulating ring areas I, and the stress buffer ring areas S are formed on the first surface 500 a of the wafer 500 by implementing two photolithography and etching processes, respectively.
- the conductive holes 510 b are formed in the holes 510 a by performing an electroplating process and using the first patterned mask 540 a .
- the insulating material 570 is disposed in the insulating ring areas I and the stress buffer ring areas S to form the insulating rings 550 and the stress buffer rings 560 .
- each of the chip units 600 of the present embodiment has the conductive through holes 510 c and the stress buffer rings 560 embedded in the first surface 500 a , and the stress buffer rings 560 can improve yield of cutting the wafer 600 during the process of fabricating the chip.
- the wafer structure of the present application is equipped with a stress buffer layer. Therefore, after a thinning process is carried out, the stress buffer layer not only can serve as a supporting structure for preventing the thinned wafer structure from being cracked when the thinned wafer structure is picked up, placed, and transported by a machine, but also can preclude the wafer from being cracked or preclude the cracks from extending to the chip areas located at respective sides of adjacent cutting paths when the wafer structure is cut and divided into a plurality of chip structures. As such, the cutting yield can be improved.
- the stress buffer rings protruding from or embedded in a surface of the wafer are formed.
- the stress buffer rings are capable of preventing the wafer from being cracked due to stress and precluding the cracks from extending to the adjacent chip units.
- the cutting yield can be improved.
- manufacturing yield can be achieved by performing the process of fabricating the chip according to the present application.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Dicing (AREA)
Abstract
A chip structure includes a substrate and a stress buffer layer. The substrate has a first surface and a second surface opposite to the first surface. The stress buffer layer is disposed on the periphery of the substrate and located in at least one of the first surface and the second surface of the substrate.
Description
- This application is a divisional of and claims the priority benefit of U.S. application Ser. No. 12/703,488 filed on Feb. 10, 2010, now allowed, which claims the priority benefit of Taiwan application serial no. 98107682, filed on Mar. 10, 2009. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of specification.
- 1. Field of the Invention
- The present application relates to a semiconductor structure and a process of fabricating a semiconductor. More particularly, the present application relates to a chip structure, a wafer structure, and a process of fabricating a chip.
- 2. Description of Related Art
- Prior to implementation of a cutting process, a thinning process is often performed on a wafer formed by carrying out a semiconductor integrated circuit fabricating process, such that a thickness of the wafer is reduced. After the thinning process is performed on the wafer, a ratio of the area to the thickness of the wafer is increased. Therefore, during subsequent processes of picking up and placing the wafer, transporting the wafer by using a machine, and cutting the wafer, the wafer is apt to be cracked. As a result, it is necessary for the thinned wafer to be adhered to and supported by a holder, which is conducive to the subsequent processes. Nonetheless, the wafer should still be removed from the holder after the cutting process is performed, and chip cracks are also prone to occur during and after removal of the wafer from the holder.
- The present application is directed to a chip structure having a stress buffer layer.
- The present application is further directed to a wafer structure having a stress buffer layer. The stress buffer layer acts as a supporting structure of a thinned substrate and is capable of preventing a wafer from being cracked or precluding cracks from extending during implementation of a cutting process.
- The present application is further directed to a process of fabricating a chip. By performing the process, chip units having both conductive through holes and stress buffer rings can be formed.
- In the present application, a chip structure having a substrate and a stress buffer layer is provided. The substrate has a first surface and a second surface opposite to the first surface. The stress buffer layer is disposed on the periphery of the substrate and located in at least one of the first surface and the second surface of the substrate.
- In the present application, a wafer structure having a substrate and a stress buffer layer is further provided. The substrate has a first surface, a second surface opposite to the first surface, and a plurality of cutting paths dividing the substrate into a plurality of chip units. The stress buffer layer surrounds each of the chip units and is disposed on at least one of the first surface and the second surface of the substrate.
- In the present application, a process of fabricating a chip is further provided. In the process, first, a wafer is provided. The wafer has a first surface and a second surface opposite to each other. A plurality of blind holes is then formed on the first surface of the wafer. Next, an insulating layer and an electroplating seed layer are formed on the first surface and on walls of the blind holes. Here, the electroplating seed layer covers the insulating layer. Thereafter, a patterned mask is formed on the electroplating seed layer located above the first surface. After that, a conductive material is formed in the blind holes by performing an electroplating process so as to form a plurality of conductive blind holes. In addition, a plurality of stress buffer rings are formed on a portion of the electroplating seed layer located above the first surface. Here, the conductive blind holes are respectively located in the stress buffer rings. Finally, the patterned mask and a portion of the electroplating seed layer located below the patterned mask are removed.
- In the present application, a process of fabricating a chip is further provided. In the process, first, a wafer is provided. The wafer has a first surface and a second surface opposite to each other. A plurality of holes is then formed on the first surface of the wafer. Thereafter, an electroplating seed layer is formed on the first surface and on walls of the holes. A first patterned mask is formed on the electroplating seed layer located above the first surface. Afterwards, a conductive material is formed in the holes by performing an electroplating process so as to form a plurality of conductive holes. The first patterned mask and a portion of the electroplating seed layer located below the first patterned mask are then removed. A second patterned mask is formed on the first surface of the wafer. Next, the first surface is etched with use of the second patterned mask as an etching mask so as to form a plurality of insulating ring areas and a plurality of stress buffer ring areas. Here, the insulating ring areas respectively expose side walls of the conductive holes, and the insulating ring areas are respectively located in the stress buffer ring areas. Finally, an insulating material is disposed in the insulating ring areas and the stress buffer ring areas to form a plurality of insulating rings and a plurality of stress buffer rings.
- Based on the above, the wafer structure of the present application is equipped with a stress buffer layer. Therefore, after a thinning process is carried out, the stress buffer layer not only can serve as a supporting structure for preventing the wafer structure from being cracked when the thinned wafer structure is picked up, placed, and transported by a machine, but also can preclude the wafer from being cracked or preclude cracks from extending to chip areas located at respective sides of adjacent cutting paths when the wafer structure is cut and divided into a plurality of chip structures. As such, cutting yield can be improved.
- In order to make the aforementioned and other features and advantages of the present application more comprehensible, several embodiments accompanying figures are described in detail below.
- The accompanying drawings are included to provide a further understanding of the application and incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
-
FIG. 1A is a schematic cross-sectional view of a wafer structure according to an embodiment of the present invention. -
FIG. 1B contains a schematic top view and a schematic partially-enlarged view of the wafer structure depicted inFIG. 1A . -
FIG. 1C is a schematic top view illustrating a chip structure which is formed by cutting the wafer structure depicted inFIG. 1A . -
FIG. 2 is a schematic cross-sectional view of a wafer structure according to another embodiment of the present invention. -
FIG. 3 is a schematic cross-sectional view of a wafer structure according to still another embodiment of the present invention. -
FIG. 4 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention. -
FIG. 5 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention. -
FIGS. 6A to 6G illustrate a process of fabricating a chip according to an embodiment of the present invention. -
FIGS. 7A to 7K illustrate a process of fabricating a chip according to an embodiment of the present invention. -
FIG. 1A is a schematic cross-sectional view of a wafer structure according to an embodiment of the present invention.FIG. 1B contains a schematic top view and a schematic partially-enlarged view of the wafer structure depicted inFIG. 1A .FIG. 1C is a schematic top view illustrating a chip structure which is formed by cutting the wafer structure depicted inFIG. 1A . Referring toFIGS. 1A and 1B , in the present embodiment, awafer structure 100 a includes asubstrate 110 and astress buffer layer 120 a. - In detail, the
substrate 110 has afirst surface 112, asecond surface 114 opposite to thefirst surface 112, and a plurality of cuttingpaths 116 dividing thesubstrate 110 into a plurality of chip units C. Here, the cuttingpaths 116 are defined by an area of thefirst surface 112 of thesubstrate 110 which is not covered by a passivation layer (not shown), and said area does not include pad regions (not shown) exposed by the passivation layer. - The
stress buffer layer 120 a is disposed on the cuttingpaths 116 and surrounds each of the chip units C. Here, thestress buffer layer 120 a is located in at least one of thefirst surface 112 and thesecond surface 114 of thesubstrate 110. Specifically, in the present embodiment, thestress buffer layer 120 a protrudes from thefirst surface 112 of thesubstrate 110, and thestress buffer layer 120 a is a lattice-like pattern formed by stress buffer rings 122 connected to one another. Here, the stress buffer rings 122 are integrally formed, and afirst surface 112 of thesubstrate 110 is an active surface. A material of thestress buffer layer 120 a includes metal, glass, or a polymer material, and the metal discussed herein is copper preferably. - Certainly, in other embodiments which are not illustrated in the drawings, the
stress buffer layer 120 a can also be formed by individual stress buffer rings 122 respectively surrounding the chip units C. Therefore, thestress buffer layer 120 a shown inFIGS. 1A and 1B are exemplary and are not to limit the present invention. - The
wafer structure 100 a of the present embodiment has thestress buffer layer 120 a. Therefore, when a thinning process is performed on thewafer structure 100 a to reduce the entire thickness of thewafer structure 100 a, thestress buffer layer 120 a can serve as a supporting structure for preventing the thinnedwafer structure 100 a from being cracked when the thinnedwafer structure 100 a is picked up, placed, and transported by a machine. Besides, referring toFIGS. 1B and 1C , when thewafer structure 100 a is cut by a cutting tool (not shown) along the cuttingpaths 116 and divided into a plurality ofchip structures 200, thestress buffer layer 120 a can also preclude cracks from extending to the chip units C located at respective sides of theadjacent cutting paths 116. As such, cutting yield can be improved. - In the present embodiment, it should be mentioned that a width of the cutting
paths 116 is greater than or equal to a width of thestress buffer layer 120 a, while a width of the cutting tool (not shown) is less than the width of thestress buffer layer 120 a. That is to say, when thewafer structure 100 a is cut by the cutting tool along the cuttingpaths 116 and divided into thechip structures 200, each of thechip structures 200 includes thestress buffer layer 120 a located in the periphery of thesubstrate 110 of each of thechip structures 200. -
FIG. 2 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention. Referring toFIGS. 1A and 2 , awafer structure 100 b depicted inFIG. 2 is similar to thewafer structure 100 a depicted inFIG. 1A , while the difference therebetween lies in that astress buffer layer 120 b of thewafer structure 100 b depicted inFIG. 2 is embedded in thefirst surface 112 of thesubstrate 110. -
FIG. 3 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention. Referring toFIGS. 1A and 3 , awafer structure 100 c depicted inFIG. 3 is similar to thewafer structure 100 a depicted inFIG. 1A , while the difference therebetween lies in that astress buffer layer 120 c of thewafer structure 100 c depicted inFIG. 3 protrudes from thesecond surface 114 of thesubstrate 110. Here, thesecond surface 114 is a non-active surface. -
FIG. 4 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention. Referring toFIGS. 1A and 4 , awafer structure 100 d depicted inFIG. 4 is similar to thewafer structure 100 a depicted inFIG. 1A , while the difference therebetween lies in that astress buffer layer 120 d of thewafer structure 100 d depicted inFIG. 4 is embedded in thesecond surface 114 of thesubstrate 110. Here, thesecond surface 114 is a non-active surface. -
FIG. 5 is a schematic cross-sectional view of a wafer structure according to yet still another embodiment of the present invention. Referring toFIGS. 1A and 5 , awafer structure 100 e depicted inFIG. 5 is similar to thewafer structure 100 a depicted inFIG. 1A , while the difference therebetween lies in that thewafer structure 100 e depicted inFIG. 5 further includes a plurality of conductive throughholes 130, and a plurality ofactive circuits 118 are located on thefirst surface 112. The conductive throughholes 130 penetrate thesecond surface 114 of thesubstrate 110 and connect theactive circuits 118. Thestress buffer layer 120 a is located on an area outside theactive circuits 118. Here, thefirst surface 112 is an active surface, whereas thesecond surface 114 is a non-active surface. Namely, thewafer structure 100 e having active devices is described in the present embodiment. - The wafer structures 100 a-100 e and the
chip structures 200 are described in above embodiments of the present invention, while a process of fabricating a chip is not discussed herein yet. Thus, two embodiments are provided hereinafter for demonstrating the process of fabricating the chip according to the present application. In the two embodiments, thinnedwafers FIGS. 7A-7K . -
FIGS. 6A to 6G illustrate a process of fabricating a chip according to an embodiment of the present invention. To better facilitate descriptions of the invention, it should be mentioned thatFIG. 6E contains a schematic top view and a schematic partially-enlarged view of the process of fabricating the chip as shown inFIG. 6D . Referring toFIG. 6A , in the process of fabricating the chip according to the present embodiment, awafer 300 having afirst surface 300 a and asecond surface 300 b opposite to each other is provided at first. - Next, referring to
FIG. 6A , a photolithography and anisotropic etching process is performed on thefirst surface 300 a of thewafer 300 to form a plurality ofholes 310 a. Besides, an insulatinglayer 320 and anelectroplating seed layer 330 covering the insulatinglayer 320 are formed on thefirst surface 300 a and on walls of theholes 310 a. - After that, referring to
FIG. 6B , apatterned mask 340 is formed on theelectroplating seed layer 330 located above thefirst surface 300 a of thewafer 300. Here, the patternedmask 340 does not cover theholes 310 a. - Referring to
FIG. 6C , a conductive material is then formed in theholes 310 a by performing an electroplating process on theelectroplating seed layer 330, such that a plurality ofconductive holes 310 b are formed. Meanwhile, a plurality of stress buffer rings 350 are formed on a portion of theelectroplating seed layer 330 located above thefirst surface 300 a of thewafer 300. Here, theconductive holes 310 b are respectively located in the stress buffer rings 350. - Thereafter, referring to
FIGS. 6D and 6E , the patternedmask 340 and a portion of theelectroplating seed layer 330 located below the patternedmask 340 are removed. So far, theconductive holes 310 b and the stress buffer rings 350 protruding from thefirst surface 300 a are completely formed on thewafer 300. - Next, referring to
FIGS. 6F and 6G , a thinning process is performed on thesecond surface 300 b of thewafer 300 until theconductive holes 310 b are exposed, such that theconductive holes 310 b are transformed into a plurality of conductive throughholes 310 c. Finally, thewafer 300 is cut along the stress buffer rings 350 to form a plurality ofchip units 400. - Specifically, the stress buffer rings 350 are located on the
first surface 300 a of thewafer 300 in the present embodiment. Therefore, when the thinning process is performed on thewafer 300 to reduce the entire thickness of thewafer 300, the stress buffer rings 350 can serve as supporting structures for preventing the thinnedwafer 300 from being cracked when the thinnedwafer 300 is picked up, placed, and transported by a machine. Additionally, when thewafer 300 is cut along the stress buffer rings 350 and divided into a plurality ofchip units 400, the stress buffer rings 350 can also preclude thewafer 300 from being cracked due to stress or preclude the cracks from extending to theadjacent chip units 400. Thereby, cutting yield can be improved. - In the present embodiment, note that the
wafer 300 is a dummy wafer. Therefore, functions and types of thefirst surface 300 a and thesecond surface 300 b are substantially the same. However, in other embodiments not depicted in the drawings, given that the wafer is a device wafer having active devices, a surface of the wafer having the active circuits (including the active devices and interconnects) is an active surface, the conductive through holes connect the active circuits, and the stress buffer rings are located on an area outside the active circuits, which is still construed as a part of the technical proposal of the present application and does not depart from the protection range of the invention. Relative positions of the active circuits and the conductive through holes are similar to those of theactive circuits 118 and the conductive throughholes 130 illustrated inFIG. 5 . - Particularly, when the stress buffer rings protruding from the surface of the wafer and the conductive through holes are completely formed on a wafer having the active devices, the wafer can be directly cut along the stress buffer rings to form a plurality of chip units having the active devices in no need of performing a thinning process.
- In brief, according to the process of fabricating the chip in the present embodiment, the
holes 310 a are formed on thefirst surface 300 a of thewafer 300 by implementing a photolithography and etching process. Thereafter, the stress buffer rings 350 protruding from thefirst surface 300 a and theconductive holes 310 b in theholes 310 a are formed by performing an electroplating process and using the patternedmask 340. A thinning process is then performed on thewafer 300, and thewafer 300 is cut along the stress buffer rings 350 to form a plurality ofchip units 400. That is to say, each of thechip units 400 of the present embodiment has the conductive throughholes 310 c and the stress buffer rings 350 protruding from thefirst surface 300 a, and the stress buffer rings 350 can improve yield of cutting thewafer 300 during the process of fabricating the chip. -
FIGS. 7A to 7K illustrate a process of fabricating a chip according to an embodiment of the present invention. To better facilitate descriptions of the invention,FIG. 7H contains a schematic top view and a schematic partially-enlarged view of the process of fabricating the chip as shown inFIG. 7I . Referring toFIG. 7A , according to the process of fabricating the chip in the present embodiment, awafer 500 having afirst surface 500 a and asecond surface 500 b opposite to each other is provided at first. - Next, referring to
FIG. 7A , a photolithography and anisotropic etching process is performed on thefirst surface 500 a of thewafer 500 to form a plurality ofholes 510 a. Besides, anelectroplating seed layer 520 is formed on thefirst surface 500 a and on walls of theholes 510 a. - After that, referring to
FIG. 7B , a firstpatterned mask 540 a is formed on theelectroplating seed layer 520 located above thefirst surface 500 a of thewafer 500. Here, the firstpatterned mask 540 a does not cover theholes 510 a. - Thereafter, referring to
FIG. 7C , a conductive material is formed in theholes 510 a by performing an electroplating process on theelectroplating seed layer 520, such that a plurality ofconductive holes 510 b are formed. - As shown in
FIG. 7D , the firstpatterned mask 540 a and a portion of theelectroplating seed layer 520 located below the firstpatterned mask 540 a are then removed to expose thefirst surface 500 a of thewafer 500 and partial surfaces of theholes 510 b. - Next, referring to
FIG. 7E , a secondpatterned mask 540 b is formed on thefirst surface 500 a of thewafer 500. Here, the secondpatterned mask 540 b does not cover theholes 510 b. - As indicated in
FIG. 7F , thefirst surface 500 a is then etched by using the secondpatterned mask 540 b as an etching mask to form a plurality of insulating ring areas I and a plurality of stress buffer ring areas S. Here, the insulating ring areas I respectively expose side walls of theconductive holes 510 b, and the insulating ring areas I are respectively located in the stress buffer ring areas S. After that, the secondpatterned mask 540 b is removed. - Thereafter, referring to
FIG. 7G , an insulatingmaterial 570 is disposed in the insulating ring areas I and the stress buffer ring areas S. In the present embodiment, the insulatingmaterial 570 is, for example, glass or polymer. - Next, referring to
FIGS. 7H and 7I , a portion of the insulatingmaterial 570 is removed, such that the insulatingmaterial 570 is substantially flush with thefirst surface 500 a of thewafer 500, and that a plurality of insulatingrings 550 and a plurality of stress buffer rings 560 are formed. So far, the stress buffer rings 560 embedded in thefirst surface 500 a and theconductive holes 510 b are completely formed on thewafer 500. - Afterwards, referring to
FIGS. 7J and 7K , a thinning process is performed on thesecond surface 500 b of thewafer 500 until theconductive holes 510 b are exposed, such that theconductive holes 510 b are transformed into a plurality of conductive throughholes 510 c. Finally, thewafer 500 is cut along the stress buffer rings 560 to form a plurality ofchip units 600. - Specifically, the stress buffer rings 560 are embedded in the
first surface 500 a of thewafer 500 according to the present embodiment. Therefore, when the thinning process is performed on thewafer 500 to reduce the entire thickness of thewafer 500, the stress buffer rings 560 can serve as supporting structures for preventing the thinnedwafer 500 from being cracked when the thinnedwafer 500 is picked up, placed, and transported by a machine. Additionally, when thewafer 500 is cut along the stress buffer rings 560 and divided into a plurality ofchip units 600, the stress buffer rings 560 can also preclude thewafer 500 from being cracked due to stress or preclude the cracks from extending to theadjacent chip units 600. Thereby, cutting yield can be improved. - In the present embodiment, note that the
wafer 500 is a dummy wafer. Therefore, functions and types of thefirst surface 500 a and thesecond surface 500 b are substantially the same. However, in other embodiments not depicted in the drawings, given that the wafer is a device wafer having active devices, a surface of the wafer having the active circuits (including the active devices and interconnects) is an active surface, the conductive through holes connect the active circuits, and the stress buffer rings are located on an area outside the active circuits, which is still construed as a part of the technical proposal of the present application and does not depart from the protection range of the invention. Relative positions of the active circuits and the conductive through holes are similar to those of theactive circuits 118 and the conductive throughholes 130 illustrated inFIG. 5 . - In particular, when the stress buffer rings embedded in the surface of the wafer and the conductive through holes are completely formed on a wafer having the active devices, the wafer can be directly cut along the stress buffer rings to form a plurality of chip units having the active devices in no need of performing a thinning process.
- In brief, according to the process of fabricating the chip in the present embodiment, the
holes 510 a, the insulating ring areas I, and the stress buffer ring areas S are formed on thefirst surface 500 a of thewafer 500 by implementing two photolithography and etching processes, respectively. In the meantime, theconductive holes 510 b are formed in theholes 510 a by performing an electroplating process and using the firstpatterned mask 540 a. After that, the insulatingmaterial 570 is disposed in the insulating ring areas I and the stress buffer ring areas S to form the insulatingrings 550 and the stress buffer rings 560. Finally, a thinning process is performed on thewafer 500, and thewafer 500 is cut along the stress buffer rings 560 to form a plurality ofchip units 600. That is to say, each of thechip units 600 of the present embodiment has the conductive throughholes 510 c and the stress buffer rings 560 embedded in thefirst surface 500 a, and the stress buffer rings 560 can improve yield of cutting thewafer 600 during the process of fabricating the chip. - In light of the foregoing, the wafer structure of the present application is equipped with a stress buffer layer. Therefore, after a thinning process is carried out, the stress buffer layer not only can serve as a supporting structure for preventing the thinned wafer structure from being cracked when the thinned wafer structure is picked up, placed, and transported by a machine, but also can preclude the wafer from being cracked or preclude the cracks from extending to the chip areas located at respective sides of adjacent cutting paths when the wafer structure is cut and divided into a plurality of chip structures. As such, the cutting yield can be improved.
- Moreover, in the process of fabricating the chip of the present application, the stress buffer rings protruding from or embedded in a surface of the wafer are formed. Hence, when the wafer is cut along the stress buffer rings to form a plurality of chip units, the stress buffer rings are capable of preventing the wafer from being cracked due to stress and precluding the cracks from extending to the adjacent chip units. As a result, the cutting yield can be improved. In conclusion, manufacturing yield can be achieved by performing the process of fabricating the chip according to the present application.
- Although the present application has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiment may be made without departing from the spirit of the invention. Accordingly, the scope of the invention will be defined by the attached claims not by the above detailed descriptions.
Claims (20)
1. A chip structure, comprising:
a substrate having a first surface and a second surface opposite to the first surface; and
a stress buffer layer disposed on the periphery of the substrate and located in at least one of the first surface and the second surface of the substrate.
2. The chip structure as claimed in claim 1 , wherein a material of the stress buffer layer comprises metal, glass, or a polymer material.
3. The chip structure as claimed in claim 1 , wherein the stress buffer layer protrudes from one of the first surface and the second surface of the substrate.
4. The chip structure as claimed in claim 1 , wherein the stress buffer layer is embedded in one of the first surface and the second surface of the substrate.
5. The chip structure as claimed in claim 1 , wherein the substrate comprises a plurality of active circuits located on the first surface, and the stress buffer layer is located on an area outside the active circuits.
6. The chip structure as claimed in claim 5 , further comprising at least a conductive through hole penetrating the second surface of the substrate and connecting the active circuits.
7. The chip structure as claimed in claim 1 , further comprising at least a conductive through hole penetrating the substrate and connecting the first surface and the second surface of the substrate.
8. A wafer structure, comprising:
a substrate having a first surface, a second surface opposite to the first surface, and a plurality of cutting paths dividing the substrate into a plurality of chip units; and
a stress buffer layer surrounding each of the chip units and disposed on at least one of the first surface and the second surface of the substrate.
9. The wafer structure as claimed in claim 8 , wherein a material of the stress buffer layer comprises metal, glass, or a polymer material.
10. The wafer structure as claimed in claim 8 , wherein the stress buffer layer protrudes from one of the first surface and the second surface of the substrate.
11. The wafer structure as claimed in claim 8 , wherein the stress buffer layer is embedded in one of the first surface and the second surface of the substrate.
12. The wafer structure as claimed in claim 8 , wherein the substrate comprises a plurality of active circuits located on the first surface, and the stress buffer layer is located on an area outside the active circuits.
13. The wafer structure as claimed in claim 12 , further comprising a plurality of conductive through holes formed in each of the chip units, wherein the conductive through holes penetrate the second surface of the substrate and connect the active circuits.
14. The wafer structure as claimed in claim 8 , further comprising a plurality of conductive through holes formed in each of the chip units, wherein the conductive through holes penetrate the second surface of the substrate and connect the first surface.
15. The wafer structure as claimed in claim 14 , further comprising:
an insulating layer surrounding the conductive through holes; and
an electroplating seed layer covering the insulating layer.
16. The wafer structure as claimed in claim 14 , further comprising:
a plurality of insulating rings surrounding the conductive through holes.
17. The wafer structure as claimed in claim 8 , wherein the stress buffer layer is a lattice-like pattern formed by stress buffer rings connected to one another, and the stress buffer rings are integrally formed.
18. The wafer structure as claimed in claim 8 , wherein a width of the cutting paths is greater than or equal to a width of the stress buffer layer.
19. The wafer structure as claimed in claim 8 , wherein the stress buffer layer is formed by individual stress buffer rings respectively surrounding the chip units.
20. The wafer structure as claimed in claim 8 , wherein the cutting paths are defined by an area of the first surface of the substrate which is not covered by a passivation layer, and the area does not include pad regions exposed by the passivation layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/932,712 US20130292803A1 (en) | 2009-03-10 | 2013-07-01 | Chip structure and wafer structure |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW98107682 | 2009-03-10 | ||
TW98107682A TWI470766B (en) | 2009-03-10 | 2009-03-10 | Chip structure, wafer structure and process of fabricating chip |
US12/703,488 US8501579B2 (en) | 2009-03-10 | 2010-02-10 | Process of fabricating chip |
US13/932,712 US20130292803A1 (en) | 2009-03-10 | 2013-07-01 | Chip structure and wafer structure |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/703,488 Division US8501579B2 (en) | 2009-03-10 | 2010-02-10 | Process of fabricating chip |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130292803A1 true US20130292803A1 (en) | 2013-11-07 |
Family
ID=42730000
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/703,488 Active 2031-12-06 US8501579B2 (en) | 2009-03-10 | 2010-02-10 | Process of fabricating chip |
US13/932,712 Abandoned US20130292803A1 (en) | 2009-03-10 | 2013-07-01 | Chip structure and wafer structure |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/703,488 Active 2031-12-06 US8501579B2 (en) | 2009-03-10 | 2010-02-10 | Process of fabricating chip |
Country Status (2)
Country | Link |
---|---|
US (2) | US8501579B2 (en) |
TW (1) | TWI470766B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8963343B1 (en) * | 2013-09-27 | 2015-02-24 | Cypress Semiconductor Corporation | Ferroelectric memories with a stress buffer |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI392069B (en) | 2009-11-24 | 2013-04-01 | Advanced Semiconductor Eng | Package structure and packaging process thereof |
TWI446420B (en) | 2010-08-27 | 2014-07-21 | Advanced Semiconductor Eng | Releasing carrier method for semiconductor process |
TWI445152B (en) | 2010-08-30 | 2014-07-11 | Advanced Semiconductor Eng | Semiconductor structure and method for manufacturing the same |
US9007273B2 (en) | 2010-09-09 | 2015-04-14 | Advances Semiconductor Engineering, Inc. | Semiconductor package integrated with conformal shield and antenna |
TWI434387B (en) | 2010-10-11 | 2014-04-11 | Advanced Semiconductor Eng | Semiconductor element having a via and package having a semiconductor element with a via and method for making the same |
TWI527174B (en) | 2010-11-19 | 2016-03-21 | 日月光半導體製造股份有限公司 | Package having semiconductor device |
TWI445155B (en) | 2011-01-06 | 2014-07-11 | Advanced Semiconductor Eng | Stacked semiconductor package and method for making the same |
US8853819B2 (en) | 2011-01-07 | 2014-10-07 | Advanced Semiconductor Engineering, Inc. | Semiconductor structure with passive element network and manufacturing method thereof |
US8541883B2 (en) | 2011-11-29 | 2013-09-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor device having shielded conductive vias |
US8975157B2 (en) | 2012-02-08 | 2015-03-10 | Advanced Semiconductor Engineering, Inc. | Carrier bonding and detaching processes for a semiconductor wafer |
US8963316B2 (en) | 2012-02-15 | 2015-02-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor device and method for manufacturing the same |
US8786060B2 (en) | 2012-05-04 | 2014-07-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package integrated with conformal shield and antenna |
US9153542B2 (en) | 2012-08-01 | 2015-10-06 | Advanced Semiconductor Engineering, Inc. | Semiconductor package having an antenna and manufacturing method thereof |
US8937387B2 (en) | 2012-11-07 | 2015-01-20 | Advanced Semiconductor Engineering, Inc. | Semiconductor device with conductive vias |
US8952542B2 (en) | 2012-11-14 | 2015-02-10 | Advanced Semiconductor Engineering, Inc. | Method for dicing a semiconductor wafer having through silicon vias and resultant structures |
US9406552B2 (en) | 2012-12-20 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor device having conductive via and manufacturing process |
US8841751B2 (en) | 2013-01-23 | 2014-09-23 | Advanced Semiconductor Engineering, Inc. | Through silicon vias for semiconductor devices and manufacturing method thereof |
US9978688B2 (en) | 2013-02-28 | 2018-05-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package having a waveguide antenna and manufacturing method thereof |
US9089268B2 (en) | 2013-03-13 | 2015-07-28 | Advanced Semiconductor Engineering, Inc. | Neural sensing device and method for making the same |
US8987734B2 (en) | 2013-03-15 | 2015-03-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor wafer, semiconductor process and semiconductor package |
US9173583B2 (en) | 2013-03-15 | 2015-11-03 | Advanced Semiconductor Engineering, Inc. | Neural sensing device and method for making the same |
CN109036132B (en) * | 2018-07-24 | 2021-03-26 | 广州国显科技有限公司 | Display panel and display mother board |
CN112967928B (en) * | 2020-12-16 | 2022-07-29 | 重庆康佳光电技术研究院有限公司 | Chip cutting method and chip transferring method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050127495A1 (en) * | 2003-12-12 | 2005-06-16 | Chartered Semiconductor Manufacturing Ltd. | Method of fabrication of a die oxide ring |
US20080099884A1 (en) * | 2006-10-31 | 2008-05-01 | Masahio Inohara | Staggered guard ring structure |
US20080299708A1 (en) * | 2004-09-24 | 2008-12-04 | Matsushita Electric Industrial Co., Ltd. | Electronic device and method for fabricating the same |
US20090075478A1 (en) * | 2004-12-02 | 2009-03-19 | Nec Electronics Corporation | Semiconductor device,having a through electrode, semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode |
US20090200548A1 (en) * | 2006-12-29 | 2009-08-13 | Nicole Meier Chang | Guard ring extension to prevent realiability failures |
US20090278238A1 (en) * | 2008-05-12 | 2009-11-12 | Texas Instruments Inc | Tsvs having chemically exposed tsv tips for integrated circuit devices |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6750516B2 (en) * | 2001-10-18 | 2004-06-15 | Hewlett-Packard Development Company, L.P. | Systems and methods for electrically isolating portions of wafers |
TWI266349B (en) * | 2004-08-06 | 2006-11-11 | Phoenix Prec Technology Corp | Chip protection method in semiconductor packaging process |
US7402515B2 (en) * | 2005-06-28 | 2008-07-22 | Intel Corporation | Method of forming through-silicon vias with stress buffer collars and resulting devices |
US7633167B2 (en) * | 2005-09-29 | 2009-12-15 | Nec Electronics Corporation | Semiconductor device and method for manufacturing same |
US9024349B2 (en) * | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US7741196B2 (en) | 2007-01-29 | 2010-06-22 | Freescale Semiconductor, Inc. | Semiconductor wafer with improved crack protection |
-
2009
- 2009-03-10 TW TW98107682A patent/TWI470766B/en active
-
2010
- 2010-02-10 US US12/703,488 patent/US8501579B2/en active Active
-
2013
- 2013-07-01 US US13/932,712 patent/US20130292803A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050127495A1 (en) * | 2003-12-12 | 2005-06-16 | Chartered Semiconductor Manufacturing Ltd. | Method of fabrication of a die oxide ring |
US20080299708A1 (en) * | 2004-09-24 | 2008-12-04 | Matsushita Electric Industrial Co., Ltd. | Electronic device and method for fabricating the same |
US20090075478A1 (en) * | 2004-12-02 | 2009-03-19 | Nec Electronics Corporation | Semiconductor device,having a through electrode, semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode |
US20080099884A1 (en) * | 2006-10-31 | 2008-05-01 | Masahio Inohara | Staggered guard ring structure |
US20090200548A1 (en) * | 2006-12-29 | 2009-08-13 | Nicole Meier Chang | Guard ring extension to prevent realiability failures |
US20090278238A1 (en) * | 2008-05-12 | 2009-11-12 | Texas Instruments Inc | Tsvs having chemically exposed tsv tips for integrated circuit devices |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8963343B1 (en) * | 2013-09-27 | 2015-02-24 | Cypress Semiconductor Corporation | Ferroelectric memories with a stress buffer |
Also Published As
Publication number | Publication date |
---|---|
TW201034162A (en) | 2010-09-16 |
US8501579B2 (en) | 2013-08-06 |
US20100230788A1 (en) | 2010-09-16 |
TWI470766B (en) | 2015-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8501579B2 (en) | Process of fabricating chip | |
TWI479622B (en) | Chip package and method for forming the same | |
KR100433781B1 (en) | Method for manufacturing semiconductor devices | |
US11545424B2 (en) | Package structure and manufacturing method thereof | |
US8178421B2 (en) | Method of fabricating semiconductor device | |
US9142486B2 (en) | Chip package and fabrication method thereof | |
JP5232185B2 (en) | Manufacturing method of semiconductor device | |
US9917010B2 (en) | Semiconductor device manufacturing method | |
KR101901988B1 (en) | Method of manufacturing semiconductor package | |
US20080169559A1 (en) | Bump structure with annular support and manufacturing method thereof | |
JP5140014B2 (en) | Manufacturing method of semiconductor device | |
JP2009032929A (en) | Semiconductor device and method of manufacturing the same | |
US20090309218A1 (en) | Semiconductor device and method of manufacturing the same | |
TWI446500B (en) | Chip package and method for forming the same | |
JP2010140987A (en) | Method of manufacturing semiconductor device | |
US20240038688A1 (en) | Semiconductor device | |
US20110057305A1 (en) | Package substrate having semiconductor component embedded therein and fabrication method thereof | |
US8173539B1 (en) | Method for fabricating metal redistribution layer | |
JP4147187B2 (en) | Manufacturing method of color image sensor on transparent substrate | |
CN101853819A (en) | Chip structure, wafer structure and chip fabrication technique | |
JP2010016224A (en) | Semiconductor device and method for manufacturing the same | |
US20060030082A1 (en) | Semiconductor device and fabricating method thereof | |
JP2007173325A (en) | Manufacturing method of semiconductor device | |
JP2006202865A (en) | Solid-state image pickup device and its manufacturing method | |
US20160300764A1 (en) | Semiconductor device and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |