US20130186600A1 - Flat heat pipe and method of manufacturing the same - Google Patents

Flat heat pipe and method of manufacturing the same Download PDF

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Publication number
US20130186600A1
US20130186600A1 US13/412,582 US201213412582A US2013186600A1 US 20130186600 A1 US20130186600 A1 US 20130186600A1 US 201213412582 A US201213412582 A US 201213412582A US 2013186600 A1 US2013186600 A1 US 2013186600A1
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US
United States
Prior art keywords
flat
capillary structure
hollow pipe
shaped
edge portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/412,582
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English (en)
Inventor
Chien-Hung Sun
Chun Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooler Master Development Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to COOLER MASTER CO., LTD. reassignment COOLER MASTER CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SUN, CHIEN-HUNG, ZHOU, Chun
Publication of US20130186600A1 publication Critical patent/US20130186600A1/en
Assigned to COOLER MASTER DEVELOPMENT CORPORATION reassignment COOLER MASTER DEVELOPMENT CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: COOLER MASTER CO., LTD.
Priority to US14/302,405 priority Critical patent/US9533385B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the invention relates to a flat heat pipe and a method of manufacturing the same and, more particularly, to a flat heat pipe with a capillary structure and a method of manufacturing the flat heat pipe, wherein the interior of the capillary structure is thin and the exterior of the capillary structure is thick.
  • Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
  • the heat dissipating device used in the electronic product usually consists of a heat pipe, a heat dissipating fin and a heat dissipating fan, wherein one end of the heat pipe contacts the electronic component, which generates heat during operation, the other end of the heat pipe is connected to the heat dissipating fin, and the heat dissipating fan blows air to the heat dissipating fin so as to dissipate heat.
  • the heat pipe mainly comprises circular heat pipe and flat heat pipe.
  • the flat heat pipe mainly consists of a flat hollow pipe, a capillary structure and a working fluid.
  • the conventional capillary structure is usually formed on an inner wall of a circular hollow pipe by a metal powder sintering process and then the circular hollow pipe is compressed to form the flat heat pipe.
  • the heat pipe is called “ultra-thin heat pipe”
  • a wall thickness of a heat pipe is larger than 2 mm
  • the heat pipe is called “thin heat pipe”.
  • the heat pipe still has to reserve enough inner space for the working fluid to change between liquid state and gaseous state. Since the capillary structure occupies much more inner space of the heat pipe except the working fluid, how to effectively make use of limited inner space of the heat pipe (especially the thin or ultra-thin heat pipe) has become a significant design issue.
  • the invention provides a flat heat pipe with a capillary structure and a method of manufacturing the flat heat pipe, wherein the interior of the capillary structure is thin and the exterior of the capillary structure is thick, so as to solve the aforesaid problems.
  • a flat heat pipe comprises a flat hollow pipe and a capillary structure.
  • the flat hollow pipe has a first flat portion, a second flat portion and two arc portions, wherein the two arc portions are connected to both sides of the first and second flat portions.
  • the capillary structure is formed in the flat hollow pipe.
  • the capillary structure has a central portion and two edge portions, wherein the central portion is located on an inner wall of the first flat portion, the two edge portions are located on inner walls of the two arc portions respectively, and a thickness of the central portion is smaller than a thickness of each of the two edge portions.
  • a method of manufacturing a flat heat pipe comprises steps of providing a circular hollow pipe and a T-shaped like wick, wherein the T-shaped like wick has a fan-shaped portion and a protruding portion protruding from the fan-shaped portion; inserting the T-shaped like wick into the circular hollow pipe such that the fan-shaped portion abuts against an inner wall of the circular hollow pipe and a segment difference space is formed between the protruding portion and the inner wall of the circular hollow pipe; forming a capillary structure in the segment difference space, wherein the capillary structure has a central portion and two edge portions and a thickness of the central portion is smaller than a thickness of each of the two edge portions; drawing the T-shaped like wick out of the circular hollow pipe; and compressing the circular hollow pipe so as to forma flat hollow pipe.
  • the flat hollow pipe After compressing the circular hollow pipe so as to form the flat hollow pipe, the flat hollow pipe has a first flat portion, a second flat portion and two arc portions, the two arc portions are connected to both sides of the first and second flat portions, the central portion is located on an inner wall of the first flat portion, and the two edge portions are located on inner walls of the two arc portions respectively. Furthermore, after compressing the circular hollow pipe so as to form the flat hollow pipe, at least one of the two edge portions abuts against an inner wall of the second flat portion.
  • the aforesaid capillary structure maybe a sintered capillary structure, a mesh capillary structure or a compound capillary structure.
  • the interior of the capillary structure is thin and the exterior of the capillary structure is thick such that one single vapor channel is formed in the flat hollow pipe of the flat heat pipe of the invention.
  • Heat conduction of the single vapor channel can be raised effectively so as to achieve good heat exchange cycle.
  • the thickness of the central portion of the capillary structure is smaller than the thickness of each of the two edge portions, thermal resistance of the central portion of the capillary structure is lower than that of each of the two edge portions so as to enhance heat conduction while a heat source is attached to the center of the flat hollow pipe of the flat heat pipe.
  • FIG. 1 is a flowchart illustrating a method of manufacturing a flat heat pipe according to an embodiment of the invention.
  • FIG. 2 is a perspective view illustrating a circular hollow pipe and a T-shaped like wick.
  • FIG. 3 is a front view illustrating the T-shaped like wick being inserted into the circular hollow pipe.
  • FIG. 4 is a front view illustrating a capillary structure being formed in a segment difference space.
  • FIG. 5 is a front view illustrating the T-shaped like wick shown in FIG. 4 being drawn out of the circular hollow pipe.
  • FIG. 6 is a front view illustrating the circular hollow pipe shown in FIG. 5 being compressed so as to form a flat hollow pipe.
  • FIG. 7 is a schematic diagram illustrating a heat source being attached to the flat heat pipe shown in FIG. 6 .
  • FIG. 1 is a flowchart illustrating a method of manufacturing a flat heat pipe according to an embodiment of the invention
  • FIG. 2 is a perspective view illustrating a circular hollow pipe 10 and a T-shaped like wick 12
  • FIG. 3 is a front view illustrating the T-shaped like wick 12 being inserted into the circular hollow pipe 10
  • FIG. 4 is a front view illustrating a capillary structure 14 being formed in a segment difference space 100
  • FIG. 5 is a front view illustrating the T-shaped like wick 12 shown in FIG. 4 being drawn out of the circular hollow pipe 10
  • FIG. 6 is a front view illustrating the circular hollow pipe 10 shown in FIG. 5 being compressed so as to form a flat hollow pipe 10 ′.
  • step S 10 is performed to provide a circular hollow pipe 10 and a T-shaped like wick 12 , wherein the T-shaped like wick 12 has a fan-shaped portion 120 and a protruding portion 122 protruding from the fan-shaped portion 120 , as shown in FIG. 2 .
  • the protruding portion 122 is trapezoid.
  • the protruding portion 122 may be arc-shaped or other shapes and it depends on practical applications.
  • step S 12 is performed to insert the T-shaped like wick 12 into the circular hollow pipe 10 such that the fan-shaped portion 120 abuts against an inner wall of the circular hollow pipe 10 and a segment difference space 100 is formed between the protruding portion 122 and the inner wall of the circular hollow pipe 10 .
  • a thickness T 1 of the center of the segment difference space 100 is smaller than a thickness T 2 of both sides of the segment difference space 100 .
  • Step S 14 is then performed to form a capillary structure 14 in the segment difference space 100 , wherein the capillary structure 14 has a central portion 140 and two edge portions 142 , as shown in FIG. 4 .
  • a thickness of the central portion 140 of the capillary structure 14 is substantially equal to the thickness T 1 of the center of the segment difference space 100
  • a thickness of each of the two edge portions 142 of the capillary structure 14 is substantially equal to the thickness T 2 of both sides of the segment difference space 100 . Accordingly, the thickness T 1 of the central portion 140 of the capillary structure 14 is smaller than the thickness T 2 of each of the two edge portions 142 .
  • the capillary structure 14 maybe a sintered capillary structure, a mesh capillary structure or a compound capillary structure and it depends on practical applications.
  • Step S 16 is then performed to draw the T-shaped like wick 12 out of the circular hollow pipe 10 , as shown in FIG. 5 .
  • step S 18 is performed to compress the circular hollow pipe 10 so as to form a flat hollow pipe 10 ′. Consequently, the flat heat pipe 1 shown in FIG. 6 is manufactured completely.
  • a working fluid (not shown), such as water or other fluids with low viscosity, is filled in the flat hollow pipe 10 ′.
  • the flat hollow pipe 10 ′ After compressing the circular hollow pipe 10 so as to form the flat hollow pipe 10 ′, the flat hollow pipe 10 ′ has a first flat portion 102 , a second flat portion 104 and two arc portions 106 , wherein the two arc portions 106 are connected to both sides of the first flat portion 102 and the second flat portion 104 . As shown in FIG.
  • the central portion 140 of the capillary structure 14 is located on an inner wall of the first flat portion 102 , and the two edge portions 142 of the capillary structure 14 are located on inner walls of the two arc portions 106 respectively so that the capillary structure 14 is U-shaped. Furthermore, after compression and deformation, a thickness T 1 ′ of the central portion 140 is still smaller than a thickness T 2 ′ of each of the two edge portions 142 . Since the interior of the capillary structure 14 is thin and the exterior of the capillary structure 14 is thick, one single vapor channel 108 is formed in the flat hollow pipe 10 ′ of the flat heat pipe 1 . Heat conduction of the single vapor channel 108 can be raised effectively so as to achieve good heat exchange cycle.
  • the two edge portions 142 of the capillary structure 14 after compressing the circular hollow pipe 10 so as to form the flat hollow pipe 10 ′, the two edge portions 142 of the capillary structure 14 abut against an inner wall of the second flat portion 104 of the flat hollow pipe 10 ′. Accordingly, the two edge portions 142 of the capillary structure 14 can support the flat hollow pipe 10 ′ so as to prevent the flat hollow pipe 10 ′ from cracking due to compression. It should be noted that the capillary structure 14 can support the flat hollow pipe 10 ′ while at least one of the two edge portions 142 abuts against the inner wall of the second flat portion 104 , so the invention is not limited to the embodiment shown in FIG. 6 .
  • FIG. 7 is a schematic diagram illustrating a heat source 3 being attached to the flat heat pipe 1 shown in FIG. 6 .
  • the heat source 3 is usually attached to the center below the first flat portion 102 of the flat heat pipe 1 . Since the thickness T 1 ′ of the central portion 140 of the capillary structure 14 is smaller than the thickness T 2 ′ of each of the two edge portions 142 , thermal resistance of the central portion 140 of the capillary structure 14 is lower than that of each of the two edge portions 142 so as to enhance heat conduction while the heat source 3 is attached to the center below the first flat portion 102 of the flat heat pipe 1 .
  • the interior of the capillary structure is thin and the exterior of the capillary structure is thick such that one single vapor channel is formed in the flat hollow pipe of the flat heat pipe of the invention.
  • Heat conduction of the single vapor channel can be raised effectively so as to achieve good heat exchange cycle.
  • the thickness of the central portion of the capillary structure is smaller than the thickness of each of the two edge portions, thermal resistance of the central portion of the capillary structure is lower than that of each of the two edge portions so as to enhance heat conduction while a heat source is attached to the center of the flat hollow pipe of the flat heat pipe.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US13/412,582 2012-01-20 2012-03-05 Flat heat pipe and method of manufacturing the same Abandoned US20130186600A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/302,405 US9533385B2 (en) 2012-01-20 2014-06-11 Flat heat pipe and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210019541.XA CN103217041B (zh) 2012-01-20 2012-01-20 扁平热管制造方法
CN201210019541.X 2012-01-20

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US14/302,405 Active 2032-09-19 US9533385B2 (en) 2012-01-20 2014-06-11 Flat heat pipe and method of manufacturing the same

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CN (1) CN103217041B (zh)
TW (1) TW201331539A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10371458B2 (en) * 2016-04-07 2019-08-06 Cooler Master Co., Ltd. Thermal conducting structure
US20200149823A1 (en) * 2018-11-09 2020-05-14 Furukawa Electric Co., Ltd. Heat pipe

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201516373A (zh) * 2013-10-29 2015-05-01 Hao Pai 具有超薄化毛細結構之熱管的製造方法
CN106091766A (zh) * 2016-07-28 2016-11-09 苏州聚力电机有限公司 具复合毛细组织的扁热管结构
CN106091767A (zh) * 2016-07-28 2016-11-09 苏州聚力电机有限公司 一种具复合毛细组织的扁热管结构
CN106017177A (zh) * 2016-07-28 2016-10-12 苏州聚力电机有限公司 具复合毛细组织的新型扁热管结构
CN107843133B (zh) * 2017-10-25 2019-07-16 昆山德泰新材料科技有限公司 一种散热管
CN107741171B (zh) * 2017-10-25 2019-07-12 昆山德泰新材料科技有限公司 一种散热管
TWI789753B (zh) * 2021-05-06 2023-01-11 大陸商廣州力及熱管理科技有限公司 一種具有船型多孔隙毛細結構之管形元件及熱導管

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110024085A1 (en) * 2009-07-28 2011-02-03 Huang Yu-Po Heat pipe and method for manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101900507B (zh) * 2010-01-15 2011-12-21 富瑞精密组件（昆山）有限公司 扁平薄型热导管
CN101844297B (zh) * 2010-04-28 2012-09-26 锘威科技(深圳)有限公司 一种热管的制作方法及其热管
CN102243030A (zh) * 2010-05-14 2011-11-16 富瑞精密组件（昆山）有限公司 扁平热导管及其制造方法
CN201731789U (zh) * 2010-08-02 2011-02-02 苏州聚力电机有限公司 一种具有复合毛细组织的扁热管结构
CN102466421B (zh) * 2010-11-08 2015-11-25 富瑞精密组件（昆山）有限公司 扁平热导管及其制造方法
CN202024640U (zh) * 2011-03-24 2011-11-02 索士亚科技股份有限公司 用于对热源进行热交换的扁型热管及其毛细结构
CN202452870U (zh) * 2012-01-20 2012-09-26 讯凯国际股份有限公司 扁平热管

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110024085A1 (en) * 2009-07-28 2011-02-03 Huang Yu-Po Heat pipe and method for manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10371458B2 (en) * 2016-04-07 2019-08-06 Cooler Master Co., Ltd. Thermal conducting structure
US10935326B2 (en) * 2016-04-07 2021-03-02 Cooler Master Co., Ltd. Thermal conducting structure
US11313628B2 (en) * 2016-04-07 2022-04-26 Cooler Master Co., Ltd. Thermal conducting structure
US20200149823A1 (en) * 2018-11-09 2020-05-14 Furukawa Electric Co., Ltd. Heat pipe
US10976112B2 (en) * 2018-11-09 2021-04-13 Furukawa Electric Co., Ltd. Heat pipe

Also Published As

Publication number Publication date
CN103217041B (zh) 2014-08-20
TW201331539A (zh) 2013-08-01
CN103217041A (zh) 2013-07-24
US9533385B2 (en) 2017-01-03
US20140290063A1 (en) 2014-10-02

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Owner name: COOLER MASTER CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SUN, CHIEN-HUNG;ZHOU, CHUN;REEL/FRAME:027808/0471

Effective date: 20120130

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Owner name: COOLER MASTER DEVELOPMENT CORPORATION, TAIWAN

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Effective date: 20130220

STCB Information on status: application discontinuation

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