US20130037883A1 - Ldpmos structure for enhancing breakdown voltage and specific on resistance in bicmos-dmos process - Google Patents

Ldpmos structure for enhancing breakdown voltage and specific on resistance in bicmos-dmos process Download PDF

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US20130037883A1
US20130037883A1 US13/648,964 US201213648964A US2013037883A1 US 20130037883 A1 US20130037883 A1 US 20130037883A1 US 201213648964 A US201213648964 A US 201213648964A US 2013037883 A1 US2013037883 A1 US 2013037883A1
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forming
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Yin-Fu Huang
Miao-Chun Chung
Shih-Chin Lien
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Macronix International Co Ltd
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Assigned to MACRONIX INTERNATIONAL CO., LTD. reassignment MACRONIX INTERNATIONAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHUNG, MIAO-CHUN, HUANG, YIN-FU, LIEN, SHIH-CHIN
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    • HELECTRICITY
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    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
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    • H01L29/0843Source or drain regions of field-effect devices
    • H01L29/0847Source or drain regions of field-effect devices of field-effect transistors with insulated gate
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    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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    • H01L21/8248Combination of bipolar and field-effect technology
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0623Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
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    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568Lateral single gate silicon transistors
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    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7835Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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    • H01L29/107Substrate region of field-effect devices
    • H01L29/1075Substrate region of field-effect devices of field-effect transistors
    • H01L29/1079Substrate region of field-effect devices of field-effect transistors with insulated gate
    • H01L29/1083Substrate region of field-effect devices of field-effect transistors with insulated gate with an inactive supplementary region, e.g. for preventing punch-through, improving capacity effect or leakage current
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    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
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    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42364Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
    • H01L29/42368Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform

Abstract

An LDPMOS structure having enhanced breakdown voltage and specific on-resistance is described, as is a method for fabricating the structure. A P-field implanted layer formed in a drift region of the structure and surrounding a tightly doped drain region effectively increases breakdown voltage while maintaining a relatively low specific on-resistance.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application is a divisional of U.S. application Ser. No. 12/797,896 (Att. Docket P980083), filed on Jun. 10, 2010, the entire contents of which are hereby incorporated by reference.
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to semiconductors and, more particularly, to power metal-oxide-semiconductor transistors and methods of fabricating and using same.
  • 2. Description of Related Art
  • A lateral double-diffused metal-oxide-semiconductor (LIMOS) field effect transistor (MOSFET) is a MOSFET fabricated with coplanar drain and source regions. LDMOS devices with a P-channel may be referred to as LDPMOS devices. These devices are typically used in high voltage applications. When designing such LDPMOS devices, it is important for the device to have a very high breakdown voltage (BVD) whilst also exhibiting, during operation, a low specific on-resistance (Ronsp). By designing LDPMOS devices with low Ronsp and high BVD, low power loss can be achieved in high voltage applications. In addition, a low Ronsp can facilitate a high drain current (Idsat) when the transistor is in saturation. One problem encountered when designing such LDPMOS devices is that approaches tending to maximize BVD tend also adversely to affect the Ronsp and vice versa. In other words, a trade-off (e.g., inverse relationship) is typically presented between the optimization of BVD and Ronsp.
  • A need thus exists in the prior art for a lateral power MOSFET arrangement that can provide an effective compromise between large BVD and small Ronsp.
  • SUMMARY OF THE INVENTION
  • The present invention addresses this need by providing a semiconductor structure that exhibits an efficient trade-off between breakdown voltage (BVD) and specific on-resistance (Ronsp). The invention herein disclosed comprises, according to one embodiment, a substrate formed of a first conductivity type with an epitaxial layer formed over the substrate. A first well region of a second conductivity type may be formed in the epitaxial layer with a second well region of the second conductivity type likewise formed in the epitaxial layer and spaced apart from the first well region. A third well region of the first conductivity type may be formed between the first well region and the second well region. A field region of the first conductivity type may be formed in a surface of the third well region and spaced apart from the first and second well regions, the field region having a drain region of the first conductivity type formed on a surface thereof and extending into the field region.
  • Another embodiment of the present invention further comprises a buried region of the second conductivity type formed in the epitaxial layer and extending into the substrate. According to this embodiment, the first well region extends from a surface of the epitaxial layer to an upper extent (e.g., surface) of the buried region, the first well region overlying a portion of the buried region and extending laterally beyond (e.g., past a right extent of) the buried region. The second well region of this embodiment also extends from the surface of the epitaxial layer to the upper extent of the buried region, overlies a portion of the buried region, and extends laterally beyond (e.g., past a left extent of) the buried region. The field region is spaced apart from the buried region.
  • While the apparatus and method has or will be described for the sake of grammatical fluidity with functional explanations, it is to be expressly understood that the claims, unless indicated otherwise, are not to be construed as limited in any way by the construction of “means” or “steps” limitations, but are to be accorded the full scope of the meaning and equivalents of the definition provided by the claims under the judicial doctrine of equivalents.
  • Any feature or combination of features described or referenced herein are included within the scope of the present invention provided that the features included in any such combination are not mutually inconsistent as will be apparent from the context, this specification, and the knowledge of one skilled in the art. In addition, any feature or combination of features described or referenced may be specifically excluded from any embodiment of the present invention. For purposes of summarizing the present invention, certain aspects, advantages and novel features the present invention are described or referenced. Of course, it is to be understood that not necessarily all such aspects, advantages or features will be embodied in any particular implementation of the present invention. Additional advantages and aspects of the present invention are apparent in the following detailed description and claims that follow.
  • BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 is a cross-sectional view of a first example of a prior-art lateral double-diffused P-channel metal-oxide-semiconductor (LDPMOS) structure;
  • FIG. 2 is a cross-sectional view of a second example of a prior-art LDPMOS structure;
  • FIG. 3 is a cross-sectional view of an LDPMOS structure fabricated according to the present invention;
  • FIG. 4 is a flow diagram illustrating an implementation of a method of fabricating an LDPMOS structure according to the present invention;
  • FIG. 5A is a cross-sectional diagram illustrating an early stage of fabricating a collection of semiconductor structures after implanting an N-type buried layer into a P-type substrate;
  • FIG. 5B is a cross-sectional diagram illustrating a result of depositing a P-type epitaxial layer over the structure of FIG. 5A;
  • FIG. 5C is a cross-sectional diagram portraying an effect of forming N- and P-wells the structure of FIG. 5B;
  • FIG. 5D is a cross-sectional diagram showing a result of fo ling a P-field in a portion of the structure of FIG. 5C;
  • FIG. 5E is a cross-sectional diagram the structure of FIG. 5D having a surface patterned with a layer of SiN;
  • FIG. 5F is a cross-sectional diagram of the structure of FIG. 5D after formation of field oxide (FOX) regions on a surface thereof;
  • FIG. 5G is a cross-sectional diagram illustrating a result of formation of high-voltage gate structures on the structure of FIG. 5F;
  • FIG. 5H is a cross-sectional diagram that demonstrates a result of performing P- and N-type implantations on the structure of FIG. 5G; and
  • FIG. 5I is a cross-sectional diagram showing metal layers, vias, and a passivation layer applied to the structure of FIG. 5H.
  • DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS
  • Embodiments of the invention are now described and illustrated in the accompanying drawings, instances of which are to be interpreted to be to scale in some implementations while in other implementations, for each instance, not. In certain aspects, use of like or the same reference designators in the drawings and description refers to the same, similar or analogous components and/or elements, while according to other implementations the same use should not. According to certain implementations, use of directional terms, such as, top, bottom, left, right, up, down, over, above, below, beneath, rear, and front, are to be consumed literally, while in other implementations the same use should not. The present invention may be practiced in conjunction with various integrated circuit fabrication and other techniques that are conventionally used in the art, and only so much of the commonly practiced process steps are included herein as are necessary to provide an understanding of the present invention. The present invention has applicability in the field of semiconductor_devices and processes in general. For illustrative purposes, however, the following description pertains to lateral double-diffused metal-oxide-semiconductor field effect transistors (MOSFETs) and related methods of use and manufacture.
  • Referring more particularly to the drawings, FIGS. 1 and 2 are cross-sectional diagrams of prior-art lateral double-diffused P-channel metal-oxide-semiconductor (LDPMOS) field effect transistors. A relatively good breakdown voltage (BVD) is obtained in FIG. 1, at the expense of an unacceptably large specific on-resistance (Ronsp). On the other hand, when an improvement is made to Ronsp as in FIG. 2, it tends to be at the expense of a smaller BVD.
  • A device illustrated FIG. 3, according to the embodiment of the present invention, comprises a P-type substrate 100 in which is formed an N-type buried layer (NBL) 305. A P-type epitaxial layer 110 overlies the substrate 100 and NBL 305, the epitaxial layer 110 having first and second N-wells 315 and 320 formed therein. A first P-well 325 is disposed between the first and second N-wells 315 and 320, and a second P-well 355 is disposed adjacent the second N-well 320 and opposite the first P-well 325. A P-field 335, which may be referred to as a P-field region, is formed (e.g., implanted) in the first P-well 325, the P-field 335 occupying a portion of a drift region of the LDPMOS device. The P-field 335 may be spaced apart from the first N-well 315, the second N-well 320, and the NBL 305. Respective first, second, and third field oxide (FOX) regions 345, 346, and 347 overlie first and second N-wells 315 and 320 and the first and second P-wells 325 and 355, the first and second FOX regions 345 and 346 being separated, as are the first and third FOX regions 345 and 347. The first FOX region 345 overlies a left portion of the P-field 335, and the second FOX region 346 overlies aright portion of the P-field 335 in order to reduce drift region resistance and increase breakdown voltage. A P+/P− lightly doped drain region (PLDD) 340 is formed in a surface of the P-field 335 between the first and second FOX regions 345 and 346. A source region 362 comprising an N+/N− region 360 abutted with a P+/P− region 361 is formed in the second N-well 320. A high-voltage gate terminal 365 overlies a portion of the first FOX region 345 as well as a portion of the second N-well 320. An interlayer dielectric 365 overlies all portions of the resulting structure except for the drain and source regions,
  • A typical embodiment of the structure just described exhibits a specific on-resistance (Ronsp) ranging from about 50 to 150, an example being, 95, mΩ-mm2 while maintaining a breakdown voltage (BVD) of about −25 to −45, an example being −35, volts. As such, the present invention may be noted to provide an efficient trade-off between BVD and Ronsp.
  • The characteristics of the embodiment of FIG. 3 may be contrasted with the prior-art LDPMOS device of FIG. 1, That illustrated prior-art device, while including features similar and/or analogous to those in the LDPMOS structure described above with reference to FIG. 3, does not contain a P-field. As mentioned above, although the prior-art device of FIG. 1 is known to exhibit relatively good breakdown voltage (BVD) performance, it presents an unacceptably large value of specific on-resistance, Ronsp. For example, a typical such device having a BVD about −35 V presents an Ronsp of about 160 mΩ-mm2.
  • As an attempt to improve Ronsp properties of the prior-art device of FIG. 1, the structure of FIG. 2 is formed similar to that of FIG. 1 with mostly corresponding elements except that a P-field 230 is formed in a first P-well 225. The first P-well 225 may correspond to the first P-well 125 in FIG. 1 with the P-field 230 extending from a first N-well 215 to a second N-well 220. To the extent that addition of the P-field 230 to the structure of FIG. 1 improves the Ronsp of the device, the improvement is obtained at an expense of a smaller BVD. That is, while the Ronsp may be improved from about 160 to about 80 mΩ-mm2 vis-à-vis that of the prior-art device of FIG. 1, the BVD undesirably decreases from about −35 V to about −27 V.
  • Returning to FIG. 3, it may be noted that the P-field 335, which surrounds the drain region 340 and is spaced apart from the NBL 305, the first N-well 315, and the second N-well 320, distinguishes, owing at least to such structure, the present invention from either of the prior-art examples described above with reference to FIGS. 1 and 2.
  • It will be understood by one skilled in the art that respective references to N- and P-type materials, implantations, depositions, and so on may be replaced, respectively, by P- and N-type references. That is, N- and P-type references may be interchanged throughout this disclosure, which then may describe an LDNMOS, rather than LDPMOS structure. The description of an LDPMOS structure, for at least this reason, as an example is not intended to limit the scope of the present invention.
  • FIG. 4 is a flow diagram that summarizes an implementation of a method comprising manufacturing steps that may be performed in order to fabricate an LDPMOS structure such as that illustrated in FIG. 3, and FIGS. 5A-5I. Of these, FIGS. 5A-5I illustrate, in addition to an LDPMOS structure fabricated according to the present invention, a conventional NMOS transistor, an NPN bipolar junction transistor (BJT), and two prior-art LDPMOS transistors, the latter having been described above with reference to FIGS. 1 and 2. All of the aforementioned structures may be fabricated by a known biCMOS-DMOS (BCD) process. FIGS. 5A-5I, therefore, illustrate that the present invention may readily be practiced within the scope of known BCD methods.
  • With combined reference to FIGS. 3, 4 and 5A-5I, the illustrated method includes providing the P-type substrate 100 at step 400 followed by formation of NBL 305 (FIGS. 3 and 5A) therein at step 405 using, for example, a photolithographic method. For instance, a patterned photoresist layer may be formed using a mask on the substrate 100, the photoresist layer exposing regions to be implanted. Atoms of an N-type dopant (e.g., antimony, arsenic or phosphorous) may then be implanted into the exposed portions of the substrate 100 at a concentration of about 1013 to 1015, an example being 5×1014, atoms/cm2. Afterward, the photoresist may be removed, and a drive-in procedure may be performed to drive the N-type atoms to a desired depth of about 2 to 4, an example being 3, microns. The drive-in procedure may comprise applying a high temperature (e.g., from about 1100 to about 1300, an example being 1200, degrees C.) for an extended time (e.g., about 2 to about 10, an example being 6, hours). The P-type epitaxial layer 110 (FIGS. 3 and 5B) may then be deposited on the structure of FIG. 5A at step 410. According to a typical embodiment, the epitaxial layer 110 has a thickness ranging from about 3.5 to about 5.5, an example being 4.5, microns,
  • First and second N-wells 315 and 320 (FIGS, 3 and 5C) may be formed in the epitaxial layer 110 at step 415, using, for example, a photolithographic method similar to that already described and/or that is well understood, to implant the N-wells 315 and 320 with atoms of N-type material at a concentration of about 1012 to 1013, an example being 9×1012, atoms/cm2. According to one embodiment, the first N-well 315 has a width of about 1.5 to about 3.5, an example being 2.5, microns and extends partially over (e.g., contacting) a first part (e.g., edge) of the NBL 305. The second N-well 320 may have a width of about 4 to about 6, an example being 5, microns extending partially over (e.g., contacting) another part (e.g., opposing part or end) of the NBL 305, At step 420, first and second P-wells 325 and 355 may be formed in the epitaxial layer 110, the first P-well 325 being formed. between the first and second N-wells 315 and 320, the second P-well 355 being formed adjacent the second N-well 320 opposite the first P-well 325. Forming of the first and second P-wells 325 and 355 may include patterning/implanting regions corresponding to their footprints (e.g., the space between N-wells 315 and 320 and that adjacent the second N-well 320) with atoms of P-type material (e.g., boron) at a concentration of about 1012 to 1013, an example being 8×1012, atoms/cm2. A suitable drive-in procedure may be performed at step 425 to drive-in the N- and P-wells 315, 320, 325, and 355 to a depth about the same as that of an upper extent of the NBL 305, which can be about 2 to 4, an example being 3, microns.
  • At step 430, the P-field 335 (FIGS. 3 and 5D) may be formed in the P-well 325 by patterning a portion of a surface of the P-well 325 and implanting atoms of P-type material at a concentration of about 1012 to 1013, an example being 1×1013, atoms/cm2. In the illustrated embodiment, once formed, opposing sides (e.g., first and second extents) of the P-field 335 may be separated (i.e., by corresponding portions of the P-well 325) from, respectively, the second N-well 320 and the first N-well 315 by about 0.3 to 1.2, an example being 0.7, microns. A drive-in procedure then may drive the P-field 335 to a depth of about 0.2 to 0.6, an example being 0.4, microns corresponding to a separation of the P-field 335 from the NBL 305 by a distance of about 3.4 to 3.6, an example being 3.2, microns.
  • Field oxide (FOX) regions 345, 346, and 347 (FIGS. 3 and 5F) may then be formed on the structure of FIG. 5D at step 435. For example, an oxide layer may be grown over (e.g., on the surface of) the structure of FIG. 5D, followed by patterning and etching the oxide layer to expose active areas (e.g., source 362 and drain 340 regions, cf. FIGS. 3 and 5H). Alternatively, the field oxide regions may be formed by a process of local oxidation of silicon (LOCOS), which may facilitate isolation of adjacent transistors. For example, a patterned layer 330 of SiN may be deposited on the surface of the structure of FIG. 5D with the layer 330 exposing regions on which FOX is to be formed as illustrated in FIG. 5E, followed by the LOCOS process oxidizing the exposed regions and the SiN layer then being removed to expose the active areas,
  • A portion of the first FOX region 345 may include a thin region 351 (FIG. 3) overlying a portion of the second N-well 320. The oxidation step may include sacrificial oxide oxidation (SAC OX), thick gate oxide oxidation (THICK GOX) 332 and low-voltage gate oxide oxidation (LV GOX) 331 in FIG. 5F. Low-voltage areas may be patterned, implanted and etched using known methods.
  • A gate electrode 350 (FIGS. 3 and 5G) may be formed at step 440 to overlie a portion of the FOX 345 including the thin region 351 above a portion of the source 362, a portion of the second N-well 320, and a portion of the first P-well 325. The gate electrode 350, which may comprise, for example, polysilicon material, may be formed by depositing polysilicon over the structure of FIG. 5F and then patterning and etching to form the gate electrode 350.
  • At step 445, the N+/N− region 360 (i.e., an N-type lightly-doped drain [NLDD] module) may be formed by implanting N-type atoms into a surface of a first portion of a space between the first and third FOX regions 345 and 347 (e.g., and contacting third FOX region 347). A first portion of the N+/N− region 360 may be lightly doped (N−), with a second portion being doped to a higher concentration of N-type atoms (N+). For example, the (N−) portion may be doped to a concentration of about 1013 to 1014, an example being 3×1013, atoms/cm2, while the (N+) portion may be doped to a concentration of about 1015 to 1016, an example being 3×1015, atoms/cm2. At step 450, the PLDD 340 may be formed by implanting atoms of P-type material between (e.g., and contacting) the first and second FOX regions 345 and 346 as shown in FIGS. 3 and 5H. At the same time, atoms of P-type material maybe implanted in the P+/P− region 361 of the source 362 formed in a second portion of the space between the first and third FOX regions 345 and 347 (e.g., and contacting first FOX region 345). Portions of the drain 340 and P+/P− region 361 may be lightly doped (P−) while other portions of the drain 340 and P+/P− region 361 may be implanted with atoms of P-type material at a higher concentration (P+). As one example, the (P−) regions may be doped to a concentration of about 1012 to 1013, an example being 7×1012, atoms/cm2, and the (P+) regions may be doped to a concentration of about 1015 to 1016, an example being 3×1015, atoms/cm2. At step 455, application-dependent connections to the structure formed in the previous steps may be formed using methods known in the art. For example, a plurality of vias 370 and 380 (FIG. 5I) may provide connections between elements such as a drain D (i.e., 340 in FIG. 5H) and first and second metal layers 375 and 385. A passivation layer 390 may overlie the resulting structure.
  • Although the disclosure herein refers to certain illustrated embodiments, it is to be understood that these embodiments have been presented by way of example rather than limitation. The intent accompanying this disclosure is to have such embodiments construed in conjunction with the knowledge of one skilled in the art to cover all modifications, variations, combinations, permutations, omissions, substitutions, alternatives, and equivalents of the embodiments, to the extent not mutually exclusive, as may fall within the spirit and scope of the invention as limited only by the appended claims.

Claims (11)

1. A method, comprising:
forming a buried layer in a first-conductivity type substrate;
depositing an epitaxial layer of the first conductivity type over the substrate and the buried layer;
forming first and second wells of a second conductivity type in the epitaxial layer;
forming a third well of the first conductivity type between the first and second wells;
forming a field region of the first conductivity type in the third well, the field region being spaced apart from the first and second wells and the buried layer; and
forming a. drain region of the first conductivity type in the field region.
2. The method as set forth in claim 1, wherein:
the first conductivity type is P-type;
the second conductivity type is N-type; and
the forming of a field region is preceded by driving in the first, second, and third wells.
3. The method as set forth in claim 1, wherein:
the first conductivity type is N-type;
the second conductivity type is P-type; and
the forming of a field region is preceded by driving in the first, second, and third wells.
4. The method as set forth in claim 1, wherein:
the buried layer is formed of material having the second conductivity type;
the forming of the first and second wells comprises implanting atoms of the second conductivity type into a surface of the epitaxial layer; and
the forming of the third well comprises implanting atoms of the first conductivity type into the surface of the epitaxial layer.
5. The method as set forth in claim 4, wherein the forming of the first, second, and third wells further comprises driving the wells to a depth about the same as that of an upper extent of the buried layer.
6. The method as set forth in claim 1, further comprising:
forming a first insulation layer overlying a portion of the second well, a portion of the third well, and a portion of the field region; and
forming a second insulation layer overlying a portion of the first well, a portion of the third well, and a portion of the field region, the first insulation layer being separated from the second insulation layer.
7. The method as set forth in claim 6, wherein the forming of the first and second insulation layers comprises:
depositing an oxide layer; and
patterning and etching the oxide layer.
8. The method as set forth in claim 6, wherein the forming of the first and second insulation layers comprises local oxidation of silicon.
9. The method as set forth in claim 1, further comprising:
forming a lightly doped drain region of the first conductivity type in the field region in a space between the first and second insulation regions; and
forming a source region in a surface of the second well.
10. The method as set forth in claim 6, wherein the forming of the source region comprises:
forming a first region having the second conductivity type; and
forming a second region having the first conductivity type.
11. A semiconductor structure fabricated according to the method set forth in claim 1.
US13/648,964 2010-06-10 2012-10-10 Ldpmos structure for enhancing breakdown voltage and specific on resistance in bicmos-dmos process Abandoned US20130037883A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170213893A1 (en) * 2016-01-21 2017-07-27 Texas Instruments Incorporated Drift region implant self-aligned to field relief oxide with sidewall dielectric
US10388649B2 (en) 2017-10-04 2019-08-20 Vanguard International Semiconductor Corporation Semiconductor devices and methods for manufacturing the same
TWI670799B (en) * 2017-09-06 2019-09-01 世界先進積體電路股份有限公司 Semiconductor devices and methods for manufacturing the same

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8629026B2 (en) * 2010-11-12 2014-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Source tip optimization for high voltage transistor devices
US8754476B2 (en) * 2011-07-19 2014-06-17 Richtek Technology Corporation, R.O.C. High voltage device and manufacturing method thereof
DE102011108651B4 (en) * 2011-07-26 2019-10-17 Austriamicrosystems Ag High-voltage transistor device and manufacturing method
CN102496575A (en) * 2011-12-23 2012-06-13 上海先进半导体制造股份有限公司 60V unsymmetrical high-pressure PMOS (P-channel Metal Oxide Semiconductor) structure and manufacturing method of same
US8872222B2 (en) * 2012-02-24 2014-10-28 Macronix International Co., Ltd. Semiconductor structure and method for forming the same
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US8643104B1 (en) * 2012-08-14 2014-02-04 United Microelectronics Corp. Lateral diffusion metal oxide semiconductor transistor structure
US9117845B2 (en) * 2013-01-25 2015-08-25 Fairchild Semiconductor Corporation Production of laterally diffused oxide semiconductor (LDMOS) device and a bipolar junction transistor (BJT) device using a semiconductor process
US8987107B2 (en) 2013-02-19 2015-03-24 Fairchild Semiconductor Corporation Production of high-performance passive devices using existing operations of a semiconductor process
CN104701372B (en) * 2013-12-06 2017-10-27 无锡华润上华科技有限公司 Transverse diffusion metal oxide semiconductor device and its manufacture method
US20150214361A1 (en) * 2014-01-30 2015-07-30 Macronix International Co., Ltd. Semiconductor Device Having Partial Insulation Structure And Method Of Fabricating Same
JP6326858B2 (en) * 2014-02-24 2018-05-23 セイコーエプソン株式会社 Semiconductor device and manufacturing method thereof
CN104934321A (en) * 2014-03-17 2015-09-23 旺宏电子股份有限公司 Semiconductor element with local insulation structure, and manufacturing method for semiconductor element
DE102014009980B4 (en) * 2014-07-03 2019-03-21 Elmos Semiconductor Aktiengesellschaft High output voltage with low on-resistance MOS transistor (Ron)
US9263574B1 (en) * 2014-11-07 2016-02-16 Vanguard International Semiconductor Corporation Semiconductor device and method for fabricating the same
US9461046B1 (en) * 2015-12-18 2016-10-04 Texas Instruments Incorporated LDMOS device with graded body doping
KR101788459B1 (en) * 2016-07-11 2017-10-20 매그나칩 반도체 유한회사 DISPLAY DRIVER IC Structure

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485027A (en) * 1988-11-08 1996-01-16 Siliconix Incorporated Isolated DMOS IC technology
US20020030238A1 (en) * 2000-09-11 2002-03-14 Kabushiki Kaisha Toshiba Semiconductor device
US20020053695A1 (en) * 2000-11-07 2002-05-09 Chorng-Wei Liaw Split buried layer for high voltage LDMOS transistor
US20020127766A1 (en) * 2000-12-27 2002-09-12 Memc Electronic Materials, Inc. Semiconductor wafer manufacturing process
US20030141541A1 (en) * 2002-01-30 2003-07-31 Ching-Yuan Wu Dual-bit flash memory cells for forming high-density memory arrays
US20060068552A1 (en) * 2004-09-29 2006-03-30 Takashi Ogura Method of manufacturing semiconductor device
US20100127326A1 (en) * 2008-11-25 2010-05-27 Newport Fab, Llc Dba Jazz Semiconductor MOS transistor with a reduced on-resistance and area product

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100272176B1 (en) * 1998-09-30 2000-12-01 김덕중 Method fabricating bicdmos device
US8076725B2 (en) * 2007-05-18 2011-12-13 Renesas Electronics Corporation Semiconductor device and method for manufacturing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485027A (en) * 1988-11-08 1996-01-16 Siliconix Incorporated Isolated DMOS IC technology
US20020030238A1 (en) * 2000-09-11 2002-03-14 Kabushiki Kaisha Toshiba Semiconductor device
US20020053695A1 (en) * 2000-11-07 2002-05-09 Chorng-Wei Liaw Split buried layer for high voltage LDMOS transistor
US20020127766A1 (en) * 2000-12-27 2002-09-12 Memc Electronic Materials, Inc. Semiconductor wafer manufacturing process
US20030141541A1 (en) * 2002-01-30 2003-07-31 Ching-Yuan Wu Dual-bit flash memory cells for forming high-density memory arrays
US20060068552A1 (en) * 2004-09-29 2006-03-30 Takashi Ogura Method of manufacturing semiconductor device
US20100127326A1 (en) * 2008-11-25 2010-05-27 Newport Fab, Llc Dba Jazz Semiconductor MOS transistor with a reduced on-resistance and area product

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Wolf et al Silicon Processing for the VLSI Era volumn 1-Process Technology, 2nd edition, USA: Lattice Press: 2000. *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170213893A1 (en) * 2016-01-21 2017-07-27 Texas Instruments Incorporated Drift region implant self-aligned to field relief oxide with sidewall dielectric
US10497787B2 (en) * 2016-01-21 2019-12-03 Texas Instruments Incorporated Drift region implant self-aligned to field relief oxide with sidewall dielectric
TWI670799B (en) * 2017-09-06 2019-09-01 世界先進積體電路股份有限公司 Semiconductor devices and methods for manufacturing the same
US10388649B2 (en) 2017-10-04 2019-08-20 Vanguard International Semiconductor Corporation Semiconductor devices and methods for manufacturing the same

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