US20120132409A1 - Heat-dissipating device - Google Patents

Heat-dissipating device Download PDF

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Publication number
US20120132409A1
US20120132409A1 US12/972,528 US97252810A US2012132409A1 US 20120132409 A1 US20120132409 A1 US 20120132409A1 US 97252810 A US97252810 A US 97252810A US 2012132409 A1 US2012132409 A1 US 2012132409A1
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US
United States
Prior art keywords
heat
dissipating device
base
fin
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/972,528
Inventor
Meng-Che Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
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Filing date
Publication date
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Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YU, MENG-CHE
Publication of US20120132409A1 publication Critical patent/US20120132409A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to thermal transmitting structures, and more particularly to a heat-dissipating device for enhancing heat dissipating efficiency.
  • a typical heat-dissipating device includes a base and a predetermined number of parallel fins projecting from an upper section of the base.
  • the base includes a bottom surface.
  • the cross-section of each fin is linear.
  • the bottom surface of the base is positioned against and is firmly held in contact with a heat transfer surface of an electronic device, in order to ensure better thermal transfer between the bottom surface and the heat transfer surface.
  • the heat-dissipating device transfers the heat energy from the electronic device to an ambient environment with fins.
  • each fin is linear
  • the heat dissipating area of each fin is very small. Accordingly, the heat dissipating efficiency of the heat-dissipating device is affected.
  • many modern electronic devices are very compact and generate much heat, and in some cases the above-described heat-dissipating device may not be able to transfer heat energy from the electronic device to the ambient environment quickly enough. This is apt to produce hotspots in the heat-dissipating device, and usually results in non-uniform dissipation of heat energy from the heat-dissipating device. That is, the thermal operating efficiency of the heat-dissipating device may be unsatisfactory.
  • FIG. 1 is a schematic, cross-sectional view of a heat-dissipating device according to a first embodiment.
  • FIG. 2 is a schematic, cross-sectional view of a heat-dissipating device according to a second embodiment.
  • FIG. 3 is a schematic, cross-sectional view of a heat-dissipating device according to a third embodiment.
  • the heat-dissipating device 100 includes a base 10 and a plurality of parallel fins 20 extending from the base 10 .
  • the base 10 includes a first surface 101 and a second surface 103 facing away from the first surface 101 .
  • the first surface 101 is configured for supporting the fins 20 .
  • the second surface 103 is firmly held in contact with an electronic device (not shown).
  • the base 10 is preferably made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.
  • the fins 20 are preferably made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.
  • the fins 20 are integrally molded with the base 10 .
  • the fins 20 can be attached on the first surface 101 of the base 10 by welding.
  • Each of fins 20 includes a main body 201 and an extending portion 203 extending from the main body 201 .
  • each fin 20 has an L-shaped cross-section.
  • Each main body 201 is between the first surface 101 and the extending portion 203 , and is perpendicular to the first surface 101 .
  • the main body 201 is a quadrate plate.
  • the extending portion 203 perpendicularly extends from an end portion 2011 of the main body 201 .
  • the end portion 2011 is distal from the first surface 101 .
  • the extending portion 203 is a quadrate plate.
  • the second surface 103 is attached to the electronic device, and transfers heat energy from the electronic device to the fins 20 .
  • the transferred heat energy is released to an ambient environment with the fins 20 .
  • each fin 20 has an extending portion 203 .
  • the heat-dissipating area of each fin 20 is increased, while the volume of the heat-dissipating device 100 is unchanged.
  • the present heat-dissipating device 100 with the extending portions 203 can quickly dissipate heat energy produced by the electronic device to the ambient environment.
  • development of hotspots in the heat-dissipating device 100 can be avoided. This helps ensure that the heat-dissipating device 100 dissipates heat uniformly. Therefore, the thermal operating efficiency of the heat-dissipating device 100 is most apt to be satisfactory while the volume of the heat-dissipating device 100 is unchanged.
  • the heat-dissipating device 200 includes a base 30 and a plurality of parallel fins 40 extending from the base 30 .
  • the base 30 is similar to the base 10 , except that the base 30 includes a metal layer 305 arranged over the second surface 303 of the base 30 .
  • the roughness of metal layer 305 is lower than 8 nanometers for reducing the roughness of the second surface 303 , thereby increasing the contact area between the base 30 and the electronic device. Accordingly, the heat absorbing efficiency of the base 30 can be improved.
  • Each fin 30 is similar to each fin 20 , except that a plurality of through holes 4031 are defined in each extending portion 403 for increasing the contact area between each fin 40 and air. Accordingly, the heat dissipating efficiency of each fin 40 can be improved.
  • the heat-dissipating device 300 includes a base 50 and a plurality of parallel pins 60 .
  • the base 50 is similar to the base 10 , except that the base 50 has a sealed cavity 501 defined therein and a working fluid 503 contained in the sealed cavity 501 .
  • the working fluid 503 is configured for absorbing and transferring heat energy from the electronic device.
  • the heated working fluid 503 is vaporized, and becomes vapor.
  • the vapor reaching to the fins 50 is cooled.
  • the cooled vapor becomes fluid, and transfers the heat energy to fins 50 .
  • the fins 50 transfer the heat energy to the ambient environment.
  • the fins 60 are similar to the fins 20 , except that each fin 60 has a T-shaped cross-section.

Abstract

An exemplary heat-dissipating device includes a base having a first surface, and a number of fins extending from the first surface. Each fin includes a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to thermal transmitting structures, and more particularly to a heat-dissipating device for enhancing heat dissipating efficiency.
  • 2. Description of Related Art
  • Electronic components, such as semiconductor chips, are becoming progressively smaller with each new product release, while at the same time the heat dissipation requirements of these kinds of components are increasing due to their improved ability to provide more functionality. In many contemporary applications, a heat-dissipating device is one of the most efficient systems in use for transmitting heat energy away from such components.
  • A typical heat-dissipating device includes a base and a predetermined number of parallel fins projecting from an upper section of the base. The base includes a bottom surface. The cross-section of each fin is linear. In typical use, the bottom surface of the base is positioned against and is firmly held in contact with a heat transfer surface of an electronic device, in order to ensure better thermal transfer between the bottom surface and the heat transfer surface. The heat-dissipating device transfers the heat energy from the electronic device to an ambient environment with fins.
  • However, because the cross-section of each fin is linear, the heat dissipating area of each fin is very small. Accordingly, the heat dissipating efficiency of the heat-dissipating device is affected. In addition, many modern electronic devices are very compact and generate much heat, and in some cases the above-described heat-dissipating device may not be able to transfer heat energy from the electronic device to the ambient environment quickly enough. This is apt to produce hotspots in the heat-dissipating device, and usually results in non-uniform dissipation of heat energy from the heat-dissipating device. That is, the thermal operating efficiency of the heat-dissipating device may be unsatisfactory.
  • Therefore, it is desirable to provide a new heat-dissipating device, which can overcome the above mentioned limitations.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic, cross-sectional view of a heat-dissipating device according to a first embodiment.
  • FIG. 2 is a schematic, cross-sectional view of a heat-dissipating device according to a second embodiment.
  • FIG. 3 is a schematic, cross-sectional view of a heat-dissipating device according to a third embodiment.
    •  DETAILED DESCRIPTION
  • Embodiments will now be described in detail below with reference to drawings.
  • Referring to FIG. 1, a heat-dissipating device 100, in accordance with a first embodiment, is shown. The heat-dissipating device 100 includes a base 10 and a plurality of parallel fins 20 extending from the base 10.
  • The base 10 includes a first surface 101 and a second surface 103 facing away from the first surface 101. The first surface 101 is configured for supporting the fins 20. The second surface 103 is firmly held in contact with an electronic device (not shown). The base 10 is preferably made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.
  • The fins 20 are preferably made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof. In the present embodiment, the fins 20 are integrally molded with the base 10. In other embodiments, the fins 20 can be attached on the first surface 101 of the base 10 by welding.
  • Each of fins 20 includes a main body 201 and an extending portion 203 extending from the main body 201. In the present embodiment, each fin 20 has an L-shaped cross-section.
  • Each main body 201 is between the first surface 101 and the extending portion 203, and is perpendicular to the first surface 101. In the present embodiment, the main body 201 is a quadrate plate.
  • The extending portion 203 perpendicularly extends from an end portion 2011 of the main body 201. The end portion 2011 is distal from the first surface 101. In the present embodiment, the extending portion 203 is a quadrate plate.
  • In use, the second surface 103 is attached to the electronic device, and transfers heat energy from the electronic device to the fins 20. The transferred heat energy is released to an ambient environment with the fins 20.
  • Compared with a conventional heat-dissipating device, each fin 20 has an extending portion 203. Thus, the heat-dissipating area of each fin 20 is increased, while the volume of the heat-dissipating device 100 is unchanged. Accordingly, the present heat-dissipating device 100 with the extending portions 203 can quickly dissipate heat energy produced by the electronic device to the ambient environment. Thus, development of hotspots in the heat-dissipating device 100 can be avoided. This helps ensure that the heat-dissipating device 100 dissipates heat uniformly. Therefore, the thermal operating efficiency of the heat-dissipating device 100 is most apt to be satisfactory while the volume of the heat-dissipating device 100 is unchanged.
  • Referring to FIG. 2, a heat-dissipating device 200, in accordance with a second embodiment, is shown. The heat-dissipating device 200 includes a base 30 and a plurality of parallel fins 40 extending from the base 30.
  • The base 30 is similar to the base 10, except that the base 30 includes a metal layer 305 arranged over the second surface 303 of the base 30. The roughness of metal layer 305 is lower than 8 nanometers for reducing the roughness of the second surface 303, thereby increasing the contact area between the base 30 and the electronic device. Accordingly, the heat absorbing efficiency of the base 30 can be improved.
  • Each fin 30 is similar to each fin 20, except that a plurality of through holes 4031 are defined in each extending portion 403 for increasing the contact area between each fin 40 and air. Accordingly, the heat dissipating efficiency of each fin 40 can be improved.
  • Referring to FIG. 3, a heat-dissipating device 300, in accordance with a third embodiment, is shown. The heat-dissipating device 300 includes a base 50 and a plurality of parallel pins 60.
  • The base 50 is similar to the base 10, except that the base 50 has a sealed cavity 501 defined therein and a working fluid 503 contained in the sealed cavity 501. The working fluid 503 is configured for absorbing and transferring heat energy from the electronic device. The heated working fluid 503 is vaporized, and becomes vapor. The vapor reaching to the fins 50 is cooled. The cooled vapor becomes fluid, and transfers the heat energy to fins 50. The fins 50 transfer the heat energy to the ambient environment.
  • The fins 60 are similar to the fins 20, except that each fin 60 has a T-shaped cross-section.
  • While certain embodiments have been described and exemplified above, various other embodiments will be apparent to those skilled in the art from the foregoing disclosure. The disclosure is not limited to the particular embodiments described and exemplified but is capable of considerable variation and modification without departure from the scope and spirit of the appended claims.

Claims (18)

1. A heat-dissipating device comprising:
a base, the base having a first surface, and
a plurality of fins extending from the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.
2. The heat-dissipating device of claim 1, wherein each extending portion has a plurality of through holes defined therein.
3. The heat-dissipating device of claim 1, wherein each fin has an L-shaped or T-shaped cross-section.
4. The heat-dissipating device of claim 1, wherein the base comprises a second surface facing away from the first surface and a metal layer arranged over the second surface.
5. The heat-dissipating device of claim 4, wherein the roughness of the metal layer is smaller than 8 nanometers.
6. The heat-dissipating device of claim 1, wherein the base comprises a sealed cavity defined therein and a working fluid contained in the sealed cavity.
7. The heat-dissipating device of claim 1, wherein the fins are made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.
8. A heat-dissipating device comprising:
a base, the base having a first surface, a second surface facing away from the first surface, and a metal layer arranged on the second surface, and
a plurality of fins arranged on the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.
9. The heat-dissipating device of claim 8, wherein the roughness of the metal layer is smaller than 8 nanometers.
10. The heat-dissipating device of claim 9, wherein each extending portion has a plurality of through holes defined therein.
11. The heat-dissipating device of claim 9, wherein each fin has an L-shaped or T-shaped cross-section.
12. The heat-dissipating device of claim 9, wherein the base comprises a sealed cavity defined therein and a working fluid contained in the sealed cavity.
13. A heat-dissipating device comprising:
a base, the base having a first surface, a sealed cavity defined therein, and a working fluid contained in the sealed cavity, and
a plurality of fins arranged on the first surface, each fin comprising a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.
14. The heat-dissipating device of claim 13, wherein each extending portion has a plurality of through holes defined therein.
15. The heat-dissipating device of claim 13, wherein each fin has an L-shaped or T-shaped cross-section.
16. The heat-dissipating device of claim 13, wherein the base comprises a second surface facing away from the first surface and a metal layer arranged on the second surface.
17. The heat-dissipating device of claim 16, wherein the roughness of the metal layer is smaller than 8 nanometers.
18. The heat-dissipating device of claim 13, wherein the fins are made of a material selected from the group consisting of copper, aluminum, stainless steel, and any suitable alloy thereof.
US12/972,528 2010-11-25 2010-12-20 Heat-dissipating device Abandoned US20120132409A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW99140704 2010-11-25
TW099140704A TW201221892A (en) 2010-11-25 2010-11-25 Heat-dissipating device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI751759B (en) 2020-10-28 2022-01-01 國立清華大學 Heat dissipation device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6742573B2 (en) * 1999-08-18 2004-06-01 The Furukawa Electric Co., Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
US20050274490A1 (en) * 2001-06-05 2005-12-15 Larson Ralph I Heatsink assembly and method of manufacturing the same
US20070025085A1 (en) * 2005-07-29 2007-02-01 Hon Hai Precision Industry Co., Ltd. Heat sink
US20080264611A1 (en) * 2007-04-30 2008-10-30 Kun-Jung Chang Heat plate
US20090229648A1 (en) * 2006-01-31 2009-09-17 Tempronics, Inc. Closely Spaced Electrodes With A Uniform Gap
US7891410B1 (en) * 2008-06-26 2011-02-22 Lockheed Martin Corporation Devices for heat exchange

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6742573B2 (en) * 1999-08-18 2004-06-01 The Furukawa Electric Co., Ltd. Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
US20050274490A1 (en) * 2001-06-05 2005-12-15 Larson Ralph I Heatsink assembly and method of manufacturing the same
US20070025085A1 (en) * 2005-07-29 2007-02-01 Hon Hai Precision Industry Co., Ltd. Heat sink
US20090229648A1 (en) * 2006-01-31 2009-09-17 Tempronics, Inc. Closely Spaced Electrodes With A Uniform Gap
US20080264611A1 (en) * 2007-04-30 2008-10-30 Kun-Jung Chang Heat plate
US7891410B1 (en) * 2008-06-26 2011-02-22 Lockheed Martin Corporation Devices for heat exchange

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TW201221892A (en) 2012-06-01

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Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YU, MENG-CHE;REEL/FRAME:025521/0425

Effective date: 20101208

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION