US20110073827A1 - Nanodevice arrays for electrical energy storage, capture and management and method for their formation - Google Patents

Nanodevice arrays for electrical energy storage, capture and management and method for their formation Download PDF

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US20110073827A1
US20110073827A1 US12/869,215 US86921510A US2011073827A1 US 20110073827 A1 US20110073827 A1 US 20110073827A1 US 86921510 A US86921510 A US 86921510A US 2011073827 A1 US2011073827 A1 US 2011073827A1
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column
distal end
nanotube device
disposed
vertical nanotube
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Gary W. Rubloff
Sang Bok Lee
Israel Perez
Laurent LECORDIER
Parag Banerjee
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University of Maryland at Baltimore
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/84Processes for the manufacture of hybrid or EDL capacitors, or components thereof
    • H01G11/86Processes for the manufacture of hybrid or EDL capacitors, or components thereof specially adapted for electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22Electrodes
    • H01G11/26Electrodes characterised by their structure, e.g. multi-layered, porosity or surface features
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/22Electrodes
    • H01G11/30Electrodes characterised by their material
    • H01G11/32Carbon-based
    • H01G11/36Nanostructures, e.g. nanofibres, nanotubes or fullerenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • H01L28/60Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669Nanowires or nanotubes
    • H01L29/0676Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/03529Shape of the potential jump barrier or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/872Schottky diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221Carbon nanotubes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13Energy storage using capacitors

Definitions

  • Embodiments of the invention relate to an apparatus, system, and method for nanostructure-based devices for electrical energy management. More particularly, embodiments of the invention relate to an apparatus, system, and method for providing nanostructure arrays as two-terminal devices, for example, nanotube or nanowire devices (hereinafter referred to as “nanodevices”), configured to store electrical energy, to capture and generate energy, and to integrate with power management circuitry.
  • nanodevices configured to store electrical energy, to capture and generate energy, and to integrate with power management circuitry.
  • Electrostatic capacitors that store charge at the surface of electrodes typically do not achieve high areal densities of the electrodes.
  • Electrochemical supercapacitors and batteries that store charge inside their active surfaces and at the surface also can experience similar limitations experienced by conventional solar cell devices, as will be discussed below. While sub-surface charge storage can enhance energy density, the resulting slow ion/charge transport into these materials can limit available power.
  • planar device layers typically create only a single depletion layer over the surface to separate photo-induced carriers.
  • each substrate of a semiconductor pn junction solar cell can be limited to only a single active layer.
  • some of the semiconductor material can absorb light, producing excitations outside a depletion range. This can prevent the separation of positive and negative charges and the collection of harvested light energy.
  • nanocomposite structures that mix nanoparticles, such as C-60 or carbon nanotubes, with organic materials having random spatial distributions on a nanoscale.
  • These nanocomposite structures can provide a high density of interfaces between the component materials, effectively enhancing the active regions, analogous to depletion regions in pn junction semiconductor structures, where charge separation can occur.
  • the nanoscale randomness of the component materials can impede efficient collection of charges at micro- or macro-scale external contacts where charge should be produced, for example, through high electrical resistance through which the charge reaches the contacts. Additionally, these materials, such as conducting polymers, can have relatively high resistivity, further diminishing the efficiency of charge collection at the external contacts.
  • nanostructures have been explored to improve the power and energy density of conventional capacitor and battery devices and conventional solar cell devices, primarily exploiting higher surface area densities per unit volume of material used in these devices.
  • a high density of nanowires on a surface can substantially enhance the surface area available, producing higher charge density per unit planar area.
  • nanowire and nanotube structures can present shortened pathways for ion transport into the surface, thereby increasing power density.
  • Nanotechnology provides new options for meeting these requirements, particularly using self-assembly phenomena and self-alignment to build more complex nanodevices from simpler nanostructures.
  • anodic aluminum oxide AAO
  • Nanopores in AAO may have uniform size and spacing in a hexagonal pattern.
  • a vertical nanotube device which includes a substrate, and an anodic oxide material disposed on the substrate.
  • the vertical nanotube device can further include a column disposed in the anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material.
  • the vertical nanotube device can include a first material disposed within the column, a second material disposed within the column, and a third material disposed between the first material and the second material.
  • the first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column.
  • the second material fills the first distal end of the column and extends to the second distal end of the column within the first material. Both the first material and the second material are exposed at the first distal end of the column.
  • a vertical two-terminal nanotube device which includes a column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material.
  • the vertical two-terminal nanotube device further includes a first material disposed within the column, a second material disposed within the column, and a third material disposed between the first material and the second material.
  • the first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column.
  • the second material fills the first distal end of the column and extends to the second distal end of the column within the first material.
  • the first material is exposed at the first distal end of the column, and the second material is exposed at the second distal end of the column.
  • a vertical two-terminal nanotube device which includes a plurality of columns, each column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material.
  • the vertical two-terminal nanotube device further includes a first material disposed within the column, a second material disposed within the column, and a third material disposed between the first material and the second material.
  • the first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column.
  • the second material fills the first distal end of the column and extends to the second distal end of the column within the first material.
  • the first material is exposed at the first distal end of the column, and the second material is exposed at the second distal end of the column.
  • the plurality of columns are connected in parallel by a first wiring structure operatively connected to an exposed end of the first material, and a second wiring structure operatively connected to an exposed end of the second material.
  • the first and the second wiring structures are configured on a top surface and a bottom surface of the column, respectively.
  • a vertical two-terminal nanotube device which includes a pressure-controlled vessel.
  • the vessel includes a plurality of columns. Each column is disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material.
  • the vessel further includes a material disposed within the column. The material includes a chemical sensing film.
  • the vessel further includes a first wiring structure operatively connected to a top surface of the plurality of columns, and a second wiring structure operatively connected to a bottom surface of the plurality of columns.
  • the first and the second wiring structures are configured on a top surface and a bottom surface of the column, respectively.
  • the pressure-controlled vessel is configured to allow a gas or liquid to flow through the plurality of columns.
  • the first and second wiring structures are configured to measure a resistance change based on an adsorption, absorption or reaction of species from the gas or liquid on the material.
  • a method which includes the step of forming a columnar pore in an exposed portion of a material layer, depositing a first material into a first distal end of the columnar pore, and depositing a second material into the first distal end of the columnar pore.
  • the step of depositing the first material includes filling the first distal end of the columnar pore with the first material so that the first material extends to the second distal end of the columnar pore along inner walls of the columnar pore.
  • the step of depositing the second material includes filling the first distal end of the columnar pore with the second material, so that the second material extends to the second distal end of the columnar pore within the first material.
  • FIGS. 1 a and 1 b show a scanning electron micrograph of AAO nanopore arrays, in accordance with an embodiment of the invention.
  • FIGS. 1 c to 1 e show a formation of ordered arrays of nanopores through anodic oxidation of aluminum, in accordance with an embodiment of the invention.
  • FIG. 2 shows a schematic of a two-terminal electrostatic capacitor nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 3 shows a schematic of a two-terminal electrochemical supercapacitor or battery nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 4 shows a schematic of a two-terminal solar cell nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 5 shows a schematic of a two-terminal nanodevice in which contacts are provided at opposite ends of a nanopore, in accordance with an embodiment of the invention.
  • FIG. 6 a shows a schematic of a metal-insulator-metal nanocapacitor fabricated by multiple atomic layer deposition steps in anodic oxide aluminum oxide nanopores to form an energy storage structure, in accordance with an embodiment of the invention.
  • FIG. 6 b shows a scanning electron micrograph of the metal-insulator-metal nanocapacitor shown in FIG. 6 a , in accordance with an embodiment of the invention.
  • FIG. 6 c shows another scanning electron micrograph of the metal-insulator-metal nanocapacitor shown in FIG. 6 a , in accordance with an embodiment of the invention.
  • FIG. 6 d shows a schematic of an aggregation of an array of metal-insulator-metal nanocapacitors, as shown in FIG. 6 a , to form an energy storage device, in accordance with an embodiment of the invention.
  • FIGS. 7 a and 7 b show a schematic of a two-terminal thermoelectric nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 7 c shows a schematic of an aggregation of an array of thermoelectric nanodevices, as shown in FIG. 7 a or 7 b , to form an energy storage device, in accordance with an embodiment of the invention.
  • FIG. 8 shows a schematic of a two-terminal nanodevice array disposed to sense chemicals or biochemicals in gaseous or liquid form, in accordance with an embodiment of the invention.
  • FIG. 9 a shows a schematic of a two-terminal electrochemical nanodevice formed within a nanopore that is compatible with a liquid or aqueous electrolyte, in accordance with an embodiment of the invention.
  • FIG. 9 b shows a schematic of an aggregation of an array of electrochemical nanodevices, as shown in FIG. 9 a , to form an energy storage device, in accordance with an embodiment of the invention.
  • FIG. 10 shows a method for creating a vertical two-terminal nanodevice, in accordance with an embodiment of the invention.
  • Embodiments of the invention provide two-terminal nanodevice arrays that utilize nanostructures having nanopores formed by anodic oxidation of aluminum, and thin films deposited by atomic layer deposition (ALD) and electrochemical deposition (ECD) to form devices in the nanopores. These nanostructures may be coupled to one another to form larger assemblies suitable for power and energy systems.
  • ALD atomic layer deposition
  • ECD electrochemical deposition
  • Certain embodiments of the invention provide two-terminal nanodevice arrays for capture, generation and storage of energy based on multi-component materials contained within nanoscale pores in aluminum oxide or another dielectric material.
  • a plurality of these nanodevice arrays may be wired in parallel to capture energy from light, either solar or ambient, and to generate energy from temperature gradients sensed by thermoelectric devices.
  • Embodiments of the invention provide electrostatic capacitors, electrochemical capacitors, and batteries for energy storage, whereby device layers for energy capture, generation or storage, can be combined one on top of another or laterally to provide enhanced functionality, including energy and power management systems and electrical power management circuitry with components for capture, generation, storage and distribution.
  • the two-terminal nanodevices are formed as nanotubes or nanowires within nanopores initially formed as arrays in a nanopore template.
  • Two electrical contacts can be formed at one end of a nanodevice, whereby one contact is brought to an end of the nanopore where the other contact is formed by a conducting nanotube outside one of the two terminals or by a conducting nanowire inside one of the two terminals.
  • the two electrical contacts can be formed at each end/side of the nanopore.
  • the two-terminal nanodevice may be used as formed in the nanopore as an embedded nanodevice.
  • portions of the two-terminal nanodevice may be exposed by removing a portion of or the entire surrounding nanopore template. Such exposure is important, for example, in electrochemical energy storage devices, where the two terminals must each be in contact with an electrolyte formed between them.
  • An array of two-terminal nanodevices in accordance with certain embodiments of the invention, can be employed as electrical energy storage devices, including, for example, electrochemical devices (e.g., electrochemical supercapacitors, pseudo-capacitors and double-layer capacitors), batteries (e.g., lithium ion batteries), and electrostatic capacitors.
  • electrochemical devices e.g., electrochemical supercapacitors, pseudo-capacitors and double-layer capacitors
  • batteries e.g., lithium ion batteries
  • electrostatic capacitors electrostatic capacitors.
  • These two-terminal nanodevices can also be used as electrical energy capture devices functioning as solar cells based on either semiconducting pn junctions or metal/semiconductor Schottky barriers.
  • thermoelectric nanodevices can be used as generators of thermoelectric energy from temperature gradients between the two terminals.
  • thermoelectric nanowires or nanotubes are provided between hot and cold terminals, and the intervening insulating material is chosen to minimize heat flow between the two terminals, so that a temperature gradient and thermoelectric voltage are maximized.
  • thermoelectric nanodevices can be employed as energy capture devices (i.e., for power generation) or as sensors (i.e., in conjunction with bolometers at one terminal to capture infrared images).
  • the two-terminal nanodevice can be used to perform optical, chemical or sensing functions.
  • the pn junction or Schottky barrier configurations as discussed above for solar cells, can be operated as light sources (e.g., light-emitting diodes or lasers) and/or as optical detectors.
  • the nanodevices may be material layers formed as nanotubes inside nanopores with the two terminals sensing resistance or other electrical changes as chemicals introduced into the nanopores chemically modify the sensing material or as other environmental changes (e.g., touch and pressure) modify the surfaces of the sensing material layers.
  • multilayer types of nanodevices may be combined into a power management system, including energy generation/capture, storage and distribution. These systems may include multiple layers of nanodevice arrays connected in three dimensional configurations.
  • FIGS. 1 a and 1 b show a scanning electron micrograph of AAO nanopore arrays, in accordance with an embodiment of the invention.
  • FIG. 1 a is a top view
  • FIG. 1 b is a side view of an AAO nanopore array, in accordance with an embodiment of the invention.
  • the tops of nanopores 1 each provide access to narrow columns of the nanopores 1 that can include therein high aspect ratio nanopore structures, or nanodevices.
  • the AAO nanopores are narrow (i.e., 5-300 nm in width) and deep (i.e., 50 nm-100 ⁇ m), such that their aspect ratio (depth/width) is of order 1-1000, and more preferably 50-500.
  • the dimensions of the AAO nanopores 1 are based on a choice of electrochemical conditions and sequences used during anodization. For example, for nanopores approximately 70 nm in diameter, their center-to-center spacing can be in the order 100 nm. Furthermore, the density of the AAO nanopores 1 , for example 10 10 pores/cm 2 , can ensure very large active surface areas per unit area. Typically, this area enhancement can be as high as approximately 1000 ⁇ planar area. Since wet processing can be used, costs associated with vacuum and gas handling technologies can be avoided, and manufacturing costs can be modest. Thus, AAO can provide a cheap and attractive platform for high density nanostructures and devices made from them.
  • a particular advantage of AAO nanostructures can be that massive arrays can be fabricated with a high degree of control over their shape and spatial relationship, including their depth, width, and vertical shape (all controlled by anodization conditions). The regularity which results is ultimately of major value for manufacturability, providing predictability for properties for the full array.
  • the nanopore arrays can have dimensions comparable to that produced by costly, sophisticated lithography and etching processes in the formation of dynamic random access memory capacitors. However, natural self-assembly from the anodization process itself produces the structures without need for such complex manufacturing steps.
  • Deposition techniques capable of introducing materials for electrical devices into very high aspect ratio nanopores are limited. Physical techniques, such as evaporation and sputter deposition, cannot sufficiently penetrate deeply into the pores, but chemical methods are suitable. Electrochemical deposition, carried out in electrolytic solutions, can successfully cope with the high aspect ratio because electric fields are established between a bottom region of the pore and a counter-electrode removed from the pore in the electrolyte.
  • FIGS. 1 c to 1 e show a formation of ordered arrays of nanopores through anodic oxidation of aluminum, in accordance with an embodiment of the invention.
  • an anodic oxidization of a substrate 2 for example aluminum
  • AAO 3 with a plurality of parallel nanopores formed therein, which increasingly order into regular arrangements with uniform dimensions.
  • the AAO 3 created above the aluminum substrate 2 is chemically removed to leave an aluminum surface having an ordered, patterned array 4 (i.e., a scalloped-shaped structure), as shown in FIG. 1 d .
  • a second anodic oxidation step is performed to create a new structure of AAO 3 , which produces a highly ordered, uniform nanopore array 5 above the aluminum substrate 1 .
  • AAO formation can be carried out using a variety of process parameters, including choice of acid, concentration, voltage, and time. While AAO is the preferred process and material for very high aspect ratio nanopore arrays, in accordance with embodiments of the invention, a person of ordinary skill in the relevant art will recognize that other materials (e.g., titanium or silicon) can be anodically oxidized to form nanopores. Alternatively, nanopore arrays can be produced by track etching, in which high energy ions bombard a film (e.g., polymer or mica) to form damage tracks in the material. The damaged material is then removed by selective etching to form nanopores through it.
  • track etching in which high energy ions bombard a film (e.g., polymer or mica) to form damage tracks in the material. The damaged material is then removed by selective etching to form nanopores through it.
  • the aluminum substrate 2 which is reacted and partially consumed to form the AAO nanopore array 5 can be used in various forms.
  • Aluminum sheets are commercially available which can be used directly. Such sheets may be anodically bonded to a substrate (e.g., glass), or otherwise attached to a thicker substrate, particularly to facilitate subsequent processing to form devices, as done in microelectronics.
  • a thin film of aluminum may also be deposited on a substrate (e.g., glass or silicon).
  • the quality of AAO nanopore uniformity and ordering may vary with the properties of the aluminum (e.g., purity, grain size, etc.). For very high aspect ratio nanopores and ultimately nanodevices in them, aluminum sheets may be preferred to avoid very long thin film deposition times.
  • material layers are created within the AAO nanopores to form two-terminal nanodevices and arrays thereof. While such nanodevices include multiple material layers created by different deposition processes, the preferred processes are limited to those capable of penetrating deeply into nanoscale pores. These include, for example, ALD and ECD, as will be discussed in more detail below.
  • FIG. 2 shows a schematic of a two-terminal electrostatic capacitor nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • a metal-insulator-metal (MIM) layer structure can be formed in a nanopore in AAO 10 .
  • a first material 20 as a bottom electrode, can be disposed through a first distal end of the nanopore 10 , extending along the inner walls to a second distal end of the nanopore 10 .
  • a second material 30 as a top electrode, can be disposed through the first distal end of the nanopore 10 , extending along the inner walls of the first material 20 to the second distal end of the nanopore 10 .
  • the first material 20 and the second material 30 can be concentrically disposed within the nanopore 10 .
  • the first material 20 and the second material 30 can be separated by a dielectric layer 40 , producing an internal electrical field for separating charges created by light absorption.
  • a first electrical contact 50 as a bottom electrode contact
  • a second electrical contact 60 as a top electrode contact
  • patterning of such contacts can be performed on the scale of one micrometer or larger feature size, realizing lithographic processes and wiring which are routine and inexpensive (i.e., consistent with decades-old microelectronics technology).
  • Such patterned wiring allows a massive array of nanodevices (i.e., millions or more) to be wired in parallel to achieve practical functionality for energy storage (i.e., or energy capture).
  • the electrostatic capacitor nanodevice can also include a passivation layer 70 formed between the AAO surface and the first material 20 to protect the nanodevice from any impurities, defects, or roughness present at the AAO surface. It is known that the AAO process, electrochemical in nature and carried out in complex acidic solutions, can incorporate impurities from the electrolytic solution into the AAO material.
  • ALD is a preferred method to obtain very high aspect ratios. Utilizing alternating sequences of chemical precursors needed for film growth, ALD exploits the self-limiting adsorption/reaction behavior for each precursor pulse to achieve unprecedented control and uniformity of thickness at the atomic level. This enables highly controlled formation of multiple material layers, each a few nanometers thick, within narrow AAO nanopores. The control and uniformity achieved in ALD persists even in very high aspect ratio nanopore structures, making ALD nearly ideal as a deposition technique for two-terminal nanodevice fabrication in very high aspect ratio nanopores.
  • Materials for the first material 20 and the second material 30 can be electrically conducting so that they can transport charge to and from their surfaces, storing it particularly at their interfaces with the dielectric layer 40 to achieve high power and energy density.
  • Materials for the electrodes can include metals, such as aluminum (Al), copper (Cu), tungsten (W), binary compounds, such as titanium nickel (TiN) or tungsten nickel (WN), or more complex materials, such as indium tin oxide (ITO).
  • the materials for the first material 20 and the second material 30 may be different or the same.
  • the material for the dielectric layer 40 can include aluminum oxide (Al 2 O 3 ) or a high-K dielectric, silicon dioxide (SiO 2 ), or other insulating materials.
  • the material preferably has properties including high conformality, low leakage current, high breakdown field, and high dielectric constant.
  • Embodiments of the invention for the electrostatic capacitor nanodevice provide advantages over conventional electrostatic capacitors. These advantages arise from the dramatically enhanced surface area of the first material 20 as a bottom electrode and the second material 30 as a top electrode compared to conventional planar structures. In such devices, energy is stored at electrode surfaces, which for high aspect ratio nanodevices have areas enhanced by 100-300 ⁇ or more compared to planar capacitor geometries. While these devices already feature high power density, their dramatically increased surface area enlarges their energy density by corresponding factors.
  • FIG. 3 shows a schematic of a two-terminal electrochemical supercapacitor or battery nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • an electrochemical supercapacitor or battery nanodevice can be formed in a nanopore in AAO 10 .
  • a first material 20 as a bottom electrochemical electrode, can be disposed through a first distal end of the nanopore 10 , extending along the inner walls to a second distal end of the nanopore 10 .
  • a second material 30 as a top electrochemical electrode, can be disposed through the first distal end of the nanopore 10 , extending along the inner walls of the first material 20 to the second distal end of the nanopore 10 .
  • the first material 20 and the second material 30 can be concentrically disposed within the nanopore 10 .
  • the first material 20 and the second material 30 can be separated by a solid, gel or polymer electrolyte 42 that can be retained in the structure under varying conditions of use to achieve supercapacitor or battery functionality.
  • a first electrical contact 50 as a bottom electrode contact
  • a second electrical contact 60 as a top electrode contact
  • the first material 20 as the bottom electrochemical electrode and the second material 30 as the top electrochemical electrode are made of materials suitable for ion transport and charge storage.
  • these materials can include metal oxides (e.g., MnO 2 , LiMnO 2 , CoO 2 , V 2 O 5 , TiO 2 , etc.), which are particularly suitable for electrochemical capacitors or battery cathodes, as well as carbon, silicon, or others suited for battery anodes.
  • a first current collecting layer 80 can be formed between the AAO surface and the first material 20 , and similarly a second current collecting layer 90 can be formed on an outer surface of the second material 30 .
  • Current collecting layers 80 , 90 are preferably formed from metallic or highly conducting material, so that electronic charge from the first and second materials 20 , 30 , as bottom and top electrochemical electrodes, can be readily transported to and from the first and second electrical contacts 50 , 60 .
  • Embodiments of the invention for the electrochemical supercapacitor or battery nanodevice provide advantages over conventional electrochemical supercapacitors or batteries. These advantages arise primarily in the form of increased power density. Since charge is transported and stored in electrochemically active electrodes as ions and atoms, their diffusion in the electrode materials is rather slow, leading to limitations on how fast charge may be moved, i.e., reduced power capability. By using very thin layers of electrochemically active electrode materials, ion/atom charge transport times are shorter, resulting in higher power capability.
  • two-terminal nanodevices such as a two-terminal solar cell nanodevice formed within a nanopore, as shown in FIG. 4 , also capture energy.
  • the two-terminal solar cell nanodevice includes a first material 20 , as a bottom semiconducting electrode, that can be disposed through a first distal end of the nanopore 10 , extending along the inner walls to a second distal end of the nanopore 10 .
  • a second material 30 as a top semiconducting electrode, can be disposed through the first distal end of the nanopore 10 , extending along the inner walls of the first material 20 to the second distal end of the nanopore 10 .
  • the first material 20 and the second material 30 can be concentrically disposed within the nanopore 10 .
  • the first material 20 includes a n-type semiconductor material
  • the second material 30 includes a p-type semiconductor material, or vice versa.
  • the first material 20 and the second material 30 provide the basic function of capturing solar energy and separating electron and hole charge in the pn junction solar cell nanodevice.
  • a depletion region 44 is formed at the interface between the two semiconductor layers, providing an electric field within the depletion region that separates the electron-hole pair created by photon (light) absorption.
  • a first electrical contact 50 as a bottom electrode contact
  • a second electrical contact 60 as a top electrode contact
  • the solar cell nanodevice can further include a first current collecting layer 80 formed between the AAO surface and the first material 20 , and similarly a second current collecting layer 90 formed on an outer surface of the second material 30 .
  • First and second electrode current collection layers 80 , 90 are preferred in many situations to improve efficiency with which electron and hole charge can be transported to first and second electrical contacts 50 , 60 .
  • the second (top) electrode current collection layer 90 and the second electrical contact 60 should be transparent to solar radiation, enabling it to reach the depletion region 44 .
  • a variety of conducting materials satisfy this requirement, such as indium tin oxide and aluminum zinc oxide.
  • certain embodiments of the present invention can produce a favorable energy capture per unit volume and per unit weight in solar cell devices.
  • Embodiments of the invention for the solar cell nanodevice provide advantages over conventional solar cell nanodevices. Because sunlight penetrates rather deeply into semiconducting materials (i.e., a significant fraction of a micrometer), the solar cell nanodevices, as discussed above, formed in deep (i.e., 1-10 micrometers) nanopores can efficiently absorb much of the solar radiation incident from above. Because the semiconducting layers are thin (i.e., enough to fit within the nanopores), the depletion regions can include a significant fraction of the layer thickness, so that a large fraction of electron-hole pairs created by light absorption can be separated to deliver useful currents. Depletion lengths can be increased by choosing lower doping (i.e., carrier concentration) levels of the semiconductors, while the resulting higher resistance of the semiconductor layers places a premium on using current collecting layers.
  • lower doping i.e., carrier concentration
  • the solar cell nanodevice can be formed as a Schottky barrier solar cell, rather than a pn junction.
  • one of the first material 20 and the second material 30 is replaced by a metal layer, which forms a rectifying Schottky barrier to the other semiconductor layer.
  • Schottky barriers rather than ohmic contacts, are typically formed between transition metals and n-type semiconductors. The Schottky barrier contact to a semiconductor produces a depletion region 44 inside the semiconductor, where electron-hole charge separation can occur, essentially circumventing the need to fabricate two-terminal nanodevices with only one material at each distal end.
  • the two-terminal nanodevices shown in FIGS. 2-4 may include first and second electrical contacts 50 , 60 formed at opposite ends of the nanopore 10 .
  • FIG. 5 shows a schematic of a two-terminal nanodevice in which contacts are provided at opposite ends of a nanopore, in accordance with an embodiment of the invention.
  • the two-terminal capacitor nanodevice shown in FIG. 5 includes the same general configuration discussed above for the electrostatic capacitor nanodevice, as shown in FIG. 2 , with the exception that the first electrical contact 50 is formed at the second distal end of the nanopore 10 (i.e., at the bottom of the nanopore 10 ), while the second electrical contact 60 is formed at the first distal end of the nanopore 10 .
  • the first material 20 must be exposed from the bottom side of the AAO nanopore 10 template. This requires removal of the bottom side of the AAO nanopore 10 template by wet or dry etching of the aluminum substrate 2 left under the nanopore 10 , as shown in FIG. 1 e , a process that may be done in a pattern, so that a mechanical support structure of the remaining aluminum substrate 2 and the AAO 3 layer remain over larger distances. Also, as shown in FIG. 1 e , the AAO 3 layer at the bottom of the nanopore array 5 must be opened by similar etching or otherwise removed by modification of the AAO nanopore fabrication process.
  • the first electrical contact 50 can be provided below the AAO nanopore 10 template, as shown in FIG. 5 .
  • the first electrical contact 5 may connect to the bottom of the first material 2 at the level of the bottom surface of the AAO nanopore 10 , or it may penetrate into the AAO nanopore 10 to reach the first material 20 somewhat above the bottom surface of the AAO nanopore 10 .
  • the two-sided contact structure can be achieved for other nanodevices, such as those depicted in FIGS. 2 , 3 and 4 , as discussed above, and in FIGS. 7 , 8 and 9 to be discussed below.
  • Having the electrical contacts 50 , 60 for the two nanodevice terminals at opposite ends of the nanodevice offers advantages over conventional devices.
  • these two-terminal nanodevices enable nanodevice designs, such as those shown in FIGS. 7 , 8 and 9 , and provide process variations that provide a high degree of design flexibility in the structure of the nanodevices.
  • the first electrical contact 50 can be provided at the bottom of the unfilled nanopore 10 and used as an electrode for ECD of materials into the nanopore 10 .
  • ECD can be used to deposit a wide range of materials, involves lower cost than ALD, and can be employed to produce different shapes of the ECD electrode, specifically as nanowires filling the nanopore 10 , or as nanotubes from deposition against the nanopore 10 sidewall.
  • As ECD begins at the electrode at the bottom of the open nanopore 10 its height within the pore can be controlled by the process time.
  • multiple materials can be sequentially deposited or simultaneously co-deposited by ECD, providing a significant flexibility in achieving a variety of geometric and compositional shapes.
  • ECD and ALD are complementary in offering design flexibility. While ECD proceeds from an electrode at the bottom of a nanopore 10 , ALD grows from the top down into the nanopore 10 and does not require an electrode. ECD can often fully fill a high aspect ratio nanopore, but does not achieve highly uniform coverage on nanopore 10 sidewalls to the extent that ALD can. While ALD is more often employed to coat the entire surface area of the nanopore 10 , precursor dose per cycle can be stopped below that needed, resulting in an ALD layer that coats the nanopore 10 surface only partway into the nanopore 10 . In these conditions, suitable modification of ALD and ECD process recipes can provide a large variety of nanodevice design options, including uniform or graded thickness profiles extending partway or fully from either end of the nanopore 10 .
  • FIG. 6 a shows a schematic of a metal-insulator-metal nanocapacitor fabricated by multiple atomic layer deposition steps in anodic oxide aluminum oxide nanopores to form an energy storage structure, in accordance with an embodiment of the invention.
  • FIGS. 6 b and 6 c show scanning electron micrographs of the metal-insulator-metal nanocapacitor shown in FIG. 6 a , in accordance with an embodiment of the invention.
  • anodic oxidation of aluminum 2 leads to formation of AAO 3 with deep pores on whose surfaces a sequence of ALD layers can be deposited to create a MIM device structure, as shown in FIGS. 2-4 .
  • the detailed structure of MIM layers is seen by scanning electron microscopy in FIGS. 6 b and 6 c for regions at the top and bottom of the nanopores 10 , respectively.
  • the pore diameter was 60 nm
  • the bottom TiN electrode thickness was 5.6 nm
  • the AAO dielectric thickness was 6.6 nm
  • the top TiN electrode thickness was 12.6 nm, nearly filling the nanopore 10 .
  • layer thicknesses could be readily adjusted to fully fill the nanopore or instead to leave internal volume.
  • the pore depth for the structures shown in FIGS. 6 a , 6 b and 6 c was 1 micrometer.
  • Embodiments of the invention further provide MIM nanocapacitor arrays for both 1 and 10 ⁇ m depths, forming capacitors whose macroscopic external contacts to the TiN ALD layers in the MIM structure were made above the nanopores 10 and to the underlying aluminum 1 below the nanopores 10 .
  • capacitors with 0.01267 mm 2 area e.g., about 0.1 mm in diameter
  • capacitors with 0.01267 mm 2 area e.g., about 0.1 mm in diameter
  • capacitors with 0.01267 mm 2 area connected approximately 10 6 nanocapacitor structures, like those shown in FIGS. 6 a , 6 b and 6 c , in parallel and indicated capacitance densities of about 10 and 100 ⁇ F/cm 2 , respectively.
  • FIG. 6 d shows a schematic of an aggregation of an array of metal-insulator-metal nanocapacitors, as shown in FIG. 6 a , to form an energy storage device, in accordance with an embodiment of the invention.
  • MIM trilayer structures from one nanodevice can connect continuously to each other over the top of the AAO material between nanopores.
  • a massive array i.e., billions of nanodevices over a few square inch area
  • this massive array is then partitioned into smaller devices for testing and use in energy applications, as will be discussed below.
  • the electrostatic capacitor nanodevices as shown in FIGS. 6 a to 6 c within a 125 micrometer diameter region may be wired in parallel to form an aggregate capacitor microdevice.
  • the wiring scheme to create small capacitors is shown in FIG. 6 d .
  • a first electrical contact 50 is formed to the first material 20 , as a common bottom electrode, of all the nanocapacitors, which are already wired together by their shared ALD bottom electrode layer.
  • a second electrical contact 60 as a small dot (i.e., with a 125 micrometer diameter)
  • this electrical contact connects only to the nanodevices underneath it, including about one million nanocapacitors (i.e., the MIM electrostatic nanocapacitor shown in FIG. 2 ).
  • the resulting electrostatic capacitor composed of a million nanodevices, can then be charged, discharged, tested and used by their first and second electrical contacts 50 , 60 . Over a massive array of such nanodevices, covering inches or more, many such capacitors can be made and further interconnected to form an electrostatic energy storage system.
  • This aggregation of nanodevices is characteristic of how nanodevices and massive arrays made from them are used in accordance with embodiments of the invention.
  • the extent of aggregation used to form such arrays depends on a variety of performance metrics sought, capabilities of the specific process and nanodevice technology, and regard for testability, yield and reliability.
  • the microdevices may be wired together to create systems, for example, on the scale of solar panels of order 1 meter in size. Analogous considerations for how this “macro” wiring is designed apply as identified for the microdevice level, as well as how many levels of aggregation and global wiring are used.
  • FIGS. 7 a and 7 b show a schematic of a two-terminal thermoelectric nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • the two-terminal thermoelectric nanodevice, as shown in FIGS. 7 a and 7 b use a two-sided contact configuration, as shown in FIG. 5 , and discussed above.
  • thermoelectric material 100 is formed as a nanotube or a nanowire within a nanopore 10 .
  • the nanopore 10 initially includes AAO material (note: aluminum oxide has a low thermal conductivity).
  • Metal contacts 110 , 120 at the top and the bottom of the nanopore are connected electrically to the thermoelectric nanotube or nanowire 100 .
  • top metal contact layer 110 is placed in thermal contact with a gas, liquid or solid at elevated temperature T 1 , while the bottom metal contact layer 120 remains at a lower temperature T 2 , a voltage is generated between the metal contacts 110 , 120 to generate power.
  • the AAO material may be removed in some locations, or replaced by another insulating material with an even lower thermal conductivity, so that higher thermal gradients and thermoelectric power can be attained.
  • thermoelectric nanodevices may be arranged in an array, as shown in FIG. 7 c .
  • FIG. 7 c shows a schematic of an aggregation of an array of thermoelectric nanodevices, as shown in FIG. 7 a or 7 b , to form an energy storage device, in accordance with an embodiment of the invention.
  • a thermoelectric energy harvesting system as shown in FIG. 7 c , may be employed, for example, to harness excess heat from an engine by contacting the metal contact layer 110 to the engine, while keeping metal contact layer 120 cooled to a lower, ambient temperature (i.e., with air cooling).
  • a low thermal conductivity insulator 130 e.g., AAO, polymer, porous or air
  • a low thermal conductivity insulator 130 may be formed at the ends of the thermoelectric energy storage device to insulate energy from escaping the sides of the device.
  • a two-terminal thermoelectric nanodevice can serve as the basis for other applications, such as a thermoelectric imaging device.
  • the top metal contact layer 110 can be patterned to form an array of pixels, with image information read out as voltages of the top electrode pixels in comparison to the voltage at the bottom metal contact layer 120 .
  • the pixels may be coated by other material to optimize absorption and consequent heating by the radiation, as in an infrared imaging application.
  • an analogous application involves use of piezoelectric material instead of thermoelectric material in a two-terminal nanodevice configured similarly to the nanodevice shown in FIG. 7 c .
  • Mechanical forces applied between the top metal contact 110 and the bottom metal contact 120 layers will generate electrical voltages between these layers if they are connected by piezoelectric nanotubes or nanowires, for example to harvest mechanical energy from vibration or pressure as electrical energy.
  • FIG. 8 shows a schematic of a two-terminal nanodevice array disposed to sense chemicals or biochemicals in gaseous or liquid form, in accordance with an embodiment of the invention.
  • a sensor material is deposited as nanotubes inside the nanopores.
  • these materials e.g., tin oxide
  • these materials have properties that exhibit resistivity changes upon exposure to chemicals (e.g., organic vapors, such as alcohols).
  • this two-terminal nanodevice array is formed by coating a nanopore 10 and perhaps other surfaces of an AAO membrane 3 with chemical sensing films 140 .
  • Metal contacts 50 and 60 are formed at opposite ends of the nanopores to measure resistance of the sensor films during exposure to analytes in gaseous or liquid form.
  • the metal contact structures 50 , 60 are shaped such that they do not substantially cover or close the nanopore regions at either end, allowing gas or liquid flow through the nanopores.
  • gas or liquid from the former is forced to flow through the nanopores 10 .
  • resistance change is measure between metal contacts 50 , 60 .
  • the two-terminal electrochemical nanodevice is compatible with liquid electrolytes.
  • Either aqueous or organic, liquid electrolytes are by far the most common in battery and supercapacitor systems.
  • current collecting layers and electrochemical materials together form electrodes at each end of AAO nanopores, with a separation region 150 between them where no material is deposited on top of the insulating sidewall of the AAO nanopore.
  • the energy storage device as shown in FIG.
  • FIG. 9 b includes a cell 160 composed of a nanodevice array that includes a plurality of two-terminal electrochemical nanodevices, as shown in FIG. 9 a , configured as a top cell electrode 170 and a bottom cell electrode 180 .
  • the energy storage device further includes a top wiring contact 190 and a bottom wiring contact 200 .
  • this structure is formed using ALD for its ability to deposit into high aspect ratio nanopores, while limiting penetration by judicious choice of precursor dose per cycle, as stated above.
  • a representative process sequence to fabricate the electrochemical nanodevice array shown in FIGS. 9 a and 9 b is as follows. First, a top contact wiring pattern is formed on top of the AAO membrane to provide structural rigidity for the membrane. Then ALD is used to deposit a current collecting layer part way into the top of the nanopores, followed by ALD and/or ECD to deposit the electrochemically active charge storage material (e.g., metal oxide) over the current collecting layer. This forms a top nanoelectrode array.
  • ALD electrochemically active charge storage material
  • the underlying aluminum and AAO material on the bottom side are then patterned and etched to expose the bottom of the nanopores in a patterned region.
  • a bottom nanoelectrode array is then formed from the exposed bottom opening of the nanopores, using ALD and/or ECD as for the top nanoelectrodes.
  • the two-terminal nanodevices reflect both energy storage and capture.
  • the nanodevices as discussed above, can be combined to form multilayer nanodevice arrays vertically stacked or horizontally located.
  • Hybrid systems capable of both storage and capture are highly desirable for applications of renewable sources (e.g., storing solar energy captured during daytime for use at night), as well as for other hybrid energy systems (e.g., high power supercapacitors and high energy batteries).
  • power management is essential and best integrated on the same nanodevice technology platform.
  • the nanodevices discussed above can serve as power management components as well.
  • Conducting nanowires can be circuit connections (or in proper geometry as inductors), electrostatic capacitors can serve as storage elements, pn junctions can perform as diodes, and Schottky barrier junctions as Schottky or ohmic contacts.
  • the solar cell nanodevices can also function as light detectors or light emitting diodes for optoelectronic functionality.
  • FIG. 10 shows a series of steps for a process for creating a vertical two-terminal nanotube device, in accordance with an embodiment of the invention.
  • an ordered array of nanopores 10 in an aluminum layer can be formed using the process shown in FIGS. 1 c - 1 e (step 200 ).
  • a first material 20 is deposited into an AAO nanopore 10 using a sequence of ALD deposition steps.
  • the first material 20 is deposited into a first distal end of the nanopore 10 , so that it extends toward a second distal end of the nanopore 10 along inner walls of the nanopore 10 (step 210 ).
  • a second material 30 is deposited into the first distal end of the nanopore 10 , so that it extends toward the second distal end of the nanopore 10 within the first material 20 (step 220 ).
  • the method includes depositing a third material into the first distal end of the nanopore 10 , so that it extends toward the second distal end of the nanopore 10 between the first material 20 and the second material 30 (step 230 ).
  • the third material is deposited during the sequential deposit of the first and second material, so that the first material is deposited, followed by the third material and then the second material.
  • the third material may include one of an electrical insulator and an electrolyte. Whereas, in other embodiments, the third material may not be needed, for example, in the case where a plurality of sequentially formed layers are deposited to form the nanodevice.
  • the method includes disposing and connecting a first wiring material 50 to an exposed end of the first material 20 , and disposing and connecting a second wiring material 60 to an exposed end of the second material 30 (step 240 ).
  • the first wiring material 50 and the second wiring material may both be connected on a top surface of the nanopore 10 , or may be connected on a top surface and a bottom surface of the nanopore 10 , respectively.
  • the method of connecting the first wiring material 50 and the second wiring material 60 may include connecting a plurality of nanopores 10 in parallel.
  • Either the first or second materials 20 , 30 can be replaced with two or more materials to achieve different device behavior and performance.
  • different materials can be used to create the electrostatic capacitor nanodevice, shown in FIG. 2
  • different materials can be used to create the electrochemical nanodevice, shown in FIG. 3 .
  • first and second materials 20 , 30 in the AAO nanopores 10 While high conformality and control of ALD makes it attractive for forming first and second materials 20 , 30 in the AAO nanopores 10 , other processes, such as ECD, CVD, and sol-gel processes can be useful for some of the process steps to introduce materials into the nanopores 10 .
  • ALD is a preferred deposition process for introducing the first and second materials 20 , 30 , in order to achieve uniform deposition within the nanopore 10 .
  • a conventional physical vapor deposition e.g., evaporation or sputtering
  • ECD may be a preferred process to deposit the first material 20 if a current collecting layer is already in place and can be contacted to define its voltage during ECD of the first material 20 , as a bottom electrode.
  • the electrolyte layer 42 may be deposited by sol-gel processes and by ALD. ALD processes are also known for some polymer systems that could include a polymer electrolyte.
  • Various electron donor and acceptor materials can be chosen for the first and second semiconductor materials 20 , 30 .
  • Either donor or acceptor material, or n-type or p-type semiconductor material can be chosen as the first material, to be deposited by ALD as a first material in a first distal end of each nanopore.
  • Semiconducting materials can be, for example, zinc oxide (ZnO) (either n-type or p-type), titanium oxide (TiO 2 ) (n-type), copper oxide-nickel oxide (Cu 2 O—NiO) (p-type), and vanadium oxide (V 2 O 5 ).

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Abstract

An apparatus, system, and method are provided for a vertical two-terminal nanotube device configured to capture and generate energy, to store electrical energy, and to integrate these functions with power management circuitry. The vertical nanotube device can include a column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material. Further, the vertical nanotube device can include a first material disposed within the column, a second material disposed within the column, and a third material disposed between the first material and the second material. The first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column. The second material fills the first distal end of the column and extends to the second distal end of the column within the first material. Both the first material and the second material are exposed at the first distal end of the column.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application claims priority under 35 U.S.C. §119(e) of U.S. Provisional Patent Application Ser. No. 61/237,155, filed on Aug. 26, 2009. The subject matter of the earlier filed application is hereby incorporated by reference.
  • This invention was made with United States Government support under Contract No. H9823004C0448 awarded by the National Security Agency and under Contract No. DMR0520471 awarded by the National Science Foundation. The United States Government has certain rights in this invention.
  • BACKGROUND
  • 1. Field
  • Embodiments of the invention relate to an apparatus, system, and method for nanostructure-based devices for electrical energy management. More particularly, embodiments of the invention relate to an apparatus, system, and method for providing nanostructure arrays as two-terminal devices, for example, nanotube or nanowire devices (hereinafter referred to as “nanodevices”), configured to store electrical energy, to capture and generate energy, and to integrate with power management circuitry.
  • 2. Description of the Related Art
  • The limitations of conventional capacitor and battery devices are well known. Charge storage devices can exhibit similar limitations experienced by conventional solar cell devices, as will be discussed below. Electrostatic capacitors that store charge at the surface of electrodes typically do not achieve high areal densities of the electrodes. Electrochemical supercapacitors and batteries that store charge inside their active surfaces and at the surface also can experience similar limitations experienced by conventional solar cell devices, as will be discussed below. While sub-surface charge storage can enhance energy density, the resulting slow ion/charge transport into these materials can limit available power.
  • The limitations of conventional devices for energy capture and storage are also well known. In semiconductor pn junction solar cells, planar device layers typically create only a single depletion layer over the surface to separate photo-induced carriers. As a result, each substrate of a semiconductor pn junction solar cell can be limited to only a single active layer. Furthermore, some of the semiconductor material can absorb light, producing excitations outside a depletion range. This can prevent the separation of positive and negative charges and the collection of harvested light energy.
  • Currently, alternate solar cell structures are being explored that utilize nanocomposite structures that mix nanoparticles, such as C-60 or carbon nanotubes, with organic materials having random spatial distributions on a nanoscale. These nanocomposite structures can provide a high density of interfaces between the component materials, effectively enhancing the active regions, analogous to depletion regions in pn junction semiconductor structures, where charge separation can occur.
  • However, the nanoscale randomness of the component materials can impede efficient collection of charges at micro- or macro-scale external contacts where charge should be produced, for example, through high electrical resistance through which the charge reaches the contacts. Additionally, these materials, such as conducting polymers, can have relatively high resistivity, further diminishing the efficiency of charge collection at the external contacts.
  • A number of nanostructures have been explored to improve the power and energy density of conventional capacitor and battery devices and conventional solar cell devices, primarily exploiting higher surface area densities per unit volume of material used in these devices. For example, a high density of nanowires on a surface can substantially enhance the surface area available, producing higher charge density per unit planar area. Furthermore, nanowire and nanotube structures can present shortened pathways for ion transport into the surface, thereby increasing power density. These advancements in technology promise improvements in energy devices, particularly if nanostructures can be formed with sufficient control at the nanoscale to realize functioning and reliable aggregation of massive arrays of nanostructures into larger working devices addressed at the macro- or micro-scale external contacts.
  • Nanotechnology provides new options for meeting these requirements, particularly using self-assembly phenomena and self-alignment to build more complex nanodevices from simpler nanostructures. For example, anodic aluminum oxide (AAO) can achieve highly regular arrays of nanopores through specific recipes for anodic oxidation of aluminum. Nanopores in AAO may have uniform size and spacing in a hexagonal pattern.
  • SUMMARY
  • In accordance with an embodiment of the invention, there is provided a vertical nanotube device, which includes a substrate, and an anodic oxide material disposed on the substrate. The vertical nanotube device can further include a column disposed in the anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material. Further, the vertical nanotube device can include a first material disposed within the column, a second material disposed within the column, and a third material disposed between the first material and the second material. The first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column. The second material fills the first distal end of the column and extends to the second distal end of the column within the first material. Both the first material and the second material are exposed at the first distal end of the column.
  • In accordance with an embodiment of the invention, there is provided a vertical two-terminal nanotube device, which includes a column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material. The vertical two-terminal nanotube device further includes a first material disposed within the column, a second material disposed within the column, and a third material disposed between the first material and the second material. The first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column. The second material fills the first distal end of the column and extends to the second distal end of the column within the first material. The first material is exposed at the first distal end of the column, and the second material is exposed at the second distal end of the column.
  • In accordance with an embodiment of the invention, there is provided a vertical two-terminal nanotube device, which includes a plurality of columns, each column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material. The vertical two-terminal nanotube device further includes a first material disposed within the column, a second material disposed within the column, and a third material disposed between the first material and the second material. The first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column. The second material fills the first distal end of the column and extends to the second distal end of the column within the first material. The first material is exposed at the first distal end of the column, and the second material is exposed at the second distal end of the column. The plurality of columns are connected in parallel by a first wiring structure operatively connected to an exposed end of the first material, and a second wiring structure operatively connected to an exposed end of the second material. The first and the second wiring structures are configured on a top surface and a bottom surface of the column, respectively.
  • In accordance with an embodiment of the invention, there is provided a vertical two-terminal nanotube device, which includes a pressure-controlled vessel. The vessel includes a plurality of columns. Each column is disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material. The vessel further includes a material disposed within the column. The material includes a chemical sensing film. The vessel further includes a first wiring structure operatively connected to a top surface of the plurality of columns, and a second wiring structure operatively connected to a bottom surface of the plurality of columns. The first and the second wiring structures are configured on a top surface and a bottom surface of the column, respectively. The pressure-controlled vessel is configured to allow a gas or liquid to flow through the plurality of columns. The first and second wiring structures are configured to measure a resistance change based on an adsorption, absorption or reaction of species from the gas or liquid on the material.
  • In accordance with an embodiment of the invention, there is provided a method, which includes the step of forming a columnar pore in an exposed portion of a material layer, depositing a first material into a first distal end of the columnar pore, and depositing a second material into the first distal end of the columnar pore. The step of depositing the first material includes filling the first distal end of the columnar pore with the first material so that the first material extends to the second distal end of the columnar pore along inner walls of the columnar pore. The step of depositing the second material includes filling the first distal end of the columnar pore with the second material, so that the second material extends to the second distal end of the columnar pore within the first material.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Further aspects, details, advantages and modifications of the present invention will become apparent from the following detailed description of the embodiments which is to be taken in conjunction with the accompanying drawings, in which:
  • FIGS. 1 a and 1 b show a scanning electron micrograph of AAO nanopore arrays, in accordance with an embodiment of the invention.
  • FIGS. 1 c to 1 e show a formation of ordered arrays of nanopores through anodic oxidation of aluminum, in accordance with an embodiment of the invention.
  • FIG. 2 shows a schematic of a two-terminal electrostatic capacitor nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 3 shows a schematic of a two-terminal electrochemical supercapacitor or battery nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 4 shows a schematic of a two-terminal solar cell nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 5 shows a schematic of a two-terminal nanodevice in which contacts are provided at opposite ends of a nanopore, in accordance with an embodiment of the invention.
  • FIG. 6 a shows a schematic of a metal-insulator-metal nanocapacitor fabricated by multiple atomic layer deposition steps in anodic oxide aluminum oxide nanopores to form an energy storage structure, in accordance with an embodiment of the invention.
  • FIG. 6 b shows a scanning electron micrograph of the metal-insulator-metal nanocapacitor shown in FIG. 6 a, in accordance with an embodiment of the invention.
  • FIG. 6 c shows another scanning electron micrograph of the metal-insulator-metal nanocapacitor shown in FIG. 6 a, in accordance with an embodiment of the invention.
  • FIG. 6 d shows a schematic of an aggregation of an array of metal-insulator-metal nanocapacitors, as shown in FIG. 6 a, to form an energy storage device, in accordance with an embodiment of the invention.
  • FIGS. 7 a and 7 b show a schematic of a two-terminal thermoelectric nanodevice formed within a nanopore, in accordance with an embodiment of the invention.
  • FIG. 7 c shows a schematic of an aggregation of an array of thermoelectric nanodevices, as shown in FIG. 7 a or 7 b, to form an energy storage device, in accordance with an embodiment of the invention.
  • FIG. 8 shows a schematic of a two-terminal nanodevice array disposed to sense chemicals or biochemicals in gaseous or liquid form, in accordance with an embodiment of the invention.
  • FIG. 9 a shows a schematic of a two-terminal electrochemical nanodevice formed within a nanopore that is compatible with a liquid or aqueous electrolyte, in accordance with an embodiment of the invention.
  • FIG. 9 b shows a schematic of an aggregation of an array of electrochemical nanodevices, as shown in FIG. 9 a, to form an energy storage device, in accordance with an embodiment of the invention.
  • FIG. 10 shows a method for creating a vertical two-terminal nanodevice, in accordance with an embodiment of the invention.
  • DETAILED DESCRIPTION OF THE EMBODIMENTS
  • Embodiments of the invention provide two-terminal nanodevice arrays that utilize nanostructures having nanopores formed by anodic oxidation of aluminum, and thin films deposited by atomic layer deposition (ALD) and electrochemical deposition (ECD) to form devices in the nanopores. These nanostructures may be coupled to one another to form larger assemblies suitable for power and energy systems.
  • Certain embodiments of the invention provide two-terminal nanodevice arrays for capture, generation and storage of energy based on multi-component materials contained within nanoscale pores in aluminum oxide or another dielectric material. A plurality of these nanodevice arrays may be wired in parallel to capture energy from light, either solar or ambient, and to generate energy from temperature gradients sensed by thermoelectric devices.
  • Embodiments of the invention provide electrostatic capacitors, electrochemical capacitors, and batteries for energy storage, whereby device layers for energy capture, generation or storage, can be combined one on top of another or laterally to provide enhanced functionality, including energy and power management systems and electrical power management circuitry with components for capture, generation, storage and distribution.
  • The two-terminal nanodevices, in accordance with embodiments of the invention, are formed as nanotubes or nanowires within nanopores initially formed as arrays in a nanopore template. Two electrical contacts can be formed at one end of a nanodevice, whereby one contact is brought to an end of the nanopore where the other contact is formed by a conducting nanotube outside one of the two terminals or by a conducting nanowire inside one of the two terminals. In another embodiment, the two electrical contacts can be formed at each end/side of the nanopore.
  • Once the two-terminal nanodevice has been fabricated, it may be used as formed in the nanopore as an embedded nanodevice. Alternatively, portions of the two-terminal nanodevice may be exposed by removing a portion of or the entire surrounding nanopore template. Such exposure is important, for example, in electrochemical energy storage devices, where the two terminals must each be in contact with an electrolyte formed between them.
  • An array of two-terminal nanodevices, in accordance with certain embodiments of the invention, can be employed as electrical energy storage devices, including, for example, electrochemical devices (e.g., electrochemical supercapacitors, pseudo-capacitors and double-layer capacitors), batteries (e.g., lithium ion batteries), and electrostatic capacitors. These two-terminal nanodevices can also be used as electrical energy capture devices functioning as solar cells based on either semiconducting pn junctions or metal/semiconductor Schottky barriers.
  • Further, these two-terminal nanodevices can be used as generators of thermoelectric energy from temperature gradients between the two terminals. For example, thermoelectric nanowires or nanotubes are provided between hot and cold terminals, and the intervening insulating material is chosen to minimize heat flow between the two terminals, so that a temperature gradient and thermoelectric voltage are maximized. These thermoelectric nanodevices can be employed as energy capture devices (i.e., for power generation) or as sensors (i.e., in conjunction with bolometers at one terminal to capture infrared images).
  • According to some embodiments of the invention, the two-terminal nanodevice can be used to perform optical, chemical or sensing functions. The pn junction or Schottky barrier configurations, as discussed above for solar cells, can be operated as light sources (e.g., light-emitting diodes or lasers) and/or as optical detectors. For sensing, the nanodevices may be material layers formed as nanotubes inside nanopores with the two terminals sensing resistance or other electrical changes as chemicals introduced into the nanopores chemically modify the sensing material or as other environmental changes (e.g., touch and pressure) modify the surfaces of the sensing material layers.
  • According to other embodiments of the invention, multilayer types of nanodevices may be combined into a power management system, including energy generation/capture, storage and distribution. These systems may include multiple layers of nanodevice arrays connected in three dimensional configurations.
  • FIGS. 1 a and 1 b show a scanning electron micrograph of AAO nanopore arrays, in accordance with an embodiment of the invention. In particular, FIG. 1 a is a top view and FIG. 1 b is a side view of an AAO nanopore array, in accordance with an embodiment of the invention. The tops of nanopores 1 each provide access to narrow columns of the nanopores 1 that can include therein high aspect ratio nanopore structures, or nanodevices. According to embodiments of the invention, the AAO nanopores are narrow (i.e., 5-300 nm in width) and deep (i.e., 50 nm-100 μm), such that their aspect ratio (depth/width) is of order 1-1000, and more preferably 50-500. The dimensions of the AAO nanopores 1 are based on a choice of electrochemical conditions and sequences used during anodization. For example, for nanopores approximately 70 nm in diameter, their center-to-center spacing can be in the order 100 nm. Furthermore, the density of the AAO nanopores 1, for example 1010 pores/cm2, can ensure very large active surface areas per unit area. Typically, this area enhancement can be as high as approximately 1000× planar area. Since wet processing can be used, costs associated with vacuum and gas handling technologies can be avoided, and manufacturing costs can be modest. Thus, AAO can provide a cheap and attractive platform for high density nanostructures and devices made from them.
  • A particular advantage of AAO nanostructures can be that massive arrays can be fabricated with a high degree of control over their shape and spatial relationship, including their depth, width, and vertical shape (all controlled by anodization conditions). The regularity which results is ultimately of major value for manufacturability, providing predictability for properties for the full array. The nanopore arrays can have dimensions comparable to that produced by costly, sophisticated lithography and etching processes in the formation of dynamic random access memory capacitors. However, natural self-assembly from the anodization process itself produces the structures without need for such complex manufacturing steps.
  • Deposition techniques capable of introducing materials for electrical devices into very high aspect ratio nanopores are limited. Physical techniques, such as evaporation and sputter deposition, cannot sufficiently penetrate deeply into the pores, but chemical methods are suitable. Electrochemical deposition, carried out in electrolytic solutions, can successfully cope with the high aspect ratio because electric fields are established between a bottom region of the pore and a counter-electrode removed from the pore in the electrolyte.
  • FIGS. 1 c to 1 e show a formation of ordered arrays of nanopores through anodic oxidation of aluminum, in accordance with an embodiment of the invention. As shown in FIG. 1 c, an anodic oxidization of a substrate 2, for example aluminum, is performed to create AAO 3 with a plurality of parallel nanopores formed therein, which increasingly order into regular arrangements with uniform dimensions. After the ordering is sufficiently established, the AAO 3 created above the aluminum substrate 2 is chemically removed to leave an aluminum surface having an ordered, patterned array 4 (i.e., a scalloped-shaped structure), as shown in FIG. 1 d. With this ordered, patterned array in place, a second anodic oxidation step, as shown in FIG. 1 e, is performed to create a new structure of AAO 3, which produces a highly ordered, uniform nanopore array 5 above the aluminum substrate 1.
  • AAO formation can be carried out using a variety of process parameters, including choice of acid, concentration, voltage, and time. While AAO is the preferred process and material for very high aspect ratio nanopore arrays, in accordance with embodiments of the invention, a person of ordinary skill in the relevant art will recognize that other materials (e.g., titanium or silicon) can be anodically oxidized to form nanopores. Alternatively, nanopore arrays can be produced by track etching, in which high energy ions bombard a film (e.g., polymer or mica) to form damage tracks in the material. The damaged material is then removed by selective etching to form nanopores through it.
  • The aluminum substrate 2, which is reacted and partially consumed to form the AAO nanopore array 5 can be used in various forms. Aluminum sheets are commercially available which can be used directly. Such sheets may be anodically bonded to a substrate (e.g., glass), or otherwise attached to a thicker substrate, particularly to facilitate subsequent processing to form devices, as done in microelectronics. A thin film of aluminum may also be deposited on a substrate (e.g., glass or silicon). The quality of AAO nanopore uniformity and ordering may vary with the properties of the aluminum (e.g., purity, grain size, etc.). For very high aspect ratio nanopores and ultimately nanodevices in them, aluminum sheets may be preferred to avoid very long thin film deposition times.
  • According to embodiments of the invention, as will be discussed below, material layers are created within the AAO nanopores to form two-terminal nanodevices and arrays thereof. While such nanodevices include multiple material layers created by different deposition processes, the preferred processes are limited to those capable of penetrating deeply into nanoscale pores. These include, for example, ALD and ECD, as will be discussed in more detail below.
  • FIG. 2 shows a schematic of a two-terminal electrostatic capacitor nanodevice formed within a nanopore, in accordance with an embodiment of the invention. As illustrated in FIG. 2, a metal-insulator-metal (MIM) layer structure can be formed in a nanopore in AAO 10. In particular, a first material 20, as a bottom electrode, can be disposed through a first distal end of the nanopore 10, extending along the inner walls to a second distal end of the nanopore 10. A second material 30, as a top electrode, can be disposed through the first distal end of the nanopore 10, extending along the inner walls of the first material 20 to the second distal end of the nanopore 10. The first material 20 and the second material 30 can be concentrically disposed within the nanopore 10.
  • The first material 20 and the second material 30 can be separated by a dielectric layer 40, producing an internal electrical field for separating charges created by light absorption. By suitable patterning of layers on the first distal end of the nanopore 10, a first electrical contact 50, as a bottom electrode contact, can be formed to provide electrical current to the first material 20, and a second electrical contact 60, as a top electrode contact, can be formed on the top surface of the AAO nanopore template 10 to provide electrical current to the second material 30. As will discussed below, patterning of such contacts can be performed on the scale of one micrometer or larger feature size, realizing lithographic processes and wiring which are routine and inexpensive (i.e., consistent with decades-old microelectronics technology). Such patterned wiring allows a massive array of nanodevices (i.e., millions or more) to be wired in parallel to achieve practical functionality for energy storage (i.e., or energy capture).
  • The electrostatic capacitor nanodevice, as shown in FIG. 2, can also include a passivation layer 70 formed between the AAO surface and the first material 20 to protect the nanodevice from any impurities, defects, or roughness present at the AAO surface. It is known that the AAO process, electrochemical in nature and carried out in complex acidic solutions, can incorporate impurities from the electrolytic solution into the AAO material.
  • While a variety of processes may be used to create the layers in the electrostatic capacitor nanodevice shown in FIG. 2, ALD is a preferred method to obtain very high aspect ratios. Utilizing alternating sequences of chemical precursors needed for film growth, ALD exploits the self-limiting adsorption/reaction behavior for each precursor pulse to achieve unprecedented control and uniformity of thickness at the atomic level. This enables highly controlled formation of multiple material layers, each a few nanometers thick, within narrow AAO nanopores. The control and uniformity achieved in ALD persists even in very high aspect ratio nanopore structures, making ALD nearly ideal as a deposition technique for two-terminal nanodevice fabrication in very high aspect ratio nanopores.
  • Materials for the first material 20 and the second material 30 can be electrically conducting so that they can transport charge to and from their surfaces, storing it particularly at their interfaces with the dielectric layer 40 to achieve high power and energy density. Materials for the electrodes can include metals, such as aluminum (Al), copper (Cu), tungsten (W), binary compounds, such as titanium nickel (TiN) or tungsten nickel (WN), or more complex materials, such as indium tin oxide (ITO). The materials for the first material 20 and the second material 30 may be different or the same. The material for the dielectric layer 40 can include aluminum oxide (Al2O3) or a high-K dielectric, silicon dioxide (SiO2), or other insulating materials. For the dielectric layer 40, the material preferably has properties including high conformality, low leakage current, high breakdown field, and high dielectric constant.
  • Embodiments of the invention for the electrostatic capacitor nanodevice, as discussed above, provide advantages over conventional electrostatic capacitors. These advantages arise from the dramatically enhanced surface area of the first material 20 as a bottom electrode and the second material 30 as a top electrode compared to conventional planar structures. In such devices, energy is stored at electrode surfaces, which for high aspect ratio nanodevices have areas enhanced by 100-300× or more compared to planar capacitor geometries. While these devices already feature high power density, their dramatically increased surface area enlarges their energy density by corresponding factors.
  • FIG. 3 shows a schematic of a two-terminal electrochemical supercapacitor or battery nanodevice formed within a nanopore, in accordance with an embodiment of the invention. As illustrated in FIG. 3, an electrochemical supercapacitor or battery nanodevice can be formed in a nanopore in AAO 10. A first material 20, as a bottom electrochemical electrode, can be disposed through a first distal end of the nanopore 10, extending along the inner walls to a second distal end of the nanopore 10. A second material 30, as a top electrochemical electrode, can be disposed through the first distal end of the nanopore 10, extending along the inner walls of the first material 20 to the second distal end of the nanopore 10. The first material 20 and the second material 30 can be concentrically disposed within the nanopore 10.
  • The first material 20 and the second material 30 can be separated by a solid, gel or polymer electrolyte 42 that can be retained in the structure under varying conditions of use to achieve supercapacitor or battery functionality. By suitable patterning of layers on the first distal end of the nanopore 10, a first electrical contact 50, as a bottom electrode contact, can be formed to provide electrical current to the first material 20, and a second electrical contact 60, as a top electrode contact, can be formed on the top surface of the AAO nanopore template 10 to provide electrical current to the second material 30.
  • The first material 20 as the bottom electrochemical electrode and the second material 30 as the top electrochemical electrode are made of materials suitable for ion transport and charge storage. For example, these materials can include metal oxides (e.g., MnO2, LiMnO2, CoO2, V2O5, TiO2, etc.), which are particularly suitable for electrochemical capacitors or battery cathodes, as well as carbon, silicon, or others suited for battery anodes.
  • Because the electrochemical electrode materials typically have lower electrical conductivity than metal, conducting electrodes, a first current collecting layer 80 can be formed between the AAO surface and the first material 20, and similarly a second current collecting layer 90 can be formed on an outer surface of the second material 30. Current collecting layers 80, 90 are preferably formed from metallic or highly conducting material, so that electronic charge from the first and second materials 20, 30, as bottom and top electrochemical electrodes, can be readily transported to and from the first and second electrical contacts 50, 60.
  • Embodiments of the invention for the electrochemical supercapacitor or battery nanodevice, as discussed above, provide advantages over conventional electrochemical supercapacitors or batteries. These advantages arise primarily in the form of increased power density. Since charge is transported and stored in electrochemically active electrodes as ions and atoms, their diffusion in the electrode materials is rather slow, leading to limitations on how fast charge may be moved, i.e., reduced power capability. By using very thin layers of electrochemically active electrode materials, ion/atom charge transport times are shorter, resulting in higher power capability.
  • In accordance with embodiments of the invention, two-terminal nanodevices, such as a two-terminal solar cell nanodevice formed within a nanopore, as shown in FIG. 4, also capture energy. As shown in FIG. 4, the two-terminal solar cell nanodevice includes a first material 20, as a bottom semiconducting electrode, that can be disposed through a first distal end of the nanopore 10, extending along the inner walls to a second distal end of the nanopore 10. A second material 30, as a top semiconducting electrode, can be disposed through the first distal end of the nanopore 10, extending along the inner walls of the first material 20 to the second distal end of the nanopore 10. The first material 20 and the second material 30 can be concentrically disposed within the nanopore 10. In the solar cell nanodevice, the first material 20 includes a n-type semiconductor material, and the second material 30 includes a p-type semiconductor material, or vice versa. The first material 20 and the second material 30 provide the basic function of capturing solar energy and separating electron and hole charge in the pn junction solar cell nanodevice.
  • A depletion region 44 is formed at the interface between the two semiconductor layers, providing an electric field within the depletion region that separates the electron-hole pair created by photon (light) absorption. By suitable patterning of layers on the first distal end of the nanopore 10, a first electrical contact 50, as a bottom electrode contact, can be formed to provide electrical current to the first material 20, and a second electrical contact 60, as a top electrode contact, can be formed on the top surface of the AAO nanopore template 10 to provide electrical current to the second material 30.
  • The solar cell nanodevice can further include a first current collecting layer 80 formed between the AAO surface and the first material 20, and similarly a second current collecting layer 90 formed on an outer surface of the second material 30. First and second electrode current collection layers 80, 90 are preferred in many situations to improve efficiency with which electron and hole charge can be transported to first and second electrical contacts 50, 60. It should be noted that the second (top) electrode current collection layer 90 and the second electrical contact 60 should be transparent to solar radiation, enabling it to reach the depletion region 44. A variety of conducting materials satisfy this requirement, such as indium tin oxide and aluminum zinc oxide.
  • Accordingly, certain embodiments of the present invention can produce a favorable energy capture per unit volume and per unit weight in solar cell devices.
  • Embodiments of the invention for the solar cell nanodevice, as discussed above, provide advantages over conventional solar cell nanodevices. Because sunlight penetrates rather deeply into semiconducting materials (i.e., a significant fraction of a micrometer), the solar cell nanodevices, as discussed above, formed in deep (i.e., 1-10 micrometers) nanopores can efficiently absorb much of the solar radiation incident from above. Because the semiconducting layers are thin (i.e., enough to fit within the nanopores), the depletion regions can include a significant fraction of the layer thickness, so that a large fraction of electron-hole pairs created by light absorption can be separated to deliver useful currents. Depletion lengths can be increased by choosing lower doping (i.e., carrier concentration) levels of the semiconductors, while the resulting higher resistance of the semiconductor layers places a premium on using current collecting layers.
  • In accordance with another embodiment of the invention, the solar cell nanodevice, as shown in FIG. 4, can be formed as a Schottky barrier solar cell, rather than a pn junction. In this embodiment, one of the first material 20 and the second material 30, as semiconducting layers, is replaced by a metal layer, which forms a rectifying Schottky barrier to the other semiconductor layer. Schottky barriers, rather than ohmic contacts, are typically formed between transition metals and n-type semiconductors. The Schottky barrier contact to a semiconductor produces a depletion region 44 inside the semiconductor, where electron-hole charge separation can occur, essentially circumventing the need to fabricate two-terminal nanodevices with only one material at each distal end.
  • In another embodiment of the invention, the two-terminal nanodevices shown in FIGS. 2-4 may include first and second electrical contacts 50, 60 formed at opposite ends of the nanopore 10. For example, FIG. 5 shows a schematic of a two-terminal nanodevice in which contacts are provided at opposite ends of a nanopore, in accordance with an embodiment of the invention. The two-terminal capacitor nanodevice shown in FIG. 5 includes the same general configuration discussed above for the electrostatic capacitor nanodevice, as shown in FIG. 2, with the exception that the first electrical contact 50 is formed at the second distal end of the nanopore 10 (i.e., at the bottom of the nanopore 10), while the second electrical contact 60 is formed at the first distal end of the nanopore 10.
  • To form the two-sided contact arrangement, as shown in FIG. 5, the first material 20 must be exposed from the bottom side of the AAO nanopore 10 template. This requires removal of the bottom side of the AAO nanopore 10 template by wet or dry etching of the aluminum substrate 2 left under the nanopore 10, as shown in FIG. 1 e, a process that may be done in a pattern, so that a mechanical support structure of the remaining aluminum substrate 2 and the AAO 3 layer remain over larger distances. Also, as shown in FIG. 1 e, the AAO 3 layer at the bottom of the nanopore array 5 must be opened by similar etching or otherwise removed by modification of the AAO nanopore fabrication process.
  • With the first material 20 exposed at the bottom of the nanopore 10 template, the first electrical contact 50 can be provided below the AAO nanopore 10 template, as shown in FIG. 5. Depending on the process sequence chosen, the first electrical contact 5 may connect to the bottom of the first material 2 at the level of the bottom surface of the AAO nanopore 10, or it may penetrate into the AAO nanopore 10 to reach the first material 20 somewhat above the bottom surface of the AAO nanopore 10.
  • The two-sided contact structure, as shown in FIG. 5, can be achieved for other nanodevices, such as those depicted in FIGS. 2, 3 and 4, as discussed above, and in FIGS. 7, 8 and 9 to be discussed below. Having the electrical contacts 50, 60 for the two nanodevice terminals at opposite ends of the nanodevice offers advantages over conventional devices. For example, these two-terminal nanodevices enable nanodevice designs, such as those shown in FIGS. 7, 8 and 9, and provide process variations that provide a high degree of design flexibility in the structure of the nanodevices.
  • One benefit of the two-sided contact structure, in accordance with embodiments of the invention, is that the first electrical contact 50 can be provided at the bottom of the unfilled nanopore 10 and used as an electrode for ECD of materials into the nanopore 10. ECD can be used to deposit a wide range of materials, involves lower cost than ALD, and can be employed to produce different shapes of the ECD electrode, specifically as nanowires filling the nanopore 10, or as nanotubes from deposition against the nanopore 10 sidewall. As ECD begins at the electrode at the bottom of the open nanopore 10, its height within the pore can be controlled by the process time. Furthermore, multiple materials can be sequentially deposited or simultaneously co-deposited by ECD, providing a significant flexibility in achieving a variety of geometric and compositional shapes.
  • In this regard, ECD and ALD are complementary in offering design flexibility. While ECD proceeds from an electrode at the bottom of a nanopore 10, ALD grows from the top down into the nanopore 10 and does not require an electrode. ECD can often fully fill a high aspect ratio nanopore, but does not achieve highly uniform coverage on nanopore 10 sidewalls to the extent that ALD can. While ALD is more often employed to coat the entire surface area of the nanopore 10, precursor dose per cycle can be stopped below that needed, resulting in an ALD layer that coats the nanopore 10 surface only partway into the nanopore 10. In these conditions, suitable modification of ALD and ECD process recipes can provide a large variety of nanodevice design options, including uniform or graded thickness profiles extending partway or fully from either end of the nanopore 10.
  • FIG. 6 a shows a schematic of a metal-insulator-metal nanocapacitor fabricated by multiple atomic layer deposition steps in anodic oxide aluminum oxide nanopores to form an energy storage structure, in accordance with an embodiment of the invention. FIGS. 6 b and 6 c show scanning electron micrographs of the metal-insulator-metal nanocapacitor shown in FIG. 6 a, in accordance with an embodiment of the invention.
  • As shown in FIG. 6 a, anodic oxidation of aluminum 2 leads to formation of AAO 3 with deep pores on whose surfaces a sequence of ALD layers can be deposited to create a MIM device structure, as shown in FIGS. 2-4. The detailed structure of MIM layers is seen by scanning electron microscopy in FIGS. 6 b and 6 c for regions at the top and bottom of the nanopores 10, respectively. In this particular example, the pore diameter was 60 nm, the bottom TiN electrode thickness was 5.6 nm, the AAO dielectric thickness was 6.6 nm, and the top TiN electrode thickness was 12.6 nm, nearly filling the nanopore 10. It should be noted that layer thicknesses could be readily adjusted to fully fill the nanopore or instead to leave internal volume. The pore depth for the structures shown in FIGS. 6 a, 6 b and 6 c was 1 micrometer.
  • Embodiments of the invention further provide MIM nanocapacitor arrays for both 1 and 10 μm depths, forming capacitors whose macroscopic external contacts to the TiN ALD layers in the MIM structure were made above the nanopores 10 and to the underlying aluminum 1 below the nanopores 10. For example, capacitors with 0.01267 mm2 area (e.g., about 0.1 mm in diameter) connected approximately 106 nanocapacitor structures, like those shown in FIGS. 6 a, 6 b and 6 c, in parallel and indicated capacitance densities of about 10 and 100 μF/cm2, respectively. This corresponds to an energy density of order 0.7 W-h/kg, placing the performance of these devices well above the energy density of conventional electrostatic capacitors, while retaining comparable power. These nanodevices also provide energy density values that exceed those achieved using all prior microstructure and nanostructure approaches.
  • FIG. 6 d shows a schematic of an aggregation of an array of metal-insulator-metal nanocapacitors, as shown in FIG. 6 a, to form an energy storage device, in accordance with an embodiment of the invention. As shown in the scanning electron microscopy of FIG. 6 b, MIM trilayer structures from one nanodevice can connect continuously to each other over the top of the AAO material between nanopores. This means that a massive array, (i.e., billions of nanodevices over a few square inch area) are already connected in parallel. To define a suitable set of useful devices, this massive array is then partitioned into smaller devices for testing and use in energy applications, as will be discussed below.
  • For example, the electrostatic capacitor nanodevices, as shown in FIGS. 6 a to 6 c within a 125 micrometer diameter region may be wired in parallel to form an aggregate capacitor microdevice. The wiring scheme to create small capacitors is shown in FIG. 6 d. As shown in FIG. 6 d, a first electrical contact 50 is formed to the first material 20, as a common bottom electrode, of all the nanocapacitors, which are already wired together by their shared ALD bottom electrode layer. Furthermore, by patterning a second electrical contact 60 as a small dot (i.e., with a 125 micrometer diameter), this electrical contact connects only to the nanodevices underneath it, including about one million nanocapacitors (i.e., the MIM electrostatic nanocapacitor shown in FIG. 2). The resulting electrostatic capacitor, composed of a million nanodevices, can then be charged, discharged, tested and used by their first and second electrical contacts 50, 60. Over a massive array of such nanodevices, covering inches or more, many such capacitors can be made and further interconnected to form an electrostatic energy storage system.
  • This aggregation of nanodevices, accomplished with simple lithographic patterning of wires, is characteristic of how nanodevices and massive arrays made from them are used in accordance with embodiments of the invention. The extent of aggregation used to form such arrays, each of which may be regarded as analogous to a “chip”, depends on a variety of performance metrics sought, capabilities of the specific process and nanodevice technology, and regard for testability, yield and reliability. In turn, for massive levels of integration, the microdevices may be wired together to create systems, for example, on the scale of solar panels of order 1 meter in size. Analogous considerations for how this “macro” wiring is designed apply as identified for the microdevice level, as well as how many levels of aggregation and global wiring are used.
  • FIGS. 7 a and 7 b show a schematic of a two-terminal thermoelectric nanodevice formed within a nanopore, in accordance with an embodiment of the invention. The two-terminal thermoelectric nanodevice, as shown in FIGS. 7 a and 7 b, use a two-sided contact configuration, as shown in FIG. 5, and discussed above.
  • Electrical energy can be extracted from a thermoelectric material (e.g., bismuth telluride), when a temperature gradient exists between two positions in the material. As shown in FIGS. 7 a and 7 b, a thermoelectric material 100 is formed as a nanotube or a nanowire within a nanopore 10. The nanopore 10 initially includes AAO material (note: aluminum oxide has a low thermal conductivity). Metal contacts 110, 120 at the top and the bottom of the nanopore are connected electrically to the thermoelectric nanotube or nanowire 100. If the top metal contact layer 110 is placed in thermal contact with a gas, liquid or solid at elevated temperature T1, while the bottom metal contact layer 120 remains at a lower temperature T2, a voltage is generated between the metal contacts 110, 120 to generate power. Once formed, the AAO material may be removed in some locations, or replaced by another insulating material with an even lower thermal conductivity, so that higher thermal gradients and thermoelectric power can be attained.
  • These thermoelectric nanodevices, as shown in FIGS. 7 a and 7 b, may be arranged in an array, as shown in FIG. 7 c. FIG. 7 c shows a schematic of an aggregation of an array of thermoelectric nanodevices, as shown in FIG. 7 a or 7 b, to form an energy storage device, in accordance with an embodiment of the invention. A thermoelectric energy harvesting system, as shown in FIG. 7 c, may be employed, for example, to harness excess heat from an engine by contacting the metal contact layer 110 to the engine, while keeping metal contact layer 120 cooled to a lower, ambient temperature (i.e., with air cooling). A low thermal conductivity insulator 130 (e.g., AAO, polymer, porous or air) may be formed at the ends of the thermoelectric energy storage device to insulate energy from escaping the sides of the device.
  • Thus, in accordance with an embodiment of the invention, a two-terminal thermoelectric nanodevice can serve as the basis for other applications, such as a thermoelectric imaging device. In this case the top metal contact layer 110 can be patterned to form an array of pixels, with image information read out as voltages of the top electrode pixels in comparison to the voltage at the bottom metal contact layer 120. The pixels may be coated by other material to optimize absorption and consequent heating by the radiation, as in an infrared imaging application.
  • In accordance with another embodiment of the invention, an analogous application involves use of piezoelectric material instead of thermoelectric material in a two-terminal nanodevice configured similarly to the nanodevice shown in FIG. 7 c. Mechanical forces applied between the top metal contact 110 and the bottom metal contact 120 layers will generate electrical voltages between these layers if they are connected by piezoelectric nanotubes or nanowires, for example to harvest mechanical energy from vibration or pressure as electrical energy.
  • FIG. 8 shows a schematic of a two-terminal nanodevice array disposed to sense chemicals or biochemicals in gaseous or liquid form, in accordance with an embodiment of the invention. As shown in FIG. 8, a sensor material is deposited as nanotubes inside the nanopores. In thin film form, these materials (e.g., tin oxide) have properties that exhibit resistivity changes upon exposure to chemicals (e.g., organic vapors, such as alcohols).
  • According to an embodiment of the invention, this two-terminal nanodevice array, as shown in FIG. 8, is formed by coating a nanopore 10 and perhaps other surfaces of an AAO membrane 3 with chemical sensing films 140. Metal contacts 50 and 60 are formed at opposite ends of the nanopores to measure resistance of the sensor films during exposure to analytes in gaseous or liquid form. The metal contact structures 50, 60 are shaped such that they do not substantially cover or close the nanopore regions at either end, allowing gas or liquid flow through the nanopores. By sealing the sensing array to a sealing structure 150, which separates a higher pressure chamber 160 from a lower pressure chamber 170 in a pressure controlled vessel 180, gas or liquid from the former is forced to flow through the nanopores 10. As adsorption, absorption, or reaction of species from the gasous or liquid analyte happens on the sensor material 140, resistance change is measure between metal contacts 50, 60.
  • While the electrochemical nanodevice, as shown in FIG. 3, is nominally restricted to use of electrolytes in solid, gel or polymer form, the two-terminal electrochemical nanodevice, as shown in FIG. 9 a, is compatible with liquid electrolytes. Either aqueous or organic, liquid electrolytes are by far the most common in battery and supercapacitor systems. In this case, current collecting layers and electrochemical materials together form electrodes at each end of AAO nanopores, with a separation region 150 between them where no material is deposited on top of the insulating sidewall of the AAO nanopore. The energy storage device, as shown in FIG. 9 b, includes a cell 160 composed of a nanodevice array that includes a plurality of two-terminal electrochemical nanodevices, as shown in FIG. 9 a, configured as a top cell electrode 170 and a bottom cell electrode 180. The energy storage device further includes a top wiring contact 190 and a bottom wiring contact 200.
  • In accordance with an embodiment of the invention, this structure is formed using ALD for its ability to deposit into high aspect ratio nanopores, while limiting penetration by judicious choice of precursor dose per cycle, as stated above. A representative process sequence to fabricate the electrochemical nanodevice array shown in FIGS. 9 a and 9 b is as follows. First, a top contact wiring pattern is formed on top of the AAO membrane to provide structural rigidity for the membrane. Then ALD is used to deposit a current collecting layer part way into the top of the nanopores, followed by ALD and/or ECD to deposit the electrochemically active charge storage material (e.g., metal oxide) over the current collecting layer. This forms a top nanoelectrode array. The underlying aluminum and AAO material on the bottom side are then patterned and etched to expose the bottom of the nanopores in a patterned region. A bottom nanoelectrode array is then formed from the exposed bottom opening of the nanopores, using ALD and/or ECD as for the top nanoelectrodes. With each nanopore in the active region now containing a top and bottom nanoelectrode separated by a distance that is a fraction of the nanopore length, the entire structure is immersed in liquid electrolyte, thus activating its function as an electrochemical energy storage device.
  • The two-terminal nanodevices, as discussed above reflect both energy storage and capture. According to embodiments of the invention, the nanodevices, as discussed above, can be combined to form multilayer nanodevice arrays vertically stacked or horizontally located. Hybrid systems capable of both storage and capture are highly desirable for applications of renewable sources (e.g., storing solar energy captured during daytime for use at night), as well as for other hybrid energy systems (e.g., high power supercapacitors and high energy batteries). In such cases, power management is essential and best integrated on the same nanodevice technology platform. The nanodevices discussed above can serve as power management components as well. Conducting nanowires can be circuit connections (or in proper geometry as inductors), electrostatic capacitors can serve as storage elements, pn junctions can perform as diodes, and Schottky barrier junctions as Schottky or ohmic contacts. The solar cell nanodevices can also function as light detectors or light emitting diodes for optoelectronic functionality.
  • FIG. 10 shows a series of steps for a process for creating a vertical two-terminal nanotube device, in accordance with an embodiment of the invention.
  • As discussed above, an ordered array of nanopores 10 in an aluminum layer can be formed using the process shown in FIGS. 1 c-1 e (step 200). According to an embodiment of the invention, as shown in FIG. 10, a first material 20 is deposited into an AAO nanopore 10 using a sequence of ALD deposition steps. The first material 20 is deposited into a first distal end of the nanopore 10, so that it extends toward a second distal end of the nanopore 10 along inner walls of the nanopore 10 (step 210). A second material 30 is deposited into the first distal end of the nanopore 10, so that it extends toward the second distal end of the nanopore 10 within the first material 20 (step 220).
  • The method includes depositing a third material into the first distal end of the nanopore 10, so that it extends toward the second distal end of the nanopore 10 between the first material 20 and the second material 30 (step 230). As will be understood by a person of ordinary skill in the relevant art, the third material is deposited during the sequential deposit of the first and second material, so that the first material is deposited, followed by the third material and then the second material. In accordance with some embodiments, the third material may include one of an electrical insulator and an electrolyte. Whereas, in other embodiments, the third material may not be needed, for example, in the case where a plurality of sequentially formed layers are deposited to form the nanodevice.
  • The method includes disposing and connecting a first wiring material 50 to an exposed end of the first material 20, and disposing and connecting a second wiring material 60 to an exposed end of the second material 30 (step 240). The first wiring material 50 and the second wiring material may both be connected on a top surface of the nanopore 10, or may be connected on a top surface and a bottom surface of the nanopore 10, respectively. The method of connecting the first wiring material 50 and the second wiring material 60 may include connecting a plurality of nanopores 10 in parallel.
  • Either the first or second materials 20, 30 can be replaced with two or more materials to achieve different device behavior and performance. For example, different materials can be used to create the electrostatic capacitor nanodevice, shown in FIG. 2, and different materials can be used to create the electrochemical nanodevice, shown in FIG. 3.
  • While high conformality and control of ALD makes it attractive for forming first and second materials 20, 30 in the AAO nanopores 10, other processes, such as ECD, CVD, and sol-gel processes can be useful for some of the process steps to introduce materials into the nanopores 10.
  • The choice of materials and deposition processes can depend significantly on the device type to be created. For the two-terminal nanotube capacitor nanodevice, as shown in FIG. 2, ALD is a preferred deposition process for introducing the first and second materials 20, 30, in order to achieve uniform deposition within the nanopore 10. Whereas, a conventional physical vapor deposition (e.g., evaporation or sputtering) may be a preferred process to deposit the first and second wiring materials 50, 60, to electrically connect a massive array of nanodevices
  • For the electrochemical nanodevice, as shown in FIG. 3, ECD may be a preferred process to deposit the first material 20 if a current collecting layer is already in place and can be contacted to define its voltage during ECD of the first material 20, as a bottom electrode. If inorganic, the electrolyte layer 42, as shown in FIG. 3, may be deposited by sol-gel processes and by ALD. ALD processes are also known for some polymer systems that could include a polymer electrolyte.
  • Various electron donor and acceptor materials can be chosen for the first and second semiconductor materials 20, 30. Either donor or acceptor material, or n-type or p-type semiconductor material, can be chosen as the first material, to be deposited by ALD as a first material in a first distal end of each nanopore. Semiconducting materials can be, for example, zinc oxide (ZnO) (either n-type or p-type), titanium oxide (TiO2) (n-type), copper oxide-nickel oxide (Cu2O—NiO) (p-type), and vanadium oxide (V2O5).
  • It is to be understood that in an embodiment of the present invention, the steps are performed in the sequence and manner as shown although the order of some steps and the like can be changed without departing from the spirit and scope of the present invention. In addition, the process sequence described in FIG. 10 can be repeated as many times as needed. Variations of the process sequence described in FIG. 10 can also use different materials and processes.
  • The many features of the invention are apparent from the detailed specification and, thus, it is intended by the appended claims to cover all such features of the invention which fall within the true spirit and scope of the invention. Further, since numerous modifications and changes will readily occur to a person of ordinary skill in the relevant art, it is not desired to limit the invention to the exact construction and operation illustrated and described, and accordingly all suitable modifications and equivalents can be resorted to, falling within the scope of the invention.

Claims (34)

1. A vertical nanotube device, comprising:
a column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material;
a first material disposed within the column;
a second material disposed within the column; and
a third material disposed between the first material and the second material,
wherein the first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column,
wherein the second material fills the first distal end of the column and extends to the second distal end of the column within the first material, and
wherein both the first material and the second material are exposed at the first distal end of the column.
2. The vertical nanotube device of claim 1, wherein the first material and the second material are concentrically disposed within the column.
3. The vertical nanotube device of claim 1, further comprising:
a first wiring structure operatively connected to an exposed end of the first material; and
a second wiring structure operatively connected to an exposed end of the second material,
wherein the first and the second wiring structures are configured on a top surface of the column.
4. The vertical nanotube device of claim 1, wherein the third material comprises one of an electrical insulator and an electrolyte.
5. The vertical nanotube device of claim 1, wherein the vertical nanotube device comprises one of an electrostatic capacitor, a battery, a supercapacitor, a solar cell, a light emitting diode and a laser.
6. The vertical nanotube device of claim 1, wherein the first material and the second material are electrically conducting.
7. The vertical nanotube device of claim 1, wherein one of the first material and the second material comprises an electron donating material, and wherein the other of the first material and the second material comprises an electron accepting material.
8. The vertical nanotube device of claim 1, wherein the anodic oxide material is selected from the group consisting of aluminum oxide, titanium oxide, silicon, or a dielectric material.
9. The vertical nanotube device of claim 1, further comprising:
a passivation layer disposed on a surface between the anodic oxide material and the first material.
10. The vertical nanotube device of claim 1, further comprising:
a first conductive layer disposed between the anodic oxide material and the first material; and
a second conductive layer disposed on an outer surface of the second material.
11. The vertical nanotube device of claim 10, wherein the first conductive layer and the second conductive layer each comprise a material selected from the group consisting of a metal, such as aluminum, copper, titanium, or a conducting compound, such as indium-tin-oxide.
12. The vertical nanotube device of claim 1, wherein one of the first material and the second material comprises an n-type semiconductor material, and wherein the other of the first material and the second material comprises a p-type semiconductor material.
13. The vertical nanotube device of claim 1, wherein the anodic oxide material comprises a rectangular patterned area disposed on the substrate.
14. The vertical nanotube device of claim 4, wherein the electrolyte comprises one of a solid, gel or polymer electrolyte.
15. The vertical nanotube device of claim 4, wherein the first material and the second material each comprise a material selected from the group consisting of a metal oxide, carbon and silicon.
16. The vertical nanotube device of claim 1, wherein one of the first material and the second material comprises a metal layer, and wherein the other of the first material and the second material comprises a semiconductor material.
17. The vertical nanotube device of claim 16, wherein the vertical nanotube device comprises a Schottky barrier.
18. A vertical nanotube device, comprising:
a column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material;
a first material disposed within the column;
a second material disposed within the column; and
a third material disposed between the first material and the second material,
wherein the first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column,
wherein the second material fills the first distal end of the column and extends to the second distal end of the column within the first material, and
wherein the first material is exposed at the first distal end of the column, and the second material is exposed at the second distal end of the column.
19. The vertical nanotube device of claim 18, further comprising:
a first wiring structure operatively connected to an exposed end of the first material; and
a second wiring structure operatively connected to an exposed end of the second material,
wherein the first and the second wiring structures are configured on a top surface and a bottom surface of the column, respectively.
20. The vertical nanotube device of claim 19, further comprising:
an electrical insulator disposed around the column.
21. The vertical nanotube device of claim 20, wherein the first wiring structure comprises a metal material at a first temperature, and the second wiring structure comprises a metal material at a second temperature, wherein the first temperature is greater than the second temperature.
22. A vertical nanotube device, comprising:
a plurality of columns, each column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material;
a first material disposed within the column;
a second material disposed within the column; and
a third material disposed between the first material and the second material,
wherein the first material fills the first distal end of the column and extends to the second distal end of the column along inner walls of the column,
wherein the second material fills the first distal end of the column and extends to the second distal end of the column within the first material,
wherein the first material is exposed at the first distal end of the column, and the second material is exposed at the second distal end of the column, and
wherein the plurality of columns are connected in parallel by a first wiring structure operatively connected to an exposed end of the first material, and a second wiring structure operatively connected to an exposed end of the second material, wherein the first and the second wiring structures are configured on a top surface and a bottom surface of the column, respectively.
23. A vertical nanotube device, comprising:
a pressure-controlled vessel, comprising
a plurality of columns, each column disposed in an anodic oxide material extending from a first distal end of the anodic oxide material to a second distal end of the anodic oxide material;
a material disposed within the column, wherein the material comprises a chemical sensing film;
a first wiring structure operatively connected to a top surface of the plurality of columns;
a second wiring structure operatively connected to a bottom surface of the plurality of columns,
wherein the first and the second wiring structures are configured on a top surface and a bottom surface of the column, respectively,
wherein the pressure-controlled vessel is configured to allow a gas or liquid to flow through the plurality of columns, and
wherein the first and second wiring structures are configured to measure a resistance change based on an adsorption, absorption or reaction of species from the gas or liquid on the material.
24. The vertical nanotube device of claim 23, wherein the pressure-controlled vessel is configured to allow the gas or liquid to flow from a point of higher pressure to a point of lower pressure across the plurality of columns.
25. A method, comprising:
forming a columnar pore in an exposed portion of a material layer;
depositing a first material into a first distal end of the columnar pore; and
depositing a second material into the first distal end of the columnar pore,
wherein the depositing the first material comprises filling the first distal end of the columnar pore with the first material so that the first material extends to the second distal end of the columnar pore along inner walls of the columnar pore, and
wherein the depositing the second material comprises filling the first distal end of the columnar pore with the second material, so that the second material extends to the second distal end of the columnar pore within the first material.
26. The method of claim 25, further comprising:
connecting a first wiring structure to an exposed end of the first material; and
connecting a second wiring structure to an exposed end of the second material,
wherein the first and second wiring structures are connected on a top surface of the columnar pore.
27. The method of claim 25, wherein the forming comprises performing an anodic etching to form aluminum oxide.
28. The method of claim 25, further comprising:
depositing a third material into the first distal end of the columnar pore.
29. The method of claim 28, wherein the depositing the third material comprises depositing the third material comprising an insulating material between the first material and the second material.
30. The method of claim 25, further comprising:
exposing the first material at the first distal end of the columnar pore; and
exposing the second material at the second distal end of the columnar pore.
31. The method of claim 30, further comprising:
connecting a first wiring structure to an exposed end of the first material; and
connecting a second wiring structure to an exposed end of the second material,
wherein the first and second wiring structures are connected on a top surface and a bottom surface of the columnar pore, respectively.
32. The method of claim 25, wherein the depositing the first material and the second material comprises concentrically disposing the first material and the second material within the columnar pore.
33. The method of claim 25, wherein the depositing the first material and the second material comprises one of an atomic layer deposition process, a chemical vapor deposition process, an electrochemical deposition process or a sol-gel process.
34. The method of claim 26, wherein the connecting the first and second wiring structures comprises connecting a plurality of columnar pores in parallel.
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Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8350360B1 (en) 2009-08-28 2013-01-08 Lockheed Martin Corporation Four-terminal carbon nanotube capacitors
EP2562851A1 (en) * 2011-08-23 2013-02-27 Mustafa K. Ürgen Method for producing an electrode material comprising nanowires
US8405189B1 (en) * 2010-02-08 2013-03-26 Lockheed Martin Corporation Carbon nanotube (CNT) capacitors and devices integrated with CNT capacitors
US20140217473A1 (en) * 2011-06-29 2014-08-07 Waqas Khalid Device comprising nanostructures and method of manufacturing thereof
DE102013104396A1 (en) * 2013-04-30 2014-10-30 Deutsches Zentrum für Luft- und Raumfahrt e.V. Electrochemical storage device
US8912522B2 (en) * 2009-08-26 2014-12-16 University Of Maryland Nanodevice arrays for electrical energy storage, capture and management and method for their formation
WO2014165247A3 (en) * 2013-03-12 2015-01-22 Invensas Corporation Capacitors comprising pores in an aluminium substrate
JP2015028425A (en) * 2013-07-30 2015-02-12 俊 保坂 Semiconductor sensor device and method of manufacturing the same
FR3012664A1 (en) * 2013-10-29 2015-05-01 Ipdia STRUCTURE WITH IMPROVED CAPACITY
US20150200058A1 (en) * 2009-08-26 2015-07-16 University Of Maryland Nanodevice arrays for electrical energy storage, capture and management and method for their formation
CN104798152A (en) * 2012-12-28 2015-07-22 英特尔公司 Energy storage devices formed with porous silicon
WO2015160412A3 (en) * 2014-01-24 2015-12-10 The Regents Of The University Of Colorado Novel methods of preparing nanodevices
US9349789B1 (en) 2014-12-09 2016-05-24 International Business Machines Corporation Coaxial carbon nanotube capacitor for eDRAM
WO2016185002A1 (en) 2015-05-20 2016-11-24 Deutsches Zentrum für Luft- und Raumfahrt e.V. Supercapacitors with oriented carbon nanotubes and method for producing them
US20170332179A1 (en) * 2016-05-16 2017-11-16 The Regents Of The University Of Colorado, A Body Corporate Thermal and thermoacoustic nanodevices and methods of making and using same
CN107533918A (en) * 2015-05-12 2018-01-02 株式会社村田制作所 Capacitor and its manufacture method
US20190088419A1 (en) * 2017-09-21 2019-03-21 Samsung Electro-Mechanics Co., Ltd. Capacitor component
EP3567645A1 (en) * 2018-05-11 2019-11-13 Murata Manufacturing Co., Ltd. Porous region structure and method of manufacture thereof
EP3570307A1 (en) * 2018-05-18 2019-11-20 Murata Manufacturing Co., Ltd. Integrated energy storage component
CN110931263A (en) * 2019-11-21 2020-03-27 杭州电子科技大学 Super capacitor electrode structure and reinforcing method
CN112119512A (en) * 2018-05-11 2020-12-22 株式会社村田制作所 Porous region structure and method for producing same
CN112151539A (en) * 2020-09-10 2020-12-29 复旦大学 High-storage-capacity nano-capacitor three-dimensional integrated structure and preparation method thereof
CN112151536A (en) * 2020-08-17 2020-12-29 复旦大学 Three-dimensional integrated structure of nano capacitor and preparation method thereof
CN112151537A (en) * 2020-09-10 2020-12-29 复旦大学 High-energy-density nano-capacitor three-dimensional integrated structure and preparation method thereof
CN112201655A (en) * 2020-09-10 2021-01-08 复旦大学 Three-dimensional integrated structure of nano capacitor and manufacturing method thereof
US20210032766A1 (en) * 2018-04-20 2021-02-04 Murata Manufacturing Co., Ltd. Semiconductor device having porous region embedded structure and method of manufacture thereof
EP3796351A1 (en) * 2019-09-17 2021-03-24 Murata Manufacturing Co., Ltd. Low defect high capacitance thin solid electrolyte capacitor and method of fabrication thereof
CN113215632A (en) * 2020-02-06 2021-08-06 普因特工程有限公司 Anodic oxide film structure
US11115010B1 (en) * 2018-05-15 2021-09-07 University Of Maryland, College Park Energy loaded dielectrics, systems including energy loaded dielectrics, and methods for fabrication and use thereof
CN114556507A (en) * 2019-09-17 2022-05-27 株式会社村田制作所 Low defect high capacitance thin solid electrolyte capacitor and method of making same
US20230040335A1 (en) * 2021-08-05 2023-02-09 Samsung Electronics Co., Ltd. Semiconductor device, array structure of semiconductor devices, neuromorphic circuit including the semiconductor devices, and computing apparatus including the neuromorphic circuit

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9406888B2 (en) * 2013-08-07 2016-08-02 GlobalFoundries, Inc. Carbon nanotube device
US9838782B2 (en) 2015-03-30 2017-12-05 Bose Corporation Adaptive mixing of sub-band signals
US10480729B2 (en) 2017-05-31 2019-11-19 At&T Intellectual Property I, L.P. Self-powered squeezed-light temperature regulation device
EP3428955A1 (en) * 2017-07-10 2019-01-16 Murata Manufacturing Co., Ltd. Substrates employing surface-area amplification, for use in fabricating capacitive elements and other devices
US12094721B2 (en) 2018-01-05 2024-09-17 University Of Maryland, College Park Multi-layer solid-state devices and methods for forming the same
WO2020162459A1 (en) 2019-02-04 2020-08-13 Murata Manufacturing Co., Ltd. Capacitor
KR20230091307A (en) 2021-12-16 2023-06-23 삼성전기주식회사 Capacitor Component

Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866444A (en) * 1995-03-21 1999-02-02 Semiconductor Energy Laboratory Co. Integrated circuit and method of fabricating the same
US6075691A (en) * 1997-03-06 2000-06-13 Lucent Technologies Inc. Thin film capacitors and process for making them
US20010023986A1 (en) * 2000-02-07 2001-09-27 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
US6320244B1 (en) * 1999-01-12 2001-11-20 Agere Systems Guardian Corp. Integrated circuit device having dual damascene capacitor
US6323084B1 (en) * 1998-06-09 2001-11-27 Samsung Electronics Co., Ltd. Semiconductor device capacitor and method of manufacturing the same
US6329234B1 (en) * 2000-07-24 2001-12-11 Taiwan Semiconductor Manufactuirng Company Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow
US6341056B1 (en) * 2000-05-17 2002-01-22 Lsi Logic Corporation Capacitor with multiple-component dielectric and method of fabricating same
US6344413B1 (en) * 1997-12-22 2002-02-05 Motorola Inc. Method for forming a semiconductor device
US6352893B1 (en) * 1999-06-03 2002-03-05 Infineon Technologies Ag Low temperature self-aligned collar formation
US6373087B1 (en) * 2000-08-31 2002-04-16 Agere Systems Guardian Corp. Methods of fabricating a metal-oxide-metal capacitor and associated apparatuses
US6461528B1 (en) * 1999-10-29 2002-10-08 California Institute Of Technology Method of fabricating lateral nanopores, directed pore growth and pore interconnects and filter devices using the same
US20020176989A1 (en) * 2001-04-16 2002-11-28 Knudsen Philip D. Dielectric laminate for a capacitor
US20030139017A1 (en) * 2001-12-31 2003-07-24 Jong-Bum Park Method for fabricating capacitors
US20040113235A1 (en) * 2002-12-13 2004-06-17 International Business Machines Corporation Damascene integration scheme for developing metal-insulator-metal capacitors
US20050032297A1 (en) * 2002-05-22 2005-02-10 Kamins Theodore I. Field effect transistor fabrication including formation of a channel in a pore
US6891191B2 (en) * 2003-09-02 2005-05-10 Organic Vision Inc. Organic semiconductor devices and methods of fabrication
US20050121068A1 (en) * 2002-06-22 2005-06-09 Nanosolar, Inc. Photovoltaic devices fabricated by growth from porous template
US20050161662A1 (en) * 2001-03-30 2005-07-28 Arun Majumdar Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
US20050274992A1 (en) * 2004-05-25 2005-12-15 Joerg Appenzeller Method of fabricating a tunneling nanotube field effect transistor
US7045205B1 (en) * 2004-02-19 2006-05-16 Nanosolar, Inc. Device based on coated nanoporous structure
US7229909B2 (en) * 2004-12-09 2007-06-12 International Business Machines Corporation Integrated circuit chip utilizing dielectric layer having oriented cylindrical voids formed from carbon nanotubes
US20070134555A1 (en) * 2001-11-30 2007-06-14 The Trustees Of Boston College Coated carbon nanotube array electrodes
US20070275487A1 (en) * 2003-10-10 2007-11-29 General Electric Company Free-standing electrostatically-doped carbon nanotube device and method for making same
US20080132055A1 (en) * 2004-11-04 2008-06-05 International Business Machines Corporation Hardmask for improved reliability of silicon based dielectrics
US20080179590A1 (en) * 2000-02-07 2008-07-31 Vladimir Mancevski Logic devices comprising carbon nanotube patterns
US20080277646A1 (en) * 2005-03-28 2008-11-13 Samsung Electronics Co., Ltd. Vertical Type Nanotube Semiconductor Device
US20090014767A1 (en) * 2003-12-18 2009-01-15 International Business Machines Corporation Carbon nanotube conductor for trench capacitors
US20090108252A1 (en) * 2007-09-27 2009-04-30 University Of Maryland Lateral two-terminal nanotube devices and method for their formation
US7576410B2 (en) * 2005-09-28 2009-08-18 Infineon Technologies Ag Power transistor
US20100304204A1 (en) * 2009-05-01 2010-12-02 Synkera Technologies, Inc. Energy conversion and energy storage devices and methods for making same
US20100314682A1 (en) * 2009-06-12 2010-12-16 Hamza Yilmaz Configurations and methods for manufacturing devices with trench-oxide-nano-tube super-junctions
US7898658B2 (en) * 2007-01-23 2011-03-01 The Regents Of The University Of California Platform for chemical and biological sensing by surface-enhanced Raman spectroscopy
US20110086507A1 (en) * 2008-05-02 2011-04-14 Imec Method for providing oxide layers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8912522B2 (en) * 2009-08-26 2014-12-16 University Of Maryland Nanodevice arrays for electrical energy storage, capture and management and method for their formation

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866444A (en) * 1995-03-21 1999-02-02 Semiconductor Energy Laboratory Co. Integrated circuit and method of fabricating the same
US6075691A (en) * 1997-03-06 2000-06-13 Lucent Technologies Inc. Thin film capacitors and process for making them
US6344413B1 (en) * 1997-12-22 2002-02-05 Motorola Inc. Method for forming a semiconductor device
US6323084B1 (en) * 1998-06-09 2001-11-27 Samsung Electronics Co., Ltd. Semiconductor device capacitor and method of manufacturing the same
US6320244B1 (en) * 1999-01-12 2001-11-20 Agere Systems Guardian Corp. Integrated circuit device having dual damascene capacitor
US6352893B1 (en) * 1999-06-03 2002-03-05 Infineon Technologies Ag Low temperature self-aligned collar formation
US6461528B1 (en) * 1999-10-29 2002-10-08 California Institute Of Technology Method of fabricating lateral nanopores, directed pore growth and pore interconnects and filter devices using the same
US20010023986A1 (en) * 2000-02-07 2001-09-27 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
US20080179590A1 (en) * 2000-02-07 2008-07-31 Vladimir Mancevski Logic devices comprising carbon nanotube patterns
US6341056B1 (en) * 2000-05-17 2002-01-22 Lsi Logic Corporation Capacitor with multiple-component dielectric and method of fabricating same
US6329234B1 (en) * 2000-07-24 2001-12-11 Taiwan Semiconductor Manufactuirng Company Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow
US6373087B1 (en) * 2000-08-31 2002-04-16 Agere Systems Guardian Corp. Methods of fabricating a metal-oxide-metal capacitor and associated apparatuses
US20050161662A1 (en) * 2001-03-30 2005-07-28 Arun Majumdar Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
US20020176989A1 (en) * 2001-04-16 2002-11-28 Knudsen Philip D. Dielectric laminate for a capacitor
US20070134555A1 (en) * 2001-11-30 2007-06-14 The Trustees Of Boston College Coated carbon nanotube array electrodes
US20030139017A1 (en) * 2001-12-31 2003-07-24 Jong-Bum Park Method for fabricating capacitors
US20050032297A1 (en) * 2002-05-22 2005-02-10 Kamins Theodore I. Field effect transistor fabrication including formation of a channel in a pore
US20050121068A1 (en) * 2002-06-22 2005-06-09 Nanosolar, Inc. Photovoltaic devices fabricated by growth from porous template
US20040113235A1 (en) * 2002-12-13 2004-06-17 International Business Machines Corporation Damascene integration scheme for developing metal-insulator-metal capacitors
US6992344B2 (en) * 2002-12-13 2006-01-31 International Business Machines Corporation Damascene integration scheme for developing metal-insulator-metal capacitors
US6891191B2 (en) * 2003-09-02 2005-05-10 Organic Vision Inc. Organic semiconductor devices and methods of fabrication
US20070275487A1 (en) * 2003-10-10 2007-11-29 General Electric Company Free-standing electrostatically-doped carbon nanotube device and method for making same
US20090014767A1 (en) * 2003-12-18 2009-01-15 International Business Machines Corporation Carbon nanotube conductor for trench capacitors
US7932549B2 (en) * 2003-12-18 2011-04-26 International Business Machines Corporation Carbon nanotube conductor for trench capacitors
US7045205B1 (en) * 2004-02-19 2006-05-16 Nanosolar, Inc. Device based on coated nanoporous structure
US20050274992A1 (en) * 2004-05-25 2005-12-15 Joerg Appenzeller Method of fabricating a tunneling nanotube field effect transistor
US20080132055A1 (en) * 2004-11-04 2008-06-05 International Business Machines Corporation Hardmask for improved reliability of silicon based dielectrics
US7229909B2 (en) * 2004-12-09 2007-06-12 International Business Machines Corporation Integrated circuit chip utilizing dielectric layer having oriented cylindrical voids formed from carbon nanotubes
US20080277646A1 (en) * 2005-03-28 2008-11-13 Samsung Electronics Co., Ltd. Vertical Type Nanotube Semiconductor Device
US7576410B2 (en) * 2005-09-28 2009-08-18 Infineon Technologies Ag Power transistor
US7898658B2 (en) * 2007-01-23 2011-03-01 The Regents Of The University Of California Platform for chemical and biological sensing by surface-enhanced Raman spectroscopy
US20090108252A1 (en) * 2007-09-27 2009-04-30 University Of Maryland Lateral two-terminal nanotube devices and method for their formation
US8378333B2 (en) * 2007-09-27 2013-02-19 University Of Maryland Lateral two-terminal nanotube devices and method for their formation
US20110086507A1 (en) * 2008-05-02 2011-04-14 Imec Method for providing oxide layers
US20100304204A1 (en) * 2009-05-01 2010-12-02 Synkera Technologies, Inc. Energy conversion and energy storage devices and methods for making same
US20100314682A1 (en) * 2009-06-12 2010-12-16 Hamza Yilmaz Configurations and methods for manufacturing devices with trench-oxide-nano-tube super-junctions

Cited By (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150200058A1 (en) * 2009-08-26 2015-07-16 University Of Maryland Nanodevice arrays for electrical energy storage, capture and management and method for their formation
US10032569B2 (en) * 2009-08-26 2018-07-24 University Of Maryland, College Park Nanodevice arrays for electrical energy storage, capture and management and method for their formation
US8912522B2 (en) * 2009-08-26 2014-12-16 University Of Maryland Nanodevice arrays for electrical energy storage, capture and management and method for their formation
US8350360B1 (en) 2009-08-28 2013-01-08 Lockheed Martin Corporation Four-terminal carbon nanotube capacitors
US8405189B1 (en) * 2010-02-08 2013-03-26 Lockheed Martin Corporation Carbon nanotube (CNT) capacitors and devices integrated with CNT capacitors
US20140217473A1 (en) * 2011-06-29 2014-08-07 Waqas Khalid Device comprising nanostructures and method of manufacturing thereof
US10141261B2 (en) * 2011-06-29 2018-11-27 Waqas Khalid Device comprising nanostructures and method of manufacturing thereof
WO2013026892A1 (en) 2011-08-23 2013-02-28 Uergen Mustafa K Method for producing an electrode material comprising nanowires
EP2562851A1 (en) * 2011-08-23 2013-02-27 Mustafa K. Ürgen Method for producing an electrode material comprising nanowires
US9466662B2 (en) 2012-12-28 2016-10-11 Intel Corporation Energy storage devices formed with porous silicon
CN104798152A (en) * 2012-12-28 2015-07-22 英特尔公司 Energy storage devices formed with porous silicon
US10147548B2 (en) 2013-03-12 2018-12-04 Invensas Corporation Capacitors using porous alumina structures
WO2014165247A3 (en) * 2013-03-12 2015-01-22 Invensas Corporation Capacitors comprising pores in an aluminium substrate
US9076594B2 (en) 2013-03-12 2015-07-07 Invensas Corporation Capacitors using porous alumina structures
DE102013104396A1 (en) * 2013-04-30 2014-10-30 Deutsches Zentrum für Luft- und Raumfahrt e.V. Electrochemical storage device
JP2015028425A (en) * 2013-07-30 2015-02-12 俊 保坂 Semiconductor sensor device and method of manufacturing the same
WO2015063420A1 (en) * 2013-10-29 2015-05-07 Ipdia Structure with an improved capacitor
CN105706234A (en) * 2013-10-29 2016-06-22 Ipdia公司 Structure with an improved capacitor
FR3012664A1 (en) * 2013-10-29 2015-05-01 Ipdia STRUCTURE WITH IMPROVED CAPACITY
JP2016535441A (en) * 2013-10-29 2016-11-10 アイピーディーアイエイ Structure with improved capacitor
TWI689071B (en) * 2013-10-29 2020-03-21 法商村田整合被動式解決方案公司 Structure with improved capacitance
US10497582B2 (en) 2013-10-29 2019-12-03 Murata Integrated Passive Solutions Capacitor formed in insulated pores of an anodized metal layer
WO2015160412A3 (en) * 2014-01-24 2015-12-10 The Regents Of The University Of Colorado Novel methods of preparing nanodevices
US9919921B2 (en) 2014-01-24 2018-03-20 The Regents Of The University Of Colorado, A Body Corporate Methods of preparing nanodevices
US9595527B2 (en) 2014-12-09 2017-03-14 International Business Machines Corporation Coaxial carbon nanotube capacitor for eDRAM
US9349789B1 (en) 2014-12-09 2016-05-24 International Business Machines Corporation Coaxial carbon nanotube capacitor for eDRAM
CN107533918A (en) * 2015-05-12 2018-01-02 株式会社村田制作所 Capacitor and its manufacture method
EP3297008A4 (en) * 2015-05-12 2018-11-21 Murata Manufacturing Co., Ltd. Capacitor and method for manufacturing same
DE102015107982A1 (en) 2015-05-20 2016-11-24 Deutsches Zentrum für Luft- und Raumfahrt e.V. Supercapacitors with oriented carbon nanotubes and process for their preparation
DE102015107982B4 (en) 2015-05-20 2021-12-09 Deutsches Zentrum für Luft- und Raumfahrt e.V. Process for the production of supercapacitors with aligned carbon nanotubes
WO2016185002A1 (en) 2015-05-20 2016-11-24 Deutsches Zentrum für Luft- und Raumfahrt e.V. Supercapacitors with oriented carbon nanotubes and method for producing them
US10510494B2 (en) 2015-05-20 2019-12-17 Deutsches Zentrum Fur Luft-Und Raumfahrt E.V. Supercapacitors with oriented carbon nanotubes and method of producing them
US20170332179A1 (en) * 2016-05-16 2017-11-16 The Regents Of The University Of Colorado, A Body Corporate Thermal and thermoacoustic nanodevices and methods of making and using same
US10171919B2 (en) * 2016-05-16 2019-01-01 The Regents Of The University Of Colorado, A Body Corporate Thermal and thermoacoustic nanodevices and methods of making and using same
CN109545778A (en) * 2017-09-21 2019-03-29 三星电机株式会社 Capacitor assembly
JP7259173B2 (en) 2017-09-21 2023-04-18 サムソン エレクトロ-メカニックス カンパニーリミテッド. capacitor parts
JP2019057703A (en) * 2017-09-21 2019-04-11 サムソン エレクトロ−メカニックス カンパニーリミテッド. Capacitor component
KR20190033239A (en) * 2017-09-21 2019-03-29 삼성전기주식회사 Capacitor Component
KR102460748B1 (en) * 2017-09-21 2022-10-31 삼성전기주식회사 Capacitor Component
US10811193B2 (en) * 2017-09-21 2020-10-20 Samsung Electro-Mechanics Co., Ltd. Capacitor component
US20190088419A1 (en) * 2017-09-21 2019-03-21 Samsung Electro-Mechanics Co., Ltd. Capacitor component
US12054838B2 (en) * 2018-04-20 2024-08-06 Murata Manufacturing Co., Ltd Semiconductor device having porous region embedded structure and method of manufacture thereof
US20210032766A1 (en) * 2018-04-20 2021-02-04 Murata Manufacturing Co., Ltd. Semiconductor device having porous region embedded structure and method of manufacture thereof
EP3567645A1 (en) * 2018-05-11 2019-11-13 Murata Manufacturing Co., Ltd. Porous region structure and method of manufacture thereof
CN112119512A (en) * 2018-05-11 2020-12-22 株式会社村田制作所 Porous region structure and method for producing same
WO2019215284A1 (en) * 2018-05-11 2019-11-14 Murata Manufacturing Co., Ltd Porous region structure and method of manufacture thereof
KR102596830B1 (en) 2018-05-11 2023-11-02 가부시키가이샤 무라타 세이사쿠쇼 Porous region structure and method of manufacturing the same
KR20210007984A (en) * 2018-05-11 2021-01-20 가부시키가이샤 무라타 세이사쿠쇼 Porous region structure and manufacturing method thereof
TWI810292B (en) * 2018-05-11 2023-08-01 日商村田製作所股份有限公司 Porous region structure and method of manufacture thereof
US11316006B2 (en) 2018-05-11 2022-04-26 Murata Manufacturing Co., Ltd. Porous region structure and method of manufacture thereof
US11115010B1 (en) * 2018-05-15 2021-09-07 University Of Maryland, College Park Energy loaded dielectrics, systems including energy loaded dielectrics, and methods for fabrication and use thereof
EP3570307A1 (en) * 2018-05-18 2019-11-20 Murata Manufacturing Co., Ltd. Integrated energy storage component
US11581139B2 (en) 2018-05-18 2023-02-14 Murata Manufacturing Co., Ltd. Integrated energy storage component
WO2021052839A1 (en) * 2019-09-17 2021-03-25 Murata Manufacturing Co., Ltd. Low defect high capacitance thin solid electrolyte capacitor and method of fabrication thereof
US11823836B2 (en) * 2019-09-17 2023-11-21 Murata Manufacturing Co., Ltd. Low defect high capacitance thin solid electrolyte capacitor and method of fabrication thereof
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US20220208480A1 (en) * 2019-09-17 2022-06-30 Murata Manufacturing Co., Ltd. Low defect high capacitance thin solid electrolyte capacitor and method of fabrication thereof
CN114556507B (en) * 2019-09-17 2024-05-17 株式会社村田制作所 Low-defect high-capacitance thin solid electrolyte capacitor and manufacturing method thereof
EP3796351A1 (en) * 2019-09-17 2021-03-24 Murata Manufacturing Co., Ltd. Low defect high capacitance thin solid electrolyte capacitor and method of fabrication thereof
CN110931263A (en) * 2019-11-21 2020-03-27 杭州电子科技大学 Super capacitor electrode structure and reinforcing method
US11523504B2 (en) * 2020-02-06 2022-12-06 Point Engineering Co., Ltd. Anodic oxide film structure
CN113215632A (en) * 2020-02-06 2021-08-06 普因特工程有限公司 Anodic oxide film structure
CN112151536A (en) * 2020-08-17 2020-12-29 复旦大学 Three-dimensional integrated structure of nano capacitor and preparation method thereof
CN112201655A (en) * 2020-09-10 2021-01-08 复旦大学 Three-dimensional integrated structure of nano capacitor and manufacturing method thereof
CN112151539A (en) * 2020-09-10 2020-12-29 复旦大学 High-storage-capacity nano-capacitor three-dimensional integrated structure and preparation method thereof
CN112151537A (en) * 2020-09-10 2020-12-29 复旦大学 High-energy-density nano-capacitor three-dimensional integrated structure and preparation method thereof
US20230040335A1 (en) * 2021-08-05 2023-02-09 Samsung Electronics Co., Ltd. Semiconductor device, array structure of semiconductor devices, neuromorphic circuit including the semiconductor devices, and computing apparatus including the neuromorphic circuit
US12113129B2 (en) * 2021-08-05 2024-10-08 Samsung Electronics Co., Ltd. Semiconductor device, array structure of semiconductor devices, neuromorphic circuit including the semiconductor devices, and computing apparatus including the neuromorphic circuit

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