US20110006312A1 - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
US20110006312A1
US20110006312A1 US12/831,647 US83164710A US2011006312A1 US 20110006312 A1 US20110006312 A1 US 20110006312A1 US 83164710 A US83164710 A US 83164710A US 2011006312 A1 US2011006312 A1 US 2011006312A1
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Prior art keywords
light
emitting
substrate
emitting device
major surface
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US12/831,647
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Chia-Liang Hsu
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Epistar Corp
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Epistar Corp
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Publication of US20110006312A1 publication Critical patent/US20110006312A1/en
Priority to US14/265,102 priority Critical patent/US8987017B2/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12032Schottky diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements

Definitions

  • the application relates to a light-emitting device, and more particularly to a light-emitting device comprising a substrate having a first major surface and a second major surface.
  • a plurality of light-emitting stacks are on the first major surface, and at least one electronic device is on the second major surface, wherein the light-emitting stacks are electrically connected to the electronic device.
  • the light-emitting mechanism of the light-emitting diode is to take advantage of the energy difference of electrons between the n-type semiconductor and the p-type semiconductor and then to release the energy in the form of light, which is different from the light-emitting mechanism of the incandescent lamp, which is by heating. Therefore, the light-emitting diode is called the cold light source. Besides, the light-emitting diode has the advantages such as long endurance, long lifetime, light weight, and low power consumption. Therefore, the present illumination market expects the light-emitting diode as a new generation illumination to substitute for the traditional light source and apply it to various fields such as traffic signal, backlight module, street light, and medical apparatus.
  • FIG. 1 is the illustration of a conventional AC light-emitting diode device.
  • the light-emitting device 100 comprises a substrate 10 , a plurality of light-emitting units 12 disposing on the substrate 10 and are serially connected to form circuit A and circuit B that are anti-parallel connected to each other later, and two electrodes 14 and 16 disposing on the substrate 10 and electrically connecting to the plurality of the light-emitting units 12 .
  • the alternative current flows into the light-emitting device 100 through the electrode 14
  • the current passes through circuit A and triggers the light-emitting unit 12 in the circuit A to emit light.
  • the alternative current flows into the light-emitting device 100 through the electrode 16
  • the current passes through circuit B and triggers the light-emitting unit 12 in the circuit B to emit light.
  • FIG. 2 is the illustration for the conventional photoelectric apparatus.
  • a photoelectric apparatus 200 comprises a sub-mount 20 , which comprises at least one circuit 202 ; a solder 22 located on the sub-mount 20 to attach the light-emitting device 100 on the sub-mount 20 and to electrically connect the substrate 10 of the light-emitting device 100 with the circuit 202 on the sub-mount 20 ; and one electrically connecting structure 24 electrically connecting the electrode 16 of the light-emitting device 100 and the circuit 202 on the sub-mount 20 .
  • the sub-mount 20 comprises a lead frame or a large-size mounting substrate to facilitate the circuit arrangement and to raise the heat dissipating efficiency.
  • the present disclosure provides a light-emitting device comprising a substrate having a first major surface and a second major surface; a plurality of light-emitting stacks spacing at intervals mutually on the first major surface, wherein the light-emitting stacks electrically connecting to each other via the first electrical connecting structure; and at least one electronic device on the second major surface electrically connecting to the light-emitting stacks via a second electrical connecting structure extending from the first major surface to the second major surface of the substrate.
  • the present disclosure also provides a light-emitting device comprising a substrate having a first major surface and a second major surface; a plurality of light-emitting stacks on the first major surface; and at least one bridge rectifying device and one passive device on the second major surface, wherein the light-emitting stacks and the bridge rectifying device are electrically connected to each other.
  • the present disclosure further provides a light-emitting device comprising a substrate, wherein a plurality of light-emitting stacks and at least one electronic device disposed on a first major surface and a second major surface of the substrate respectively, and the plurality light-emitting stacks on the first major surface and the electronic device on the second major surface electrically connecting to each other via a plug of the substrate or via the metal wire.
  • the present disclosure further provides a light-emitting device comprising a substrate, wherein a plurality of light-emitting stacks and at least one electronic device disposed on the top-side surface and the bottom-side surface respectively, and further comprising a heat dissipation layer located on the bottom-side surface of the substrate to raise the heat dissipating efficiency and to increase the reliability of the light-emitting device.
  • the present disclosure further provides a light-emitting device disposing the devices such as the electric device like the rectifying device, the resistance, the inductance, and the capacitance or the heat dissipation layer that are not for light emitting on the second major surface of the substrate and to dispose the light-emitting stacks on the first major surface.
  • the devices such as the electric device like the rectifying device, the resistance, the inductance, and the capacitance or the heat dissipation layer that are not for light emitting on the second major surface of the substrate and to dispose the light-emitting stacks on the first major surface.
  • Such design uses the total surface where the light-emitting stacks located on to be the light extraction surface and reduce the waste of light-emitting area.
  • FIG. 1 is the illustration of the conventional light-emitting device.
  • FIG. 2 is the illustration of the conventional photoelectric apparatus.
  • FIG. 3A is the side view illustration in accordance with one embodiment in the present disclosure.
  • FIG. 3B is the circuit illustration of the present disclosure.
  • FIGS. 4A and 4B are the illustrations of the first electrical connecting structure in accordance with one embodiment in the present disclosure.
  • FIGS. 5A and 5B are the illustrations of the second electrical connecting structure in accordance with one embodiment in the present disclosure.
  • FIG. 6 is the top view and the bottom view in accordance with one embodiment in the present disclosure.
  • FIG. 7 is the illustration of the fourth electrical connecting structure in accordance with one embodiment in the present disclosure.
  • FIG. 8 is the illustration in accordance with another embodiment in the present disclosure.
  • FIG. 9 is the illustration in accordance with another embodiment in the present disclosure.
  • FIG. 3A is the side view illustration in accordance with one embodiment in the present disclosure
  • FIG. 3B is the circuit illustration in accordance with one embodiment of the present disclosure.
  • the light-emitting device comprises a substrate 30 having a first major surface 302 and a second major surface 304 ; a plurality of light-emitting stacks 32 spacing at intervals mutually on the first major surface 302 , wherein the light-emitting stacks 32 electrically connecting to each other via a plurality of the first electrical connecting structures 320 ; and at least one rectifying device 34 locating on the second major surface 304 of the substrate 30 , wherein the rectifying device 34 having a plurality of semiconductor stacks 340 , which are electrically connecting to each other via a second electrical connecting structure 342 and arranging in a bridge circuit form.
  • the light-emitting stacks 32 electrically connect to the rectifying device 34 by the first electrical connecting structure 36 .
  • the light-emitting device 300 further comprises at least one bump pad 38 , which is electrically connecting to the rectifying device 34 and the AC power supplier (not shown in the figure) respectively, located on the second major surface 304 .
  • the alternative current flows into the light-emitting device 300 via the bump pad 38 , the current is converted into a direct current by passing through the bridge rectifying circuit, which is arranged by the plurality of the semiconductor stacks 340 located on the second major surface 304 , and then the current is transmitted to the light-emitting stacks through the third electrical connecting structure 36 , wherein the third electrical connecting structure 36 comprises the metal plug filled in the via hole passing through the substrate 30 , or the conductive wire extending from the first major surface 302 to the second major surface 304 .
  • the light-emitting stacks 32 comprise one first conducting type semiconductor layer 322 formed on the substrate 30 , a light emitting layer 324 formed on the first conducting type semiconductor layer 322 , and a second conducting type semiconductor layer 326 formed on the light emitting layer 324 , wherein the materials of the light-emitting stacks 32 comprise semiconductor materials containing aluminum (Al), gallium (Ga), indium (In), nitrogen (N), phosphor (P), and/or arsenic (As), such as the Gallium Nitride (GaN) series materials or the Aluminum Gallium Indium Phosphide (AlGaInP) series materials.
  • the light-emitting stacks 32 are formed by the metal-organic chemical vapor deposition, and each light-emitting stack 32 comprises a partially exposed first conducting type semiconductor layer 322 formed by photolithography and the etching technology.
  • the first electrical connecting structure 320 serially connects to the first conducting type semiconductor layer 322 of the light emitting stack 32 and the second conducting type semiconductor layer 326 of the adjacent light emitting stack 32 respectively.
  • the semiconductor stacks 340 for composing the rectifying device 34 comprise a plurality of the structures such as the light-emitting diode, the Zener diode, or the Schottky diode formed by the metal-organic chemical vapor deposition, the photolithography and the etching technology, and the materials comprise the III-V compounds or the Group IV elements such as the Gallium Nitride (GaN) series materials, the Aluminum Gallium Indium Phosphide (AlGaInP) series materials, or Silicon.
  • the materials comprise the III-V compounds or the Group IV elements such as the Gallium Nitride (GaN) series materials, the Aluminum Gallium Indium Phosphide (AlGaInP) series materials, or Silicon.
  • the first electrical connecting structure 320 comprises an insulating layer 3202 filled between the adjacent light-emitting stacks 32 to prevent the short circuit between the adjacent light-emitting stacks 32 and a metal layer 3204 that is located on the insulating layer 3202 and electrically connecting to the adjacent light-emitting stacks 32 .
  • the first electrical connecting structure 320 could also be a metal wire as shown in FIG. 4B , and the two terminals of the metal wire are connected to the adjacent light-emitting stacks 32 respectively.
  • the second electrical connecting structure 342 comprises an insulating layer 3422 filled between the adjacent semiconductor stacks 340 to prevent the short circuit between the connecting semiconductor stacks 340 and a metal layer 3424 that is located on the insulating layer 3422 and electrically connecting to the adjacent semiconductor stacks 340 .
  • the second electrical connecting structure 342 can also be a metal wire as shown in FIG. 5B , and the two terminals of the metal wire are connected to the adjacent semiconductor stacks 340 respectively.
  • FIG. 6 is the illustration of another embodiment.
  • the light-emitting stacks 32 and the semiconductor stacks 340 of the light-emitting device 300 can be formed on the first major surface 302 and the second major surface 304 by the metal-organic chemical vapor deposition, the photolithography and the etching technology.
  • an adhesive layer 44 can also be provided between the light-emitting stacks 32 , the semiconductor stacks 340 and the substrate 30 to attach the light-emitting stacks 32 and the semiconductor stacks 340 to the first major surface 302 and the second major surface 306 of the substrate 30 respectively.
  • the yield of the products is therefore increased and the production cost is reduced.
  • the material of the adhesive layer 44 comprises the metal material or the organic adhesive material.
  • FIG. 7 is the illustration of another embodiment.
  • the light-emitting device 300 further comprises a passive device 40 located on the second surface 304 of the substrate 30 and electrically connecting to the rectifying device 34 .
  • the passive device 40 comprises a resistance, an inductance, or a capacitance serially connecting to the rectifying device 34 , or a capacitance parallelly connecting to the rectifying device 34 to provide the electric protection for the light-emitting device 300 or to adjust the electric characteristic of the light-emitting device 300 .
  • the passive device can be a thin-film resistance, a thin-film capacitance, or a thin-film inductance integrated with the light-emitting device 300 as a single chip, and the material of the above mentioned thin-film resistance comprises tantalum nitride (TaN), silicon-chromium alloy (SiCr), or nickel-chromium alloy (NiCr).
  • TaN tantalum nitride
  • SiCr silicon-chromium alloy
  • NiCr nickel-chromium alloy
  • FIG. 8 is the illustration of another embodiment.
  • the light-emitting device 300 further comprises a wavelength converting structure 42 located on the light-emitting stacks 32 to absorb and convert the light emitted from the light-emitting stacks 32 .
  • the material of the wavelength comprises one or more than one fluorescent materials or phosphor materials
  • the wavelength converting structure 42 can be a layer structure uniformly coated on the light-emitting stacks 32 or a glue comprising the fluorescent material to encapsulate the light-emitting stacks so the products with different optical properties are formed.
  • FIG. 9 is the illustration of another embodiment.
  • the light-emitting device 300 further comprises a heat dissipation layer 46 , wherein the heat dissipation layer 46 can connect with the second major surface 304 of the substrate 30 or the passive device 34 to guide the heat produced from the elements in the light-emitting device 300 .
  • the material of heat dissipation layer 46 has high thermal conductivity which is preferably larger than that of the substrate 30 or larger than 50 W/mK.
  • the material of the heat dissipation layer 46 can be copper, silver, gold, nickel, diamond, diamond-like carbon (DLC), aluminum nitride (AIN), graphite, carbon nanotube (CNT), or the composite thereof.
  • the thickness of the heat dissipation layer is preferably larger than 3 ⁇ m and the area of it is preferably not smaller than 30% of that of the substrate 30 .
  • the light-emitting devices 300 as shown in FIG. 3A to FIG. 9 can be applied to the lighting system, and the lighting system can be further applied to the illumination system, the display backlight module, or the vehicle lighting, and the light-emitting devices 300 can be adapted to the power supply with 100V, 110V, 220V, 240V, 12V, 24V, or 48V.
  • the present disclosure discloses the light-emitting device 300 disposing the device such as the rectifying device 34 , the bump pad 38 , the resistance, the inductance, the capacitance, and the heat dissipation layer 46 that are not for light emitting on the second major surface 304 of the substrate 30 and to dispose the light-emitting stacks 32 on the first major surface 302 of the substrate 30 .
  • Such design uses the total surface where the light-emitting stacks 32 located on the light-emitting device 300 to be the light extraction surface and reduces the waste of light-emitting area.

Abstract

This disclosure discloses a light-emitting device, comprising a substrate having a first major surface and a second major surface; a plurality of light-emitting stacks on the first major surface; and at least one electronic device on the second major surface, wherein the light-emitting stacks are electrically connected to each other in series via a first electrical connecting structure; the electronic device are electrically connected to the light-emitting stacks via a second electrical connecting structure.

Description

    REFERENCE TO RELATED APPLICATION
  • The application claims the right of priority based on TW application Ser. No. 098123043 filed on Jul. 7, 2009, which is incorporated herein by reference and assigned to the assignee herein.
  • TECHNICAL FIELD
  • The application relates to a light-emitting device, and more particularly to a light-emitting device comprising a substrate having a first major surface and a second major surface. A plurality of light-emitting stacks are on the first major surface, and at least one electronic device is on the second major surface, wherein the light-emitting stacks are electrically connected to the electronic device.
  • DESCRIPTION OF BACKGROUND ART
  • The light-emitting mechanism of the light-emitting diode is to take advantage of the energy difference of electrons between the n-type semiconductor and the p-type semiconductor and then to release the energy in the form of light, which is different from the light-emitting mechanism of the incandescent lamp, which is by heating. Therefore, the light-emitting diode is called the cold light source. Besides, the light-emitting diode has the advantages such as long endurance, long lifetime, light weight, and low power consumption. Therefore, the present illumination market expects the light-emitting diode as a new generation illumination to substitute for the traditional light source and apply it to various fields such as traffic signal, backlight module, street light, and medical apparatus.
  • FIG. 1 is the illustration of a conventional AC light-emitting diode device. As shown in FIG. 1, the light-emitting device 100 comprises a substrate 10, a plurality of light-emitting units 12 disposing on the substrate 10 and are serially connected to form circuit A and circuit B that are anti-parallel connected to each other later, and two electrodes 14 and 16 disposing on the substrate 10 and electrically connecting to the plurality of the light-emitting units 12. When the alternative current flows into the light-emitting device 100 through the electrode 14, the current passes through circuit A and triggers the light-emitting unit 12 in the circuit A to emit light. Correspondingly, when the alternative current flows into the light-emitting device 100 through the electrode 16, the current passes through circuit B and triggers the light-emitting unit 12 in the circuit B to emit light.
  • Besides, the light-emitting device 100 could form a photoelectric apparatus by further connecting with other components. FIG. 2 is the illustration for the conventional photoelectric apparatus. As shown in FIG. 2, a photoelectric apparatus 200 comprises a sub-mount 20, which comprises at least one circuit 202; a solder 22 located on the sub-mount 20 to attach the light-emitting device 100 on the sub-mount 20 and to electrically connect the substrate 10 of the light-emitting device 100 with the circuit 202 on the sub-mount 20; and one electrically connecting structure 24 electrically connecting the electrode 16 of the light-emitting device 100 and the circuit 202 on the sub-mount 20. The sub-mount 20 comprises a lead frame or a large-size mounting substrate to facilitate the circuit arrangement and to raise the heat dissipating efficiency.
  • Nevertheless, although the design of the light-emitting device 100 could be applied to the alternative current directly, only parts of the light-emitting units 12 emitting light at the same time often causes the waste of the light-emitting area on the light-emitting device.
  • SUMMARY OF THE DISCLOSURE
  • The present disclosure provides a light-emitting device comprising a substrate having a first major surface and a second major surface; a plurality of light-emitting stacks spacing at intervals mutually on the first major surface, wherein the light-emitting stacks electrically connecting to each other via the first electrical connecting structure; and at least one electronic device on the second major surface electrically connecting to the light-emitting stacks via a second electrical connecting structure extending from the first major surface to the second major surface of the substrate.
  • The present disclosure also provides a light-emitting device comprising a substrate having a first major surface and a second major surface; a plurality of light-emitting stacks on the first major surface; and at least one bridge rectifying device and one passive device on the second major surface, wherein the light-emitting stacks and the bridge rectifying device are electrically connected to each other.
  • The present disclosure further provides a light-emitting device comprising a substrate, wherein a plurality of light-emitting stacks and at least one electronic device disposed on a first major surface and a second major surface of the substrate respectively, and the plurality light-emitting stacks on the first major surface and the electronic device on the second major surface electrically connecting to each other via a plug of the substrate or via the metal wire.
  • The present disclosure further provides a light-emitting device comprising a substrate, wherein a plurality of light-emitting stacks and at least one electronic device disposed on the top-side surface and the bottom-side surface respectively, and further comprising a heat dissipation layer located on the bottom-side surface of the substrate to raise the heat dissipating efficiency and to increase the reliability of the light-emitting device.
  • The present disclosure further provides a light-emitting device disposing the devices such as the electric device like the rectifying device, the resistance, the inductance, and the capacitance or the heat dissipation layer that are not for light emitting on the second major surface of the substrate and to dispose the light-emitting stacks on the first major surface. Such design uses the total surface where the light-emitting stacks located on to be the light extraction surface and reduce the waste of light-emitting area.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is the illustration of the conventional light-emitting device.
  • FIG. 2 is the illustration of the conventional photoelectric apparatus.
  • FIG. 3A is the side view illustration in accordance with one embodiment in the present disclosure.
  • FIG. 3B is the circuit illustration of the present disclosure.
  • FIGS. 4A and 4B are the illustrations of the first electrical connecting structure in accordance with one embodiment in the present disclosure.
  • FIGS. 5A and 5B are the illustrations of the second electrical connecting structure in accordance with one embodiment in the present disclosure.
  • FIG. 6 is the top view and the bottom view in accordance with one embodiment in the present disclosure.
  • FIG. 7 is the illustration of the fourth electrical connecting structure in accordance with one embodiment in the present disclosure.
  • FIG. 8 is the illustration in accordance with another embodiment in the present disclosure.
  • FIG. 9 is the illustration in accordance with another embodiment in the present disclosure.
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • The following shows the description of the embodiments of the present disclosure in accordance with the drawings.
  • FIG. 3A is the side view illustration in accordance with one embodiment in the present disclosure and FIG. 3B is the circuit illustration in accordance with one embodiment of the present disclosure. As shown in FIGS. 3A and 3B, the light-emitting device comprises a substrate 30 having a first major surface 302 and a second major surface 304; a plurality of light-emitting stacks 32 spacing at intervals mutually on the first major surface 302, wherein the light-emitting stacks 32 electrically connecting to each other via a plurality of the first electrical connecting structures 320; and at least one rectifying device 34 locating on the second major surface 304 of the substrate 30, wherein the rectifying device 34 having a plurality of semiconductor stacks 340, which are electrically connecting to each other via a second electrical connecting structure 342 and arranging in a bridge circuit form. Besides, the light-emitting stacks 32 electrically connect to the rectifying device 34 by the first electrical connecting structure 36.
  • Besides, the light-emitting device 300 further comprises at least one bump pad 38, which is electrically connecting to the rectifying device 34 and the AC power supplier (not shown in the figure) respectively, located on the second major surface 304. When the alternative current flows into the light-emitting device 300 via the bump pad 38, the current is converted into a direct current by passing through the bridge rectifying circuit, which is arranged by the plurality of the semiconductor stacks 340 located on the second major surface 304, and then the current is transmitted to the light-emitting stacks through the third electrical connecting structure 36, wherein the third electrical connecting structure 36 comprises the metal plug filled in the via hole passing through the substrate 30, or the conductive wire extending from the first major surface 302 to the second major surface 304.
  • In the light-emitting device 300, the materials of the substrate 30 comprise the insulating materials such as sapphire, aluminum nitride (AIN), glass, or diamond. The substrate 30 can also be a single layer structure formed by a single material. The substrate 30 in the embodiment is a single layer substrate made of sapphire. The light-emitting stacks 32 comprise one first conducting type semiconductor layer 322 formed on the substrate 30, a light emitting layer 324 formed on the first conducting type semiconductor layer 322, and a second conducting type semiconductor layer 326 formed on the light emitting layer 324, wherein the materials of the light-emitting stacks 32 comprise semiconductor materials containing aluminum (Al), gallium (Ga), indium (In), nitrogen (N), phosphor (P), and/or arsenic (As), such as the Gallium Nitride (GaN) series materials or the Aluminum Gallium Indium Phosphide (AlGaInP) series materials. In the embodiment, the light-emitting stacks 32 are formed by the metal-organic chemical vapor deposition, and each light-emitting stack 32 comprises a partially exposed first conducting type semiconductor layer 322 formed by photolithography and the etching technology. The first electrical connecting structure 320 serially connects to the first conducting type semiconductor layer 322 of the light emitting stack 32 and the second conducting type semiconductor layer 326 of the adjacent light emitting stack 32 respectively.
  • Furthermore, the semiconductor stacks 340 for composing the rectifying device 34 comprise a plurality of the structures such as the light-emitting diode, the Zener diode, or the Schottky diode formed by the metal-organic chemical vapor deposition, the photolithography and the etching technology, and the materials comprise the III-V compounds or the Group IV elements such as the Gallium Nitride (GaN) series materials, the Aluminum Gallium Indium Phosphide (AlGaInP) series materials, or Silicon.
  • As shown in FIG. 4A, the first electrical connecting structure 320 comprises an insulating layer 3202 filled between the adjacent light-emitting stacks 32 to prevent the short circuit between the adjacent light-emitting stacks 32 and a metal layer 3204 that is located on the insulating layer 3202 and electrically connecting to the adjacent light-emitting stacks 32. Besides, the first electrical connecting structure 320 could also be a metal wire as shown in FIG. 4B, and the two terminals of the metal wire are connected to the adjacent light-emitting stacks 32 respectively. The second electrical connecting structure 342 comprises an insulating layer 3422 filled between the adjacent semiconductor stacks 340 to prevent the short circuit between the connecting semiconductor stacks 340 and a metal layer 3424 that is located on the insulating layer 3422 and electrically connecting to the adjacent semiconductor stacks 340. Besides, the second electrical connecting structure 342 can also be a metal wire as shown in FIG. 5B, and the two terminals of the metal wire are connected to the adjacent semiconductor stacks 340 respectively.
  • FIG. 6 is the illustration of another embodiment. The light-emitting stacks 32 and the semiconductor stacks 340 of the light-emitting device 300 can be formed on the first major surface 302 and the second major surface 304 by the metal-organic chemical vapor deposition, the photolithography and the etching technology. Besides, an adhesive layer 44 can also be provided between the light-emitting stacks 32, the semiconductor stacks 340 and the substrate 30 to attach the light-emitting stacks 32 and the semiconductor stacks 340 to the first major surface 302 and the second major surface 306 of the substrate 30 respectively. The yield of the products is therefore increased and the production cost is reduced. The material of the adhesive layer 44 comprises the metal material or the organic adhesive material.
  • FIG. 7 is the illustration of another embodiment. As shown in FIG. 7, the light-emitting device 300 further comprises a passive device 40 located on the second surface 304 of the substrate 30 and electrically connecting to the rectifying device 34. For example, the passive device 40 comprises a resistance, an inductance, or a capacitance serially connecting to the rectifying device 34, or a capacitance parallelly connecting to the rectifying device 34 to provide the electric protection for the light-emitting device 300 or to adjust the electric characteristic of the light-emitting device 300. The passive device can be a thin-film resistance, a thin-film capacitance, or a thin-film inductance integrated with the light-emitting device 300 as a single chip, and the material of the above mentioned thin-film resistance comprises tantalum nitride (TaN), silicon-chromium alloy (SiCr), or nickel-chromium alloy (NiCr).
  • FIG. 8 is the illustration of another embodiment. As shown in FIG. 8, the light-emitting device 300 further comprises a wavelength converting structure 42 located on the light-emitting stacks 32 to absorb and convert the light emitted from the light-emitting stacks 32. Wherein, the material of the wavelength comprises one or more than one fluorescent materials or phosphor materials, and the wavelength converting structure 42 can be a layer structure uniformly coated on the light-emitting stacks 32 or a glue comprising the fluorescent material to encapsulate the light-emitting stacks so the products with different optical properties are formed.
  • FIG. 9 is the illustration of another embodiment. As shown in FIG. 9, the light-emitting device 300 further comprises a heat dissipation layer 46, wherein the heat dissipation layer 46 can connect with the second major surface 304 of the substrate 30 or the passive device 34 to guide the heat produced from the elements in the light-emitting device 300. Besides, the material of heat dissipation layer 46 has high thermal conductivity which is preferably larger than that of the substrate 30 or larger than 50 W/mK. The material of the heat dissipation layer 46 can be copper, silver, gold, nickel, diamond, diamond-like carbon (DLC), aluminum nitride (AIN), graphite, carbon nanotube (CNT), or the composite thereof. The thickness of the heat dissipation layer is preferably larger than 3 μm and the area of it is preferably not smaller than 30% of that of the substrate 30.
  • Furthermore, the light-emitting devices 300 as shown in FIG. 3A to FIG. 9 can be applied to the lighting system, and the lighting system can be further applied to the illumination system, the display backlight module, or the vehicle lighting, and the light-emitting devices 300 can be adapted to the power supply with 100V, 110V, 220V, 240V, 12V, 24V, or 48V.
  • The present disclosure discloses the light-emitting device 300 disposing the device such as the rectifying device 34, the bump pad 38, the resistance, the inductance, the capacitance, and the heat dissipation layer 46 that are not for light emitting on the second major surface 304 of the substrate 30 and to dispose the light-emitting stacks 32 on the first major surface 302 of the substrate 30. Such design uses the total surface where the light-emitting stacks 32 located on the light-emitting device 300 to be the light extraction surface and reduces the waste of light-emitting area.
  • The embodiments mentioned above are used to describe the technical thinking and the characteristic of the invention and to make the person with ordinary skill in the art to realize the content of the invention and to practice, which could not be used to limit the claim scope of the present invention. That is, any modification or variation according to the spirit of the present invention should also be covered in the claim scope of the present disclosure.

Claims (18)

1. A light-emitting device, comprising:
a substrate, comprising a first major surface and a second major surface;
a plurality of light-emitting stacks located on the first major surface of the substrate,
wherein the light-emitting stacks electrically connecting to each other via a first electrical connecting structure;
at least one electronic device located on the second major surface of the substrate; and
a second electrical connecting structure extending from the first major surface to the second major surface of the substrate and electrically connecting the light-emitting stacks and the electronic device.
2. The light-emitting device of claim 1, wherein the electronic device comprising a resistance, an inductance, capacitance, or a rectifying device.
3. The light-emitting device of claim 2, wherein the rectifying device comprising a plurality of semiconductor stacks.
4. The light-emitting device of claim 1, wherein the first electrical connecting structure comprising a metal wire or a metal plug passing through the substrate.
5. The light-emitting device of claim 3, wherein the semiconductor stacks form a light-emitting diode, a Zener diode, or a Schottky diode.
6. The light-emitting device of claim 1, further comprising a wavelength converting layer covering on the light-emitting stacks, wherein the material of the wavelength converting layer comprising a fluorescent material or a phosphor material.
7. The light-emitting device of claim 2, wherein the material of the resistance comprising tantalum nitride (TaN), silicon-chromium alloy (SiCr), or nickel-chromium alloy (NiCr).
8. The light-emitting device of claim 1, further comprising a heat dissipation layer on the second major surface of the substrate, wherein the heat dissipation layer comprising a thermal conductivity larger than 50 W/mK.
9. The light-emitting device of claim 8, wherein the thickness of the heat dissipation layer is larger than 3 μm or the area of the heat dissipation layer is not smaller than 50% of that of the substrate.
10. The light-emitting device of claim 8, wherein the material of the heat dissipation layer comprising copper, silver, gold, nickel, diamond, diamond-like carbon (DLC), aluminum nitride (AIN), graphite, carbon nanotube (CNT), or the composite thereof
11. The light-emitting device of claim 1, further comprising an adhesive layer located between the light-emitting stacks and the substrate and/or between the electronic device and the substrate, wherein the material of the adhesive layer comprising a metal material or an organic adhesive material.
12. The light-emitting device of claim 1, wherein the substrate is a single layer structure.
13. The light-emitting device of claim 1, which is adapted to the power supply with 100V, 110V, 220V, 240V, 12V, 24V, or 48V.
14. A light-emitting device, comprising:
a substrate, comprising a first major surface and a second major surface;
a plurality of light-emitting stacks, located on the first major surface of the substrate; and
one bridge rectifying device and one passive device, located on the second major surface of the substrate, wherein the light-emitting stacks, the bridge rectifying device, and the passive device are electrically connected to each other.
15. The light-emitting device of claim 14, wherein the passive device comprising a thin-film resistance, a thin-film inductance, or a thin-film capacitance.
16. The light-emitting device of claim 14, further comprising an adhesive layer located between the light-emitting stacks and the substrate and/or between the passive device, the bridge rectifying device and the substrate, wherein the material of the adhesive layer comprising a metal material or an organic adhesive material.
17. The light-emitting device of claim 14, wherein the substrate is a single layer structure.
18. The light-emitting device of claim 14, which is adapted to the power supply with 100V, 110V, 220V, 240V, 12V, 24V, or 48V.
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