US20100053893A1 - Self-retaining vibration isolating fan mount assembly - Google Patents

Self-retaining vibration isolating fan mount assembly Download PDF

Info

Publication number
US20100053893A1
US20100053893A1 US12/199,916 US19991608A US2010053893A1 US 20100053893 A1 US20100053893 A1 US 20100053893A1 US 19991608 A US19991608 A US 19991608A US 2010053893 A1 US2010053893 A1 US 2010053893A1
Authority
US
United States
Prior art keywords
ribs
fan housing
fan
recess
bracket member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US12/199,916
Other versions
US7684191B1 (en
Inventor
Clifford B. Willis
William A. De Meulenaere
Brett C. Ong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oracle America Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Priority to US12/199,916 priority Critical patent/US7684191B1/en
Assigned to SUN MICROSYSTEMS, INC. reassignment SUN MICROSYSTEMS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ONG, BRETT C., DE MEULENAERE, WILLIAM A., WILLIS, CLIFFORD B.
Publication of US20100053893A1 publication Critical patent/US20100053893A1/en
Application granted granted Critical
Publication of US7684191B1 publication Critical patent/US7684191B1/en
Assigned to Oracle America, Inc. reassignment Oracle America, Inc. MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: Oracle America, Inc., ORACLE USA, INC., SUN MICROSYSTEMS, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/66Combating cavitation, whirls, noise, vibration or the like; Balancing
    • F04D29/661Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps
    • F04D29/668Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps damping or preventing mechanical vibrations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04DNON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00Details, component parts, or accessories
    • F04D29/60Mounting; Assembling; Disassembling
    • F04D29/601Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications

Definitions

  • One or more embodiments of the present invention described herein generally relate to a self-retaining vibration isolation fan mount assembly.
  • a plurality of fans are disposed proximate to the electrical/electronic components for blowing the heat away from the components thereby increasing the life span of such components and ensuring operational integrity of the computer.
  • at least one fan is typically coupled to and supported by at least one fan bracket.
  • the fan bracket is generally coupled to a computer chassis of a computer.
  • the manner in which the fans are coupled to the fan brackets are gaining attention as the amount of vibration caused by the fans while positioned on the fan brackets may affect the performance of surrounding components positioned within the computer.
  • HDDs hard disk drives
  • Conventional fan brackets generally include isolation mounting pegs that are coupled to the fans to absorb vibrations generated by the fan.
  • the isolation mounting pegs may be made of a material that is different than the material used to construct the fan bracket to absorb the vibration. While the isolation mounting pegs are generally useful, such isolation mounting pegs may provide for a loose fitting between recesses of the fans which generally receive the pegs. As such, the fans move over the pegs to and from the fan bracket over time causing the fan bracket to deform over time.
  • a fan assembly for a computer comprises a fan housing, at least one bracket member, and at least one retention peg.
  • the fan housing defines at least one recess therein and is configured to direct heat away from a plurality of electrical components positioned within the computer.
  • the bracket member supports the fan housing within the computer.
  • the retention peg is disposed about the bracket and includes a plurality of ribs spaced apart from one another for insertion into the recess to retain the bracket to the fan.
  • a system for cooling a plurality of computer components comprises a computer chassis, a fan housing, at least one bracket member, and at least one retention peg.
  • the fan housing defines at least one recess therein and is configured to cool the plurality of computer components.
  • the bracket member supports the fan housing on the computer chassis.
  • the retention peg is disposed about the bracket member and includes a plurality of ribs spaced apart from one another for insertion into the recess to retain the bracket to the fan.
  • a fan assembly for an electronic device includes a fan housing, at least one bracket member, and at least one retention peg.
  • the fan housing defines at least one recess therein and is configured to direct heat away from a plurality of electrical components positioned within the electronic device.
  • the bracket member supports the fan housing within the electronic device.
  • the retention peg is disposed about the bracket member and includes at least one rib for insertion into the recess to retain the bracket member to the fan housing. The material of the retention peg and the ribs are different from the material of the bracket member.
  • FIG. 1 depicts a first perspective view of a prior art fan assembly
  • FIG. 2 a depicts a first top view of the prior art fan assembly
  • FIG. 2 b depicts a second view of the prior art fan assembly
  • FIG. 3 depicts a perspective view of a fan assembly in accordance to one embodiment of the present invention
  • FIG. 4 depicts a first bracket member of the fan assembly of FIG. 3 in accordance to one embodiment of the present invention.
  • FIG. 5 depicts a computer system implementing at least one fan assembly in accordance to one embodiment of the present invention.
  • the assembly 10 includes a fan bracket assembly 12 that is capable of being mounted to a computer chassis (not shown) of a computer.
  • the fan bracket assembly 12 supports a fan housing 14 .
  • the fan housing 14 includes first and second fans 14 a - 14 b and is positioned on the computer chassis for moving heat away from a plurality of electronics (not shown).
  • the fan bracket assembly 12 generally includes first and second bracket members 12 a and 12 b.
  • Each bracket member 12 a and 12 b includes a plurality of isolation pegs 16 .
  • Each fan 14 a and 14 b includes a plurality of recesses 18 for receiving the isolation pegs 16 so that the first and the second bracket members 12 a and 12 b retain the fans 14 a and 14 b therebetween.
  • the isolation pegs 16 are generally cylindrical in shape.
  • the isolation pegs 16 are generally constructed from a different set of materials from that of the first and the second bracket members 12 a and 12 b.
  • the isolation pegs 16 may each be constructed of an elastomer and the first and the second bracket members 12 a and 12 b may be constructed of plastic.
  • the recesses 18 of the fans 14 a and 14 b are generally configured to facilitate a loose fit with the isolation pegs 16 to allow the fans 14 a and 14 b to move about the isolation pegs 16 .
  • the first and second bracket members 12 a and 12 b may act as a conductor and transmit vibrations through the computer chassis and onto to other such electrical components positioned proximate to the fan assembly 10 while the fans 14 a and 14 b rotate.
  • any such HDD (or other suitable device capable of having its operation interfered with due to vibration) positioned proximate to the first and second bracket members 12 a and 12 b may be exposed to the vibrations caused by the fans 14 a and 14 b.
  • Such vibrations may affect the performance of the HDD.
  • the loose fitting characteristic with respect to the isolation pegs 16 and the recesses 18 minimize the transmission of vibrations from the fans 14 a and 14 b to the HDD
  • the loose fitting characteristic may deform the fan bracket 12 as will be described in more detail in connection with FIGS. 2 a - 2 b.
  • FIGS. 2 a - 2 b top views of the prior art fan assembly 10 are shown.
  • FIG. 2 a illustrates the presence of a first gap G 1 that is formed between the first bracket member 12 a and the fan housing 14 .
  • a second gap G 2 is also formed between the second bracket member 12 b and the fan housing 14 .
  • Each gap G 1 and G 2 is generally uncontrolled which means that the fans 14 a and 14 b are free to move within the gaps G 1 and G 2 when the fans rotate.
  • FIG. 2 b depicts the condition whereby the first and the second bracket members 12 a and 12 b have buckled outward due to the movement of the fans 14 a and 14 b within the fan housing 14 on the plurality of isolation pegs 16 (e.g., see gap increase between G 1 and G 2 for FIGS. 2 a and 2 b ).
  • the deformation of the bracket members 12 a and 12 b may become more pronounced over time. The deformation may be accelerated due to temperature cycling. For example, the fan assembly 10 while in the computer may be exposed to 70 C for long periods of time (e.g., up to 22 hours).
  • the deformation of the bracket members 12 a and 12 b may provide the situation whereby less surface area within one or more of the recesses 18 of the fans 14 a - 14 b (e.g, apertures in the fan 12 a and 12 b that receive the isolation pegs 16 ) are capable of contacting the vibrating isolation properties of the pegs 16 thereby minimizing the benefits of implementing the various isolation properties of the pegs 16 . Further, over time, the fans 14 a and 14 b may altogether disengage from one or more of the pegs 16 due to the buckling of the first and the second brackets members 12 a and 12 b as shown in FIG. 2 b.
  • the assembly 20 includes a fan bracket assembly 22 that is capable of being mounted to a computer chassis of a computer. It is generally contemplated that the fan assembly 20 may be used or implemented for any type of electrical device that includes electrical components capable of generating heat and is not to be limited for use solely to computer applications.
  • the fan bracket assembly 22 supports a fan housing 24 .
  • the fan housing 24 includes first and second fans 24 a - 24 b and is positioned on the computer chassis for moving heat away from a plurality of electronics (not shown). While FIG. 3 depicts two fans, it is generally contemplated that the fan assembly 24 may include any number of fans.
  • the number of fans implemented within the fan housing 24 may vary based on the desired criteria of a particular implementation.
  • the fan bracket assembly 22 generally includes first and second bracket members 22 a and 22 b. Each bracket member 22 a and 22 b includes a plurality of retention pegs 26 .
  • the fan housing 27 includes a plurality of recesses 28 for receiving the retention pegs 26 so that the first and the second bracket members 22 a and 22 b retain the fans 24 a and 24 b therebetween.
  • each retention peg 26 is integrally formed with a base 30 .
  • each peg 26 and base 30 may be molded together to form a single piece (or integrated piece). It is generally contemplated that the pegs 26 and the bases 30 are formed of a thermoplastic elastomer or other suitable vibration isolation material.
  • the pegs 26 and the bases 30 are positioned over predesignated sections of the first bracket member 22 a. The particular placement of the pegs 26 and the bases 30 on the first and the second bracket members 22 a - 22 b may vary based on the desired criteria of a particular implementation.
  • the bases 30 are generally press fit over the predesignated sections of the first and the second bracket members 22 a - 22 b.
  • Each retention peg 26 comprises a plurality of serrated ribs 32 .
  • each retention peg 26 is generally configured to function like a screw thereby creating an optimal retention fit with the recesses 28 of the fans 24 a and 24 b.
  • the serrated ribs 32 may prevent undesired separation between the pegs 26 and the recesses 28 of the fans 24 a and 24 b and may also prevent the deformation of the first and/or second bracket members 22 a and 22 b.
  • the serrated ribs 32 are generally formed at a predetermined durometer such that the ribs 32 compress inwardly (or deform) in response to being inserted into the recesses 28 of the fans 24 a and 24 b to increase retention between the first bracket member 24 a and the fans.
  • the durometer of the ribs 32 is generally arranged to allow the ribs 32 to deform within a range of 20% to 40% of the original size.
  • the hardness of each peg 26 and each rib 32 positioned thereon is Shore A durometer of between 40-70. Such a range may allow each rib 32 to deform to facilitate sufficient retention properties with the first and the second bracket members 22 a and 22 b.
  • the hardness of each peg 26 and rib 32 may be Shore A durometer 56 .
  • the particular hardness or durometer of the pegs and the ribs may vary based on the desired criteria of a particular implementation.
  • the peg 26 and the ribs 32 define a generally cylindrical cross section.
  • the retention peg 26 and the serrated ribs 32 may define a total diameter between 5 mm and 6 mm.
  • a portion of the retention peg 26 (e.g., portion of the peg that is independent of the serrated rib 32 ) may define a diameter between 3 mm and 4 mm.
  • the diameter of the retention peg 26 together with the serrated ribs 32 and the diameter of the portion of the retention peg 26 that is independent of the serrated ribs 32 may vary based on the size of the fans.
  • the nose of the peg 26 and the serrated ribs 32 may be tapered between six and ten degrees to facilitate insertion into the recesses 28 of the fans 24 a and 24 b.
  • each rib 32 may ensure that the there may not be too much surface area of the peg 26 that is in contact with each recess 28 of the fans 24 a and 24 b to minimize the transmission of vibrations to the rest of the devices within the computer. Further, the openings between each rib 32 may allow for ample movement of the fans 24 a and 24 b with respect to the first and the second bracket members 22 a and 22 b to allow the isolation material to absorb vibrations caused by the movement and to prevent vibrations from being transmitted to the rest of the devices within the computer.
  • the length for each opening may vary between 0.75 mm to 1.5 mm. In one example, the approximate length for each opening may be approximately 1 mm.
  • the particular length for each opening between the ribs 32 may be similar or different from one another and may vary based on which particular length provides for optimal movement while minimizing the amount of vibrations that are transmitted from the assembly 20 . While FIG. 4 illustrates that the ribs 32 are equally spaced from one another, it is contemplated that the ribs 32 may be spaced in a non-equal manner from one another.
  • the retention pegs 26 may prevent the first and the second bracket members 22 a - 22 b from buckling due the increased retention characteristic provided by the serrated ribs 32 .
  • the pegs 26 may assist in controlling the gaps G 1 and G 2 due to the increased retention characteristic provided by the serrated ribs 32 .
  • the computer system 80 includes a plurality of fan assemblies 82 , a HDD 84 , a power supply 86 , and a plurality of electronics 88 .
  • the fan assemblies 82 may be implemented to include one or more fan assemblies 20 as described above in connection with FIGS. 3-4 . It is generally contemplated that any number of fans may be positioned within each fan assembly 82 .
  • the fan assemblies 82 are generally positioned within a computer chassis 92 and comprise first and second rows 90 a and 90 b.
  • the first row 90 a of fan assemblies 82 are configured to move heat away from the HDD 84 .
  • the second row 90 b of fan assemblies 82 are configured to move heat away from the power supply 86 and the plurality of electronics 88 .

Abstract

A fan assembly for an electronic device is provided. The assembly comprises a fan housing, at least one bracket member, and at least one retention peg. The fan housing defines a recess therein for directing heat away from a electrical components positioned within the electronic device. The bracket member supports the fan housing within the electronic device. The retention peg is disposed about the bracket member and includes a plurality of ribs for insertion into the recess to retain the bracket member to the fan housing.

Description

    BACKGROUND
  • 1. Technical Field
  • One or more embodiments of the present invention described herein generally relate to a self-retaining vibration isolation fan mount assembly.
  • 2. Background Art
  • It is generally known that various electrical/electronic components on a circuit board are capable of generating large amounts of heat. To minimize exposure to such heat, a plurality of fans are disposed proximate to the electrical/electronic components for blowing the heat away from the components thereby increasing the life span of such components and ensuring operational integrity of the computer. In general, at least one fan is typically coupled to and supported by at least one fan bracket. The fan bracket is generally coupled to a computer chassis of a computer.
  • The manner in which the fans are coupled to the fan brackets are gaining attention as the amount of vibration caused by the fans while positioned on the fan brackets may affect the performance of surrounding components positioned within the computer. For example, hard disk drives (HDDs) are sensitive to such vibrations. HDD operation may be degraded if exposed to the vibrations. Conventional fan brackets generally include isolation mounting pegs that are coupled to the fans to absorb vibrations generated by the fan. The isolation mounting pegs may be made of a material that is different than the material used to construct the fan bracket to absorb the vibration. While the isolation mounting pegs are generally useful, such isolation mounting pegs may provide for a loose fitting between recesses of the fans which generally receive the pegs. As such, the fans move over the pegs to and from the fan bracket over time causing the fan bracket to deform over time.
  • SUMMARY
  • In at least one embodiment, a fan assembly for a computer is provided. The fan assembly comprises a fan housing, at least one bracket member, and at least one retention peg. The fan housing defines at least one recess therein and is configured to direct heat away from a plurality of electrical components positioned within the computer. The bracket member supports the fan housing within the computer. The retention peg is disposed about the bracket and includes a plurality of ribs spaced apart from one another for insertion into the recess to retain the bracket to the fan.
  • In another embodiment, a system for cooling a plurality of computer components is provided. The system comprises a computer chassis, a fan housing, at least one bracket member, and at least one retention peg. The fan housing defines at least one recess therein and is configured to cool the plurality of computer components. The bracket member supports the fan housing on the computer chassis. The retention peg is disposed about the bracket member and includes a plurality of ribs spaced apart from one another for insertion into the recess to retain the bracket to the fan.
  • In another embodiment, a fan assembly for an electronic device is provided. The fan assembly includes a fan housing, at least one bracket member, and at least one retention peg. The fan housing defines at least one recess therein and is configured to direct heat away from a plurality of electrical components positioned within the electronic device. The bracket member supports the fan housing within the electronic device. The retention peg is disposed about the bracket member and includes at least one rib for insertion into the recess to retain the bracket member to the fan housing. The material of the retention peg and the ribs are different from the material of the bracket member.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The embodiments of the present invention are pointed out with particularity in the appended claims. However, other features of the various embodiments will become more apparent and will be best understood by referring to the following detailed description in conjunction with the accompany drawings in which:
  • FIG. 1 depicts a first perspective view of a prior art fan assembly;
  • FIG. 2 a depicts a first top view of the prior art fan assembly;
  • FIG. 2 b depicts a second view of the prior art fan assembly;
  • FIG. 3 depicts a perspective view of a fan assembly in accordance to one embodiment of the present invention
  • FIG. 4 depicts a first bracket member of the fan assembly of FIG. 3 in accordance to one embodiment of the present invention; and
  • FIG. 5 depicts a computer system implementing at least one fan assembly in accordance to one embodiment of the present invention.
  • DETAILED DESCRIPTION
  • Detailed embodiments of the present invention are disclosed herein. However, it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms. The figures are not necessarily to scale, some features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for the claims and/or as a representative basis for teaching one skilled in the art to variously employ the present invention.
  • Referring now to FIG. 1, a perspective view of a prior art fan assembly 10 is shown. The assembly 10 includes a fan bracket assembly 12 that is capable of being mounted to a computer chassis (not shown) of a computer. The fan bracket assembly 12 supports a fan housing 14. The fan housing 14 includes first and second fans 14 a-14 b and is positioned on the computer chassis for moving heat away from a plurality of electronics (not shown). The fan bracket assembly 12 generally includes first and second bracket members 12 a and 12 b. Each bracket member 12 a and 12 b includes a plurality of isolation pegs 16. Each fan 14 a and 14 b includes a plurality of recesses 18 for receiving the isolation pegs 16 so that the first and the second bracket members 12 a and 12 b retain the fans 14 a and 14 b therebetween.
  • The isolation pegs 16 are generally cylindrical in shape. The isolation pegs 16 are generally constructed from a different set of materials from that of the first and the second bracket members 12 a and 12 b. In one example, the isolation pegs 16 may each be constructed of an elastomer and the first and the second bracket members 12 a and 12 b may be constructed of plastic. The recesses 18 of the fans 14 a and 14 b are generally configured to facilitate a loose fit with the isolation pegs 16 to allow the fans 14 a and 14 b to move about the isolation pegs 16. If the recesses 18 are arranged such that a tight interference fit is created with the pegs 16, the first and second bracket members 12 a and 12 b may act as a conductor and transmit vibrations through the computer chassis and onto to other such electrical components positioned proximate to the fan assembly 10 while the fans 14 a and 14 b rotate.
  • In this type of arrangement, any such HDD (or other suitable device capable of having its operation interfered with due to vibration) positioned proximate to the first and second bracket members 12 a and 12 b may be exposed to the vibrations caused by the fans 14 a and 14 b. Such vibrations may affect the performance of the HDD. While the loose fitting characteristic with respect to the isolation pegs 16 and the recesses 18 minimize the transmission of vibrations from the fans 14 a and 14 b to the HDD, the loose fitting characteristic may deform the fan bracket 12 as will be described in more detail in connection with FIGS. 2 a-2 b.
  • Referring now to FIGS. 2 a-2 b, top views of the prior art fan assembly 10 are shown. FIG. 2 a illustrates the presence of a first gap G1 that is formed between the first bracket member 12 a and the fan housing 14. A second gap G2 is also formed between the second bracket member 12 b and the fan housing 14. Each gap G1 and G2 is generally uncontrolled which means that the fans 14 a and 14 b are free to move within the gaps G1 and G2 when the fans rotate.
  • FIG. 2 b depicts the condition whereby the first and the second bracket members 12 a and 12 b have buckled outward due to the movement of the fans 14 a and 14 b within the fan housing 14 on the plurality of isolation pegs 16 (e.g., see gap increase between G1 and G2 for FIGS. 2 a and 2 b). The deformation of the bracket members 12 a and 12 b may become more pronounced over time. The deformation may be accelerated due to temperature cycling. For example, the fan assembly 10 while in the computer may be exposed to 70 C for long periods of time (e.g., up to 22 hours).
  • The deformation of the bracket members 12 a and 12 b may provide the situation whereby less surface area within one or more of the recesses 18 of the fans 14 a-14 b (e.g, apertures in the fan 12 a and 12 b that receive the isolation pegs 16) are capable of contacting the vibrating isolation properties of the pegs 16 thereby minimizing the benefits of implementing the various isolation properties of the pegs 16. Further, over time, the fans 14 a and 14 b may altogether disengage from one or more of the pegs 16 due to the buckling of the first and the second brackets members 12 a and 12 b as shown in FIG. 2 b.
  • Referring now to FIG. 3, a perspective view of a fan assembly 20 in accordance to one embodiment of the present invention is shown. The assembly 20 includes a fan bracket assembly 22 that is capable of being mounted to a computer chassis of a computer. It is generally contemplated that the fan assembly 20 may be used or implemented for any type of electrical device that includes electrical components capable of generating heat and is not to be limited for use solely to computer applications. The fan bracket assembly 22 supports a fan housing 24. The fan housing 24 includes first and second fans 24 a-24 b and is positioned on the computer chassis for moving heat away from a plurality of electronics (not shown). While FIG. 3 depicts two fans, it is generally contemplated that the fan assembly 24 may include any number of fans. The number of fans implemented within the fan housing 24 may vary based on the desired criteria of a particular implementation. The fan bracket assembly 22 generally includes first and second bracket members 22 a and 22 b. Each bracket member 22 a and 22 b includes a plurality of retention pegs 26. The fan housing 27 includes a plurality of recesses 28 for receiving the retention pegs 26 so that the first and the second bracket members 22 a and 22 b retain the fans 24 a and 24 b therebetween.
  • Referring now to FIG. 4, the first bracket member 24 a of the fan assembly 20 in accordance to one embodiment of the present invention is shown. Each retention peg 26 is integrally formed with a base 30. In one example, each peg 26 and base 30 may be molded together to form a single piece (or integrated piece). It is generally contemplated that the pegs 26 and the bases 30 are formed of a thermoplastic elastomer or other suitable vibration isolation material. The pegs 26 and the bases 30 are positioned over predesignated sections of the first bracket member 22 a. The particular placement of the pegs 26 and the bases 30 on the first and the second bracket members 22 a-22 b may vary based on the desired criteria of a particular implementation. The bases 30 are generally press fit over the predesignated sections of the first and the second bracket members 22 a-22 b.
  • Each retention peg 26 comprises a plurality of serrated ribs 32. In general, each retention peg 26 is generally configured to function like a screw thereby creating an optimal retention fit with the recesses 28 of the fans 24 a and 24 b. The serrated ribs 32 may prevent undesired separation between the pegs 26 and the recesses 28 of the fans 24 a and 24 b and may also prevent the deformation of the first and/or second bracket members 22 a and 22 b. In general, the serrated ribs 32 are generally formed at a predetermined durometer such that the ribs 32 compress inwardly (or deform) in response to being inserted into the recesses 28 of the fans 24 a and 24 b to increase retention between the first bracket member 24 a and the fans. The durometer of the ribs 32 is generally arranged to allow the ribs 32 to deform within a range of 20% to 40% of the original size. In one example, the hardness of each peg 26 and each rib 32 positioned thereon is Shore A durometer of between 40-70. Such a range may allow each rib 32 to deform to facilitate sufficient retention properties with the first and the second bracket members 22 a and 22 b. In yet another example, the hardness of each peg 26 and rib 32 may be Shore A durometer 56. The particular hardness or durometer of the pegs and the ribs may vary based on the desired criteria of a particular implementation.
  • As shown, the peg 26 and the ribs 32 define a generally cylindrical cross section. In one example, the retention peg 26 and the serrated ribs 32 may define a total diameter between 5 mm and 6 mm. A portion of the retention peg 26 (e.g., portion of the peg that is independent of the serrated rib 32) may define a diameter between 3 mm and 4 mm. The diameter of the retention peg 26 together with the serrated ribs 32 and the diameter of the portion of the retention peg 26 that is independent of the serrated ribs 32 may vary based on the size of the fans. The nose of the peg 26 and the serrated ribs 32 may be tapered between six and ten degrees to facilitate insertion into the recesses 28 of the fans 24 a and 24 b.
  • The openings between each rib 32 may ensure that the there may not be too much surface area of the peg 26 that is in contact with each recess 28 of the fans 24 a and 24 b to minimize the transmission of vibrations to the rest of the devices within the computer. Further, the openings between each rib 32 may allow for ample movement of the fans 24 a and 24 b with respect to the first and the second bracket members 22 a and 22 b to allow the isolation material to absorb vibrations caused by the movement and to prevent vibrations from being transmitted to the rest of the devices within the computer. The length for each opening may vary between 0.75 mm to 1.5 mm. In one example, the approximate length for each opening may be approximately 1 mm. The particular length for each opening between the ribs 32 may be similar or different from one another and may vary based on which particular length provides for optimal movement while minimizing the amount of vibrations that are transmitted from the assembly 20. While FIG. 4 illustrates that the ribs 32 are equally spaced from one another, it is contemplated that the ribs 32 may be spaced in a non-equal manner from one another.
  • In general, the retention pegs 26 may prevent the first and the second bracket members 22 a-22 b from buckling due the increased retention characteristic provided by the serrated ribs 32. In addition, the pegs 26 may assist in controlling the gaps G1 and G2 due to the increased retention characteristic provided by the serrated ribs 32.
  • Referring now to FIG. 5, a computer system 80 in accordance to one embodiment of the present invention is shown. The computer system 80 includes a plurality of fan assemblies 82, a HDD 84, a power supply 86, and a plurality of electronics 88. In general, the fan assemblies 82 may be implemented to include one or more fan assemblies 20 as described above in connection with FIGS. 3-4. It is generally contemplated that any number of fans may be positioned within each fan assembly 82. The fan assemblies 82 are generally positioned within a computer chassis 92 and comprise first and second rows 90 a and 90 b. The first row 90 a of fan assemblies 82 are configured to move heat away from the HDD 84. The second row 90 b of fan assemblies 82 are configured to move heat away from the power supply 86 and the plurality of electronics 88.
  • While embodiments of the invention have been illustrated and described, it is not intended that these embodiments illustrate and describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention.

Claims (23)

1. A fan assembly for a computer, the assembly comprising:
a fan housing defining at least one recess therein for directing heat away from a plurality of electrical components positioned within the computer;
at least one bracket member for supporting the fan housing within the computer; and
at least one retention peg disposed on the at least one bracket member, the at least one retention peg including a plurality of ribs that are radially spaced apart from one another for insertion into the at least one recess to retain the at least one bracket member to the fan housing, wherein the at least one retention peg and the plurality of ribs are constructed from a first material and the at least one bracket member is constructed from a second material, the first material being different from the second material.
2. The fan assembly of claim 1 wherein the plurality of ribs are constructed of a thermoplastic elastomer for isolating vibration.
3. The fan assembly of claim 1 the plurality of ribs are constructed with a preselected durometer to facilitate compression of the ribs by 20% to 40% upon insertion into the at least one recess.
4. The fan assembly of claim 1 wherein each rib is generally equally spaced apart.
5. The fan assembly of claim 1 wherein each rib is not equally spaced apart.
6. The fan assembly of claim 1 wherein the at least one retention peg and the plurality of ribs define a generally cylindrical cross section having a diameter between 4 mm and 6 mm.
7. (canceled)
8. The fan assembly of claim 1 wherein each rib is tapered by 6 to 10 degrees to facilitate insertion of the at least one retention peg into the at least one recess.
9. The fan assembly of claim 1 wherein each rib includes a hardness between Shore A Durometer 40 hardness and Shore A Durometer 70 hardness.
10. A system for cooling a plurality of computer components, the system comprising:
a computer chassis;
a fan housing defining at least one recess therein for cooling the plurality of computer components;
at least one bracket member for supporting the fan housing on the computer chassis; and
at least one retention peg disposed on the at least one bracket member and including a plurality of ribs that are radially spaced apart from one another for insertion into the at least one recess to retain the at least one bracket member to the fan housing, wherein the at least one retention peg and the plurality of ribs are constructed from a first material and the at least one bracket member is constructed from a second material, the first material being different from the second material.
11. The system of claim 10 wherein each rib within the plurality of ribs is constructed of a thermoplastic elastomer for isolating vibration.
12. The system of claim 10 wherein the plurality of ribs are constructed with a preselected durometer to facilitate compression of the ribs by 20% to 40% upon insertion into the at least one recess.
13. The system of claim 10 wherein each rib is generally equally spaced apart.
14. The system of claim 10 wherein the at least one retention peg and the plurality of ribs define a generally cylindrical cross section having a diameter between 4 mm and 6 mm.
15. (canceled)
16. The system of claim 10 wherein each rib is tapered by 6 to 10 degrees to facilitate insertion of the at least one retention peg into the at least one recess.
17. The system of claim 10 wherein each rib includes a Shore A Durometer hardness between 40 and 70.
18-20. (canceled)
21. The fan assembly of claim 1 wherein the first material is a thermoplastic elastomer and the second material is plastic.
22. The fan assembly of claim 1 wherein each rib is spaced apart at a predetermined length to allow desired movement of the fan housing with respect to the at least one retention peg by preventing a large surface area of the plurality of ribs from contacting the at least one recess when positioned therein such that the desired movement of the fan housing causes vibrations to be absorbed by the first material of the plurality of ribs thereby preventing such vibrations from being transmitted from the fan housing to the plurality of electrical components.
23. The system of claim 10 wherein the first material is a thermoplastic elastomer and the second material is plastic.
24. The system of claim 10 wherein each rib is spaced apart at a predetermined length to allow desired movement of the fan housing by preventing a large surface area of the plurality of ribs from contacting the at least one recess when positioned therein such that the desired movement of the fan housing causes vibrations to be absorbed by the first material of the plurality of ribs thereby preventing such vibrations from being transmitted from the fan housing to the plurality of electrical components.
25. A fan assembly for a computer, the assembly comprising:
a fan housing defining at least one recess therein for directing heat away from a plurality of electrical components positioned within the computer;
at least one bracket member for supporting the fan housing within the computer; and
at least one retention peg disposed on the at least one bracket member, the at least one retention peg including a plurality of ribs that are radially spaced apart from one another for insertion into the at least one recess to retain the at least one bracket member to the fan housing, wherein each rib is spaced apart at a predetermined length to allow desired movement of the fan housing by preventing a large surface area of the plurality of ribs from contacting the at least one recess when positioned therein such that the desired movement of the fan housing causes vibrations to be absorbed by an isolation material of the plurality of ribs thereby preventing such vibrations from being transmitted to the plurality of electrical components.
US12/199,916 2008-08-28 2008-08-28 Self-retaining vibration isolating fan mount assembly Active US7684191B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/199,916 US7684191B1 (en) 2008-08-28 2008-08-28 Self-retaining vibration isolating fan mount assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/199,916 US7684191B1 (en) 2008-08-28 2008-08-28 Self-retaining vibration isolating fan mount assembly

Publications (2)

Publication Number Publication Date
US20100053893A1 true US20100053893A1 (en) 2010-03-04
US7684191B1 US7684191B1 (en) 2010-03-23

Family

ID=41725165

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/199,916 Active US7684191B1 (en) 2008-08-28 2008-08-28 Self-retaining vibration isolating fan mount assembly

Country Status (1)

Country Link
US (1) US7684191B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100142143A1 (en) * 2008-12-10 2010-06-10 Sun Microsystems, Inc. Computer chassis fan modules providing vibration isolation and pinch release
US20110073731A1 (en) * 2009-09-29 2011-03-31 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Mounting apparatus for fan
US20130077242A1 (en) * 2011-09-23 2013-03-28 Inventec Corporation Fan structure and electronic device applied with the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102562624A (en) * 2010-12-21 2012-07-11 鸿富锦精密工业(深圳)有限公司 Fan combination
US8649172B2 (en) * 2012-02-07 2014-02-11 Aic Inc. Fixing assembly for fan module
CN103365365A (en) * 2012-03-28 2013-10-23 鸿富锦精密工业(深圳)有限公司 Fan fixing device

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5677829A (en) * 1995-06-07 1997-10-14 Thermalloy, Inc. Fan attachment clip for heat sink
US5788566A (en) * 1996-10-29 1998-08-04 Dell U.S.A., L.P. Integrated cooling fan and finger guard assembly
US6017185A (en) * 1998-08-13 2000-01-25 Chaun-Choung Industrial Corp. Fan fixing structure of a radiator
US6351380B1 (en) * 1999-11-12 2002-02-26 Dell Products, L.P. Cooling fan mounting arrangement
US6549406B1 (en) * 2002-05-09 2003-04-15 Sun Microsystems, Inc. Fan tray assembly for an electronics enclosure
US20040184234A1 (en) * 2003-01-28 2004-09-23 Fujitsu Limited Casing, equipment unit and fan units provided with the casing, and electronic equipment provided with the fan units
US20040240175A1 (en) * 2003-05-29 2004-12-02 Brovald Russell K. Fan holder and components cooling duct assembly
US6894897B1 (en) * 2003-12-12 2005-05-17 Lockheed Martin Corporation Structure-borne noise isolation technique and apparatus for fans and blowers
US7004236B2 (en) * 2003-01-29 2006-02-28 Hon Hai Precision Ind. Co., Ltd. Fan holder
US20060133035A1 (en) * 2004-12-17 2006-06-22 Hon Hai Precision Industry Co., Ltd. Cooling fan mounting arrangement with vibration isolation member
US7145771B2 (en) * 2003-06-17 2006-12-05 Wistron Neweb Corp. System structure and fan module thereof
US20070133169A1 (en) * 2005-12-14 2007-06-14 Inventec Corporation Assembly structure for securing heat-dissipating fan
US20070242433A1 (en) * 2006-04-14 2007-10-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7494408B2 (en) * 2005-12-30 2009-02-24 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Fan holder

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5677829A (en) * 1995-06-07 1997-10-14 Thermalloy, Inc. Fan attachment clip for heat sink
US5788566A (en) * 1996-10-29 1998-08-04 Dell U.S.A., L.P. Integrated cooling fan and finger guard assembly
US6017185A (en) * 1998-08-13 2000-01-25 Chaun-Choung Industrial Corp. Fan fixing structure of a radiator
US6351380B1 (en) * 1999-11-12 2002-02-26 Dell Products, L.P. Cooling fan mounting arrangement
US6549406B1 (en) * 2002-05-09 2003-04-15 Sun Microsystems, Inc. Fan tray assembly for an electronics enclosure
US20040184234A1 (en) * 2003-01-28 2004-09-23 Fujitsu Limited Casing, equipment unit and fan units provided with the casing, and electronic equipment provided with the fan units
US7004236B2 (en) * 2003-01-29 2006-02-28 Hon Hai Precision Ind. Co., Ltd. Fan holder
US20040240175A1 (en) * 2003-05-29 2004-12-02 Brovald Russell K. Fan holder and components cooling duct assembly
US7145771B2 (en) * 2003-06-17 2006-12-05 Wistron Neweb Corp. System structure and fan module thereof
US6894897B1 (en) * 2003-12-12 2005-05-17 Lockheed Martin Corporation Structure-borne noise isolation technique and apparatus for fans and blowers
US20060133035A1 (en) * 2004-12-17 2006-06-22 Hon Hai Precision Industry Co., Ltd. Cooling fan mounting arrangement with vibration isolation member
US20070133169A1 (en) * 2005-12-14 2007-06-14 Inventec Corporation Assembly structure for securing heat-dissipating fan
US7494408B2 (en) * 2005-12-30 2009-02-24 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Fan holder
US20070242433A1 (en) * 2006-04-14 2007-10-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100142143A1 (en) * 2008-12-10 2010-06-10 Sun Microsystems, Inc. Computer chassis fan modules providing vibration isolation and pinch release
US8182319B2 (en) * 2008-12-10 2012-05-22 Oracle America Inc. Computer chassis fan modules providing vibration isolation and pinch release
US20110073731A1 (en) * 2009-09-29 2011-03-31 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Mounting apparatus for fan
US20130077242A1 (en) * 2011-09-23 2013-03-28 Inventec Corporation Fan structure and electronic device applied with the same
US9017023B2 (en) * 2011-09-23 2015-04-28 Inventec Corporation Fan structure and electronic device applied with the same

Also Published As

Publication number Publication date
US7684191B1 (en) 2010-03-23

Similar Documents

Publication Publication Date Title
US7684191B1 (en) Self-retaining vibration isolating fan mount assembly
US10149399B1 (en) Solid state drive with improved enclosure assembly
US6351380B1 (en) Cooling fan mounting arrangement
US7352574B2 (en) Assembly and heat-dissipating device having the same assembly
US7567435B2 (en) Heat sink assembly
US8248778B2 (en) Fixing mechanism for storage device
US7315445B2 (en) Electrical apparatus
US20130315728A1 (en) Fixing device for fan
US20080151495A1 (en) Fan assembly
US8608438B2 (en) Mounting device for fan and fan module with the same
US20110158791A1 (en) Fan assembly with vibration absorbing member
US20100018670A1 (en) Heat Sink Assembly
US20120147545A1 (en) Mounting apparatus for data storage devices
US9022734B2 (en) Case structure and fan frame fixing module
US20150271943A1 (en) Electronic device
US20150305137A1 (en) Electronic device with combination heat sink/blower or fan assembly having air duct
US7855886B1 (en) Electronic device and heat dissipation apparatus thereof
US20140027604A1 (en) Mounting apparatus for fan
US20130168065A1 (en) Fixing device for fan
EP2456292A1 (en) Mounting apparatus for fans
US20110188201A1 (en) Electronic device with vibration-absorbing function
US8757581B2 (en) Fixing device for fan
US20130170135A1 (en) Airflow guide member and electronic device having the same
US20080315731A1 (en) Flexible mount for a fan and like devices
US9022724B2 (en) Anti-vibration serial fan structure

Legal Events

Date Code Title Description
AS Assignment

Owner name: SUN MICROSYSTEMS, INC.,CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WILLIS, CLIFFORD B.;DE MEULENAERE, WILLIAM A.;ONG, BRETT C.;SIGNING DATES FROM 20080821 TO 20080824;REEL/FRAME:021456/0397

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: ORACLE AMERICA, INC., CALIFORNIA

Free format text: MERGER AND CHANGE OF NAME;ASSIGNORS:ORACLE USA, INC.;SUN MICROSYSTEMS, INC.;ORACLE AMERICA, INC.;REEL/FRAME:037306/0268

Effective date: 20100212

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552)

Year of fee payment: 8

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 12