US20100038054A1 - Heat dispensing unit for memory chip - Google Patents

Heat dispensing unit for memory chip Download PDF

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Publication number
US20100038054A1
US20100038054A1 US12230639 US23063908A US2010038054A1 US 20100038054 A1 US20100038054 A1 US 20100038054A1 US 12230639 US12230639 US 12230639 US 23063908 A US23063908 A US 23063908A US 2010038054 A1 US2010038054 A1 US 2010038054A1
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US
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Application
Patent type
Prior art keywords
heat
dispensing
plates
unit
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12230639
Inventor
Wei-Hau Chen
Steven Yen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Comptake Tech Inc
Steven Yen
Original Assignee
Comptake Tech Inc
Steven Yen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip.

Description

    BACKGROUND OF THE INVENTION
  • [0001]
    (1) Field of the Invention
  • [0002]
    The present invention relates to a heat dispensing unit for removing heat from memory chips and the heat dispensing unit includes two clamps clamping tow ends of the heat dispensing unit.
  • [0003]
    (2) Description of the Prior Art
  • [0004]
    A conventional heat dispensing unit 30 for memory chips is shown in FIG. 4 and generally includes two heat conductive pads 301, two heat dispensing plates 302 and two clamps 303, wherein the heat conductive pads 301 are attached to in sides of the two heat dispensing plates 302 which have hooks 302 a, engaging holes 302 b and engaging pieces 302 c on a top thereof. When the two heat dispensing plates 302 are combined, a space is defined therebetween and the memory chip 2 is clamped. The engaging pieces 302 c each have a downward positioning plates 302 d which are located corresponding to the U-shaped restriction slots 304 on outsides of the heat dispensing plates 302. A through hole 305 is located above the restriction slot 304 and a guide slot 306 is located above the through hole 305 so that when the two clamps 303 clamp the two heat dispensing plates 302, the two clamps 303 are mounted onto the two positioning plates 302 d and the hoods 303 a are engaged with the through hole 305 via the guide slots 306 so that the two heat dispensing plates 302 can clamp the memory chip 20. The heat generated from the memory chip 2 is conducted to the heat dispensing unit 30 and releases to air.
  • [0005]
    However, the conventional heat dispensing unit 30 includes a complicated structure which includes hooks 303 a, restriction slots 304, through holes 305 and guide slots 306. The complicated structure makes the heat dispensing unit 30 to be expensive and time consuming when manufacturing. Besides, the two clamps 303 clamp at the top edges of the two heat dispensing plates 302 so that it is impossible to add extra heat dispensing plates 302 onto the top edges.
  • [0006]
    The existed heat dispensing unit cannot efficiently dispense the high temperature generated from the latest chips which operate at very high speed and the low efficient heat dispensing unit restricts the use of the high end CPU in computers.
  • [0007]
    The present invention intends to provide a heat dispensing unit for memory chips wherein the heat dispensing plates are securely connected to each other by two clamps clamping two ends of the heat dispensing plates. The clamps further hook the notches of the chip.
  • SUMMARY OF THE INVENTION
  • [0008]
    The present invention relates to a heat dispensing unit which comprises two heat dispensing plates between which the chip is clamped. Each heat dispensing plate has multiple ridges extending from an outside thereof and two holes are defined through two ends of each heat dispensing plate. Two clamps clamp the two ends of the two heat dispensing plates. Each clamp having two side plates and a flexible plate connected between the two side plates, two protrusions extend from two respective insides of the two side plates. The two protrusions are engaged with the holes of the two heat dispensing plates.
  • [0009]
    The primary object of the present invention is to provide a heat dispending unit for chips wherein the two heat dispensing plates are securely connected to each other by two clamps from two ends of the heat dispensing plates.
  • [0010]
    The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0011]
    FIG. 1 is an exploded view to show the heat dispensing unit of the present invention;
  • [0012]
    FIG. 2 is a perspective view to show that the chip is clamped between the two heat dispensing plates of the heat dispensing unit of the present invention;
  • [0013]
    FIG. 3 is a perspective view to show the clamp for clamping the two heat dispensing plates of the present invention, and
  • [0014]
    FIG. 4 is an exploded view to show the conventional heat dispensing unit.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • [0015]
    Referring to FIGS. 1 to 3, the heat dispensing unit 1 of the present invention comprises two heat dispensing plates 1 and each heat dispensing plate 1 includes multiple parallel ridges 14 extending from an outside thereof. Each of the heat dispensing plates 1 is an aluminum extruding plate. A heat conductive pad 13 is attached to the inside of each heat dispensing plate 1 and two holes 12 are defined through two ends of each of the two heat dispensing plates 1. The chip 2 that is clamped between the two heat dispensing plates 1 includes circuit pieces 21 extending therefrom which are in contact with the heat conductive pad 13. Two notches are defined in two ends of the chip 2.
  • [0016]
    Two clamps 3 clamp the two ends of the two heat dispensing plates 1 and each clamp 3 has two side plates 31 and a flexible plate 32 connected between the two side plates 31. Two protrusions 34 extend from two respective insides of the two side plates 31 so that the two protrusions 34 are engaged with the holes 12 of the two heat dispensing plates 1 to connect the two heat dispensing plates 1. Two hooks 33 extend from a lower edge of the flexible plate 32 and hook the two notches defined in two ends of the chip 2. By this arrangement, the heat dispensing plates 1, the chip 2 and the two clamps 3 are securely connected to each other.
  • [0017]
    Two heat dispensing parts 15 extend from a top of each of the heat dispensing plates 1 and the heat dispensing parts 15 extend inward from the top of each of the heat dispensing plates 1. Each heat dispensing part 15 includes three fins so as to increase the efficiency of removal of heat. The heat dispensing parts 15 of the two heat dispensing plates 1 are located so that when the two heat dispensing plates 1 are connected to each other by the clamps 3, the four heat dispensing part 15 are located head-to-tail to form a row of fins.
  • [0018]
    The heat dispensing plates 1 include the ridges 14, the heat conductive pad 13, the fins of the heat dispensing parts 15 to effectively remove heat from the chip 2. The clamps 3 are easily used and able to securely connect the heat dispensing plates 1 and the chip 2 to ensure that the chip 2 is in contact with the heat dispensing plates 1.
  • [0019]
    While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.

Claims (5)

  1. 1. A heat dispensing unit comprising:
    two heat dispensing plates and a chip being clamped between the two heat dispensing plates, each heat dispensing plate having multiple ridges extending from an outside thereof and two holes defined through two ends thereof, and
    Two clamps clamping the two ends of the two heat dispensing plates, each clamp having two side plates and a flexible plate connected between the two side plates, two protrusions extending from two respective insides of the two side plates, the two protrusions engaged with the holes of the two heat dispensing plates.
  2. 2. The heat dispensing unit as claimed in claim 1, wherein two hooks extending from a lower edge of the flexible plate and hook two notches defined in two ends of the chip.
  3. 3. The heat dispensing unit as claimed in claim 1, wherein a heat conductive pad is applied to an inside of each of the heat dispensing plates.
  4. 4. The heat dispensing unit as claimed in claim 1, wherein two heat dispensing parts extend from a top of each of the heat dispensing plates and the heat dispensing parts extend inward from the top of each of the heat dispensing plates.
  5. 5. The heat dispensing unit as claimed in claim 1, wherein each of the heat dispensing plates is an aluminum extruding plate.
US12230639 2008-08-18 2008-09-03 Heat dispensing unit for memory chip Abandoned US20100038054A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW97214762 2008-08-18
TW097214762 2008-08-18

Publications (1)

Publication Number Publication Date
US20100038054A1 true true US20100038054A1 (en) 2010-02-18

Family

ID=41680458

Family Applications (1)

Application Number Title Priority Date Filing Date
US12230639 Abandoned US20100038054A1 (en) 2008-08-18 2008-09-03 Heat dispensing unit for memory chip

Country Status (1)

Country Link
US (1) US20100038054A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761744S1 (en) 2012-07-18 2016-07-19 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US6233150B1 (en) * 1998-12-28 2001-05-15 Foxconn Precision Components Co., Ltd. Memory module assembly
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6728107B2 (en) * 2002-07-26 2004-04-27 Hon Hai Precision Ind. Co., Ltd. Mounting assembly for heat sink
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
US20070151705A1 (en) * 2005-12-30 2007-07-05 Kwan Rita Y Heat dissipating clamp for dissipating heat of chips in an electrical device
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US7365985B1 (en) * 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US20080101036A1 (en) * 2006-10-26 2008-05-01 Chiung Yi Chen Heat-dissipating assembly structure
US7391613B2 (en) * 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US20080151487A1 (en) * 2004-09-29 2008-06-26 Super Talent Electronics, Inc. Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive
US7532477B2 (en) * 2007-01-22 2009-05-12 June-On Co., Ltd. Memory module and heat sink arrangement
US7626823B2 (en) * 2008-04-11 2009-12-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly
US7920383B2 (en) * 2007-11-05 2011-04-05 Samsung Electronics Co., Ltd. Heat sink for dissipating heat and apparatus having the same

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US6233150B1 (en) * 1998-12-28 2001-05-15 Foxconn Precision Components Co., Ltd. Memory module assembly
US6765797B2 (en) * 2001-06-28 2004-07-20 Intel Corporation Heat transfer apparatus
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US20030026076A1 (en) * 2001-08-06 2003-02-06 Wen-Chen Wei Memory heat sink device
US6728107B2 (en) * 2002-07-26 2004-04-27 Hon Hai Precision Ind. Co., Ltd. Mounting assembly for heat sink
US7221569B2 (en) * 2004-09-15 2007-05-22 Comptake Technology Co., Ltd. Memory heat-dissipating device
US7365985B1 (en) * 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7768785B2 (en) * 2004-09-29 2010-08-03 Super Talent Electronics, Inc. Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive
US20080151487A1 (en) * 2004-09-29 2008-06-26 Super Talent Electronics, Inc. Memory Module Assembly Including Heat-Sink Plates With Heat-Exchange Fins Attached To Integrated Circuits By Adhesive
US7312996B2 (en) * 2005-03-14 2007-12-25 Wan Chien Chang Heat sink for memory strips
US20070151705A1 (en) * 2005-12-30 2007-07-05 Kwan Rita Y Heat dissipating clamp for dissipating heat of chips in an electrical device
US7382617B2 (en) * 2006-01-16 2008-06-03 Nanya Technology Corporation Heat sink assembly
US20070165382A1 (en) * 2006-01-16 2007-07-19 Nanya Technology Corporation Heat sink assembly
US7391613B2 (en) * 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US20080101036A1 (en) * 2006-10-26 2008-05-01 Chiung Yi Chen Heat-dissipating assembly structure
US7532477B2 (en) * 2007-01-22 2009-05-12 June-On Co., Ltd. Memory module and heat sink arrangement
US7920383B2 (en) * 2007-11-05 2011-04-05 Samsung Electronics Co., Ltd. Heat sink for dissipating heat and apparatus having the same
US7626823B2 (en) * 2008-04-11 2009-12-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761744S1 (en) 2012-07-18 2016-07-19 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module

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Legal Events

Date Code Title Description
AS Assignment

Owner name: COMPTAKE TECHNOLOGY INC.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, WEI-HAU;YEN, STEVEN;REEL/FRAME:021520/0439

Effective date: 20080828