BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention generally relates to a heat-dissipating device, in particular, to a heat-dissipating device having a vapor chamber in curved configuration.
2. Description of Prior Art
Applying a thermal dissipater to dissipate heat generated from electronic component is a well-known technique. Traditionally thermal dissipater is mainly constructed by a thermally conducting base contacted with a heat source and a plurality of cooling fins arranged on the thermally conducting base. Through a surface area of each cooling fin, the entirely cooling area of the thermal dissipater is thus enhanced. The cooling effectiveness provided by a thermal dissipater is usually preferred, when the quantity of the cooling fin is increased or the cooling area of a single cooling fin is enlarged, under the condition that same material has a same cooling coefficient.
In addition, a specifically heat-conducting element possessed of a heat-transferring function is sometimes applied in a heat-dissipating field by means of a phase-changing circulation occurred between vapor and liquid phases such as heat pipe or vapor chamber. Especially for a heat pipe, since of the merits of easy manufacture and less space occupation in terms of a flat plate configuration, through an extension of pipe length, a heat generated from CPU can be horizontally transferred to a cooling area and then thermally dissipated by other cooling mechanisms such as fin or fan. On the other hand, a vapor chamber is sometimes applied in a replacement of the thermally conducting base of the aforementioned cooler through arranging a plurality of cooling fins thereon.
However, according to the prior vapor chamber, due to a flat characteristic of a long plate, only two surfaces with larger area can be applied for the heated and condensed purposes, so the distance between the heated surface and the condensed surface is so small that the vapor chamber is sometimes unable to develop its coherent effectiveness in the occasion of air-conditioning application, because enough temperature difference can not be generated through such small distance to provide sufficiently thermal transfer.
- SUMMARY OF THE INVENTION
Accordingly, aiming to solving the aforementioned shortcomings, after a substantially devoting study, in cooperation with the application of relatively academic principles, the inventor has at last proposed the present invention “Heat-Dissipating Device of Curved Vapor Chamber” that is designed reasonably to possess the capability to improve the prior arts significantly.
The invention is mainly to provide a heat-dissipating device of vapor chamber in curved configuration, by which an internally phase-changing route is changed by effectively generating an accommodating space to thereby provide an externally heat-transferring route additionally.
BRIEF DESCRIPTION OF DRAWING
Secondly, the invention is to provide a heat-dissipating device of vapor chamber in curved configuration, including a vapor chamber shown as a flat long plate, a heat-dissipating plate superposed on the vapor chamber, and a first fin set. The middle portion of the vapor chamber is designed as a heated section, two sides of which respectively have a condensing section. Two curvedly extending sections are respectively disposed between the heated section and the condensing sections. Each condensing section is extended to a higher position of the heated section through the bending of each extending section. The heat-dissipating plate is horizontally attached onto the two condensing sections, thus that a section-differential space formed between the heat-dissipating plate and the heated section accommodates the first fin set thermally contacted with the heated section of the vapor chamber. According to above structure, a heat-dissipating device of vapor chamber in curved configuration is thus obtained to meet the aforementioned objects.
The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes several exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a perspective explosive view according to the first embodiment of the present invention;
FIG. 2 is a perspective assembled view according to the first embodiment of the present invention viewed from another angle;
FIG. 3 is a planar sectional view of the first embodiment of the present invention;
FIG. 4 is an illustration of the first embodiment of the present invention under a using status; and
DETAILED DESCRIPTION OF THE INVENTION
FIG. 5 is an illustration of the second embodiment of the present invention under a using status.
In cooperation with attached drawings, the technical contents and detailed description of the invention are described thereinafter according to several preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
Please refer to FIG. 1 and FIG. 2, which respectively are a perspective explosive view and a perspective assembled view from another angle according to the first embodiment of the present invention. The invention is to provide a heat-dissipating device of vapor chamber in curved configuration, including a vapor chamber 1, a heat-dissipating plate 2, and a first fin set.
The vapor chamber 1 is a heat-conducting element providing a heat-transferring function through a vapor-liquid phase variation, an internal wall of which has a capillary wick, and which is internally shown as a sealed vacuum and is filled with working fluid. The vapor chamber 1 is shown as a long flat plate, a middle portion of which has a heated section 10, and two sides of which respectively has a condensing section 11. Respectively, two extending sections 12 shown as a curved configuration are arranged between the heated section 10 and the two condensing sections 11. The two condensing sections 11 are located at higher positions of the heated section 10 by the bending of the extending sections 12, thus that the two condensing sections 11 can be formed as a symmetric configuration.
The heat-dissipating plate 2 shown as a flat long configuration is usually made of a material capable of excellently thermal dissipation such as copper or aluminum. The heat-dissipating plate 2 is at first superposed on the aforementioned vapor chamber 1 and is then horizontally attached onto the two condensing sections 11 of the vapor chamber 1 to form a section-differential space 100 above the heated section 10 of the vapor chamber 1. In addition, according to one preferable embodiment of the invention, the area of the upper and lower surfaces of the heat-dissipating plate 2 is larger than that of the vapor chamber 1. Because a plurality of vapor chambers 1 can be arranged in parallel, the contacting area between the vapor chamber 1 and the heat-dissipating plate 2 can be enlarged.
The first fin set 3 accommodated in the section-differential space 100 is constructed by a plurality of cooling fins 30 horizontally interspaced and thermally contacted with respect to the heated section 10 of the vapor chamber 1. When a plurality of vapor chambers 1 are arranged in parallel, the first fin set 3 can be arranged across the heated sections 10 of the vapor chambers 1 or a plurality of first fin sets 3 can be arranged separately with respect to each heated section 10 of the vapor chambers 1 (not shown in the figures). As shown in FIG. 3, according to the first embodiment of the present invention, the top of the first fin set 3 is kept a distance from the lower surface of the heat-dissipating plate 2 without any contact.
In addition, a second fin set 4 constructed by a plurality of cooling fins 40 horizontally interspaced can be further arranged on the aforementioned heat-dissipating plate 2 and thermally contacted with the upper surface thereof.
Therefore, by assembling the aforementioned structures, a heat-dissipating device of vapor chamber in cured configuration is thus obtained.
Accordingly, as shown in FIG. 4, when the heat-dissipating device is applied to an electronic element 5 such as CPU, the lower surface of the heated section 10 of the vapor chamber 1 is attached onto the upper surface of the electronic element 5. The thermally conducting routes provided by the heat-dissipating device can be divided into two ways as the follow:
Firstly, the two condensing sections 11 located at higher side positions of the heated section 10 of the vapor chamber 1 can provide a thermally conducting route in a horizontally extending way; namely, when the heated section 10 of the vapor chamber 1 is heated by the heat generated from the electronic element 5, the vapor chamber 1 can quickly transfer the heat absorbed by the heated section 10 toward the two condensing sections 11 and dissipated by the heat-dissipating plate 2, making a phase-changing circulation formed in the vapor chamber, and developing a thermally conducting effectiveness that should be possessed by a vapor chamber 1.
Secondly, the first fin set 3 located on the heated section 10 of the vapor chamber 1 can directly help the heat-dissipating procedure of the heated section 10 of the vapor chamber 1 through the cooling effectiveness provided by the cooling air in the section-differential space 100 or as shown in FIG. 5, the top of the first fin set 3 is thermally contacted with the lower surface of the heat-dissipating plate 2 to transfer the absorbed heat toward the middle section of the heat-dissipating plate 2; thereby, a further cooling is provided by the second fin set 4, effectively using every part of the heat-dissipating plate 2, which is capable of providing a heat-dissipating function.
According to aforementioned description, the invention is a novel structure for a vapor chamber indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
Moreover, the aforementioned description is only several preferable embodiments according to the present invention, being not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.