US20090166655A1 - Light-emitting diode structure - Google Patents
Light-emitting diode structure Download PDFInfo
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- US20090166655A1 US20090166655A1 US11/968,038 US96803807A US2009166655A1 US 20090166655 A1 US20090166655 A1 US 20090166655A1 US 96803807 A US96803807 A US 96803807A US 2009166655 A1 US2009166655 A1 US 2009166655A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Definitions
- the present invention relates to a light-emitting diode (LED) structure, and more particularly to an LED structure that could be easily mounted to and dismounted from a power supply board and therefore be conveniently replaced when necessary.
- LED light-emitting diode
- a light-emitting diode has the advantages of having simple structure and providing high brightness, and is therefore widely employed in advertising and illuminating facilities, such as large-scaled outdoor TV walls, large-scaled outdoor signboards, car lights, flashlights, etc.
- the LED has a longer and a shorter pin, and the two pins have different polarities.
- a user has to check whether two insertion holes on the power supply board for receiving the two pins of the LED respectively have a polarity the same as that of the pin to be received therein.
- the user has to turn the LED for the pins thereof to separately align with an insertion hole having a matched polarity, so that the LED may be correctly mounted on the power supply board. Therefore, the mounting of the conventional LED to a power supply board is troublesome and inconvenient. Similarly, it is uneasy to dismount or replace the conventional LED when the same is failed.
- a primary object of the present invention is to provide an improved LED structure that can be easily mounted on and dismounted from a power supply board, and can therefore be conveniently replaced when necessary.
- the LED structure of the present invention includes a first conductive body having an upward projected conducting portion; a first insulating body having an insulating sleeve portion and being disposed on the first conductive body with the insulating sleeve portion fitted around the conducting portion, such that a conducting section at a top of the conducting portion is exposed at the insulating sleeve portion; a second conductive body having a through opening and being disposed on the first insulating body with the insulating sleeve portion upward extended through the opening to electrically isolate the second conductive body from the first conductive body; and an LED having at least one first electrode in electric contact with the conducting section of the first conductive body and at least one second electrode in electric contact with the second conductive body.
- FIG. 1 is an exploded perspective view of an LED structure according to a first preferred embodiment of the present invention
- FIG. 2 is an assembled view of FIG. 1 ;
- FIG. 3 is an assembled perspective view of an LED structure according to a second preferred embodiment of the present invention.
- FIG. 4 is a vertical sectional view of FIG. 3 ;
- FIG. 5 is an assembled perspective view of an LED structure according to a third preferred embodiment of the present invention.
- FIG. 6 is an assembled perspective view of an LED structure according to a fourth preferred embodiment of the present invention.
- FIG. 7 is a vertical sectional view of FIG. 6 ;
- FIG. 8 is an exploded view of an LED structure according to a fifth preferred embodiment of the present invention.
- FIG. 9 is an assembled vertical sectional view of FIG. 8 ;
- FIG. 10 is an exploded view of an LED structure according to a sixth preferred embodiment of the present invention.
- FIG. 11 is an assembled vertical sectional view of FIG. 10 ;
- FIG. 12 is an exploded view of an LED structure according to a seventh preferred embodiment of the present invention.
- FIG. 13 is an assembled view of FIG. 12 ;
- FIG. 14 is a vertical sectional view of FIG. 13 ;
- FIG. 15 is an exploded view of an LED structure according to an eighth preferred embodiment of the present invention.
- FIG. 16 is an assembled view of FIG. 15 ;
- FIG. 17 is a vertical sectional view of FIG. 16 ;
- FIG. 18 is an exploded view of an LED structure according to a ninth preferred embodiment of the present invention.
- FIG. 19 is an assembled view of FIG. 18 ;
- FIG. 20 is a vertical sectional view of FIG. 19 ;
- FIG. 21 is an exploded view of an LED structure according to a tenth preferred embodiment of the present invention.
- FIG. 22 is an assembled view of FIG. 21 ;
- FIG. 23 is a vertical sectional view of FIG. 22 .
- FIGS. 1 and 2 are exploded and assembled perspective views, respectively, of an LED structure according to a first preferred embodiment of the present invention.
- the LED structure includes a first conductive body 1 , a second conductive body 2 , a first insulating body 3 , and an LED 4 .
- the first conductive body 1 includes an upward projected conducting portion 11 , which may be a cylindrical post.
- the first insulating body 3 includes an insulating sleeve portion 31 , which may be a hollow boss, such that the first insulating body 3 may be disposed on the first conductive body 1 with the insulating sleeve portion 31 fitted around the upward projected conducting portion 11 . It is noted a conducting section 111 at a top of the projected conducting portion 11 is exposed at the sleeve portion 31 .
- the second conductive body 2 includes a through opening 21 and is disposed on the first insulating body 3 , such that the hollow cylindrical insulating sleeve portion 31 of the first insulating body 3 is upward extended through the opening 21 . Meanwhile, the second conductive body 2 is electrically isolated from the first conductive body 1 by the first insulating body 3 .
- the LED 4 is mounted on the conducting section 111 , such that a first electrode 41 located at a lower side of the LED 4 is in electric contact with the conducting section 111 and four second electrodes 42 spaced at four sides of the LED 4 are electrically connected to the second conductive body 2 .
- a first electrode 41 located at a lower side of the LED 4 is in electric contact with the conducting section 111 and four second electrodes 42 spaced at four sides of the LED 4 are electrically connected to the second conductive body 2 .
- By increasing the number of the second electrodes 42 it is possible to increase the amount of conducted electric current. Heat produced by the LED 4 during the operation thereof may also be radiated from the second electrodes 42 and dissipated into ambient environment.
- FIGS. 3 and 4 are assembled perspective view and vertical sectional view, respectively, of an LED structure according to a second preferred embodiment of the present invention.
- the second embodiment is generally structural similar to the first embodiment, but further includes a light hood 6 .
- the light hood 6 may be semispherical in shape for covering the LED 4 , the first electrode 41 , and the four second electrodes 42 therein, so as to shield the LED 4 , the first electrode 41 , and the four second electrodes 42 from destructive factors in the ambient environment.
- the light hood 6 also concentrates or diffuses the light emitted by the LED 4 .
- a main body 5 is formed.
- the main body 5 is in the shape of a square base.
- FIG. 5 is an assembled perspective view of an LED structure according to a third preferred embodiment of the present invention.
- the third embodiment is generally structural similar to the second embodiment, except that the light hood 6 in the third embodiment is rectangular in shape.
- FIGS. 6 and 7 are assembled perspective and vertical sectional views, respectively, of an LED structure according to a fourth preferred embodiment of the present invention.
- the fourth embodiment is generally structurally similar to the second embodiment, but further includes a second insulating body 43 disposed between the LED 4 and the conducting section 111 , and has two first electrodes 44 electrically connected to the conducting section 111 , and two second electrodes 42 located at two sides of the LED 4 and electrically connected to the second conductive body 2 .
- By increasing the number of the first and the second electrodes 44 , 42 it is possible to increase the amount of conducted electric current. Heat produced by the LED 4 during the operation thereof may also be radiated from the first and the second electrodes 44 , 42 and dissipated into ambient environment.
- FIGS. 8 and 9 are exploded perspective view and assembled vertical sectional view, respectively, of an LED structure according to a fifth embodiment of the present invention.
- the LED structure of the fifth embodiment is a combination of the LED structure of the second embodiment and a power supply board 7 .
- the power supply board 7 includes a first conducting layer 71 , a second conducting layer 72 , an insulating layer 73 , and an upper conductive cover plate 8 .
- the insulating layer 73 is located on the first conducting layer 71
- the second conducting layer 72 is located on the insulating layer 73 .
- the upper conductive cover plate 8 is provided with a through opening 81
- the second conducting layer 72 is provided with an upper opening 741
- the insulating layer 73 is provided with a receiving space 74 .
- the LED structure of the second embodiment is mounted on the power supply board 7 in the receiving space 74 via the upper opening 741 , such that the first conductive body 1 is in electric contact with the first conducting layer 71 .
- the upper conductive cover plate 8 is then fastened to the upper opening 741 , so that the second conductive body 2 is in electric contact with the upper conductive cover plate 8 and the light hood 6 is upward protruded from the through opening 81 .
- FIGS. 10 and 11 are exploded perspective view and assembled vertical sectional view, respectively, of an LED structure according to a sixth embodiment of the present invention.
- the LED structure of the sixth embodiment is a combination of the LED structure of the second embodiment and a power supply board 7 .
- the power supply board 7 includes a first conducting layer 71 , a second conducting layer 72 , an insulating layer 73 , and a lower conductive cover plate 9 .
- the insulating layer 73 is located on the first conducting layer 71
- the second conducting layer 72 is located on the insulating layer 73 .
- the first conducting layer 71 is provided with a lower opening 743
- the second conducting layer 72 is provided with a through opening 742
- the insulating layer 73 is provided with a receiving space 74 .
- the LED structure of the second embodiment is mounted on the power supply board 7 in the receiving space 74 via the lower opening 743 , such that the light hood 6 is upward protruded from the through opening 742 , and the second conductive body 2 is in electric contact with the second conducting layer 72 .
- the lower conductive cover plate 9 is then fastened to the lower opening 743 , so that the first conductive body 1 is in electric contact with the lower conductive cover plate 9 .
- FIGS. 12 to 14 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to a seventh embodiment of the present invention.
- the LED structure of the seventh embodiment is a combination of the LED structure of the second embodiment and a power supply board 7 .
- the power supply board 7 includes a first conducting layer 71 , a second conducting layer 72 , and an insulating layer 73 .
- the insulating layer 73 is located on the first conducting layer 71
- the second conducting layer 72 is located on the insulating layer 73 .
- the insulating layer 73 is provided with a receiving space 731
- the second conducting layer 72 is provided near a middle portion with a first opening 721 and at two opposite ends of the first opening 721 with two second openings 722 , which have a width smaller than that of the first opening 721 and are communicable with the first opening 721 .
- the LED structure of the second embodiment is mounted on the power supply boar 7 in the receiving space 731 via the first opening 721 , and is then moved to one of the two second openings 722 . With the reduced width of the second opening 722 , the main body 5 of the LED structure of the second embodiment is held in the receiving space 731 below the second opening 722 .
- a conducting spring leaf 711 is provided on the first conducting layer 71 in each of the second openings 722 , such that when the main body 5 is received in the receiving space 731 below the second opening 722 , the conducting spring leaf 711 is located between the first conductive body 1 and the first conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receiving space 731 .
- FIGS. 15 to 17 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to an eighth embodiment of the present invention.
- the LED structure of the eighth embodiment is a combination of the LED structure of the second embodiment and a power supply board 7 .
- the power supply board 7 includes a first conducting layer 71 , a second conducting layer 72 , and an insulating layer 73 .
- the insulating layer 73 is located on the first conducting layer 71
- the second conducting layer 72 is located on the insulating layer 73 .
- the insulating layer 73 is provided with a receiving space 732
- the second conducting layer 72 is provided with an opening 723 .
- the LED structure of the second embodiment is mounted on the power supply boar 7 in the receiving space 732 via the opening 723 , and is then turned relative to the opening 723 , so that the main body 5 of the LED structure of the second embodiment is held in the receiving space 732 below the opening 723 .
- the first conductive body 1 is in electric contact with the first conducting layer 71
- the second conductive body 2 is in electric contact with the second conducting layer 72
- the light hood 6 is upward protruded from the opening 723 .
- a conducting spring leaf 711 is provided on the first conducting layer 71 in the receiving space 732 , such that when the main body 5 is received in the receiving space 732 below the opening 723 , the conducting spring leaf 711 is located between the first conductive body 1 and the first conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receiving space 732 .
- FIGS. 18 to 20 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to a ninth embodiment of the present invention.
- the LED structure of the ninth embodiment is a combination of the LED structure of the second embodiment and a power supply board 7 .
- the power supply board 7 includes a first conducting layer 71 , a second conducting layer 72 , and an insulating layer 73 .
- the insulating layer 73 is located on the first conducting layer 71
- the second conducting layer 72 is located on the insulating layer 73 .
- the insulating layer 73 is provided with a receiving space 732
- the second conducting layer 72 is provided with an opening 723 .
- a plurality of elastically retractable conducting terminals 724 is provided along the opening 723 to normally project from an inner rim of the opening 723 .
- the LED structure of the second embodiment is mounted on the power supply boar 7 in the receiving space 732 via the opening 723 .
- the conducting terminals 724 are elastically pushed backward by the main body 5 .
- the conducting terminals 724 are elastically restored to the projected position to electrically contact with the second conductive body 2 and hold the main body 5 in the receiving space 732 below the opening 723 .
- a conducting spring leaf 711 is provided on the first conducting layer 71 in the receiving space 732 , such that when the main body 5 is received in the receiving space 732 below the opening 723 , the conducting spring leaf 711 is located between the first conductive body 1 and the first conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receiving space 732 .
- FIGS. 21 to 23 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to a tenth embodiment of the present invention.
- the LED structure of the tenth embodiment is a combination of the LED structure of the second embodiment and a power supply board 7 .
- the power supply board 7 includes a first conducting layer 71 , a second conducting layer 72 , and an insulating layer 73 .
- the insulating layer 73 is located on the first conducting layer 71
- the second conducting layer 72 is located on the insulating layer 73 .
- the insulating layer 73 is provided with a receiving space 732
- the second conducting layer 72 is provided with an opening 723 .
- the LED structure of the second embodiment is mounted on the power supply boar 7 in the receiving space 732 with the first conductive body 1 in electric contact with the first conducting layer 71 . Then, the second conductive body 2 is fastened to a top of the insulating layer 73 using a plurality of screws 10 , allowing the light hood 6 to upward protrude from the opening 723 , and the second conductive body 2 to electric contact with the second conducting layer 72 .
- a conducting spring leaf 711 is provided on the first conducting layer 71 in the receiving space 732 , such that when the main body 5 is received in the receiving space 732 below the opening 723 , the conducting spring leaf 711 is located between the first conductive body 1 and the first conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receiving space 732 .
- the first electrodes 41 , 44 , the conducting section 111 on the first conductive body 1 , and the first conducting layer 71 have the same polarity, which may be positive or negative.
- the second electrodes 42 , the second conductive body 2 , and the second conducting layer 72 have the same polarity, which is different from the polarity of the first electrodes, the conducting section, and the first conducting layer, and may be negative or positive.
- the LED structure of the present invention can be mounted to the power supply board without the need of distinguishing the polarities of electrodes. A user needs only to dispose the LED structure in the receiving space formed on the power supply board and cause the LED structure to be held in the receiving space. Therefore, the LED structure of the present invention is easy to mount to and dismount from the power supply board, and can be conveniently replaced when necessary.
- the second conductive body, the insulating body, and the first conductive body are sequentially stacked from top to bottom with the conducting portion of the first conductive body upward extended through the insulating body and the second conductive body to expose the conducting section at the sleeve portion, so that the LED may be mounted on the top of the conducting section of the first conductive body and electrically connected to the second conductive body.
- the LED structure of the present invention could be very easily mounted to and dismounted from a power supply board, and accordingly, be conveniently replaced when necessary. Therefore, the present invention is novel, improved, and industrially valuable for use.
Abstract
Description
- The present invention relates to a light-emitting diode (LED) structure, and more particularly to an LED structure that could be easily mounted to and dismounted from a power supply board and therefore be conveniently replaced when necessary.
- A light-emitting diode (LED) has the advantages of having simple structure and providing high brightness, and is therefore widely employed in advertising and illuminating facilities, such as large-scaled outdoor TV walls, large-scaled outdoor signboards, car lights, flashlights, etc. Conventionally, the LED has a longer and a shorter pin, and the two pins have different polarities. To mount the conventional LED to a power supply board, a user has to check whether two insertion holes on the power supply board for receiving the two pins of the LED respectively have a polarity the same as that of the pin to be received therein. If not, the user has to turn the LED for the pins thereof to separately align with an insertion hole having a matched polarity, so that the LED may be correctly mounted on the power supply board. Therefore, the mounting of the conventional LED to a power supply board is troublesome and inconvenient. Similarly, it is uneasy to dismount or replace the conventional LED when the same is failed.
- It is therefore tried by the inventor to develop an LED structure that could be very easily mounted to and dismounted from a power supply board, and accordingly, be conveniently replaced when necessary.
- A primary object of the present invention is to provide an improved LED structure that can be easily mounted on and dismounted from a power supply board, and can therefore be conveniently replaced when necessary.
- To achieve the above and other objects, the LED structure of the present invention includes a first conductive body having an upward projected conducting portion; a first insulating body having an insulating sleeve portion and being disposed on the first conductive body with the insulating sleeve portion fitted around the conducting portion, such that a conducting section at a top of the conducting portion is exposed at the insulating sleeve portion; a second conductive body having a through opening and being disposed on the first insulating body with the insulating sleeve portion upward extended through the opening to electrically isolate the second conductive body from the first conductive body; and an LED having at least one first electrode in electric contact with the conducting section of the first conductive body and at least one second electrode in electric contact with the second conductive body.
- The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
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FIG. 1 is an exploded perspective view of an LED structure according to a first preferred embodiment of the present invention; -
FIG. 2 is an assembled view ofFIG. 1 ; -
FIG. 3 is an assembled perspective view of an LED structure according to a second preferred embodiment of the present invention; -
FIG. 4 is a vertical sectional view ofFIG. 3 ; -
FIG. 5 is an assembled perspective view of an LED structure according to a third preferred embodiment of the present invention; -
FIG. 6 is an assembled perspective view of an LED structure according to a fourth preferred embodiment of the present invention; -
FIG. 7 is a vertical sectional view ofFIG. 6 ; -
FIG. 8 is an exploded view of an LED structure according to a fifth preferred embodiment of the present invention; -
FIG. 9 is an assembled vertical sectional view ofFIG. 8 ; -
FIG. 10 is an exploded view of an LED structure according to a sixth preferred embodiment of the present invention; -
FIG. 11 is an assembled vertical sectional view ofFIG. 10 ; -
FIG. 12 is an exploded view of an LED structure according to a seventh preferred embodiment of the present invention; -
FIG. 13 is an assembled view ofFIG. 12 ; -
FIG. 14 is a vertical sectional view ofFIG. 13 ; -
FIG. 15 is an exploded view of an LED structure according to an eighth preferred embodiment of the present invention; -
FIG. 16 is an assembled view ofFIG. 15 ; -
FIG. 17 is a vertical sectional view ofFIG. 16 ; -
FIG. 18 is an exploded view of an LED structure according to a ninth preferred embodiment of the present invention; -
FIG. 19 is an assembled view ofFIG. 18 ; -
FIG. 20 is a vertical sectional view ofFIG. 19 ; -
FIG. 21 is an exploded view of an LED structure according to a tenth preferred embodiment of the present invention; -
FIG. 22 is an assembled view ofFIG. 21 ; and -
FIG. 23 is a vertical sectional view ofFIG. 22 . - Please refer to
FIGS. 1 and 2 that are exploded and assembled perspective views, respectively, of an LED structure according to a first preferred embodiment of the present invention. As shown, in the first preferred embodiment, the LED structure includes a firstconductive body 1, a secondconductive body 2, a firstinsulating body 3, and anLED 4. - The first
conductive body 1 includes an upward projected conductingportion 11, which may be a cylindrical post. - The first insulating
body 3 includes aninsulating sleeve portion 31, which may be a hollow boss, such that the first insulatingbody 3 may be disposed on the firstconductive body 1 with the insulatingsleeve portion 31 fitted around the upward projected conductingportion 11. It is noted a conductingsection 111 at a top of the projected conductingportion 11 is exposed at thesleeve portion 31. - The second
conductive body 2 includes a through opening 21 and is disposed on the firstinsulating body 3, such that the hollow cylindricalinsulating sleeve portion 31 of the firstinsulating body 3 is upward extended through the opening 21. Meanwhile, the secondconductive body 2 is electrically isolated from the firstconductive body 1 by the firstinsulating body 3. - The
LED 4 is mounted on the conductingsection 111, such that afirst electrode 41 located at a lower side of theLED 4 is in electric contact with the conductingsection 111 and foursecond electrodes 42 spaced at four sides of theLED 4 are electrically connected to the secondconductive body 2. By increasing the number of thesecond electrodes 42, it is possible to increase the amount of conducted electric current. Heat produced by theLED 4 during the operation thereof may also be radiated from thesecond electrodes 42 and dissipated into ambient environment. - Please refer to
FIGS. 3 and 4 , which are assembled perspective view and vertical sectional view, respectively, of an LED structure according to a second preferred embodiment of the present invention. The second embodiment is generally structural similar to the first embodiment, but further includes alight hood 6. Thelight hood 6 may be semispherical in shape for covering theLED 4, thefirst electrode 41, and the foursecond electrodes 42 therein, so as to shield theLED 4, thefirst electrode 41, and the foursecond electrodes 42 from destructive factors in the ambient environment. Thelight hood 6 also concentrates or diffuses the light emitted by theLED 4. - When the first insulating
body 3 has been disposed on the firstconductive body 1 and the secondconductive body 2 is sequentially disposed on the first insulatingbody 3, amain body 5 is formed. In the illustrated preferred embodiments of the present invention, themain body 5 is in the shape of a square base. -
FIG. 5 is an assembled perspective view of an LED structure according to a third preferred embodiment of the present invention. The third embodiment is generally structural similar to the second embodiment, except that thelight hood 6 in the third embodiment is rectangular in shape. -
FIGS. 6 and 7 are assembled perspective and vertical sectional views, respectively, of an LED structure according to a fourth preferred embodiment of the present invention. The fourth embodiment is generally structurally similar to the second embodiment, but further includes a secondinsulating body 43 disposed between theLED 4 and the conductingsection 111, and has twofirst electrodes 44 electrically connected to the conductingsection 111, and twosecond electrodes 42 located at two sides of theLED 4 and electrically connected to the secondconductive body 2. By increasing the number of the first and thesecond electrodes LED 4 during the operation thereof may also be radiated from the first and thesecond electrodes -
FIGS. 8 and 9 are exploded perspective view and assembled vertical sectional view, respectively, of an LED structure according to a fifth embodiment of the present invention. As shown, the LED structure of the fifth embodiment is a combination of the LED structure of the second embodiment and apower supply board 7. Thepower supply board 7 includes a first conductinglayer 71, a second conductinglayer 72, aninsulating layer 73, and an upperconductive cover plate 8. Theinsulating layer 73 is located on the first conductinglayer 71, and the second conductinglayer 72 is located on theinsulating layer 73. The upperconductive cover plate 8 is provided with a throughopening 81, thesecond conducting layer 72 is provided with anupper opening 741, and the insulatinglayer 73 is provided with a receivingspace 74. The LED structure of the second embodiment is mounted on thepower supply board 7 in the receivingspace 74 via theupper opening 741, such that the firstconductive body 1 is in electric contact with thefirst conducting layer 71. The upperconductive cover plate 8 is then fastened to theupper opening 741, so that the secondconductive body 2 is in electric contact with the upperconductive cover plate 8 and thelight hood 6 is upward protruded from the throughopening 81. -
FIGS. 10 and 11 are exploded perspective view and assembled vertical sectional view, respectively, of an LED structure according to a sixth embodiment of the present invention. As shown, the LED structure of the sixth embodiment is a combination of the LED structure of the second embodiment and apower supply board 7. Thepower supply board 7 includes afirst conducting layer 71, asecond conducting layer 72, an insulatinglayer 73, and a lowerconductive cover plate 9. The insulatinglayer 73 is located on thefirst conducting layer 71, and thesecond conducting layer 72 is located on the insulatinglayer 73. Thefirst conducting layer 71 is provided with alower opening 743, thesecond conducting layer 72 is provided with a throughopening 742, and the insulatinglayer 73 is provided with a receivingspace 74. The LED structure of the second embodiment is mounted on thepower supply board 7 in the receivingspace 74 via thelower opening 743, such that thelight hood 6 is upward protruded from the throughopening 742, and the secondconductive body 2 is in electric contact with thesecond conducting layer 72. The lowerconductive cover plate 9 is then fastened to thelower opening 743, so that the firstconductive body 1 is in electric contact with the lowerconductive cover plate 9. -
FIGS. 12 to 14 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to a seventh embodiment of the present invention. As shown, the LED structure of the seventh embodiment is a combination of the LED structure of the second embodiment and apower supply board 7. Thepower supply board 7 includes afirst conducting layer 71, asecond conducting layer 72, and an insulatinglayer 73. The insulatinglayer 73 is located on thefirst conducting layer 71, and thesecond conducting layer 72 is located on the insulatinglayer 73. The insulatinglayer 73 is provided with a receivingspace 731, and thesecond conducting layer 72 is provided near a middle portion with afirst opening 721 and at two opposite ends of thefirst opening 721 with twosecond openings 722, which have a width smaller than that of thefirst opening 721 and are communicable with thefirst opening 721. The LED structure of the second embodiment is mounted on thepower supply boar 7 in the receivingspace 731 via thefirst opening 721, and is then moved to one of the twosecond openings 722. With the reduced width of thesecond opening 722, themain body 5 of the LED structure of the second embodiment is held in the receivingspace 731 below thesecond opening 722. At this position, the firstconductive body 1 is in electric contact with thefirst conducting layer 71, the secondconductive body 2 is in electric contact with thesecond conducting layer 72, and thelight hood 6 is upward protruded from thesecond opening 722. A conductingspring leaf 711 is provided on thefirst conducting layer 71 in each of thesecond openings 722, such that when themain body 5 is received in the receivingspace 731 below thesecond opening 722, the conductingspring leaf 711 is located between the firstconductive body 1 and thefirst conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receivingspace 731. -
FIGS. 15 to 17 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to an eighth embodiment of the present invention. As shown, the LED structure of the eighth embodiment is a combination of the LED structure of the second embodiment and apower supply board 7. Thepower supply board 7 includes afirst conducting layer 71, asecond conducting layer 72, and an insulatinglayer 73. The insulatinglayer 73 is located on thefirst conducting layer 71, and thesecond conducting layer 72 is located on the insulatinglayer 73. The insulatinglayer 73 is provided with a receivingspace 732, and thesecond conducting layer 72 is provided with anopening 723. The LED structure of the second embodiment is mounted on thepower supply boar 7 in the receivingspace 732 via theopening 723, and is then turned relative to theopening 723, so that themain body 5 of the LED structure of the second embodiment is held in the receivingspace 732 below theopening 723. At this position, the firstconductive body 1 is in electric contact with thefirst conducting layer 71, the secondconductive body 2 is in electric contact with thesecond conducting layer 72, and thelight hood 6 is upward protruded from theopening 723. A conductingspring leaf 711 is provided on thefirst conducting layer 71 in the receivingspace 732, such that when themain body 5 is received in the receivingspace 732 below theopening 723, the conductingspring leaf 711 is located between the firstconductive body 1 and thefirst conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receivingspace 732. -
FIGS. 18 to 20 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to a ninth embodiment of the present invention. As shown, the LED structure of the ninth embodiment is a combination of the LED structure of the second embodiment and apower supply board 7. Thepower supply board 7 includes afirst conducting layer 71, asecond conducting layer 72, and an insulatinglayer 73. The insulatinglayer 73 is located on thefirst conducting layer 71, and thesecond conducting layer 72 is located on the insulatinglayer 73. The insulatinglayer 73 is provided with a receivingspace 732, and thesecond conducting layer 72 is provided with anopening 723. A plurality of elasticallyretractable conducting terminals 724 is provided along theopening 723 to normally project from an inner rim of theopening 723. The LED structure of the second embodiment is mounted on thepower supply boar 7 in the receivingspace 732 via theopening 723. When themain body 5 of the LED structure of the second embodiment is downward moved through theopening 723, the conductingterminals 724 are elastically pushed backward by themain body 5. And, when themain body 5 has been moved through theopening 723 into the receivingspace 732, the conductingterminals 724 are elastically restored to the projected position to electrically contact with the secondconductive body 2 and hold themain body 5 in the receivingspace 732 below theopening 723. At this position, the firstconductive body 1 is in electric contact with thefirst conducting layer 71, and thelight hood 6 is upward protruded from theopening 723. A conductingspring leaf 711 is provided on thefirst conducting layer 71 in the receivingspace 732, such that when themain body 5 is received in the receivingspace 732 below theopening 723, the conductingspring leaf 711 is located between the firstconductive body 1 and thefirst conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receivingspace 732. -
FIGS. 21 to 23 are exploded perspective view, assembled perspective view, and assembled vertical sectional view, respectively, of an LED structure according to a tenth embodiment of the present invention. As shown, the LED structure of the tenth embodiment is a combination of the LED structure of the second embodiment and apower supply board 7. Thepower supply board 7 includes afirst conducting layer 71, asecond conducting layer 72, and an insulatinglayer 73. The insulatinglayer 73 is located on thefirst conducting layer 71, and thesecond conducting layer 72 is located on the insulatinglayer 73. The insulatinglayer 73 is provided with a receivingspace 732, and thesecond conducting layer 72 is provided with anopening 723. The LED structure of the second embodiment is mounted on thepower supply boar 7 in the receivingspace 732 with the firstconductive body 1 in electric contact with thefirst conducting layer 71. Then, the secondconductive body 2 is fastened to a top of the insulatinglayer 73 using a plurality ofscrews 10, allowing thelight hood 6 to upward protrude from theopening 723, and the secondconductive body 2 to electric contact with thesecond conducting layer 72. A conductingspring leaf 711 is provided on thefirst conducting layer 71 in the receivingspace 732, such that when themain body 5 is received in the receivingspace 732 below theopening 723, the conductingspring leaf 711 is located between the firstconductive body 1 and thefirst conducting layer 71 to ensure firm disposition of the LED structure of the second embodiment in the receivingspace 732. - In the above embodiments of the present invention, the
first electrodes section 111 on the firstconductive body 1, and thefirst conducting layer 71 have the same polarity, which may be positive or negative. And, thesecond electrodes 42, the secondconductive body 2, and thesecond conducting layer 72 have the same polarity, which is different from the polarity of the first electrodes, the conducting section, and the first conducting layer, and may be negative or positive. - The LED structure of the present invention can be mounted to the power supply board without the need of distinguishing the polarities of electrodes. A user needs only to dispose the LED structure in the receiving space formed on the power supply board and cause the LED structure to be held in the receiving space. Therefore, the LED structure of the present invention is easy to mount to and dismount from the power supply board, and can be conveniently replaced when necessary.
- In the LED structure of the present invention, the second conductive body, the insulating body, and the first conductive body are sequentially stacked from top to bottom with the conducting portion of the first conductive body upward extended through the insulating body and the second conductive body to expose the conducting section at the sleeve portion, so that the LED may be mounted on the top of the conducting section of the first conductive body and electrically connected to the second conductive body. With these arrangements, the LED structure of the present invention could be very easily mounted to and dismounted from a power supply board, and accordingly, be conveniently replaced when necessary. Therefore, the present invention is novel, improved, and industrially valuable for use.
Claims (15)
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US11/968,038 US7547924B1 (en) | 2007-12-31 | 2007-12-31 | Light-emitting diode structure |
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US11/968,038 US7547924B1 (en) | 2007-12-31 | 2007-12-31 | Light-emitting diode structure |
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US9188314B2 (en) | 2013-12-11 | 2015-11-17 | Delta Electronics, Inc. | Light emitting diode device |
USD790486S1 (en) * | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
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KR101804892B1 (en) * | 2011-04-14 | 2017-12-06 | 엘지디스플레이 주식회사 | Light emitting diode assembly and liquid crystal display device having the same |
WO2013117198A1 (en) * | 2012-02-08 | 2013-08-15 | Scanled Ipr Aps | An assembly of a construction panel and a light emitting diode |
DK178014B1 (en) * | 2014-01-10 | 2015-03-09 | Led Ibond Holding Aps | Construction element with at least one electronic component |
EP3403024B1 (en) * | 2016-01-11 | 2020-07-15 | LED IBOND INTERNATIONAL ApS | Electrical supply module |
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US20060054914A1 (en) * | 2004-09-10 | 2006-03-16 | Sen Tech Co., Ltd. | Composite heat conductive structure for a LED package |
US20080149960A1 (en) * | 2006-12-26 | 2008-06-26 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
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US20060054914A1 (en) * | 2004-09-10 | 2006-03-16 | Sen Tech Co., Ltd. | Composite heat conductive structure for a LED package |
US20080149960A1 (en) * | 2006-12-26 | 2008-06-26 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
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WO2015059499A3 (en) * | 2013-10-25 | 2015-06-18 | Litecool Limited | Led package and led module |
US9188314B2 (en) | 2013-12-11 | 2015-11-17 | Delta Electronics, Inc. | Light emitting diode device |
USD790486S1 (en) * | 2014-09-30 | 2017-06-27 | Cree, Inc. | LED package with truncated encapsulant |
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