US20090015283A1 - Integrated circuit probing apparatus having a temperature-adjusting mechanism - Google Patents

Integrated circuit probing apparatus having a temperature-adjusting mechanism Download PDF

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Publication number
US20090015283A1
US20090015283A1 US12239060 US23906008A US2009015283A1 US 20090015283 A1 US20090015283 A1 US 20090015283A1 US 12239060 US12239060 US 12239060 US 23906008 A US23906008 A US 23906008A US 2009015283 A1 US2009015283 A1 US 2009015283A1
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Prior art keywords
integrated circuit
temperature
surface
probing apparatus
adjusting mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12239060
Inventor
Choon Leong Lou
Li Min Wang
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STAr Technologies Inc
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STAr Technologies Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/44Modifications of instruments for temperature compensation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

Description

  • This present application is a divisional application of U.S. patent application Ser. No. 12/046,818, filed on Mar. 12, 2008, which is a divisional application of U.S. patent application Ser. No. 11/609,558, filed on Dec. 12, 2006. The contents of both of those applications are incorporated herein by reference in their entirety.
  • BACKGROUND OF THE INVENTION
  • (A) Field of the Invention
  • The present invention relates to an integrated circuit probing apparatus having a temperature-adjusting mechanism, and more particularly, to an integrated circuit probing apparatus having a temperature-adjusting mechanism to transfer heat into or out of the testing environment by pressurized fluid.
  • (B) Description of the Related Art
  • FIG. 1 and FIG. 2 illustrate a probe card 10 used for testing electrical properties of an integrated circuit device 36 according to the prior art. The probe card 10 comprises a circuit board 12, a circular supporter 14 positioned on the circuit board 12, and a plurality of probes 16 positioned on the circular supporter 14 by epoxy resin 24. The probes 16 are electrically connected to conductive wires 18 on the back surface of the circuit board 12 via channels 20 inside the circuit board 12.
  • Referring to FIG. 2, a semiconductor wafer 30 is positioned on a wafer chuck 32 with a heater 34. The wafer chuck 32 will rise during testing so that the tip of the probe 16 can contact a pad 38 of integrated circuit devices 36 of the semiconductor wafer 30. During the testing processes, such as the reliability test of the integrated circuit device 36, the heater 34 heats the semiconductor wafer 30, and heat is transmitted to the test environment where the probe card 10 is positioned by thermal radiation or by thermal conduction through the tip of the probe 16, i.e., the temperature of the test environment increases. The increasing temperature causes the physical or material properties of parts or mechanisms in the test environment to change, for example the thermal expansion property causes the material to strain. As a result, the increasing temperature may interrupt the testing or influence the accuracy of the test. In addition, the heat transfer into or out of a test head above the circuit board 12 may also influence the temperature range at which the test instruments or parts within the test head to give results of lower accuracy due to test being carried out in a temperature outside the specification of the test units.
  • SUMMARY OF THE INVENTION
  • One aspect of the present invention provides an integrated circuit probing apparatus having a temperature-adjusting mechanism to transfer heat into or out of the testing environment by pressurized fluid.
  • An integrated circuit probing apparatus according to this aspect of the present invention comprises a probe card having a circuit board, a holder configured to support the probe card, a test head and a temperature-adjusting mechanism. The probe card includes at least one probe positioned on the circuit board, the probe can form an electrical connection with an integrated circuit device facing a first surface of the circuit board, and the temperature-adjusting mechanism can be optionally positioned on a second surface of the circuit board. In addition, the temperature-adjusting mechanism can also be optionally positioned inside the circuit board, inside the holder or on the holder. The test head includes a plurality of pins capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board and test instruments or circuitry within the test head for performing the measurements of electrical properties of the device under tests. The temperature-adjusting mechanism can be optionally positioned inside the test head or on the test head. The temperature-adjusting mechanism includes at least one flow line having at least one fluid inlet and a plurality of fluid outlets, the fluid inlet can be positioned on the second surface of the circuit board, and the fluid is gas, liquid or the combination thereof.
  • Compared to the prior art, the present invention allows the flow of the pressurized fluid in the flow line to adjust the temperature of the test environment. Consequently, the temperature of the test environment where the integrated circuit probing apparatus is positioned can be kept within the range in which the material of the integrated circuit probing apparatus can optimally perform. In addition, variations in the physical or material properties of the test and measurement units, parts and mechanisms of the integrated circuit probing apparatus can be reduced to a minimum by controlling the temperature of the pressurized fluid and the flow rate of the pressurized fluid to decrease the temperature variation of the test environment.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The objectives and advantages of the present invention will become apparent upon reading the following description and upon reference to the accompanying drawings in which:
  • FIG. 1 and FIG. 2 illustrate a probe card used for testing electrical properties of an integrated circuit device according to the prior art;
  • FIG. 3 and FIG. 4 illustrate an integrated circuit probing apparatus according to the first embodiment of the present invention;
  • FIG. 5 illustrates an integrated circuit probing apparatus according to the second embodiment of the present invention;
  • FIG. 6 and FIG. 7 illustrate an integrated circuit probing apparatus according the third embodiment of the present invention
  • FIG. 8 illustrates an integrated circuit probing apparatus according to the fourth embodiment of the present invention;
  • FIG. 9 illustrates an integrated circuit probing apparatus according to the fifth embodiment of the present invention; and
  • FIG. 10 illustrates an integrated circuit probing apparatus according to the sixth embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 3 and FIG. 4 illustrate an integrated circuit probing apparatus 50 according to the first embodiment of the present invention. The integrated circuit probing apparatus 50 comprises a probe card 10, a temperature-adjusting mechanism 66 configured to adjust the temperature of the test environment, a holder 64 configured to support the probe card 10, and a test head 60. The probe card 10 includes a circuit board 12 and a plurality of probes 16 positioned on the circuit board 12. The circuit board has a first surface 12A and a second surface 12B, and the probe 16 can form an electrical connection with an integrated circuit device 30 facing a first surface 12A of the circuit board 12. The test head 60 includes a plurality of pogo pins, connection pins, test interfaces and test measurement units 62 capable of forming electrical connections and measurements with a plurality of connecting sites 28 on the second surface 12B of the circuit board 12.
  • The temperature-adjusting mechanism 66 comprises a support 52 such as a cover positioned on the second surface 12B of the circuit board 12 and a flow line 54 positioned on the supporter 52. Preferably, the flow line can be a guiding tube having at least one fluid inlet and a plurality of fluid outlets facing the outer edge of the circuit board 12. The flow line permits a fluid to flow therein, and the fluid can be gas, liquid or the combination thereof. For example, the fluid can be cooled dry air, nitrogen or the combination of cooled dry air and nitrogen for cooling the test environment. In addition, the fluid can be heated air for increasing the temperature of cold temperature environment to prevent condensation on the test head 60 and pogo pins 62.
  • The temperature-adjusting mechanism 66 permits a pressurized fluid to flow therein via the fluid inlet 58 in a controlled manner such that the temperature of the test environment can be kept within a predetermined range in which the material of the integrated circuit probing apparatus 50 can optimally perform. Variations in the physical or material properties of the integrated circuit probing apparatus 50 can be reduced to a minimum by controlling the temperature of the pressurized fluid and the flow rate of the pressurized fluid in order to decrease the temperature variation of the test environment.
  • The accuracy of the test data of the integrated circuit are determined by the test equipment operating under pre-specified range of working temperature. The temperature-adjusting mechanism 66 is also used to ensure that the test head 60 and pogo pins 62 are performing the electrical measurements of integrated circuit under the specified operation temperature.
  • FIG. 5 illustrates an integrated circuit probing apparatus 50′ according to the second embodiment of the present invention. Compared to the integrated circuit probing apparatus 50 in FIG. 4 having the flow line 54 on the supporter 52 on the second surface 12B, the integrated circuit probing apparatus 50′ in FIG. 5 positions its flow line 54′, serving as the temperature-adjusting mechanism, on the second surface 12B. The flow line 54′ has a plurality of fluid outlets 56 facing the outer edge of the circuit board 12, and the fluid outlets 56 are preferably facing the pins 62 of the test head.
  • FIG. 6 and FIG. 7 illustrate an integrated circuit probing apparatus 70 according to the third embodiment of the present invention. Compared to the integrated circuit probing apparatus 50 and 50′ in FIG. 4 and FIG. 5 having the flow line 54 and 54′ substantially on the second surface 12B, the integrated circuit probing apparatus 70 in FIG. 7 positions its flow line 80, serving as the temperature-adjusting mechanism, inside the circuit board 12. The circuit board 12 includes a plurality of laminates 72, 74 and 76, and the flow line 80 is positioned in one of the laminates 72, 74 and 76, for example the laminate 74. The flow line 80 includes a plurality of openings 82 facing the second surface 12B of the circuit board 12, and the openings 82 can serve as fluid inlets or fluid outlets.
  • FIG. 8 illustrates an integrated circuit probing apparatus 90 according to the fourth embodiment of the present invention. Compared to the integrated circuit probing apparatus 50, 50′ and 70 in FIG. 4, FIG. 5 and FIG. 7 having the flow line 54, 54′ and 80 on the second surface 12B or inside the circuit board 12, the integrated circuit probing apparatus 90 in FIG. 8 positions its flow line 92, serving as the temperature-adjusting mechanism, inside the holder 64. The flow line 92 has a fluid inlet 96 and a plurality of fluid outlets 94, and the fluid outlets 94 may face the pins 62 of the test head 60 or the first surface 12A of the circuit board 12.
  • FIG. 9 illustrates an integrated circuit probing apparatus 100 according to the fifth embodiment of the present invention. Compared to the integrated circuit probing apparatus 90 in FIG. 8 having the flow line 92 in the holder 64, the integrated circuit probing apparatus 100 in FIG. 9 positions its flow line 102, serving as the temperature-adjusting mechanism, on the holder 64. The flow line 102 has a plurality of openings 104, which can be used as fluid inlets or fluid outlets.
  • FIG. 10 illustrates an integrated circuit probing apparatus 110 according to the sixth embodiment of the present invention. Compared to the aforementioned integrated circuit probing apparatus having the flow line on the circuit board 12 or the holder 64, the integrated circuit probing apparatus 110 in FIG. 10 positions its flow line 112, serving as the temperature-adjusting mechanism, outside the test head 60. The flow line 112 has a plurality of openings 114, which can be used as fluid inlets or fluid outlets. In addition, the flow line 112 can also be positioned inside the test head 60.
  • Compared to the prior art, the present invention allows the flowing of the pressurized fluid in the flow line to adjust the temperature of the test environment. Consequently, the temperature of the test environment where the integrated circuit probing apparatus is positioned can be kept within the range in which the material of the integrated circuit probing apparatus and the test units of test head can optimally perform. In addition, variations in the physical or material properties of the integrated circuit probing apparatus can be reduced to the minimum by controlling the temperature of the pressurized fluid and the flow rate of the pressurized fluid to decrease the temperature variation of the test environment.
  • The above-described embodiments of the present invention are intended to be illustrative only. Numerous alternative embodiments may be devised by those skilled in the art without departing from the scope of the following claims.

Claims (14)

  1. 1. An integrated circuit probing apparatus, comprising:
    a circuit board having a first surface and a second surface;
    at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit device facing the first surface; and
    a temperature-adjusting mechanism positioned on the second surface, the temperature-adjusting mechanism including at least one flow line positioned on the second surface of the circuit board, and the flow line includes at least one fluid inlet and a plurality of fluid outlets.
  2. 2. The integrated circuit probing apparatus of claim 1, wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof.
  3. 3. The integrated circuit probing apparatus of claim 1, wherein the flow line is a guiding tube.
  4. 4. An integrated circuit probing apparatus, comprising:
    a circuit board having a first surface and a second surface;
    at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit device facing the first surface;
    a holder configured to support the circuit board; and
    a temperature-adjusting mechanism positioned in the holder or on the holder.
  5. 5. The integrated circuit probing apparatus of claim 4, wherein the temperature-adjusting mechanism is a flow line positioned in the holder.
  6. 6. The integrated circuit probing apparatus of claim 5, wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof.
  7. 7. The integrated circuit probing apparatus of claim 5, wherein the flow line includes at least one fluid inlet and a plurality of fluid outlets.
  8. 8. The integrated circuit probing apparatus of claim 5, wherein the temperature-adjusting mechanism is a guiding tube positioned on the holder, and the guiding tube includes at least one fluid inlet and a plurality of fluid outlets.
  9. 9. An integrated circuit probing apparatus, comprising:
    a circuit board having a first surface and a second surface;
    at least one probe positioned on the circuit board, the probe being able to electrically contact an integrated circuit device facing the first surface;
    a test head positioned above the second surface; and
    a temperature-adjusting mechanism positioned in the test head or on the test head.
  10. 10. The integrated circuit probing apparatus of claim 9, wherein the test head includes a plurality of pins capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board.
  11. 11. The integrated circuit probing apparatus of claim 9, wherein the temperature-adjusting mechanism is a flow line having at least one fluid inlet and a plurality of fluid outlets.
  12. 12. The integrated circuit probing apparatus of claim 11, wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof.
  13. 13. The integrated circuit probing apparatus of claim 11, wherein the flow line is a guiding tube.
  14. 14. The integrated circuit probing apparatus of claim 9, wherein the test head includes a test interface or test measurement unit capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board.
US12239060 2006-08-25 2008-09-26 Integrated circuit probing apparatus having a temperature-adjusting mechanism Abandoned US20090015283A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW95131279 2006-08-25
US11609558 US7576553B2 (en) 2006-08-25 2006-12-12 Integrated circuit probing apparatus having a temperature-adjusting mechanism
US12046818 US7616018B2 (en) 2006-08-25 2008-03-12 Integrated circuit probing apparatus having a temperature-adjusting mechanism
US12239060 US20090015283A1 (en) 2006-08-25 2008-09-26 Integrated circuit probing apparatus having a temperature-adjusting mechanism

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12239060 US20090015283A1 (en) 2006-08-25 2008-09-26 Integrated circuit probing apparatus having a temperature-adjusting mechanism
US12697508 US20100134130A1 (en) 2006-08-25 2010-02-01 Integrated circuit probing apparatus having a temperature-adjusting mechanism

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US20090015283A1 true true US20090015283A1 (en) 2009-01-15

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US11609558 Active US7576553B2 (en) 2006-08-25 2006-12-12 Integrated circuit probing apparatus having a temperature-adjusting mechanism
US12046818 Active US7616018B2 (en) 2006-08-25 2008-03-12 Integrated circuit probing apparatus having a temperature-adjusting mechanism
US12239060 Abandoned US20090015283A1 (en) 2006-08-25 2008-09-26 Integrated circuit probing apparatus having a temperature-adjusting mechanism
US12697508 Abandoned US20100134130A1 (en) 2006-08-25 2010-02-01 Integrated circuit probing apparatus having a temperature-adjusting mechanism

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US11609558 Active US7576553B2 (en) 2006-08-25 2006-12-12 Integrated circuit probing apparatus having a temperature-adjusting mechanism
US12046818 Active US7616018B2 (en) 2006-08-25 2008-03-12 Integrated circuit probing apparatus having a temperature-adjusting mechanism

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US12697508 Abandoned US20100134130A1 (en) 2006-08-25 2010-02-01 Integrated circuit probing apparatus having a temperature-adjusting mechanism

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JP (1) JP4514758B2 (en)
KR (1) KR20080018775A (en)

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US9562943B2 (en) * 2012-11-19 2017-02-07 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer temperature sensing methods and related semiconductor wafer
CN103926480A (en) * 2013-01-10 2014-07-16 致茂电子(苏州)有限公司 Test machine table with dry environment
CN104345186B (en) * 2013-07-23 2017-07-14 旺矽科技股份有限公司 Probe card for detection of the photovoltaic element
KR101794744B1 (en) 2013-08-14 2017-12-01 에프이아이 컴파니 Circuit probe for charged particle beam system
US9678109B2 (en) * 2014-01-09 2017-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Probe card
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US9577358B2 (en) * 2014-10-25 2017-02-21 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods
US10003149B2 (en) 2014-10-25 2018-06-19 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods
US9805891B2 (en) 2014-10-25 2017-10-31 ComponentZee, LLC Multiplexing, switching and testing devices and methods using fluid pressure
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Also Published As

Publication number Publication date Type
US7576553B2 (en) 2009-08-18 grant
US20080048700A1 (en) 2008-02-28 application
KR20080018775A (en) 2008-02-28 application
US20100134130A1 (en) 2010-06-03 application
JP4514758B2 (en) 2010-07-28 grant
US7616018B2 (en) 2009-11-10 grant
US20080150567A1 (en) 2008-06-26 application
JP2008051792A (en) 2008-03-06 application

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