US20080247136A1 - Heat dissipation apparatus for heat producing device - Google Patents
Heat dissipation apparatus for heat producing device Download PDFInfo
- Publication number
- US20080247136A1 US20080247136A1 US11/696,682 US69668207A US2008247136A1 US 20080247136 A1 US20080247136 A1 US 20080247136A1 US 69668207 A US69668207 A US 69668207A US 2008247136 A1 US2008247136 A1 US 2008247136A1
- Authority
- US
- United States
- Prior art keywords
- plate
- base
- heat
- fins
- fin set
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat dissipating apparatus for heat producing device and particularly to a heat dissipating apparatus mounted onto a processor such as, for example, a VGA (video graphics array) card, for dissipating heat generated during operation of the processor.
- a processor such as, for example, a VGA (video graphics array) card
- a typical heat dissipating apparatus comprises a base for contacting the electronic component so as to absorb the heat generated by the electronic component, a plurality of fins extending from the base, and a centrifugal fan horizontally installed at a lateral side of the fins for providing airflow through the fins to remove the heat from the fins into ambient air.
- a heat dissipating apparatus having a fan installed which doesn't restrict the size of the fins and allows airflow to be distributed to high temperature areas of the heat dissipating apparatus.
- a heat dissipating apparatus configured for dissipating heat generated by heat producing device such as an add-on device, includes a base, a fin set and an axial fan.
- the base can be attached to the heat producing device and contacts with a heat producing element of the heat producing device, such as, for example, a processor in the add-on device.
- the fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and parallel to each other and form a plurality of air passages therebetween.
- the axial fan is installed on a lateral side of the fin set and blows airflow into the fin set through the air passages.
- the fin set defines an inclined plane at an end thereof, and the axial fan is installed on the inclined plane of the fin set and oblique to the base, whereby the axial fan can have a larger size to provide an airflow with a larger flow rate through the fins to effectively remove heat therefrom.
- FIG. 1 is an assembled view of a heat dissipating apparatus according to a preferred embodiment of the present invention, shown together with an exemplary add-on device having a processor;
- FIG. 2 is an exploded, isometric view of FIG. 1 .
- FIGS. 1 and 2 show a heat dissipating apparatus in accordance with a preferred embodiment of the present invention.
- the heat dissipating apparatus is shown mounted on an exemplary add-on device 80 such as a VGA card for dissipating heat generated by a processor 82 mounted on the add-on device 80 .
- the heat dissipating apparatus includes a back plate 10 located beneath the add-on device 80 , a base (not labeled) in contact with the processor 82 , three heat pipes 40 disposed on the base, a fin set 50 arranged on the heat pipes 40 , a fan duct 60 covering the fin set 50 and an axial fan 70 installed at a lateral side of the fin set 50 .
- the processor 82 is located in a central portion of the add-on device 80 .
- the add-on device 80 symmetrically defines four mounting holes 84 around the processor 82 , for allowing a plurality of screws 100 to extend therethrough to secure the heat dissipating apparatus thereon.
- a plurality of electronic components (not labeled) is located around the processor 82 on the add-on device 80 .
- the back plate 10 is mounted below the add-on device 80 and is positioned corresponding to the processor 82 .
- the back plate 10 is integrally formed from a single piece of stainless steel.
- the back plate 10 has a central body (not labeled) and four fixing legs 12 symmetrically extending outwardly from four corners of the central body.
- the fixing legs 12 each defines a fixing hole 120 adjacent to a distal end thereof corresponding to the mounting hole 84 of the add-on device 80 for receiving the screw 100 .
- the base of the heat dissipating apparatus comprises a first plate 20 and a second plate 30 engaged with the first plate 20 .
- the first plate 20 is substantially rectangular and made of a heat conductive material such as aluminum.
- the first plate 20 has a lengthways portion with a concave section, thereby defining a lengthways receiving groove 22 parallel and adjacent to a first lateral side (not labeled) thereof, for accommodating the heat pipes 40 therein.
- the first plate 20 defines a rectangular opening 24 extending from the first lateral side to a second lateral side (not labeled) opposite to the first lateral side until beyond the receiving groove 22 , for receiving the second plate 30 .
- the first plate 20 defines four rectangular step portions 26 respectively adjacent to four corners of the opening 24 .
- the step portions 26 are formed by stamping the first plate 20 downwards and each define a fixing orifice 260 therein.
- the first plate 20 defines two pairs of mounting orifices 220 around the opening 24 and adjacent to the first and second lateral sides thereof for fixing the fan duct 60 thereto by screws 400 .
- the second plate 30 can be made of a heat conductive material with better heat conductivity than the first plate 20 , such as copper.
- the second plate 30 is substantially rectangular and has a configuration consistent with that of the opening 24 of the first plate 20 .
- the second plate 30 defines a receiving groove 32 in a middle portion thereof.
- the receiving groove 32 is located corresponding to and communicating with the receiving groove 22 of the first plate 20 when the second plate 30 is snugly accommodated in the opening 24 of the first plate 20 .
- the second plate 30 defines four through holes 34 in four respective corners thereof for receiving sleeves 300 therein.
- the sleeves 300 have screw thread formed on an inner face thereof for receiving the screws 100 , thus fixing the base on the add-on device 80 .
- Each sleeve 300 comprises a wide portion and a narrow portion.
- the through holes 34 each match a corresponding sleeve 300 and define a step therein for supporting the sleeve 300 thereon.
- the second plate 30 has two pairs of spaced fixing ears 36 extending outwards from respective ends of two opposite lateral sides thereof.
- the fixing ears 36 each are rectangular and designed to be snugly supported on the corresponding step portions 26 of the first plate 20 and to hold top surfaces of the first and second plates 20 , 30 essentially level with each other.
- the fixing ears 36 each define a fixing orifice 360 therein corresponding to the fixing orifice 260 of the corresponding step portion 26 for engaging with screw 200 to secure the first and second plates 20 , 30 together.
- the three heat pipes 40 each consist of elongated linear flat plates with capillary structure and phase-changeable media contained therein.
- the three heat pipes 42 are disposed side by side and thermally communicate with the receiving grooves 22 , 32 after being attached to the base. Top surfaces of the three heat pipes 42 , the first and second plates 20 , 30 form a plane face for supporting the fin set 50 thereon after they are assembled.
- the fin set 50 comprises a plurality of the fins 52 .
- the fins 52 are spaced with each other and define a plurality of air passages therebetween.
- the fins 52 are held vertically on the plane face formed by the heat pipes 42 and the base, and parallel to the receiving grooves 22 , 32 of the base after the fin set 50 is attached to the base.
- Each fin 52 has a main body (not labeled) and two flanges 520 extending perpendicularly from parallel upper and lower edges of the main body.
- the body of each fin 52 is substantially trapezium in shape.
- Corresponding flanges 520 of the fins 52 cooperatively form a top plane face (not labeled) and a bottom plane face (not labeled) for thermally contacting with the base.
- each fin 52 has a beveled edge connecting the top edge and the bottom edge thereof.
- the beveled edges of the fins 52 are parallel to each other and cooperatively define an inclined plane area at the lateral side of the fin set 50 .
- the inclined area is oriented at an acute angle to the base. The acute angle should be in an approximate range from 30-60 degrees for enabling the axial fan 70 installed onto the inclined area to direct airflow to the fins 52 and the second plate 30 where heat absorbed from the processor 82 accumulates.
- the fan duct 60 covering the fins set 50 comprises a top wall 62 parallel to and spaced from the base and two sidewalls 64 extending downwardly from two opposite lateral edges of the top wall 62 .
- the sidewalls 64 each define a beveled edge identical to that of the fins 52 .
- the beveled edges of the sidewalls 52 each have two rectangular tabs 6420 extending perpendicularly and inwardly from two ends thereof.
- the tabs 6420 each define a mounting orifice 642 therein for mating with a fan fixture (not shown) to mount the axial fan 70 on the inclined plane at the lateral ends of the fins 52 of the fins set 50 .
- the sidewalls 64 each have two spaced fixing eyelets 644 extending horizontally and outwardly from a bottom edge thereof.
- the fixing eyelets 644 each define a mounting orifice 6440 therein corresponding to the mounting orifice 220 of the first plate 20 for receiving the screw 400 to secure the fan duct 60 onto the first plate 20 .
- the second plate 30 is snugly received in the opening 24 of the first plate 20 with the fixing ears 36 supported by the step portions 26 of the first plate 20 .
- the heat pipes 42 are tightly received in the receiving grooves 22 , 32 of the base.
- the fin set 52 is thermally attached to the base and the heat pipes 42 via soldering.
- the fan duct 60 covers the fin set 50 and is secured to the base by the screws 400 extending through the fixing eyelets 644 of the fan duct 60 to engage into the mounting orifices 220 of the first plate 20 .
- the axial fan 70 is installed on the inclined area of the fin set 50 by the fan fixtures engaging in the mounting orifice 642 of the tabs 6420 of the fan duct 60 .
- the axial fan 70 is in this way slantwise installed on the lateral side of the fin set 50 and at an acute angle to the base.
- the base is secured on the add-on device 80 with a bottom surface of the second plate 30 held in intimate contact with the processor 82 by the screws 100 extending through the fixing holes 120 of the back plate 10 , the mounting holes 84 of the add-on device 80 and the fixing orifices 34 of the second plate 30 to engage with the sleeves 300 .
- Heat generated by the processor 82 is absorbed by the second plate 30 .
- Some of the heat in the second plate 30 is directly transferred to the fin set 50 and some is absorbed by the heat pipes 40 and is then transferred to the first plate 20 and the fin set 50 .
- the axial fan 70 at the lateral side of the fin set 50 provides forced airflow to the fins 52 of the fin set 50 .
- the airflow from the axial fan 70 in the passages between the fins 52 is directed towards the base, more particularly toward the second plate 30 wherein more heat is accumulated, which results in the heat in the second plate 30 , portions of heat pipes 40 and middle portions of the fins 52 corresponding to the second plate 30 being directly removed by the airflow.
- the inclined plane has an area larger than that when the plane is vertically defined, the axial fan 70 can have a larger size thereby providing the airflow through the fins 52 with a lager flow rate to effectively remove the heat from the fins 52 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a heat dissipating apparatus for heat producing device and particularly to a heat dissipating apparatus mounted onto a processor such as, for example, a VGA (video graphics array) card, for dissipating heat generated during operation of the processor.
- 2. Description of Related Art
- When electronic components operate at high speed they generate a mass of heat. Generally, it is desirable to employ a heat dissipating apparatus to remove the heat from these electronic components, to assure that the components function properly and reliably. A typical heat dissipating apparatus comprises a base for contacting the electronic component so as to absorb the heat generated by the electronic component, a plurality of fins extending from the base, and a centrifugal fan horizontally installed at a lateral side of the fins for providing airflow through the fins to remove the heat from the fins into ambient air.
- Generally, space surrounding a computer add-on device such as a VGA card is quite limited, and the centrifugal fan of the heat dissipating apparatus horizontally fixed to the lateral side of the fins of the heat dissipating apparatus not only takes up a large area around the VGA card thus severely restricting the size of the fins, but also limits airflow to central areas of the base of the heat dissipating apparatus where most heat absorbed from the electronic component is accumulated, thereby inhibiting heat dissipating efficiency of the heat dissipating apparatus.
- Accordingly, what is needed is a heat dissipating apparatus having a fan installed which doesn't restrict the size of the fins and allows airflow to be distributed to high temperature areas of the heat dissipating apparatus.
- According to a preferred embodiment of the present invention, a heat dissipating apparatus configured for dissipating heat generated by heat producing device such as an add-on device, includes a base, a fin set and an axial fan. The base can be attached to the heat producing device and contacts with a heat producing element of the heat producing device, such as, for example, a processor in the add-on device. The fin set comprises a plurality of fins arranged on the base; the fins are spaced apart from and parallel to each other and form a plurality of air passages therebetween. The axial fan is installed on a lateral side of the fin set and blows airflow into the fin set through the air passages. The fin set defines an inclined plane at an end thereof, and the axial fan is installed on the inclined plane of the fin set and oblique to the base, whereby the axial fan can have a larger size to provide an airflow with a larger flow rate through the fins to effectively remove heat therefrom.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings.
-
FIG. 1 is an assembled view of a heat dissipating apparatus according to a preferred embodiment of the present invention, shown together with an exemplary add-on device having a processor; and -
FIG. 2 is an exploded, isometric view ofFIG. 1 . -
FIGS. 1 and 2 show a heat dissipating apparatus in accordance with a preferred embodiment of the present invention. The heat dissipating apparatus is shown mounted on an exemplary add-ondevice 80 such as a VGA card for dissipating heat generated by aprocessor 82 mounted on the add-ondevice 80. The heat dissipating apparatus includes aback plate 10 located beneath the add-ondevice 80, a base (not labeled) in contact with theprocessor 82, threeheat pipes 40 disposed on the base, afin set 50 arranged on theheat pipes 40, afan duct 60 covering thefin set 50 and anaxial fan 70 installed at a lateral side of thefin set 50. - The
processor 82 is located in a central portion of the add-ondevice 80. The add-ondevice 80 symmetrically defines fourmounting holes 84 around theprocessor 82, for allowing a plurality ofscrews 100 to extend therethrough to secure the heat dissipating apparatus thereon. A plurality of electronic components (not labeled) is located around theprocessor 82 on the add-ondevice 80. - The
back plate 10 is mounted below the add-ondevice 80 and is positioned corresponding to theprocessor 82. Theback plate 10 is integrally formed from a single piece of stainless steel. Theback plate 10 has a central body (not labeled) and fourfixing legs 12 symmetrically extending outwardly from four corners of the central body. Thefixing legs 12 each defines afixing hole 120 adjacent to a distal end thereof corresponding to themounting hole 84 of the add-ondevice 80 for receiving thescrew 100. - The base of the heat dissipating apparatus comprises a
first plate 20 and asecond plate 30 engaged with thefirst plate 20. Thefirst plate 20 is substantially rectangular and made of a heat conductive material such as aluminum. Thefirst plate 20 has a lengthways portion with a concave section, thereby defining alengthways receiving groove 22 parallel and adjacent to a first lateral side (not labeled) thereof, for accommodating theheat pipes 40 therein. Thefirst plate 20 defines arectangular opening 24 extending from the first lateral side to a second lateral side (not labeled) opposite to the first lateral side until beyond thereceiving groove 22, for receiving thesecond plate 30. Thefirst plate 20 defines fourrectangular step portions 26 respectively adjacent to four corners of theopening 24. Thestep portions 26 are formed by stamping thefirst plate 20 downwards and each define afixing orifice 260 therein. Thefirst plate 20 defines two pairs ofmounting orifices 220 around theopening 24 and adjacent to the first and second lateral sides thereof for fixing thefan duct 60 thereto byscrews 400. - The
second plate 30 can be made of a heat conductive material with better heat conductivity than thefirst plate 20, such as copper. Thesecond plate 30 is substantially rectangular and has a configuration consistent with that of the opening 24 of thefirst plate 20. Thesecond plate 30 defines areceiving groove 32 in a middle portion thereof. Thereceiving groove 32 is located corresponding to and communicating with thereceiving groove 22 of thefirst plate 20 when thesecond plate 30 is snugly accommodated in the opening 24 of thefirst plate 20. Thesecond plate 30 defines four throughholes 34 in four respective corners thereof for receivingsleeves 300 therein. Thesleeves 300 have screw thread formed on an inner face thereof for receiving thescrews 100, thus fixing the base on the add-ondevice 80. Eachsleeve 300 comprises a wide portion and a narrow portion. The throughholes 34 each match acorresponding sleeve 300 and define a step therein for supporting thesleeve 300 thereon. Thesecond plate 30 has two pairs of spacedfixing ears 36 extending outwards from respective ends of two opposite lateral sides thereof. Thefixing ears 36 each are rectangular and designed to be snugly supported on thecorresponding step portions 26 of thefirst plate 20 and to hold top surfaces of the first andsecond plates fixing ears 36 each define afixing orifice 360 therein corresponding to thefixing orifice 260 of thecorresponding step portion 26 for engaging withscrew 200 to secure the first andsecond plates - The three
heat pipes 40 each consist of elongated linear flat plates with capillary structure and phase-changeable media contained therein. The threeheat pipes 42 are disposed side by side and thermally communicate with thereceiving grooves heat pipes 42, the first andsecond plates - The
fin set 50 comprises a plurality of thefins 52. Thefins 52 are spaced with each other and define a plurality of air passages therebetween. Thefins 52 are held vertically on the plane face formed by theheat pipes 42 and the base, and parallel to thereceiving grooves fin set 50 is attached to the base. Eachfin 52 has a main body (not labeled) and twoflanges 520 extending perpendicularly from parallel upper and lower edges of the main body. The body of eachfin 52 is substantially trapezium in shape. Correspondingflanges 520 of thefins 52 cooperatively form a top plane face (not labeled) and a bottom plane face (not labeled) for thermally contacting with the base. The body of eachfin 52 has a beveled edge connecting the top edge and the bottom edge thereof. The beveled edges of thefins 52 are parallel to each other and cooperatively define an inclined plane area at the lateral side of thefin set 50. The inclined area is oriented at an acute angle to the base. The acute angle should be in an approximate range from 30-60 degrees for enabling theaxial fan 70 installed onto the inclined area to direct airflow to thefins 52 and thesecond plate 30 where heat absorbed from theprocessor 82 accumulates. - The
fan duct 60 covering the fins set 50, comprises a top wall 62 parallel to and spaced from the base and twosidewalls 64 extending downwardly from two opposite lateral edges of the top wall 62. Thesidewalls 64 each define a beveled edge identical to that of thefins 52. The beveled edges of thesidewalls 52 each have tworectangular tabs 6420 extending perpendicularly and inwardly from two ends thereof. Thetabs 6420 each define a mountingorifice 642 therein for mating with a fan fixture (not shown) to mount theaxial fan 70 on the inclined plane at the lateral ends of thefins 52 of the fins set 50. Thesidewalls 64 each have two spaced fixingeyelets 644 extending horizontally and outwardly from a bottom edge thereof. The fixing eyelets 644 each define a mountingorifice 6440 therein corresponding to the mountingorifice 220 of thefirst plate 20 for receiving thescrew 400 to secure thefan duct 60 onto thefirst plate 20. - In assembly, the
second plate 30 is snugly received in theopening 24 of thefirst plate 20 with the fixingears 36 supported by thestep portions 26 of thefirst plate 20. Theheat pipes 42 are tightly received in the receivinggrooves heat pipes 42 via soldering. Thefan duct 60 covers the fin set 50 and is secured to the base by thescrews 400 extending through the fixingeyelets 644 of thefan duct 60 to engage into the mountingorifices 220 of thefirst plate 20. Theaxial fan 70 is installed on the inclined area of the fin set 50 by the fan fixtures engaging in the mountingorifice 642 of thetabs 6420 of thefan duct 60. Theaxial fan 70 is in this way slantwise installed on the lateral side of the fin set 50 and at an acute angle to the base. - In use, the base is secured on the add-on
device 80 with a bottom surface of thesecond plate 30 held in intimate contact with theprocessor 82 by thescrews 100 extending through the fixingholes 120 of theback plate 10, the mountingholes 84 of the add-ondevice 80 and the fixingorifices 34 of thesecond plate 30 to engage with thesleeves 300. Heat generated by theprocessor 82 is absorbed by thesecond plate 30. Some of the heat in thesecond plate 30 is directly transferred to the fin set 50 and some is absorbed by theheat pipes 40 and is then transferred to thefirst plate 20 and the fin set 50. Theaxial fan 70 at the lateral side of the fin set 50 provides forced airflow to thefins 52 of the fin set 50. Because of the acute angle between theaxial fan 70 and the base, the airflow from theaxial fan 70 in the passages between thefins 52 is directed towards the base, more particularly toward thesecond plate 30 wherein more heat is accumulated, which results in the heat in thesecond plate 30, portions ofheat pipes 40 and middle portions of thefins 52 corresponding to thesecond plate 30 being directly removed by the airflow. Furthermore, since the inclined plane has an area larger than that when the plane is vertically defined, theaxial fan 70 can have a larger size thereby providing the airflow through thefins 52 with a lager flow rate to effectively remove the heat from thefins 52. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/696,682 US7443680B1 (en) | 2007-04-04 | 2007-04-04 | Heat dissipation apparatus for heat producing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/696,682 US7443680B1 (en) | 2007-04-04 | 2007-04-04 | Heat dissipation apparatus for heat producing device |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080247136A1 true US20080247136A1 (en) | 2008-10-09 |
US7443680B1 US7443680B1 (en) | 2008-10-28 |
Family
ID=39826709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/696,682 Expired - Fee Related US7443680B1 (en) | 2007-04-04 | 2007-04-04 | Heat dissipation apparatus for heat producing device |
Country Status (1)
Country | Link |
---|---|
US (1) | US7443680B1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090052175A1 (en) * | 2007-08-24 | 2009-02-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with a heat dissipation device |
US20090323272A1 (en) * | 2008-06-27 | 2009-12-31 | Fujitsu Limited | Electronic apparatus |
US20120275152A1 (en) * | 2011-04-29 | 2012-11-01 | Phoseon Technology, Inc. | Heat sink for light modules |
EP2426575A3 (en) * | 2010-05-28 | 2015-03-18 | Giga-Byte Technology Co., Ltd. | Heat-dissipation device |
US10303228B2 (en) * | 2017-04-21 | 2019-05-28 | Evga Corporation | Multi-directional cooling structure for interface card |
US20210337699A1 (en) * | 2020-04-28 | 2021-10-28 | Lenovo (Singapore) Pte. Ltd. | Heat transport device and electronic apparatus |
US11266040B2 (en) * | 2019-05-09 | 2022-03-01 | Lenovo (Singapore) Pte Ltd | Heat transport device |
US20220087078A1 (en) * | 2018-12-26 | 2022-03-17 | Lg Innotek Co., Ltd. | Power conversion device |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008140803A (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co Ltd | Heat sink |
JP2008140802A (en) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co Ltd | Heat sink |
US20090059524A1 (en) * | 2007-08-27 | 2009-03-05 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
TW200910070A (en) * | 2007-08-28 | 2009-03-01 | Inventec Corp | Heat dissipation module |
US7609521B2 (en) * | 2007-09-26 | 2009-10-27 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with a heat pipe |
TWM333479U (en) * | 2007-11-01 | 2008-06-01 | Asustek Comp Inc | Electrical fan and board card |
CN101452328A (en) * | 2007-12-03 | 2009-06-10 | 鸿富锦精密工业(深圳)有限公司 | Computer radiator |
CN101528018A (en) * | 2008-03-07 | 2009-09-09 | 富准精密工业(深圳)有限公司 | Heat radiating device and manufacturing method thereof |
CN201230438Y (en) * | 2008-07-07 | 2009-04-29 | 鸿富锦精密工业(深圳)有限公司 | Combination of heat radiating device |
US20110113667A1 (en) * | 2009-05-07 | 2011-05-19 | Teludyne Tech Industries, Inc. | Weapons System Construction And Modification |
EP2490517A1 (en) * | 2009-10-16 | 2012-08-22 | Fujitsu Limited | Electronic device and casing for electronic device |
US8159819B2 (en) * | 2010-05-14 | 2012-04-17 | Xfx Creation Inc. | Modular thermal management system for graphics processing units |
CN102651957B (en) * | 2011-02-25 | 2016-08-10 | 裕利年电子南通有限公司 | Electronic installation |
WO2012149786A1 (en) * | 2011-09-30 | 2012-11-08 | 华为技术有限公司 | Heat sink |
JP5579349B1 (en) * | 2012-12-06 | 2014-08-27 | 古河電気工業株式会社 | heatsink |
US9568255B2 (en) * | 2014-04-21 | 2017-02-14 | Htc Corporation | Electronic device |
WO2015187748A1 (en) * | 2014-06-02 | 2015-12-10 | Corsair Memory, Inc. | Graphics card cooler |
US9468086B1 (en) * | 2015-04-03 | 2016-10-11 | Motorola Soultions, Inc. | Electronic device including an externally-mounted heat pipe |
JP2017112151A (en) * | 2015-12-14 | 2017-06-22 | 富士電機株式会社 | Cooling structure of power unit |
CN110535040B (en) * | 2019-09-12 | 2020-09-25 | 陈志君 | Switch board with protect function |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020003690A1 (en) * | 2000-07-06 | 2002-01-10 | Bo-Yao Lin | Heat sink capable of having a fan mounted aslant to the lateral side thereof |
US6373700B1 (en) * | 2001-06-18 | 2002-04-16 | Inventec Corporation | Heat sink modular structure inside an electronic product |
US6450251B1 (en) * | 2000-12-28 | 2002-09-17 | Foxconn Precision Components Co., Ltd. | Heat removal system |
US20020185259A1 (en) * | 2001-05-15 | 2002-12-12 | Gateway, Inc. | Angle mounted fan-sink |
US6512673B1 (en) * | 2000-07-05 | 2003-01-28 | Network Engines, Inc. | Low profile equipment housing with angular fan |
US6704199B2 (en) * | 2000-07-05 | 2004-03-09 | Network Engines, Inc. | Low profile equipment housing with angular fan |
US7040384B2 (en) * | 2004-01-27 | 2006-05-09 | Molex Incorporated | Heat dissipation device |
US7085134B2 (en) * | 2004-06-30 | 2006-08-01 | International Business Machines Corporation | Dual fan heat sink |
US7165603B2 (en) * | 2002-04-15 | 2007-01-23 | Fujikura Ltd. | Tower type heat sink |
US20070151711A1 (en) * | 2006-01-05 | 2007-07-05 | Kuo-Hsin Chen | Heat sink and method for manufacturing the same |
US7304846B2 (en) * | 2005-02-11 | 2007-12-04 | Inventec Corporation | Heatsink device of video graphics array and chipset |
US7385820B1 (en) * | 2006-11-30 | 2008-06-10 | Foxconn Technology Co., Ltd. | Heat dissipation module |
-
2007
- 2007-04-04 US US11/696,682 patent/US7443680B1/en not_active Expired - Fee Related
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512673B1 (en) * | 2000-07-05 | 2003-01-28 | Network Engines, Inc. | Low profile equipment housing with angular fan |
US6704199B2 (en) * | 2000-07-05 | 2004-03-09 | Network Engines, Inc. | Low profile equipment housing with angular fan |
US20020003690A1 (en) * | 2000-07-06 | 2002-01-10 | Bo-Yao Lin | Heat sink capable of having a fan mounted aslant to the lateral side thereof |
US6501651B2 (en) * | 2000-07-06 | 2002-12-31 | Acer, Inc. | Heat sink capable of having a fan mounted aslant to the lateral side thereof |
US6450251B1 (en) * | 2000-12-28 | 2002-09-17 | Foxconn Precision Components Co., Ltd. | Heat removal system |
US20020185259A1 (en) * | 2001-05-15 | 2002-12-12 | Gateway, Inc. | Angle mounted fan-sink |
US6373700B1 (en) * | 2001-06-18 | 2002-04-16 | Inventec Corporation | Heat sink modular structure inside an electronic product |
US7165603B2 (en) * | 2002-04-15 | 2007-01-23 | Fujikura Ltd. | Tower type heat sink |
US7040384B2 (en) * | 2004-01-27 | 2006-05-09 | Molex Incorporated | Heat dissipation device |
US7085134B2 (en) * | 2004-06-30 | 2006-08-01 | International Business Machines Corporation | Dual fan heat sink |
US7304846B2 (en) * | 2005-02-11 | 2007-12-04 | Inventec Corporation | Heatsink device of video graphics array and chipset |
US20070151711A1 (en) * | 2006-01-05 | 2007-07-05 | Kuo-Hsin Chen | Heat sink and method for manufacturing the same |
US7385820B1 (en) * | 2006-11-30 | 2008-06-10 | Foxconn Technology Co., Ltd. | Heat dissipation module |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090052175A1 (en) * | 2007-08-24 | 2009-02-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Led lamp with a heat dissipation device |
US7534015B2 (en) * | 2007-08-24 | 2009-05-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp with a heat dissipation device |
US20090323272A1 (en) * | 2008-06-27 | 2009-12-31 | Fujitsu Limited | Electronic apparatus |
US7826223B2 (en) * | 2008-06-27 | 2010-11-02 | Fujitsu Limited | Electronic apparatus |
EP2426575A3 (en) * | 2010-05-28 | 2015-03-18 | Giga-Byte Technology Co., Ltd. | Heat-dissipation device |
US20120275152A1 (en) * | 2011-04-29 | 2012-11-01 | Phoseon Technology, Inc. | Heat sink for light modules |
US10303228B2 (en) * | 2017-04-21 | 2019-05-28 | Evga Corporation | Multi-directional cooling structure for interface card |
US20220087078A1 (en) * | 2018-12-26 | 2022-03-17 | Lg Innotek Co., Ltd. | Power conversion device |
US11910580B2 (en) * | 2018-12-26 | 2024-02-20 | Lg Innotek Co., Ltd. | Power conversion device |
US11266040B2 (en) * | 2019-05-09 | 2022-03-01 | Lenovo (Singapore) Pte Ltd | Heat transport device |
US20210337699A1 (en) * | 2020-04-28 | 2021-10-28 | Lenovo (Singapore) Pte. Ltd. | Heat transport device and electronic apparatus |
CN113573541A (en) * | 2020-04-28 | 2021-10-29 | 联想(新加坡)私人有限公司 | Heat transport device and electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
US7443680B1 (en) | 2008-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7443680B1 (en) | Heat dissipation apparatus for heat producing device | |
US7891411B2 (en) | Heat dissipation device having a fan for dissipating heat generated by at least two electronic components | |
US7755902B2 (en) | Heat dissipation device for computer add-on cards | |
US7640968B2 (en) | Heat dissipation device with a heat pipe | |
US7262965B2 (en) | Thermal structure for electric devices | |
US7489513B2 (en) | Heat dissipation device | |
US7110259B2 (en) | Heat dissipating device incorporating heat pipe | |
US20090059525A1 (en) | Heat dissipation device for computer add-on cards | |
US8459343B2 (en) | Thermal module assembly and heat sink assembly having at least two engageable heat sinks | |
US7967059B2 (en) | Heat dissipation device | |
US7697293B1 (en) | Heat dissipation device | |
US7852630B2 (en) | Heat dissipating device | |
US7806167B2 (en) | Heat dissipation device | |
US6860321B2 (en) | Heat-dissipating device | |
US20080158820A1 (en) | Heat dissipation device for computer add-on cards | |
US8081458B2 (en) | Heat dissipation apparatus for electronic device | |
US8322404B2 (en) | Heat dissipation device for at least two electronic devices with two sets of fins | |
US20110186269A1 (en) | Thermal module | |
US20100212869A1 (en) | Heat dissipation device | |
US20050030719A1 (en) | Heat dissipating device for dissipating heat generated by an electronic component inside a housing | |
US20130083483A1 (en) | Heat dissipation device and electronic device using same | |
US20100139895A1 (en) | Thermal module | |
US8047270B2 (en) | Heat dissipation device having heat pipes for supporting heat sink thereon | |
US20110305559A1 (en) | Heat dissipation device and centrifugal fan thereof | |
US7382615B2 (en) | Heat dissipation device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PENG, XUE-WEN;CHEN, RUI-HUA;REEL/FRAME:019115/0622 Effective date: 20070330 |
|
AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:021365/0364 Effective date: 20080724 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:021365/0364 Effective date: 20080724 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20121028 |