US20060274498A1 - Air conducting cover - Google Patents

Air conducting cover Download PDF

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Publication number
US20060274498A1
US20060274498A1 US11/306,592 US30659206A US2006274498A1 US 20060274498 A1 US20060274498 A1 US 20060274498A1 US 30659206 A US30659206 A US 30659206A US 2006274498 A1 US2006274498 A1 US 2006274498A1
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United States
Prior art keywords
server
air
conducting cover
air conducting
motherboard
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Granted
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US11/306,592
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US7447021B2 (en
Inventor
Chin-Hui Chen
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Hon Hai Precision Industry Co Ltd
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Individual
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Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIN-HUI
Publication of US20060274498A1 publication Critical patent/US20060274498A1/en
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Publication of US7447021B2 publication Critical patent/US7447021B2/en
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present invention relates to an air conducting cover, and particularly to an air conducting cover that can improve heat dissipation efficiency for a server.
  • a server is a core computer for serving every computers in a network system.
  • the server can provide a variety of functions for network users, such as printing, copying, storage, and sharing information and sources among the network users in the network system.
  • a structure of the server is similar to a personal computer.
  • the server includes a central processing unit (CPU), a memory, a north bridge chip, a south bridge chip, input devices, output devices, and etc.
  • the north bridge chip is connected with the CPU and the memory.
  • the south bridge chip is connected with input devices and output devices.
  • a chassis of the server may be a tower chassis, a bracket chassis or a blade chassis.
  • a blade server includes several motherboards and a blade chassis.
  • One blade chassis can take in a lot of motherboards.
  • Each motherboard is an independent system, which has a CPU, a memory, a hard disc, and other electronic components.
  • a power supply, a storage service, and network connections between motherboards are provided by a backboard.
  • the blade server has a heat dissipation system.
  • a conventional heat dissipation system includes a cooling fan and a heat sink. However, as the blade server develops, heat generated therefrom is getting larger and larger. Because a large number of motherboards are placed in one blade chassis, room for heat dissipation is limited. The cooling fan will produce larger noises if improving its efficiency.
  • An air conducting cover for a server in accordance with a preferred embodiment includes a recess portion, a guiding portion, and a connecting portion.
  • the guiding portion upwardly and outward extends from an end of the recess portion.
  • the connecting portion horizontally extends from an end of the guiding portion and is attached to the server.
  • the server comprises a server motherboard bracket and a server motherboard installed on the server motherboard bracket.
  • the air conducting cover is disposed on the server motherboard bracket and combined with the server motherboard bracket as an airflow channel.
  • the airflow channel is a diverging duct and gradually narrowed from two ends to a middle.
  • FIG. 1 is an isometric view of an air conducting cover in accordance with a preferred embodiment of the present invention, and a server;
  • FIG. 2 is an assembled view of FIG. 1 ;
  • FIG. 3 is a cross sectional view taken along line III-III of FIG. 2 .
  • the server includes a server motherboard bracket 10 and a server motherboard 20 .
  • the server motherboard bracket 10 includes a bottom plate 11 , a front baffle plate 13 , a back baffle plate 14 , a right sidewall 15 , a left sidewall 16 , and two hems 12 .
  • the hems 12 perpendicularly inwardly extend from top portions of the right sidewall 15 and the left sidewall 16 respectively.
  • An air inlet 151 is defined in the right sidewall 15
  • an air outlet 161 is defined in the left sidewall 16 .
  • the server motherboard 20 is fixed on the bottom plate 11 of the server motherboard bracket 10 .
  • the server motherboard 20 includes a plurality of electronic components such as a hard disc 21 and a heat sink 22 .
  • the heat sink 22 is in the vicinity of the air inlet 151 .
  • a cooling air is insufflated into the server from the air inlet 151 , passes through the heat sink 22 , and is discharged out of the server from the air outlet 161 .
  • the air conducting cover 30 includes a recess portion 31 , a first guiding portion 32 and a second guiding portion 33 .
  • the first guiding portion 32 and the second guiding portion 33 upwardly and outwardly extend from two opposite ends of the recess portion 31 respectively.
  • a first connecting portion 34 and a second connecting portion 35 respectively horizontally extend from upper ends of the first guiding portion 32 and the second guiding portion 33 .
  • the air conducting cover 30 is placed on the server motherboard bracket 10 and combined with the server motherboard bracket 10 as an airflow channel 40 .
  • the first connecting portion 34 and the second connecting portion 35 of the air conducting cover 30 are attached to the hems 12 of the server motherboard bracket 10 by conventional means such as screws and glue water.
  • the recess portion 31 , the first guiding portion 32 , and the second guiding portion 33 of the air conducting cover 30 are disposed in the server motherboard bracket 10 , and the recess portion 31 is in the vicinity of a top portion of the electronic components.
  • the airflow channel 40 is enclosed by the air conducting cover 30 , the air inlet 151 , the air outlet 161 , and the recess portion 11 .
  • the airflow channel 40 is a diverging duct and gradually narrowed from two ends to a middle thereof.
  • the electronic components on the server motherboard 20 will generate a large amount of heat.
  • the cooling air is insufflated into the server from the air inlet 151 . Because the airflow channel 40 is gradually narrowed from two ends to a middle, a cross sectional area of the airflow channel 40 on the electronic components is reduced. Thus, a blowing speed of the cooling air is accelerated.
  • the air conducting cover 30 covers the server motherboard bracket 10 , the cooling air is centralized to blow over the electronic components and the heat sink 221 .
  • the air conducting cover 30 can improve heat dissipation efficiency for the server without additional room and more noise.
  • the air conducting cover 30 maybe have another structure, for example, only one guiding portion upwardly and outward extends from an end of the recess portion 31 .

Abstract

An air conducting cover for a server includes a recess portion, a guiding portion, and a connecting portion. The guiding portion upwardly and outwardly extends from an end of the recess portion. The connecting portion horizontally extends from an end of the guiding portion and is attached to the server. The server includes a server motherboard bracket and a server motherboard installed on the server motherboard bracket. The air conducting cover is disposed on the server motherboard bracket and combined with the server motherboard bracket as an airflow channel. The airflow channel is a diverging duct and gradually narrowed from two ends to a middle. Thus, a blowing speed of a cooling air insufflated into the server is accelerated. The air conducting cover can improve heat dissipation efficiency of the server without additional room and will not produce more noise.

Description

    FIELD OF THE INVENTION
  • The present invention relates to an air conducting cover, and particularly to an air conducting cover that can improve heat dissipation efficiency for a server.
    • DESCRIPTION OF RELATED ART
  • A server is a core computer for serving every computers in a network system. The server can provide a variety of functions for network users, such as printing, copying, storage, and sharing information and sources among the network users in the network system. A structure of the server is similar to a personal computer. The server includes a central processing unit (CPU), a memory, a north bridge chip, a south bridge chip, input devices, output devices, and etc. The north bridge chip is connected with the CPU and the memory. The south bridge chip is connected with input devices and output devices. A chassis of the server may be a tower chassis, a bracket chassis or a blade chassis.
  • A blade server includes several motherboards and a blade chassis. One blade chassis can take in a lot of motherboards. Each motherboard is an independent system, which has a CPU, a memory, a hard disc, and other electronic components. A power supply, a storage service, and network connections between motherboards are provided by a backboard. Thus the blade server can save a lot of room, but resulting in a serious heating problem. The blade server has a heat dissipation system. A conventional heat dissipation system includes a cooling fan and a heat sink. However, as the blade server develops, heat generated therefrom is getting larger and larger. Because a large number of motherboards are placed in one blade chassis, room for heat dissipation is limited. The cooling fan will produce larger noises if improving its efficiency.
  • What is needed, therefore, is an air conducting cover that can improve heat dissipation efficiency for a server without additional room and producing more noise.
    • SUMMARY OF THE INVENTION
  • An air conducting cover for a server in accordance with a preferred embodiment includes a recess portion, a guiding portion, and a connecting portion. The guiding portion upwardly and outward extends from an end of the recess portion. The connecting portion horizontally extends from an end of the guiding portion and is attached to the server. The server comprises a server motherboard bracket and a server motherboard installed on the server motherboard bracket. The air conducting cover is disposed on the server motherboard bracket and combined with the server motherboard bracket as an airflow channel. The airflow channel is a diverging duct and gradually narrowed from two ends to a middle. Thus, a blowing speed of a cooling air insufflated into the server is accelerated. So, the air conducting cover can improve heat dissipation efficiency of the server without additional room and producing more noise.
  • Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
    • BRIEF DESCRIPTION OF DRAWINGS
  • FIG. 1 is an isometric view of an air conducting cover in accordance with a preferred embodiment of the present invention, and a server;
  • FIG. 2 is an assembled view of FIG. 1; and
  • FIG. 3 is a cross sectional view taken along line III-III of FIG. 2.
    • DETAILED DESCRIPTION
  • Referring to FIG. 1, an air conducting cover 30 for a server in accordance with the preferred embodiment of the present invention is shown. The server includes a server motherboard bracket 10 and a server motherboard 20.
  • The server motherboard bracket 10 includes a bottom plate 11, a front baffle plate 13, a back baffle plate 14, a right sidewall 15, a left sidewall 16, and two hems 12. The hems 12 perpendicularly inwardly extend from top portions of the right sidewall 15 and the left sidewall 16 respectively. An air inlet 151 is defined in the right sidewall 15, and an air outlet 161 is defined in the left sidewall 16.
  • The server motherboard 20 is fixed on the bottom plate 11 of the server motherboard bracket 10. The server motherboard 20 includes a plurality of electronic components such as a hard disc 21 and a heat sink 22. The heat sink 22 is in the vicinity of the air inlet 151. A cooling air is insufflated into the server from the air inlet 151, passes through the heat sink 22, and is discharged out of the server from the air outlet 161.
  • The air conducting cover 30 includes a recess portion 31, a first guiding portion 32 and a second guiding portion 33. The first guiding portion 32 and the second guiding portion 33 upwardly and outwardly extend from two opposite ends of the recess portion 31 respectively. A first connecting portion 34 and a second connecting portion 35 respectively horizontally extend from upper ends of the first guiding portion 32 and the second guiding portion 33.
  • Referring also to FIGS. 2 and 3, the air conducting cover 30 is placed on the server motherboard bracket 10 and combined with the server motherboard bracket 10 as an airflow channel 40. The first connecting portion 34 and the second connecting portion 35 of the air conducting cover 30 are attached to the hems 12 of the server motherboard bracket 10 by conventional means such as screws and glue water. The recess portion 31, the first guiding portion 32, and the second guiding portion 33 of the air conducting cover 30 are disposed in the server motherboard bracket 10, and the recess portion 31 is in the vicinity of a top portion of the electronic components. The airflow channel 40 is enclosed by the air conducting cover 30, the air inlet 151, the air outlet 161, and the recess portion 11. The airflow channel 40 is a diverging duct and gradually narrowed from two ends to a middle thereof.
  • When the server is working, the electronic components on the server motherboard 20 will generate a large amount of heat. The cooling air is insufflated into the server from the air inlet 151. Because the airflow channel 40 is gradually narrowed from two ends to a middle, a cross sectional area of the airflow channel 40 on the electronic components is reduced. Thus, a blowing speed of the cooling air is accelerated. At the same time, because the air conducting cover 30 covers the server motherboard bracket 10, the cooling air is centralized to blow over the electronic components and the heat sink 221. Thus, the air conducting cover 30 can improve heat dissipation efficiency for the server without additional room and more noise.
  • The air conducting cover 30 maybe have another structure, for example, only one guiding portion upwardly and outward extends from an end of the recess portion 31.
  • Proved by experiments, when adding the air conducting cover 30 into the server, a temperature of each of the electronic components is reduced. A temperature correlation table is given as follows:
    Temperature Temperature
    (° C.) (° C.) Temperature
    Electronic Without air With air requirement
    components conducting cover conducting cover (° C.)
    CPU 90.8 77.2 <100
    North Bridge Chip 93.6 78.0 <105
    South Bridge Chip 209.8 100.4 <105
    Memory 135.3 61.8 —
  • It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (10)

1. An air conducting cover for a server, the air conducting cover comprising: a recess portion;
a guiding portion upwardly and outwardly extending from an end of the recess portion; and
a connecting portion horizontally extending from an end of the guiding portion, the connecting portion attached to the server, the air conducting cover combined with the server as an airflow channel, the airflow channel being gradually narrowed from an end to a middle thereof, to accelerate blowing speed of air.
2. The air conducting cover as claimed in claim 1, wherein the server comprises:
a server motherboard bracket comprising a bottom plate and two sidewalls; and
a server motherboard installed on the bottom plate of the server motherboard bracket, the server motherboard comprising a plurality of electronic components and a heat sink thereon.
3. The air conducting cover as claimed in claim 2, wherein the two sidewalls respectively comprise an air inlet and an air outlet defined therein, two hems perpendicularly inwardly extending from top portions of the two sidewalls respectively, and the connecting portion of the air conducting cover is attached to one of the hems.
4. The air conducting cover as claimed in claim 3, wherein the airflow channel is enclosed by the air conducting cover, the air inlet, the air outlet, and the recess portion.
5. The air conducting cover as claimed in claim 2, wherein the recess portion is in the vicinity of a top portion of the electronic components.
6. A server comprising:
a sever motherboard bracket comprising an air inlet and an air outlet;
a sever motherboard fixed in the server motherboard bracket, the sever motherboard comprising a plurality of electronic components and a heat sink; and
an air conducting cover comprising a recess portion, two guiding portions upwardly and outwardly extending from two opposite ends of the recess portion, and two connecting portions extending from each end of the guiding portions, wherein the connecting portions are attached to the server motherboard bracket at the air inlet and the air outlet, respectively.
7. The server as claimed in claim 6, wherein the server motherboard bracket comprises a bottom plate and two sidewalls, the air inlet and the air outlet defined in the sidewalls respectively, two hems perpendicularly inwardly extending from top portions of the sidewalls, and the connecting portion of the air conducting cover is attached to one of the hems.
8. The server as claimed in claim 7, wherein an airflow channel is enclosed by the air conducting cover, the air inlet, the air outlet, and the recess portion.
9. The server as claimed in claim 8, wherein the airflow channel is a diverging duct and gradually narrowed from two ends to a middle.
10. The server as claimed in claim 6, wherein the recess portion is in the vicinity of a top portion of the electronic components.
US11/306,592 2005-06-04 2006-01-04 Air guiding cover Expired - Fee Related US7447021B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2005100351545A CN100383702C (en) 2005-06-04 2005-06-04 Improved structure of server
CN200510035154.5 2005-06-04

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US20060274498A1 true US20060274498A1 (en) 2006-12-07
US7447021B2 US7447021B2 (en) 2008-11-04

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US7447021B2 (en) 2008-11-04
CN100383702C (en) 2008-04-23

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