US20060260785A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
US20060260785A1
US20060260785A1 US11287393 US28739305A US2006260785A1 US 20060260785 A1 US20060260785 A1 US 20060260785A1 US 11287393 US11287393 US 11287393 US 28739305 A US28739305 A US 28739305A US 2006260785 A1 US2006260785 A1 US 2006260785A1
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Prior art keywords
fin
vent
heat sink
baffle
fins
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US11287393
Inventor
Alex Hsia
Yu Hung Huang
Chin Ming Chen
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Delta Electronics Inc
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Delta Electronics Inc
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink includes a plurality of fins, each of which includes a first vent and a first baffle. Each baffle is extended at one side of the first vent, and each of the first vents of the fins is located corresponding to the first vent of an adjacent fin. The heat sink further has a base, on which the fins are installed in parallel.

Description

  • This non-provisional application claims priority under U.S.C. § 119(A) on patent application No(s). 094115552 filed in Taiwan, Republic of China on May 13, 2005, the entire contents of which are hereby incorporated by reference.
  • BACKGROUND OF THE INVENTION
  • 1. Field of Invention
  • The invention relates to a heat sink and, in particular to a heat sink that provides good airflow guiding effect for heat dissipation.
  • 2. Related Art
  • With the advance in the functions of electronic devices, more heat is generated during their operations. If the heat is not properly dissipated, the efficiency of the electronic devices will be lowered and the devices may be burned out. Therefore, the heat sink has become an indispensable part of modem electronic devices.
  • In particular, the areas of integrated circuits (IC) become smaller as the integration of microelectronic devices increases with the improving packaging techniques. As the result, heat accumulated in each unit area of the electronic devices rises accordingly. Therefore, how to provide a high efficiency heat sink is always a hot topic in the field of the electronic industry.
  • Please refer to FIG. 1, which shows the schematic view of the conventional heat sink and fan. The heat sink 1 is used on an electronic device 9 which generates heat in the operation, such as a chip. The heat sink 1 consists of a base 11 and a plurality of fins 12 which are perpendicularly formed and connected on an upper surface of the base 11 to increase the heat-dissipating area of the heat sink 1. The heat sink 1 is disposed on the top of the chip 9, and the bottom surface of the base 11 directly contacts the chip 9 so that the heat generated by the chip is received by the base 11 and is transported to outside of the heat sink 1 with high efficiency, whereby lowering the temperature of the chip 9.
  • Also, a fan 8 is additionally added on the heat sink 1 for providing airflow into the heat sink 1 and facilitating the heat dissipation of the fins 12. However, when airflow provided by the fan 8 is blown into the heat sink 1, there is an area of the heat sink 1 under the motor base 81 where is received no airflow due to obstruction of the motor base 81. Therefore, heat is not able to be dissipated and is accumulated in a regional area of the heat sink 1 so that the overall heat dissipation effect is greatly affected.
  • SUMMARY OF THE INVENTION
  • In view of the foregoing, the invention is to provide a heat sink with an airflow design component to prevent airflow obstruction by the motor base of the fan. This avoids the problem that heat cannot be effectively brought away and is accumulated in a regional area in the heat sink, and the overall heat dissipation efficiency is thus increased.
  • To achieve the above, a heat sink of the invention includes a first fin and a second fin. The first fin has a first vent and a first baffle extended at one side of the first vent. The second fin is installed in parallel with the first fin. The second fin has a second vent and a second baffle dispose at one side of the second vent. The first vent and the second vent are formed on the first fin and the second fin in an oblique manner, respectively. The second vent is located corresponding to the first vent of the first fin, and the first baffle of the first fin is connected to the second fin. The second fin and the second baffle thereof can be integrally formed as a single piece. Alternatively, the second fin can be processed by a punching process to form the second vent and the second baffle. The first fin further has a fourth vent and a fourth baffle, which is extended at one side of the fourth vent.
  • To achieve the above, a heat sink of the invention includes a first fin, a second fin, and a first baffle. The first fin has a first vent. The second fin is disposed at one side of the first fin and has a second vent located corresponding to the first vent of the first fin. The first baffle is provided between the first fin and the second fin and is positioned at the first vent. The first fin and the first baffle are formed individually and then assembled together, or the first fin and the first baffle are integrally formed as a single piece. The first vent and the second vent are formed on the first fin and the second fin in an oblique manner, respectively.
  • To achieve the above, the invention further provides a heat sink including a plurality of fins. Each of the fins has a first vent and a first baffle extended at one side of the first vent. In this case, the first vent of each heat sink is located corresponding to the first vent of its adjacent fin.
  • The above-mentioned heat sink further includes a base, on which the fins are installed in parallel. Each of the fins further has a second vent and a second baffle extended at one side of the second vent. The first vent and the second vent of each fin are positioned substantially in a V shape relative to a vertical direction of the fins. Each fin and the second baffle thereof can be integrally formed as a single piece. Alternatively, each fin can be processed by a punching process to form the second vent and the second baffle. Each of the fins has an opening, and the openings form an airflow passage when all fins are installed on the base.
  • As mentioned above, the heat sink of the invention utilizes the baffles to guide the airflow, so that air is blown toward a specific area to prevent heat accumulated in a regional area in the heat sink, whereby enhancing the heat dissipation effect. Thus, the overall heat dissipation efficiency can be increased.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention will become more fully understood from the detailed description given herein below illustration only, and thus is not limitative of the present invention, and wherein:
  • FIG. 1 is a schematic view of the conventional heat sink and fan;
  • FIG. 2 is a schematic view of a heat sink according to a first embodiment of the invention;
  • FIG. 3 is a side view of the heat sink in FIG. 2;
  • FIG. 4 is a schematic view of the heat sink in combination with a fan;
  • FIG. 5 is a three-dimensional view of another heat sink according to the first embodiment of the invention;
  • FIG. 6 is a side view of a heat sink according to a second embodiment of the invention; and
  • FIG. 7 is a three-dimensional view of the heat sink according to the second embodiment of the invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • The present invention will be apparent from the following detailed description, which proceeds with reference to the accompanying drawings, wherein the same references relate to the same elements.
  • First Embodiment
  • Please refer both to FIGS. 2 and 3, which illustrate a heat sink according to a first embodiment of the invention. A heat sink 2 includes a first fin 21, a second fin 22, a third fin 23, and a base 24. The first fin 21, the second fin 22 and the third fin 23 are installed on the base 24 in parallel. It should be noted that the amount of the fins such as the first, second, and third fins 21, 22, 23 are not restricted to any one specific number, and the amount can be flexibly determined by the user according their requirements. For the convenience of explanation, only one first fin 21, one second fin 22, and one third fin 23 are drawn in FIGS. 2 and 3.
  • As shown in FIG. 2, the first fin 21 has a first vent 211 and a second vent 212. The first vent 211 and the second vent 212 are obliquely and symmetrically disposed according an image line of the vertical direction L of the first fin 21. In other words, the first vent 211 is located corresponding to the second vent 212, and the first vent 211 and the second vent 212 tilt away from the image line of the vertical direction L of the first fin 21 and are positioned substantially in a V shape. Further, there is at least one baffle 214 extended at one side of the first vent 211 and one side of the second vent 212 in the first fin 21. In this embodiment, the first fin 21 is a thin plate made of copper, copper alloys, aluminum, aluminum alloys, or other metal materials. The first fin 21 and the baffles 214 thereof are integrally formed as a single piece. For example, the first fin 21 can be processed by a punching process to form the first vent 211, the second vent 212 and the baffles 214.
  • The second fin 22 is disposed at the side of the first fin 21 where the baffles 214 are located so that the baffles 214 of the first fin 21 are able to reach the second fin 22. The second fin 22 has a first vent 221 and a second vent 222. The first vent 221 and the second vent 222 are formed on the first fin 21 and the second fin 22 in an oblique manner, respectively. Also, the first vent 221 and the second vent 222 are obliquely and symmetrically installed disposed according an image line of the vertical direction L of the second fin 22. In other words, the first vent 221 is located corresponding to the second vent 222, and the first vent 221 and the second vent 222 tilt away from the image line of the vertical direction L of the second fin 22 and are positioned substantially in a V shape. Further, there is at least one baffle 224 extended at one side of the first vent 221 and one side of the second vent 222 in the second fin 22.
  • Moreover, the first vent 221 and the second vent 222 of the second fin 22 are located corresponding to the first vent 211 and the second vent 212 of the first fin 21, respectively. The second fin 22 is a thin plate made of copper, copper alloys, aluminum, aluminum alloys, or other metal materials. The second fin 22 and the baffles 224 thereof can be integrally formed as a single piece. For example, the second fin 22 can be processed by a punching process to form the first vent 221, the second vent 222 and the baffles 224.
  • The third fin 23 is disposed at the side of the second fin 22 where the baffles 224 is located so that the baffles 224 of the second fin 22 are able to reach the third fin 23. The third fin 23 has a first vent 231 and a second vent 232. The first vent 231 and the second vent 232 are obliquely and symmetrically disposed according an image line of the vertical direction L of the third fin 23. In other words, the first vent 231 is located corresponding to the second vent 232, and the first vent 231 and the second vent 232 tilt away from the image line of the vertical direction L of the third fin 23 and are positioned substantially in a V shape. Further, there is at least one baffle 234 extended at one side of the first vent 231 and one side of the second vent 232 in the third fin 23.
  • Moreover, the first vent 231 and the second vent 232 of the third fin 23 are located corresponding to the first vent 221 and the second vent 222 of the second fin 22, respectively. The third fin 23 is a thin plate made of copper, copper alloys, aluminum, aluminum alloys, or other metal materials. The third fin 23 and the baffles 234 thereof can be integrally formed as a single piece. For example, the third fin 23 can be processed by a punching process to form the first vent 231, the second vent 232 and the baffles 234.
  • In this embodiment, the base 24 can be made of metal such as copper or copper alloys. The bottom surface of the base 24 may be in direct contact with a heat-generating device (not shown), such as a chip or CPU so that the heat generated by the heat-generating device is received by the base 24 and is transmitted to the base 24. Also, the base 24 is formed with a plurality of grooves on the top surface thereof by mechanical machining for allowing the first fin 21, the second fin 22 and the third fin 23 to be inserted on the base 24 in parallel, whereby the disclosed heat sink 2 is obtained.
  • Further, an example is fully described with reference to FIG. 4 showing a schematic view of the heat sink in combination with a fan. FIG. 4 shows how the baffles 234 guide the airflow when the airflow provided by the fan 8 is blown into the heat sink 2. The fan 8 is preferably installed above the heat sink 2. Conventionally, because the base 24 of the heat sink 2 is in direct contact with the heat-generating device (not shown), the temperature at the center of the base 24 is higher than other parts of the base 24. When the airflow generated by the fan 8 is blown to the heat sink 2, the baffles 234 of the third fin 23 (or the baffles 214, 224) can guide and lead the airflow focusing toward the center of the base 24, the area of the heat sink 2 under the motor base 81 where is received no airflow due to obstruction of the motor base 81. As the result, the baffles 214, 224 and 234 can solve the problem of heat accumulating in a regional area of the heat sink and improve the heat dissipation effect and efficiency of the heat sink 2.
  • Although FIG. 2 only depicts only one for each of the first fin 21, the second fin 22, and the third fin 23, the invention is not limited to this example. The heat sink 2 of the invention may include a plurality of first fins 21, a plurality of second fins 22, and a plurality of third fins 23, which are all installed in parallel on the base 24 to form the heat sink 2. The first fins 21, the second fins 22, and the third fins 23 may be the same or different. FIG. 5 is a three-dimensional view of another heat sink according to the first embodiment of the invention. The heat sink 2 may also include a plurality of first fins, a plurality of second fins, and a plurality of third fins. All of the fins are the same and are installed in parallel on the base 24.
  • Second Embodiment
  • Please refer both to FIGS. 6 and 7, which show a heat sink 6 according to a second embodiment of the invention. The heat sink 6 includes a plurality of fins 61, a base 62, and a plurality of baffles 63. The fins 61 are installed on the base 62 in parallel, and each baffle 63 is connected to at least one fin 61. It should be noted that the amount of the fins 61 is not restricted to any one specific number, and the amount can be flexibly determined by the user according their requirements.
  • In addition, as shown in FIG. 7, each of the fins 61 has a first vent 611, a second vent 612, and an opening 613. The first vent 611 and the second vent 612 are obliquely and symmetrically disposed according an image line of the vertical direction L of the fin 61. In other words, the first vent 611 is located corresponding to the second vent 612, and the first vent 611 and the second vent 612 tilt away from the image line of the vertical direction L of the fin 61 and are positioned substantially in a V shape.
  • Each opening 613 is formed along the vertical direction of each fin 61 and is located between the first vent 611 and the second vent 612. It is preferred to be formed at a place on the fin 61 in the vicinity of the base 62. Therefore, when several fins 61 are installed on the base 62, the openings 613 corporately form an airflow passage between the fins 61 and the base 62. When the airflow enters the heat sink 6 from the top of the fins 61, the airflow flows through the vents 611, 612 and is then guided by the baffles 63 to and flows through the out via the airflow passage. This enhances the convection in the heat sink 6.
  • In addition, the first vent 611 and the second vent 612 on the fin 61 are connected with a baffle 63, respectively. Although the fins 61 and the baffles 63 in this embodiment are formed individually and then assembled together, they can be, alternatively, integrally formed as a single piece by a punching process.
  • Although only three fins 61 are depicted in FIG. 6, the invention is not limited to this example. The heat sink 6 of the invention may have several fins 61 installed in parallel on the base 62 (see FIG. 7).
  • In summary, the heat sink of the invention utilizes baffles to guide the airflow, so that air is blown toward a specific area to prevent heat accumulated in a regional area in the heat sink, whereby enhancing the heat dissipation effect. This solves the problem that there is an area of the heat sink under the motor base where is received no airflow due to obstruction of the motor base. The overall heat dissipation efficiency is thus increased.
  • Although the invention has been described with reference to specific embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments, will be apparent to persons skilled in the art. It is, therefore, contemplated that the appended claims will cover all modifications that fall within the true scope of the invention.

Claims (20)

  1. 1. A heat sink, comprising:
    a plurality of fins, each of which comprises a first vent and a first baffle extended at one side of the first vent, wherein each of the first vents of the fins is located corresponding to the first vent of an adjacent fin.
  2. 2. The heat sink as claimed in claim 1, further comprising:
    a base, on which the fins are installed in parallel.
  3. 3. The heat sink as claimed in claim 1, wherein each of the fins further comprises a second vent and a second baffle extended at one side of the second vent.
  4. 4. The heat sink as claimed in claim 3, wherein the first vent and the second vent are formed on the first fin and the second fin in an oblique manner, respectively.
  5. 5. The heat sink as claimed in claim 3, wherein the first vent and the second vent of each fin are positioned substantially in a V shape relative to a vertical direction of the fins.
  6. 6. The heat sink as claimed in claim 3, wherein each of the fins and the first baffle as well as the second baffle thereof are integrally formed as a single piece.
  7. 7. The heat sink as claimed in claim 6, wherein each of the fins is processed by a punching process to form the first vent, the first baffle, the second vent and the second baffle.
  8. 8. The heat sink as claimed in claim 2, wherein each of the fins further comprises an opening and the openings form an airflow passage when all fins are installed on the base.
  9. 9. The heat sink as claimed in claim 8, wherein each of the fins is processed by a punching process to form the first vent and the first baffle when all fins are installed on the base.
  10. 10. The heat sink as claimed in claim 8, wherein the fins are thin plates comprising copper, copper alloys, aluminum, aluminum alloys, or other metal materials.
  11. 11. A heat sink, comprising:
    a first fin, which comprises a first vent and a first baffle extended at one side of the first vent; and
    a second fin, which comprises a second vent located corresponding to the first vent of the first fin, wherein the second fin is installed in parallel with the first fin, and the first baffle of the first fin is connected to the second fin.
  12. 12. The heat sink as claimed in claim 11, wherein the second fin comprises a second baffle extended at one side of the second vent, which is back to the first baffle.
  13. 13. The heat sink as claimed in claim 12, wherein the first fin and the first baffle thereof are integrally formed as a single piece by a punching process, and the second fin and the second baffle thereof are integrally formed as a single piece by a punching process.
  14. 14. The heat sink as claimed in claim 11, further comprising:
    a base, on which the first fin and the second fin are installed in parallel.
  15. 15. The heat sink as claimed in claim 11, wherein the first vent and the second vent are formed on the first fin and the second fin in an oblique manner, respectively.
  16. 16. A heat sink, comprising:
    a first fin, which comprises a first vent;
    a second fin, disposed at one side of the first fin and comprising a second vent located corresponding to the first vent of the first fin; and
    a first baffle, disposed between the first fin and the second fin and located at the first vent.
  17. 17. The heat sink as claimed in claim 16, further comprising:
    a third fin, which is disposed at one side of the second fin and comprises a third vent; and
    a second baffle, which is disposed between the second fin and the third fin and located at the second vent.
  18. 18. The heat sink as claimed in claim 16, further comprising:
    a base, on which the first fin and the second fin are installed in parallel.
  19. 19. The heat sink of claim 16, wherein the first fin and the first baffle are formed individually and then assembled together.
  20. 20. The heat sink of claim 16, wherein the first fin and the first baffle are integrally formed as a single piece.
US11287393 2005-05-13 2005-11-28 Heat sink Abandoned US20060260785A1 (en)

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Cited By (9)

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US20070006997A1 (en) * 2005-07-07 2007-01-11 Ama Precision Inc. Heat sink structure
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
US20070119566A1 (en) * 2005-11-30 2007-05-31 Xue-Wen Peng Heat dissipation device
US20080212280A1 (en) * 2007-03-01 2008-09-04 Nec Corporation Electronic apparatus
US20090219691A1 (en) * 2008-03-03 2009-09-03 Tai-Sol Electronics Co., Ltd. Heat sink capable of internal deflection
US20100288476A1 (en) * 2009-05-15 2010-11-18 HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO.,LTD. Heat dissipation apparatus
US20140196878A1 (en) * 2013-01-15 2014-07-17 Research In Motion Corporation Thermal dissipater apparatus for use with electronic devices
US20150013955A1 (en) * 2013-07-10 2015-01-15 Hon Hai Precision Industry Co., Ltd. Heat sink
EP3225909A1 (en) * 2016-04-01 2017-10-04 Minebea Co., Ltd. Heat radiation member and lighting device

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