US20050284607A1 - Cooling-assisted, heat-generating electrical component and method of manufacturing same - Google Patents

Cooling-assisted, heat-generating electrical component and method of manufacturing same Download PDF

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Publication number
US20050284607A1
US20050284607A1 US10/184,290 US18429002A US2005284607A1 US 20050284607 A1 US20050284607 A1 US 20050284607A1 US 18429002 A US18429002 A US 18429002A US 2005284607 A1 US2005284607 A1 US 2005284607A1
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United States
Prior art keywords
heat
electrical component
removing element
thermal vias
generating
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Abandoned
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US10/184,290
Inventor
Tina Barcley
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Eastman Kodak Co
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Eastman Kodak Co
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Priority to US10/184,290 priority Critical patent/US20050284607A1/en
Assigned to EASTMAN KODAK COMPANY reassignment EASTMAN KODAK COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BARCLEY, TINA P.
Publication of US20050284607A1 publication Critical patent/US20050284607A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113Via provided in pad; Pad over filled via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • H05K1/112Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114Pad being close to via, but not surrounding the via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/062Means for thermal insulation, e.g. for protection of parts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to improvements in heat transfer in electronic technology. More particularly, the invention concerns electrical assemblages, such as circuit boards, which reduce heat generated in ceramic “chip” components during service.
  • the largest chip ceramic component for instance the 2512 resistor, is the least reliable component on most circuit boards and the component most likely to fracture its solder joint due to thermal cycling. The thermal cycling occurs every time the component is used. It would, therefore, be desirable to cool this component during service to dramatically improve its useful life and reliability.
  • an object of the present invention to provide an electrical component protected from deterioration due to overheating during service.
  • Another object of the invention is to provide such an electrical component that is considerably more reliable, has a longer useful life and is cost effective to build and use.
  • an electrical component has a heat-generating main portion having a junction temperature T j and at least one mating surface.
  • Means for reducing the junction temperature T j of the heat-generating main portion has at least one heat-removing element.
  • the heat-removing element comprises a plurality of arranged thermal vias and is electrically associated with the mating surface to form a thermal transport path for heat flow away from said heat-generating main portion.
  • a method of manufacturing a cooling assisted, heat-generating electrical component comprising the steps of providing a heat-generating electrical component having at least one mating portion.
  • a heat-removing element is affixed to the mating portion of the heat-generating electrical component such that heat removed therefrom follows a path from the heat-generating electrical component through the heat-removing element.
  • the present invention has numerous advantages over existing developments including reliability, cost effectiveness, ease of development, and increased component useful life. Moreover, the present invention has the advantage of being applicable to practically any ceramic chip, ball grid array (BGA), direct die attached components, chip-on-board, and smaller chip resistors, such as the 2010, 1206, etc.
  • BGA ball grid array
  • direct die attached components such as the 2010, 1206, etc.
  • chip-on-board such as the 2010, 1206, etc.
  • FIG. 1 is an elevated plan view of an electrical component having the heat-removing element of the invention
  • FIG. 2 is an elevated front plan view of an electrical component having alternative heat-removing elements thereon;
  • FIG. 3 is a cross-sectional view of a typical circuit board construction having the heat-removing element of the invention thereon;
  • FIG. 4 is a plan view of a solder stencil used for automated manufacturing of heat-removing element and thermal vias.
  • electrical component 10 for instance a resistor or capacitor, has mating portions 12 , 14 and a heat-removing element 16 attached to either of mating portions 12 , 14 .
  • Electrical component 10 is preferably made of a ceramic or ceramic-like material for suitability of die usage or affixing other electrical components (multi-chip module).
  • soldering is the preferred method of attaching heat-removing element 16 to either of mating portions 12 , 14
  • Mating portions 12 , 14 are typically gold or palladium tipped for best thermal conductivity and solderability. Skilled artisans will appreciate that, alternatively, the mating portions 12 , 14 may comprise other thermally conductive materials such as tin-lead.
  • heat-removing element 16 has a plurality of thermal vias 18 that provides the mechanism for effectively removing heat from the electrical component 10 .
  • the thermal conductivity of thermal vias 18 is enhanced as possible with the addition of solder or some thermal compound either partially or totally filling the inner walls (not shown) of thermal vias 18 .
  • Thermal vias 18 may have practically any size diameter. A preferred range for the diameter is about 0.022 inches to about 0.040 inches. However, a diameter in the range of about 0.022 inches to about 0.028 inches is more preferred.
  • thermal vias 18 may be electrically connected to a high density copper plane 20 to increase the thermal conductivity of the vias 18 . Therefore, practically any high density copper circuit or collection of signals can be used to increase the thermal conductivity of the vias 18 .
  • the maximum effect on thermal conductivity is realized when the thermal vias 18 are connected to a large copper area, such as high-density copper plane 20 . Typically, large copper areas are generally used for grounds and power circuits.
  • This construction would also include a bonded heat sink 40 , as described below. Use of a thermal conductive bonding adhesive or thermally conductive compound will effectively maximize the heat transfer to the heat sink.
  • electrical assemblage 30 includes a main portion, or circuit board 32 , and at least one heat-generating component 34 , each with the heat-removing elements 16 of the invention.
  • Heat-removing element 16 has a plurality of thermal vias 18 for transporting heat away from heat-generating component 34 .
  • Heat-generating component 34 has a junction temperature T j .
  • the thermal vias 18 transport the heat generated by component 34 to the bottom outer layer 38 of circuit board 32 . The heat is then transported from the bottom outer layer 38 to the adjoining heat sink 40 .
  • Heat sink 40 may be adjoined to bottom outer layer 38 with, for instance, a thermally conductive adhesive material. In this way, the junction temperature T j of the heat-generating component 34 is reduced to a temperature T 1 , wherein T 1 is less than T j .
  • a 10-layer polyimide circuit board 32 may comprise 1 ⁇ 2 oz. copper on the inner layers 35 and 1 oz. copper on the outer layers 37 (top), 38 (bottom).
  • the heat-removing element 16 of the invention can be used with any material circuit board since the primary heat transfer mechanism is conduction through the thermal vias 18 .
  • heat-removing element 16 can be used on any number of layers or copper weight available from any circuit board manufacturer.
  • Current industry standards for circuit board plating include Pd, NiAu, Immersion Tin, Immersion Ag, and HASL for plating types.
  • the specific board material was polyimide, but any board material where vias can be drilled could use this invention (FR2, FR4, CEM, Rogers, etc.).
  • a particular pattern of thermal vias 18 is used on the heat-removing element 16 .
  • the thermal vias 18 are preferably about 0.025 inches in diameter with a grid spacing of about 0.040 inches center-to-center for the hole pattern (see for instance, FIGS. 1 and 2 ).
  • This hole pattern provides a specific cross-sectional area of copper in the circumference of the thermal vias 18 to conduct the heat from the top outer layer 37 of the circuit board 32 to the bottom outer layer 38 .
  • the copper of heat-removing element 16 is used to transport heat across the surface of the circuit board 32 . Additionally, the similar heat-removing elements on the bottom outer layer 38 of the circuit board 32 enhance the transport of the heat from the thermal vias 18 to the heat sink 40 .
  • heat-removing element 16 may have practically any geometric configuration.
  • heat-removing element 16 is substantially rectangular shaped.
  • heat-removing element 16 may be substantially T-shaped.
  • the T-shaped pads are used to separate the thermal vias 18 from mating surfaces 12 , 14 to improve solderability and manufacturability.
  • the actual solder joint not shown
  • Separation of thermal vias 18 from the mating surfaces 12 , 14 may be accomplished by use of webs 22 , typically comprising copper, on circuit board 32 . Any number of webs 22 may be used depending on the application.
  • electrical assemblage 30 of the invention has an aluminum heat sink 40 that is 0.090 inches thick.
  • the heat sink 40 was attached via adhesive layer 39 to the circuit board 32 using an Arlon Thermobond® silicone, thermally conductive, electrically isolative adhesive film.
  • Any metal heat sink 40 could have been used of any thickness, preferably between 0.060 inches and 0.090 inches.
  • any thermally conductive compound or adhesive (including epoxies and liquid silicones) could be used with substantially similar results.
  • thermally conductive, electrically conductive adhesives may be used as a substitute for thermally conductive compounds.
  • solder stencil 50 may be used to automatically apply solder paste to the circuit board 32 in high volume electronic applications.
  • Solder stencil 50 has at least one cut-out portion 52 (two are shown) which provides a path for the solder paste to be applied to the heat-removing elements 16 of circuit board 32 .
  • solder stenciling has the advantage of consistency and ease of use.
  • the solder stencil 50 has standard support features that reduces sagging in the vicinity of the cut-out portions 52 .
  • the amount of solder paste applied to the heat-removing elements 16 can be increased by increasing the size of the cut-out portions 52 .
  • the increased amount of solder paste associated with the increased sizes of the cut-out portions 52 will accommodate the volume of paste that eventually fills the thermal vias 18 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling-assisted, heat-generating electrical component reduces heat generated during operation. The electrical component, typically a resistor, has a least one heat-removing element electrically associated therewith. Heat-removing element comprises a plurality of thermal vias therein and is fixedly attached to an end portion of the electrical component, typically on opposed end portions. Heat absorbed by the heat-removing element can be transported away from the electrical component during service.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • The present application is related to U.S. application Ser. No. ______(Docket 84843), filed ______, by Tina P. Barcley, and entitled, “Insitu-Cooled Electrical Assemblage And Method Of Manufacturing Same;” and U.S. application Ser. No. ______(Docket 84844), filed ______, by Tina P. Barcley, and entitled, “Method of Cooling Heat-Generating Electrical Components.”
  • FIELD OF THE INVENTION
  • The invention relates to improvements in heat transfer in electronic technology. More particularly, the invention concerns electrical assemblages, such as circuit boards, which reduce heat generated in ceramic “chip” components during service.
  • BACKGROUND OF THE INVENTION
  • It is well known that overheating of electrical components, for instance components mounted on a circuit board, contributes to reducing the life of the component. Overall component reliability is also compromised by excessive overheating during service. As circuit boards become denser and contain components that have higher power output capacity, reliability problems become magnified for solder joints of the circuit board, particularly in “chip” ceramic type parts due to CTE (Coefficient of Thermal Expansion) differences.
  • The current trend in the industry is to either assume the reliability risk or to institute extremely expensive chip construction processes for removing excess heat. Both practices have proven undesirable from a cost management standpoint.
  • In a typical electronic package, the largest chip ceramic component, for instance the 2512 resistor, is the least reliable component on most circuit boards and the component most likely to fracture its solder joint due to thermal cycling. The thermal cycling occurs every time the component is used. It would, therefore, be desirable to cool this component during service to dramatically improve its useful life and reliability.
  • Therefore, a need persists in the art for a system and method of cooling electrical components, such as those mounted in circuit boards, during service that produces a component that is reliable, cost effective and has an extended useful life.
  • SUMMARY OF THE INVENTION
  • It is, therefore, an object of the present invention to provide an electrical component protected from deterioration due to overheating during service.
  • Another object of the invention is to provide such an electrical component that is considerably more reliable, has a longer useful life and is cost effective to build and use.
  • The present invention is directed to overcoming one or more of the problems set forth above. Briefly summarized, according to one aspect of the present invention, an electrical component has a heat-generating main portion having a junction temperature Tj and at least one mating surface. Means for reducing the junction temperature Tj of the heat-generating main portion has at least one heat-removing element. The heat-removing element comprises a plurality of arranged thermal vias and is electrically associated with the mating surface to form a thermal transport path for heat flow away from said heat-generating main portion.
  • In another aspect of the invention, a method of manufacturing a cooling assisted, heat-generating electrical component, comprising the steps of providing a heat-generating electrical component having at least one mating portion. A heat-removing element is affixed to the mating portion of the heat-generating electrical component such that heat removed therefrom follows a path from the heat-generating electrical component through the heat-removing element.
  • The present invention has numerous advantages over existing developments including reliability, cost effectiveness, ease of development, and increased component useful life. Moreover, the present invention has the advantage of being applicable to practically any ceramic chip, ball grid array (BGA), direct die attached components, chip-on-board, and smaller chip resistors, such as the 2010, 1206, etc.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The above and other objects, features, and advantages of the present invention will become more apparent when taken in conjunction with the following description and drawings wherein identical reference numerals have been used, where possible, to designate identical features that are common to the figures, and wherein:
  • FIG. 1 is an elevated plan view of an electrical component having the heat-removing element of the invention;
  • FIG. 2 is an elevated front plan view of an electrical component having alternative heat-removing elements thereon;
  • FIG. 3 is a cross-sectional view of a typical circuit board construction having the heat-removing element of the invention thereon; and,
  • FIG. 4 is a plan view of a solder stencil used for automated manufacturing of heat-removing element and thermal vias.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Turning now to the drawings, and in particular to FIGS. 1 and 2, the electrical component 10 of the invention is illustrated. According to FIG. 1, electrical component 10, for instance a resistor or capacitor, has mating portions 12, 14 and a heat-removing element 16 attached to either of mating portions 12, 14. Electrical component 10 is preferably made of a ceramic or ceramic-like material for suitability of die usage or affixing other electrical components (multi-chip module). Although soldering is the preferred method of attaching heat-removing element 16 to either of mating portions 12, 14, skilled artisans will appreciate that other methods may be used including using electrically conductive adhesives. Mating portions 12, 14 are typically gold or palladium tipped for best thermal conductivity and solderability. Skilled artisans will appreciate that, alternatively, the mating portions 12, 14 may comprise other thermally conductive materials such as tin-lead.
  • According to FIG. 1, heat-removing element 16 has a plurality of thermal vias 18 that provides the mechanism for effectively removing heat from the electrical component 10. The thermal conductivity of thermal vias 18 is enhanced as possible with the addition of solder or some thermal compound either partially or totally filling the inner walls (not shown) of thermal vias 18. Thermal vias 18 may have practically any size diameter. A preferred range for the diameter is about 0.022 inches to about 0.040 inches. However, a diameter in the range of about 0.022 inches to about 0.028 inches is more preferred.
  • As shown in FIG. 3, skilled artisans will appreciate that thermal vias 18 may be electrically connected to a high density copper plane 20 to increase the thermal conductivity of the vias 18. Therefore, practically any high density copper circuit or collection of signals can be used to increase the thermal conductivity of the vias 18. The maximum effect on thermal conductivity is realized when the thermal vias 18 are connected to a large copper area, such as high-density copper plane 20. Typically, large copper areas are generally used for grounds and power circuits. This construction would also include a bonded heat sink 40, as described below. Use of a thermal conductive bonding adhesive or thermally conductive compound will effectively maximize the heat transfer to the heat sink.
  • Referring to FIG. 3, an electrical assemblage 30 is illustrated. According to FIG. 3, electrical assemblage 30 includes a main portion, or circuit board 32, and at least one heat-generating component 34, each with the heat-removing elements 16 of the invention. Heat-removing element 16, as described above, has a plurality of thermal vias 18 for transporting heat away from heat-generating component 34. Heat-generating component 34 has a junction temperature Tj. To reduce the junction temperature Tj of the heat-generating component 34, the thermal vias 18 transport the heat generated by component 34 to the bottom outer layer 38 of circuit board 32. The heat is then transported from the bottom outer layer 38 to the adjoining heat sink 40. Heat sink 40 may be adjoined to bottom outer layer 38 with, for instance, a thermally conductive adhesive material. In this way, the junction temperature Tj of the heat-generating component 34 is reduced to a temperature T1, wherein T1 is less than Tj.
  • As an example, a 10-layer polyimide circuit board 32 may comprise ½ oz. copper on the inner layers 35 and 1 oz. copper on the outer layers 37 (top), 38 (bottom). The heat-removing element 16 of the invention can be used with any material circuit board since the primary heat transfer mechanism is conduction through the thermal vias 18. Moreover, heat-removing element 16 can be used on any number of layers or copper weight available from any circuit board manufacturer. Current industry standards for circuit board plating include Pd, NiAu, Immersion Tin, Immersion Ag, and HASL for plating types. The specific board material was polyimide, but any board material where vias can be drilled could use this invention (FR2, FR4, CEM, Rogers, etc.). For the electrical assemblage 30 of the invention, a particular pattern of thermal vias 18 is used on the heat-removing element 16. The thermal vias 18 are preferably about 0.025 inches in diameter with a grid spacing of about 0.040 inches center-to-center for the hole pattern (see for instance, FIGS. 1 and 2). This hole pattern provides a specific cross-sectional area of copper in the circumference of the thermal vias 18 to conduct the heat from the top outer layer 37 of the circuit board 32 to the bottom outer layer 38. The copper of heat-removing element 16 is used to transport heat across the surface of the circuit board 32. Additionally, the similar heat-removing elements on the bottom outer layer 38 of the circuit board 32 enhance the transport of the heat from the thermal vias 18 to the heat sink 40.
  • Referring again to FIGS. 1 and 2, heat-removing element 16 may have practically any geometric configuration. In FIG. 1, heat-removing element 16 is substantially rectangular shaped. As shown in FIG. 2, alternatively, heat-removing element 16 may be substantially T-shaped. In this latter design the T-shaped pads are used to separate the thermal vias 18 from mating surfaces 12, 14 to improve solderability and manufacturability. Typically one would stay away from the actual solder joint (not shown), i.e., the interface of the mating surface 12, 14 and the heat-removing element 16 of the electrical component 10 in order to maintain solder joint integrity. Separation of thermal vias 18 from the mating surfaces 12, 14 may be accomplished by use of webs 22, typically comprising copper, on circuit board 32. Any number of webs 22 may be used depending on the application.
  • Referring to FIG. 3, electrical assemblage 30 of the invention has an aluminum heat sink 40 that is 0.090 inches thick. The heat sink 40 was attached via adhesive layer 39 to the circuit board 32 using an Arlon Thermobond® silicone, thermally conductive, electrically isolative adhesive film. Any metal heat sink 40 could have been used of any thickness, preferably between 0.060 inches and 0.090 inches. Additionally, any thermally conductive compound or adhesive (including epoxies and liquid silicones) could be used with substantially similar results. Those skilled in the art will appreciate that thermally conductive, electrically conductive adhesives may be used as a substitute for thermally conductive compounds.
  • Turning now to FIG. 4, to construct electrical assemblage 30 of the invention, a solder stencil 50 may be used to automatically apply solder paste to the circuit board 32 in high volume electronic applications. Solder stencil 50 has at least one cut-out portion 52 (two are shown) which provides a path for the solder paste to be applied to the heat-removing elements 16 of circuit board 32. Although this process may be accomplished manually, solder stenciling has the advantage of consistency and ease of use. The solder stencil 50 has standard support features that reduces sagging in the vicinity of the cut-out portions 52. The amount of solder paste applied to the heat-removing elements 16 can be increased by increasing the size of the cut-out portions 52. The increased amount of solder paste associated with the increased sizes of the cut-out portions 52 will accommodate the volume of paste that eventually fills the thermal vias 18.
  • The invention has been described with reference to a preferred embodiment. However, it will be appreciated that variations and modifications can be effected by a person of ordinary skill in the art without departing from the scope of the invention.
  • PARTS LIST
    • 10 electrical component
    • 12, 14 mating portion of 10
    • 16 heat-removing element
    • 18 thermal vias
    • 20 high density copper plane
    • 22 webs of heat-removing element 16
    • 30 electrical assemblage
    • 32 circuit board
    • 34 heat-generating component
    • 35 inner layers of circuit board 32
    • 37 top outer layer of circuit board 32
    • 38 bottom outer layer of circuit board 32
    • 39 adhesive layer
    • 40 heat sink
    • 50 solder stencil
    • 52 cut-out portion of solder stencil 50

Claims (12)

1. A cooling-assisted electrical component, comprising:
a heat-generating main portion having a top surface a bottom surface, a junction temperature Tj and at least one mating surface; and,
means for reducing said junction temperature Tj of said heat-generating main portion comprising at least one two-piece heat-removing element having a top pad on said top surface, a bottom pad on said bottom surface and a plurality of thermal vias therein extending between said top and bottom pads, said at least one heat-removing element being electrically associated with said at least one mating surface to form a thermal transport path for heat flow away from said heat-generating main portion through said top pad, thermal vias and bottom pad.
2. The electrical component recited in claim 1 wherein said plurality of thermal vias are arranged in a grid-like pattern with each one of said plurality of thermal vias having a diameter of about 0.025 inches.
3. The electrical component recited in claim 2, wherein nearest adjacent thermal vias are spaced about 0.040 inches apart as measured from a center portion of a first thermal vias to a second center portion of a nearest adjacent second thermal vias.
4. The electrical component recited in claim 2 wherein each one of said plurality of thermal vias is filled with a thermally conductive compound.
5. The electrical component recited in claim 2 wherein each one of said plurality of thermal vias is filled with a solder material.
6. The electrical component recited in claim 2 wherein said at least one heat-removing element is affixed to a gold tipped portion of said at least one mating portion.
7. The electrical component recited in claim 2 wherein said at least one heat-removing element is affixed to a palladium tipped portion of said at least one mating portion.
8. The electrical component recited in claim 2 wherein said at least one heat-removing element is affixed to a tin-lead tipped portion of said at least one mating portion.
9. A method of manufacturing a cooling assisted, heat-generating electrical component, comprising the steps of:
providing a heat-generating electrical component having a top surface, a bottom surface and at least one mating portion and;
affixing a two-piece heat-removing element having a top pad and a bottom pad connected by a plurality of thermal vias to said at least one mating portion of said heat-generating electrical component such that said top pad is on said top surface and said bottom pad is on said bottom surface so that heat removed therefrom follows a path from said heat-generating electrical component through said top pad, thermal vias and bottom pad of said heat-removing element.
10. The method recited in claim 9 further comprising the step of affixing a heat sink in fluid communications with said bottom pad of said heat-removing element to transport heat from said path and away from said heat-removing element.
11. The method recited in claim 9 wherein said step of providing a heat-generating component comprises the step of providing mating portions on opposing end portions of said heat-generating component and then affixing a heat-removing element to each of said end portions.
12. The method recited in claim 11 further comprising the step of affixing a heat sink to said heat-removing element on each of said end portions.
US10/184,290 2002-06-27 2002-06-27 Cooling-assisted, heat-generating electrical component and method of manufacturing same Abandoned US20050284607A1 (en)

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US20140202658A1 (en) * 2011-02-11 2014-07-24 Tai-Her Yang Temperature Equalization Apparatus Jetting Fluid for Thermal Conduction Used in Electrical Equipment
US20180168025A1 (en) * 2015-05-28 2018-06-14 IFP Energies Nouvelles Electronic device comprising a printed circuit board with improved cooling
US20210166987A1 (en) * 2018-11-20 2021-06-03 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and semiconductor manufacturing process

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US20180168025A1 (en) * 2015-05-28 2018-06-14 IFP Energies Nouvelles Electronic device comprising a printed circuit board with improved cooling
US20210166987A1 (en) * 2018-11-20 2021-06-03 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and semiconductor manufacturing process

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