US20050116730A1 - Double-faced detecting devices for an electronic substrate - Google Patents

Double-faced detecting devices for an electronic substrate Download PDF

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Publication number
US20050116730A1
US20050116730A1 US10/724,512 US72451203A US2005116730A1 US 20050116730 A1 US20050116730 A1 US 20050116730A1 US 72451203 A US72451203 A US 72451203A US 2005116730 A1 US2005116730 A1 US 2005116730A1
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Prior art keywords
substrate
detecting
electronic substrate
probe
faced
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Granted
Application number
US10/724,512
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US6897668B1 (en
Inventor
Ming-Huey Hsu
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Premtek International Inc
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Premtek International Inc
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Priority to US10/724,512 priority Critical patent/US6897668B1/en
Assigned to PREMTEK INTERNATIONAL INC. reassignment PREMTEK INTERNATIONAL INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSU, MING-HUEY
Application granted granted Critical
Publication of US6897668B1 publication Critical patent/US6897668B1/en
Publication of US20050116730A1 publication Critical patent/US20050116730A1/en
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Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Definitions

  • the present invention relates to double-faced detecting devices for an electronic substrate, and more particularly to detecting devices that enables to alternatively place the electronic substrate in a horizontal position or a vertical position to detect high-frequency properties of the electronic substrate.
  • conventional detecting devices for an electronic substrate such as a flip chip, a wafer or a printed circuit board (PCB) in high-frequency properties comprises two opposite probe-detecting machines 50 and a substrate platform 70 .
  • Each probe-detecting machine 50 has a probe 51 secured on an inward face of the probe-detecting machine 50 and connects to a detecting system (example: networking analysis instrument) via a high-frequency isolation wire (not shown).
  • the two probe-detecting machines 50 are respectively mounted on two bases 60 .
  • the substrate platform 70 is located between the two probe-detecting machines 50 .
  • the substrate platform 70 has a top face for securing the flip chip, the wafer or the printed circuit board (not shown).
  • a calibration substrate 90 with multiple detecting points 91 (or so-called “pads”) is placed on the top face of the substrate platform 70 for adjustment by the two probes 51 on the two probe-detecting devices 50 .
  • the calibration substrate 90 is removed from the substrate platform 70 .
  • the flip chip, the wafer or the printed circuit board (not shown) with multiple detecting points is settled on the top face of the substrate platform 70 .
  • the probes 51 on the probe-detecting machines 50 extend to touch multiple detecting points 91 to detect high-frequency properties of the electronic substrate.
  • the flip chip, the wafer or the printed circuit board usually has the multiple detecting points formed on a top face and a bottom face in an ideal configuration.
  • the wafers or the printed circuit boards are designed to arrange the multiple detecting points of circuit on the same face.
  • data of high-frequency properties obtained from the designed wafers or the printed circuit boards are only simulating data that is not precise.
  • only 80% of the electronic substrates can be modified and be detected by the conventional detecting devices. Rest of the electronic substrate still can not be modified in circuit to arrange the multiple detecting points on the same face and thus can not be detected.
  • the present invention provides double-faced detecting devices for an electronic substrate in high-frequency properties, which conveniently contact multiple detecting points on two faces of the electronic substrate to detect the high-frequency properties.
  • the double-faced detecting devices for an electronic substrate comprise:
  • the electronic substrate is rotated and erected to the vertical position to expose two faces to respectively face the two probe-detecting machines to allow multiple detecting points on the two faces to be touched in a convenient way.
  • FIG. 1 is a schematically side plane view of double-faced detecting devices for an electronic substrate in accordance with the present invention
  • FIG. 2 is a schematically operational side plane view of the detecting devices for an electronic substrate in FIG. 1 , wherein a substrate platform is located at a vertical position;
  • FIG. 3 is a schematically operational side plane view of the detecting devices in FIG. 2 , wherein two probes of two opposite probe-detecting machines extend to touch multiple detecting points on two sides of the electronic substrate;
  • FIG. 4 is a partially enlarged side plane view of the detecting devices in FIG. 3 to clearly show conjunctions of the probes and the detecting points of the electronic substrate;
  • FIG. 5 is a schematically operational side plane view of conventional detecting devices for an electronic substrate in accordance with prior art.
  • double-faced detecting devices for an electronic substrate 40 in accordance with the present invention comprises a base 10 with a substrate platform 11 , two pivot bases 33 , two probe-detecting machines 30 respectively mounted on the two pivot bases 33 .
  • the electronic substrate 40 has a top face and a bottom face and multiple contacts 41 respectively arranged on the top and bottom faces.
  • the base 10 has an erecting post (not numbered) with a front face, an guiding groove 101 longitudinally defined in the front face of the erecting post, and the substrate platform 11 with a connecting rod 112 movably and rotatably attached to the erecting post via the guiding groove 101 .
  • the substrate platform 11 has a top face.
  • a through hole 114 is defined in the substrate platform 11 and has a diameter smaller than that of the electronic substrate 40 . Therefore, the electronic substrate 40 enables to be mounted on the top face of the substrate platform 11 and exposes the bottom face of the electronic substrate 40 via the through hole 114 .
  • the substrate platform 11 is controlled by a controlling device (not shown) to move vertically to change the height of electronic substrate 40 . Additionally, the substrate platform 11 also enables to be rotated to hold the electronic substrate 40 at a horizontal position or a vertical position. Preferably, the substrate platform 11 rotates from 0 to 90 degrees.
  • the two pivot bases 33 are oppositely located beside the substrate platform 11 .
  • Each pivot base 33 has a levering plate 32 .
  • Each probe-detecting machine 30 is mounted on the levering plate 32 and has a probe 31 retractably extending toward to the electronic substrate 40 . Whereby, the probe-detecting machine 30 can be pivoted to allow the probe 31 being inclined to extend upward to reach the contacts 41 at high locations when the electronic substrate 40 is in the vertical position.
  • the substrate platform 11 horizontally arises and then rotates to the vertical position to expose the two faces of the electronic substrate 40 to respectively face the two probe-detecting machines 30 .
  • the pivot bases 33 rotate the levering plates 32 to adjust inclinations of the two probes 31 on the two probe-detecting machines 30 .
  • the probes 31 enable to probe the contacts 41 to detect the high-frequency properties of the electronic substrate 40 .
  • a calibration substrate is applied on the detecting devices initially for adjustment as described in the conventional ones. Then, a flip chip, a wafer or a printed circuit board is mounted on the top face of the substrate platform 11 to detect high-frequency properties. Operational procedures of the detecting devices for each detection of any electronic substrate, whether the calibration substrate or the flip chip, the wafer or the printed circuit board, are the same as described as in the conventional detecting devices.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

Double-faced detecting devices for an electronic substrate, the detecting device have a base and two probe-detecting machines oppositely located beside the base. The base has a guiding groove and a substrate platform with a through hole rotatably and movably mounted on the base via the guiding groove. Therefore, when the electronic substrate mounts on the substrate platform, the substrate platform enables to rotate from a horizontal position to a vertical position to expose two faces of the electronic substrate to face the two probe-detecting machines for a double-faced detection of the electronic substrate in high-frequency properties. Additionally, each probe-detecting machine is mounted on a pivot base and pivoted by the pivot base to adjust the height of probe to touch the electronic substrate at the vertical position.

Description

    FIELD OF THE INVENTION
  • In general, the present invention relates to double-faced detecting devices for an electronic substrate, and more particularly to detecting devices that enables to alternatively place the electronic substrate in a horizontal position or a vertical position to detect high-frequency properties of the electronic substrate.
    • BACKGROUND OF THE INVENTION
  • With reference to FIG. 5, conventional detecting devices for an electronic substrate, such as a flip chip, a wafer or a printed circuit board (PCB), in high-frequency properties comprises two opposite probe-detecting machines 50 and a substrate platform 70. Each probe-detecting machine 50 has a probe 51 secured on an inward face of the probe-detecting machine 50 and connects to a detecting system (example: networking analysis instrument) via a high-frequency isolation wire (not shown). The two probe-detecting machines 50 are respectively mounted on two bases 60. The substrate platform 70 is located between the two probe-detecting machines 50. The substrate platform 70 has a top face for securing the flip chip, the wafer or the printed circuit board (not shown).
  • When the detecting devices operate, a calibration substrate 90 with multiple detecting points 91 (or so-called “pads”) is placed on the top face of the substrate platform 70 for adjustment by the two probes 51 on the two probe-detecting devices 50. After adjustment, the calibration substrate 90 is removed from the substrate platform 70. Then, the flip chip, the wafer or the printed circuit board (not shown) with multiple detecting points is settled on the top face of the substrate platform 70. The probes 51 on the probe-detecting machines 50 extend to touch multiple detecting points 91 to detect high-frequency properties of the electronic substrate.
  • However, the flip chip, the wafer or the printed circuit board usually has the multiple detecting points formed on a top face and a bottom face in an ideal configuration. For convenience in detection, most of the flip chips, the wafers or the printed circuit boards are designed to arrange the multiple detecting points of circuit on the same face. Unfortunately, data of high-frequency properties obtained from the designed wafers or the printed circuit boards are only simulating data that is not precise. Additionally, only 80% of the electronic substrates can be modified and be detected by the conventional detecting devices. Rest of the electronic substrate still can not be modified in circuit to arrange the multiple detecting points on the same face and thus can not be detected.
    • SUMMARY OF THE INVENTION
  • The present invention provides double-faced detecting devices for an electronic substrate in high-frequency properties, which conveniently contact multiple detecting points on two faces of the electronic substrate to detect the high-frequency properties.
  • To achieve the foregoing purpose, the double-faced detecting devices for an electronic substrate comprise:
      • a base with a substrate platform movably and rotatably attached to the base, and through hole defined in the substrate platform, wherein the substrate platform is adapted to settle the electronic substrate on the substrate platform and is controlled by a controlling device to locate at a horizontal position or a vertical position;
      • two pivot bases oppositely placed beside the substrate platform and each pivot base has a levering plate; and
      • two probe-detecting machines respectively and pivotally mounted on the levering plates of the two pivot bases, wherein each probe-detecting machine has a probe extending toward to the substrate platform to touch the electronic substrate.
  • Whereby, the electronic substrate is rotated and erected to the vertical position to expose two faces to respectively face the two probe-detecting machines to allow multiple detecting points on the two faces to be touched in a convenient way.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematically side plane view of double-faced detecting devices for an electronic substrate in accordance with the present invention;
  • FIG. 2 is a schematically operational side plane view of the detecting devices for an electronic substrate in FIG. 1, wherein a substrate platform is located at a vertical position;
  • FIG. 3 is a schematically operational side plane view of the detecting devices in FIG. 2, wherein two probes of two opposite probe-detecting machines extend to touch multiple detecting points on two sides of the electronic substrate;
  • FIG. 4 is a partially enlarged side plane view of the detecting devices in FIG. 3 to clearly show conjunctions of the probes and the detecting points of the electronic substrate; and
  • FIG. 5 is a schematically operational side plane view of conventional detecting devices for an electronic substrate in accordance with prior art.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • With reference to FIGS. 1 and 2, double-faced detecting devices for an electronic substrate 40 in accordance with the present invention comprises a base 10 with a substrate platform 11, two pivot bases 33, two probe-detecting machines 30 respectively mounted on the two pivot bases 33. Particularly, the electronic substrate 40 has a top face and a bottom face and multiple contacts 41 respectively arranged on the top and bottom faces.
  • The base 10 has an erecting post (not numbered) with a front face, an guiding groove 101 longitudinally defined in the front face of the erecting post, and the substrate platform 11 with a connecting rod 112 movably and rotatably attached to the erecting post via the guiding groove 101. The substrate platform 11 has a top face. A through hole 114 is defined in the substrate platform 11 and has a diameter smaller than that of the electronic substrate 40. Therefore, the electronic substrate 40 enables to be mounted on the top face of the substrate platform 11 and exposes the bottom face of the electronic substrate 40 via the through hole 114. The substrate platform 11 is controlled by a controlling device (not shown) to move vertically to change the height of electronic substrate 40. Additionally, the substrate platform 11 also enables to be rotated to hold the electronic substrate 40 at a horizontal position or a vertical position. Preferably, the substrate platform 11 rotates from 0 to 90 degrees.
  • The two pivot bases 33 are oppositely located beside the substrate platform 11. Each pivot base 33 has a levering plate 32. Each probe-detecting machine 30 is mounted on the levering plate 32 and has a probe 31 retractably extending toward to the electronic substrate 40. Whereby, the probe-detecting machine 30 can be pivoted to allow the probe 31 being inclined to extend upward to reach the contacts 41 at high locations when the electronic substrate 40 is in the vertical position.
  • With further reference to FIGS. 3 and 4, when the detecting devices operate to probe the electronic substrate 40, the substrate platform 11 horizontally arises and then rotates to the vertical position to expose the two faces of the electronic substrate 40 to respectively face the two probe-detecting machines 30. Because the contacts 41 on the electronic substrate 40 are at high positions when the substrate platform 11 is arisen to the vertical position, the pivot bases 33 rotate the levering plates 32 to adjust inclinations of the two probes 31 on the two probe-detecting machines 30. Thereby, the probes 31 enable to probe the contacts 41 to detect the high-frequency properties of the electronic substrate 40.
  • For an actually complete operation, a calibration substrate is applied on the detecting devices initially for adjustment as described in the conventional ones. Then, a flip chip, a wafer or a printed circuit board is mounted on the top face of the substrate platform 11 to detect high-frequency properties. Operational procedures of the detecting devices for each detection of any electronic substrate, whether the calibration substrate or the flip chip, the wafer or the printed circuit board, are the same as described as in the conventional detecting devices.
  • Although particular and specific embodiments of the invention have been disclosed in some detail, numerous modifications will occur to those having skill in the art, which modifications hold true to the spirit of this invention. Such modifications are deemed to be within the scope of the following claims.

Claims (4)

1. Double-faced detecting devices for an electronic substrate with two faces, the detecting devices comprising:
a base having an erecting post with a front face, an guiding groove longitudinally defined in the front face of the erecting post, a substrate platform movably and rotatably attached to the erecting post via the guiding groove, and a through hole defined in the substrate platform, wherein the substrate platform is adapted to settle the electronic substrate on the substrate platform and is controlled by a controlling device to locate at a horizontal position or a vertical position;
two pivot bases oppositely placed beside the substrate platform, wherein each pivot base has a levering plate; and
two probe-detecting machines respectively and pivotally mounted on the levering plates of the two pivot bases, wherein each probe-detecting machine has a probe extending toward to the substrate platform and adapted to touch the electronic substrate.
2. The double-faced detecting devices as claimed in claim 1, wherein the substrate platform rotates within 0 to 90 degrees.
3. The double-faced detecting devices as claimed in claim 1, wherein the electronic substrate is a flip chip.
4. The double-faced detecting devices as claimed in claim 1, wherein the electronic substrate is a printed circuit board.
US10/724,512 2003-11-28 2003-11-28 Double-faced detecting devices for an electronic substrate Expired - Fee Related US6897668B1 (en)

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070296423A1 (en) * 2006-05-25 2007-12-27 Whitener Michael B Double-sided wafer probe
US20080012591A1 (en) * 2006-06-09 2008-01-17 Richard Campbell Differential signal probe with integral balun
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7417446B2 (en) 2002-11-13 2008-08-26 Cascade Microtech, Inc. Probe for combined signals
US7420381B2 (en) * 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7436194B2 (en) 2002-05-23 2008-10-14 Cascade Microtech, Inc. Shielded probe with low contact resistance for testing a device under test
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7456646B2 (en) 2000-12-04 2008-11-25 Cascade Microtech, Inc. Wafer probe
US7498829B2 (en) 2003-05-23 2009-03-03 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7504842B2 (en) 1997-05-28 2009-03-17 Cascade Microtech, Inc. Probe holder for testing of a test device
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe

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JP6088145B2 (en) * 2012-02-13 2017-03-01 オートモーティブエナジーサプライ株式会社 Battery manufacturing method and conductivity inspection apparatus
CN112986632A (en) * 2019-12-12 2021-06-18 陈冠宏 Mounting base device and probe station
CN112379243B (en) * 2020-11-02 2023-07-04 上海无线电设备研究所 Automatic loading and unloading and plugging system and method for normal-temperature test of circuit board
CN112485271B (en) * 2020-12-04 2024-07-05 中山市东照照明有限公司 A PCB board detection device

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US3551807A (en) * 1968-10-01 1970-12-29 Pennwalt Corp Manually adjustable electrical probe for testing printed circuits and the like
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US3701021A (en) * 1970-11-27 1972-10-24 Signetics Corp Apparatus for testing circuit packages

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7504842B2 (en) 1997-05-28 2009-03-17 Cascade Microtech, Inc. Probe holder for testing of a test device
US7761983B2 (en) 2000-12-04 2010-07-27 Cascade Microtech, Inc. Method of assembling a wafer probe
US7688097B2 (en) 2000-12-04 2010-03-30 Cascade Microtech, Inc. Wafer probe
US7495461B2 (en) 2000-12-04 2009-02-24 Cascade Microtech, Inc. Wafer probe
US7456646B2 (en) 2000-12-04 2008-11-25 Cascade Microtech, Inc. Wafer probe
US7482823B2 (en) 2002-05-23 2009-01-27 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7518387B2 (en) 2002-05-23 2009-04-14 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7436194B2 (en) 2002-05-23 2008-10-14 Cascade Microtech, Inc. Shielded probe with low contact resistance for testing a device under test
US7489149B2 (en) 2002-05-23 2009-02-10 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7417446B2 (en) 2002-11-13 2008-08-26 Cascade Microtech, Inc. Probe for combined signals
US7453276B2 (en) 2002-11-13 2008-11-18 Cascade Microtech, Inc. Probe for combined signals
US7501842B2 (en) 2003-05-23 2009-03-10 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7498829B2 (en) 2003-05-23 2009-03-03 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7898273B2 (en) 2003-05-23 2011-03-01 Cascade Microtech, Inc. Probe for testing a device under test
US7759953B2 (en) 2003-12-24 2010-07-20 Cascade Microtech, Inc. Active wafer probe
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7420381B2 (en) * 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US8013623B2 (en) 2004-09-13 2011-09-06 Cascade Microtech, Inc. Double sided probing structures
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US20070296423A1 (en) * 2006-05-25 2007-12-27 Whitener Michael B Double-sided wafer probe
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US20080012591A1 (en) * 2006-06-09 2008-01-17 Richard Campbell Differential signal probe with integral balun
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7750652B2 (en) 2006-06-12 2010-07-06 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe

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