US20040244952A1 - Integrated heat spreader with mechanical interlock designs - Google Patents

Integrated heat spreader with mechanical interlock designs Download PDF

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Publication number
US20040244952A1
US20040244952A1 US10883493 US88349304A US2004244952A1 US 20040244952 A1 US20040244952 A1 US 20040244952A1 US 10883493 US10883493 US 10883493 US 88349304 A US88349304 A US 88349304A US 2004244952 A1 US2004244952 A1 US 2004244952A1
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Patent type
Prior art keywords
heat
spreader
sealant
integrated
portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10883493
Inventor
Sabina Houle
Ashay Dani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/163Connection portion, e.g. seal
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/163Connection portion, e.g. seal
    • H01L2924/16315Shape

Abstract

An integrated heat spreader is presented. The heat spreader is constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, such as a substrate. The heat spreader includes a body portion, a lip portion substantially vertically oriented and integrally formed with the body portion, and a step portion integrally formed with the lip portion. As such, adhesion of the heat spreader to the sealant is increased, and failure due to shear stresses at the heat spreader bonding surface is prevented.

Description

    BACKGROUND
  • [0001]
    1. Field
  • [0002]
    This invention relates generally to packaging for integrated circuits. More specifically, this invention relates to a novel integrated heat spreader.
  • [0003]
    2. Background and Related Art
  • [0004]
    Integrated circuits generate heat to varying degrees. In typical applications, such radiated heat must be dissipated to ensure that thermal effects do not impair the performance of, or even damage, integrated circuits. With increasing demands in computing speeds and memory, heat removal has become a critical focus area in packaging. Various techniques have been employed to dissipate radiated heat effectively, including the attachment of integrated heat spreaders (heatsinks) or fans to integrated circuits.
  • [0005]
    [0005]FIG. 1 (Prior Art) illustrates portions of an electronic package 100. Package 100 includes a die 110, a substrate 120, and pins 130. An integrated heat spreader 101 is adhesively attached to substrate 120 via a sealant. Heat spreader 101 absorbs heat radiated by die 110 and substrate 120.
  • [0006]
    [0006]FIG. 2 (Prior Art) illustrates a portion of another electronic package 200. Package 200 includes a die 210, a substrate 220, and pins 130. Heat spreader 201 is attached to substrate 220 via an adhesive bond 240. Heat spreader 201 is in contact with die 210 to absorb radiated heat of die 210. Heat spreader 201 includes lips 250 that extend from the heat spreader and adhere, via adhesive bond 240, to substrate 220. In package 200, one face of each lip 250 is in contact with adhesive bond 240.
  • [0007]
    The splitting or separating of a laminate into layers is known as delamination. In particular, heat spreader-to-sealant delamination in electronic packages may lead to the popping off of heat spreaders from the integrated circuits to which they are attached. For instance, heat spreader 201 may pop off of substrate 220, causing package 200 to fail. Moreover, high combined shear and tensional stress distributions are often exhibited by packages with off-center dies. Because of severe shear stress (torsional) distributions, heat spreader-to-sealant interfacial delamination may occur. Heat spreader-to-sealant adhesion may be unable to withstand the high shear stresses generated at the heat spreader-to-sealant interface.
  • [0008]
    Therefore, what is needed is an improved integrated heat spreader.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0009]
    [0009]FIG. 1 (Prior Art) illustrates portions of an electronic package.
  • [0010]
    [0010]FIG. 2 (Prior Art) illustrates portions of an electronic package.
  • [0011]
    [0011]FIGS. 3A and 3B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
  • [0012]
    [0012]FIGS. 4A and 4B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
  • [0013]
    [0013]FIGS. 5A and 5B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
  • [0014]
    [0014]FIGS. 6A and 6B are plan and side views, respectively, of an integrated heat spreader according to an embodiment of the present invention.
  • DETAILED DESCRIPTION
  • [0015]
    An integrated heat spreader, as presented herein, is constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, such as a substrate. The heat spreader includes a body portion, a lip portion substantially vertically oriented and integrally formed with the body portion, and a step portion integrally formed with the lip portion. As such, adhesion of the heat spreader to the sealant is increased, and failure due to shear stresses at the heat spreader bonding surface is prevented.
  • [0016]
    [0016]FIGS. 3A and 3B are plan and side views, respectively, of an integrated heat spreader 300 according to an embodiment of the present invention. Heat spreader 300 includes a heat spreader element 301. Heat spreader element 301 may be shaped to suit a particular application. For instance, heat spreader element 301 may be rectangular or square. Lips 310 extend substantially vertically from heat spreader element 301. A step 320 extends from each lip 310 and may be regularly or irregularly shaped. In the embodiment of FIGS. 3A and 3B, steps 320 are rectangular and extend laterally from lips 310 in a substantially perpendicular manner.
  • [0017]
    Heat spreader element 301, lips 310, and steps 320 may be respectively formed of the same materials or different materials. Exemplary materials include copper, copper with a nickel or other coating, aluminum, a carbon/carbon composite, or a carbon/metal composite. Exemplary carbon/metal composites include carbon/copper and matrix fiber reinforced composites. Heat spreader 300 may be selectively plated or plated over its entire surface area. Exemplary electrolytic plating materials include gold, silver, tin, nickel, and metal composites.
  • [0018]
    A thermal interface material (TIM) may be placed between the die and the heat spreader cavity interfaces. A TIM can be a solder, a polymer/solder composite, or a polymer.
  • [0019]
    A sealant may be employed to affix heat spreader 300 to other objects, such as package components, including a substrate (not shown). In exemplary implementations, silicone- or epoxy-based sealants may be employed.
  • [0020]
    Sealant flows over each step 320 to form a mechanical link. Sealant flow 370 is identified in FIG. 3B. In various embodiments, thickness of sealant at the heat spreader surface ranges from 1.5 mm to 3 mm, and extended lips 310 are 2 mm wide.
  • [0021]
    According to embodiments of the present invention, an extension to lip 310, such as step 320, increases the surface area of each lip 310 of heat spreader 300. Thus, sealant coverage over heat spreader 300 increases, and the sealant may better grip heat spreader 300. More specifically, shear stress is distributed above and below lips 310, providing greater area in which to absorb and dissipate stresses. The strength of the sealant in the areas of mechanical linkage, coupled with the adhesive bonding energy, increases the bonding strength and may prevent failure due to shear stresses at the heat spreader-to-sealant interface.
  • [0022]
    In sum, embodiments of the present invention, which include mechanical links at the heat spreader-to-sealant interface, increase adhesion of the sealant to the heat spreader and to a package component, such as a substrate. As such, a sealant is more likely to fail at the substrate interface or cohesively within the sealant than to fail adhesively at the head spreader bonding surface.
  • [0023]
    [0023]FIGS. 4A and 4B are plan and side views, respectively, of an integrated heat spreader 400 according to an embodiment of the present invention. Heat spreader 400 includes a heat spreader element 401 and lips 410 extending therefrom. A step 420 extends from each lip 410. As shown in FIG. 4A, each step 420 includes holes 430. Holes 430 may comprise, for example, circular holes or slots. Sealant may flow through each hole 430 and over each step 420, forming a mechanical link. Sealant 470 is depicted in FIG. 4B.
  • [0024]
    [0024]FIGS. 5A and 5B are plan and side views, respectively, of an integrated heat spreader 500 according to an embodiment of the present invention. Heat spreader 500 includes heat spreader element 501. Lips 510 extend from heat spreader element 501. A step 520 extends from each lip 510. Each step 520 includes cutouts 540. In some embodiments, edges of cutouts 540 may be rounded. Sealant may flow through cutouts 540 and up over step 520 to form a mechanical link. Sealant 570 is shown in FIG. 5B.
  • [0025]
    [0025]FIGS. 6A and 6B are plan and side views, respectively, of an integrated heat spreader 600 according to an embodiment of the present invention. Heat spreader 600 includes an integrated heat spreader element 601. Lips 610 extend from heat spreader element 601. Each lip 610 includes a channel 650, which may be concave. During the process of attaching heat spreader 600 to a substrate or other component, sealant may flow into channel 650 to form a mechanical link. Deeper and sharper channels may achieve greater reductions in delamination, increasing the ability of the sealant to adhere to heat spreader 600 under higher stresses. One or more channels of the same or different dimension can be utilized.
  • [0026]
    The integrated heat spreader structures described above may be fabricated in various ways. For instance, extensions, holes, slots, cutouts, and channels may be stamped during a stamping operation associated with an integrated heat spreader. Alternatively, structures may be formed by grinding or laser etching after a stamping operation associated with an integrated heat spreader.
  • [0027]
    The foregoing description of the preferred embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments are possible, and the generic principles presented herein may be applied to other embodiments as well. As such, the present invention is not intended to be limited to the embodiments shown above but rather is to be accorded the widest scope consistent with the principles and novel features disclosed in any fashion herein. In particular, variations and combinations of embodiments presented above may be incorporated into integrated heat spreaders. For instance, cutouts may be irregularly spaced, and a step or lip may have a channel, multiple channels, or notch in a lateral face.

Claims (6)

  1. 1-17. (Canceled)
  2. 18. An integrated heat spreader constructed and arranged to be adhesively affixed, with a sealant, to at least a portion of a component, the sealant to act as an adhesive interface between the integrated heat spreader and the component, comprising:
    a body portion; and
    a lip portion vertically oriented relative to the body portion, the lip portion being constructed and arranged to define a channel in a face thereof.
  3. 19. The integrated heat spreader of claim 18, wherein the channel is substantially concave.
  4. 20-23. (Canceled)
  5. 24. A method of making an integrated heat spreader, comprising:
    forming a body portion; and
    forming a lip portion vertically oriented relative to the body portion, wherein the lip portion defines a channel in a face thereof.
  6. 25. The method of claim 24, wherein the channel is substantially concave.
US10883493 2002-01-11 2004-07-01 Integrated heat spreader with mechanical interlock designs Abandoned US20040244952A1 (en)

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US10883493 US20040244952A1 (en) 2002-01-11 2004-07-01 Integrated heat spreader with mechanical interlock designs

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080305584A1 (en) * 2007-06-08 2008-12-11 Chee Seng Foong Heat spreader for center gate molding
US20110012257A1 (en) * 2009-07-14 2011-01-20 Freescale Semiconductor, Inc Heat spreader for semiconductor package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040174682A1 (en) 2003-03-04 2004-09-09 Siliconware Precision Industries, Ltd. Semiconductor package with heat sink
US7327025B2 (en) * 2004-04-30 2008-02-05 St Assembly Test Services Ltd. Heat spreader for thermally enhanced semiconductor package
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
US20070295482A1 (en) * 2006-06-23 2007-12-27 Fitzgerald Thomas J Heat spreader for use in conjunction with a semiconducting device and method of manufacturing same
US9536851B2 (en) * 2014-09-05 2017-01-03 Infineon Technologies Ag Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement

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US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
US4953173A (en) * 1987-08-08 1990-08-28 Kabushiki Kaisha Toshiba Semiconductor device
US5276586A (en) * 1991-04-25 1994-01-04 Hitachi, Ltd. Bonding structure of thermal conductive members for a multi-chip module
US5504652A (en) * 1994-09-16 1996-04-02 Apple Computer, Inc. Unitary heat sink for integrated circuits
US5587882A (en) * 1995-08-30 1996-12-24 Hewlett-Packard Company Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
US5931222A (en) * 1995-11-30 1999-08-03 International Business Machines Coporation Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
US5990418A (en) * 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
US6188130B1 (en) * 1999-06-14 2001-02-13 Advanced Technology Interconnect Incorporated Exposed heat spreader with seal ring
US6188578B1 (en) * 1999-06-11 2001-02-13 Industrial Technology Research Institute Integrated circuit package with multiple heat dissipation paths
US6222264B1 (en) * 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
US6232558B1 (en) * 1997-04-30 2001-05-15 Ibiden Co., Ltd. Electronic component mounting base board having heat slug with slits and projections
US6271058B1 (en) * 1998-01-06 2001-08-07 Nec Corporation Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board
US6294408B1 (en) * 1999-01-06 2001-09-25 International Business Machines Corporation Method for controlling thermal interface gap distance
US6376907B1 (en) * 1997-12-01 2002-04-23 Kabushiki Kaisha Toshiba Ball grid array type package for semiconductor device
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader
US6538320B1 (en) * 2000-06-28 2003-03-25 Advanced Micro Devices, Inc. Heat spreader having holes for rivet-like adhesive connections
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953173A (en) * 1987-08-08 1990-08-28 Kabushiki Kaisha Toshiba Semiconductor device
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
US5276586A (en) * 1991-04-25 1994-01-04 Hitachi, Ltd. Bonding structure of thermal conductive members for a multi-chip module
US5504652A (en) * 1994-09-16 1996-04-02 Apple Computer, Inc. Unitary heat sink for integrated circuits
US5587882A (en) * 1995-08-30 1996-12-24 Hewlett-Packard Company Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
US5931222A (en) * 1995-11-30 1999-08-03 International Business Machines Coporation Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
US6232558B1 (en) * 1997-04-30 2001-05-15 Ibiden Co., Ltd. Electronic component mounting base board having heat slug with slits and projections
US5990418A (en) * 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
US6376907B1 (en) * 1997-12-01 2002-04-23 Kabushiki Kaisha Toshiba Ball grid array type package for semiconductor device
US6271058B1 (en) * 1998-01-06 2001-08-07 Nec Corporation Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board
US6294408B1 (en) * 1999-01-06 2001-09-25 International Business Machines Corporation Method for controlling thermal interface gap distance
US6188578B1 (en) * 1999-06-11 2001-02-13 Industrial Technology Research Institute Integrated circuit package with multiple heat dissipation paths
US6188130B1 (en) * 1999-06-14 2001-02-13 Advanced Technology Interconnect Incorporated Exposed heat spreader with seal ring
US6222264B1 (en) * 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
US6538320B1 (en) * 2000-06-28 2003-03-25 Advanced Micro Devices, Inc. Heat spreader having holes for rivet-like adhesive connections
US6577504B1 (en) * 2000-08-30 2003-06-10 Intel Corporation Integrated heat sink for different size components with EMI suppression features
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
US6472762B1 (en) * 2001-08-31 2002-10-29 Lsi Logic Corporation Enhanced laminate flipchip package using a high CTE heatspreader

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080305584A1 (en) * 2007-06-08 2008-12-11 Chee Seng Foong Heat spreader for center gate molding
US8643172B2 (en) * 2007-06-08 2014-02-04 Freescale Semiconductor, Inc. Heat spreader for center gate molding
US20110012257A1 (en) * 2009-07-14 2011-01-20 Freescale Semiconductor, Inc Heat spreader for semiconductor package

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