US20040061243A1 - Window-type semiconductor package and fabrication method thereof - Google Patents
Window-type semiconductor package and fabrication method thereof Download PDFInfo
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- US20040061243A1 US20040061243A1 US10/261,833 US26183302A US2004061243A1 US 20040061243 A1 US20040061243 A1 US 20040061243A1 US 26183302 A US26183302 A US 26183302A US 2004061243 A1 US2004061243 A1 US 2004061243A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000008393 encapsulating agent Substances 0.000 claims abstract description 43
- 239000012811 non-conductive material Substances 0.000 claims abstract description 41
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- 229920001296 polysiloxane Polymers 0.000 claims description 4
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- 238000000465 moulding Methods 0.000 claims description 2
- 238000005336 cracking Methods 0.000 abstract description 9
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- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
Definitions
- the present invention relates to semiconductor packages and fabrication methods thereof and more particularly, to a window-type semiconductor package for preventing chip-cracking and wire-sweeping, and a method for fabricating the same.
- Window-type semiconductor packages are advanced packaging technology, characterized by forming at least an opening penetrating through a substrate, allowing a chip to be mounted over the opening, and electrically connected to the substrate by bonding wires through the opening. This arrangement allows length of the bonding wires to be effectively shortened, thereby facilitating electrical transmission or performances between the chip and the substrate.
- FIGS. 3A and 3B A conventional window-type semiconductor structure 1 is illustrated in FIGS. 3A and 3B, wherein a substrate 10 has an upper surface 100 and a lower surface 101 , and is formed with an opening 102 penetrating through the same.
- a chip 11 is mounted on the upper surface 100 of the substrate 10 in a face-down manner as to allow bond pads 111 formed on an active surface 110 of the chip 11 to be exposed to the opening 102 .
- a plurality of bonding wires 12 are formed through the opening 102 and bonded to the exposed bond pads 111 of the chip 1 , so as to electrically connect the active surface 110 of the chip 11 to the lower surface 101 of the substrate 10 .
- a lower encapsulant 13 is formed on the lower surface 101 of the substrate 10 by a printing process, for encapsulates the bonding wires 12 and sealing the opening 102
- An objective of the present invention is to provide a window-type semiconductor package and a fabrication method thereof, for enhancing mechanical strength of a chip mounted therein and for preventing chip cracks from occurrence.
- Another objective of the invention is to provide a window-type semiconductor package and a fabrication method thereof
- a further objective of the invention is to provide a window-type semiconductor package and a fabrication method thereof
- the window-type semiconductor package comprises: a substrate having an upper surface and a lower surface opposed to the upper surface, and formed with at least an opening penetrating through the upper and lower surfaces; at least a chip having an active surface and a non-active surface opposed to the active surface, wherein the active surface of the chip is mounted over the opening on the upper surface of the substrate, allowing a conductive area of the active surface to be exposed to the opening; a plurality of bonding wires formed through the opening for electrically connecting the conductive area of the chip to the lower surface of the substrate; a non-conductive material applied over the conductive area of the chip within the opening of the substrate; an upper encapsulant formed on the upper surface of the substrate for encapsulating the chip; a lower encapsulant formed on the lower surface of the substrate for encapsulating the bonding wires and the non-conductive material; and a plurality of solder balls
- the non-conductive material applied over the conductive area of the chip is low in viscosity, and has coefficient of thermal expansion (CTE) between that of the chip and of a resin material for fabricating the lower encapsulant; preferably, the non-conductive material may be silicone.
- the non-conductive material is applied by printing or dispensing technique through the use of a stencil mounted on the lower surface of the substrate around the opening without interfering the bonding wires, wherein the stencil is formed with a through hole corresponding in position to the conductive area of the chip, so as to allow the non-conductive material to be applied through the through hole of the stencil into the opening of the substrate and over the conductive area of the chip
- the above semiconductor package provides significant benefits.
- the non-conductive material interposed between the chip and the lower encapsulant has low viscosity and intermediate CTE, and may serve as buffer to reduce thermal stress exerted from the lower encapsulant to the chip and to prevent the chip from cracking at end portions thereof, which chip-cracking is discussed in the prior art and caused by shrinkage of a lower encapsulant in direct contact with a chip during a curing or subsequently high-temperature process.
- the non-conductive material encapsulates part of the bonding wires within the opening of the substrate, this helps secure the bonding wires in position and prevent wire-sweeping from occurrence during fabrication of the lower encapsulant for encapsulating the bonding wires. Therefore, in free concern of chip-cracking and wire-sweeping, reliability and yield of the semiconductor package can be desirably improved.
- FIG. 1 is a cross-sectional view of a semiconductor package according to the invention.
- FIGS. 2 A- 2 G are schematic diagrams showing fabrication processes for a semiconductor package according to the invention, wherein FIG. 2D is a bottom view of FIG. 2C; and
- FIGS. 3A and 3B are respectively a cross-sectional view and a top view of a conventional semiconductor structure.
- FIG. 1 illustrates a window-type semiconductor package 2 according to the invention.
- This semiconductor package 2 comprises: a substrate 20 having an upper surface 200 and a lower surface 201 opposed to the upper surface 200 , and formed with at least an opening 202 penetrating through the upper and lower surfaces 200 , 201 ; at least a chip 21 having an active surface 210 and a non-active surface 211 opposed to the active surface 210 , wherein the active surface 210 of the chip 21 is mounted over the opening 202 on the upper surface 200 of the substrate 20 , allowing a conductive area 212 of the active surface 210 to be exposed to the opening 202 ; a plurality of bonding wires 22 formed through the opening 202 for electrically connecting the conductive area 212 of the chip 21 to the lower surface 201 of the substrate 20 ; a non-conductive material 23 applied over the conductive area 212 of the chip 21 within the opening 202 of the substrate 20 ; an upper encapsulant 24 formed on the upper surface 200 of the substrate 20 for en
- the above semiconductor package 2 can be fabricated by process steps illustrated in FIGS. 2 A- 2 G.
- the first step is to prepare a substrate 20 having an upper surface 200 and a lower surface 201 opposed to the upper surface 200 , and at least an opening 202 is formed through the upper and lower surfaces 200 , 201 of the substrate 20 .
- the substrate 20 is primarily made of a conventional resin material, such as epoxy resin, polyimide, BT (bismaleimide triazine) resin, FR-4 resin, etc.
- the next step is to mount at least a chip 21 on the upper surface 200 of the substrate 20 .
- the chip 21 has an active surface 210 where a plurality of electronic elements and circuits (not shown) are formed, and a non-active surface 211 opposed to the active surface 210
- the active surface 210 of the chip 21 is disposed over the opening 202 on the upper surface 200 of the substrate 20 , allowing a conductive area 212 of the active surface 210 , where at least two rows of bond pads 213 are formed, to be exposed to the opening 202 .
- a wire-bonding process is performed to form a plurality of bonding wires 22 such as gold wires through the opening 202 of the substrate 20 , wherein the bonding wires 22 are bonded to the bond pads 213 on the conductive area 212 of the chip 21 and to the lower surface 201 of the substrate 20 , so as to allow the active surface 210 of the chip 21 to be electrically connected to the substrate 20 by the bonding wires 22 .
- a non-conductive material 23 is applied over the conductive area 212 of the chip 21 within the opening 202 of the substrate 20 , allowing the non-conductive material 23 to completely cover the conductive area 212 of the chip 21 .
- the non-conductive material 23 is low in viscosity, and has coefficient of thermal expansion (CTE) between that of the chip 21 and of a resin material (not shown) subsequently used for encapsulating the bonding wires 22 ; preferably, the non-conductive material 23 may be silicone
- the substrate 20 mounted with the chip 21 thereon is turned upside down, allowing the lower surface 201 of the substrate 20 and the active surface 210 of the chip 21 to face upwardly. Then, a stencil 27 is attached to the lower surface 201 of the substrate 20 around the opening 202 without interfering the bonding wires 22 , wherein the stencil 27 is formed with a through hole 270 corresponding in position to the conductive area 212 of the chip 21 and sized not greater than distance between the two rows of the bond pads 213 .
- a conventional printing process is performed to form a lower encapsulant 25 on the lower surface 201 of the substrate 20 for encapsulating the bonding wires 22 and the non-conductive material 23 .
- a molding process is performed to form an upper encapsulant 24 on the upper surface 200 of the substrate 20 for encapsulating the chip 21 , wherein the upper encapsulant 24 may be made of a conventional resin compound such as epoxy resin
- a ball-implantation process is performed to implant a plurality of solder balls 26 on the lower surface 201 of the substrate 20 , wherein the solder balls 26 are positioned at area outside the lower encapsulant 25 , and dimensioned in height H larger than thickness T of the lower encapsulant 25 protruding from the lower surface 201 of the substrate 20 , i.e. H>T
- the solder balls 26 serve as input/output (I/O) ports for electrically connecting the chip 21 to an external device such as printed circuit board (PCB, not shown). This completes fabrication of the semiconductor package 2 .
- the above semiconductor package 2 provides significant benefits
- the non-conductive material 23 interposed between the chip 21 and the lower encapsulant 25 has low viscosity and intermediate CTE, and may serve as buffer to reduce thermal stress exerted from the lower encapsulant 25 to the chip 21 and to prevent the chip 21 from cracking at end portions thereof, which chip-cracking is discussed in the prior art and caused by shrinkage of a lower encapsulant in direct contact with a chip during a curing or subsequently high-temperature process
- the non-conductive material 23 encapsulates part of the bonding wires 22 within the opening 202 of the substrate 20 ; this helps secure the bonding wires 22 in position and prevent wire-sweeping from occurrence during fabrication of the lower encapsulant 25 for encapsulating the bonding wires 22 . Therefore, in free concern of chip-cracking and wire-sweeping, reliability and yield of the semiconductor package 2 can be desirably improved
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
- The present invention relates to semiconductor packages and fabrication methods thereof and more particularly, to a window-type semiconductor package for preventing chip-cracking and wire-sweeping, and a method for fabricating the same.
- Window-type semiconductor packages are advanced packaging technology, characterized by forming at least an opening penetrating through a substrate, allowing a chip to be mounted over the opening, and electrically connected to the substrate by bonding wires through the opening. This arrangement allows length of the bonding wires to be effectively shortened, thereby facilitating electrical transmission or performances between the chip and the substrate.
- A conventional window-
type semiconductor structure 1 is illustrated in FIGS. 3A and 3B, wherein asubstrate 10 has anupper surface 100 and alower surface 101, and is formed with anopening 102 penetrating through the same. Achip 11 is mounted on theupper surface 100 of thesubstrate 10 in a face-down manner as to allowbond pads 111 formed on anactive surface 110 of thechip 11 to be exposed to theopening 102. A plurality ofbonding wires 12 are formed through theopening 102 and bonded to the exposedbond pads 111 of thechip 1, so as to electrically connect theactive surface 110 of thechip 11 to thelower surface 101 of thesubstrate 10. Then, alower encapsulant 13 is formed on thelower surface 101 of thesubstrate 10 by a printing process, for encapsulates thebonding wires 12 and sealing theopening 102 - However, due to material mismatch in coefficient of thermal expansion (CTE) between the lower encapsulant13 (formed by a resin compound) and the
chip 11 directly in contact with thelower encapsulant 13, under a high temperature condition such as curing of thelower encapsulant 13 or subsequent thermal cycles, thechip 11 particularly at end portions thereof (as circled in FIG. 31B) would be subject to greater thermal stress from thelower encapsulant 13 and cracks due to shrinkage of thelower encapsulant 13, chip-cracking problems are severe for relatively long or large-scale chips, making reliability and yield of fabricated products undesirably degraded. Moreover, during fabrication of thelower encapsulant 13, thebonding wires 12 directly encounter mold flow impact from the resin compound for forming thelower encapsulant 13, and thereby easily lead to wire-sweeping or short-circuiting problems. - An objective of the present invention is to provide a window-type semiconductor package and a fabrication method thereof, for enhancing mechanical strength of a chip mounted therein and for preventing chip cracks from occurrence.
- Another objective of the invention is to provide a window-type semiconductor package and a fabrication method thereof,
- A further objective of the invention is to provide a window-type semiconductor package and a fabrication method thereof,
- In accordance with the above and other objectives, the present invention proposes a window-type semiconductor package and a fabrication method thereof. The window-type semiconductor package comprises: a substrate having an upper surface and a lower surface opposed to the upper surface, and formed with at least an opening penetrating through the upper and lower surfaces; at least a chip having an active surface and a non-active surface opposed to the active surface, wherein the active surface of the chip is mounted over the opening on the upper surface of the substrate, allowing a conductive area of the active surface to be exposed to the opening; a plurality of bonding wires formed through the opening for electrically connecting the conductive area of the chip to the lower surface of the substrate; a non-conductive material applied over the conductive area of the chip within the opening of the substrate; an upper encapsulant formed on the upper surface of the substrate for encapsulating the chip; a lower encapsulant formed on the lower surface of the substrate for encapsulating the bonding wires and the non-conductive material; and a plurality of solder balls implanted on the lower surface of the substrate at area outside the lower encapsulant.
- The non-conductive material applied over the conductive area of the chip is low in viscosity, and has coefficient of thermal expansion (CTE) between that of the chip and of a resin material for fabricating the lower encapsulant; preferably, the non-conductive material may be silicone. The non-conductive material is applied by printing or dispensing technique through the use of a stencil mounted on the lower surface of the substrate around the opening without interfering the bonding wires, wherein the stencil is formed with a through hole corresponding in position to the conductive area of the chip, so as to allow the non-conductive material to be applied through the through hole of the stencil into the opening of the substrate and over the conductive area of the chip
- The above semiconductor package provides significant benefits. The non-conductive material interposed between the chip and the lower encapsulant, has low viscosity and intermediate CTE, and may serve as buffer to reduce thermal stress exerted from the lower encapsulant to the chip and to prevent the chip from cracking at end portions thereof, which chip-cracking is discussed in the prior art and caused by shrinkage of a lower encapsulant in direct contact with a chip during a curing or subsequently high-temperature process. Moreover, the non-conductive material encapsulates part of the bonding wires within the opening of the substrate, this helps secure the bonding wires in position and prevent wire-sweeping from occurrence during fabrication of the lower encapsulant for encapsulating the bonding wires. Therefore, in free concern of chip-cracking and wire-sweeping, reliability and yield of the semiconductor package can be desirably improved.
- The present invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein.
- FIG. 1 is a cross-sectional view of a semiconductor package according to the invention;
- FIGS.2A-2G are schematic diagrams showing fabrication processes for a semiconductor package according to the invention, wherein FIG. 2D is a bottom view of FIG. 2C; and
- FIGS. 3A and 3B (PRIOR ART) are respectively a cross-sectional view and a top view of a conventional semiconductor structure.
- Preferred embodiments for a semiconductor package proposed in the present invention are described in more detail as follows with reference to FIGS. 1 and 2A-2G.
- FIG. 1 illustrates a window-
type semiconductor package 2 according to the invention. Thissemiconductor package 2 comprises: asubstrate 20 having anupper surface 200 and alower surface 201 opposed to theupper surface 200, and formed with at least anopening 202 penetrating through the upper andlower surfaces chip 21 having anactive surface 210 and anon-active surface 211 opposed to theactive surface 210, wherein theactive surface 210 of thechip 21 is mounted over theopening 202 on theupper surface 200 of thesubstrate 20, allowing aconductive area 212 of theactive surface 210 to be exposed to theopening 202; a plurality ofbonding wires 22 formed through theopening 202 for electrically connecting theconductive area 212 of thechip 21 to thelower surface 201 of thesubstrate 20; anon-conductive material 23 applied over theconductive area 212 of thechip 21 within theopening 202 of thesubstrate 20; anupper encapsulant 24 formed on theupper surface 200 of thesubstrate 20 for encapsulating thechip 21; alower encapsulant 25 formed on thelower surface 201 of thesubstrate 20 for encapsulating thebonding wires 22 and thenon-conductive material 23; and a plurality ofsolder balls 26 implanted on thelower surface 201 of thesubstrate 20 at area outside thelower encapsulant 25. - The
above semiconductor package 2 can be fabricated by process steps illustrated in FIGS. 2A-2G. - Referring to FIG. 2A, the first step is to prepare a
substrate 20 having anupper surface 200 and alower surface 201 opposed to theupper surface 200, and at least anopening 202 is formed through the upper andlower surfaces substrate 20. Thesubstrate 20 is primarily made of a conventional resin material, such as epoxy resin, polyimide, BT (bismaleimide triazine) resin, FR-4 resin, etc. - Referring to FIG. 2B, the next step is to mount at least a
chip 21 on theupper surface 200 of thesubstrate 20. Thechip 21 has anactive surface 210 where a plurality of electronic elements and circuits (not shown) are formed, and anon-active surface 211 opposed to theactive surface 210 Theactive surface 210 of thechip 21 is disposed over theopening 202 on theupper surface 200 of thesubstrate 20, allowing aconductive area 212 of theactive surface 210, where at least two rows ofbond pads 213 are formed, to be exposed to theopening 202. - Then, a wire-bonding process is performed to form a plurality of
bonding wires 22 such as gold wires through theopening 202 of thesubstrate 20, wherein thebonding wires 22 are bonded to thebond pads 213 on theconductive area 212 of thechip 21 and to thelower surface 201 of thesubstrate 20, so as to allow theactive surface 210 of thechip 21 to be electrically connected to thesubstrate 20 by thebonding wires 22. - Referring to FIGS. 2C and 2D (a bottom view of FIG. 2C), a
non-conductive material 23 is applied over theconductive area 212 of thechip 21 within theopening 202 of thesubstrate 20, allowing thenon-conductive material 23 to completely cover theconductive area 212 of thechip 21. Thenon-conductive material 23 is low in viscosity, and has coefficient of thermal expansion (CTE) between that of thechip 21 and of a resin material (not shown) subsequently used for encapsulating thebonding wires 22; preferably, thenon-conductive material 23 may be silicone - For applying the
non-conductive material 23, as shown in FIG. 2E, thesubstrate 20 mounted with thechip 21 thereon is turned upside down, allowing thelower surface 201 of thesubstrate 20 and theactive surface 210 of thechip 21 to face upwardly. Then, astencil 27 is attached to thelower surface 201 of thesubstrate 20 around theopening 202 without interfering thebonding wires 22, wherein thestencil 27 is formed with a through hole 270 corresponding in position to theconductive area 212 of thechip 21 and sized not greater than distance between the two rows of thebond pads 213. Conventional printing or dispensing technology is employed to apply thenon-conductive material 23 through the through hole 270 of thestencil 27 into theopening 202 of thesubstrate 20 and over theconductive area 212 of thechip 21, wherein thenon-conductive material 23 may be adapted to completely fill theopening 202 of thesubstrate 20. And, the limited-sized through hole 270 of thestencil 27 allows thenon-conductive material 23 to be comfortably situated within theopening 202 of thesubstrate 20 without flashing over unintended area such as thelower surface 201 of thesubstrate 20 After thenon-conductive material 23 is cured, thesubstrate 20 is turned again for facing thechip 21 upwardly, as shown in FIG. 2C. It should be understood that, other techniques or processes suitable for application of thenon-conductive material 23 are encompassed within the scope of this invention. - Referring to FIG. 2F, a conventional printing process is performed to form a
lower encapsulant 25 on thelower surface 201 of thesubstrate 20 for encapsulating thebonding wires 22 and thenon-conductive material 23. - Then, a molding process is performed to form an
upper encapsulant 24 on theupper surface 200 of thesubstrate 20 for encapsulating thechip 21, wherein theupper encapsulant 24 may be made of a conventional resin compound such as epoxy resin - Finally referring to FIG. 2G, a ball-implantation process is performed to implant a plurality of
solder balls 26 on thelower surface 201 of thesubstrate 20, wherein thesolder balls 26 are positioned at area outside thelower encapsulant 25, and dimensioned in height H larger than thickness T of thelower encapsulant 25 protruding from thelower surface 201 of thesubstrate 20, i.e. H>T Thesolder balls 26 serve as input/output (I/O) ports for electrically connecting thechip 21 to an external device such as printed circuit board (PCB, not shown). This completes fabrication of thesemiconductor package 2. - The
above semiconductor package 2 provides significant benefits Thenon-conductive material 23 interposed between thechip 21 and thelower encapsulant 25, has low viscosity and intermediate CTE, and may serve as buffer to reduce thermal stress exerted from thelower encapsulant 25 to thechip 21 and to prevent thechip 21 from cracking at end portions thereof, which chip-cracking is discussed in the prior art and caused by shrinkage of a lower encapsulant in direct contact with a chip during a curing or subsequently high-temperature process Moreover, thenon-conductive material 23 encapsulates part of thebonding wires 22 within theopening 202 of thesubstrate 20; this helps secure thebonding wires 22 in position and prevent wire-sweeping from occurrence during fabrication of thelower encapsulant 25 for encapsulating thebonding wires 22. Therefore, in free concern of chip-cracking and wire-sweeping, reliability and yield of thesemiconductor package 2 can be desirably improved - The invention has been described using exemplary preferred embodiments. However, it is to be understood that the scope of the invention is not limited to the disclosed embodiments On the contrary, it is intended to cover various modifications and similar arrangements. The scope of the claims, therefore, should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements
Claims (20)
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US20070158815A1 (en) * | 2004-04-02 | 2007-07-12 | Chen Fung L | Multi-chip ball grid array package and method of manufacture |
US10304788B1 (en) * | 2018-04-11 | 2019-05-28 | Semiconductor Components Industries, Llc | Semiconductor power module to protect against short circuit event |
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US7332411B2 (en) * | 2004-08-12 | 2008-02-19 | Hewlett-Packard Development Company, Lp | Systems and methods for wafer bonding by localized induction heating |
US10121766B2 (en) | 2016-06-30 | 2018-11-06 | Micron Technology, Inc. | Package-on-package semiconductor device assemblies including one or more windows and related methods and packages |
KR102467030B1 (en) | 2018-01-17 | 2022-11-14 | 삼성전자주식회사 | Semiconductor package and semiconductor apparatus comprising the same |
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US6501170B1 (en) * | 2000-06-09 | 2002-12-31 | Micron Technology, Inc. | Substrates and assemblies including pre-applied adhesion promoter |
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US6218731B1 (en) * | 1999-05-21 | 2001-04-17 | Siliconware Precision Industries Co., Ltd. | Tiny ball grid array package |
US6265768B1 (en) * | 2000-01-31 | 2001-07-24 | Advanced Semiconductor Engineering, Inc. | Chip scale package |
US6501170B1 (en) * | 2000-06-09 | 2002-12-31 | Micron Technology, Inc. | Substrates and assemblies including pre-applied adhesion promoter |
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US20070158815A1 (en) * | 2004-04-02 | 2007-07-12 | Chen Fung L | Multi-chip ball grid array package and method of manufacture |
US7851899B2 (en) * | 2004-04-02 | 2010-12-14 | Utac - United Test And Assembly Test Center Ltd. | Multi-chip ball grid array package and method of manufacture |
US20070132089A1 (en) * | 2005-12-13 | 2007-06-14 | Tongbi Jiang | Microelectronic devices and methods for manufacturing microelectronic devices |
US7633157B2 (en) * | 2005-12-13 | 2009-12-15 | Micron Technology, Inc. | Microelectronic devices having a curved surface and methods for manufacturing the same |
US20100062571A1 (en) * | 2005-12-13 | 2010-03-11 | Micron Technology, Inc. | Microelectronic devices and methods for manufacturing microelectronic devices |
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