US20030234431A1 - Led package - Google Patents

Led package Download PDF

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Publication number
US20030234431A1
US20030234431A1 US10271532 US27153202A US2003234431A1 US 20030234431 A1 US20030234431 A1 US 20030234431A1 US 10271532 US10271532 US 10271532 US 27153202 A US27153202 A US 27153202A US 2003234431 A1 US2003234431 A1 US 2003234431A1
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US
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Patent type
Prior art keywords
led
area
film
golden
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US10271532
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US6667497B1 (en )
Inventor
Teng-Huei Huang
Chuan-Ming Chang
Tse-Min Mao
Min-Huang Huang
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Advanced Optoelectronic Technology Inc
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Advanced Optoelectronic Technology Inc
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area. The third LED die is attached on the third golden film area; wherein the third LED die is composed of an anode connected to the first golden film area by a metallic wire, and a cathode connected to the third golden film area.

Description

    BACKGROUND OF THE INVENTION
  • [0001]
    1. Field of Invention
  • [0002]
    The present invention relates to a packaging design for light emitting diode (LED), more particularly, to a LED package contains three LED dies. 2. Description of Related Art
  • [0003]
    Light emitting diode (LED) is a junction diode formed by an epitaxial P-type layer and an epitaxial N-type layer on a heavily doped semiconductor compound base. The diode further includes an ohmic metallic contact on the P-type and N-type layers. LED is mainly packaged within an epoxy or a metallic housing. Visible LED are generally used in display screens, automobile braking lights, scanners, indicator lights for equipment and so on.
  • [0004]
    Surface-mount device LED (SMD LED) was developed in the early 1980s. For assembling SMD LED, the chip is glued or eutectic bonded to a metallic system carrier, what is referred to as a leadframe, namely on a central part or island thereof given standard components or, respectively, standard ICs, and wires are bonded to the chip. The chip is also completely enveloped with a plastic molding compound in an injection molding process such that only the ends of the system carrier serving as outer terminals project therefrom.
  • [0005]
    SMD LEDs have several of specification, such as 1206M(3.0 mm*1.5 mm*0.7 mm), 1206P (with a size of 3.0 mm*1.5 mm*0.7 mm), 0805M (with a size of 2.0 mm*1.2 mm*0.6 mm), and 0603M (with a size of 1.6 mm*0.8 mm*0.5 mm). Because the 0603M model is especially small in size, only single light emitting diode could be contained in the LED package in accordance with the prior art.
  • [0006]
    As soon as the rapid development of mobile phones and PDAs (Personal Digital Assistants), there is a request to develop colorful LED panels to display colorful images. Therefore, it is necessary to develop a LED package with three (3) light emitting diodes (generally red, blue, and green).
  • [0007]
    However, particularly for the smallest 0603M model, the conventional LED package can contain only one die, so it is impossible to generate colorful images. Therefore, in order to display colorful images, it is very important for the LED package industry to create a package assembly containing at least a red, a blue, and a green light emitting diodes.
  • SUMMARY OF THE INVENTION
  • [0008]
    It is the main object of the present invention to provide a LED package with three different light emitting diodes (red, blue, and green).
  • [0009]
    The second object of the present invention is to disclose a LED package.
  • [0010]
    The third object of the present invention is to provide a method for manufacturing a LED package.
  • [0011]
    The first embodiment of the present invention discloses a LED package, which is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area. The third LED die is attached on the third golden film area; wherein the third LED die is composed of an anode connected to the first golden film area by a metallic wire, and a cathode connected to the third golden film area.
  • [0012]
    The second embodiment of the present invention discloses a LED package, which is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein a cathode of the first LED die is connected to the first golden film area, and an anode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of a cathode connected to the first golden film area, and an anode connected to the fourth golden film area. The third LED die is attached on the third golden film area; wherein the third LED die is composed of a cathode connected to the first golden film area by a metallic wire, and an anode connected to the third golden film area.
  • [0013]
    The process flow of the method of manufacturing a LED package according to the present invention is also disclosed. A flat panel base is first provided. Thereafter, the first golden film area, the second golden film area, the third golden film area, the fourth golden film area, the first connection area, and the second connection area are formed on the flat panel base. After that, the first LED die, the second LED die, and the third LED die are attached on the flat panel base by means of silver glue.
  • [0014]
    Next, the anode or cathode of the third LED die is connected to the common anode or common cathode of the LED package by wire bonding.
  • [0015]
    Thereafter, a PCB is formed by using a glue plate and a mold, and then the PCB is cut by using a cutter. Finally, a step of classification is performed by inputting a stable current into the LED package.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0016]
    The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
  • [0017]
    [0017]FIG. 1 schematically illustrates the top-view diagram of the LED package according to the first embodiment of the present invention;
  • [0018]
    [0018]FIG. 2 schematically illustrates the top-view diagram of the LED package according to the second embodiment of the present invention;
  • [0019]
    [0019]FIG. 3 discloses the process flow of the method of manufacturing a LED package according to the present invention.
  • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • [0020]
    The present invention relates to a packaging design for light emitting diode (LED), more particularly, to a LED package contains three LED dies.
  • [0021]
    First please refer to FIG. 1, which schematically illustrates the top-view diagram of the LED package according to the first embodiment of the present invention. The LED package is composed of a flat panel base 10, the first LED die 40 a, the second LED die 40 b, and the third LED die 40 c.
  • [0022]
    The flat panel base 10 is composed of a first golden film area 20 a, a second golden film area 20 b, a third golden film area 20 c, a fourth golden film area 20 d, a first connection area 30 a, and a second connection area 30 b. The first connection area 30 a and the second connection area 30 b are connected to the first golden film area 20 a.
  • [0023]
    The first golden film area 20 a serves as the common anode of the LED package. The second golden film area 20 b serves as the cathode for blue color of the LED package. The third golden film area 20 c works as the cathode for green color of the LED package. The fourth film area 20 d works as the cathode for the red color of the LED package.
  • [0024]
    The first LED die 40 a is a blue-colored light emitting diode manufactured from InGaN. The first LED die 40 a is attached on the flat panel base 10 by flip-chip mounting. The anode of the first LED die 40 a is connected to the first connection area 30 a and then to the first golden film area20 a. The cathode of the first LED die 40 a is connected to the second golden film area 20 b.
  • [0025]
    The second LED die 40 b is a green-colored light emitting diode manufactured from InGaN. The second LED die 40 b is attached on the flat panel base 10 by flip-chip mounting. The anode of the second LED die 40 b is connected to the second connection area 30 b, and then to the first golden film area 20 a. The cathode of the second LED die 40 b is connected to the fourth golden film area 20 d.
  • [0026]
    The third LED die 40 c is a red-colored light emitting diode attached on the third golden film area 20 c. The anode of the third LED die 40 c is connected to the first golden film area 20 a by a metallic wire 50. The cathode of the third LED die 40 c is connected to the third golden film area 20 c.
  • [0027]
    According to a preferred embodiment of the present invention, the LED package can specially be a 0603 model package.
  • [0028]
    Please then to FIG. 2, which schematically illustrates the top-view diagram of the LED package according to the second embodiment of the present invention. The LED package is composed of a flat panel base 10, the first LED die 40 a, the second LED die 40 b, and the third LED die 40 c.
  • [0029]
    The flat panel base 10 is composed of a first golden film area 20 a, a second golden film area 20 b, a third golden film area 20 c, a fourth golden film area 20 d, a first connection area 30 a, and a second connection area 30 b. The first connection area 30 a and the second connection area 30 b are connected to the first golden film area 20 a.
  • [0030]
    The first golden film area 20 a serves as the common cathode of the LED package. The second golden film area 20 b serves as the anode for blue color of the LED package. The third golden film area 20 c works as the anode for green color of the LED package. The fourth film area 20 d works as the anode for the red color of the LED package.
  • [0031]
    The first LED die 40 a is a blue-colored light emitting diode manufactured from InGaN. The first LED die 40 a is attached on the flat panel base 10 by flip-chip mounting. The cathode of the first LED die 40 a is connected to the first connection area 30 a and then to the first golden film area20 a. The anode of the first LED die 40 a is connected to the second golden film area 20 b.
  • [0032]
    The second LED die 40 b is a green-colored light emitting diode manufactured from InGaN. The second LED die 40 b is attached on the flat panel base 10 by flip-chip mounting. The cathode of the second LED die 40 b is connected to the second connection area 30 b, and then to the first golden film area 20 a. The anode of the second LED die 40 b is connected to the fourth golden film area 20 d.
  • [0033]
    The third LED die 40 c is a red-colored light emitting diode attached on the third golden film area 20 c. The cathode of the third LED die 40 c is connected to the first golden film area 20 a by a metallic wire 50. The anode of the third LED die 40 c is connected to the third golden film area 20 c.
  • [0034]
    According to a preferred embodiment of the present invention, the LED package can specially be a 0603 model package.
  • [0035]
    Referring then to FIG. 3, the process flow of the method of manufacturing a LED package according to the present invention is disclosed. A flat panel base 10 is first provided (step 101). Thereafter, the first golden film area 20 a, the second golden film area 20 b, the third golden film area20 c, the fourth golden film area 20 d, the first connection area 30 a, and the second connection area 30 b are formed on the flat panel base 10 (step 102). After that, the first LED die 40 a, the second LED die 40 b, and the third LED die 40 c are attached on the flat panel base by means of silver glue (step 103).
  • [0036]
    Next, the anode or cathode of the third LED die 40 c is connected to the common anode or common cathode of the LED package by means of wire bonding (step 104).
  • [0037]
    Thereafter, a PCB is formed by using a glue plate and a mold (step 105), and then the PCB is cut by using a cutter (step 106). Finally, a step of classification is performed by inputting a stable current into the LED package (step 107).
  • [0038]
    While the present invention has been described with the reference to a preferred embodiment thereof, those skilled in the art will appreciate various changes in form and detail may be made without departing from the intended scope of the present invention as defined in the appended claims.

Claims (24)

    What is claimed is:
  1. 1. A LED package comprising:
    a flat panel base, which is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein said first connection area and said second connection area are connected to said first golden film area;
    a first LED die attached on said flat panel base by flip-chip mounting, wherein an anode of said first LED die is connected to said first connection area and then to said first golden film area, and a cathode of said first LED die is connected to said second golden film area;
    a second LED die attached on said flat panel base by flip-chip mounting, wherein said second LED die is composed of an anode connected to said second connection area and then to said first golden film area, and a cathode connected to said fourth golden film area;
    a third LED die attached on said third golden film area; wherein said third LED die is composed of an anode connected to said first golden film area by a metallic wire, and a cathode connected to said third golden film area.
  2. 2. The LED package of claim 1, wherein said LED package is a 0603 model package.
  3. 3. The LED package of claim 1, wherein said first LED die, said second LED die, and said third LED die are attached on said flat panel base by means of silver glue.
  4. 4. The LED package of claim 1, wherein said first golden film area serves as a common anode of said LED package.
  5. 5. The LED package of claim 1, wherein said first LED die is a blue-colored light emitting diode manufactured from InGaN.
  6. 6. The LED package of claim 1, wherein said second golden film area serves as a cathode for blue color of the LED package.
  7. 7. The LED package of claim 1, wherein said second LED die is a green-colored light emitting diode manufactured from InGaN.
  8. 8. The LED package of claim 1, wherein said third golden film area serves as a cathode for green color of the LED package.
  9. 9. The LED package of claim 1, wherein said second LED die is a red-colored light emitting diode.
  10. 10. The LED package of claim 1, wherein said fourth golden film area serves as a cathode for red color of the LED package.
  11. 11. A LED package comprising:
    a flat panel base, which is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein said first connection area and said second connection area are connected to said first golden film area;
    a first LED die attached on said flat panel base by flip-chip mounting, wherein a cathode of said first LED die is connected to said first connection area and then to said first golden film area, and an anode of said first LED die is connected to said second golden film area;
    a second LED die attached on said flat panel base by flip-chip mounting, wherein said second LED die is composed of a cathode connected to said second connection area and then to said first golden film area, and an anode connected to said fourth golden film area;
    a third LED die attached on said third golden film area; wherein said third LED die is composed of a cathode connected to said first golden film area by a metallic wire, and an anode connected to said third golden film area.
  12. 12. The LED package of claim 11, wherein said LED package is a 0603 model package.
  13. 13. The LED package of claim 11, wherein said first LED die, said second LED die, and said third LED die are attached on said flat panel base by means of silver glue.
  14. 14. The LED package of claim 11, wherein said first golden film area serves as common cathode of said LED package.
  15. 15. The LED package of claim 11, wherein said first LED die is a blue-colored light emitting diode manufactured from InGaN.
  16. 16. The LED package of claim 11, wherein said second golden film area serves as an anode for blue color of the LED package.
  17. 17. The LED package of claim 11, wherein said second LED die is a green-colored light emitting diode manufactured from InGaN.
  18. 18. The LED package of claim 11, wherein said third golden film area serves as an anode for green color of the LED package.
  19. 19. The LED package of claim 11, wherein said second LED die is a red-colored light emitting diode.
  20. 20. The LED package of claim 11, wherein said fourth golden film area serves as an anode for red color of the LED package.
  21. 21. A method of forming a LED package, comprising:
    providing a flat panel base;
    forming a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area on said flat panel base;
    attaching a first LED die, a second LED die, and a third LED die on said flat panel base by using silver glue; and
    wire-bonding an electrode of a third LED die to a common electrode of said LED package.
  22. 22. A method of claim 21, further comprising a step of forming a PCB by using a glue plate and a mold.
  23. 23. A method of claim 21, further comprising a step of cutting a PCB by using a cutter.
  24. 24. A method of claim 21, further comprising a step of performing a step of classification by inputting a stable current into the LED package.
US10271532 2002-06-21 2002-10-17 LED package Active - Reinstated US6667497B1 (en)

Priority Applications (3)

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TW91113659 2002-06-21
TW91113659A 2002-06-21

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006012842A2 (en) * 2004-07-26 2006-02-09 Osram Opto Semiconductors Gmbh Optoelectronic component that emits electromagnetic radiation and illumination module
US20130168705A1 (en) * 2012-01-02 2013-07-04 Lextar Electronics Corp. Solid-state light-emitting device and solid-state light-emitting package thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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KR100533635B1 (en) 2003-11-20 2005-12-06 삼성전기주식회사 Led package
US7904723B2 (en) * 2005-01-12 2011-03-08 Interdigital Technology Corporation Method and apparatus for enhancing security of wireless communications
US20110121349A1 (en) * 2009-11-25 2011-05-26 Everlight Electronics Co., Ltd. Light-emitting diode and manufacturing method thereof
CN102082218B (en) 2009-11-26 2013-10-23 亿光电子工业股份有限公司 Light-emitting diode, light-emitting diode device and packaging method of light-emitting diode
JP6064396B2 (en) * 2012-07-09 2017-01-25 日亜化学工業株式会社 The light-emitting device
CN104409451A (en) * 2014-12-17 2015-03-11 木林森股份有限公司 Bracket set of small-sized LED lamp beads and brackets

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06310763A (en) * 1993-04-21 1994-11-04 Sanyo Electric Co Ltd Led lamp
JPH10242523A (en) 1997-02-28 1998-09-11 Kouha:Kk Light emitting diode display device and picture display device utilizing the same
JP3893735B2 (en) * 1998-04-24 2007-03-14 松下電器産業株式会社 The light-emitting device
JP4042213B2 (en) 1998-06-05 2008-02-06 松下電器産業株式会社 Full-color semiconductor light-emitting device
JP2000332297A (en) * 1999-05-17 2000-11-30 Koha Co Ltd Full color led module
US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006012842A2 (en) * 2004-07-26 2006-02-09 Osram Opto Semiconductors Gmbh Optoelectronic component that emits electromagnetic radiation and illumination module
WO2006012842A3 (en) * 2004-07-26 2006-05-11 Osram Opto Semiconductors Gmbh Optoelectronic component that emits electromagnetic radiation and illumination module
US20090001490A1 (en) * 2004-07-26 2009-01-01 Georg Bogner Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module
US8071990B2 (en) 2004-07-26 2011-12-06 Osram Opto Semiconductors Gmbh Optoelectronic component that emits electromagnetic radiation and illumination module
US20130168705A1 (en) * 2012-01-02 2013-07-04 Lextar Electronics Corp. Solid-state light-emitting device and solid-state light-emitting package thereof

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KR20030097574A (en) 2003-12-31 application
US6667497B1 (en) 2003-12-23 grant

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