US20030153253A1 - Polishing cloth - Google Patents

Polishing cloth Download PDF

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Publication number
US20030153253A1
US20030153253A1 US10/323,599 US32359902A US2003153253A1 US 20030153253 A1 US20030153253 A1 US 20030153253A1 US 32359902 A US32359902 A US 32359902A US 2003153253 A1 US2003153253 A1 US 2003153253A1
Authority
US
United States
Prior art keywords
polishing
adhered
window opening
polishing cloth
belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/323,599
Inventor
Takashi Hanamoto
Mineo Hattori
Yasuji Yokomichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta DuPont Inc
Original Assignee
Rodel Nitta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodel Nitta Inc filed Critical Rodel Nitta Inc
Assigned to RODEL NITTA COMPANY reassignment RODEL NITTA COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HANAMOTO, TAKASHI, HATTORI, MINEO, YOKOMICHI, YASUJI
Publication of US20030153253A1 publication Critical patent/US20030153253A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion

Definitions

  • This invention relates to a polishing cloth (polishing pad) that is used, for example, when semiconductors are manufactured.
  • polishing cloth that is used, for example, when semiconductors are manufactured.
  • Window openings 5 for laser end-point detection are drilled at a fixed distance so that an end-point detection device 4 detects an end point of a surface state of the object to be polished 3 .
  • a polishing cloth according to the present invention is adhered to a polishing belt including a window opening for end-point detection.
  • a transparent film that transmits end-point detection light is adhered to a portion of the polishing cloth corresponding to the window opening of the polishing belt, and a liner is adhered to the transparent film.
  • Another liner is adhered via an adhesion layer to an adhesion surface of the polishing cloth facing the polishing belt at area other than the portion corresponding to the window opening.
  • the polishing cloth includes the transparent film that transmits the end-point detection light so that an end point of a surface state of an object to be polished can be detected through the transparent film.
  • the liner is adhered to the transparent film and the other liner is adhered via the adhesion layer to the adhesion surface facing the polishing belt at area other than the portion of the polishing cloth corresponding to the window opening. Therefore, when the polishing cloth is adhered to the polishing belt, both the liner of the transparency film corresponding to the window opening and the other liner of the area other than the portion of the polishing cloth corresponding to the window opening are peeled off so that the polishing cloth adhered to the polishing belt is unlikely to come off from the belt at the time of polishing.
  • FIG. 1 is a plane view showing a state of polishing cloths adhered to a polishing belt according to an embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view, partly in sections, of a main part of the polishing cloth according to FIG. 1.
  • FIG. 3 is a perspective view showing a situation how the polishing cloths are used.
  • FIG. 1 through FIG. 3 plural pieces of polishing cloth 1 are adhered to a surface of a polishing belt 2 that is driven to rotate.
  • An object to be polished 3 that is made to spin on the polishing belt 2 is polished with slurry (not shown in the drawings).
  • Window openings 5 for laser end-point detection are drilled at a fixed distance so that an end-point detection device 4 detects an end point of a surface state of the object to be polished 3 .
  • the polishing cloth 1 based on a base pad 6 is used after being adhered to the polishing belt 2 including the window opening 5 for end-point detection.
  • a transparent film 7 that transmits end-point detection laser light is disposed at a portion of the polishing cloth 1 corresponding to the window opening 5 of the polishing belt 2 .
  • a round PET film is used as the transparent film 7 .
  • the PET film is made of a raw material, named “Super Clean” produced by TORAY Industries, Inc., that makes laser light detection possible.
  • a liner 9 (an exfoliation sheet) is adhered to the outside of the transparent film 7 (the round PET film).
  • a liner 9 ′ (an exfoliation sheet) is adhered via an adhesion layer of double-sided tape 10 to an adhesion surface of the polishing cloth 1 facing the polishing belt 2 at area other than the portion corresponding to the window opening 5 .
  • the polishing cloth 1 for example, is formed by the way described next.
  • the double-sided tape 10 is adhered to an adhesion surface of the base pad 6 with the polishing cloth 1 facing the polishing belt 2 .
  • a portion of the liner, corresponding to the window opening 5 of the polishing belt 2 , out of the liner 9 ′ of the adhered double-sided tape 10 is circularly cut out.
  • the above mentioned round PET film 7 is put over the cut portion of the polishing cloth 1 and is adhered thereto.
  • the transparent film 7 that transmits the end-point detection light is adhered to the portion of the polishing cloth 1 corresponding to the window opening 5 of the polishing belt 2 .
  • the end point of the surface state of the object to be polished 3 can be detected through the transparent film 7 .
  • the liner 9 is adhered to the transparent film 7 for laser light and the liner 9 ′ is adhered via the adhesion layer of the double-sided tape 10 to the adhesion surface the polishing cloth 1 facing the polishing belt 2 at area other than the portion corresponding to the window opening 5 . Therefore, when the polishing cloth 1 is adhered to the polishing belt 2 , both the liner 9 of the portion corresponding to the window opening 5 and the liner 9 ′ of the area other than the portion corresponding to the window opening 5 are peeled off so that the polishing cloth 1 adhered to the polishing belt 2 is unlikely to come off from the belt at the time of turning a corner of the belt when polishing.
  • the present invention has the above mentioned structure and the polishing cloth is adhered to the polishing belt so that it may not come off from the belt. Therefore, the present invention can provide the polishing cloth that prevents slurry to leak inside the belt.

Abstract

A polishing cloth is adhered to a polishing belt including a window opening for end-point detection. A transparent film, including a liner, that transmits end-point detection light is adhered to a portion of the polishing cloth corresponding to the window opening of the polishing belt. Another liner is adhered via an adhesion layer to the adhesion surface of the polishing cloth at area other than the portion corresponding to the window opening. The polishing cloth includes the transparent film that transmits the end-point detection light at the portion corresponding to the window opening of the polishing belt so that an end point of the surface of the object to be polished can be detected through the transparent film. This prevents slurry to leak inside the belt compared to the conventional technology.

Description

    FIELD OF THE INVENTION
  • This invention relates to a polishing cloth (polishing pad) that is used, for example, when semiconductors are manufactured. [0001]
  • DESCRIPTION OF THE PRIOR ART
  • There has been a polishing cloth that is used, for example, when semiconductors are manufactured. [0002]
  • As shown in FIG. 3, plural pieces of [0003] polishing cloth 1 are adhered to a surface of a polishing belt 2 that is driven to rotate. An object to be polished 3 that is made to spin on the belt is polished with slurry (not shown in the drawings).
  • [0004] Window openings 5 for laser end-point detection are drilled at a fixed distance so that an end-point detection device 4 detects an end point of a surface state of the object to be polished 3.
  • However, there has been a problem that inferior detection occurs when the slurry leaks inside the [0005] polishing belt 2 from the window opening 5. There has been another problem that the slurry leaking inside makes the end-point detection device 4 and the like dirty.
  • SUMMERY OF THE INVENTION
  • It is hence an object of the present invention to provide a polishing cloth that prevents slurry to leak inside a belt compared to conventional technology. [0006]
  • To solve the foregoing drawbacks, this invention takes some technical steps, which are described next. [0007]
  • A polishing cloth according to the present invention is adhered to a polishing belt including a window opening for end-point detection. A transparent film that transmits end-point detection light is adhered to a portion of the polishing cloth corresponding to the window opening of the polishing belt, and a liner is adhered to the transparent film. Another liner is adhered via an adhesion layer to an adhesion surface of the polishing cloth facing the polishing belt at area other than the portion corresponding to the window opening. [0008]
  • The polishing cloth includes the transparent film that transmits the end-point detection light so that an end point of a surface state of an object to be polished can be detected through the transparent film. [0009]
  • The liner is adhered to the transparent film and the other liner is adhered via the adhesion layer to the adhesion surface facing the polishing belt at area other than the portion of the polishing cloth corresponding to the window opening. Therefore, when the polishing cloth is adhered to the polishing belt, both the liner of the transparency film corresponding to the window opening and the other liner of the area other than the portion of the polishing cloth corresponding to the window opening are peeled off so that the polishing cloth adhered to the polishing belt is unlikely to come off from the belt at the time of polishing. [0010]
  • The above and other objects, features and advantages of the present invention will become apparent from the following description read in conjunction with the accompanying drawings.[0011]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a plane view showing a state of polishing cloths adhered to a polishing belt according to an embodiment of the present invention. [0012]
  • FIG. 2 is an enlarged perspective view, partly in sections, of a main part of the polishing cloth according to FIG. 1. [0013]
  • FIG. 3 is a perspective view showing a situation how the polishing cloths are used.[0014]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • As showing FIG. 1 through FIG. 3, plural pieces of [0015] polishing cloth 1 are adhered to a surface of a polishing belt 2 that is driven to rotate. An object to be polished 3 that is made to spin on the polishing belt 2 is polished with slurry (not shown in the drawings). Window openings 5 for laser end-point detection are drilled at a fixed distance so that an end-point detection device 4 detects an end point of a surface state of the object to be polished 3.
  • As shown FIG. 2, the [0016] polishing cloth 1 based on a base pad 6 is used after being adhered to the polishing belt 2 including the window opening 5 for end-point detection.
  • A [0017] transparent film 7 that transmits end-point detection laser light is disposed at a portion of the polishing cloth 1 corresponding to the window opening 5 of the polishing belt 2. In this embodiment, a round PET film is used as the transparent film 7. The PET film is made of a raw material, named “Super Clean” produced by TORAY Industries, Inc., that makes laser light detection possible. A liner 9 (an exfoliation sheet) is adhered to the outside of the transparent film 7 (the round PET film). A liner 9′ (an exfoliation sheet) is adhered via an adhesion layer of double-sided tape 10 to an adhesion surface of the polishing cloth 1 facing the polishing belt 2 at area other than the portion corresponding to the window opening 5.
  • The [0018] polishing cloth 1, for example, is formed by the way described next.
  • First of all, the double-[0019] sided tape 10 is adhered to an adhesion surface of the base pad 6 with the polishing cloth 1 facing the polishing belt 2. A portion of the liner, corresponding to the window opening 5 of the polishing belt 2, out of the liner 9′ of the adhered double-sided tape 10 is circularly cut out. The above mentioned round PET film 7 is put over the cut portion of the polishing cloth 1 and is adhered thereto.
  • Next, the state how the [0020] polishing cloth 1 is used according to this embodiment is described.
  • The [0021] transparent film 7 that transmits the end-point detection light is adhered to the portion of the polishing cloth 1 corresponding to the window opening 5 of the polishing belt 2. The end point of the surface state of the object to be polished 3 can be detected through the transparent film 7.
  • Moreover, the liner [0022] 9 is adhered to the transparent film 7 for laser light and the liner 9′ is adhered via the adhesion layer of the double-sided tape 10 to the adhesion surface the polishing cloth 1 facing the polishing belt 2 at area other than the portion corresponding to the window opening 5. Therefore, when the polishing cloth 1 is adhered to the polishing belt 2, both the liner 9 of the portion corresponding to the window opening 5 and the liner 9′ of the area other than the portion corresponding to the window opening 5 are peeled off so that the polishing cloth 1 adhered to the polishing belt 2 is unlikely to come off from the belt at the time of turning a corner of the belt when polishing.
  • The present invention has the above mentioned structure and the polishing cloth is adhered to the polishing belt so that it may not come off from the belt. Therefore, the present invention can provide the polishing cloth that prevents slurry to leak inside the belt. [0023]

Claims (3)

What is claimed is:
1. A polishing cloth to be adhered to a polishing belt including a window opening for end-point detection comprising:
a transparent film, including a liner, that transmits end-point detection light adhered to a portion of the polishing cloth corresponding to the window opening of the polishing belt;
a liner, adhered to an adhesion surface of the polishing cloth facing the polishing belt at area other than the portion corresponding to the window opening; and
an adhesion layer.
2. A polishing cloth to be adhered to a polishing belt including a window opening for end-point detection comprising:
a transparent film, including an exfoliation sheet on an outside thereof, that transmits end-point detection light disposed at a portion of the polishing cloth corresponding to the window opening of the polishing belt;
an exfoliation sheet, adhered to an adhesion surface of the polishing cloth facing the polishing belt at area other than the portion corresponding to the window opening; and
an adhesion layer.
3. A polishing cloth to be adhered to a polishing belt including a window opening for end-point detection comprising:
a base pad; and
a transparent film that transmits end-point detection light, double-sided tape adhered to an adhesion surface of the base pad facing the polishing belt, a portion of an exfoliation sheet, corresponding to the window opening of the polishing belt, out of the exfoliation sheet of the adhered double-sided tape being cut out and the transparent film that transmits end-point detection light being put over a cut portion of the polishing cloth and adhered thereto.
US10/323,599 2001-12-14 2002-12-13 Polishing cloth Abandoned US20030153253A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001381533A JP2003188124A (en) 2001-12-14 2001-12-14 Polishing cloth
JPJP2001-381533 2001-12-14

Publications (1)

Publication Number Publication Date
US20030153253A1 true US20030153253A1 (en) 2003-08-14

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US10/323,599 Abandoned US20030153253A1 (en) 2001-12-14 2002-12-13 Polishing cloth

Country Status (4)

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US (1) US20030153253A1 (en)
JP (1) JP2003188124A (en)
KR (1) KR20030051300A (en)
TW (1) TW200300720A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080305729A1 (en) * 2007-06-08 2008-12-11 Applied Materials, Inc. Thin polishing pad with window and molding process
US20140065932A1 (en) * 2011-04-21 2014-03-06 Toyo Tire & Rubber Co., Ltd. Laminated polishing pad
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
USD903732S1 (en) * 2018-09-27 2020-12-01 Mirka Ltd. Abrasive strip
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11524384B2 (en) 2017-08-07 2022-12-13 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
US11685014B2 (en) 2018-09-04 2023-06-27 Applied Materials, Inc. Formulations for advanced polishing pads
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11958162B2 (en) 2020-01-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007091439A1 (en) * 2006-02-06 2007-08-16 Toray Industries, Inc. Abrasive pad and abrasion device
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080305729A1 (en) * 2007-06-08 2008-12-11 Applied Materials, Inc. Thin polishing pad with window and molding process
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US9138858B2 (en) * 2007-06-08 2015-09-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US20140065932A1 (en) * 2011-04-21 2014-03-06 Toyo Tire & Rubber Co., Ltd. Laminated polishing pad
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10493691B2 (en) 2014-10-17 2019-12-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11826875B2 (en) * 2016-02-26 2023-11-28 Applied Materials, Inc. Window in thin polishing pad
US11161218B2 (en) 2016-02-26 2021-11-02 Applied Materials, Inc. Window in thin polishing pad
US20220023990A1 (en) * 2016-02-26 2022-01-27 Applied Materials, Inc. Window in thin polishing pad
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11524384B2 (en) 2017-08-07 2022-12-13 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
US11685014B2 (en) 2018-09-04 2023-06-27 Applied Materials, Inc. Formulations for advanced polishing pads
USD903732S1 (en) * 2018-09-27 2020-12-01 Mirka Ltd. Abrasive strip
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11958162B2 (en) 2020-01-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Also Published As

Publication number Publication date
TW200300720A (en) 2003-06-16
KR20030051300A (en) 2003-06-25
JP2003188124A (en) 2003-07-04

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AS Assignment

Owner name: RODEL NITTA COMPANY, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HANAMOTO, TAKASHI;HATTORI, MINEO;YOKOMICHI, YASUJI;REEL/FRAME:013944/0989;SIGNING DATES FROM 20030204 TO 20030205

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION