US20030079860A1 - Cooling element - Google Patents

Cooling element Download PDF

Info

Publication number
US20030079860A1
US20030079860A1 US10/284,030 US28403002A US2003079860A1 US 20030079860 A1 US20030079860 A1 US 20030079860A1 US 28403002 A US28403002 A US 28403002A US 2003079860 A1 US2003079860 A1 US 2003079860A1
Authority
US
United States
Prior art keywords
cooling
cooling fins
base plate
cooling element
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/284,030
Inventor
Ingolf Hoffmann
Volker Schinn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOFFMANN, INGOLF, SCHINN, VOLKER
Publication of US20030079860A1 publication Critical patent/US20030079860A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling element with a base plate and several spaced-apart cooling fins which are arranged on a flat side of the base plate.
  • the end faces of the cooling fins together with the formed cooling channels form an inflow and outflow side for cooling air.
  • the cooling element includes a base plate 2 having a flat side 4 and cooling fins 6 , end faces 8 and 10 formed by the cooling fins as well as cooling channels 16 having an inflow side 12 and an outflow side 14 . Cooling air produced by a fan 18 is blown through the cooling channels 16 . The fan 18 is directly attached to the inflow side 12 of the cooling element.
  • Each of the cooling channels 16 is formed by two adjacent cooling fins 16 and a section of the flat side 4 of the base plate 2 .
  • the outflow side 14 is arranged in opposition to the inflow side 12 and is formed by the end faces 10 of the cooling fins 6 and the cooling channels 16 .
  • Modern high-efficiency semiconductor devices have a heat flux density of approximately 10 5 W/cm 2 . These devices can be cooled efficiently only by using a cooling element with a high fin ratio R V , which is defined as the quotient of the cooling fin width or thickness R B to the fin spacing R A .
  • the efficiency of the cooling element is limited by the achievable temperature increase ⁇ T of the cooling air. This temperature increase ⁇ T depends on the geometry of the cooling element and, more particularly, is proportional to the rib ratio R V .
  • the increase of the air temperature in the cooling element is a result of a momentum transfer between the cooling air and the cooled surface at the boundary between the cooling fin 6 and cooling channel 16 , whereby the momentum transfer depends on the degree of turbulence in the flow and increases with increasing degree of turbulence.
  • the degree of turbulence depends on the surface characteristic of the rib 6 , the physical properties of the cooling air as well as the inherent momentum of the cooling air (airspeed).
  • the removable heat current ⁇ dot over (Q) ⁇ can only be increased by increasing the degree of turbulence. This can be achieved, for example, by increasing the airspeed. To achieve this, either the mass flow of the air has to be increased or the cross-section of the flow channel has to be reduced. Both measures necessitate an increase in the required fan power.
  • the form factor ⁇ describes herein the flow resistance of the flow channel. This form factor ⁇ is essentially composed of three components, which are:
  • a cooling element cooled with cooling air having a flow direction includes a base plate and a plurality of spaced-apart cooling fins spaced apart transversely to the flow direction and arranged on a flat side of the base plate so as to form cooling channels.
  • the cooling fins have end faces which cooperate to form an inflow side and an outflow side for the cooling air.
  • the end faces of the cooling fins on the inflow side and the outflow side are configured so as to provide a low flow resistance.
  • the fan power can be reduced due to the reduced pressure drop.
  • This advantageous effect increases with decreasing spacing between the cooling fins of a cooling element.
  • the fin density is considered to be high when the fin spacing is approximately equal to the fin width.
  • the spaced-apart cooling fins are offset in the flow direction of the cooling air in such a way that the inflow and outflow sides have a wave-like shape. This measure further decreases the pressure drop and simultaneously reduces the fan power requirement.
  • each end face of each cooling fin on the inflow side is formed convex and each end face of each cooling fin on the outflow side is wedge-shaped.
  • each end face of each cooling fin on the inflow and outflow side is inclined and/or the spaced-apart cooling fins are mutually offset in the flow direction of the cooling air in such a way that the inflow and outflow side each form a zigzag pattern.
  • the two zigzag surfaces in this embodiment are in phase.
  • each cooling fin can include transverse ribs oriented in the flow direction of the cooling air.
  • a second base plate can be arranged so that its flat side contacts the narrow sides of the free ends of the cooling fins.
  • At least one the base plate can include spaced-apart grooves oriented in the flow direction of the cooling air, into which grooves a cooling rib can be pressed.
  • the base plate(s) and the cooling fins can be made of extruded aluminum or another metal with a high thermal conductivity.
  • FIG. 1 is a perspective view of a conventional cooling element
  • FIG. 2 shows a flow pattern on the cooling fins of the cooling element according to FIG. 1
  • FIG. 3 shows a flow pattern on the cooling fins of a first embodiment of a cooling element according to the present invention
  • FIG. 4 shows a flow pattern on the cooling fins of a second embodiment of a cooling element according to the present invention.
  • FIG. 5 is a perspective view of a third embodiment of a cooling element according to the present invention.
  • FIG. 2 there is shown a flow pattern of cooling air on cooling fins of a commercially available cooling element according to FIG. 1.
  • the cooling air produced by the fan 18 is depicted in FIG. 2 by arrows A.
  • FIG. 1 Also seen in FIG. 1 are on the inflow side 12 turbulent zones B which generate the undesirable counterpressure. This effect increases with increasing width R B of the fins. This effect is particularly pronounced in extruded cooling fins.
  • Turbulent zones C also form on the outflow side 14 of the flow channels 16 due to the movement of the cooling air at the edges of the fin ends.
  • the turbulent zones C can even experience a flow reversal.
  • the flow distribution is a result of the geometry at the inflow and outflow sides of the flow channels 16 .
  • FIG. 3 shows the flow pattern on the cooling fins of a cooling element according to a first embodiment of the invention.
  • the cooling air produced by the fan 18 is also depicted by arrows A.
  • the end faces 8 of the cooling fins 6 are convex and the end faces 10 are formed as wedges.
  • the convex form of the end faces 8 of the cooling fins 6 of a cooling element prevent the formation of turbulent zones B at the inflow end of the flow channels 16 , since the cooling air A no longer impinges on a rebounding surface.
  • the cooling ribs 6 are offset in the flow direction of the cooling air A at the inflow side 12 in a wavy pattern.
  • the convex end faces 8 divert the cooling air A in the region between the end faces 8 into adjacent flow channels 16 .
  • the end faces 8 of the different cooling fins 6 of the cooling element at the inflow side 12 are located on a concave curvature with respect to the flow in cooling air A.
  • the curvature of the concave end faces 8 required for efficiently preventing turbulence depends on the airspeed of the supplied cooling air A.
  • the air mass flow in each flow channel 16 of the fin arrangement of the cooling element can be increased by suitably shaping the end faces 8 on the inflow side 12 . As a result, the airspeed in the flow channels 16 of the cooling element also increases.
  • the end faces 10 of the cooling fins on the outflow side 14 of the fin arrangement are wedge-shaped. It should be noted that the wedge-like shape of the end faces 10 should optimally be free of any edges. Advantageously, if the inclined surfaces of the wedge-shaped end faces 10 should be concave. In this way, the cooling air A can exit from the flow channels 16 without experiencing turbulence in spite of the increased airspeed.
  • the two end faces 8 and 10 of each cooling fin 6 of the cooling element are formed in the shape of a drop oriented opposite the flow direction. More particularly, the wedge-like shape of the end faces 10 on the outflow side 14 of each fin 6 of the fin arrangement significantly reduced the counterpressure.
  • FIG. 4 shows a flow pattern on the cooling fins 6 of another cooling element according to the invention.
  • the cooling air produced by the fan 18 is also indicated by the arrows A.
  • the cooling fins 6 have inclined end faces 8 and 10 .
  • the inclined end faces 8 and 10 of each cooling fin 6 are beveled so as to extend in parallel in space.
  • the cooling fins 6 in this embodiment are mutually offset in the flow direction of the cooling air A on the flat side 10 of the base plate 2 so that (the envelopes of) both the inflow side 12 and the outflow side 14 form a zigzag pattern. Since each cooling fin has an identical angle of inclination, the zigzag-shaped inflow and outflow sides 12 and 14 have the same phase.
  • the base plate 2 is made substantially longer (overhang) than that of the cooling element depicted in FIG. 1 so that the flow channels 16 in the inflow and outflow region of the fin arrangement are not entirely open.
  • the angle of inclination (bevel angle) of the inclined end faces 8 and 10 determines the overhang of the base plate 2 .
  • the length of the base plate 2 of the cooling element increases with increasing bevel angle of the end faces 8 and 10 of each cooling fin 6 .
  • each cooling fin 6 thereby forms a mini-region in the region of the inflow and outflow side 12 and 14 , whereby the arrangement of the fins according to the invention forms a macro-region, which separately contribute to a reduction in the counterpressure.
  • FIG. 5 shows in a perspective view an advantageous cooling element according to the invention.
  • This advantageous cooling element has cooling fins 6 which according to FIG. 4 are arranged on the base plate 2 and have inclined end faces 8 and 10 .
  • the cooling fins 6 are pressed into grooves 26 provided in the base plate 2 .
  • this cooling element has a second base plate 28 , which is placed with a flat surface on the narrow side of the free ends of the cooling fins 6 .
  • the flat side of the second base plate 28 also has grooves into which the cooling fins 6 can be pressed.
  • the flow channels 16 are closed off by the second base plate 28 , except for the inflow and outflow side 12 and 14 .
  • high-power semiconductors can be releaseably secured on the flat surfaces 20 and 30 of the two base plates 2 and 28 opposite the grooved surfaces.
  • the cooling fins are provided with transverse ribs extending in the flow direction of the cooling air A.
  • the components b) and c) of the form factor ⁇ can be significantly reduced or even eliminated. This reduces substantially the counterpressure exerted on the cooling air flow, obviating the need for high-power fans 18 , while removing the same heat per unit time ⁇ dot over (Q) ⁇ . This not only reduces the system cost, but also maintenance expenses.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling element includes a base plate and several spaced-apart cooling fins which are arranged on a flat side of the base plate. The end faces of the cooling fins together with the formed cooling channels form an inflow side and an outflow side for cooling air. The end face of the cooling fins on the inflow side and the outflow side are configured to produce a low flow resistance. This substantially reduces the counterpressure exerted on the cooling air flow and thereby obviates the need for high-power fans, without a reduction in the removed heat per unit time {dot over (Q)}.

Description

    CROSS-REFERENCES TO RELATED APPLICATIONS
  • This application claims the priority of German Patent Application, Serial No. 101 53 512.0, filed Oct. 30, 2001, pursuant to 35 U.S.C. 119(a)-(d), the disclosure of which is incorporated herein by reference. [0001]
  • BACKGROUND OF THE INVENTION
  • The present invention relates to a cooling element with a base plate and several spaced-apart cooling fins which are arranged on a flat side of the base plate. The end faces of the cooling fins together with the formed cooling channels form an inflow and outflow side for cooling air. [0002]
  • A cooling element of this type is commercially available and illustrated in greater detail in FIG. 1. The cooling element includes a [0003] base plate 2 having a flat side 4 and cooling fins 6, end faces 8 and 10 formed by the cooling fins as well as cooling channels 16 having an inflow side 12 and an outflow side 14. Cooling air produced by a fan 18 is blown through the cooling channels 16. The fan 18 is directly attached to the inflow side 12 of the cooling element. Each of the cooling channels 16 is formed by two adjacent cooling fins 16 and a section of the flat side 4 of the base plate 2. The outflow side 14 is arranged in opposition to the inflow side 12 and is formed by the end faces 10 of the cooling fins 6 and the cooling channels 16. FIG. 1 does not show the end faces 8 of cooling fins 6 which together with a cooling channels 16 form the inflow side 12, since these are covered by the fan 18. Several semiconductor components 22 are mounted with a heat-conducting mounting plate 24 on the flat side 20 of the base plate 2 that faces away from the cooling fins 6.
  • Modern high-efficiency semiconductor devices have a heat flux density of approximately 10[0004] 5 W/cm2. These devices can be cooled efficiently only by using a cooling element with a high fin ratio RV, which is defined as the quotient of the cooling fin width or thickness RB to the fin spacing RA. The efficiency of the cooling element is limited by the achievable temperature increase ΔT of the cooling air. This temperature increase ΔT depends on the geometry of the cooling element and, more particularly, is proportional to the rib ratio RV. A cooling element with a rib ratio RV=1 has an upper limit value for the increase in the cooling air temperature of approximately 24K as determined by the flow conditions. This increase in cooling air temperature is capable to remove an average heat current {dot over (Q)}.
  • The increase of the air temperature in the cooling element is a result of a momentum transfer between the cooling air and the cooled surface at the boundary between the [0005] cooling fin 6 and cooling channel 16, whereby the momentum transfer depends on the degree of turbulence in the flow and increases with increasing degree of turbulence. The degree of turbulence, on the other hand, depends on the surface characteristic of the rib 6, the physical properties of the cooling air as well as the inherent momentum of the cooling air (airspeed).
  • For a given temperature increase and rib characteristic, such as geometry and roughness, the removable heat current {dot over (Q)} can only be increased by increasing the degree of turbulence. This can be achieved, for example, by increasing the airspeed. To achieve this, either the mass flow of the air has to be increased or the cross-section of the flow channel has to be reduced. Both measures necessitate an increase in the required fan power. [0006]
  • With a constant air mass flow {dot over (m)}, the flow velocity increases with decreasing cross-sectional A of the flow channel, which is equal to the product of fin spacing R[0007] A and height of the cooling fins RH. Increasing the flow velocity causes an increased counterpressure in the flow channel. The pressure drop of a flow channel can be expressed by the following equation using Bernoulli's law: Δ P = ζ * ρ 2 * ( s t ) 2 = ζ * ρ 2 * ( m . ρ * R H * R A ) 2
    Figure US20030079860A1-20030501-M00001
  • As seen from this equation, decreasing the fin spacing R[0008] A cause an increase ΔP in the pressure. The form factor ζ describes herein the flow resistance of the flow channel. This form factor ζ is essentially composed of three components, which are:
  • a) the surface properties along the flow channel (roughness), [0009]
  • b) the conditions at the inflow end of the flow channel (geometry), and [0010]
  • c) the conditions at the outflow end of the flow channel (geometry). [0011]
  • While for the momentum transfer the form factor ζ along the flow channel should be as large as possible, the components b) and c) listed above and also relating to the form factor ζ are undesirable and detrimental, since they tend to increase the system cost. [0012]
  • The effect of the form factor ζ in particular of the components b) and c) above, is typically neglected in conventional embodiments of cooling elements. If the heat flow {dot over (Q)} to be removed by the cooling element is to be increased, the pressure drop increases quadratically with the flow velocity and linearly with the form factor ζ. This is a reason why commercially available cooling elements require heavy-duty fans to produce the mechanical power to move the cooling air. However, such fans are large and expensive. [0013]
  • It would therefore be desirable and advantageous to provide an improved cooling element which obviates prior art shortcomings and which is so configure that a fan requiring less power can be used. [0014]
  • SUMMARY OF THE INVENTION
  • According to one aspect of the present invention, a cooling element cooled with cooling air having a flow direction includes a base plate and a plurality of spaced-apart cooling fins spaced apart transversely to the flow direction and arranged on a flat side of the base plate so as to form cooling channels. The cooling fins have end faces which cooperate to form an inflow side and an outflow side for the cooling air. The end faces of the cooling fins on the inflow side and the outflow side are configured so as to provide a low flow resistance. As a result, the fan power can be reduced due to the reduced pressure drop. This advantageous effect increases with decreasing spacing between the cooling fins of a cooling element. The fin density is considered to be high when the fin spacing is approximately equal to the fin width. [0015]
  • According to an advantageous embodiment of the cooling element of the invention, the spaced-apart cooling fins are offset in the flow direction of the cooling air in such a way that the inflow and outflow sides have a wave-like shape. This measure further decreases the pressure drop and simultaneously reduces the fan power requirement. [0016]
  • According to another advantageous embodiment of the cooling element of the invention, each end face of each cooling fin on the inflow side is formed convex and each end face of each cooling fin on the outflow side is wedge-shaped. These different configurations of the end faces of each cooling fin gives the cooling fin the shape of an elongated drop that is oriented opposite the flow direction. This produces an ideal form of the cooling fins by reducing the counterpressure, and thereby also the mechanical power requirements of the fan. However, this disadvantageously makes the fabrication process for the cooling element quite complex. [0017]
  • According to another embodiment of the cooling element of the invention, each end face of each cooling fin on the inflow and outflow side is inclined and/or the spaced-apart cooling fins are mutually offset in the flow direction of the cooling air in such a way that the inflow and outflow side each form a zigzag pattern. The two zigzag surfaces in this embodiment are in phase. This arrangement produces a particularly economical solution for a cooling element according to the invention. By inclining each fin end with the aforedescribed arrangement, a mini-region (each fin) and a macro-region (arrangement of the fins) results, each of which contributes to the reduction in the counterpressure. [0018]
  • According to yet another advantageous embodiment, each cooling fin can include transverse ribs oriented in the flow direction of the cooling air. In addition, a second base plate can be arranged so that its flat side contacts the narrow sides of the free ends of the cooling fins. At least one the base plate can include spaced-apart grooves oriented in the flow direction of the cooling air, into which grooves a cooling rib can be pressed. For improved heat conduction, the base plate(s) and the cooling fins can be made of extruded aluminum or another metal with a high thermal conductivity.[0019]
  • BRIEF DESCRIPTION OF THE DRAWING
  • Other features and advantages of the present invention will be more readily apparent upon reading the following description of currently preferred exemplified embodiments of the invention with reference to the accompanying drawing, in which: [0020]
  • FIG. 1 is a perspective view of a conventional cooling element; [0021]
  • FIG. 2 shows a flow pattern on the cooling fins of the cooling element according to FIG. 1 [0022]
  • FIG. 3 shows a flow pattern on the cooling fins of a first embodiment of a cooling element according to the present invention; [0023]
  • FIG. 4 shows a flow pattern on the cooling fins of a second embodiment of a cooling element according to the present invention; and [0024]
  • FIG. 5 is a perspective view of a third embodiment of a cooling element according to the present invention.[0025]
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • Throughout all the Figures, same or corresponding elements are generally indicated by same reference numerals. [0026]
  • Turning now to the drawing, and in particular to FIG. 2, there is shown a flow pattern of cooling air on cooling fins of a commercially available cooling element according to FIG. 1. The cooling air produced by the [0027] fan 18 is depicted in FIG. 2 by arrows A. Also seen in FIG. 1 are on the inflow side 12 turbulent zones B which generate the undesirable counterpressure. This effect increases with increasing width RB of the fins. This effect is particularly pronounced in extruded cooling fins. Turbulent zones C also form on the outflow side 14 of the flow channels 16 due to the movement of the cooling air at the edges of the fin ends. The turbulent zones C can even experience a flow reversal. The flow distribution is a result of the geometry at the inflow and outflow sides of the flow channels 16. These two components substantially affect the form factor ζ of the cooling element which is responsible for the generation and the magnitude of the pressure drop on the cooling element.
  • FIG. 3 shows the flow pattern on the cooling fins of a cooling element according to a first embodiment of the invention. The sake of clarity, only a few [0028] individual cooling fins 6 are shown. The cooling air produced by the fan 18 is also depicted by arrows A. In this first embodiment of the cooling element, the end faces 8 of the cooling fins 6 are convex and the end faces 10 are formed as wedges. The convex form of the end faces 8 of the cooling fins 6 of a cooling element prevent the formation of turbulent zones B at the inflow end of the flow channels 16, since the cooling air A no longer impinges on a rebounding surface. The cooling ribs 6 are offset in the flow direction of the cooling air A at the inflow side 12 in a wavy pattern. As a result, the convex end faces 8 divert the cooling air A in the region between the end faces 8 into adjacent flow channels 16. The end faces 8 of the different cooling fins 6 of the cooling element at the inflow side 12 are located on a concave curvature with respect to the flow in cooling air A. The curvature of the concave end faces 8 required for efficiently preventing turbulence depends on the airspeed of the supplied cooling air A. The air mass flow in each flow channel 16 of the fin arrangement of the cooling element can be increased by suitably shaping the end faces 8 on the inflow side 12. As a result, the airspeed in the flow channels 16 of the cooling element also increases.
  • The end faces [0029] 10 of the cooling fins on the outflow side 14 of the fin arrangement are wedge-shaped. It should be noted that the wedge-like shape of the end faces 10 should optimally be free of any edges. Advantageously, if the inclined surfaces of the wedge-shaped end faces 10 should be concave. In this way, the cooling air A can exit from the flow channels 16 without experiencing turbulence in spite of the increased airspeed.
  • The two end faces [0030] 8 and 10 of each cooling fin 6 of the cooling element are formed in the shape of a drop oriented opposite the flow direction. More particularly, the wedge-like shape of the end faces 10 on the outflow side 14 of each fin 6 of the fin arrangement significantly reduced the counterpressure.
  • FIG. 4 shows a flow pattern on the [0031] cooling fins 6 of another cooling element according to the invention. The cooling air produced by the fan 18 is also indicated by the arrows A. In this particularly advantageous embodiment, the cooling fins 6 have inclined end faces 8 and 10. The inclined end faces 8 and 10 of each cooling fin 6 are beveled so as to extend in parallel in space. Moreover, the cooling fins 6 in this embodiment are mutually offset in the flow direction of the cooling air A on the flat side 10 of the base plate 2 so that (the envelopes of) both the inflow side 12 and the outflow side 14 form a zigzag pattern. Since each cooling fin has an identical angle of inclination, the zigzag-shaped inflow and outflow sides 12 and 14 have the same phase. The base plate 2 is made substantially longer (overhang) than that of the cooling element depicted in FIG. 1 so that the flow channels 16 in the inflow and outflow region of the fin arrangement are not entirely open. The angle of inclination (bevel angle) of the inclined end faces 8 and 10 determines the overhang of the base plate 2. The length of the base plate 2 of the cooling element increases with increasing bevel angle of the end faces 8 and 10 of each cooling fin 6.
  • The aforedescribed advantageous shape of the end faces [0032] 8 and 10 of the cooling fins 6 of a fin arrangement of a cooling element produces an embodiment with a substantially reduced counterpressure. Each cooling fin 6 thereby forms a mini-region in the region of the inflow and outflow side 12 and 14, whereby the arrangement of the fins according to the invention forms a macro-region, which separately contribute to a reduction in the counterpressure.
  • FIG. 5 shows in a perspective view an advantageous cooling element according to the invention. This advantageous cooling element has cooling [0033] fins 6 which according to FIG. 4 are arranged on the base plate 2 and have inclined end faces 8 and 10. The cooling fins 6 are pressed into grooves 26 provided in the base plate 2. In addition, this cooling element has a second base plate 28, which is placed with a flat surface on the narrow side of the free ends of the cooling fins 6. The flat side of the second base plate 28 also has grooves into which the cooling fins 6 can be pressed. The flow channels 16 are closed off by the second base plate 28, except for the inflow and outflow side 12 and 14. In addition, high-power semiconductors can be releaseably secured on the flat surfaces 20 and 30 of the two base plates 2 and 28 opposite the grooved surfaces. To increase the surface area of the cooling fin 6, the cooling fins are provided with transverse ribs extending in the flow direction of the cooling air A.
  • By forming the [0034] cooling fins 6 in the inflow and outflow region of a fin arrangement of the cooling body according to the invention, the components b) and c) of the form factor ζ can be significantly reduced or even eliminated. This reduces substantially the counterpressure exerted on the cooling air flow, obviating the need for high-power fans 18, while removing the same heat per unit time {dot over (Q)}. This not only reduces the system cost, but also maintenance expenses.
  • While the invention has been illustrated and described in connection with currently preferred embodiments shown and described in detail, it is not intended to be limited to the details shown since various modifications and structural changes may be made without departing in any way from the spirit of the present invention. The embodiments were chosen and described in order to best explain the principles of the invention and practical application to thereby enable a person skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. [0035]
  • What is claimed as new and desired to be protected by Letters Patent is set forth in the appended claims and their equivalents: [0036]

Claims (11)

What is claimed is:
1. A cooling element, comprising:
a base plate; and
a plurality of cooling fins spaced apart transversely to a flow direction and arranged on a flat side of the base plate so as to form cooling channels, each of the cooling fins having an end face on an inflow side and an end face on an outflow side for flow of cooling air in the flow direction from the inflow side to the outflow side, wherein the end faces of the cooling fins are constructed to enhance flow dynamics.
2. The cooling element of claim 1, wherein the spaced-apart cooling fins are disposed in offset relationship in the flow direction so that the end faces of the cooling fins on the inflow and outflow sides form a wave-shaped pattern transversely to the flow direction.
3. The cooling element of claim 1, wherein the end face on the inflow side of each of the cooling fins has a convex shape and the end face on the outflow side of each of the cooling fins has a wedge shape.
4. The cooling element of claim 1, wherein the end faces on the inflow and outflow sides of the cooling fins are inclined with respect to the flow direction.
5. The cooling element of claim 1, wherein the spaced-apart cooling fins are placed in offset relationship in the flow direction so that both the inflow side and the outflow side form a zigzag pattern.
6. The cooling element of claim 1, wherein the cooling fins includes transverse ribs extending in the flow direction.
7. The cooling element of claim 1, wherein the cooling fins have free ends with narrow sides located opposite the base plate, and further comprising a second base plate having a flat major surface disposed on the narrow sides of the free ends of the cooling fins.
8. The cooling element of claim 1, wherein the base plate has a plurality of spaced-apart grooves substantially aligned in the flow direction of the cooling air, with the cooling fins being pressed into corresponding ones of the spaced-apart grooves.
9. The cooling element of claim 7, wherein the second base plate has a plurality of spaced-apart grooves substantially aligned in the flow direction of the cooling air, with the free ends of the cooling fins being pressed into corresponding ones of the spaced-apart second grooves.
10. The cooling element of claim 1, wherein the base plate and the cooling fins are made of extruded aluminum.
11. The cooling element of claim 7, wherein the second base plate is made of extruded aluminum.
US10/284,030 2001-10-30 2002-10-30 Cooling element Abandoned US20030079860A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10153512A DE10153512A1 (en) 2001-10-30 2001-10-30 Cooling element for modern high-efficiency semiconductor devices has cooling fins arranged on flat side of baseplate, and which have end faces on inflow and outflow sides constructed to enhance flow dynamics
DE10153512.0 2001-10-30

Publications (1)

Publication Number Publication Date
US20030079860A1 true US20030079860A1 (en) 2003-05-01

Family

ID=7704199

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/284,030 Abandoned US20030079860A1 (en) 2001-10-30 2002-10-30 Cooling element

Country Status (2)

Country Link
US (1) US20030079860A1 (en)
DE (1) DE10153512A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1628342A1 (en) * 2004-08-16 2006-02-22 Dietmar Dr. Kern Heatsink and heatsink assembly
US20070137849A1 (en) * 2005-12-15 2007-06-21 Toshiba International Corporation Heatsink with offset fins
US20080112134A1 (en) * 2006-11-09 2008-05-15 Brandon Rubenstein Dust accumulation resistant heat sink
US20100183725A1 (en) * 2005-07-15 2010-07-22 Map Pharmaceuticals, Inc. Multiple active pharmaceutical ingredients combined in discrete inhalation particles and formulations thereof
US20100291221A1 (en) * 2009-05-15 2010-11-18 Robert Owen Cook Method of administering dose-sparing amounts of formoterol fumarate-budesonide combination particles by inhalation
US20110267550A1 (en) * 2010-04-29 2011-11-03 Coleman Jesse J Off-state light baffle for digital projection
US8854807B2 (en) 2011-08-09 2014-10-07 Siemens Aktiengesellschaft Converter arrangement with an air cooling system
CN112923775A (en) * 2019-12-05 2021-06-08 Abb瑞士股份有限公司 Heat exchanger and cooled electrical assembly comprising same
US11039550B1 (en) * 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
US11139722B2 (en) 2018-03-02 2021-10-05 Black & Decker Inc. Motor having an external heat sink for a power tool

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1478020A1 (en) * 2003-05-14 2004-11-17 Thomson Licensing S.A. Streamline heat sink and method for manufacturing the heat sink
EP1478019A1 (en) * 2003-05-14 2004-11-17 Thomson Licensing S.A. Streamline heat sink and method for manufacturing the heat sink
DE102004004440B4 (en) * 2004-01-28 2006-06-29 Kermi Gmbh Cooling device for an electronic component, in particular for a microprocessor
US7760506B1 (en) * 2007-06-06 2010-07-20 Hewlett-Packard Development Company, L.P. Electronic components, systems and apparatus with air flow devices
DE102013112256B3 (en) * 2013-11-07 2015-02-12 Fujitsu Technology Solutions Intellectual Property Gmbh Heat sink for cooling a heat generating component of a computer system and computer system
AT522955B1 (en) * 2020-01-27 2021-04-15 Gerald Poellmann Mag Heat dissipation device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW376171U (en) * 1998-11-24 1999-12-01 Foxconn Prec Components Co Ltd Radiating device

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1628342A1 (en) * 2004-08-16 2006-02-22 Dietmar Dr. Kern Heatsink and heatsink assembly
US20100183725A1 (en) * 2005-07-15 2010-07-22 Map Pharmaceuticals, Inc. Multiple active pharmaceutical ingredients combined in discrete inhalation particles and formulations thereof
US20070137849A1 (en) * 2005-12-15 2007-06-21 Toshiba International Corporation Heatsink with offset fins
US20080112134A1 (en) * 2006-11-09 2008-05-15 Brandon Rubenstein Dust accumulation resistant heat sink
US20100291221A1 (en) * 2009-05-15 2010-11-18 Robert Owen Cook Method of administering dose-sparing amounts of formoterol fumarate-budesonide combination particles by inhalation
US8342690B2 (en) * 2010-04-29 2013-01-01 Eastman Kodak Company Off-state light baffle for digital projection
US20110267550A1 (en) * 2010-04-29 2011-11-03 Coleman Jesse J Off-state light baffle for digital projection
US8854807B2 (en) 2011-08-09 2014-10-07 Siemens Aktiengesellschaft Converter arrangement with an air cooling system
US11139722B2 (en) 2018-03-02 2021-10-05 Black & Decker Inc. Motor having an external heat sink for a power tool
CN112923775A (en) * 2019-12-05 2021-06-08 Abb瑞士股份有限公司 Heat exchanger and cooled electrical assembly comprising same
EP3832245A1 (en) * 2019-12-05 2021-06-09 ABB Schweiz AG Heat exchanger and cooled electrical assembly
US11406040B2 (en) 2019-12-05 2022-08-02 Abb Schweiz Ag Heat exchanger and cooled electrical assembly comprising ihe same
US11039550B1 (en) * 2020-04-08 2021-06-15 Google Llc Heat sink with turbulent structures
US11574850B2 (en) 2020-04-08 2023-02-07 Google Llc Heat sink with turbulent structures

Also Published As

Publication number Publication date
DE10153512A1 (en) 2003-05-15

Similar Documents

Publication Publication Date Title
US20030079860A1 (en) Cooling element
JP4776032B2 (en) Heat exchanger
US7117928B2 (en) Heat sinks for a cooler
US20080144279A1 (en) Heat sink
EP2065283B1 (en) Cooling device for mobile body
US5653285A (en) Heat sink apparatus
US5224538A (en) Dimpled heat transfer surface and method of making same
US6015008A (en) Heat radiating plate
US7213636B2 (en) Cooling assembly with impingement cooled heat sink
US6418020B1 (en) Heat dissipation device with ribbed fin plates
US7909087B2 (en) Heat exchanger
US7896063B2 (en) Heat exchanger structure for battery module
US20100012303A1 (en) Hollow plate heat exchangers
JP5878352B2 (en) heatsink
JP4913333B2 (en) Heat sink and uniform cooling method
CN212695142U (en) Microchannel heat sink with interrupted inclined rib structure
US20050087326A1 (en) Heat sinks
US5353867A (en) Heat exchanger, a method of manufacturing same, and applications
US20230051026A1 (en) Heat dissipation device
JP5129942B2 (en) Semiconductor device
JP3175160U (en) heatsink
CN209945100U (en) Radiating fin for plate-fin heat exchanger
JP2001345585A (en) Heat-radiating fin
JP4462877B2 (en) Heat sink with louver
JPH05206339A (en) Heat sink

Legal Events

Date Code Title Description
AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HOFFMANN, INGOLF;SCHINN, VOLKER;REEL/FRAME:013591/0411

Effective date: 20021106

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION