US20030076662A1 - Transponder and injection-molded part and method for manufacturing same - Google Patents

Transponder and injection-molded part and method for manufacturing same Download PDF

Info

Publication number
US20030076662A1
US20030076662A1 US10302967 US30296702A US2003076662A1 US 20030076662 A1 US20030076662 A1 US 20030076662A1 US 10302967 US10302967 US 10302967 US 30296702 A US30296702 A US 30296702A US 2003076662 A1 US2003076662 A1 US 2003076662A1
Authority
US
Grant status
Application
Patent type
Prior art keywords
circuit
transponder
according
mold
invention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10302967
Inventor
Martin Miehling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sokymat SA
Original Assignee
Sokymat SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G06K19/041Constructional details
    • G06K19/047Constructional details the record carrier being shaped as a coin or a gambling token
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07724Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • B29C2045/14131Positioning or centering articles in the mould using positioning or centering means forming part of the insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/12Making multilayered or multicoloured articles
    • B29C39/123Making multilayered articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • B29C45/14073Positioning or centering articles in the mould using means being retractable during injection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16Making multilayered or multicoloured articles
    • B29C45/1671Making multilayered or multicoloured articles with an insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0097Glues, adhesives, e.g. hot melts, thermofusible adhesives
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0102Calcium [Ca]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01068Erbium [Er]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

A transponder contains an integrated circuit, a power transmitting component (antenna) and a capsule made of a thermoplastic resin (hot glue) that surrounds the circuit continuously at least on one surface of the circuit. The glue preferably is a polyamide and surrounds the circuit protectively, ensuring a mechanical connection between the circuit and the antenna. The encapsulation with the hot glue is conducted at pressures and temperatures that are below the pressures and temperatures encountered during conventional injection molding. The transponder can be integrated into an injection molded part, for example a coin, by being placed in an injection mold in which it is supported by feet and then surrounded by molding material in a conventional injection molding process so that it develops a more resistant sheath.

Description

    BACKGROUND OF THE INVENTION
  • [0001]
    1. Field of the Invention
  • [0002]
    The invention relates to a transponder as installed primarily in maps or marks for identification of objects of various types, but also of persons or animals, and to a method of making such transponders.
  • [0003]
    2. Discussion of Related Art
  • [0004]
    Transponders are well known in the art and generally comprise an electrical circuit having a coil connected to an integrated circuit. The transponder is responsive to a received radio frequency signal and produces a radio frequency signal.
  • [0005]
    U.S. Pat. No. 5,420,757 describes a transponder according to the species in which the electrical circuit is encapsulated in epoxy resin or thermoplastic material. Such a capsule is made by conventional injection molding. This method has a number of drawbacks. In particular, the circuit is exposed to high temperatures and pressures during the molding, which conditions often lead to damage of the circuit. Conventional injection molding typically is conducted at a temperature of 180-400° C. and a pressure of 1,000-2,000 bars. Under such conditions, the baking lacquer of the coils softens at high temperatures, so that the coils may disintegrate. Soldered connections may also soften. Since high stresses may be acting on the components because of the high pressure, particularly when they have no connections to which they can be attached during injection molding, they have to be connected to expensive holders or supports made of a suitable material so that they are not displaced in the cavity during the injection molding process. This could lead to incomplete encapsulation and damage in subsequent processing steps. Moreover, the holders penetrate the capsule and then have to be separated by punching or another similar work step. Making an intact capsule becomes more difficult and expensive.
  • SUMMARY OF THE INVENTION
  • [0006]
    It is one object of the invention to provide an electrical circuit of a transponder having an enveloping capsule.
  • [0007]
    It is a further object of the present invention to develop a simple and inexpensive method for manufacturing such a transponder.
  • [0008]
    These and other objects are achieved by the present invention. In the invention, the circuitry of a transponder is encapsulated within a hot melt material having a relatively low melting point. The hot melt encapsulation provides protection of the electronics of the transponder against damage from harsh environments, including those encountered in further processing (injection molding) of the transponder.
  • [0009]
    More in particular, the invention relates to a transponder comprising an electrical circuit containing at least one component suitable for interaction with an electromagnetic field encapsulated within a capsule, wherein the capsule comprises a thermoplastic resin having a melting point of from 120° C. and 250° C., and wherein the electrical circuit is encapsulated by the thermoplastic resin.
  • [0010]
    The invention also relates to a method for manufacturing a transponder comprising an electrical circuit containing at least one component suitable for interaction with an electromagnetic field encapsulated within a capsule, wherein the capsule comprises a thermoplastic resin having a melting point of from 120° C. and 250° C., and wherein the electrical circuit is encapsulated by the thermoplastic resin, comprising placing at least one of the electrical circuits in a cavity of a mold, and feeding the thermoplastic resin in molten form into the cavity to encapsulate the at least one electrical circuit and form the capsule, wherein the feeding is conducted at a temperature of from 120° C. to 260° C. and at a pressure of from 5 to 40 bars.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0011]
    [0011]FIG. 1A is a cross section through a mold during a first phase of a first embodiment of the method according to the invention for making a transponder according to the invention.
  • [0012]
    [0012]FIG. 1B is a top view of the bottom half of the mold according to FIG. 1A.
  • [0013]
    [0013]FIG. 1C is a cross section through the mold during a second phase of the first embodiment of the method according to the invention for manufacturing a transponder according to the invention.
  • [0014]
    [0014]FIG. 1D is a top view of the bottom half of the mold according to FIG. 1C.
  • [0015]
    [0015]FIG. 1E is a cross section through a transponder according to the invention. manufactured according to the first embodiment of the method according to the invention.
  • [0016]
    [0016]FIG. 1F is a top view of the transponder according to the invention, according to FIG. 1E.
  • [0017]
    [0017]FIG. 2A is a cross section through a mold during a first phase of a second embodiment of the method according to the invention for manufacturing a transponder according to the invention.
  • [0018]
    [0018]FIG. 2B is a cross section through the mold during a second phase of the second embodiment of the method according to the invention for manufacturing a transponder according to the invention.
  • [0019]
    [0019]FIG. 3A is a top view of an intermediate product of a third embodiment of the method according to the invention for manufacturing a transponder according to the invention.
  • [0020]
    [0020]FIG. 3B is a cross section through the intermediate product according to FIG. 3A.
  • [0021]
    [0021]FIG. 3C is a cross section through a transponder according to the invention, manufactured according to the third embodiment of the method according to the invention.
  • [0022]
    [0022]FIG. 3D is a top view of a transponder according to the invention according to FIG. 3C.
  • [0023]
    [0023]FIG. 4A is a cross section through an injection mold during a phase of the method according to the invention for manufacturing an injection molded part according to the invention.
  • [0024]
    [0024]FIG. 4B is a cross section through an injection molded part according to the invention.
  • [0025]
    [0025]FIG. 4C is a top view of the injection mold part according to the invention according to FIG. 4B.
  • [0026]
    [0026]FIG. 5A is a cross section through a mold during a first phase of a fourth embodiment of the method according to the invention for making a transponder according to the invention in which the mold becomes a part of the transponder.
  • [0027]
    [0027]FIG. 5B is a cross section through a mold during a second phase of a fourth embodiment of the method according to the invention for making a transponder according to the invention in which the mold becomes a part of the transponder.
  • [0028]
    [0028]FIG. 5C is a cross section of the transponder of the fourth embodiment according to the invention in which the mold has become a part of the transponder.
  • [0029]
    [0029]FIG. 5D is a cross section of the transponder of the fourth embodiment according to the invention in which the mold forms substantially the entire housing of the transponder.
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • [0030]
    The transponder according to the invention is enveloped by its capsule so that it is optimally protected from damage and can safely be exposed to a harsh (i.e., high temperature and pressure) environment. That is, it is important to ensure mechanical stability of at least an integrated circuit and an antenna or coil of the transponder. Most preferably, the circuitry of the transponder is completely encapsulated within the hot melt thermoplastic material of the capsule. However, it is also possible to encapsulate only one side of the transponder, for example the side on which the electrical connections of the transponder protrude so that the electrical connections between the integrated circuit and the antenna of the circuit are encapsulated, or the opposite side. The transponder can easily be laminated with film, particularly plastic film, if needed, as a result of the mechanical stability. The encapsulated circuit can also easily be subjected to a further injection molding operation at higher temperatures and pressures without damaging the electrical circuit, again as a result of the mechanical stability.
  • [0031]
    The process of manufacture is simple and exposes the circuits to only relatively low pressures and temperatures during the complete encapsulation of the circuit with the hot melt thermoplastic resin, so that there is no damage to the circuit during manufacture. The circuits also do not have to be attached in a complicated fashion, but instead may be simply inserted into a final product.
  • [0032]
    Moreover, in the process, inexpensive molds such as aluminum, ceramic, plastic, textile or the like may be used, which mold materials are far cheaper than the steel molds used for conventional injection molding. The molds do not normally have to be heated. The molds may preferably be incorporated into the transponder itself, rather than used only for shaping of the mold.
  • [0033]
    Because of the low pressure, lighter and comparatively cheaper injection molding machines can be used when encapsulating the circuit in the hot melt thermoplastic material (hot glue).
  • [0034]
    The encapsulated transponders achieved by the invention can be exposed immediately to the high pressures and temperatures that normally occur in injection molding, because the circuits are enveloped in the hot melt thermoplastic resin as discussed above.
  • [0035]
    The invention thus also covers injection molded parts that include a transponder according to the invention, which can be designed specifically for such purpose. These can include coins, housings, consumer goods, pallets, etc. There are no limits on shaping. No difficulties are added to the manufacture of such injection molded parts by building in a transponder according to the invention as it can be inserted into the cavity and the capsule injected around it without this having to be taken especially into consideration when the parameters are established.
  • [0036]
    The invention will now be further described with specific reference to the drawing figures.
  • [0037]
    A transponder 1 according to the invention (see, for example, FIGS. 1E and 1F) comprises an electrical circuit 2, which may be, for example, an antenna such as copper wire coil 3 held together by baked Lacquer as well known in the art, with electrical connections 4 a, 4 b that connect coil 3 with an integrated circuit 5 that likewise belongs to circuit 2. Circuit 2 is self-contained and has no external connections. It can interact by means of the antenna or coil with an external electromagnetic alternating field, and pick up energy, and transmit stored data. With a suitable design of integrated circuit 5, it can also receive and store data.
  • [0038]
    The hot glue is preferably made of polyamide, although any suitable hot melt thermoplastic material may be used. The hot glue preferably has a melting point of 250° C. maximum, 120° C. minimum, and most preferably between 180° C. and 220° C. The viscosity of the liquid glue is preferably low.
  • [0039]
    In this regard, it should be noted that the material of the capsule is a hot melt or thermoplastic material, preferably polyamide. Conventional injection molding materials, for example polyamide materials, used in injection molding have a processing temperature of 300° C. to 400° C. and require higher processing pressures (50 to 1,200 bar, more typically 400 to 1,200 bar), heated injection molding tools and hardened steel molds. The thermoplastic materials of the invention have lower melting temperatures, which lowers the viscosity of the melt and permits the use of significantly lower molding pressures and the use of, for example, aluminum molding materials.
  • [0040]
    In one preferred embodiment of the present invention, circuit 2 is completely enveloped by a capsule 6 made of hot glue (i.e., a hot melt thermoplastic resin).
  • [0041]
    In a first aspect of such an embodiment, a first mold 7 (FIGS. 1A and 1B) is prepared. The mold is preferably comprised of an inexpensive material such as aluminum, ceramic, plastic or textile.
  • [0042]
    The mold has a bottom mold half 8 a and a top mold half 8 b. Circuit 2 is located in bottom mold half 8 a and the coil 3 is partially contained in a depression 9 of the mold to hold the coil. Integrated circuit 5 is approximately in the center of coil 3 on bottom mold half 8 a and is held by connections 4 a, 4 b. These connections are electrical connections, i.e., connections that connect the coil to the integrated circuit in an electrically conducting manner. Thus, supporting surface, or back surface, 10 of circuit 2, consisting of the lower part of the outer surface of coil 3 and the bottom surface of integrated circuit 5, abuts a corresponding support surface of mold 7. The electrical connections are on the front, or electrical connection, surface of the circuit 2, i.e., the surface of the circuit from which the electrical connections protrude in connecting the integrated circuit to the coil.
  • [0043]
    Once first mold 7 has been closed by applying second mold half 8 b, liquid hot glue is injected into the cavity 11 formed between mold halves 8 a, 8 b. The temperature of the hot glue should preferably be slightly higher than the melting point of the glue. Thus, the temperature at injection is, for example, between 120° C. and 260° C., more preferably between 190° C. and 230° C., and most preferably about 200° C. Because of the low viscosity of the liquid glue, injection can usually be done at a low pressure of, for example, between 5 and 40 bars, more preferably between 5 and 35 bars, and most preferably at approximately 20 bars. The pressures are usually less in cavity 11, namely slightly over 0 bar, until the cavity is completely filled when it too reaches the injection pressure.
  • [0044]
    Circuit 2 located in cavity 11 is surrounded partially, e.g., up to its middle plane, by the hot glue and supporting surface 10 remains exposed. Since the encapsulation takes place without high heat or mechanical loads, no damage to or displacement of circuit 2 by the entering glue is caused.
  • [0045]
    In this aspect of the invention, once the hot glue has set, the partially covered circuit 2 is removed from first mold 7, turned, and placed in a second mold half 8 a′ (FIGS. 1C, 1D) of a second, higher mold 7′. Supporting surface 10 then faces upward and is exposed. Mold 7′ is closed by applying a top mold half 8 b′ and its cavity 11′ is filled with hot glue, which is preferably the same as the hot glue used to encapsulate the first half of the circuit. Supporting surface 10 is now also covered with hot glue and circuit 2 is completely covered. Capsule 6 is then complete. When the hot glue has set, mold 7′ is opened and the disk-shaped transponder 1 (FIGS. 1E, 1F) is removed. Circuit 2, which is also approximately disk-shaped, is disposed symmetrically in capsule 6.
  • [0046]
    In another aspect of the invention similar to the first embodiment discussed above, the capsule encapsulates the circuit on only one side of the circuit. The electrical connections may or may not be encapsulated. This is accomplished by subjecting the circuit to encapsulation with the thermoplastic material on only one side in the above embodiment, i.e., by only conducting the encapsulation of FIGS. 1A and 1B on the front, electrical connection surface of the circuit or on the opposite, supporting surface of the circuit, but not the other. Preferably, the electrical circuits are encapsulated. In this way, the circuit is still suitably encapsulated for protection of the connections of the circuit as discussed above. However, this security in the connections is secondary to the mechanical stability of encapsulating the integrated circuit and the antenna/coil. The chip/module is mechanically connected to the coil by the hot melt thermoplastic resin, and thus the unit is handleable without risk of damage to the circuit. This aspect of the invention eliminates the additional encapsulation step on the opposite side of the circuit as above, thereby reducing the expense and time of the process.
  • [0047]
    According to another embodiment of the method according to the invention for manufacturing a transponder according to the invention, only one mold 7 is used and circuit 2 is held in the center of the cavity by four pins 12 a, b, c, d whose end surfaces in turn form supporting surfaces, abutted by coil 3 with a supporting surface 10 consisting of four partial surfaces. Pins 12 a, b, c, d form two pairs 12 a, b and 12 c, d, oriented toward each other, and hold coil 3 firmly between them. Although four pins are shown in FIGS. 2A and 2B for illustration purposes, any number of pins may be used, including only one where, for example, the one pin is a bearing surface that may be retracted like a pin during molding.
  • [0048]
    Once the hot glue has been injected and has set (FIG. 2A), pins 12 a, b, c, d are pulled back to the wall of the cavity. More hot glue is injected and the space left by the retraction of pins 12 a, b, c, d is filled (FIG. 2b). In this way, capsule 6 is once more complete and circuit 2 is completely covered with hot glue. When the second batch of hot glue has set, mold 7 is opened and transponder 1 is removed.
  • [0049]
    In a most preferred embodiment of the invention, the mold used during encapsulation with the hot glue is comprised of an inexpensive material that can be incorporated into the final transponder product. That is, the mold preferably forms a part or substantially all of the capsule or housing of the transponder. In this way, the circuit does not have to be removed from the mold following encapsulation, which might cause damage to the encapsulation material and/or circuit. Instead, the mold preferably forms a part of the capsule, and thus a part of the final product.
  • [0050]
    For this purpose, it is most preferred to use a plastic material as the mold, for example polyamide and the like, i.e., a material similar in chemical structure and properties to the material of the hot glue. However, any suitable mold material may be used including, for example, any suitable plastic, aluminum, textile, ceramic or the like.
  • [0051]
    This embodiment is illustrated in FIGS. 5A to 5D. The circuit 2 is located within mold 7 that will form a part of the housing and remain with the transponder. A top part 8 (FIG. 5B), for example an aluminum form, is then used to close the mold. The hot melt thermoplastic resin is then injected into the closed mold under the conditions discussed above. Following the injection, the encapsulated circuit 50 (FIG. 5C), encapsulated in the hot melt thermoplastic resin capsule 6, is obtained by removing top part 8. As can be seen, the mold 7 remains with the transponder to form a part of the housing. In FIG. 5D, top part 8 also becomes part of the housing and thus is not removed following encapsulation, thereby forming a transponder in which the mold forms substantially all of the housing of the transponder.
  • [0052]
    In the embodiment of FIGS. 5A-5C, the mold most preferably is used on the support, or back, surface of the circuit, and the injected hot melt thermoplastic resin encapsulates the electrical connection, or front, surface of the circuit as shown in FIG. 5C. The hot melt thermoplastic resin need not completely encapsulate the circuit in this embodiment, the mold itself protecting at least the support surface of the circuit.
  • [0053]
    According to a still further embodiment of the method according to the invention for manufacturing a transponder according to the invention, several circuits are covered at the same time, so that they are temporarily held together by the hot glue coating. The method is the same in principle as in the first or in the second embodiment, but the mold is significantly larger and its cavity is, for example, a parallelepiped and flat, so that a plurality of circuits can be placed therein in a regular grid. The result of the injection molding step is a three-dimensional arrangement of circuits 2 embedded in hot glue, which form a plate 13 (FIGS. 3A and 3B). Circuits 2 are completely covered with hot glue and spaced apart from each other.
  • [0054]
    Plate 13 can be hot- or cold-laminated on one or both sides with a plastic film, most preferably polyvinyl chloride (PVC). It is then separated by a stamping tool into individual transponders 1 each of which is a circuit 2 completely surrounded by a capsule 6. Transponder 1 (FIGS. 3C and 3D) is constructed in essentially the same way as those made according to the first or second embodiment of the method according to the invention but when plate 13 is laminated on both sides, it has cover layers 14 a, b preferably made of PVC, but also possibly made of ABS, polycarbonate, polyester, or any other suitable plastic material. Plate 13 can be prepared such that a credit card or other card or a coin or the like containing a transponder 1 can immediately be punched out from it.
  • [0055]
    It is also possible to encapsulate several circuits together so that they form a line held together by the capsule or another arrangement of transponders that will later be held together by connecting sections which are separated mechanically, for example in a later work step.
  • [0056]
    Since the circuits are protected from high pressures and temperatures by the continuous capsules, the transponders according to the invention can be smoothly integrated into injection molded parts. By contrast, nonencapsulated circuits cannot be smoothly integrated into injection molded parts because before injection of the injection-molding material with the conventional injection molding method, the circuits are disposed in the cavity of the injection mold.
  • [0057]
    Circuits of the invention can be specially designed for injection molding and provided with supporting elements. These can be formed as feet 15 of transponder 1 projecting from both sides of the capsule (FIGS. 4A-C). These feet can be produced by, for example, additional injection with a suitable design of the mold used to make them or by retraction of pins as used in the second embodiment of the method according to the invention, behind the wall of the cavity. In any case, they support transponder 1 (FIG. 4A) in a cavity 16 of an injection mold 17 made of hardened steel during the manufacture according to the invention of an injection molded part according to the invention in such fashion that it is reliably secured and cannot be displaced when the injection molding material is injected.
  • [0058]
    The temperatures during injection molding are higher by about 50° C. than during the production of capsule 6 of transponder 1. For example, the temperature during conventional injection molding is typically on the order of 180° C. to 400° C. In addition, the pressure of the injection molding is also higher than during the encapsulation, often by at least several hundred bars. For example, the pressure during conventional injection molding is on the order of 400 to 2,000 bars. Transfer molding, sometimes used in the electronics industry, uses pressures of 50 to 250 bars, which is still higher than the 5 to 40 bars of pressure used in encapsulation in the present invention. As a result of first encapsulating the circuit in the hot glue at lower temperatures and pressures, the circuit is able to easily withstand the harsher conditions of injection molding without damage and without special, expensive additional processing to protect the circuits during injection molding.
  • [0059]
    It is also possible to provide a plastic or metal support surrounding the transponder for example annularly as a supporting element, said support being cast with the capsule, and whose outer area is then clamped between the halves of the injection mold to secure the transponder.
  • [0060]
    In the finished injection molded part according to the invention, for example a coin 18 or a token, transponder 1 is surrounded nearly completely by a sheath 19 of the injection molding material. Since it consists of injection molding material that is viscous and has a higher melting point than the hot glue that forms capsule 6 of transponder 1, sheath 19 is stronger and harder than the hot glue and coin 18 is correspondingly sturdy and resistant.
  • [0061]
    The injection molding material may comprise any suitable material. Such include any known plastics which can provide the transponder with higher chemical resistance, higher strength, higher temperature resistance, etc. compared to the thermoplastic resin of encapsulation. Specific injection molding materials include, for example, polyphenylene sulfide, acrylonitrile butadiene styrene (ABS) and polyethylene.
  • [0062]
    Transponder 1 can analogously also be integrated into more-complex injection molded parts, for example in vessels or containers, housings, pallets, vehicle parts, and consumer goods of all types.
  • [0063]
    The present invention thus offers many advantages over the prior art as discussed above, and including that the invention achieves a transponder that can be simply and inexpensively formed. The invention surprisingly utilizes a hot glue material, a material conventionally used in other arts to repair items, to filly encapsulate the circuitry of the transponder in order to protect the circuitry (a use not heretofore foreseen with such material). Also, it is not necessary in forming the capsule to first mount the circuitry on any type of substrate.

Claims (28)

    What is claimed is:
  1. 1. An electrical circuit comprising an integrated circuit, an antenna and one or more electrical connections between the integrated circuit and the antenna, wherein at least the integrated circuit and the antenna are encapsulated within a capsule, and wherein the capsule comprises a thermoplastic resin having a melting point of from 120° C. to 250° C.
  2. 2. The electrical circuit according to claim 1, wherein the capsule completely encapsulates the electrical circuit.
  3. 3. The electrical circuit according to claim 1, wherein the capsule encapsulates the electrical circuit only on one surface of the electrical circuit.
  4. 4. The electrical connection according to claim 1, wherein the electrical circuit is encapsulated within the capsule such that at least one or more electrical connections are encapsulated by the thermoplastic resin.
  5. 5. The electrical connection according to claim 1, wherein the antenna is a coil.
  6. 6. Transponder comprising an electrical circuit containing at least one component suitable for interaction with an electromagnetic field encapsulated within a capsule, wherein the capsule comprises a thermoplastic resin having a melting point of from 120° C. to 250° C., and wherein the-electrical circuit is encapsulated by the thermoplastic resin such that at least an integrated circuit and an antenna of the electrical circuit are encapsulated by the thermoplastic resin.
  7. 7. Transponder according to claim 6, wherein the thermoplastic resin consists essentially of thermoplastic polyamide.
  8. 8. Transponder according to claim 6, wherein at least part of a surface of the capsule is covered with a cover layer of laminated film.
  9. 9. Transponder according to claim 8, wherein the laminated film comprises a plastic.
  10. 10. Transponder according to claim 9, wherein the plastic is polyvinyl chloride.
  11. 11. Transponder according to claim 6, wherein the antenna is a coil.
  12. 12. Transponder according to claim 6, wherein the electrical circuit further comprises one or more electrical connections connecting the integrated circuit in electrically conducting fashion with the antenna.
  13. 13. Transponder according to claim 6, wherein the capsule further comprises at least one supporting element projecting from its surface.
  14. 14. Transponder according to claim 6, wherein the capsule includes a material used as a mold during encapsulation with the thermoplastic resin.
  15. 15. Transponder according to claim 6, wherein the transponder further comprises a sheath of injection molded resin surrounding the encapsulated electrical circuit.
  16. 16. Method of manufacturing a transponder comprising an electrical circuit containing at least one component suitable for interaction with an electromagnetic field encapsulated within a capsule, wherein the capsule comprises a thermoplastic resin having a melting point of from 120° C. to 250° C., and wherein the electrical circuit is encapsulated by the thermoplastic resin within the capsule such that at least an integrated circuit and an antenna of the electrical circuit are encapsulated by the thermoplastic resin, comprising
    placing at least one of the electrical circuits in a cavity of a mold, and
    feeding the thermoplastic resin in molten form into the cavity to encapsulate the at least one electrical circuit and form the capsule, wherein the feeding is conducted at a temperature of from 120° C. to 260° C. and at a pressure of from 5 to 40 bars.
  17. 17. Method according to claim 16, wherein the placing places a supporting surface of the electrical circuit against the mold, and wherein the feeding consists of forming a partially covered electrical circuit covered with thermoplastic resin at least on one surface.
  18. 18. Method according to claim 16, wherein the placing places a supporting surface of the electrical circuit against the mold, wherein the feeding forms a partially covered electrical circuit covered with thermoplastic resin at least on one surface, and the method further comprises placing the partially covered electrical circuit in a cavity of a second mold such that the supporting surface is exposed to the cavity of the second mold, and filling the cavity of the second mold with the thermoplastic resin to form a fully covered electrical circuit.
  19. 19. Method according to claim 16, wherein the placing includes a plurality of pins supporting the electrical circuit within the cavity of the mold.
  20. 20. Method according to claim 19, wherein the method further comprises, following the feeding, removing the plurality of pins and subsequently filling the cavity of the mold once more with the thermoplastic resin.
  21. 21. Method according to claim 16, wherein the at least one electrical circuit comprises a plurality of electrical circuits that are encapsulated together so as to be held together by the thermoplastic resin.
  22. 22. Method according to claim 21, wherein the encapsulation forms a plate in which the plurality of electrical circuits are embedded, and the method further comprises stamping the transponder comprising at least one electrical circuit from the plate.
  23. 23. Method according to claim 22, wherein the method further comprises forming a film cover layer on one or both sides of the plate before the transponder is stamped from the plate.
  24. 24. Method according to claim 16, wherein the feeding is conducted at a temperature of at most 230° C. and at a pressure of at most 35 bars.
  25. 25. Method according to claim 16, wherein the mold remains with the electrical circuit and forms at least a part of the capsule.
  26. 26. Method according to claim 16, wherein the method further comprises placing the transponder encapsulated in the thermoplastic resin in a cavity of an injection mold and subsequently injecting injection molding material into the cavity to form an injection molded part.
  27. 27. Method according to claim 26, wherein the injecting is conducted at a temperature of from 180° C. to 400° C. and at a pressure of from 50 bars to 2,000 bars.
  28. 28. Injection molded part with transponder integrated therein made according to the method of claim 26.
US10302967 1999-05-14 2002-11-25 Transponder and injection-molded part and method for manufacturing same Abandoned US20030076662A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP19990810432 EP1052594A1 (en) 1999-05-14 1999-05-14 Transponder and molding die, and their method of manufacture
EP19990811181 EP1052595B1 (en) 1999-05-14 1999-12-21 Transponder and injection-moulded object and method for manufacturing the same
EP99811181.9 1999-12-21
EP99810432.7 1999-12-21
US09512223 US6687131B1 (en) 1999-05-14 2000-02-24 Transponder and injection-molded part and method for manufacturing same
US10302967 US20030076662A1 (en) 1999-05-14 2002-11-25 Transponder and injection-molded part and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10302967 US20030076662A1 (en) 1999-05-14 2002-11-25 Transponder and injection-molded part and method for manufacturing same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US09512223 Division US6687131B1 (en) 1999-05-14 2000-02-24 Transponder and injection-molded part and method for manufacturing same

Publications (1)

Publication Number Publication Date
US20030076662A1 true true US20030076662A1 (en) 2003-04-24

Family

ID=26153756

Family Applications (2)

Application Number Title Priority Date Filing Date
US09512223 Expired - Fee Related US6687131B1 (en) 1999-05-14 2000-02-24 Transponder and injection-molded part and method for manufacturing same
US10302967 Abandoned US20030076662A1 (en) 1999-05-14 2002-11-25 Transponder and injection-molded part and method for manufacturing same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US09512223 Expired - Fee Related US6687131B1 (en) 1999-05-14 2000-02-24 Transponder and injection-molded part and method for manufacturing same

Country Status (3)

Country Link
US (2) US6687131B1 (en)
EP (1) EP1052595B1 (en)
JP (1) JP2001024550A (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005054030A1 (en) * 2003-12-05 2005-06-16 Ansaldo Segnalamento Ferroviario S.P.A. Railway beacon and related production method
US20050199734A1 (en) * 2004-03-10 2005-09-15 Infineon Technologies Ag Chip card
EP1583029A1 (en) * 2004-03-31 2005-10-05 Satoh Gosei Co., Ltd. Information recording member resin-enclosed tag and its manufacturing method
US20060096087A1 (en) * 2004-11-10 2006-05-11 Lotfi Ashraf W Method of manufacturing a power module
US20060096088A1 (en) * 2004-11-10 2006-05-11 Lotfi Ashraf W Method of manufacturing an encapsulated package for a magnetic device
US20070075817A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Magnetic device having a conductive clip
US20070074386A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Method of forming a power module with a magnetic device having a conductive clip
US20070075816A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Power module with a magnetic device having a conductive clip
US20070075815A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Method of forming a magnetic device having a conductive clip
EP1850276A1 (en) * 2006-04-25 2007-10-31 Id-Systec Gmbh In-mould label
US20090068400A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Micromagnetic Device and Method of Forming the Same
US20090068761A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Method of Forming a Micromagnetic Device
US20090066467A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Micromagnetic Device and Method of Forming the Same
US20090066300A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Power Converter Employing a Micromagnetic Device
US20090085747A1 (en) * 2007-09-28 2009-04-02 Fujitsu Limited Rfid tag and manufacturing method thereof
US20100084750A1 (en) * 2008-10-02 2010-04-08 Lotfi Ashraf W Module having a stacked passive element and method of forming the same
US20100087036A1 (en) * 2008-10-02 2010-04-08 Lotfi Ashraf W Module having a stacked passive element and method of forming the same
US20100164449A1 (en) * 2008-12-29 2010-07-01 Mirmira Ramarao Dwarakanath Power Converter with a Dynamically Configurable Controller and Output Filter
US20100212150A1 (en) * 2008-10-02 2010-08-26 Lotfi Ashraf W Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same
US20100214746A1 (en) * 2008-10-02 2010-08-26 Lotfi Ashraf W Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same
US20100292944A1 (en) * 2006-12-06 2010-11-18 Colin Howell Conductivity sensor
US20110094134A1 (en) * 2004-10-25 2011-04-28 Van Wijk Antoon Identification device and method for manufacturing thereof
US8018315B2 (en) 2007-09-10 2011-09-13 Enpirion, Inc. Power converter employing a micromagnetic device
US8133529B2 (en) 2007-09-10 2012-03-13 Enpirion, Inc. Method of forming a micromagnetic device
US8325047B2 (en) 2009-04-08 2012-12-04 Sabic Innovative Plastics Ip B.V. Encapsulated RFID tags and methods of making same
US20130221109A1 (en) * 2012-02-24 2013-08-29 Mitomo Corporation Wireless ic tag, process for manufacturing the same, and die for molding wireless ic tag
US8541991B2 (en) 2008-04-16 2013-09-24 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8686698B2 (en) 2008-04-16 2014-04-01 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8692532B2 (en) 2008-04-16 2014-04-08 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8867295B2 (en) 2010-12-17 2014-10-21 Enpirion, Inc. Power converter for a memory module
US9246390B2 (en) 2008-04-16 2016-01-26 Enpirion, Inc. Power converter with controller operable in selected modes of operation
WO2016187503A1 (en) * 2015-05-21 2016-11-24 Texas Nameplate Company, Inc. Method and system for securing a tracking device to a component
US9509217B2 (en) 2015-04-20 2016-11-29 Altera Corporation Asymmetric power flow controller for a power converter and method of operating the same
US20160370813A1 (en) * 2015-06-19 2016-12-22 Phillips & Temro Industries Inc. Thermostat Assembly and Method of Manufacturing
US9548714B2 (en) 2008-12-29 2017-01-17 Altera Corporation Power converter with a dynamically configurable controller and output filter

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004511033A (en) * 2000-08-11 2004-04-08 エスコート・メモリー・システムズEscort Memory Systems Rfid tag assembly and system
JP2002163627A (en) * 2000-11-29 2002-06-07 Hitachi Cable Ltd Electronic tag and production method therefor
JP4706117B2 (en) * 2001-03-26 2011-06-22 凸版印刷株式会社 Manufacturing method of Ic card
ES2241937T3 (en) 2001-09-18 2005-11-01 Toyo Boseki Kabushiki Kaisha Method of injection molding at low pressure for polyester resins and resin compositions.
US7218232B2 (en) * 2003-07-11 2007-05-15 Depuy Products, Inc. Orthopaedic components with data storage element
US20070005141A1 (en) * 2005-06-30 2007-01-04 Jason Sherman Apparatus, system, and method for transcutaneously transferring energy
US7780613B2 (en) * 2005-06-30 2010-08-24 Depuy Products, Inc. Apparatus, system, and method for transcutaneously transferring energy
EP1770603A1 (en) * 2005-10-03 2007-04-04 Assa Abloy Identification Technology Group AB Encapsulated transponder and method for manufacturing the same
DE102006012708A1 (en) * 2006-03-17 2007-09-20 Polyic Gmbh & Co. Kg Active/passive electrical component e.g. solar cell, manufacturing method, involves overlapping electrically conductive contact regions partially, where regions are electrically conducted by pressure sensitive adhesive
US20070270660A1 (en) * 2006-03-29 2007-11-22 Caylor Edward J Iii System and method for determining a location of an orthopaedic medical device
US8015024B2 (en) 2006-04-07 2011-09-06 Depuy Products, Inc. System and method for managing patient-related data
US8075627B2 (en) 2006-04-07 2011-12-13 Depuy Products, Inc. System and method for transmitting orthopaedic implant data
FR2903624B1 (en) * 2006-07-17 2008-11-28 Oberthur Card Syst Sa molding manufacturing Method for a portable electronic entity and entity obtained.
US8632464B2 (en) * 2006-09-11 2014-01-21 DePuy Synthes Products, LLC System and method for monitoring orthopaedic implant data
EP2081462A4 (en) * 2006-11-13 2015-09-16 Entertainment Gaming Asia Inc Improved gaming token
US20080251968A1 (en) * 2007-04-10 2008-10-16 Cascade Engineering, Inc. Rfid hard case device and method of manufacture
US8080064B2 (en) 2007-06-29 2011-12-20 Depuy Products, Inc. Tibial tray assembly having a wireless communication device
GB0719158D0 (en) * 2007-10-01 2007-11-07 Rftraq Ltd A process for tracking a bale of waste material
DE102007048798A1 (en) * 2007-10-10 2009-04-16 Ses Rfid Solutions Gmbh Spatial structure with an RFID transponder
US8310367B1 (en) 2009-05-18 2012-11-13 Empire Technology Development Llc Methods of implanting electronics in objects and objects with implanted electronics
WO2010133935A1 (en) * 2009-05-18 2010-11-25 Empire Technology Development Llc A method of implanting electronics in objects
JP5346747B2 (en) * 2009-09-01 2013-11-20 Necトーキン株式会社 Piezoelectric speaker and its manufacturing method
WO2014096554A1 (en) 2012-12-21 2014-06-26 Wisteq Oy Rfid tag, insert for an rfid tag, methods and casting moulds for manufacturing an rfid tag and insert, methods for tuning an rfid tag, quick-fastening adapter for an rfid tag, and applications of an rfid tag
CN107615098A (en) * 2015-04-09 2018-01-19 Mdt创新私人有限公司 Method for manufacturing an RFID tag

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3706840A (en) * 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
US4911217A (en) * 1989-03-24 1990-03-27 The Goodyear Tire & Rubber Company Integrated circuit transponder in a pneumatic tire for tire identification
US5024727A (en) * 1986-10-06 1991-06-18 Bio Medic Data Systems, Inc. Method of forming an animal marker implanting system
US5166502A (en) * 1990-01-05 1992-11-24 Trend Plastics, Inc. Gaming chip with implanted programmable identifier means and process for fabricating same
US5181975A (en) * 1991-03-27 1993-01-26 The Goodyear Tire & Rubber Company Integrated circuit transponder with coil antenna in a pneumatic tire for use in tire identification
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
US5462622A (en) * 1994-06-09 1995-10-31 Illinois Tool Works Inc. Molding an electrical element within a premold element and an overmold element to provide a one-piece component
US5574470A (en) * 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method
US5604485A (en) * 1993-04-21 1997-02-18 Motorola Inc. RF identification tag configurations and assemblies
US5606488A (en) * 1990-04-19 1997-02-25 Sokymat Sa Miniaturized printed circuit and coil assembly
US5690773A (en) * 1994-02-24 1997-11-25 Gemplus Card International Method for the manufacture of a contact-free or hybrid card
US5731754A (en) * 1994-06-03 1998-03-24 Computer Methods Corporation Transponder and sensor apparatus for sensing and transmitting vehicle tire parameter data
US5800763A (en) * 1994-10-06 1998-09-01 Giesecke & Devrient Gmbh Method for producing data carriers with embedded elements
US5840148A (en) * 1995-06-30 1998-11-24 Bio Medic Data Systems, Inc. Method of assembly of implantable transponder
US5856378A (en) * 1988-12-02 1999-01-05 Courtaulds Coatings (Holdings) Limited Powder coating compositions
US5879502A (en) * 1994-05-27 1999-03-09 Gustafson; Ake Method for making an electronic module and electronic module obtained according to the method
US6031459A (en) * 1998-07-22 2000-02-29 Micron Technology, Inc. Wireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devices
US6087930A (en) * 1994-02-22 2000-07-11 Computer Methods Corporation Active integrated circuit transponder and sensor apparatus for transmitting vehicle tire parameter data
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6177040B1 (en) * 1993-11-24 2001-01-23 Texas Instruments Incorporated Method for making light transparent package for integrated circuit
US6285561B1 (en) * 1998-12-18 2001-09-04 U.S. Philips Corporation Data carrier module device having integrated circuit and transmission coil connection contacts covered by a common protective cap
US6441741B1 (en) * 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
US6518600B1 (en) * 2000-11-17 2003-02-11 General Electric Company Dual encapsulation for an LED
US6534711B1 (en) * 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2721733B1 (en) 1994-06-22 1996-08-23 Gemplus Card Int A method for manufacturing a contactless card by overmolding and contactless card obtained by such a method.
JPH08142557A (en) * 1994-11-14 1996-06-04 Mitsubishi Chem Corp Production of noncontact type ic card
JPH1026934A (en) * 1996-07-12 1998-01-27 Toshiba Chem Corp Electronic tag and its manufacturing method
WO1998053424A1 (en) * 1997-05-20 1998-11-26 Santbrink Ronald Barend Van Method for the production of a smart card, smart card and device for the production thereof
JPH1134548A (en) * 1997-07-15 1999-02-09 Toppan Printing Co Ltd Non-contact ic card and its manufacture

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3706840A (en) * 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
US5024727A (en) * 1986-10-06 1991-06-18 Bio Medic Data Systems, Inc. Method of forming an animal marker implanting system
US5856378A (en) * 1988-12-02 1999-01-05 Courtaulds Coatings (Holdings) Limited Powder coating compositions
US4911217A (en) * 1989-03-24 1990-03-27 The Goodyear Tire & Rubber Company Integrated circuit transponder in a pneumatic tire for tire identification
US5166502A (en) * 1990-01-05 1992-11-24 Trend Plastics, Inc. Gaming chip with implanted programmable identifier means and process for fabricating same
US5606488A (en) * 1990-04-19 1997-02-25 Sokymat Sa Miniaturized printed circuit and coil assembly
US5181975A (en) * 1991-03-27 1993-01-26 The Goodyear Tire & Rubber Company Integrated circuit transponder with coil antenna in a pneumatic tire for use in tire identification
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
US5604485A (en) * 1993-04-21 1997-02-18 Motorola Inc. RF identification tag configurations and assemblies
US6177040B1 (en) * 1993-11-24 2001-01-23 Texas Instruments Incorporated Method for making light transparent package for integrated circuit
US6087930A (en) * 1994-02-22 2000-07-11 Computer Methods Corporation Active integrated circuit transponder and sensor apparatus for transmitting vehicle tire parameter data
US5690773A (en) * 1994-02-24 1997-11-25 Gemplus Card International Method for the manufacture of a contact-free or hybrid card
US5879502A (en) * 1994-05-27 1999-03-09 Gustafson; Ake Method for making an electronic module and electronic module obtained according to the method
US5731754A (en) * 1994-06-03 1998-03-24 Computer Methods Corporation Transponder and sensor apparatus for sensing and transmitting vehicle tire parameter data
US5462622A (en) * 1994-06-09 1995-10-31 Illinois Tool Works Inc. Molding an electrical element within a premold element and an overmold element to provide a one-piece component
US5574470A (en) * 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method
US5800763A (en) * 1994-10-06 1998-09-01 Giesecke & Devrient Gmbh Method for producing data carriers with embedded elements
US5840148A (en) * 1995-06-30 1998-11-24 Bio Medic Data Systems, Inc. Method of assembly of implantable transponder
US6534711B1 (en) * 1998-04-14 2003-03-18 The Goodyear Tire & Rubber Company Encapsulation package and method of packaging an electronic circuit module
US6031459A (en) * 1998-07-22 2000-02-29 Micron Technology, Inc. Wireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devices
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6285561B1 (en) * 1998-12-18 2001-09-04 U.S. Philips Corporation Data carrier module device having integrated circuit and transmission coil connection contacts covered by a common protective cap
US6441741B1 (en) * 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
US6518600B1 (en) * 2000-11-17 2003-02-11 General Electric Company Dual encapsulation for an LED

Cited By (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070096983A1 (en) * 2003-12-05 2007-05-03 Salvatore Sabina Railway beacon and related production method
US7639160B2 (en) 2003-12-05 2009-12-29 Ansaldo Sts S.P.A. Railway beacon and related production method
WO2005054030A1 (en) * 2003-12-05 2005-06-16 Ansaldo Segnalamento Ferroviario S.P.A. Railway beacon and related production method
US20100064504A1 (en) * 2003-12-05 2010-03-18 Salvatore Sabina Railway beacon and related production method
US7240847B2 (en) 2004-03-10 2007-07-10 Infineon Technologies Ag Chip card
US20050199734A1 (en) * 2004-03-10 2005-09-15 Infineon Technologies Ag Chip card
FR2867589A1 (en) * 2004-03-10 2005-09-16 Infineon Technologies Ag Manufacture of non-contacting chip card, includes assembly of recessed plastic substrate, antenna coil and chip followed by over-injection molding
EP1583029A1 (en) * 2004-03-31 2005-10-05 Satoh Gosei Co., Ltd. Information recording member resin-enclosed tag and its manufacturing method
US20110094134A1 (en) * 2004-10-25 2011-04-28 Van Wijk Antoon Identification device and method for manufacturing thereof
US9005505B2 (en) * 2004-10-25 2015-04-14 Allflex Europe Sas Identification device and method for manufacturing thereof
US8528190B2 (en) 2004-11-10 2013-09-10 Enpirion, Inc. Method of manufacturing a power module
US20060096088A1 (en) * 2004-11-10 2006-05-11 Lotfi Ashraf W Method of manufacturing an encapsulated package for a magnetic device
US8043544B2 (en) 2004-11-10 2011-10-25 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
US7426780B2 (en) * 2004-11-10 2008-09-23 Enpirion, Inc. Method of manufacturing a power module
US7462317B2 (en) 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
US20060096087A1 (en) * 2004-11-10 2006-05-11 Lotfi Ashraf W Method of manufacturing a power module
US20090065964A1 (en) * 2004-11-10 2009-03-12 Lotfi Ashraf W Method of Manufacturing an Encapsulated Package for a Magnetic Device
US20100176905A1 (en) * 2005-10-05 2010-07-15 Lotfi Ashraf W Magnetic Device Having a Conductive Clip
US8631560B2 (en) 2005-10-05 2014-01-21 Enpirion, Inc. Method of forming a magnetic device having a conductive clip
US8701272B2 (en) 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
US20070075815A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Method of forming a magnetic device having a conductive clip
US8384506B2 (en) 2005-10-05 2013-02-26 Enpirion, Inc. Magnetic device having a conductive clip
US20070074386A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Method of forming a power module with a magnetic device having a conductive clip
US20070075817A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Magnetic device having a conductive clip
US7688172B2 (en) 2005-10-05 2010-03-30 Enpirion, Inc. Magnetic device having a conductive clip
US8139362B2 (en) 2005-10-05 2012-03-20 Enpirion, Inc. Power module with a magnetic device having a conductive clip
US20070075816A1 (en) * 2005-10-05 2007-04-05 Lotfi Ashraf W Power module with a magnetic device having a conductive clip
EP1850276A1 (en) * 2006-04-25 2007-10-31 Id-Systec Gmbh In-mould label
US9086357B2 (en) * 2006-12-06 2015-07-21 Abb Limited Conductivity sensor
US20100292944A1 (en) * 2006-12-06 2010-11-18 Colin Howell Conductivity sensor
US9651511B2 (en) 2006-12-06 2017-05-16 Abb Limited Conductivity sensor
US20090066467A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Micromagnetic Device and Method of Forming the Same
US7920042B2 (en) 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US20090066300A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Power Converter Employing a Micromagnetic Device
US7952459B2 (en) 2007-09-10 2011-05-31 Enpirion, Inc. Micromagnetic device and method of forming the same
US7955868B2 (en) 2007-09-10 2011-06-07 Enpirion, Inc. Method of forming a micromagnetic device
US20110181383A1 (en) * 2007-09-10 2011-07-28 Lotfi Ashraf W Micromagnetic Device and Method of Forming the Same
US8018315B2 (en) 2007-09-10 2011-09-13 Enpirion, Inc. Power converter employing a micromagnetic device
US8618900B2 (en) 2007-09-10 2013-12-31 Enpirion, Inc. Micromagnetic device and method of forming the same
US8133529B2 (en) 2007-09-10 2012-03-13 Enpirion, Inc. Method of forming a micromagnetic device
US20090068400A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Micromagnetic Device and Method of Forming the Same
US7544995B2 (en) 2007-09-10 2009-06-09 Enpirion, Inc. Power converter employing a micromagnetic device
US8339232B2 (en) 2007-09-10 2012-12-25 Enpirion, Inc. Micromagnetic device and method of forming the same
US9299489B2 (en) 2007-09-10 2016-03-29 Enpirion, Inc. Micromagnetic device and method of forming the same
US20090068761A1 (en) * 2007-09-10 2009-03-12 Lotfi Ashraf W Method of Forming a Micromagnetic Device
US8248240B2 (en) 2007-09-28 2012-08-21 Fujitsu Limited RFID tag and manufacturing method thereof
US20090085747A1 (en) * 2007-09-28 2009-04-02 Fujitsu Limited Rfid tag and manufacturing method thereof
US8686698B2 (en) 2008-04-16 2014-04-01 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8541991B2 (en) 2008-04-16 2013-09-24 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8692532B2 (en) 2008-04-16 2014-04-08 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US9246390B2 (en) 2008-04-16 2016-01-26 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8339802B2 (en) 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8153473B2 (en) 2008-10-02 2012-04-10 Empirion, Inc. Module having a stacked passive element and method of forming the same
US20100087036A1 (en) * 2008-10-02 2010-04-08 Lotfi Ashraf W Module having a stacked passive element and method of forming the same
US20100212150A1 (en) * 2008-10-02 2010-08-26 Lotfi Ashraf W Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same
US9054086B2 (en) 2008-10-02 2015-06-09 Enpirion, Inc. Module having a stacked passive element and method of forming the same
US20100084750A1 (en) * 2008-10-02 2010-04-08 Lotfi Ashraf W Module having a stacked passive element and method of forming the same
US20100214746A1 (en) * 2008-10-02 2010-08-26 Lotfi Ashraf W Module Having a Stacked Magnetic Device and Semiconductor Device and Method of Forming the Same
US8266793B2 (en) 2008-10-02 2012-09-18 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8698463B2 (en) 2008-12-29 2014-04-15 Enpirion, Inc. Power converter with a dynamically configurable controller based on a power conversion mode
US9548714B2 (en) 2008-12-29 2017-01-17 Altera Corporation Power converter with a dynamically configurable controller and output filter
US20100164449A1 (en) * 2008-12-29 2010-07-01 Mirmira Ramarao Dwarakanath Power Converter with a Dynamically Configurable Controller and Output Filter
US8643492B2 (en) 2009-04-08 2014-02-04 Sabic Innovative Plastics Ip B.V. Encapsulated RFID tags and methods of making same
US8325047B2 (en) 2009-04-08 2012-12-04 Sabic Innovative Plastics Ip B.V. Encapsulated RFID tags and methods of making same
US8867295B2 (en) 2010-12-17 2014-10-21 Enpirion, Inc. Power converter for a memory module
US9627028B2 (en) 2010-12-17 2017-04-18 Enpirion, Inc. Power converter for a memory module
US20130221109A1 (en) * 2012-02-24 2013-08-29 Mitomo Corporation Wireless ic tag, process for manufacturing the same, and die for molding wireless ic tag
US9509217B2 (en) 2015-04-20 2016-11-29 Altera Corporation Asymmetric power flow controller for a power converter and method of operating the same
WO2016187503A1 (en) * 2015-05-21 2016-11-24 Texas Nameplate Company, Inc. Method and system for securing a tracking device to a component
US20160370813A1 (en) * 2015-06-19 2016-12-22 Phillips & Temro Industries Inc. Thermostat Assembly and Method of Manufacturing

Also Published As

Publication number Publication date Type
EP1052595B1 (en) 2001-09-19 grant
EP1052595A1 (en) 2000-11-15 application
US6687131B1 (en) 2004-02-03 grant
JP2001024550A (en) 2001-01-26 application

Similar Documents

Publication Publication Date Title
US5612532A (en) Thin IC card and method for producing the same
US6139304A (en) Mold for injection molding encapsulation over small device on substrate
US4680617A (en) Encapsulated electronic circuit device, and method and apparatus for making same
US5057679A (en) Technique for attaching an electronic module to a card body to form an electronic memory card
US5677511A (en) Overmolded PC board with ESD protection and EMI suppression
US4990759A (en) Chip card structure
US6206291B1 (en) Flat card having internal relief and incorporating at least one electronic element
US6462273B1 (en) Semiconductor card and method of fabrication
US5926696A (en) Ball grid array plastic package
US5637858A (en) Method for producing identity cards
US4816426A (en) Process for manufacturing plastic pin grid arrays and the product produced thereby
US5962840A (en) Data carrier with electronic module and embedded coil feature
US20070105616A1 (en) Chip with insert including an electronic microchip
US6388636B1 (en) Circuit module
US6025054A (en) Smart cards having glue-positioned electronic components
US4755661A (en) Connection of electronic components in a card
US5350553A (en) Method for the manufacture of a decorated chip card
US5955021A (en) Method of making smart cards
US6803114B1 (en) Manufacturing process for laminated cards with intermediate PETG layer
US20070235548A1 (en) Electronic inlay module used for electronic cards and tags
US5173840A (en) Molded ic card
US3637994A (en) Active electrical card device
US7017822B2 (en) Low cost RFID antenna manufactured from conductive loaded resin-based materials
US6404643B1 (en) Article having an embedded electronic device, and method of making same
US5588202A (en) Method for manufacturing an overmolded sensor