New! View global litigation for patent families

US20020176993A1 - Smoothing and barrier layers on high tg substrates - Google Patents

Smoothing and barrier layers on high tg substrates Download PDF

Info

Publication number
US20020176993A1
US20020176993A1 US09553191 US55319100A US2002176993A1 US 20020176993 A1 US20020176993 A1 US 20020176993A1 US 09553191 US09553191 US 09553191 US 55319100 A US55319100 A US 55319100A US 2002176993 A1 US2002176993 A1 US 2002176993A1
Authority
US
Grant status
Application
Patent type
Prior art keywords
barrier
substrate
polymer
layers
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US09553191
Other versions
US6492026B1 (en )
Inventor
Gordon L Graff
Mark E Gross
Ming K Shi
Michael G Hall
Peter M Martin
Eric S Mast
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Battelle Memorial Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/60Deposition of organic layers from vapour phase
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/325Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers
    • B32B7/04Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers characterised by the connection of layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers
    • B32B7/04Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers characterised by the connection of layers
    • B32B7/12Layered products characterised by the relation between layers, i.e. products comprising layers having different physical properties and products characterised by the interconnection of layers characterised by the connection of layers using an adhesive, i.e. any interposed material having adhesive or bonding properties
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • H01L51/5256Protective coatings having repetitive multilayer structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/41Opaque
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/724Permeability to gases, adsorption
    • B32B2307/7242Non-permeable
    • B32B2307/7244Oxygen barrier
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/724Permeability to gases, adsorption
    • B32B2307/7242Non-permeable
    • B32B2307/7246Water vapor barrier
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00Polyalkenes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2369/00Polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2377/00Polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31507Of polycarbonate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31533Of polythioether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31667Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
    • Y10T428/31935Ester, halide or nitrile of addition polymer

Abstract

A high temperature substrate having improved properties. The substrate is a polymer substrate having a glass transition temperature greater than about 120° C., and at least one first barrier stack adjacent to the polymer substrate. The barrier stack includes at least one first barrier layer and at least one first polymer layer. A method for making the high temperature substrate with improved properties is also disclosed.

Description

    BACKGROUND OF THE INVENTION
  • [0001]
    The present invention relates generally to polymer substrates, and more particularly to high temperature polymer substrates having improved properties.
  • [0002]
    There is a need for versatile visual display devices for electronic products of many different types. Although many current displays use glass substrates, there is a trend toward the use of plastic substrates. Plastic substrates are critical to future generations of electronic products and associated technologies because they are light weight, impact resistant, and cost effective. However, temperature limitations and gas and liquid permeation limitations of plastics have prevented their use in most displays.
  • [0003]
    Many processes in the manufacture of displays, such as flat panel displays, require relatively high temperatures that cannot be tolerated by most polymer substrates. For example, the recrystallization of amorphous Si to poly-Si in thin film transistors requires substrate temperatures of at least 160°-250° C., even with pulsed excimer laser anneals. The conductivity of the transparent electrode, which is typically made of indium tin oxide, is greatly improved if deposition occurs above 220° C. Polyimide curing generally requires temperatures of 250° C. In addition, many of the photolithographic process steps for patterning electrodes are operated in excess of 120° C. to enhance processing speeds in the fabrication. These processes are used extensively in the manufacture of display devices, and they have been optimized on glass and silicon substrates. The high temperatures needed for the processes can deform and damage a plastic substrate, and subsequently destroy the display. If displays are to be manufactured on flexible plastic materials, the plastic must be able to withstand the process conditions, including high temperatures over 100° C., harsh chemicals, and mechanical damage.
  • [0004]
    Flexible plastic materials having a high glass transition temperature hold great promise for use in displays. As used herein, the term polymers having a high glass transition temperature is defined as those with a glass transition temperature greater than about 120° C., preferably greater than about 150° C., and most preferably greater than about 200° C. Examples of such polymers include, but are not limited to, polynorbornene (Tg: 320° C.), polyimide (Tg: 270-388° C.), polyethersulphone (Tg: 184-230° C.), polyetherimide, (Tg: 204-299° C.), polyarylate (Tg: 148-245° C.), polycarbonate (Tg: 150° C.), and a high glass transition temperature cyclic olefin polymer (Tg: 171° C., sold under the trade name Transphan™, available from Lofo High Tech Film, GMBH of Weil am Rhein, Germany). Because of their temperature stability and high glass transition temperature, these materials offer promise in overcoming the temperature limitations of existing commodity polymers, such as polyethylene terephthalate (Tg: 78° C.), and polyethylene naphthanate (Tg: 120° C.).
  • [0005]
    However, polymers having high glass transition temperatures are often inherently mechanically weak, easily scratched, low in chemical resistance, and possess high oxygen and water permeability. Their poor properties make processing difficult. In addition, their high oxygen and water permeation rates, and poor surface finish preclude their use as substrates for sensitive display devices.
  • [0006]
    Many different display devices are presently being used, including liquid crystal displays (LCDs), light emitting diodes (LEDs), light emitting polymers (LEPs), electronic signage using electrophoretic inks, electroluminescent devices (EDs), and phosphorescent devices. Many of these display devices are environmentally sensitive. As used herein, the term environmentally sensitive display device means display devices which are subject to degradation caused by permeation of environmental gases or liquids, such as oxygen and water vapor in the atmosphere or chemicals used in the processing of the electronic product.
  • [0007]
    The gas and liquid permeation resistance of plastics is poor, often several orders of magnitude below what is required for sustained device performance. For example, the oxygen and water vapor permeation rates for polynorbornene and Transphan™ are over 1000 cc/m2/day (at 23° C.). The rate required to provide a sufficient lifetime for an organic light emitting device has been calculated to be approximately 106 cc/m2/day (at 23° C.). The environmental sensitivity of the display devices limits the lifetime, reliability, and performance of devices constructed on plastics, which has retarded the development of display devices made with plastic substrates.
  • [0008]
    Thus, there is a need for a high temperature substrate having improved properties, including ultra-low gas and liquid permeation, scratch resistance, and chemical resistance, which can be used as a support for display devices, and for methods for making such substrates.
  • SUMMARY OF THE INVENTION
  • [0009]
    The present invention meets these need by providing a high temperature substrate having improved properties and a method for making such a substrate. The substrate includes a polymer substrate having a glass transition temperature greater than about 120° C., and at least one first barrier stack adjacent to the polymer substrate. The barrier stack includes at least one first barrier layer and at least one first polymer layer. The high temperature substrate optionally includes an environmentally sensitive display device adjacent to the first barrier stack and at least one second barrier stack adjacent to the environmentally sensitive display device. By adjacent, we mean next to but not necessarily directly next to. There can be additional layers intervening between the adjacent layers. The second barrier stack includes at least one second barrier layer and at least one second polymer layer.
  • [0010]
    Preferably, either one or both of the first and second barrier layers of the first and second barrier stacks is substantially transparent. At least one of the first barrier layers preferably comprises a material selected from metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof.
  • [0011]
    Either one of the first and second barrier layers can be substantially opaque, if desired. The opaque barrier layers are preferably selected from opaque metals, opaque polymers, opaque ceramics, and opaque cermets.
  • [0012]
    The polymer layers of the first and second barrier stacks are preferably acrylate-containing polymers. As used herein, the term acrylate-containing polymers includes acrylate-containing polymers, methacrylate-containing polymers, and combinations thereof. The polymer layers in the first and/or the second barrier stacks can be the same or different.
  • [0013]
    The high temperature substrate can include additional layers if desired, such as polymer smoothing layers, scratch resistant layers, antireflective coatings, or other functional layers.
  • [0014]
    The present invention also involves a method of making the high temperature substrate having improved properties. The method includes providing a polymer substrate having a glass transition temperature greater than about 120° C., and placing at least one first barrier stack on the polymer substrate. The barrier stack includes at least one first barrier layer and at least one first polymer layer.
  • [0015]
    The barrier stack can be placed on the substrate by deposition or by lamination. The deposition is preferably vacuum deposition, and the lamination can be performed using an adhesive, solder, ultrasonic welding, pressure, or heat.
  • [0016]
    An environmentally sensitive display device can be placed on the first barrier stack, either by deposition or lamination. A second barrier stack can be placed on the environmentally sensitive display device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. The second barrier stack can be deposited on the environmentally sensitive display device, preferably by vacuum deposition.
  • [0017]
    Accordingly, it is an object of the present invention to provide a high temperature substrate having improved properties, and to provide a method of making such a substrate.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0018]
    [0018]FIG. 1 is a cross-section of one embodiment of the high temperature substrate of the present invention.
  • [0019]
    [0019]FIG. 2 is a cross-section of an encapsulated display device using the high temperature substrate of the present invention.
  • DESCRIPTION OF THE INVENTION
  • [0020]
    One embodiment of the encapsulated display device of the present invention is shown in FIG. 1. The high temperature coated substrate 100 includes a substrate 105, a polymer smoothing layer 110, and a first barrier stack 115. The first barrier stack 115 includes a barrier layer 120 and a polymer layer 125. The first barrier stack 115 prevents environmental oxygen and water vapor from permeating through the substrate 105.
  • [0021]
    The substrate 105 is made of a polymer having a glass transition temperature greater than about 120° C., preferably greater than about 150° C., and more preferably greater than 200° C. Examples of such polymers include, but are not limited to, polynorbornene, polyimide, polyethersulfone, polyetherimide, polyarylate, polycarbonate, and high glass transition temperature cyclic olefin polymers.
  • [0022]
    In each barrier stack 115, there can be one or more barrier layers 120 and one or more polymer layers 125. The barrier layers and polymer layers in the barrier stack can be made of the same material or of a different material. The barrier layers are typically about 100-400 Å thick, and the polymer layers are typically about 1000-10,000 Å thick.
  • [0023]
    Although FIG. 1 shows a barrier stack with a single barrier layer and a single polymer layer, the barrier stacks can have one or more polymer layers and one or more barrier layers. There could be one polymer layer and one barrier layer, there could be one or more polymer layers on one side of one or more barrier layers, or there could be one or more polymer layers on both sides of one or more barrier layers. The important feature is that the barrier stack have at least one polymer layer and at least one barrier layer.
  • [0024]
    There can be additionai overcoat layers on top of the barrier stack, such as organic or inorganic layers, planarizing layers, transparent conductors, antireflective coatings, or other functional layers, if desired.
  • [0025]
    An encapsulated display device made with the high temperature substrate of the present invention is shown in FIG. 2. The encapsulated display device 200 has a substrate 205, as described above. On top of the substrate 205, there is a polymer smoothing layer 210. The polymer smoothing layer 210 decreases surface roughness, and encapsulates surface defects, such as pits, scratches, and digs. This produces a planarized surface which is ideal for deposition of subsequent layers. Depending on the desired application, there can be additional layers deposited on the substrate 205, such as organic or inorganic layers, planarizing layers, electrode layers, scratch resistant layers, antireflective coatings, and other functional layers. In this way, the substrate can be specifically tailored to different applications.
  • [0026]
    The first barrier stack 215 is above the polymer smoothing layer 210. The first barrier stack 215 includes a first barrier layer 220 and a first polymer layer 225. The first barrier layer 220 includes barrier layers 230 and 235. Barrier layers 230 and 235 can be made of the same barrier material or of different barrier materials.
  • [0027]
    An environmentally sensitive display device 240 is placed over the first barrier stack 215. The environmentally sensitive display device 240 can be any display device which is environmentally sensitive. Examples of environmentally sensitive display devices include, but are not limited to liquid crystal displays (LCDs), light emitting diodes (LEDs), light emitting polymers (LEPs), electronic signage using electrophoretic inks, electroluminescent devices (EDs), and phosphorescent devices. These display devices can be made using known techniques, such as those described in U.S. Pat. Nos. 6,025,899, 5,995,191, 5,994,174, 5,956,112 (LCDs); U.S. Pat. Nos. 6,005,692, 5,821,688, 5,747,928 (LEDs); U.S. Pat. Nos. 5,969,711, 5,961,804, 4,026,713 (E Ink); U.S. Pat. Nos. 6,023,373, 6,023,124, 6,023,125 (LEPs); and U.S. Pat. Nos. 6,023,073, 6,040,812, 6,019,654, 6,018,237, 6,014,119, 6,010,796 (EDs), which are incorporated herein by reference.
  • [0028]
    There is a second barrier stack 245 placed over the environmentally sensitive display device 240 to encapsulate it. The second barrier stack 245 has a second barrier layer 250 and a second polymer layer 255, although it can have one or more barrier layers and one or more polymer layers, as discussed above. The barrier layers and polymer layers in the first and second barrier stacks can be the same or they can be different.
  • [0029]
    Although only one first barrier stack and only one second barrier stack are shown in FIG. 2, the number of barrier stacks is not limited. The number of barrier stacks needed depends on the substrate material used and the level of permeation resistance needed for the particular application. One or two barrier stacks should provide sufficient barrier properties for some applications. The most stringent applications may require five or more barrier stacks.
  • [0030]
    There is optionally a lid 260 over the second barrier stack 245. The lid can be can be rigid or flexible. It is preferably made of the same materials as the substrate 205. Alternatively, flexible lids could be made of any flexible material, including, but not limited to other polymers, metal, paper, fabric, and combinations thereof. Rigid substrates are preferably ceramics, metal, or semiconductors.
  • [0031]
    The method of making the high temperature substrate with improved properties will be described with reference to the embodiment shown in FIG. 2. Any initial layers which are desired, such as scratch resistant layers, planarizing layers, electrically conductive layers, etc., can be coated, deposited, or otherwise placed on the substrate. A polymer smoothing layer is preferably included to provide a smooth base for the remaining layers. It can be formed by depositing a layer of polymer, for example, an acrylate-containing polymer, onto the substrate or previous layer. The polymer layer can be deposited in vacuum or by using atmospheric processes such as spin coating and/or spraying. Preferably, an acrylate-containing monomer, oligomer, or resin is deposited and then polymerized in situ to form the polymer layer. As used herein, the term acrylate-containing monomer, oligomer, or resin includes acrylate-containing monomers, oligomers, and resins, methacrylate-containing monomers, oligomers, and resins, and combinations thereof.
  • [0032]
    The first barrier stack is then placed on the substrate. The first and second barrier stacks include at least one barrier layer and at least one polymer layer. The barrier stacks are preferably made by vacuum deposition. The barrier layer can be vacuum deposited onto the polymer smoothing layer, substrate, or previous layer. The polymer layer is then deposited on the barrier layer, preferably by flash evaporating acrylate-containing monomers, oligomers, or resins, condensing on the barrier layer, and polymerizing in situ in a vacuum chamber. U.S. Pat. Nos. 5,440,446 and 5,725,909, which are incorporated herein by reference, describe methods of depositing thin film, barrier stacks.
  • [0033]
    Vacuum deposition includes flash evaporation of acrylate-containing monomer, oligomer, or resin with in situ polymerization under vacuum, plasma deposition and polymerization of acrylate-containing monomer, oligomer, or resin, as well as vacuum deposition of the barrier layers by sputtering, chemical vapor deposition, plasma enhanced chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma enhanced vapor deposition (ECR-PECVD), and combinations thereof.
  • [0034]
    In order to protect the integrity of the barrier layer, the formation of defects and/or microcracks in the deposited layer subsequent to deposition and prior to downstream processing should be avoided. The encapsulated display device is preferably manufactured so that the barrier layers are not directly contacted by any equipment, such as rollers in a web coating system, to avoid defects that may be caused by abrasion over a roll or roller. This can be accomplished by designing the deposition system such that the barrier layers are always covered by polymer layers prior to contacting or touching any handling equipment.
  • [0035]
    The environmentally sensitive display device is then placed on the first barrier layer. The environmentally sensitive display device can be placed on the substrate by deposition, such as vacuum deposition. Alternatively it can be placed on the substrate by lamination. The lamination can use an adhesive, glue, or the like, or heat to seal the environmentally sensitive display device to the substrate.
  • [0036]
    The second barrier stack is then placed over the environmentally sensitive display device to encapsulate it. The second barrier stack can be placed over the environmentally sensitive display device by deposition or lamination.
  • [0037]
    The barrier layers in the first and second barrier stacks may be any barrier material. The barrier layers in the first and second barrier stacks can be made of the same material or a different material. In addition, multiple barrier layers of the same or different barrier materials can be used in a barrier stack.
  • [0038]
    The barrier layers can be transparent or opaque, depending on the design and application of the display device. Preferred transparent barrier materials include, but are not limited to, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof. The metal oxides are preferably selected from silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof. The metal nitrides are preferably selected from aluminum nitride, silicon nitride, boron nitride, and combinations thereof. The metal oxynitrides are preferably selected from aluminum oxynitride, silicon oxynitride, boron oxynitride, and combinations thereof.
  • [0039]
    For most devices, only one side of the device must be transparent. Therefore, opaque barrier layers can be used in some barrier stacks depending on the design of the display device. Opaque barrier materials include, but are not limited to, metals, ceramics, polymers, and cermets. Examples of opaque cermets include, but are not limited to, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, niobium nitride, tungsten disilicide, titanium diboride, and zirconium diboride.
  • [0040]
    The polymer layers of the first and second barrier stacks are preferably acrylate-containing monomers, oligomers, or resins. The polymer layers in the first and second barrier stacks can be the same or different. In addition, the polymer layers within each barrier stack can be the same or different.
  • [0041]
    In a preferred embodiment, the barrier stack includes a polymer layer and two barrier layers. The two barrier layers can be made from the same barrier material or from different barrier materials. The thickness of each barrier layer in this embodiment is about one half the thickness of the single barrier layer, or about 50 to 200 Å. There are no limitations on the thickness, however.
  • [0042]
    When the barrier layers are made of the same material, they can be deposited either by sequential deposition using two sources or by the same source using two passes. If two deposition sources are used, deposition conditions can be different for each source, leading to differences in microstructure and defect dimensions. Any type of deposition source can be used. Different types of deposition processes, such as magnetron sputtering and electron beam evaporation, can be used to deposit the two barrier layers.
  • [0043]
    The microstructures of the two barrier layers are mismatched as a result of the differing deposition sources/parameters. The barrier layers can even have different crystal structure. For example, Al2O3 can exist in different phases (alpha, gamma) with different crystal orientations. The mismatched microstructure can help decouple defects in the adjacent barrier layers, enhancing the tortuous path for gases and water vapor permeation.
  • [0044]
    When the barrier layers are made of different materials, two deposition sources are needed. This can be accomplished by a variety of techniques. For example, if the materials are deposited by sputtering, sputtering targets of different compositions could be used to obtain thin films of different compositions. Alternatively, two sputtering targets of the same composition could be used but with different reactive gases. Two different types of deposition sources could also be used. In this arrangement, the lattices of the two layers are even more mismatched by the different microstructures and lattice parameters of the two materials.
  • [0045]
    A single pass, roll-to-roll, vacuum deposition of a three layer combination on a PET substrate, i.e., PET substrate/polymer layer/barrier layer/polymer layer, can be more than five orders of magnitude less permeable to oxygen and water vapor than a single oxide layer on PET alone. See J. D. Affinito, M. E. Gross, C. A. Coronado, G. L. Graff, E. N. Greenwell, and P. M. Martin, Polymer-Oxide Transparent Barrier Layers Produced Using PML Process, 39th Annual Technical Conference Proceedings of the Society of Vacuum Coaters, Vacuum Web Coating Session, 1996, pages 392-397; J. D. Affinito, S. Eufinger, M. E. Gross, G. L. Graff, and P. M. Martin, PML/Oxide/PML Barrier Layer Performance Differences Arising From Use of UV or Electron Beam Polymerization of the PML Layers, Thin Solid Films, Vol.308, 1997, pages 19-25. This is in spite of the fact that the effect on the permeation rate of the polymer multilayers (PML) layers alone, without the barrier layer (oxide, metal, nitride, oxynitride) layer, is barely measurable. It is believed that the improvement in barrier properties is due to two factors. First, permeation rates in the roll-to-roll coated oxide-only layers were found to be conductance limited by defects in the oxide layer that arose during deposition and when the coated substrate was wound up over system idlers/rollers. Asperities (high points) in the underlying substrate are replicated in the deposited inorganic barrier layer. These features are subject to mechanical damage during web handling/take-up, and can lead to the formation of defects in the deposited film. These defects seriously limit the ultimate barrier performance of the films. In the single pass, polymer/barrier/polymer process, the first acrylic layer planarizes the substrate and provides an ideal surface for subsequent deposition of the inorganic barrier thin film. The second polymer layer provides a robust “protective” film that minimizes damage to the barrier layer and also planarizes the structure for subsequent barrier layer (or environmentally sensitive display device) deposition. The intermediate polymer layers also decouple defects that exist in adjacent inorganic barrier layers, thus creating a tortuous path for gas diffusion.
  • [0046]
    The permeability of the barrier stacks used in the present invention is shown in Table 1. The barrier stacks of the present invention on polymeric substrates, such as PET, have measured oxygen transmission rate (OTR) and water vapor transmission rate (WVTR) values well below the detection limits of current industrial instrumentation used for permeation measurements (Mocon OxTran 2/20L and Permatran). Table 1 shows the OTR and WVTR values (measured according to ASTM F 1927-98 and ASTM F 1249-90, respectively) measured at Mocon (Minneapolis, Minn.) for several barrier stacks on PET and polynorbornene (PNB), along with some other measured values.
    TABLE 1
    Oxygen Permeation Water Vapor
    Rate Permeation
    (cc/m2/day) (g/m2/day)+
    Sample 23° C. 38° C. 23° C. 38° C.
    Native 7 mil PET 7.62
    Transphan ™ 1 >1000
    Native PNB1 >1000
    2-barrier stacks on PNB 1
    1-barrier stack <0.005 <0.005*   0.46+
    1-barrier stack with ITO <0.005 <0.005*  0.011+
    2-barrier stacks <0.005 <0.005* <0.005+
    2-barrier stacks with ITO <0.005 <0.005* <0.005+
    5-barrier stacks <0.005 <0.005* <0.005+
    5-barrier stacks with ITO <0.005 <0.005* <0.005+
  • [0047]
    As the data in Table 1 shows, the barrier stacks of the present invention provide oxygen and water vapor permeation rates several orders of magnitude better than PET alone. Typical permeation rates for other barrier coatings range from 0.1 to 1 cc/m2/day. The barrier stacks are extremely effective in preventing oxygen and water penetration to the underlying components, and substantially outperform other barrier coatings on the market.
  • [0048]
    Two barrier stacks were applied to the polynorbornene. At a temperature of 23° C., the two barrier stacks reduced the oxygen permeation rate from >1000 cc/m2/day to 1 cc/m2/day, an improvement of more than three orders of magnitude. The polynorbornene used in the preliminary evaluation was a prototype material and had very poor surface quality (pits, scratches, and other surface defects). It is believed that the oxygen and water vapor permeation rates can be reduced to <0.005 cc/m2/day by using a better quality substrate material and more barrier stacks.
  • [0049]
    The preferred deposition process is compatible with a wide variety of substrates. Because the preferred process involves flash evaporation of a monomer and magnetron sputtering, deposition temperatures are well below 100° C., and stresses in the coating can be minimized. Multilayer coatings can be deposited at high deposition rates. No harsh gases or chemicals are used, and the process can be scaled up to large substrates and wide webs. The barrier properties of the coating can be tailored to the application by controlling the number of layers, the materials, and the layer design.
  • [0050]
    The barrier stacks and polymer smoothing layers of the present invention have been shown to smooth substrate surfaces with submicron roughness effectively to a roughness of less than 10 Å. In addition, because they include crosslinked polymer layers and hard inorganic layers, the barrier stacks provide a degree of chemical resistance and scratch resistance to the substrate.
  • [0051]
    Thus, the present invention provides a substrate having a high glass transition temperature, a smooth surface, exceptional barrier properties, improved durability, improved chemical resistance, and improved scratch resistance. The high temperature substrate permits the production of an encapsulated environmentally sensitive display device.
  • [0052]
    While certain representative embodiments and details have been shown for purposes of illustrating the invention, it will be apparent to those skilled in the art that various changes in the compositions and methods disclosed herein may be made without departing from the scope of the invention, which is defined in the appended claims.

Claims (40)

    What is claimed is:
  1. 1. A high temperature substrate having improved properties comprising:
    a polymer substrate having a glass transition temperature greater than about 120° C.; and
    at least one first barrier stack comprising at least one first barrier layer and at least one first polymer layer, the at least one first barrier stack adjacent to the polymer substrate.
  2. 2. The high temperature substrate of claim 1 wherein the polymer substrate is selected from polynorbornene, polyamide, polyethersulfone, polyetherimide, polycarbonate, and high glass transition temperature cyclic olefin polymers.
  3. 3. The high temperature substrate of claim 1 wherein the at least one first barrier layer is substantially transparent.
  4. 4. The high temperature substrate of claim 1 wherein at least one of the at least one first barrier layers comprises a material selected from metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof.
  5. 5. The high temperature substrate of claim 4 wherein the metal oxides are selected from silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof.
  6. 6. The high temperature substrate of claim 4 wherein the metal nitrides are selected from aluminum nitride, silicon nitride, boron nitride, and combinations thereof.
  7. 7. The high temperature substrate of claim 4 wherein the metal oxynitrides are selected from aluminum oxynitride, silicon oxynitride, boron oxynitride, and combinations thereof.
  8. 8. The high temperature substrate of claim 1 wherein the at least one first barrier layer is substantially opaque.
  9. 9. The high temperature substrate of claim 1 wherein at least one of the at least one first barrier layers is selected from opaque metals, opaque polymers, opaque ceramics, and opaque cermets.
  10. 10. The high temperature substrate of claim 1 wherein at least one of the at least one first polymer layers comprises an acrylate-containing polymer.
  11. 11. The high temperature substrate of claim 1 further comprising a polymer smoothing layer adjacent to the polymer substrate.
  12. 12. The high temperature substrate of claim 1 wherein the at least one first barrier layer comprises two barrier layers.
  13. 13. The high temperature substrate of claim 1 wherein the oxygen transmission rate through the at least one first barrier stack is less than 0.005 cc/m2/day at 23° C. and 0% relative humidity.
  14. 14. The high temperature substrate of claim 1 wherein the oxygen transmission rate through the at least one first barrier stack is less than 0.005 cc/m2/day at 38° C. and 90% relative humidity.
  15. 15. The high temperature substrate of claim 1 wherein the water vapor transmission rate through the at least one first barrier stack is less than 0.005 g/m2/day at 38° C. and 100% relative humidity.
  16. 16. The high temperature substrate of claim 1 further comprising an environmentally sensitive display device adjacent to the at least one first barrier stack.
  17. 17. The high temperature substrate of claim 16 further comprising at least one second barrier stack comprising at least one second barrier layer and at least one second polymer layer, the at least one second barrier stack adjacent to the environmentally sensitive display device, wherein the at least one second barrier stack encapsulates the environmentally sensitive display device.
  18. 18. The high temperature substrate of claim 17 further comprising a lid adjacent to the at least one second barrier stack.
  19. 19. The high temperature substrate of claim 1 wherein the polymer substrate has a glass transition temperature greater than about 150° C.
  20. 20. The high temperature substrate of claim 1 wherein the polymer substrate has a glass transition temperature greater than about 200° C.
  21. 21. A method of making a high temperature substrate having improved properties comprising:
    providing a substrate having a glass transition temperature greater than about 120° C.; and
    placing at least one first barrier stack comprising at least one first barrier layer and at least one first polymer layer adjacent to the polymer substrate.
  22. 22. The method of claim 21 wherein the step of placing the at least one first barrier stack adjacent to the polymer substrate comprises depositing the at least one first barrier stack on the polymer substrate.
  23. 23. The method of claim 22 wherein the at least one first barrier stack is vacuum deposited.
  24. 24. The method of claim 22 wherein the at least one first barrier layer is vacuum deposited and the at least one first polymer layer is deposited.
  25. 25. The method of claim 21 wherein the step of placing the at least one first barrier stack adjacent to the polymer substrate comprises laminating the at least one first barrier stack on the polymer substrate.
  26. 26. The method of claim 25 wherein the at least one first barrier stack is laminated using an adhesive.
  27. 27. The method of claim 25 wherein the at least one first barrier stack is laminated using heat.
  28. 28. The method of claim 25 wherein the at least one first barrier stack is laminated using solder.
  29. 29. The method of claim 25 wherein the at least one first barrier stack is laminated using ultrasonic welding.
  30. 30. The method of claim 25 wherein the at least one first barrier stack is laminated using pressure.
  31. 31. The method of claim 21 further comprising placing an environmentally sensitive display device on the at least one first barrier stack.
  32. 32. The method of claim 31 wherein the step of placing the environmentally sensitive display device on the substrate comprises depositing the environmentally sensitive display device on the at least one first barrier stack.
  33. 33. The method of claim 32 wherein the environmentally sensitive display device is vacuum deposited.
  34. 34. The method of claim 31 wherein the step of placing the environmentally sensitive display device on the substrate comprises laminating the environmentally sensitive device on the substrate.
  35. 35. The method of claim 31 further comprising placing a second barrier stack comprising at least one second barrier layer and at least one second polymer layer on the substrate over the environmentally sensitive display device encapsulating the environmentally sensitive display device.
  36. 36. The method of claim 35 wherein the step of placing the at least one second barrier stack on the environmentally sensitive display device comprises depositing the at least one second barrier stack on the environmentally sensitive display device.
  37. 37. The method of claim 36 wherein the at least one second barrier stack is vacuum deposited.
  38. 38. The method of claim 36 wherein the at least one first barrier layer is vacuum deposited and the at least one first polymer layer is deposited.
  39. 39. The method of claim 21 wherein the polymer substrate has a glass transition temperature greater than about 150° C.
  40. 40. The method of claim 21 wherein the polymer substrate has a glass transition temperature greater than about 200° C.
US09553191 2000-04-20 2000-04-20 Smoothing and barrier layers on high Tg substrates Active US6492026B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09553191 US6492026B1 (en) 2000-04-20 2000-04-20 Smoothing and barrier layers on high Tg substrates

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US09553191 US6492026B1 (en) 2000-04-20 2000-04-20 Smoothing and barrier layers on high Tg substrates
CN 01811491 CN100365759C (en) 2000-04-20 2001-03-06 Smoothing and barrier layers on tg substrates
DE2001631390 DE60131390D1 (en) 2000-04-20 2001-03-06 Barrier layers on a substrate containing laminate
EP20010922271 EP1284835B1 (en) 2000-04-20 2001-03-06 Laminate comprising barrier layers on a substrate
DE2001631390 DE60131390T2 (en) 2000-04-20 2001-03-06 Barrier layers on a substrate containing laminate
PCT/US2001/007005 WO2001082336A3 (en) 2000-04-20 2001-03-06 Laminate comprising barrier layers on a substrate
JP2001579332A JP2003531745A (en) 2000-04-20 2001-03-06 Smooth layer and the barrier layer on the Tg substrate
JP2009244705A JP5367531B2 (en) 2000-04-20 2009-10-23 Smooth layer and the barrier layer on the Tg substrate
JP2012214994A JP5436640B2 (en) 2000-04-20 2012-09-27 Smooth layer and the barrier layer on the Tg substrate

Publications (2)

Publication Number Publication Date
US20020176993A1 true true US20020176993A1 (en) 2002-11-28
US6492026B1 US6492026B1 (en) 2002-12-10

Family

ID=24208472

Family Applications (1)

Application Number Title Priority Date Filing Date
US09553191 Active US6492026B1 (en) 2000-04-20 2000-04-20 Smoothing and barrier layers on high Tg substrates

Country Status (6)

Country Link
US (1) US6492026B1 (en)
EP (1) EP1284835B1 (en)
JP (3) JP2003531745A (en)
CN (1) CN100365759C (en)
DE (2) DE60131390D1 (en)
WO (1) WO2001082336A3 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040195967A1 (en) * 2003-04-02 2004-10-07 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20060240275A1 (en) * 2005-04-25 2006-10-26 Gadkaree Kishor P Flexible display substrates
US20070059491A1 (en) * 2003-03-31 2007-03-15 Sayaka Kawashima Gas barrier substrate
US20100068542A1 (en) * 2006-12-29 2010-03-18 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid films
US20100068382A1 (en) * 2006-12-29 2010-03-18 Strobel Mark A Method of curing metal alkoxide-containing films
US20100090218A1 (en) * 2008-10-10 2010-04-15 Jiro Tsukahara Sealed device
US20100196679A1 (en) * 2007-07-31 2010-08-05 Sumitomo Chemcial Company Limited Barrier layer-attached substrate, display component, and method for manufacturing display component
US20120135212A1 (en) * 2010-11-26 2012-05-31 Hon Hai Precision Industry Co., Ltd. Coated article and method for making same
US8236424B2 (en) 2003-05-15 2012-08-07 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
US20140283910A1 (en) * 2011-08-04 2014-09-25 3M Innovative Properties Company Edge protected barrier assemblies
US8846169B2 (en) 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
US9362527B2 (en) 2012-02-15 2016-06-07 Konica Minolta, Inc. Functional film having a hybrid layer of polysiloxane and fine resin particles
US9481927B2 (en) 2008-06-30 2016-11-01 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid barrier films

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040241454A1 (en) * 1993-10-04 2004-12-02 Shaw David G. Barrier sheet and method of making same
WO2000026973A1 (en) 1998-11-02 2000-05-11 Presstek, Inc. Transparent conductive oxides for plastic flat panel displays
US6228434B1 (en) 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making a conformal coating of a microtextured surface
US6573652B1 (en) 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US8853696B1 (en) 1999-06-04 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and electronic device
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6762124B2 (en) * 2001-02-14 2004-07-13 Avery Dennison Corporation Method for patterning a multilayered conductor/substrate structure
JP4147008B2 (en) * 2001-03-05 2008-09-10 株式会社日立製作所 Films and organic el element used for organic el element
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
US7045438B2 (en) * 2001-07-27 2006-05-16 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, semiconductor device, and method of fabricating the devices
JP5057619B2 (en) 2001-08-01 2012-10-24 株式会社半導体エネルギー研究所 A method for manufacturing a semiconductor device
KR100884053B1 (en) * 2001-08-10 2009-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method of peeling off and method of manufacturing semiconductor device
US7351300B2 (en) 2001-08-22 2008-04-01 Semiconductor Energy Laboratory Co., Ltd. Peeling method and method of manufacturing semiconductor device
KR100944886B1 (en) 2001-10-30 2010-03-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 A method of manufacturing a semiconductor device
US7335573B2 (en) 2001-11-30 2008-02-26 Semiconductor Energy Laboratory Co., Ltd. Vehicle, display device and manufacturing method for a semiconductor device
US6853785B2 (en) 2001-12-14 2005-02-08 3M Innovative Properties Co. Index modulation in glass using a femtosecond laser
JP2003282238A (en) * 2002-03-25 2003-10-03 Pioneer Electronic Corp Organic electroluminescence display panel and its manufacturing method
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US20040166335A1 (en) * 2002-08-06 2004-08-26 O'regan Marie B. Laminated polymer with integrated lighting, sensors and electronics
US6933051B2 (en) 2002-08-17 2005-08-23 3M Innovative Properties Company Flexible electrically conductive film
US7215473B2 (en) * 2002-08-17 2007-05-08 3M Innovative Properties Company Enhanced heat mirror films
US6929864B2 (en) 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
US8691371B2 (en) * 2002-09-11 2014-04-08 General Electric Company Barrier coating and method
US7015640B2 (en) 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
WO2004040648A1 (en) 2002-10-30 2004-05-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
DE10255822B4 (en) * 2002-11-29 2004-10-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. A method for the vapor deposition of band-shaped substrates with a transparent barrier layer of aluminum oxide
CA2509402A1 (en) * 2002-12-20 2004-07-08 Ifire Technology Corp. Barrier layer for thick film dielectric electroluminescent displays
JP4617086B2 (en) * 2003-09-26 2011-01-19 大日本印刷株式会社 Flame-retardant films and residential interior material using the same, electrical products or printing film
US7635525B2 (en) * 2003-09-30 2009-12-22 Fujifilm Corporation Gas barrier laminate film and method for producing the same
US7297414B2 (en) * 2003-09-30 2007-11-20 Fujifilm Corporation Gas barrier film and method for producing the same
JP4233433B2 (en) * 2003-11-06 2009-03-04 シャープ株式会社 Method for manufacturing a display device
JP4313221B2 (en) * 2004-02-17 2009-08-12 富士フイルム株式会社 Gas barrier film
US20050181212A1 (en) * 2004-02-17 2005-08-18 General Electric Company Composite articles having diffusion barriers and devices incorporating the same
US20050202263A1 (en) * 2004-03-09 2005-09-15 Jonathan Sargent Barrier layer to prevent the loss of additives in an underlying layer
US20050228465A1 (en) * 2004-04-09 2005-10-13 Christa Harris Thermal device for activatable thermochemical compositions
KR100615229B1 (en) * 2004-06-29 2006-08-25 삼성에스디아이 주식회사 Thin film transistor, flat panel display device therewith, method of manufacturing that thin film transistor
US8704211B2 (en) * 2004-06-30 2014-04-22 General Electric Company High integrity protective coatings
US20060063015A1 (en) * 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
JP4716773B2 (en) * 2005-04-06 2011-07-06 富士フイルム株式会社 Gas barrier film and organic device using the same
US20070020451A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20070040501A1 (en) 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US7678701B2 (en) * 2006-07-31 2010-03-16 Eastman Kodak Company Flexible substrate with electronic devices formed thereon
US7977170B2 (en) * 2006-10-03 2011-07-12 Eastman Kodak Company Flexible substrate with electronic devices and traces
US8115326B2 (en) 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
JP5519293B2 (en) 2006-12-28 2014-06-11 スリーエム イノベイティブ プロパティズ カンパニー Nucleation layer for the thin metal layer formed
US8241713B2 (en) * 2007-02-21 2012-08-14 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
CN101668879B (en) * 2007-03-28 2012-05-09 陶氏康宁公司 Roll-to-roll plasma enhanced chemical vapor deposition method of barrier layers comprising silicon and carbon
JP5162179B2 (en) * 2007-07-31 2013-03-13 住友化学株式会社 Light emitting device and manufacturing method thereof lighting device
US8498464B2 (en) * 2007-09-27 2013-07-30 Siemens Medical Solutions Usa, Inc. Intrinsic co-registration for modular multimodality medical imaging systems
US7743492B2 (en) * 2008-02-08 2010-06-29 Carestream Health, Inc. Method for forming cast flexible substrate and resultant substrate and electronic device
US8800138B2 (en) * 2008-02-08 2014-08-12 Carestream Health, Inc. Method for conditioning a substrate surface for forming an electronic device thereon and resultant device
US9627420B2 (en) * 2008-02-08 2017-04-18 Carestream Health, Inc. Method for forming an electronic device on a flexible substrate supported by a detachable carrier
US8350451B2 (en) 2008-06-05 2013-01-08 3M Innovative Properties Company Ultrathin transparent EMI shielding film comprising a polymer basecoat and crosslinked polymer transparent dielectric layer
KR101656843B1 (en) * 2008-07-10 2016-09-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light-emitting device and electronic device using the same
JP5216716B2 (en) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 Emitting device and a manufacturing method thereof
JP5405075B2 (en) * 2008-09-24 2014-02-05 富士フイルム株式会社 Forming method and a gas barrier layer of the gas barrier film
US8033885B2 (en) 2008-09-30 2011-10-11 General Electric Company System and method for applying a conformal barrier coating with pretreating
EP2178133A3 (en) 2008-10-16 2013-12-04 Semiconductor Energy Laboratory Co., Ltd. Flexible Light-Emitting Device, Electronic Device, and Method for Manufacturing Flexible-Light Emitting Device
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US8427845B2 (en) * 2009-05-21 2013-04-23 General Electric Company Electrical connectors for optoelectronic device packaging
US8450926B2 (en) 2009-05-21 2013-05-28 General Electric Company OLED lighting devices including electrodes with magnetic material
US20100294526A1 (en) * 2009-05-21 2010-11-25 General Electric Company Hermetic electrical package
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
WO2011084806A1 (en) 2010-01-06 2011-07-14 Dow Global Technologies Inc. Moisture resistant photovoltaic devices with elastomeric, polysiloxane protection layer
US9000443B2 (en) 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device
US9000442B2 (en) * 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
KR20130125715A (en) 2012-05-09 2013-11-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Light-emitting device and electronic device
KR20150045596A (en) 2013-10-21 2015-04-29 삼성디스플레이 주식회사 Encapsulating member and display device having the same
WO2016014690A1 (en) 2014-07-25 2016-01-28 Kateeva, Inc. Organic thin film ink compositions and methods

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475307A (en) 1965-02-04 1969-10-28 Continental Can Co Condensation of monomer vapors to increase polymerization rates in a glow discharge
FR1393629A (en) 1965-09-13 1965-03-26 Continental Oil Co Method and apparatus for coating sheet solids
US3607365A (en) 1969-05-12 1971-09-21 Minnesota Mining & Mfg Vapor phase method of coating substrates with polymeric coating
US4098965A (en) 1977-01-24 1978-07-04 Polaroid Corporation Flat batteries and method of making the same
JPS55129345A (en) 1979-03-29 1980-10-07 Ulvac Corp Electron beam plate making method by vapor phase film formation and vapor phase development
US4581337A (en) 1983-07-07 1986-04-08 E. I. Du Pont De Nemours And Company Polyether polyamines as linking agents for particle reagents useful in immunoassays
US4842893A (en) 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
US5032461A (en) 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
DE3571772D1 (en) 1984-03-21 1989-08-31 Ulvac Corp Improvements in or relating to the covering of substrates with synthetic resin films
US4695618A (en) 1986-05-23 1987-09-22 Ameron, Inc. Solventless polyurethane spray compositions and method for applying them
DE3786063T2 (en) 1986-06-23 1993-09-09 Spectrum Control Inc Evaporation of liquid monomer.
US4954371A (en) 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
JPH07105034B2 (en) 1986-11-28 1995-11-13 株式会社日立製作所 A magnetic recording medium
JP2627619B2 (en) 1987-07-13 1997-07-09 日本電信電話株式会社 Organic amorphous film manufacturing method
US4847469A (en) 1987-07-15 1989-07-11 The Boc Group, Inc. Controlled flow vaporizer
JPH01171856A (en) * 1987-12-26 1989-07-06 Toray Ind Inc Metallized film
JP2742057B2 (en) 1988-07-14 1998-04-22 シャープ株式会社 Thin film el panel
JPH02183230A (en) 1989-01-09 1990-07-17 Sharp Corp Organic nonlinear optical material and production thereof
US5189405A (en) 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
JP2678055B2 (en) 1989-03-30 1997-11-17 シャープ株式会社 Preparation of an organic compound thin film
US5792550A (en) 1989-10-24 1998-08-11 Flex Products, Inc. Barrier film having high colorless transparency and method
US5036249A (en) 1989-12-11 1991-07-30 Molex Incorporated Electroluminescent lamp panel and method of fabricating same
US5362328A (en) 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
US5711816A (en) 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
JP2755844B2 (en) 1991-09-30 1998-05-25 シャープ株式会社 Plastic substrate liquid crystal display element
US5372851A (en) 1991-12-16 1994-12-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chemically adsorbed film
US5759329A (en) 1992-01-06 1998-06-02 Pilot Industries, Inc. Fluoropolymer composite tube and method of preparation
JP2958186B2 (en) 1992-04-20 1999-10-06 シャープ株式会社 Plastic substrate liquid crystal display element
US5427638A (en) 1992-06-04 1995-06-27 Alliedsignal Inc. Low temperature reaction bonding
GB9215928D0 (en) 1992-07-27 1992-09-09 Cambridge Display Tech Manufacture of electroluminescent devices
US5260095A (en) 1992-08-21 1993-11-09 Battelle Memorial Institute Vacuum deposition and curing of liquid monomers
DE4232390A1 (en) 1992-09-26 1994-03-31 Roehm Gmbh A method of generating siliciumoxidischen scratch-resistant coatings on plastics by plasma coating
JPH06182935A (en) 1992-12-18 1994-07-05 Bridgestone Corp Gas barrier rubber laminate and manufacture thereof
EP0758482B1 (en) 1993-10-04 2003-03-05 3M Innovative Properties Company Cross-linked acrylate coating material useful for forming capacitor dielectrics and oxygen barriers
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
US5654084A (en) 1994-07-22 1997-08-05 Martin Marietta Energy Systems, Inc. Protective coatings for sensitive materials
CN1078845C (en) * 1994-09-30 2002-02-06 钟渊化学工业株式会社 Laminated heat-resistant optical plastic sheet
DE4438359C2 (en) 1994-10-27 2001-10-04 Schott Glas Plastic container with a barrier coating
US6083628A (en) 1994-11-04 2000-07-04 Sigma Laboratories Of Arizona, Inc. Hybrid polymer film
JP3204356B2 (en) * 1994-12-14 2001-09-04 住友ベークライト株式会社 Transparent conductive film
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
US5620524A (en) 1995-02-27 1997-04-15 Fan; Chiko Apparatus for fluid delivery in chemical vapor deposition systems
US5811183A (en) 1995-04-06 1998-09-22 Shaw; David G. Acrylate polymer release coated sheet materials and method of production thereof
US5771562A (en) 1995-05-02 1998-06-30 Motorola, Inc. Passivation of organic devices
US5554220A (en) 1995-05-19 1996-09-10 The Trustees Of Princeton University Method and apparatus using organic vapor phase deposition for the growth of organic thin films with large optical non-linearities
JPH08325713A (en) 1995-05-30 1996-12-10 Matsushita Electric Works Ltd Formation of metallic film on organic substrate surface
US5629389A (en) 1995-06-06 1997-05-13 Hewlett-Packard Company Polymer-based electroluminescent device with improved stability
ES2213776T3 (en) 1995-06-30 2004-09-01 Commonwealth Scientific And Industrial Research Organisation Improved treatment of the surface of polymers.
US5681615A (en) 1995-07-27 1997-10-28 Battelle Memorial Institute Vacuum flash evaporated polymer composites
JPH0959763A (en) 1995-08-25 1997-03-04 Matsushita Electric Works Ltd Formation of metallic film on surface of organic substrate
JPH0957894A (en) * 1995-08-29 1997-03-04 Fujimori Kogyo Kk Optical sheet with transparent electrode
DE19603746A1 (en) 1995-10-20 1997-04-24 Bosch Gmbh Robert The electroluminescent layer system
US5811177A (en) 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
US5686360A (en) 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US5723219A (en) 1995-12-19 1998-03-03 Talison Research Plasma deposited film networks
US5684084A (en) 1995-12-21 1997-11-04 E. I. Du Pont De Nemours And Company Coating containing acrylosilane polymer to improve mar and acid etch resistance
US5955161A (en) 1996-01-30 1999-09-21 Becton Dickinson And Company Blood collection tube assembly
US5731661A (en) 1996-07-15 1998-03-24 Motorola, Inc. Passivation of electroluminescent organic devices
US5902688A (en) 1996-07-16 1999-05-11 Hewlett-Packard Company Electroluminescent display device
US5693956A (en) 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
US5948552A (en) 1996-08-27 1999-09-07 Hewlett-Packard Company Heat-resistant organic electroluminescent device
WO1998010116A1 (en) 1996-09-05 1998-03-12 Talison Research Ultrasonic nozzle feed for plasma deposited film networks
JPH10119170A (en) * 1996-10-18 1998-05-12 Sumitomo Bakelite Co Ltd Flexible laminated film
CN1644608A (en) 1996-10-31 2005-07-27 3M革新产权公司 Acrylate coating methods
US5821692A (en) 1996-11-26 1998-10-13 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package
US5912069A (en) 1996-12-19 1999-06-15 Sigma Laboratories Of Arizona Metal nanolaminate composite
US5844363A (en) 1997-01-23 1998-12-01 The Trustees Of Princeton Univ. Vacuum deposited, non-polymeric flexible organic light emitting devices
US5952778A (en) 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
US5872355A (en) 1997-04-09 1999-02-16 Hewlett-Packard Company Electroluminescent device and fabrication method for a light detection system
JP3290375B2 (en) 1997-05-12 2002-06-10 松下電器産業株式会社 The organic electroluminescent device
US5965907A (en) 1997-09-29 1999-10-12 Motorola, Inc. Full color organic light emitting backlight device for liquid crystal display applications
US5902641A (en) 1997-09-29 1999-05-11 Battelle Memorial Institute Flash evaporation of liquid monomer particle mixture
US6224948B1 (en) 1997-09-29 2001-05-01 Battelle Memorial Institute Plasma enhanced chemical deposition with low vapor pressure compounds
US5994174A (en) * 1997-09-29 1999-11-30 The Regents Of The University Of California Method of fabrication of display pixels driven by silicon thin film transistors
US6194487B1 (en) 1997-11-14 2001-02-27 Sharp Kabushiki Kaisha Method of manufacturing modified particles
JP3400324B2 (en) * 1997-11-17 2003-04-28 住友ベークライト株式会社 Conductive film
US6045864A (en) 1997-12-01 2000-04-04 3M Innovative Properties Company Vapor coating method
DE19802740A1 (en) 1998-01-26 1999-07-29 Leybold Systems Gmbh A method for the treatment of surfaces of substrates made of plastic
US5996498A (en) 1998-03-12 1999-12-07 Presstek, Inc. Method of lithographic imaging with reduced debris-generated performance degradation and related constructions
US5904958A (en) 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
JP4314642B2 (en) * 1998-04-30 2009-08-19 東洋紡績株式会社 Vacuum deposition material
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
JP3577232B2 (en) * 1999-01-22 2004-10-13 シャープ株式会社 The liquid crystal display element

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7442428B2 (en) * 2003-03-31 2008-10-28 Dai Nippon Printing Co., Ltd. Gas barrier substrate
US20070059491A1 (en) * 2003-03-31 2007-03-15 Sayaka Kawashima Gas barrier substrate
US20060062937A1 (en) * 2003-04-02 2006-03-23 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7980910B2 (en) 2003-04-02 2011-07-19 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7940004B2 (en) 2003-04-02 2011-05-10 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20100073936A1 (en) * 2003-04-02 2010-03-25 3M Innovative Properties Comapny Flexible high-temperature ultrabarrier
US7486019B2 (en) 2003-04-02 2009-02-03 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20090142476A1 (en) * 2003-04-02 2009-06-04 3M Innovative Properties Company Flexible high-temperature ultrabarrier
EP2277698A1 (en) 2003-04-02 2011-01-26 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20100119840A1 (en) * 2003-04-02 2010-05-13 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US20040195967A1 (en) * 2003-04-02 2004-10-07 3M Innovative Properties Company Flexible high-temperature ultrabarrier
EP3121003A1 (en) 2003-04-02 2017-01-25 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US8236424B2 (en) 2003-05-15 2012-08-07 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
US20060240275A1 (en) * 2005-04-25 2006-10-26 Gadkaree Kishor P Flexible display substrates
US20100099237A1 (en) * 2005-04-25 2010-04-22 Gadkaree Kishor P Flexible display substrates
WO2006115760A1 (en) * 2005-04-25 2006-11-02 Corning Incorporated Flexible display substrates
US8053331B2 (en) 2005-04-25 2011-11-08 Corning Incorporated Flexible display substrates
US20100068542A1 (en) * 2006-12-29 2010-03-18 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid films
US8227040B2 (en) 2006-12-29 2012-07-24 3M Innovative Properties Company Method of curing metal alkoxide-containing films
US20100068382A1 (en) * 2006-12-29 2010-03-18 Strobel Mark A Method of curing metal alkoxide-containing films
US9012017B2 (en) 2007-07-31 2015-04-21 Sumitomo Chemical Company, Limited Barrier layer-attached substrate, display component, and method for manufacturing display component
US20100196679A1 (en) * 2007-07-31 2010-08-05 Sumitomo Chemcial Company Limited Barrier layer-attached substrate, display component, and method for manufacturing display component
US8846169B2 (en) 2007-12-28 2014-09-30 3M Innovative Properties Company Flexible encapsulating film systems
US9481927B2 (en) 2008-06-30 2016-11-01 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid barrier films
US20100090218A1 (en) * 2008-10-10 2010-04-15 Jiro Tsukahara Sealed device
US20120135212A1 (en) * 2010-11-26 2012-05-31 Hon Hai Precision Industry Co., Ltd. Coated article and method for making same
US20140283910A1 (en) * 2011-08-04 2014-09-25 3M Innovative Properties Company Edge protected barrier assemblies
US9362527B2 (en) 2012-02-15 2016-06-07 Konica Minolta, Inc. Functional film having a hybrid layer of polysiloxane and fine resin particles

Also Published As

Publication number Publication date Type
DE60131390T2 (en) 2008-09-25 grant
CN100365759C (en) 2008-01-30 grant
EP1284835B1 (en) 2007-11-14 grant
JP5436640B2 (en) 2014-03-05 grant
WO2001082336A2 (en) 2001-11-01 application
JP5367531B2 (en) 2013-12-11 grant
EP1284835A2 (en) 2003-02-26 application
DE60131390D1 (en) 2007-12-27 grant
JP2010058516A (en) 2010-03-18 application
JP2013056546A (en) 2013-03-28 application
WO2001082336A3 (en) 2002-12-05 application
US6492026B1 (en) 2002-12-10 grant
CN1636258A (en) 2005-07-06 application
JP2003531745A (en) 2003-10-28 application

Similar Documents

Publication Publication Date Title
US20030085654A1 (en) Electro-optical apparatus, manufacturing method thereof, and electronic instrument
US20050224935A1 (en) Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US6624568B2 (en) Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US20090208754A1 (en) Method for edge sealing barrier films
US20030209708A1 (en) Organic electroluminescenst display panel and manufacturing method therefor
US6962671B2 (en) Multilayer plastic substrates
US6897474B2 (en) Protected organic electronic devices and methods for making the same
US20050269943A1 (en) Protected organic electronic devices and methods for making the same
US7198832B2 (en) Method for edge sealing barrier films
US6835950B2 (en) Organic electronic devices with pressure sensitive adhesive layer
US6268695B1 (en) Environmental barrier material for organic light emitting device and method of making
US20030203210A1 (en) Barrier coatings and methods of making same
US20080196664A1 (en) Moisture barrier coatings for organic light emitting diode devices
US6720203B2 (en) Flexible organic electronic device with improved resistance to oxygen and moisture degradation
US20040229051A1 (en) Multilayer coating package on flexible substrates for electro-optical devices
JP2004244606A (en) Transparent barrier film
US20070196682A1 (en) Three dimensional multilayer barrier and method of making
US20040239241A1 (en) Flexible multilayer packaging material and electronic devices with the packaging material
US7074501B2 (en) Coatings with low permeation of gases and vapors
JPH09161967A (en) Passivation for organic device
US20060061272A1 (en) Organic electroluminescent device
US20080006819A1 (en) Moisture barrier coatings for organic light emitting diode devices
JP2003053881A (en) Plastic film having water vapor barrier properties
US20070231592A1 (en) Gas-barrier laminate film and method for producing same, and image display device
JP2007290369A (en) Gas barrier laminated film, its manufacturing method and image display element

Legal Events

Date Code Title Description
AS Assignment

Owner name: BATTELLE MEMORIAL INSTITUTE, WASHINGTON

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GRAFF, GORDON LEE;GROSS, MARK EDWARD;SHI, MING KUN;AND OTHERS;REEL/FRAME:010879/0234;SIGNING DATES FROM 20000427 TO 20000501

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

AS Assignment

Owner name: SAMSUNG MOBILE DISPLAY CO., LTD., KOREA, REPUBLIC

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BATTELLE MEMORIAL INSTITUTE;REEL/FRAME:025516/0773

Effective date: 20101028

AS Assignment

Owner name: SAMSUNG DISPLAY CO., LTD., KOREA, REPUBLIC OF

Free format text: MERGER;ASSIGNOR:SAMSUNG MOBILE DISPLAY CO., LTD.;REEL/FRAME:028912/0083

Effective date: 20120702

FPAY Fee payment

Year of fee payment: 12