US20020131251A1 - Semiconductor card and method of fabrication - Google Patents
Semiconductor card and method of fabrication Download PDFInfo
- Publication number
- US20020131251A1 US20020131251A1 US09/809,781 US80978101A US2002131251A1 US 20020131251 A1 US20020131251 A1 US 20020131251A1 US 80978101 A US80978101 A US 80978101A US 2002131251 A1 US2002131251 A1 US 2002131251A1
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- United States
- Prior art keywords
- substrate
- semiconductor
- card
- connecting segments
- strip
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- This invention relates generally to semiconductor manufacture, and more particularly to an improved semiconductor card, and to a method and to a system for fabricating the card.
- cards One type of electronic assembly containing semiconductor components is referred to as a “card”. Examples of cards include multi media cards (MMC), memory cards, smart cards, and personal computer memory card international association (PCMCIA) cards. The present patent application refers to these types of cards as “semiconductor cards”. These cards are also sometimes referred to as “daughter boards”.
- MMC multi media cards
- PCMCIA personal computer memory card international association
- the card typically includes a printed-circuit substrate (usually multilayer) that provides interconnection and power distribution for semiconductor components, such as semiconductor dice or packages, on the card.
- the card also provides interconnect capability to a next level package, such as a mother printed-circuit board.
- the card can include other types of electronic components such as resistors, inductors and capacitors.
- the components are mounted to a circuit side of the board, and the external contacts for the card are contained on an opposing back side of the substrate.
- the cards typically also include a separate cover adhesively attached to the substrate, which encloses all of the components on the circuit side of the card.
- the cover can add thickness to the card. For most applications it is desirable to make the card as thin as possible.
- the covers are typically fabricated separately, and then attached to the substrate using an adhesive. The cover represents a separate component which requires additional process steps, and which is subject to detachment from the substrate.
- peripheral outlines and dimensions of the cards be as consistent as possible.
- a typical fabrication processes is performed on a strip which is similar to a lead frame and contains several printed circuit substrates.
- the individual cards are then separated from the strip using a singulation step such as sawing. Often the singulation step produces slivers, and roughened portions on the edges of the printed-circuit substrate. These defects can adversely affect the peripheral outline, dimensions and appearance of the card.
- Specifications on the peripheral outline and dimensions of cards have been set by various industry standard setting bodies (e.g., PCMCIA) Defects such as slivers of substrate material, can make the peripheral outline of the card larger, such that the card does not meet the specifications.
- the present invention is directed to a semiconductor card in which the components on the printed circuit substrate are encapsulated in a molded plastic body, such that the card can be made as thin as possible.
- the fabrication process employs a strip of substrate material, and a singulation step, designed to reduce defects, such as substrate slivers and dimensional irregularities.
- an improved semiconductor card and a method and a system for fabricating the card are provided.
- the card includes a printed circuit substrate, which comprises an electrically insulating material, such as an organic polymer resin reinforced with glass fibers.
- the substrate includes a circuit side with a pattern of conductors thereon, a back side with a pattern of external contacts thereon, and a plurality of interlevel conductors which electrically connect the conductors on the circuit side to the external contacts on the back side.
- the substrate is initially a segment of a strip containing multiple substrates.
- the strip is similar in function to a semiconductor lead frame, and allows various fabrication processes to be performed on several substrates at the same time.
- the substrate is connected to the strip with connecting segments that are similar in function to tie bars on a semiconductor lead frame.
- a peripheral outline of the substrate is defined by a peripheral opening in the strip.
- the card also includes one or more semiconductor components mounted to the circuit side of the substrate in electrical communication with the conductors on the circuit side.
- the semiconductor components can comprise bare dice wire bonded to the conductors, bumped dice flip chip mounted to the conductors, or semiconductor packages bonded to the conductors.
- the card also includes a molded encapsulant on the circuit side of the substrate which encapsulates the components.
- the card also includes a molded plastic body which covers the encapsulant, the remainder of the circuit side, and the edges of the substrate.
- the plastic body includes one or more notches formed on edge portions thereof in alignment with the connecting segments for the substrate. Although most portions of the connecting segments are removed during singulation of the substrate from the strip, some portions of the connecting segments (e.g., slivers) can remain in the notches following the singulation step. However, because the notches are configured to enclose these remaining portions of the connecting segments, the peripheral outline and dimensions of the card can still meet specification.
- the notches in addition to enclosing defects on the substrate also function to provide access to the connecting segments for singulating the substrate from the strip.
- a method for fabricating the semiconductor card includes the initial step of providing the strip containing multiple printed circuit substrates.
- the peripheral outline of each substrate on the strip is defined by the peripheral openings through the strip, and each substrate is connected to the strip by the connecting segments.
- the method includes the steps of mounting the semiconductor components to the substrates on the strip, and then encapsulating the semiconductor components.
- a molding step is performed to mold the plastic bodies to the substrates on the strip.
- the molding step can be performed using a molding apparatus having mold cavities configured to mold the plastic bodies to the strips.
- the mold cavities include pins configured to contact the connecting segments for the substrates, and to form the notches in the plastic bodies in alignment with the connecting segments.
- a singulation step is performed by severing the connecting segments to separate the substrates from the strip. During the singulation step, the notches provide access for severing the connecting segments. In addition, any slivers from the connecting segments remain in the molded notches such that the peripheral outline of the card meets specification.
- a system for performing the method includes the strip containing multiple printed circuit substrates connected to the strip by the connecting segments and defined by the peripheral openings in the panel.
- the system includes the molding apparatus having the mold cavities for molding the plastic bodies to the substrates.
- the system also includes the pins in the molding cavities configured to mold the notches into the plastic bodies and to hold the connecting segments down during the molding step.
- the system also includes a punch apparatus having cutters configured to move through the notches in the plastic bodies to sever the connecting segments.
- FIG. 1A is an enlarged plan view of a semiconductor card fabricated in accordance with the invention.
- FIG. 1B is an enlarged bottom view of the semiconductor card
- FIG. 1C is an enlarged side elevation view of the semiconductor card
- FIG. 1D is an enlarged cross sectional view of the semiconductor card, taken along section line 1 D- 1 D of FIG. 1A;
- FIG. 1E is an enlarged cross sectional view of the semiconductor card, taken along section line 1 E- 1 E of FIG. 1A;
- FIG. 1F is an enlarged cross sectional view, equivalent to FIG. 1E, of an alternate embodiment semiconductor card
- FIG. 1G is an enlarged cross sectional view of the semiconductor card, taken along section line 1 G- 1 G of FIG. 1E;
- FIGS. 2 A- 2 F are schematic cross sectional views illustrating steps in a method for fabricating the semiconductor card in accordance with the invention
- FIG. 3A is an enlarged schematic plan view of the semiconductor card during fabrication, taken along line 3 A- 3 A of FIG. 2A;
- FIG. 3B is an enlarged schematic plan view of the semiconductor card during fabrication, taken along line 3 B- 3 B of FIG. 2B, and partially cut away;
- FIG. 3C is an enlarged schematic plan view of the semiconductor card during fabrication, taken along line 3 C- 3 C of FIG. 2C, and partially cut away;
- FIG. 3D is an enlarged schematic plan view of the semiconductor card during fabrication, taken along line 3 D- 3 D of FIG. 2D;
- FIG. 3E is an enlarged schematic plan view of the semiconductor card during fabrication, taken along line 3 E- 3 E of FIG. 2E;
- FIG. 3F is an enlarged schematic plan view of the semiconductor card during fabrication, taken along line 3 F- 3 F of FIG. 2F;
- FIG. 4 is an enlarged cross sectional view taken along section line 4 of FIG. 3F.
- FIG. 5 is a schematic view of a system constructed in accordance with the invention.
- the card 10 includes a printed circuit substrate 12 , and a plurality of semiconductor components 14 (FIG. 1E) mounted to the substrate 12 .
- the card 10 also includes an encapsulant 16 (FIG. 1E) on the substrate 12 encapsulating the components 14 , a plastic body 18 molded to the encapsulant 16 and to the substrate 12 , and an array of external contacts 20 (FIG. 1B) on the substrate 12 .
- the substrate 12 comprises an electrically insulating material such as an organic polymer resin reinforced with glass fibers.
- Suitable materials for the substrate 12 include bismaleimide-triazine (BT), epoxy resins (e.g., “FR-4” and “FR-5”), and polyimide resins. These materials can be formed with a desired thickness, and then punched, machined, or otherwise formed with a required peripheral configuration, and with required features.
- a representative thickness of the substrate 12 can be from about 0.2 mm to 1.6 mm.
- the substrate 12 is initially a segment of a strip 30 (FIG. 3A) which is used to fabricate several cards 10 at the same time.
- the substrate 12 has a generally rectangular peripheral shape but with one chamfered corner 22 .
- the substrate 12 includes a circuit side 24 (FIG. 1G) wherein the semiconductor components 14 are mounted, a back side 26 (FIG. 1B) wherein the external contacts 20 are located, and a peripheral edge 28 (FIG. 1B).
- the circuit side 24 of the substrate 12 includes patterns of conductors 32 and contacts 36 .
- the conductors 32 can comprise a highly conductive metal, such as copper, and are configured to provide separate electrical paths on the substrate 12 for the electrical components contained on the card 10 .
- the contacts 36 provide electrical connection points for performing various electrical functions, such as testing the semiconductor components 14 , or other circuits and components on the substrate 12 .
- the substrate 12 also includes conductive vias (not shown), or other interlevel conductors, that provide separate electrical paths through the substrate 12 between the conductors 32 , the contacts 36 , the components 14 , and the external contacts 20 (FIG. 1B).
- the card also includes various other electrical components 40 on the substrate 12 , such as resistors, capacitors and inductors in electrical communication with the conductors 32 and with the semiconductor components 14 .
- the semiconductor components 14 , the conductors 32 , and the electrical components 40 form a circuit 42 (FIG. 1G) on the substrate 12 that is configured to perform a desired function (e.g., memory storage, sound production, video production, product identification, etc.).
- the external contacts 20 on the substrate 12 provide connection points for sending signals to the circuit 42 or for receiving signals generated by the circuit 42 .
- the external contacts 20 are configured for mating electrical engagement with corresponding contacts (not shown) on a mother circuit board or other electrical assembly (not shown).
- the external contacts 20 comprise planar pads formed of a non-oxidizing material such as gold.
- other configurations for the external contacts 20 can be employed (e.g., bumps, pins, etc.).
- the components 14 can comprise bare semiconductor dice wire bonded to the substrate 12 .
- wires 44 are bonded to bond pads 62 (FIG. 1G) on the components 14 , and to corresponding bond pads 34 (FIG. 1G) on the substrate 12 in electrical communication with the conductors 32 .
- the encapsulant 16 encapsulates the components 14 , the wires 44 and the associated wire bonds as well.
- the encapsulant 16 can comprise a suitable curable polymer such as a “glob top” material, an epoxy resin, or a silicone material deposited and formed using a suitable process (e.g., molding, dispensing through a nozzle).
- a curing step for the encapsulant such as heating in a oven may also be required.
- a semiconductor card 10 A can include semiconductor components 14 A in the form of dice or packages flip chip mounted to a substrate 12 A, or semiconductor packages (e.g., TSOPs, chip scale packages) bonded to the substrate 12 A.
- contacts 46 A on the components 14 A such as solder balls or C4 bumps, are bonded to corresponding contacts on the substrate 12 A.
- an encapsulant 16 A encapsulates the components 14 A, and external contacts 20 A on the substrate 12 A provide outside electrical connection points for the card 10 A.
- the card 10 A also includes a molded plastic body 18 A substantially similar to the molded plastic body 18 for card 10 .
- the molded plastic body 18 for card 10 completely covers the circuit side 24 of the substrate 12 .
- the molded plastic body 18 has a peripheral outline that substantially matches, but is slightly larger than the peripheral outline of the substrate 12 .
- the molded plastic body 18 can comprise a Novolac based epoxy formed in a desired shape using a transfer molding process, and then cured using an oven.
- the molded plastic body 18 also includes an edge portion 52 that covers the peripheral edge 28 of the substrate 12 but leaves the backside 26 of the substrate 12 and the external contacts 20 exposed.
- the molded plastic body 18 includes a recessed face portion 48 configured to retain a label.
- the label for example, can comprise a preprinted sheet of paper having art work on one side, and an adhesive on an opposing side.
- the molded plastic body 18 includes a groove 50 that functions as a finger grip for handling the card 10 .
- the molded plastic body 18 includes notches 38 formed in the edge portion 52 .
- the notches 38 are generally hemispherical in shape, and extend completely through the edge portion 52 of the molded plastic body 18 .
- the notches 38 can also extend a short distance into the substrate 12 such that the peripheral edge 28 of the substrate 12 is slightly notched.
- there are four notches 38 consisting of two pairs located on opposing longitudinal sides of the card 10 .
- the notches 38 align with connecting segments 54 (FIG. 3A) of the substrate 12 that initially attach the substrate 12 to the strip 30 .
- One function of the notches 38 is to provide access for severing the connecting segments 54 to singulate the substrate 12 , and the card 10 , from the strip 30 following the fabrication process. Another function of the notches 38 is to provide an enclosed area for containing rough edges of the substrate 12 , or slivers of substrate material, that may form during severing of the connecting segments 54 .
- FIGS. 2 A- 2 F and 3 A- 3 F steps in a method for fabricating the card 10 are illustrated.
- the strip 30 containing the substrate 12 , as well as additional substrates 12 (not shown) is provided.
- the strip 30 can also be described as a panel similar in construction to a semiconductor lead frame, and can include as many substrates as desired (e.g., two to eighteen).
- the strip 30 facilitates the fabrication process in that different operations, such as die attach, wire bonding, molding and singulation can be performed at the same time on multiple substrates 12 .
- the strip 30 can be constructed from a commercially produced bi-material core, such as a copper clad bismaleimide-triazine (BT) core, available from Mitsubishi Gas Chemical Corp., Japan.
- a representative weight of the copper can be from 0.5 oz to 2 oz. per square foot.
- the strip 30 can include indexing openings 56 that facilitate handling by automated equipment such as conveyors, magazines, die attachers, wire bonders and molding apparatus.
- the substrate 12 on the strip 30 can include the conductors 32 , the contacts 36 and the electrical components 40 , configured substantially as previously described, on the circuit side 24 of the substrate 12 .
- the substrate 12 can include the external contacts 20 on the backside 26 , and the vias (not shown) which electrically connect the external contacts 20 to the conductors 32 , to the electrical components 40 and to the contacts 36 .
- the strip 30 also includes the connecting segments 54 configured to attach the substrate 12 to the strip 30 .
- the connecting segments 54 are similar in structure and function to tie bars of a semiconductor lead frame.
- a peripheral opening 58 though the strip 30 defines the peripheral outline of the substrate 12 .
- the peripheral opening 58 is continuous except where the connecting segments 54 are located.
- Adhesive layers 60 such as a curable adhesive (e.g., polyimide), or a tape material (“KAPTON” tape), can be used to adhesively attach the semiconductor components 14 to the substrate 12 .
- a conventional die attacher can be used to perform the attachment process.
- the semiconductor components 14 can be wire bonded to the substrate 12 by bonding the wires 44 to the bond pads 62 on the semiconductor components 14 and to the bond pads 34 on the substrate 12 .
- a conventional wire bonder can be used to perform the wire bonding step.
- a flip chip process e.g., C4
- a TAB bonding process can be used to electrically connect the semiconductor components 14 to the conductors 32 .
- the semiconductor components 14 A can include contacts 46 A (FIG. 1F) such as solder balls configured for bonding to the bond pads 34 on the substrate 12 using a solder reflow process.
- the contacts 46 A can comprise conductive polymer bumps configured for bonding to the bond pads 34 on the substrate 12 using a curing process.
- the encapsulant 16 can be formed on the semiconductor components 14 and on portions of the substrate 12 .
- the encapsulant 16 can comprise a glob top material, such as an epoxy resin or silicone, deposited using a suitable deposition process and then cured.
- the encapsulant 16 can comprise a Novolac based epoxy formed in a desired shape using a transfer molding process, and then cured using an oven.
- the molded plastic body 18 is formed using a molding apparatus 64 .
- the molding apparatus 64 can comprise a conventional transfer molding apparatus modified to include pins 74 to be hereinafter described.
- the molding apparatus 64 includes a first plate 66 configured to contact the circuit side 24 of the substrate 12 .
- the molding apparatus 64 includes a second plate 72 configured to contact the back side 26 of the substrate 12 . If desired, the back side 26 of the substrate 12 can be protected by tape or other protective member during the molding process.
- the first plate 66 of the molding apparatus 64 includes a mold cavity 68 in fluid communication with a pressurized source 70 of a molding compound such as a Novolac based epoxy.
- the mold cavity 68 is adapted to receive the molding compound and to mold the molded plastic body 18 over the encapsulant 16 , and on the circuit side 24 and peripheral edge 28 of the substrate 12 .
- the mold cavity 68 is adapted to define features of the molded plastic body 18 such as the face portion 48 (FIG. 1A) and the groove 50 (FIG. 1A).
- the first plate 66 and the second plate 72 are configured to apply pressure to the substrate 12 during the molding process to prevent molding compound from forming on portions of the substrate 12 such as on the back side 26 thereof (i.e., to prevent “flash” from forming).
- the first plate 66 also includes four pins 74 located within the mold cavity 68 , which are configured to form the notches 38 (FIG. 1B) in the molded plastic body 18 .
- the pins 74 align with the connecting segments 54 which attach the substrate 12 to the strip 30 .
- the pins 74 are configured to contact the connecting segments 54 during the molding process. This forms the notches 38 (FIG. 1B) in the molded plastic body 18 in exact alignment with the connecting segments 54 .
- the pins 74 are also configured to apply pressure to the connecting segments 54 , such that molding compound does not flow beneath the connecting segments 54 and form “flash” on the back side 26 of the substrate 12 .
- the pins 74 are generally cylindrically shaped and form the notches 38 with a hemispherical shape.
- the pins 74 can have other geometrical configurations adapted to form the notches 38 in other shapes (e.g., square, rectangular, quarter moon, etc.).
- the molded plastic body 18 is shown following the molding process. As shown in FIG. 3D, the notches 38 in the molded plastic body 18 are aligned with the connecting segments 54 . However, the connecting segments 54 remain intact such that the substrate 18 remains connected to the strip 30 .
- a singulating step is performed to sever the connecting segments 54 and separate the substrate 18 from the strip 30 .
- a punch apparatus 76 can be provided.
- the punch apparatus 76 can comprise a conventional punch or press that includes cutters 78 configured to sever the connecting segments 54 at their point of attachment to the substrate 18 .
- the cutters 78 are sized and shaped similarly to the pins 74 , such that they are able to move through the notches 38 to sever the connecting segments 54 .
- the notches 38 thus provide access for the cutters 78 to the connecting segments 54 .
- the card 10 is illustrated following the singulating step but prior to removal from the strip 30 .
- a peripheral outline 80 of the card 10 is defined by the peripheral opening 58 through the strip 30 .
- the connecting segments 54 in the opening 58 have been severed such that the card 10 can be removed from the strip 30 .
- one of the notches 38 is shown in an enlarged view.
- the connecting segment 54 was not cleanly severed such that a sliver 82 of substrate material remains.
- the sliver 82 is contained within the notches 38 such that the peripheral outline and dimensions of the card 10 will meet specification.
- the notches 38 also function to shield rough edges that may have resulted from shearing of the connecting segments 54 .
- the system 84 includes the strip 30 containing the substrates 12 .
- the substrates 12 are defined by the peripheral openings 58 in the strip 30 , and are attached to the strip 30 by the connecting segments 54 (FIG. 3A).
- the system 84 also includes the molding apparatus 64 having the pins 74 configured to contact the connecting segments 54 (FIG. 3C) during molding of the molded plastic body 18 .
- the pins 74 form the notches 38 (FIG. 1A) in the molded plastic body 18 .
- the system 84 also includes the punch apparatus 76 having cutters 78 configured to sever the connecting segments 54 (FIG. 3E).
- the invention provides an improved semiconductor card, a method for fabricating the card, and a system for performing the method. While the invention has been described with reference to certain preferred embodiments, as will be apparent to those skilled in the art, certain changes and modifications can be made without departing from the scope of the invention as defined by the following claims.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
- This invention relates generally to semiconductor manufacture, and more particularly to an improved semiconductor card, and to a method and to a system for fabricating the card.
- One type of electronic assembly containing semiconductor components is referred to as a “card”. Examples of cards include multi media cards (MMC), memory cards, smart cards, and personal computer memory card international association (PCMCIA) cards. The present patent application refers to these types of cards as “semiconductor cards”. These cards are also sometimes referred to as “daughter boards”.
- Typically, the card includes a printed-circuit substrate (usually multilayer) that provides interconnection and power distribution for semiconductor components, such as semiconductor dice or packages, on the card. The card also provides interconnect capability to a next level package, such as a mother printed-circuit board. In addition to semiconductor components, the card can include other types of electronic components such as resistors, inductors and capacitors. Typically the components are mounted to a circuit side of the board, and the external contacts for the card are contained on an opposing back side of the substrate.
- In the past it has been common practice to encapsulate the semiconductor components contained on the circuit side of the substrate using a “glob top” encapsulant. The cards typically also include a separate cover adhesively attached to the substrate, which encloses all of the components on the circuit side of the card. One shortcoming of this approach is that the cover can add thickness to the card. For most applications it is desirable to make the card as thin as possible. Also, the covers are typically fabricated separately, and then attached to the substrate using an adhesive. The cover represents a separate component which requires additional process steps, and which is subject to detachment from the substrate.
- Besides being as thin as possible, another requirement for these cards is that the peripheral outlines and dimensions of the cards be as consistent as possible. A typical fabrication processes is performed on a strip which is similar to a lead frame and contains several printed circuit substrates. The individual cards are then separated from the strip using a singulation step such as sawing. Often the singulation step produces slivers, and roughened portions on the edges of the printed-circuit substrate. These defects can adversely affect the peripheral outline, dimensions and appearance of the card. Specifications on the peripheral outline and dimensions of cards, have been set by various industry standard setting bodies (e.g., PCMCIA) Defects such as slivers of substrate material, can make the peripheral outline of the card larger, such that the card does not meet the specifications.
- The present invention is directed to a semiconductor card in which the components on the printed circuit substrate are encapsulated in a molded plastic body, such that the card can be made as thin as possible. In addition, the fabrication process employs a strip of substrate material, and a singulation step, designed to reduce defects, such as substrate slivers and dimensional irregularities.
- In accordance with the present invention, an improved semiconductor card, and a method and a system for fabricating the card are provided.
- The card includes a printed circuit substrate, which comprises an electrically insulating material, such as an organic polymer resin reinforced with glass fibers. The substrate includes a circuit side with a pattern of conductors thereon, a back side with a pattern of external contacts thereon, and a plurality of interlevel conductors which electrically connect the conductors on the circuit side to the external contacts on the back side. The substrate is initially a segment of a strip containing multiple substrates. The strip is similar in function to a semiconductor lead frame, and allows various fabrication processes to be performed on several substrates at the same time. The substrate is connected to the strip with connecting segments that are similar in function to tie bars on a semiconductor lead frame. In addition, a peripheral outline of the substrate is defined by a peripheral opening in the strip.
- The card also includes one or more semiconductor components mounted to the circuit side of the substrate in electrical communication with the conductors on the circuit side. The semiconductor components can comprise bare dice wire bonded to the conductors, bumped dice flip chip mounted to the conductors, or semiconductor packages bonded to the conductors. The card also includes a molded encapsulant on the circuit side of the substrate which encapsulates the components. The card also includes a molded plastic body which covers the encapsulant, the remainder of the circuit side, and the edges of the substrate.
- The plastic body includes one or more notches formed on edge portions thereof in alignment with the connecting segments for the substrate. Although most portions of the connecting segments are removed during singulation of the substrate from the strip, some portions of the connecting segments (e.g., slivers) can remain in the notches following the singulation step. However, because the notches are configured to enclose these remaining portions of the connecting segments, the peripheral outline and dimensions of the card can still meet specification. The notches in addition to enclosing defects on the substrate also function to provide access to the connecting segments for singulating the substrate from the strip.
- A method for fabricating the semiconductor card includes the initial step of providing the strip containing multiple printed circuit substrates. The peripheral outline of each substrate on the strip is defined by the peripheral openings through the strip, and each substrate is connected to the strip by the connecting segments. In addition, the method includes the steps of mounting the semiconductor components to the substrates on the strip, and then encapsulating the semiconductor components.
- Following the encapsulating step, a molding step is performed to mold the plastic bodies to the substrates on the strip. The molding step can be performed using a molding apparatus having mold cavities configured to mold the plastic bodies to the strips. The mold cavities include pins configured to contact the connecting segments for the substrates, and to form the notches in the plastic bodies in alignment with the connecting segments. Following the molding, a singulation step is performed by severing the connecting segments to separate the substrates from the strip. During the singulation step, the notches provide access for severing the connecting segments. In addition, any slivers from the connecting segments remain in the molded notches such that the peripheral outline of the card meets specification.
- A system for performing the method includes the strip containing multiple printed circuit substrates connected to the strip by the connecting segments and defined by the peripheral openings in the panel. In addition, the system includes the molding apparatus having the mold cavities for molding the plastic bodies to the substrates. The system also includes the pins in the molding cavities configured to mold the notches into the plastic bodies and to hold the connecting segments down during the molding step. The system also includes a punch apparatus having cutters configured to move through the notches in the plastic bodies to sever the connecting segments.
- FIG. 1A is an enlarged plan view of a semiconductor card fabricated in accordance with the invention;
- FIG. 1B is an enlarged bottom view of the semiconductor card;
- FIG. 1C is an enlarged side elevation view of the semiconductor card;
- FIG. 1D is an enlarged cross sectional view of the semiconductor card, taken along
section line 1D-1D of FIG. 1A; - FIG. 1E is an enlarged cross sectional view of the semiconductor card, taken along
section line 1E-1E of FIG. 1A; - FIG. 1F is an enlarged cross sectional view, equivalent to FIG. 1E, of an alternate embodiment semiconductor card;
- FIG. 1G is an enlarged cross sectional view of the semiconductor card, taken along
section line 1G-1G of FIG. 1E; - FIGS.2A-2F are schematic cross sectional views illustrating steps in a method for fabricating the semiconductor card in accordance with the invention;
- FIG. 3A is an enlarged schematic plan view of the semiconductor card during fabrication, taken along
line 3A-3A of FIG. 2A; - FIG. 3B is an enlarged schematic plan view of the semiconductor card during fabrication, taken along
line 3B-3B of FIG. 2B, and partially cut away; - FIG. 3C is an enlarged schematic plan view of the semiconductor card during fabrication, taken along
line 3C-3C of FIG. 2C, and partially cut away; - FIG. 3D is an enlarged schematic plan view of the semiconductor card during fabrication, taken along
line 3D-3D of FIG. 2D; - FIG. 3E is an enlarged schematic plan view of the semiconductor card during fabrication, taken along
line 3E-3E of FIG. 2E; - FIG. 3F is an enlarged schematic plan view of the semiconductor card during fabrication, taken along
line 3F-3F of FIG. 2F; - FIG. 4 is an enlarged cross sectional view taken along
section line 4 of FIG. 3F; and - FIG. 5 is a schematic view of a system constructed in accordance with the invention.
- Referring to FIGS.1A-1G, a
semiconductor card 10 constructed in accordance with the invention is illustrated. Thecard 10 includes a printedcircuit substrate 12, and a plurality of semiconductor components 14 (FIG. 1E) mounted to thesubstrate 12. Thecard 10 also includes an encapsulant 16 (FIG. 1E) on thesubstrate 12 encapsulating thecomponents 14, aplastic body 18 molded to theencapsulant 16 and to thesubstrate 12, and an array of external contacts 20 (FIG. 1B) on thesubstrate 12. - The
substrate 12 comprises an electrically insulating material such as an organic polymer resin reinforced with glass fibers. Suitable materials for thesubstrate 12 include bismaleimide-triazine (BT), epoxy resins (e.g., “FR-4” and “FR-5”), and polyimide resins. These materials can be formed with a desired thickness, and then punched, machined, or otherwise formed with a required peripheral configuration, and with required features. A representative thickness of thesubstrate 12 can be from about 0.2 mm to 1.6 mm. As will be further explained, thesubstrate 12 is initially a segment of a strip 30 (FIG. 3A) which is used to fabricateseveral cards 10 at the same time. - As shown in FIG. 1B, the
substrate 12 has a generally rectangular peripheral shape but with one chamferedcorner 22. Thesubstrate 12 includes a circuit side 24 (FIG. 1G) wherein thesemiconductor components 14 are mounted, a back side 26 (FIG. 1B) wherein theexternal contacts 20 are located, and a peripheral edge 28 (FIG. 1B). As shown in FIG. 1G, thecircuit side 24 of thesubstrate 12 includes patterns ofconductors 32 andcontacts 36. For simplicity only a few of theconductors 32 are shown. Theconductors 32 can comprise a highly conductive metal, such as copper, and are configured to provide separate electrical paths on thesubstrate 12 for the electrical components contained on thecard 10. Thecontacts 36 provide electrical connection points for performing various electrical functions, such as testing thesemiconductor components 14, or other circuits and components on thesubstrate 12. Thesubstrate 12 also includes conductive vias (not shown), or other interlevel conductors, that provide separate electrical paths through thesubstrate 12 between theconductors 32, thecontacts 36, thecomponents 14, and the external contacts 20 (FIG. 1B). - In addition to the
semiconductor components 14, the card also includes various otherelectrical components 40 on thesubstrate 12, such as resistors, capacitors and inductors in electrical communication with theconductors 32 and with thesemiconductor components 14. Thesemiconductor components 14, theconductors 32, and theelectrical components 40 form a circuit 42 (FIG. 1G) on thesubstrate 12 that is configured to perform a desired function (e.g., memory storage, sound production, video production, product identification, etc.). - The
external contacts 20 on thesubstrate 12 provide connection points for sending signals to thecircuit 42 or for receiving signals generated by thecircuit 42. Theexternal contacts 20 are configured for mating electrical engagement with corresponding contacts (not shown) on a mother circuit board or other electrical assembly (not shown). In the illustrative embodiment theexternal contacts 20 comprise planar pads formed of a non-oxidizing material such as gold. However, other configurations for theexternal contacts 20 can be employed (e.g., bumps, pins, etc.). - As shown in FIG. 1E, the
components 14 can comprise bare semiconductor dice wire bonded to thesubstrate 12. In this case,wires 44 are bonded to bond pads 62 (FIG. 1G) on thecomponents 14, and to corresponding bond pads 34 (FIG. 1G) on thesubstrate 12 in electrical communication with theconductors 32. As also shown in FIG. 1E, theencapsulant 16 encapsulates thecomponents 14, thewires 44 and the associated wire bonds as well. Theencapsulant 16 can comprise a suitable curable polymer such as a “glob top” material, an epoxy resin, or a silicone material deposited and formed using a suitable process (e.g., molding, dispensing through a nozzle). Depending on the encapsulant a curing step for the encapsulant such as heating in a oven may also be required. - As an alternative to wire bonding, and as shown in FIG. 1F, a
semiconductor card 10A can includesemiconductor components 14A in the form of dice or packages flip chip mounted to asubstrate 12A, or semiconductor packages (e.g., TSOPs, chip scale packages) bonded to thesubstrate 12A. In either case,contacts 46A on thecomponents 14A, such as solder balls or C4 bumps, are bonded to corresponding contacts on thesubstrate 12A. In addition, anencapsulant 16A encapsulates thecomponents 14A, andexternal contacts 20A on thesubstrate 12A provide outside electrical connection points for thecard 10A. Thecard 10A also includes a moldedplastic body 18A substantially similar to the moldedplastic body 18 forcard 10. - Referring again to FIGS. 1A and 1B, the molded
plastic body 18 forcard 10 completely covers thecircuit side 24 of thesubstrate 12. In addition, the moldedplastic body 18 has a peripheral outline that substantially matches, but is slightly larger than the peripheral outline of thesubstrate 12. As will be further explained, the moldedplastic body 18 can comprise a Novolac based epoxy formed in a desired shape using a transfer molding process, and then cured using an oven. - As shown in FIG. 1B, the molded
plastic body 18 also includes anedge portion 52 that covers theperipheral edge 28 of thesubstrate 12 but leaves thebackside 26 of thesubstrate 12 and theexternal contacts 20 exposed. In addition, as shown in FIGS. 1A and 1D, the moldedplastic body 18 includes a recessedface portion 48 configured to retain a label. The label, for example, can comprise a preprinted sheet of paper having art work on one side, and an adhesive on an opposing side. As also shown in FIGS. 1A and 1D, the moldedplastic body 18 includes agroove 50 that functions as a finger grip for handling thecard 10. - As also shown in FIGS. 1A and 1B, the molded
plastic body 18 includesnotches 38 formed in theedge portion 52. In the illustrative embodiment, thenotches 38 are generally hemispherical in shape, and extend completely through theedge portion 52 of the moldedplastic body 18. Thenotches 38 can also extend a short distance into thesubstrate 12 such that theperipheral edge 28 of thesubstrate 12 is slightly notched. In the illustrative embodiment, there are fournotches 38 consisting of two pairs located on opposing longitudinal sides of thecard 10. Thenotches 38 align with connecting segments 54 (FIG. 3A) of thesubstrate 12 that initially attach thesubstrate 12 to thestrip 30. One function of thenotches 38 is to provide access for severing the connectingsegments 54 to singulate thesubstrate 12, and thecard 10, from thestrip 30 following the fabrication process. Another function of thenotches 38 is to provide an enclosed area for containing rough edges of thesubstrate 12, or slivers of substrate material, that may form during severing of the connectingsegments 54. - Referring to FIGS.2A-2F and 3A-3F, steps in a method for fabricating the
card 10 are illustrated. Initially as shown in FIGS. 2A and 3A, thestrip 30 containing thesubstrate 12, as well as additional substrates 12 (not shown) is provided. Thestrip 30 can also be described as a panel similar in construction to a semiconductor lead frame, and can include as many substrates as desired (e.g., two to eighteen). Thestrip 30 facilitates the fabrication process in that different operations, such as die attach, wire bonding, molding and singulation can be performed at the same time onmultiple substrates 12. If desired, thestrip 30 can be constructed from a commercially produced bi-material core, such as a copper clad bismaleimide-triazine (BT) core, available from Mitsubishi Gas Chemical Corp., Japan. A representative weight of the copper can be from 0.5 oz to 2 oz. per square foot. - As shown in FIG. 3A, the
strip 30 can includeindexing openings 56 that facilitate handling by automated equipment such as conveyors, magazines, die attachers, wire bonders and molding apparatus. In addition, thesubstrate 12 on thestrip 30 can include theconductors 32, thecontacts 36 and theelectrical components 40, configured substantially as previously described, on thecircuit side 24 of thesubstrate 12. Similarly, thesubstrate 12 can include theexternal contacts 20 on thebackside 26, and the vias (not shown) which electrically connect theexternal contacts 20 to theconductors 32, to theelectrical components 40 and to thecontacts 36. - The
strip 30 also includes the connectingsegments 54 configured to attach thesubstrate 12 to thestrip 30. The connectingsegments 54 are similar in structure and function to tie bars of a semiconductor lead frame. As also shown in FIG. 3A, aperipheral opening 58 though thestrip 30 defines the peripheral outline of thesubstrate 12. Theperipheral opening 58 is continuous except where the connectingsegments 54 are located. - Next, as shown in FIGS. 2B and 3B, the
semiconductor components 14 are mounted to thecircuit side 24 of thesubstrate 12. Adhesive layers 60 (FIG. 2B) such as a curable adhesive (e.g., polyimide), or a tape material (“KAPTON” tape), can be used to adhesively attach thesemiconductor components 14 to thesubstrate 12. Also, a conventional die attacher can be used to perform the attachment process. - As shown in FIG. 3B, the
semiconductor components 14 can be wire bonded to thesubstrate 12 by bonding thewires 44 to thebond pads 62 on thesemiconductor components 14 and to thebond pads 34 on thesubstrate 12. A conventional wire bonder can be used to perform the wire bonding step. Alternately, instead of wire bonding, a flip chip process (e.g., C4), or a TAB bonding process, can be used to electrically connect thesemiconductor components 14 to theconductors 32. - As another alternative, the
semiconductor components 14A (FIG. 1F) can includecontacts 46A (FIG. 1F) such as solder balls configured for bonding to thebond pads 34 on thesubstrate 12 using a solder reflow process. Alternately, thecontacts 46A (FIG. 1F) can comprise conductive polymer bumps configured for bonding to thebond pads 34 on thesubstrate 12 using a curing process. - As also shown in FIGS. 2B and 3B, following wire bonding, the
encapsulant 16 can be formed on thesemiconductor components 14 and on portions of thesubstrate 12. Theencapsulant 16 can comprise a glob top material, such as an epoxy resin or silicone, deposited using a suitable deposition process and then cured. As another alternative theencapsulant 16 can comprise a Novolac based epoxy formed in a desired shape using a transfer molding process, and then cured using an oven. - Next, as shown in FIGS. 2C and 3C, the molded
plastic body 18 is formed using amolding apparatus 64. Themolding apparatus 64 can comprise a conventional transfer molding apparatus modified to includepins 74 to be hereinafter described. Themolding apparatus 64 includes afirst plate 66 configured to contact thecircuit side 24 of thesubstrate 12. In addition, themolding apparatus 64 includes asecond plate 72 configured to contact theback side 26 of thesubstrate 12. If desired, theback side 26 of thesubstrate 12 can be protected by tape or other protective member during the molding process. - The
first plate 66 of themolding apparatus 64 includes amold cavity 68 in fluid communication with apressurized source 70 of a molding compound such as a Novolac based epoxy. Themold cavity 68 is adapted to receive the molding compound and to mold the moldedplastic body 18 over theencapsulant 16, and on thecircuit side 24 andperipheral edge 28 of thesubstrate 12. In addition, themold cavity 68 is adapted to define features of the moldedplastic body 18 such as the face portion 48 (FIG. 1A) and the groove 50 (FIG. 1A). - The
first plate 66 and thesecond plate 72 are configured to apply pressure to thesubstrate 12 during the molding process to prevent molding compound from forming on portions of thesubstrate 12 such as on theback side 26 thereof (i.e., to prevent “flash” from forming). Thefirst plate 66 also includes fourpins 74 located within themold cavity 68, which are configured to form the notches 38 (FIG. 1B) in the moldedplastic body 18. - As shown in FIG. 3C, the
pins 74 align with the connectingsegments 54 which attach thesubstrate 12 to thestrip 30. Thepins 74 are configured to contact the connectingsegments 54 during the molding process. This forms the notches 38 (FIG. 1B) in the moldedplastic body 18 in exact alignment with the connectingsegments 54. Thepins 74 are also configured to apply pressure to the connectingsegments 54, such that molding compound does not flow beneath the connectingsegments 54 and form “flash” on theback side 26 of thesubstrate 12. In the illustrative embodiment thepins 74 are generally cylindrically shaped and form thenotches 38 with a hemispherical shape. However, thepins 74 can have other geometrical configurations adapted to form thenotches 38 in other shapes (e.g., square, rectangular, quarter moon, etc.). - Referring to FIGS. 2D and 3D, the molded
plastic body 18 is shown following the molding process. As shown in FIG. 3D, thenotches 38 in the moldedplastic body 18 are aligned with the connectingsegments 54. However, the connectingsegments 54 remain intact such that thesubstrate 18 remains connected to thestrip 30. - Next, as shown in FIGS. 2E and 3E, a singulating step is performed to sever the connecting
segments 54 and separate thesubstrate 18 from thestrip 30. For performing the singulating step, apunch apparatus 76 can be provided. Thepunch apparatus 76 can comprise a conventional punch or press that includescutters 78 configured to sever the connectingsegments 54 at their point of attachment to thesubstrate 18. Thecutters 78 are sized and shaped similarly to thepins 74, such that they are able to move through thenotches 38 to sever the connectingsegments 54. Thenotches 38 thus provide access for thecutters 78 to the connectingsegments 54. - Referring to FIGS. 2F and 3F, the
card 10 is illustrated following the singulating step but prior to removal from thestrip 30. As shown in FIG. 3F, aperipheral outline 80 of thecard 10 is defined by theperipheral opening 58 through thestrip 30. In addition, the connectingsegments 54 in theopening 58 have been severed such that thecard 10 can be removed from thestrip 30. - Referring to FIG. 4, one of the
notches 38 is shown in an enlarged view. In this case, the connectingsegment 54 was not cleanly severed such that asliver 82 of substrate material remains. However, thesliver 82 is contained within thenotches 38 such that the peripheral outline and dimensions of thecard 10 will meet specification. Thenotches 38 also function to shield rough edges that may have resulted from shearing of the connectingsegments 54. - Referring to FIG. 5, a
system 84 configured to perform the method of the invention is illustrated. Thesystem 84 includes thestrip 30 containing thesubstrates 12. In addition, thesubstrates 12 are defined by theperipheral openings 58 in thestrip 30, and are attached to thestrip 30 by the connecting segments 54 (FIG. 3A). Thesystem 84 also includes themolding apparatus 64 having thepins 74 configured to contact the connecting segments 54 (FIG. 3C) during molding of the moldedplastic body 18. In addition, thepins 74 form the notches 38 (FIG. 1A) in the moldedplastic body 18. Thesystem 84 also includes thepunch apparatus 76 havingcutters 78 configured to sever the connecting segments 54 (FIG. 3E). - Thus the invention provides an improved semiconductor card, a method for fabricating the card, and a system for performing the method. While the invention has been described with reference to certain preferred embodiments, as will be apparent to those skilled in the art, certain changes and modifications can be made without departing from the scope of the invention as defined by the following claims.
Claims (50)
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