US20020056874A1 - Semiconductor device and method for fabricating the same - Google Patents
Semiconductor device and method for fabricating the same Download PDFInfo
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- US20020056874A1 US20020056874A1 US09/749,590 US74959000A US2002056874A1 US 20020056874 A1 US20020056874 A1 US 20020056874A1 US 74959000 A US74959000 A US 74959000A US 2002056874 A1 US2002056874 A1 US 2002056874A1
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- silicon film
- polycrystalline silicon
- boron
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims description 41
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 193
- 229910052796 boron Inorganic materials 0.000 claims abstract description 119
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 115
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 91
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 91
- 239000010703 silicon Substances 0.000 claims abstract description 90
- 238000009413 insulation Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000013078 crystal Substances 0.000 claims abstract description 16
- 150000004767 nitrides Chemical class 0.000 claims abstract description 16
- 239000012535 impurity Substances 0.000 claims abstract description 15
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 49
- 238000000059 patterning Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 abstract description 25
- 230000004888 barrier function Effects 0.000 abstract description 13
- 230000003247 decreasing effect Effects 0.000 abstract description 10
- 150000002500 ions Chemical class 0.000 description 12
- -1 tungsten nitride Chemical class 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 10
- 238000009826 distribution Methods 0.000 description 8
- 239000002019 doping agent Substances 0.000 description 7
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 7
- 229910021342 tungsten silicide Inorganic materials 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000005465 channeling Effects 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 6
- 229910021332 silicide Inorganic materials 0.000 description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910021341 titanium silicide Inorganic materials 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 238000005280 amorphization Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
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- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 description 2
- SKKMWRVAJNPLFY-UHFFFAOYSA-N azanylidynevanadium Chemical compound [V]#N SKKMWRVAJNPLFY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- AKJVMGQSGCSQBU-UHFFFAOYSA-N zinc azanidylidenezinc Chemical compound [Zn++].[N-]=[Zn].[N-]=[Zn] AKJVMGQSGCSQBU-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910001337 iron nitride Inorganic materials 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- XUIMIQQOPSSXEZ-NJFSPNSNSA-N silicon-30 atom Chemical compound [30Si] XUIMIQQOPSSXEZ-NJFSPNSNSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/6656—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using multiple spacer layers, e.g. multiple sidewall spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
- H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
- H01L21/28061—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a metal or metal silicide formed by deposition, e.g. sputter deposition, i.e. without a silicidation reaction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28247—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon passivation or protection of the electrode, e.g. using re-oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
- H01L29/4925—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
- H01L29/4941—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a barrier layer between the silicon and the metal or metal silicide upper layer, e.g. Silicide/TiN/Polysilicon
Definitions
- the first polycrystalline silicon film and the second polycrystalline silicon film are doped with boron, a boron concentration in the first polycrystalline silicon film near an interface between the first polycrystalline silicon film and the second polycrystalline silicon film is higher than a boron concentration in the second polycrystalline silicon film near the interface between the first polycrystalline silicon film and the second polycrystalline silicon film.
- a 5 nm-thick WN film 20 is formed on the amorphous silicon film 18 by, e.g., sputtering method.
Abstract
The semiconductor device comprises a pair of impurity diffused regions formed in a silicon substrate 10, spaced from each other, and a gate electrode 26 formed above the silicon substrate 10 between the pair of impurity diffused regions 38 intervening a gate insulation film 12 therebetween. The gate electrode 26 is formed of a polycrystalline silicon film 16 formed on the gate insulation film 12, a polycrystalline silicon film 30 formed on the polycrystalline silicon film 16 and having crystal grain boundaries discontinuous to the polycrystalline silicon film 16, a metal nitride film 20 formed on the polycrystalline silicon film 30, and a metal film 22 formed on the barrier metal film 20. Whereby diffusion of the boron from the first polycrystalline silicon film 16 toward the metal nitride film 20 can be decreased. Thus, depletion of the gate electrode 26 can be suppressed.
Description
- The present invention relates to a semiconductor device and a method for fabricating the semiconductor device, more specifically to a semiconductor device including gate electrodes of a polymetal structure having laid polycrystalline silicon films and metal films, and a method for fabricating the same.
- Conventionally, the gate electrodes of MOSFETs have been formed of single polycrystalline silicon layered structures owing to the thermal stability, the compatibility of polycrystalline silicon with silicon of the substrates in its MOS characteristics, etc. Presently, the so-called polycide structure, which is formed of a silicide film deposited on a polycrystalline silicon film, is dominantly used for the end of decreasing sheet resistance of the gate electrodes while utilizing the above-described advantages of polycrystalline silicon. Logic devices and memory devices now on market have gate electrode structures of the polycide structure.
- The gate electrodes of the MOSFETs of the current logic devices generally have layered structures of titanium silicide or cobalt silicide, and polycrystalline silicon. On the other hand, the gate electrodes of the MOSFETs of memory devices are formed of layered structures of tungsten silicide and polycrystalline silicon. This is because the logic device require no high-temperature and long-time heat processing after the gate electrodes have been formed, so that titanium silicide and cobalt silicide, which have low heat resistance but can sufficiently lower sheet resistance, are applicable to the gate electrode of the logic device for high-speed operation. On the other hand, the memory devices require the step of forming capacitors, which require high-temperature and long-time heat processing after the gate electrodes have been formed, so that tungsten silicide, which has higher sheet resistance than titanium silicide and cobalt silicide, but is superior to titanium silicide and cobalt silicide in heat resistance, is applicable to the gate electrode of the memory device compatibly with steps of forming the memory elements.
- It is one reason for applying tungsten silicide to the memory devices that the peripheral circuits of the currently fabricated memory devices are CMOS circuits of the so-called single gates which include the gate electrodes of the N-channel transistors and the gate electrodes of the P-channel transistors formed of N polycrystalline silicon. That is, the memory devices do not require high performance of the peripheral circuits, as do the logic devices, and accordingly it has not been much necessary to use the CMOS circuits of the so-called dual gates which include the gate electrodes of the N-channel transistors formed of N+ polycrystalline silicon, and the gate electrodes of the P-channel transistors formed of P polycrystalline silicon. Furthermore, diffusivity of dopants in tungsten silicide are several orders of magnitude higher than that in polycrystalline silicon, which has made it difficult to apply tungsten silicide to the CMOS circuits having the dual gates.
- Recently, dual-gate CMOS technology is required even in peripheral circuits of memory devices in order to achieve high performance. However, high-performance circuits cannot be achieved in memory devices by using current dual-gate technology for LOGIC devices because of the poor thermal stability and severe inter-diffusion of gate dopants between P+ gate and N+ gate.
- Presently, the so-called polymetal (polycrystalline silicon-metal) gate structures having a refractory metal and polycrystalline silicon laid on each other are considered. The polymetal structure has on polycrystalline silicon a layer of a refractory metal having higher heat resistance and lower sheet resistance than silicide, and can simultaneously satisfy low sheet resistance required by the logic devices, and heat resistance required by the memory devices.
- A MOS transistor having the typical polymetal gate structure will be explained with reference to FIG. 12.
- A
gate electrode 104 is formed on asilicon substrate 100 intervening agate insulation film 102 therebetween. Thegate electrode 104 is formed of a layered structure of apolycrystalline silicon film 106 formed on thegate insulation film 102, a WN (tungsten nitride)film 108 formed on thepolycrystalline silicon film 106 and a W (tungsten) film formed on the WNfilm 108. The WNfilm 108 is a barrier metal for preventing thepolycrystalline silicon film 106 and theW film 110 from reacting with each other to thereby form tungsten silicide, which has high resistance. Acap film 112 of silicon nitride film is formed on thegate electrode 104. Asilicon oxide film 114 is formed on the side walls of thepolycrystalline silicon film 106. Asidewall insulation film 116 is formed on the side walls of thegate electrode 104. A source/drain diffusedlayer 122 formed of a low-concentration diffusedregion 118 and a high-concentration diffusedregion 120 is formed in the silicon substrate on both sides of thegate electrode 104. - The polymetal gate structure shown in FIG. 12 is much superior in heat resistance and in suppressing interdiffusion of a dopant in the
polycrystalline silicon film 106 in a case that the dual gate structure is adopted, whereby sheet resistance does not increase even after high-temperature and long-time heat processing and a threshold voltage of the transistors of the CMOS circuit does not change. - In the conventional method for fabricating the semiconductor device, an amorphous silicon film to be the
polycrystalline silicon film 106 is deposited, boron is doped in the amorphous silicon film, the WNfilm 108 and theW film 10 are deposited, these laid films are patterned to form thegate electrode 104. - However, the semiconductor device having the polymetal structure fabricating by the above-described fabrication method often has depletion in the
gate electrode 104 of the PMOSFET. - The inventors of the present application have made earnest studies of the depletion in the
gate electrode 104 of the PMOSFET and has found for the first time that the depletion in thegate electrode 104 are caused by the fact that boron, a gate dopant of the PMOSFET is absorbed into the reaction layer between theWN film 108 as the barrier metal and thepolycrystalline silicon film 106 to form B—N bonds, which lowers a boron concentration in thepolycrystalline silicon film 106. The depletion in the gate electrode affect characteristics of the MOS transistor, and it is desirable to suppress the depletion as far as possible. - An object of the present invention is to provide a semiconductor device including a polymetal gate structure of the dual gate, which can suppress depletion in the gate electrode of a PMOSFET, and a method for fabricating the same.
- The inventors of the present application have made earnest studies of causes of the depletion of the
gate electrode 104 of the conventional semiconductor device shown in FIG. 12 and have found for the first time that the boron absorption of the WN film is due to B—N bonds formed by boron as a gate dopant being absorbed by the reaction layer between theWN film 108 as a barrier metal and thepolycrystalline silicon film 106. - FIG. 13 is a graph of a boron distribution in the gate electrode of the conventional semiconductor device shown in FIG. 12 measured by secondary ion mass spectroscopy (SIMS). FIG. 14 shows B1s spectrum present on the interface between the WN film and the polycrystalline silicon film analyzed by X-ray photo-electron spectroscopy (XPS).
- As shown in FIG. 13, boron introduced into the
polycrystalline silicon film 106 is absorbed up by the WNfilm 108, and a high concentration of boron is present in the WNfilm 108. As shown in FIG. 14, a peak at the binding energy of 191 eV which corresponds to B—N bond can be observed at the interface between the WN film and the polycrystalline silicon film. Based on these results, it is considered that boron in thepolycrystalline silicon film 106 is absorbed by the reaction layer between theWN film 108 and thepolycrystalline silicon film 106 to form B—N bonds, whereby a boron concentration in thepolycrystalline silicon film 106 is decreased to thereby depletion of thegate electrode 104 occur. - Then, the inventors of the present application groped for means for suppressing the absorption of boron by the reaction layer between the WN film and the polycrystalline silicon film. Resultantly, they considered it effective that a thin silicon film interposed between the polycrystalline silicon film and the WN film. They have succeeded in suppressing boron absorption of the reaction layer between the WN film and the polycrystalline silicon film.
- It is considered that diffusion of boron toward the WN film is suppressed by providing silicon film between the polycrystalline silicon film and the WN film because native oxide film is formed between the polycrystalline silicon film and the silicon film. In the process in which the silicon film is formed after boron has been introduced into the polycrystalline silicon film, the wafer is exposed to the air between the step of forming the polycrystalline silicon film and the step of forming the silicon film, and native oxide film is formed on the surface of the polycrystalline silicon film. Even if a pre-treatment is made before the following formation of the silicon film, native oxide film is formed in the process up to the load of the wafer into a film forming system. It is difficult to completely remove the native oxide film between the polycrystalline silicon film and the silicon film.
- The present invention utilizes the thus-formed native oxide film, so that the native oxide film formed between the polycrystalline silicon film and the silicon film suppresses diffusion of boron from the polycrystalline silicon film toward the silicon film, and accordingly the boron absorption by the WN film is decreased.
- It is considered that the oxide film intervening between the polycrystalline silicon film and the silicon film, when too thick, increases contact resistance between the polycrystalline silicon film and the silicon film, and when too thin, reduces the effect of suppressing the diffusion of the boron. Accordingly, a thickness of the oxide film is preferably 0.5-1.5 nm.
- The silicon film intervening between the polycrystalline silicon film and the WN film may be polycrystalline silicon film or amorphous silicon film. Preferably, the silicon film has a thickness of not less than about 5 nm. This is because when the silicon film has a thickness below about 5 nm, all the silicon film reacts with the WN film, and the suppression of the boron diffusion by the native oxide film is not sufficient. On the other hand, when the silicon film intervening between the polycrystalline silicon film and the WN film is too thick, supply of the boron from the polycrystalline silicon film to the silicon film is insufficient, and contact resistance between the silicon film and the WN film increases. There is a risk that especially AC characteristics may be affected. There is also a risk that over-etching of the WN film is stopped by the native oxide film, and the etching for forming the gate electrode may be complicated. Accordingly, it is preferable that a film thickness of the silicon film is set to be about 2-20 nm.
- FIG. 1 is a graph of boron distributions in the gate electrodes of the Control without silicon film intervening and of the present invention (Example 1) with amorphous silicon film intervening measured by SIMS. For detailed conditions for fabricating the sample of the present invention (Example 1) used in this measurement, a first embodiment which will be described later is referred to. The sample of the Control was fabricated under the same fabrication conditions as those for the first embodiment except that the step of forming the amorphous silicon film is omitted.
- As seen in FIG. 1, in Example 1 of the present invention with the amorphous silicon film (a-Si) intervening, the diffusion of boron toward the WN film is suppressed in comparison with the Control without amorphous silicon film intervening. Thus, in the present invention the boron concentration in the polycrystalline silicon film could be much increased.
- In the present invention, a small peak is observed between the amorphous silicon film and the polycrystalline silicon film. This means that native oxide film is present in the interface. In other words, as means for confirming that the polycrystalline silicon film below the barrier metal was formed by plural times of deposition, measurement of boron concentration distribution by SIMS can be used. Oxygen of the native oxide film may be directly analyzed by SIMS.
- However, in Example 1 shown in FIG. 1, the boron concentration near the surface of the silicon substrate is higher in comparison with that of the Control. This will be because a concentration of boron diffused into the silicon substrate was increased as a boron concentration near the interface was increased. The diffusion of boron into the inside of the silicon substrate affects changes of the flat band voltage, i.e., the threshold voltage of a transistor. It is preferable that the diffusion is suppressed as much as possible.
- The crystal structure of the silicon films in contact with gate insulator is essential for reducing boron penetration into silicon substrate. In the case of polycrystalline silicon, the amount of boron penetration is smaller than in the case of amorphous silicon. Please note if polycrystalline silicon is used for this structure, amorphization using implantation of heavy ion such as Ge is needed before boron implantation, in order to suppress the boron penetration caused by channeling. The inventors presume the mechanism of suppressing boron penetration as follows.
- Generally, the grain size of a polycrystalline silicon film deposited at the temperatures 600-650° C. is smaller than that of a poly-crystallized amorphous silicon film which is poly-crystallized by thermal processing at the temperatures around 800° C. The crystals in the former case grow in columns since boron atoms introduced into the polycrystalline silicon film easily diffuse toward the gate insulation film along the column in the grain boundaries. On the other hand, smaller grain size results in larger crystal grain boundary areas. Accordingly, the boron atoms more tend to be taken into the crystals than in large grain size polycrystalline silicon film such as poly-crystallized amorphous silicon film by thermal processing. Accordingly, it is considered that in the small grain polycrystalline silicon film, boron is diffused in a high concentration near the gate insulation film, but boron is taken into the polycrystalline silicon in a large quantity, so that a concentration of boron which is diffused into the
silicon substrate 10 across thegate insulation film 12 can be low. It can be presumed based on this view that preferably the base polycrystalline silicon film has small crystal grain diameters. - The pre-amorphization of the polycrystalline silicon film is for suppressing the channeling of boron ions upon the doping. Accordingly, when the ions can be implanted at low energy of, e.g., 13 keV, the pre-amorphization of the polycrystalline silicon film is not essential because the punch-through of boron by the channeling into the inside of the silicon substrate can be suppressed.
- FIG. 2 is a graph of boron distributions in the gate electrodes of a Control in which amorphous silicon film doped with boron is poly-crystallized to form the
polycrystalline silicon film 106, and amorphous silicon film intervenes between thepolycrystalline silicon film 106 and theWN film 108, and of the present invention (Example 2) in which polycrystalline silicon film is deposited and pre-amorphized, and doped with boron, and the amorphous silicon film intervenes between thepolycrystalline silicon film 106 and theWN film 108. For detailed conditions for fabricating the sample of the present invention used in this measurement, a second embodiment which will be described later is referred to. The sample of the Control was fabricated under the same fabrication conditions as those for the first embodiment except that the step of forming the amorphous silicon film is omitted. - Polycrystalline silicon film is deposited and is pre-amorphized in place of depositing the amorphous silicon film, whereby, as shown in FIG. 2, a boron concentration in the silicon substrate near the interface with the gate insulation film can be decreased to be equal to that of the Control. Accordingly, change of a threshold voltage of a transistor can be suppressed.
- The sample of Example 2 of the present invention shown in FIG. 2 has the polycrystalline silicon film of a 100 nm-thick, and the polycrystalline silicon film is thicker than the 70 nm-thick polycrystalline silicon film of the Control. However, the effect of suppressing the diffusion of boron into the silicon substrate does not result from decrease of the channeling owing to the increased film thickness of the polycrystalline silicon film. In comparison of the sample (Example 1 of the present invention in FIG. 1) with boron implanted in the 70 nm-thick polycrystalline silicon film with the sample (Example 2 of the present invention in FIG. 2) with boron implanted in the 100 nm-thick polycrystalline silicon film, the latter has a lower concentration of boron which has punched through into the gate silicon substrate even with a higher boron concentration in the polycrystalline silicon film near the gate insulation film than that of the former. Accordingly, it is considered that the effect of suppressing the diffusion of boron toward the silicon substrate results from a difference between a state of diffusion of boron in the polycrystalline silicon film and a state of diffusion of boron in the polycrystalline silicon film having amorphous silicon poly-crystallized.
- FIG. 3 is a graph of results of C-V measurement of a conventional MOS capacitor as a Control, and MOS capacitors formed by the present invention as Examples 1 and 2. Depletion of the p+ polycrystalline silicon of the gate electrodes occur in negative biased region in FIG. 3. Thus, an index for evaluating depletion of a gate electrode can be measured accumulation (negative biased region) capacitances on a C-V curve. It is judged that depletion of the gate electrode is little as an accumulation capacitance is higher. The diffusion of boron toward the silicon substrate can be judged based on an inclination of the C-V curve near 0 V, and it is judged that as an inclination is blunter, i.e., as a flat band voltage is higher, the diffusion of boron toward the substrate is more.
- As shown, Example 1 including an amorphous silicon film intervening between a WN film and a polycrystalline silicon film could have the increased accumulation capacitances in comparison with the Control and could suppress the diffusion of boron toward the substrate to the substantially equal levels.
- FIG. 4 is a graph of results of measured Id-Vg characteristics of a conventional PMOSFET as a Control, and PMOSFETs formed by the present invention. As seen in the results of FIG. 3, in Example 1 shift of the threshold voltages is observed, and it can be observed that boron is diffused toward the silicon substrate. On the other hand, Example 2 of the present invention has substantially the same subthreshold characteristic as the Control, and it is seen that the diffusion of boron toward the silicon substrate is suppressed.
- The above-described object is attained by a semiconductor device comprising: a pair of impurity diffused regions formed in a silicon substrate, spaced from each other; and a gate electrode formed above the silicon substrate between the pair of impurity diffused regions intervening a gate insulation film therebetween, the gate electrode being formed of a first polycrystalline silicon film formed on the gate insulation film, a second polycrystalline silicon film formed on the first polycrystalline silicon film and having crystal grain boundaries which are discontinuous to the first polycrystalline silicon film, and a metal nitride film formed on the second polycrystalline silicon film.
- The above-described object is also attained by a semiconductor device comprising: a pair of impurity diffused regions formed in a silicon substrate, spaced from each other; and a gate electrode formed above the silicon substrate between the pair of impurity diffused regions intervening a gate insulation film therebetween, the gate electrode being formed of a first polycrystalline silicon film formed on the gate insulation film, a second polycrystalline silicon film formed on the first polycrystalline silicon film and having crystal grain boundaries which are discontinuous to the first polycrystalline silicon film, a metal nitride film formed on the second polycrystalline silicon film, and a metal film form on the metal nitride film.
- In the above-described semiconductor device, it is possible that a native oxide film is formed between the first polycrystalline silicon film and the second polycrystalline silicon film.
- In the above-described semiconductor device, it is possible that the first polycrystalline silicon film is doped with boron.
- In the above-described semiconductor device, it is possible that the first polycrystalline silicon film and the second polycrystalline silicon film are doped with boron, a boron concentration in the first polycrystalline silicon film near an interface between the first polycrystalline silicon film and the second polycrystalline silicon film is higher than a boron concentration in the second polycrystalline silicon film near the interface between the first polycrystalline silicon film and the second polycrystalline silicon film.
- In the above-described semiconductor device, it is possible that a crystal grain size of the first polycrystalline silicon film is smaller than a crystal grain size of the second polycrystalline silicon film.
- The above-described object is also attained by a method for fabricating a semiconductor device comprising the steps of: forming a gate insulation film on a silicon substrate; forming a first silicon film doped with boron on the gate insulation film; forming a second silicon film on the first silicon film; forming a metal nitride film on the second silicon film; forming a metal film on the metal nitride film; and patterning a layered structure of the first silicon film, the second silicon film, the metal nitride film and the metal film to form a gate electrode of the layered structure.
- In the above-described method for fabricating a semiconductor device, it is possible that the step of forming the first silicon film includes the step of forming a polycrystalline silicon film on the gate insulation film and the step of doping boron in the polycrystalline silicon film.
- In the above-described method for fabricating a semiconductor device, it is possible that the method further comprises between the step of forming the polycrystalline silicon film and the step of doping boron, the step of amorphizing the surface of the polycrystalline silicon film.
- In the above-described method for fabricating a semiconductor device, it is possible that the step of forming the first silicon film includes the step of forming an amorphous silicon film on the gate insulation film and the step of doping boron in the amorphous silicon film.
- In the above-described method for fabricating a semiconductor device, it is possible that in the step of forming the second silicon film, the second silicon film is formed on the first silicon film intervening a native oxide film therebetween.
- In the above-described method for fabricating a semiconductor device, it is possible that the method further comprises between the step of forming the first silicon film and the step of forming the second silicon film, the step of thermal processing to activate the boron doped in the first silicon film.
- In the above-described method for fabricating a semiconductor device, it is possible that in the step of forming the second silicon film, the second silicon film is formed in a 2-20 nm-thick.
- FIG. 1 is a graph of boron distributions in the gate electrodes of the semiconductor device according to the present invention and the conventional semiconductor device (Part 1).
- FIG. 2 is a graph of boron distributions in the gate electrodes of the semiconductor device according to the present invention and the conventional semiconductor device (Part 2).
- FIG. 3 is a graph of results of C-V measurement of the semiconductor device according to the present invention and the conventional semiconductor device.
- FIG. 4 is a graph of Id-Vg characteristics of PMOSFETs of the semiconductor device according to the present invention and the PMOSFET of the conventional semiconductor device.
- FIG. 5 is a diagrammatic sectional view of the semiconductor device according to a first embodiment of the present invention, which shows a structure thereof.
- FIGS.6A-6D are sectional views of the semiconductor device according to the first embodiment in the steps of the method for fabricating the semiconductor device, which show the method (Part 1).
- FIGS.7A-7C are sectional views of the semiconductor device according to the first embodiment in the steps of the method for fabricating the semiconductor device, which show the method (Part 2).
- FIGS. 8A and 8B are sectional views of the semiconductor device according to the first embodiment in the steps of the method for fabricating the semiconductor device, which show the method (Part 3).
- FIGS. 9A and 9B are sectional views of the semiconductor device according to the first embodiment in the steps of the method for fabricating the semiconductor device, which show the method (Part 4).
- FIGS.10A-10D are sectional views of the semiconductor device according to a second embodiment in the steps of the method for fabricating the semiconductor device, which show the method (Part 1).
- FIGS.11A-11C are sectional views of the semiconductor device according to the second embodiment in the steps of the method for fabricating the semiconductor device, which show the method (Part 2).
- FIG. 12 is a diagrammatic sectional view of the conventional semiconductor device, which shows the structure thereof.
- FIG. 13 is a graph of a boron distribution in the gate electrode of the conventional semiconductor device.
- FIG. 14 is a graph of bonding states of boron in the gate electrode of the conventional semiconductor device.
- [A First Embodiment]
- The semiconductor device according to a first embodiment of the present invention and the method for fabricating the semiconductor device will be explained with reference to FIGS.5, 6A-6D, 7A-7C, 8A-8B and 9A-9B.
- First, a structure of the semiconductor device according to the present embodiment will be explained with reference to FIG. 5.
- A
gate electrode 26 is formed on asilicon substrate 10 intervening agate insulation film 12 therebetween. Thegate electrode 26 has a layered structure ofpolycrystalline silicon films gate insulation film 12, aWN film 20 formed on thepolycrystalline silicon film 30, and aW film 22 formed on theWN film 20. TheWN film 20 is a barrier metal for preventing thepolycrystalline silicon film 30 and theW film 22 from reacting with each other to thereby form tungsten silicide of high resistance. A cap film of asilicon nitride film 24 is formed on thegate electrode 26. Asilicon oxide film 28 for removing damage in patterning thegate electrode 26 is formed on the side walls of thepolycrystalline silicon films sidewall insulation film 34 is formed on the side walls of thegate electrode 26 and thesilicon nitride film 24. A source/drain diffusedlayer 38 including a dopant diffusedregion 32 and a dopant diffusedregion 36 is formed in thesilicon substrate 10 on both sides of thegate electrode 26. - The semiconductor device according to the present embodiment is characterized in that the polycrystalline silicon film formed on the
gate insulation film 12 is formed of thepolycrystalline silicon film 16 which is thicker and thepolycrystalline silicon film 30 which is thinner, and the crystal grain boundaries of thepolycrystalline silicon film 16 are not continuous to those of thepolycrystalline silicon film 30. The discontinuity between the crystal grain boundaries of thepolycrystalline silicon film 16 and thepolycrystalline silicon film 30 is due to different thermal processing steps for the films. Such difference in the crystal grain diameter can be confirmed, e.g., by the cross-sectional observation by a transmission electron microscope (TEM), the boron concentration distribution measurement by SIMS or others. - The semiconductor device according to the present embodiment will be detailed along the method for fabricating the semiconductor device according to the present embodiment.
- First, the
gate insulation film 12 of a 4 nm-thick silicon oxide film containing nitrogen by about some % is formed on asilicon substrate 10 by, e.g., thermal oxidation (FIG. 6A). - Then, the
amorphous silicon film 14 of a 70 nm-thick is formed by, e.g., CVD method on thesilicon substrate 10 with thegate insulation film 12 formed on. - Then, boron ions as an acceptor impurity are implanted into the
amorphous silicon film 14 by ion implantation (FIG. 6C). Boron ions are implanted, e.g., with 5 keV acceleration energy and at a 2×1015 cm dose. Boron is implanted in theamorphous silicon film 14, and the channeling of the implanted ions is suppressed. In place of depositing the non-dopedamorphous silicon film 14 and then implanting boron, theamorphous silicon film 14 doped with boron may be deposited. - Then, thermal processing, e.g., in a nitrogen atmosphere, at 800° C. and for 30 minutes follows. This thermal processing is for crystallizing the
amorphous silicon film 14 to activate the implanted boron while diffusing the implanted boron sufficiently near thegate insulation film 12. This thermal processing lower a boron concentration near theWN film 12, which will be deposited later, and boron which will transit toward theWN film 20 can be decreased. In the following explanation, the crystallizedamorphous silicon film 14 is called thepolycrystalline silicon film 16. - Next, the
amorphous silicon film 18 is formed in a 10 nm-thick on thepolycrystalline silicon film 16 by, e.g., CVD method (FIG. 6D). At this time, native oxide films (not shown) are formed between thepolycrystalline silicon film 16 and theamorphous silicon film 18. - Then, the
WN film 20 is deposited in a 5 nm-thick on theamorphous silicon film 18 by, e.g., sputtering method. - A higher boron concentration is preferable between the
amorphous silicon film 18 and theWN film 20 in consideration of contact resistance between theamorphous silicon film 18 and theWN film 20. From this viewpoint, boron may be implanted into theamorphous silicon film 18 after theamorphous silicon film 18 has been deposited and before theWN film 20 is deposited, if necessary. - Then, the
W film 22 is formed in a 40 nm-thick on theWN film 20 by, e.g., sputtering method. Then, thesilicon nitride film 24 is formed in a 100 nm-thick on theW film 22 by, e.g., CVD method. At this time, the thermal processing in the film forming process crystallizes theamorphous silicon film 18 to be the polycrystalline silicon 30 (FIG. 7B). - The boron in the
polycrystalline silicon film 16 is thermally diffused in this step and the following thermal processing steps, but the diffusion of the boron from thepolycrystalline silicon film 16 toward thepolycrystalline silicon film 30 is suppressed by the native oxide films (not shown) formed between thepolycrystalline silicon film 16 and thepolycrystalline silicon film 30. As a result, a boron concentration in thepolycrystalline silicon film 16 near the interface between thepolycrystalline silicon film 16 and thepolycrystalline silicon film 30 is higher than that in the polycrystalline silicon film near the interface, whereby the boron absorption of theWN film 20 is reduced, and a boron concentration in thepolycrystalline silicon film 16 can made higher (see FIG. 1). - Then, the
silicon nitride film 24, theW film 22, theWN film 20, thepolycrystalline silicon film 30 and thepolycrystalline silicon film 16 are patterned by the usual lithography and etching to form thegate electrode 26 of the polymetal structure which is formed of the layer film of thepolycrystalline silicon films WN film 20 and theW film 22 having the upper surface covered with the silicon nitride film 24 (FIG. 7C). - Then, thermal process is performed, e.g., in an atmosphere containing hydrogen and steam, at 800° C. and for 60 minutes to selectively oxidize the side walls alone of the
polycrystalline silicon films W film 22 and theWN film 20 to thereby form thesilicon oxide film 28. Thesilicon oxide film 28 is for removing etching damage caused in thegate insulation film 12 at the edge of thegate electrode 26 in patterning the gate electrode 26 (FIG. 8A). - Next, with the
gate electrode 26 as a mask, BF2 ions are implanted, e.g., at 5 keV acceleration energy and a 5×1014 cm−2 dose to form in thesilicon substrate 10 on both sides of thegate electrode 26 the impurity diffusedlayer 32 which is to a low-concentration region of an LDD structure or a shallow region of an extension source/drain structure (FIG. 8B). - Then, a 60 nm-thick silicon nitride film is deposited on the entire surface by, e.g., CVD method and etched back to form the
sidewall insulation film 34 of the silicon nitride film on the side walls of thegate electrode 26 and the silicon nitride film 24 (FIG. 9A). - Then, with the
gate electrode 26 and thesidewall insulation film 34 as a mask, boron ions, for example, are implanted at 5 keV acceleration energy and a 2×1015 cm−2 to form the impurity diffusedregion 36, which is to be a heavily doped region of an LDD structure or a deep region of an extension source/drain structure. - Next, in a nitrogen atmosphere thermal processing is performed, e.g., at 950° C. for10 seconds to activate the boron ions introduced into the impurity diffused
regions - Thus, the PMOSFET including the
gate electrode 26 of the polymetal structure is formed. - As describe above, according to the present embodiment, after the
polycrystalline silicon film 16 with boron implanted is formed and before theWN film 20 is formed, theamorphous silicon film 18 intervenes between thepolycrystalline silicon film 16 and theWN film 20, whereby the diffusion of the boron from the polycrystalline silicon film toward theWN film 20 can be decreased. Thus, 40 with Ge ions, it is preferable that a dose is about 5×1014 cm−2 at most. When too much Ge is introduced into thepolycrystalline silicon film 40, the activation of boron is accelerated by B—Ge bonds in thepolycrystalline silicon film 40 on the upper side, and the boron concentration is decreased near the interface with thegate insulation film 12. - Next, boron ions as an acceptor impurity are introduced into the polycrystalline silicon film by ion implantation (FIG. 10D). At this time, the surface of the
polycrystalline silicon film 40 has been amorphized, and the channeling of the implanted ions is suppressed. In place of implanting boron after the non-dopedpolycrystalline silicon film 40 is deposited, the polycrystalline silicon film doped with boron may be deposited. - Then, thermal processing is performed, e.g., in a nitrogen atmosphere at 800° C. for 30 minutes. This thermal processing is for activating the boron implanted in the
polycrystalline silicon film 40 while sufficiently diffusing the boron up to the vicinity of thegate insulation film 12. This thermal processing decreases the boron concentration near aWN film 20 which will be deposited later and can decrease boron which will transit toward theWN film 20. Because thepolycrystalline silicon film 40 is not deposited in the amorphous state, the diffusion of the boron in thepolycrystalline silicon film 40 into thesilicon substrate 10 by this thermal processing and later thermal processing steps can be suppressed (see FIG. 2). - Next, a 10 nm-thick
amorphous silicon film 18 is formed on thepolycrystalline silicon film 40 by, e.g., CVD method (FIG. 11A). At this time, native oxide films (not shown) are present between thepolycrystalline silicon film 40 and theamorphous silicon film 18. - Then, a 5 nm-
thick WN film 20 is formed on theamorphous silicon film 18 by, e.g., sputtering method. - Next, a 40 nm-
thick W film 22 is formed on theWN film 20 by, e.g., sputtering method. - Then, a 100 nm-thick
silicon nitride film 24 is formed on theW film 22 by, e.g., CVD method. At this time, theamorphous silicon film 18 is crystallized by the thermal processing of this film forming step to be a polycrystalline silicon film 30 (FIG. 11B). In forming thepolycrystalline silicon films polycrystalline silicon film 40 are smaller than those of thepolycrystalline silicon film 30. - Next, in the same way as in the method for fabricating the semiconductor device according to the first embodiment shown in FIGS. 7A to9B, a PMOSFET including a
gate electrode 26 of the polymetal structure of the layer films of thepolycrystalline silicon films WN film 20 and the W film 22 (FIG. 11C). - As described above, according to the present embodiment, after boron is introduced into the
polycrystalline silicon film 40 and before theWN film 20 is formed, theamorphous silicon film 18 intervenes between thepolycrystalline silicon film 40 and theWN film 20, whereby diffusion of the boron from thepolycrystalline silicon film 40 toward theWN film 20 can be decreased. Thus, the depletion of thegate electrode 26 can be suppressed. - Boron is not doped with the
amorphous silicon film 14 deposited, but is doped with thepolycrystalline silicon film 40 deposited, whereby diffusion of the boron into thesilicon substrate 10 by later thermal processing can be suppressed. - In the present embodiment, WN film is used as the barrier metal. The absorption of the boron by the barrier metal is caused by formation of bonds between the boron with the nitrogen. Accordingly, the present invention is applicable to MOSFETs including the barrier metals consisting of other nitride materials, e.g., MoN (molybdenum nitride), TiN (titanium nitride), VN (vanadium nitride), CrN (chrome nitride), CuN (copper nitride), FeN (iron nitride), ZnN (zinc nitride), NiN (nickel nitride), etc.
- In the present embodiment, for suppressing diffusion of the boron toward the barrier metal, native oxide films formed between the polycrystalline silicon film and the amorphous silicon film are used. In addition to the use of the native oxide film, a step of positively oxidizing the surface of the polycrystalline silicon film after the polycrystalline silicon film is formed and before the amorphous silicon film is formed may be provided. A thin silicon oxide film of a film thickness equal to the native oxide films can be formed by, e.g., liquid chemical treatment, as of hydrochloric acid, or rapid thermal oxidation.
- In the present embodiment, Ge ions are used for pre-amorphizing the polycrystalline silicon film, but Ge ions are not essential. For example, ions of IV Group, such as Ge (germanium), Si, Sn (tin), ions of III Group, such as Ga (gallium), In (indium), etc., ions of inactive gases, such as Ar (argon), Kr (krypton), and ions of halogen group, such as I (iodine), Cl (chlorine), Br (bromine), etc. can be used. Ions of V Group, which can amorphize the polycrystalline silicon film by relatively low dosage, such as As (arsenic), Sb (antimony), etc., can be also used.
- As described above, according to the present invention, after boron is implanted in the amorphous silicon film or the polycrystalline silicon film, and before the barrier metal of a metal consisting of a nitride is formed, the silicon film intervenes between the film and the barrier metal, whereby diffusion of the boron from the lower polycrystalline silicon film toward the barrier metal can be decreased. Thus, depletion of the gate electrode can be suppressed.
- In forming the lower polycrystalline silicon film, an amorphous silicon film is not deposited, but a polycrystalline silicon film is deposited, and boron is doped into the polycrystalline silicon film, whereby diffusion of the boron toward the silicon substrate by later thermal processing can be suppressed.
Claims (14)
1. A semiconductor device comprising:
a pair of impurity diffused regions formed in a silicon substrate, spaced from each other; and
a gate electrode formed above the silicon substrate between the pair of impurity diffused regions intervening a gate insulation film therebetween, the gate electrode being formed of a first polycrystalline silicon film formed on the gate insulation film, a second polycrystalline silicon film formed on the first polycrystalline silicon film and having crystal grain boundaries which are discontinuous to the first polycrystalline silicon film, and a metal nitride film formed on the second polycrystalline silicon film.
2. A semiconductor device comprising:
a pair of impurity diffused regions formed in a silicon substrate, spaced from each other; and
a gate electrode formed above the silicon substrate between the pair of impurity diffused regions intervening a gate insulation film therebetween, the gate electrode being formed of a first polycrystalline silicon film formed on the gate insulation film, a second polycrystalline silicon film formed on the first polycrystalline silicon film and having crystal grain boundaries which are discontinuous to the first polycrystalline silicon film, a metal nitride film formed on the second polycrystalline silicon film, and a metal film form on the metal nitride film.
3. A semiconductor device according to claim 1 , wherein
a native oxide film is formed between the first polycrystalline silicon film and the second polycrystalline silicon film.
4. A semiconductor device according to claim 2 , wherein
a native oxide film is formed between the first polycrystalline silicon film and the second polycrystalline silicon film.
5. A semiconductor device according to claim 1 , wherein
the first polycrystalline silicon film is doped with boron.
6. A semiconductor device according to claim 2 , wherein
the first polycrystalline silicon film is doped with boron.
7. A semiconductor device according to claim 1 , wherein
the first polycrystalline silicon film and the second polycrystalline silicon film are doped with boron, a boron concentration in the first polycrystalline silicon film near an interface between the first polycrystalline silicon
11. A method for fabricating a semiconductor device comprising the steps of:
forming a gate insulation film on a silicon substrate;
forming a first silicon film doped with boron on the gate insulation film;
forming a second silicon film on the first silicon film;
forming a metal nitride film on the second silicon film;
forming a metal film on the metal nitride film; and
patterning a layered structure of the first silicon film, the second silicon film, the metal nitride film and the metal film to form a gate electrode of the layered structure.
12. A method for fabricating a semiconductor device according to claim 11 , wherein
the step of forming the first silicon film includes the step of forming a polycrystalline silicon film on the gate insulation film and the step of doping boron in the polycrystalline silicon film.
13. A method for fabricating a semiconductor device according to claim 12 , further comprising between the step of forming the polycrystalline silicon film and the step of doping boron,
the step of amorphizing the surface of the polycrystalline silicon film.
14. A method for fabricating a semiconductor device according to claim 11 , wherein
the step of forming the first silicon film includes the step of forming an amorphous silicon film on the gate insulation film and the step of doping boron in the amorphous silicon film.
15. A method for fabricating a semiconductor device according to claim 11 , wherein
in the step of forming the second silicon film, the second silicon film is formed on the first silicon film intervening a native oxide film therebetween.
16. A method for fabricating a semiconductor device according to claim 11 , further comprising between the step of forming the first silicon film and the step of forming the second silicon film,
the step of thermal processing to activate the boron doped in the first silicon film.
17. A method for fabricating a semiconductor device according to claim 11 , wherein
in the step of forming the second silicon film, the second silicon film is formed in a 2-20 nm-thick.
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US6939787B2 (en) | 2005-09-06 |
US20050062115A1 (en) | 2005-03-24 |
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