US20010016436A1 - Contact-making device, in particular for making contact between electrical components and lead frames, and process for its production - Google Patents
Contact-making device, in particular for making contact between electrical components and lead frames, and process for its production Download PDFInfo
- Publication number
- US20010016436A1 US20010016436A1 US09/789,971 US78997101A US2001016436A1 US 20010016436 A1 US20010016436 A1 US 20010016436A1 US 78997101 A US78997101 A US 78997101A US 2001016436 A1 US2001016436 A1 US 2001016436A1
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- United States
- Prior art keywords
- contact
- underside
- upper side
- electrically conducting
- layer
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Definitions
- the present invention relates to a contact-making device, in particular for making contacts between electrical components in electrical subassemblies and lead frames, such as printed-circuit boards, multi-chip modules (MCM), flexible circuits or the like, and to a process for producing a contact-making device.
- a contact-making device in particular for making contacts between electrical components in electrical subassemblies and lead frames, such as printed-circuit boards, multi-chip modules (MCM), flexible circuits or the like, and to a process for producing a contact-making device.
- conductive rubber films In the production of electrical subassemblies, so-called zero-insertion-force connectors or contact-making devices configured for example as “conductive rubber films” have previously been used for making releasable contacts between packaged and unpackaged components and displays and lead frames, such as printed-circuit boards or the like. These conductive rubber films are generally elastomers filled with metal particles or carbon particles, thereby producing electrical conductivity. Furthermore, special elastic contact-making devices that are filled with wire clews as contact elements are used.
- a contact-making device for making electrical contact between components.
- the contact-making device contains a zero-insertion-force connector having an elastic dielectric with an underside and an upper side forming an underside and an upper side, respectively, of the zero-insertion-force connector.
- the elastic dielectric is formed of at least one elastic dielectric layer each having an underside and an upper side.
- Contact points are disposed on both the upper side and the underside of the zero-insertion-force connector.
- Electrically conducting connections are disposed in the elastic dielectric and each of the electrically conducting connections respectively connecting a number of the contact points to one another.
- a structured metal layer is disposed on one of the underside and the upper side of at least one layer of the elastic dielectric.
- the electrically conducting connections connect the structured metal layer to the contact points on an oppositely lying one of the underside and the upper side of the zero-insertion-force connector.
- the object is achieved according to a first aspect of the invention by a contact-making device, in particular for making contacts between electrical components and lead frames.
- the contact making device has an electrical zero-insertion-force connector having an elastic dielectric, a number of electrically conducting connections formed in the electrical zero-insertion-force connector and a number of contact points are disposed on the upper side and underside of the electrical zero-insertion-force connector. The contact points are connected via the connections.
- the electrical contact-making device is distinguished first by the fact that high contact-making dependability is ensured. At the same time, the necessary contact forces can be kept relatively low. This leads to a reduction in the risk of damage to the components and the contact-making device. Furthermore, the contact-making device can be adapted to the corresponding configuration and layout of the components for which contacts are to be made. The contact-making device is elastic, and therefor can be used even for very small connection patterns and contact areas and can be produced inexpensively in high numbers. In addition, targeted contact-making between the respective contact points on the components and lead frames is possible.
- the contact-making device can be produced virtually irrespective of its size in modern printed-circuit board and MCM production operations, since they have a similar structure.
- the contact-making device establishes in particular a releasable electrical connection between components and the lead frames that allows individual components to be exchanged or replaced.
- connections within the elastic electrical zero-insertion-force connector can be established for example by the so-called “micro-via technique”, for instance by laser structuring or the like.
- the elastic dielectric may be formed from silicone rubber or polyurethane.
- the invention is not restricted to the use of these two materials. Rather, any material that is on the one hand elastic and on the other hand electrically insulating can be used.
- the contact points can in each case protrude beyond the plane of the upper side and underside of the electrical zero-insertion-force connector. This makes it possible, on the one hand, to compensate in a simple way for differences in level in the surfaces of the components, lead-frames and the like for which contacts are to be made. In addition, contact-making can also be performed in depressions of the components and lead-frames in a reliable and dependable way, which was possible only inadequately with the previously known contact-making devices.
- the surfaces of the contact points may advantageously have a metal coating, preferably a gold coating. As a result, the contact-making dependability is further increased. Of course, other metals are also conceivable as a coating.
- individual contact points which are respectively disposed on the upper side and underside of the electrical zero-insertion-force connector can be connected to one another via the connections.
- those contact points that are disposed at positions respectively lying directly opposite one another on the upper side and underside of the electrical zero-insertion-force connector are connected to one another via the connections.
- the present invention is not restricted to any specific interconnection of the individual contact points on the upper side and underside of the electrical zero-insertion-force connector. Rather, the required interconnection is governed by the connection patterns and contact areas to be provided with contacts of the components for which contacts are to be made.
- the connections in the electrical zero-insertion-force connector may advantageously form a three-dimensional circuit system.
- the so-called “translator effect” can also be used if it is required.
- Such a “translator effect” is needed in particular if there is a very fine connection pattern on the component for which contacts are to be made, while the lead-frame has a coarser pattern.
- the three-dimensional circuit system allows the contact-making dependability to be further increased.
- one and the same contact-making device can be used universally, even for making contacts between extremely different components.
- the three-dimensional circuit system may preferably have a meandering form.
- connections may be disposed in releasable contact with respect to other connections in the electrical zero-insertion-force connector.
- This allows the linking of the electrically conducting connections within the elastic electrical zero-insertion-force connector to be varied according to the prevailing contact force. Therefore, different structures of the three-dimensional circuit system can be produced within the electrical zero-insertion-force connector. As a result, a variation of the connection of individual contact points is possible, whereby the flexibility in the making of contacts between various components and the contact-making dependability are further increased.
- the electrical zero-insertion-force connector may be formed from one or more layers of an elastic dielectric.
- an elastic dielectric may be formed from one or more layers of an elastic dielectric.
- the lead-frame may have an electrically conducting layer, preferably a metal layer, on the upper side and/or underside.
- a preferred metal is copper, but other metals which are suitable as electrical conductors are also conceivable.
- the layer may also be produced from other electrically conducting materials and compositions. Silver conductive adhesive may be mentioned as one example of this.
- two or more dielectric layers may have an electrically conducting layer, preferably a metal layer, on the upper side and/or underside.
- an electrically conducting layer preferably a metal layer
- the electrically conducting layer may preferably be formed as a foil. However, it may also be formed by screen printing, a special coating operation or the like.
- one or more layers of a photolithographic film may be provided on the upper side and/or the underside of the electrical zero-insertion-force connector.
- the connections which are disposed in the electrical zero-insertion-force connector may be formed by a structuring of the dielectric layer(s), of the electrically conducting layer(s), if present, and of the photolithographic film(s), if present. Consequently, the connections can be established for example by the “micro-via technique”, for instance by laser structuring, in a way similar to in the production of modern printed-circuit boards. This allows the contact-making device according to the invention to be produced in a particularly inexpensive way.
- the contact points and/or the metal layer(s) may be electro-deposited.
- the connections within the electrical zero-insertion-force connector may also be electrolytically produced.
- other types of production such as for example conductive paste printing or the like, are also possible.
- the contact-making device allows contacts to be made for electrical components in a simple and dependable way.
- the required contact force and the required contact path of the individual contact points can be set by the elasticity of the dielectric and the configuration of the circuit system containing the connections—and in this way for example by the number of translator layers present—and can be adapted to the prevailing circumstances.
- the contact-making device may also be configured a ball grid array (BGA) or micro-BGA, which makes it possible for low-cost products and products of high volume to be mounted in an inexpensive way.
- BGA ball grid array
- micro-BGA micro-BGA
- a process for producing the contact-making device, preferably for making contacts between electrical components and lead-frames, in particular for producing a contact-making device according to the invention as described above.
- the process is characterized according to the invention by the following steps:
- the production of the electrical zero-insertion-force connector can take place for example by coating an electrically conducting layer, for instance a metal layer and here in particular a copper layer, with a liquid dielectric material.
- the coating may take place by casting (as in the case of solder resist), spraying, centrifuging, rolling or similar processes. Laminating on of partially polymerized dielectric films is also possible. Subsequently, a second metal layer is applied to the dielectric material on the side opposite the first metal layer and the dielectric is cured. Then the structuring of for forming the connections can be performed.
- two or more layers of an elastic dielectric which are coated on the upper side and/or underside with an electrically conducting layer can be produced. After they have been structured, the individual layers of the dielectric are connected to one another to produce the electrical zero-insertion-force connector.
- the upper side and/or the underside of the dielectric layer(s) may be coated with at least one photolithographic film.
- the number of layers of photolithographic film to be used depends on requirements.
- the photolithographic film(s) may serve as protection for the components located thereunder. It may also be used for the structuring of the individual connections.
- the structuring of the dielectric layer(s) and/or of the electrically conducting layer(s) and/or of the photolithographic film(s) may advantageously be performed by laser structuring—for example by laser drilling and/or photostructuring and/or by etching-structuring.
- laser structuring for example by laser drilling and/or photostructuring and/or by etching-structuring.
- other types of structuring are also conceivable.
- the contact points may be built up electrolytically on the upper side and underside of the lead-frame.
- the other types of production as described further above, are also conceivable.
- the contact points may advantageously be coated with a metal layer, for example a gold layer.
- the making of contacts between the individual dielectric layers may also take place via the metal layer(s) to form the electrical zero-insertion-force connector.
- the structured metal layer is provided on the upper side and the underside of at least one layer of the elastic dielectric.
- the electrically conducting connections connect the structured metal layer on the upper side to the structured metal layer on the underside.
- the at least one elastic dielectric layer is one of at least two elastic dielectric layers
- the structured metal layer is disposed between the two elastic dielectric layers
- the electrically conducting connections connect the contact points which are offset laterally in relation to one another with respect to the elastic dielectric layers to one another through the structured metal layer.
- the at least one elastic dielectric layer is one of a plurality of elastic dielectric layers and the upper side and the underside of each of the elastic dielectric layers have disposed thereon a respective structured metal layer.
- the electrically conducting connections in each case connect the two structured metal layers to each other.
- the contact points disposed next to one another on the upper side and on the underside of the zero-insertion-force connector are connected to one another through the electrically conducting connections.
- the elastic dielectric is formed from silicone rubber or polyurethane.
- the contact points have surfaces and a gold coating is disposed on the surfaces of the contact points.
- At least some of the electrically conducting connections are disposed in releasable contact with respect to others of the electrically conducting connections in the zero-insertion-force connector.
- a process for producing a contact-making device for making electrical contact between components includes the step of forming a zero-insertion-force connector having an upper side and an underside.
- the zero-insertion-force connector is formed by the steps of:
- the step of applying the metal layer to both sides of the layer and the further layer of the elastic dielectric there is the step of applying the metal layer to both sides of the layer and the further layer of the elastic dielectric.
- the metal layers are connected to one another by making contacts being electrolytically made between the metal layers.
- step of providing at least one layer of a photolithographic film on the upper side and/or the underside of the electrical zero-insertion-force connector is the step of providing at least one layer of a photolithographic film on the upper side and/or the underside of the electrical zero-insertion-force connector.
- step of forming an area for the electrically conducting connections by structuring the elastic dielectric, the metal layer, and/or the photolithographic film.
- a process for producing a contact-making device for making contact between electrical components and lead-frames includes the steps of: producing an electrical zero-insertion-force connector having at least one layer of an elastic dielectric coated on at least one of an upper side and an underside with an electrically conducting layer; structuring the elastic dielectric and the electrically conducting layer to form an area for a number of electrically conducting connections; forming the electrically conducting connections in the electrical zero-insertion-force connector; and applying a number of contact points to an upper side and an underside of the electrical zero-insertion-force connector, the contact points being connected to one another through the electrically conducting connections.
- step of performing the structuring step by laser structuring, photo-structuring, and/or etching-structuring.
- FIG. 1 is a diagrammatic, partial sectional view of a configuration of an electrical component and a lead frame between which contacts can be made by a contact-making device according to the invention
- FIG. 2 is a sectional view of a further embodiment of the contact-making device
- FIG. 3 is a sectional view of another embodiment of the contact-making device at its starting height before the contact-making.
- FIG. 4 is a sectional view of the contact-making device according to FIG. 3 at its contact-making height after contact-making.
- FIG. 1 there is shown a printed-circuit board 10 , for which contact with an electrical component 11 is made by a contact-making device 20 .
- holding elements 12 are provided on both sides of the contact-making device 20 .
- Both the printed-circuit board 10 and the electrical component 11 have a contact pattern with a multiplicity of contacts 13 .
- the individual contacts 13 are connected to one another by the contact-making device 20 .
- the contact-making device 20 has an electrical zero-insertion-force connector 21 , which has an elastic dielectric layer 30 . Furthermore, the electrical zero-insertion-force connector 21 has a number of electrically conducting connections 22 .
- the connections 22 respectively connect a number of contact points 25 that are disposed on an upper side 23 and an underside 24 of the electrical zero-insertion-force connector 21 .
- the contact points 25 are respectively in connection with the contacts 13 of the printed-circuit board 10 and of the electrical component 11 , whereby the making of releasable contacts between the component 11 and the printed-circuit board 10 is made possible.
- the contact points 25 protrude beyond the plane of the upper side 23 and underside 24 , whereby it is also possible for contacts to be made in depressions of the corresponding electrical components 10 , 11 .
- FIG. 2 Another embodiment of the contact-making device 20 is represented in FIG. 2.
- the contact points 25 that are disposed directly opposite one another on the upper side 23 and the underside 24 of the electrical zero-insertion-force connector 21 are respectively connected to one another via the connections 22 .
- the connections 22 are configured differently, so that a different three-dimensional circuit system, formed by the connections 22 , is obtained within the electrical zero-insertion-force connector 21 .
- the configuration of the circuit systems that are suitable in each case depend on the application.
- FIGS. 3 and 4 A further exemplary embodiment of a contact-making device 20 according to the invention is represented in FIGS. 3 and 4.
- FIG. 3 shows the contact-making device 20 before the actual contact-making operation with a starting height “ha”.
- the electrical zero-insertion-force connector 21 has a plurality of layers of the elastic dielectric 30 .
- the individual dielectric layers 30 are respectively coated on their upper side and underside with a metal layer 27 .
- the entire electrical zero-insertion-force connector 21 is coated on its upper side 23 and its underside 24 with a metal layer 26 .
- a multiplicity of the contact points 25 are provided on the upper side 23 and the underside 24 of the electrical zero-insertion-force connector 21 .
- the individual metal layers 26 and 27 and also the dielectric layers 30 are structured and form a three-dimensional circuit system that contains the individual connections 22 .
- Both the contact points 25 that are disposed on the respectively oppositely lying upper side 23 and underside 24 of the electrical zero-insertion-force connector 21 and the contact points 25 which are respectively disposed next to one another either on the upper side 23 or the underside 24 are connected to one another by the circuit system formed by the connections 22 .
- the special configuration of the three-dimensional circuit system allows the so-called “translator effect” to be produced, whereby contacts can be made between components and contact-making devices with different patterns of the contact points in a nevertheless satisfactory manner.
- the contact-making device 20 After contact-making and applying a suitable contact force, the contact-making device 20 is compressed into the contact-making height “he”, as is represented in FIG. 4.
- the compressing of the electrical zero-insertion-force connector 21 has the effect that the connections 22 forming the three-dimensional circuit system are displaced. This results in a three-dimensional circuit system in which the contact points 25 respectively lying directly opposite one another on the upper side 23 and the underside 24 of the electrical zero-insertion-force connector 21 are electrically connected to one another via the connections 22 in the contact-making state.
- the metal layer 26 is provided in the form of a thin copper foil 26 .
- the thin copper foil 26 is coated with a liquid silicone rubber or polyurethane as the dielectric layer 30 .
- the coating may take place by casting (as in the case of solder resist), spraying, centrifuging, rolling or the like.
- the other metal layer 27 being a second copper foil 27 is laminated onto the still liquid dielectric 30 .
- a copper layer may also be applied to an already cured dielectric 30 .
- the elastic dielectric 30 is cured.
- connections 22 also known as micro-vias—are introduced into the copper foils 26 , 27 and the dielectric by laser structuring—for example by laser drilling—to produce a first plated-through level.
- the metal layers 26 , 27 may also be photo-structured or etching-structured.
- the connections 22 are thereby formed in the structured layer structure formed in and of the metal layers 26 , 27 and the dielectric layer 30 .
- the electrical zero-insertion-force connector 21 with the structure represented in FIG. 3 is produced.
- the dielectric layer 30 last applied that is to say the dielectric layer 30 lying on the outside, is coated with one or more layers of photolithographic film.
- the photolithographic films and, according to requirements, the dielectric layers 30 are laser-structured to allow the formation of the connections 22 .
- the contacts 25 are electrolytically applied to the upper side 23 and the underside 24 of the electrical zero-insertion-force connector 21 and are electrolytically plated with a gold layer 31 .
- photolithographic films are applied to the upper side 23 and the underside 24 of the electrical zero-insertion-force connector 21 . These photolithographic films serve on the one hand as protection for the contacts, and on the other hand as the starting material for the subsequent production of the contact points 25 .
- the photolithographic films are then laser-structured to produce the contact points 25 . Subsequently, the contact points 25 are built up electrolytically on the contacts and then electrolytically gold-plated. The photolithographic films are stripped and subsequently a final etching-structuring of the upper side 23 and the underside 24 is performed. The resulting contact-making device 20 can be used for making contacts between different electrical components.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US10/213,750 US6948242B2 (en) | 1998-08-17 | 2002-08-06 | Process for producing a contact-making device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19837246.9 | 1998-08-17 | ||
DE19837246 | 1998-08-17 | ||
PCT/DE1999/002564 WO2000011755A1 (de) | 1998-08-17 | 1999-08-16 | Kontaktiervorrichtung, insbesondere zum ankontaktieren von elektrischen bauelementen und schaltungsträgern, sowie verfahren zu deren herstellung |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1999/002564 Continuation WO2000011755A1 (de) | 1998-08-17 | 1999-08-16 | Kontaktiervorrichtung, insbesondere zum ankontaktieren von elektrischen bauelementen und schaltungsträgern, sowie verfahren zu deren herstellung |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/213,750 Division US6948242B2 (en) | 1998-08-17 | 2002-08-06 | Process for producing a contact-making device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20010016436A1 true US20010016436A1 (en) | 2001-08-23 |
Family
ID=7877783
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/789,971 Abandoned US20010016436A1 (en) | 1998-08-17 | 2001-02-20 | Contact-making device, in particular for making contact between electrical components and lead frames, and process for its production |
US10/213,750 Expired - Lifetime US6948242B2 (en) | 1998-08-17 | 2002-08-06 | Process for producing a contact-making device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/213,750 Expired - Lifetime US6948242B2 (en) | 1998-08-17 | 2002-08-06 | Process for producing a contact-making device |
Country Status (5)
Country | Link |
---|---|
US (2) | US20010016436A1 (ja) |
EP (1) | EP1105942B1 (ja) |
JP (1) | JP2002523881A (ja) |
DE (1) | DE59901657D1 (ja) |
WO (1) | WO2000011755A1 (ja) |
Cited By (8)
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US20050215086A1 (en) * | 2002-10-28 | 2005-09-29 | Jsr Corpation | Sheet-form connector and production method and application therefor |
US7052290B1 (en) * | 2005-08-10 | 2006-05-30 | Sony Ericsson Mobile Communications Ab | Low profile connector for electronic interface modules |
US7187123B2 (en) | 2004-12-29 | 2007-03-06 | Dupont Displays, Inc. | Display device |
US20080200046A1 (en) * | 2007-02-20 | 2008-08-21 | Qimonda Ag | Interconnection structure and method of manufacturing the same |
US20130143420A1 (en) * | 2011-12-02 | 2013-06-06 | David Noel Light | Electrical Connector and Method of Making It |
US9318824B2 (en) | 2012-07-03 | 2016-04-19 | Yazaki Corporation | Connecting structure for terminal fitting and substrate |
US9343830B1 (en) * | 2015-06-08 | 2016-05-17 | Xcerra Corporation | Integrated circuit chip tester with embedded micro link |
US20160204535A1 (en) * | 2013-09-27 | 2016-07-14 | Wenmin Ye | Device for coupling a plc bus |
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US6816385B1 (en) | 2000-11-16 | 2004-11-09 | International Business Machines Corporation | Compliant laminate connector |
US8074622B2 (en) * | 2005-01-25 | 2011-12-13 | Borgwarner, Inc. | Control and interconnection system for an apparatus |
EP3116070B1 (fr) * | 2015-07-07 | 2021-10-06 | Ingenico Group | Connecteur de circuit intégré sécurisé |
FR3038779A1 (fr) | 2015-07-07 | 2017-01-13 | Ingenico Group | Connecteur de carte a puce securise |
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-
1999
- 1999-08-16 DE DE59901657T patent/DE59901657D1/de not_active Expired - Lifetime
- 1999-08-16 WO PCT/DE1999/002564 patent/WO2000011755A1/de active IP Right Grant
- 1999-08-16 JP JP2000566922A patent/JP2002523881A/ja active Pending
- 1999-08-16 EP EP99952416A patent/EP1105942B1/de not_active Expired - Lifetime
-
2001
- 2001-02-20 US US09/789,971 patent/US20010016436A1/en not_active Abandoned
-
2002
- 2002-08-06 US US10/213,750 patent/US6948242B2/en not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050215086A1 (en) * | 2002-10-28 | 2005-09-29 | Jsr Corpation | Sheet-form connector and production method and application therefor |
US7318729B2 (en) * | 2002-10-28 | 2008-01-15 | Jsr Corporation | Sheet-form connector and production method and application therefor |
US7187123B2 (en) | 2004-12-29 | 2007-03-06 | Dupont Displays, Inc. | Display device |
US7052290B1 (en) * | 2005-08-10 | 2006-05-30 | Sony Ericsson Mobile Communications Ab | Low profile connector for electronic interface modules |
US20080200046A1 (en) * | 2007-02-20 | 2008-08-21 | Qimonda Ag | Interconnection structure and method of manufacturing the same |
US7462038B2 (en) * | 2007-02-20 | 2008-12-09 | Qimonda Ag | Interconnection structure and method of manufacturing the same |
US20130143420A1 (en) * | 2011-12-02 | 2013-06-06 | David Noel Light | Electrical Connector and Method of Making It |
US8641428B2 (en) * | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9318824B2 (en) | 2012-07-03 | 2016-04-19 | Yazaki Corporation | Connecting structure for terminal fitting and substrate |
US20160204535A1 (en) * | 2013-09-27 | 2016-07-14 | Wenmin Ye | Device for coupling a plc bus |
US9634415B2 (en) * | 2013-09-27 | 2017-04-25 | Siemens Aktiengesellschaft | Device for coupling a PLC bus |
US9343830B1 (en) * | 2015-06-08 | 2016-05-17 | Xcerra Corporation | Integrated circuit chip tester with embedded micro link |
Also Published As
Publication number | Publication date |
---|---|
US20020184759A1 (en) | 2002-12-12 |
US6948242B2 (en) | 2005-09-27 |
EP1105942A1 (de) | 2001-06-13 |
DE59901657D1 (de) | 2002-07-11 |
WO2000011755A1 (de) | 2000-03-02 |
EP1105942B1 (de) | 2002-06-05 |
JP2002523881A (ja) | 2002-07-30 |
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Legal Events
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