US12358243B2 - Printing conductive elements - Google Patents
Printing conductive elementsInfo
- Publication number
- US12358243B2 US12358243B2 US18/413,468 US202418413468A US12358243B2 US 12358243 B2 US12358243 B2 US 12358243B2 US 202418413468 A US202418413468 A US 202418413468A US 12358243 B2 US12358243 B2 US 12358243B2
- Authority
- US
- United States
- Prior art keywords
- agent
- conductive
- fusing agent
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
- B29C64/321—Feeding
- B29C64/336—Feeding of two or more materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
- B22F2003/1052—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding assisted by energy absorption enhanced by the coating or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Definitions
- FIG. 1 is a schematic drawing of an example apparatus for generating print instructions
- FIG. 2 is a schematic drawing of an example of a print apparatus
- FIG. 3 A- 3 D are example of conductive elements
- FIG. 4 shows a machine readable medium in association with a processor
- FIGS. 5 and 6 are flowcharts of example methods of printing conductive elements.
- Additive manufacturing techniques may generate a three-dimensional object through the solidification of a build material.
- the build material may be a powder-like granular material, which may for example be a plastic, ceramic or metal powder.
- the properties of generated objects may depend on the type of build material and the type of solidification mechanism used.
- Build material may be deposited, for example on a print bed and processed layer by layer, for example within a fabrication chamber.
- selective solidification is achieved through directional application of energy, for example using a laser or electron beam which results in solidification of build material where the directional energy is applied.
- at least one print agent may be selectively applied to the build material, and may be liquid when applied.
- a fusing agent also termed a ‘coalescence agent’ or ‘coalescing agent’
- the fusing agent may have a composition which absorbs energy such that, when energy (for example, heat) is applied to the layer, the build material coalesces and solidifies to form a slice of the three-dimensional object in accordance with the pattern. In other examples, coalescence may be achieved in some other manner.
- a print agent may comprise a coalescence modifying agent (referred to as modifying or detailing agents herein after), which acts to modify the effects of a fusing agent for example by reducing or increasing coalescence or to assist in producing a particular finish or appearance to an object, and such agents may therefore be termed detailing agents.
- Detailing agents may have a cooling effect, for example comprising a fluid which may be evaporated on heating, and may therefore be termed fusion reduction agents.
- a coloring agent for example comprising a dye or colorant, may in some examples be used as a fusing agent or a modifying agent, and/or as a print agent to provide a particular color for the object.
- an agent may be used to introduce functionality into an object.
- a conductive agent which may comprise fusible metallic particles, such as silver nanoparticles
- a conductive track may be utilised to introduce a conductive track.
- thermal management is a concern: a build material is to be sufficiently heated such that coalescence is achieved, but overheating can impair an object's form, appearance and/or functionality.
- Fusing agents are selected in part for their radiation absorbing qualities.
- an amount of fusing agent to be applied may be determined based on an intended temperature increase in that region of the object under generation.
- the fusing agent is applied is reduced, in some examples to zero, in the region in which the conductive element is to be formed. This may nevertheless result in coalescence of build material as the conductive agent may be an absorber of energy and serve to heat the build material. Taking this into account, the amount of fusing agent may be reduced and a fusing temperature still acquired. In some examples, this may be achieved using an increased irradiation level.
- FIG. 3 D shows an example of a printed touchpad 312 , which may be used as a capacitive sensing device.
- a touchpad 312 may be formed in more than one layer of build material in order to enhance the sensitivity thereof.
- such touchpads 312 may be embedded under one or more layers of fused build material which is not treated with conductive agent, which may protect them from damage. While a planar example is shown here, such touchpads 312 may be formed in curved surfaces.
- FIG. 4 is an example of a machine readable medium 400 in association with a processor 402 .
- the machine readable medium 400 comprises instructions 404 which when executed by the processor 402 cause the processor to carry out certain processes.
- the instructions 404 comprises instructions 406 to determine fabrication instructions for printing an object layer comprising a conductive element in a substantially insulating composition.
- FIG. 5 is an example of a method, which may be a method for generating a conductive element within a 3D printed object.
- the conductive element is to be formed on or near the surface of a 3D printed object. In some examples, the conductive element is to be formed within a 3D printed object.
- Block 504 comprises applying a conductive agent to a first portion of the layer in a first printing pass.
- a conductive agent may be a fusible conductive agent as has been described above.
- a cooling agent e.g. a detailing agent
- FIG. 6 is an example of a sequence in which treatment may be applied to a formed layer of build material which is to include a conductive element, and may for example follow block 502 as described in relation to FIG. 5 .
- a conductive agent is printed in a first printing pass.
- the layer of build material is heated. As noted above, this may both raise conductive particles within the fusing agent to their fusing temperature (which may be around 140° C.) and cause evaporation of a carrier fluid.
- a cooling agent e.g. a detailing agent
- Block 602 and 604 could be reversed in order or carried out concurrently (for example, the heating may be provided from an energy source provided on a print agent distributor).
- conductive agent is again applied to the same layer of build material and in block 608 , the layer is again heated.
- two or more separate cycles of application and heating may be carried out.
- the number of printing passes in which conductive agent is applied and the amount applied in each pass may be determined based on the attributes of the agent and an intended conductivity level.
- a cooling agent e.g. a detailing agent
- Block 606 and 608 could be reversed in order or carried out concurrently.
- fusing agent is printed on the build material layer. This may be applied at a relatively low contone level. This may allow an insulating substrate to be formed where the fusing agent is itself at least somewhat conductive: as the amount of fusing agent may be kept low, the conductivity of a region of build material caused to fuse with a small amount of fusing agent may also be kept low. In some examples, no fusing agent may be applied in the same locations as the conductive agent, and the fusing agent may instead be applied to other portions of the build material layer. In block 612 , the layer is again heated. Block 610 and 612 could be reversed in order or carried out concurrently.
- the level of fusing agent applied and the heating delivered in the third printing pass may be selected (bearing in mind the level of preheating of the build material provided by previous printing passes) so as to allow the build material to reach its fusing temperature, which may be around 150-200° C. in some examples.
- non-print there may be a ‘non-print’ pass at this point if it is determined that additional energy is indicated to allow the built material to reach its fusing temperature.
- detailing agent may be applied during such a pass.
- Detailing agent may also be employed to mark the edge of the fabricated object.
- the fusing agent is applied after the conductive agent.
- fusing agent may be applied before a conductive agent. This could start to melt the build material within a layer, which may provide conditions where the conductor could reside on the top part of the layer (for example in the top 50 um of a 100 um layer).
- it may be intended for the conductive element to form at the lower end of the layer, and/or to intermingle with other sub-layers, thus forming a sub-surface conductive via or the like.
- Examples in the present disclosure can be provided as methods, systems or machine readable instructions, such as any combination of software, hardware, firmware or the like.
- Such machine readable instructions may be included on a computer readable storage medium (including but is not limited to disc storage, CD-ROM, optical storage, etc.) having computer readable program codes therein or thereon.
- the machine readable instructions may, for example, be executed by a general purpose computer, a special purpose computer, an embedded processor or processors of other programmable data processing devices to realize the functions described in the description and diagrams.
- a processor or processing apparatus may execute the machine readable instructions.
- functional modules of the apparatus and devices may be implemented by a processor executing machine readable instructions stored in a memory, or a processor operating in accordance with instructions embedded in logic circuitry.
- the term ‘processor’ is to be interpreted broadly to include a CPU, processing unit, ASIC, logic unit, or programmable gate array etc.
- the methods and functional modules may all be performed by a single processor or divided amongst several processors.
- Such machine readable instructions may also be stored in a computer readable storage that can guide the computer or other programmable data processing devices to operate in a specific mode.
- Such machine readable instructions may also be loaded onto a computer or other programmable data processing devices, so that the computer or other programmable data processing devices perform a series of operations to produce computer-implemented processing, thus the instructions executed on the computer or other programmable devices realize functions specified by flow(s) in the flow charts and/or block(s) in the block diagrams.
- teachings herein may be implemented in the form of a computer software product, the computer software product being stored in a storage medium and comprising a plurality of instructions for making a computer device implement the methods recited in the examples of the present disclosure.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Composite Materials (AREA)
- Automation & Control Theory (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/413,468 US12358243B2 (en) | 2017-04-26 | 2024-01-16 | Printing conductive elements |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2017/029642 WO2018199943A1 (en) | 2017-04-26 | 2017-04-26 | Printing conductive elements |
| US201816089130A | 2018-09-27 | 2018-09-27 | |
| US18/413,468 US12358243B2 (en) | 2017-04-26 | 2024-01-16 | Printing conductive elements |
Related Parent Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2017/029642 Continuation WO2018199943A1 (en) | 2017-04-26 | 2017-04-26 | Printing conductive elements |
| US16/089,130 Continuation US20210170678A1 (en) | 2017-04-26 | 2017-04-26 | Printing conductive elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20240149542A1 US20240149542A1 (en) | 2024-05-09 |
| US12358243B2 true US12358243B2 (en) | 2025-07-15 |
Family
ID=63919875
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/089,130 Abandoned US20210170678A1 (en) | 2017-04-26 | 2017-04-26 | Printing conductive elements |
| US18/413,468 Active 2037-06-06 US12358243B2 (en) | 2017-04-26 | 2024-01-16 | Printing conductive elements |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/089,130 Abandoned US20210170678A1 (en) | 2017-04-26 | 2017-04-26 | Printing conductive elements |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US20210170678A1 (en) |
| EP (1) | EP3615311A4 (en) |
| CN (1) | CN110520280B (en) |
| WO (1) | WO2018199943A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3436236A4 (en) | 2016-07-27 | 2019-11-27 | Hewlett-Packard Development Company, L.P. | FORMATION OF ELECTRONIC PARTS IN THREE DIMENSIONS (3D) |
| EP3544788A4 (en) | 2017-04-18 | 2020-07-22 | Hewlett-Packard Development Company, L.P. | INCREASED ELECTRICAL CONDUCTIVITY OF SELECTED SITES OF A 3D OBJECT |
| US11449029B2 (en) | 2019-01-30 | 2022-09-20 | Hewlett-Packard Development Company, L.P. | Creating a print job using user-specified build material layer thicknesses |
| WO2021201850A1 (en) * | 2020-03-31 | 2021-10-07 | Hewlett-Packard Development Company, L.P. | Porous sections with partially-fused build material particles |
| US11580279B1 (en) * | 2020-05-05 | 2023-02-14 | Ansys, Inc. | System and method for performing a thermal simulation of a powder bed based additive process |
| WO2022019896A1 (en) * | 2020-07-22 | 2022-01-27 | Hewlett-Packard Development Company, L.P. | Three-dimensional latticed conductive elements |
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| WO2004044816A1 (en) | 2002-11-12 | 2004-05-27 | Objet Geometries Ltd. | Three-dimensional object printing |
| US20090004381A1 (en) | 2007-06-27 | 2009-01-01 | Seiko Epson Corporation | Three-dimensional molding apparatus and three-dimensional molding method |
| US20140070957A1 (en) | 2012-09-11 | 2014-03-13 | Gianluigi LONGINOTTI-BUITONI | Wearable communication platform |
| CN104461211A (en) | 2014-05-31 | 2015-03-25 | 福州大学 | 3D manufacturing method for resistive touch screen |
| US20150201500A1 (en) | 2014-01-12 | 2015-07-16 | Zohar SHINAR | System, device, and method of three-dimensional printing |
| WO2015136277A1 (en) * | 2014-03-11 | 2015-09-17 | Bae Systems Plc | Forming a three dimensional object |
| WO2016080993A1 (en) | 2014-11-20 | 2016-05-26 | Hewlett-Packard Development Company, L.P. | Generating three-dimensional objects |
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| WO2016186613A1 (en) | 2015-05-15 | 2016-11-24 | Hewlett-Packard Development Company, L.P. | Coalescing agent concentrations and contone densities for three-dimensional objects |
| US20170014911A1 (en) | 2015-07-17 | 2017-01-19 | Hou T. NG | Fusing of multiple layers in additive manufacturing |
| US20170106596A1 (en) | 2015-10-15 | 2017-04-20 | Seiko Epson Corporation | Method of manufacturing three-dimensionally formed object and three-dimensionally formed object manufacturing apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2699406B1 (en) * | 2011-04-17 | 2020-02-19 | Stratasys Ltd. | System and method for additive manufacturing of an object |
| SE536670C2 (en) * | 2011-08-26 | 2014-05-13 | Digital Metal Ab | Layer-based manufacture of free-form micro-components of multimaterial |
| CN106513193B (en) * | 2015-09-06 | 2019-03-22 | 东莞市瑞迪三维电子科技有限公司 | Electrostatic 3D printer and printing method thereof |
-
2017
- 2017-04-26 US US16/089,130 patent/US20210170678A1/en not_active Abandoned
- 2017-04-26 WO PCT/US2017/029642 patent/WO2018199943A1/en not_active Ceased
- 2017-04-26 EP EP17907407.5A patent/EP3615311A4/en active Pending
- 2017-04-26 CN CN201780089385.5A patent/CN110520280B/en active Active
-
2024
- 2024-01-16 US US18/413,468 patent/US12358243B2/en active Active
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| US20090004381A1 (en) | 2007-06-27 | 2009-01-01 | Seiko Epson Corporation | Three-dimensional molding apparatus and three-dimensional molding method |
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| WO2016146374A1 (en) | 2015-03-17 | 2016-09-22 | Philips Lighting Holding B.V. | Making 3d printed shapes with interconnects and embedded components. |
| WO2016186613A1 (en) | 2015-05-15 | 2016-11-24 | Hewlett-Packard Development Company, L.P. | Coalescing agent concentrations and contone densities for three-dimensional objects |
| US20170014911A1 (en) | 2015-07-17 | 2017-01-19 | Hou T. NG | Fusing of multiple layers in additive manufacturing |
| US20170106596A1 (en) | 2015-10-15 | 2017-04-20 | Seiko Epson Corporation | Method of manufacturing three-dimensionally formed object and three-dimensionally formed object manufacturing apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3615311A4 (en) | 2020-12-09 |
| US20240149542A1 (en) | 2024-05-09 |
| EP3615311A1 (en) | 2020-03-04 |
| CN110520280A (en) | 2019-11-29 |
| WO2018199943A1 (en) | 2018-11-01 |
| CN110520280B (en) | 2021-10-29 |
| US20210170678A1 (en) | 2021-06-10 |
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