US11972792B2 - Integrated circuit structure and memory structure - Google Patents
Integrated circuit structure and memory structure Download PDFInfo
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- US11972792B2 US11972792B2 US17/804,910 US202217804910A US11972792B2 US 11972792 B2 US11972792 B2 US 11972792B2 US 202217804910 A US202217804910 A US 202217804910A US 11972792 B2 US11972792 B2 US 11972792B2
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4096—Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4091—Sense or sense/refresh amplifiers, or associated sense circuitry, e.g. for coupled bit-line precharging, equalising or isolating
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4097—Bit-line organisation, e.g. bit-line layout, folded bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
Definitions
- the present disclosure relates to the technical field of integrated circuits, and specifically to an integrated circuit structure and a memory structure using the integrated circuit structure.
- a memory array inside the DRAM is divided into 4 bank groups (BGs) due to the existence of the BGs [1:0]. Alternate reading and writing between the different BGs can improve the access efficiency of the DRAM.
- data connections to the different BGs are merged in a central region of the 4 BGs, and a data bus is shared to transmit data to a data queue (DQ). Since the data connections need to reach each BG through long metal wires, drive circuits for read and write data lines in the central region need a large size. This size is multiplied by a data line width of 72 bits, so that data read and write drive circuits of the 4 BGs occupy a large layout area, there are long data lines from the DQ, and the data lines have large loading.
- the layout area of the central region is large in both an X direction (an extension direction of the data lines that are connected to the DQ) and a Y direction (perpendicular to the X direction, and an extension direction of the data lines that are connected to each BG).
- the large area in the X direction increases the loading of the data lines from a DQ terminal
- the large area in the Y direction increases the loading of the data lines at a BG terminal.
- the wiring in the X direction is placed on a top metal layer, and the wiring in the Y direction will is placed on a first metal layer, so the loading in the Y direction is more serious.
- An integrated circuit structure includes a first bank group and a second bank group, the first bank group and the second bank group share one set of data read and write drive circuits.
- the set of data read and write drive circuits includes: a read control module that is connected to a read data bus, a first read and write data bus, and a second read and write data bus, and is configured to read data of the first bank group onto the read data bus through the first read and write data bus, and to read data of the second bank group onto the read data bus through the second read and write data bus; and a write control module that is connected to a write data bus, the first read and write data bus, and the second read and write data bus, and is configured to write data of the write data bus into the first bank group through the first read and write data bus, and to write data of the write data bus into the second bank group through the second read and write data bus.
- the read data bus includes a plurality of read data lines
- the write data bus includes a plurality of write data lines
- a memory structure includes: a first bank group and a second bank group, jointly arranged in a first layout region, and sharing one integrated circuit structure having an instance of the above set of data read and write drive circuits; and a third bank group and a fourth bank group, jointly arranged in a second layout region, and sharing another integrated circuit structure having another instance of the above set of data read and write drive circuits.
- the first bank group and the second bank group are arranged in parallel in a first direction
- the third bank group and the fourth bank group are arranged in parallel in the first direction
- the first layout region and the second layout region are arranged in parallel in a second direction
- the second direction is perpendicular to the first direction.
- FIG. 1 is a schematic structural diagram of an integrated circuit structure according to one exemplary embodiment of the present disclosure.
- FIG. 2 is a schematic structural diagram of a write control module and a read control module according to one embodiment of the present disclosure.
- FIG. 3 is a schematic diagram of layout of a write control module and a read control module according to one embodiment of the present disclosure.
- FIG. 4 is a schematic diagram of layout and wiring of a read control module and a write control module according to one embodiment of the present disclosure.
- FIG. 5 is a schematic diagram of layout and wiring of a read control module and a write control module according to another embodiment of the present disclosure.
- FIG. 6 is a schematic diagram of a memory structure according to one embodiment of the present disclosure.
- FIG. 7 is a schematic diagram of a memory structure according to another embodiment of the present disclosure.
- FIG. 1 is a schematic structural diagram of an integrated circuit structure according to one exemplary embodiment of the present disclosure.
- the integrated circuit structure may include:
- the read data bus RD includes a plurality of read data lines
- the write data bus WR includes a plurality of write data lines
- the plurality of read data lines and the plurality of write data lines are arranged in a staggered manner.
- embodiments of the present disclosure merge identical control circuits in different BGs as much as possible. Since BG 0 and BG 1 share one set of read and write data buses (RD+WR), receivers having different BG write functions can be merged, and drivers having different BG read functions can be merged, thereby reducing the overall area of the data read and write drive circuits, and reducing a volume of a memory.
- RD+WR read and write data buses
- the write control module 11 and the read control module 12 are described below.
- FIG. 2 is a schematic structural diagram of a write control module and a read control module according to one embodiment of the present disclosure.
- the write control module 11 includes:
- the read control module 12 includes:
- the first bank group BG 0 and the second bank group BG 1 have different data read and write times. That is, during data writing, data transmitted on the write data bus WR is written into the first bank group BG 0 and the second bank group BG 1 alternately; and during data reading, the data is read alternately from the first bank group BG 0 and the second bank group BG 1 onto the read data bus RD.
- control of the write logic of the two bank groups is completed by using one write control unit 111 , so as to write, in an alternative time-shared manner, data to be written on the write data bus WR into two write drive units (a first write drive unit 112 and a second write drive unit 113 ) that are connected to the first bank group BG 0 and the second bank group BG 1 , thereby writing the data into the first bank group BG 0 and the second bank group BG 1 through the two write drive units.
- the write control unit 111 can write a cache function for caching the data received from the write data bus WR to implement alternate time-shared writing for the first write drive unit 112 and the second write drive unit 113 .
- the alternate time-shared writing means that the data to be written is written into the first write drive unit 112 during a first time period and written into the second write drive unit 113 during a second time period.
- Each of the first time period and the second time period includes a plurality of time periods, an end time point of one first time period is close to a start time point of one second time period, and an end time point of one second time period is close to a start time point of the next first time period.
- the data of the first bank group BG 0 and the data of the second bank group BG 1 have a same read logic and complementary read timing. Therefore, according to the embodiments of the present disclosure, the data is read from the first bank group BG 0 and the second bank group BG 1 by using two read control units (a first read control unit 121 and a second read control unit 122 ) that are respectively connected to the first bank group BG 0 and the second bank group BG 1 , then outputted to a read drive unit 123 in a time-shared manner, and sent to the read data bus RD through the read drive unit 123 .
- two read control units a first read control unit 121 and a second read control unit 122
- Each of the first read control unit 121 and the second read control unit 122 may have a read cache function for caching the data read from the first bank group BG 0 and the second bank group BG 1 , thereby alternately outputting the data to the read drive unit 123 in a time-shared manner.
- the alternate time-shared outputting means that the read drive unit 123 reads the data from the first read control unit 121 during a third time period and reads the data from the second read control unit 122 during a fourth time period.
- Each of the third time period and the fourth time period includes a plurality of time periods, an end time point of one third time period is close to a start time point of one fourth time period, and an end time point of one fourth time period is close to a start time point of the next third time period.
- one write control unit and one read drive unit perform read and write control for two bank groups, greatly saving the circuit layout area of the data read and write drive circuit.
- the staggered arrangement of the plurality of read data lines and the plurality of write data lines is conducive to realizing that the read data lines and the write data lines are mutually shielding lines, thereby suppressing signal interference between the adjacent read data lines or the adjacent write data lines.
- FIG. 3 is a schematic diagram of layout of a write control module and a read control module according to one embodiment of the present disclosure.
- the write control module 11 and the read control module 12 can be arranged side by side to reduce the layout area of the data read and write drive circuits as much as possible.
- the first write drive unit 112 and the second write drive unit 113 are located in a first region A 1 , the first write drive unit 112 and the second write drive unit 113 are arranged in parallel in a first direction, the write control unit 111 and the first region A 1 are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction.
- the first bank group BG 0 and the second bank group BG 1 are located in a second region A 2 , and the second region A 2 , the first region A 1 , and the write control unit 111 are sequentially arranged in the second direction.
- the first bank group BG 0 and the second bank group BG 1 are arranged in parallel in the first direction.
- the first read control unit 121 and the second read control unit 122 are located in a third region A 3 , the first read control unit 121 and the second read control unit 122 are arranged in parallel in the first direction, and the third region A 3 and the read drive unit 123 are arranged in parallel in the second direction.
- the second region A 2 , the third region A 3 , and the read drive unit 123 are sequentially arranged in the second direction.
- the first write drive unit 112 is located in a first column
- the second write drive unit 113 is located in a second column
- the write control unit 111 occupies the first column and the second column in the first direction.
- the first read control unit 121 is located in a first column
- the second read control unit 122 is located in a second column
- the read drive unit 123 occupies the first column and the second column in the first direction. According to the layout method of two columns and two rows shown in FIG. 3 , the layout of the data read and write drive circuit can be minimized.
- the second region A 2 , the first region A 1 , and the third region A 3 are sequentially arranged in the second direction.
- the sequence of the first region A 1 and the third region A 3 can also be adjusted, or the arrangement sequence of the second region A 2 , the first region A 1 , and the third region A 3 is adjusted, which is not specifically limited in the present disclosure.
- FIG. 4 is a schematic diagram of layout and wiring of a read control module and a write control module according to one embodiment of the present disclosure.
- a gap extending in the second direction is provided between the first write drive unit 112 and the second write drive unit 113 , and a projection of one section of the first read and write data bus RW 1 and a projection of one section of the second read and write data bus RW 2 are located in the gap.
- the first read and write data bus RW 1 and the second read and write data bus RW 2 are arranged in a staggered manner. Since the first read and write data bus and the second read and write data bus do not operate at the same time, the two can serve as mutually shielding lines through staggered arrangement.
- the plurality of read data lines and the plurality of write data lines are arranged in a first wiring region B 1 and a second wiring region B 2 also in a staggered manner; the first wiring region B 1 , the read control module 12 , and the second wiring region B 2 are arranged in parallel in the first direction; the read data line and the write data line extend in the second direction in the first wiring region and the second wiring region; and the second direction is perpendicular to the first direction.
- the side of the first wiring region B 1 adjacent to the read control module 12 is provided with a first power line P 1 extending in the second direction
- the side of the second wiring region B 2 adjacent to the read control module 12 is provided with a second power line P 2 extending in the second direction.
- the side of the first wiring region B 1 away from the read control module 12 is provided with a first shielding line 51 extending in the second direction
- the side of the second wiring region B 2 away from the read control module 12 is provided with a second shielding line S 2 extending in the second direction.
- the write data lines and the read data lines are routed separately and can be mutually shielding lines.
- the data lines after passing through a central region, the data lines are not divided into the write data lines and the read data lines anymore, and an additional set of lines is needed for shielding, which increases the layout area.
- the data lines of the two bank groups can also be mutually shielding lines, thereby increasing the utilization rate of the lines in the layout, and reducing the layout area.
- the same set of read drive units and write drive units can be placed in the second direction.
- single drive units are divided into one column or a combination of two columns.
- the write drive units cannot be merged and can be divided into single columns.
- the read drive units of the two bank groups can be merged.
- the read drive units need to be divided into two columns, the read data lines and the write data lines in the read data bus and the write data bus are then routed on two sides, and shielding lines are added to the outermost edges of the data lines to prevent other routings from influencing the data lines.
- the data lines close to the drive units use the power lines as shielding lines, without needing additional shielding lines.
- FIG. 5 is a schematic diagram of layout and wiring of a read control module and a write control module according to another embodiment of the present disclosure.
- the first read and write data bus RW 1 and the second read and write data bus RW 2 extend in a third wiring region B 3 in the second direction
- the third wiring region B 3 is arranged between the first wiring region B 1 and the second wiring region B 2
- the side of the third wiring region B 3 adjacent to the first wiring region B 1 is provided with a third power line P 3
- the side of the third wiring region B 3 adjacent to the second wiring region B 2 is provided with a fourth power line P 4
- both the third power line P 3 and the fourth power P 4 line extend in the second direction.
- the write drive units and the read drive units are divided into double rows or a single row, a distance between the two rows is widened, and the read and write data buses from the central region to the bank groups are arranged.
- the data buses of BG 0 and BG 1 i.e., the first read and write data bus RW 1 and the second read and write data bus RW 2
- This set of data buses uses the power lines as shielding layers on the two sides close to the write drive units, without needing any other shielding layers, so that high utilization rate of the lines is achieved, and the wiring area is also reduced.
- circuits of the write control module 11 and the read control module 12 can be partially arranged on a same layer, and the data lines are arranged on other layers and can be arranged on a same layer or different layers.
- the first wiring region B 1 and the second wiring region B 2 can be respectively arranged in regions that have projection areas overlapping the first write drive unit 112 and the second write drive unit 113 , thereby reducing, through multilayer wiring, the layout area occupied by the central region, the wiring length, and the load of the data lines.
- FIG. 6 is a schematic diagram of a memory structure according to one embodiment of the present disclosure.
- the memory structure 600 may include:
- the first bank group BG 0 and the second bank group BG 1 are arranged in parallel in the first direction
- the third bank group BG 2 and the fourth bank group BG 3 are arranged in parallel in the first direction
- the first layout region C 1 and the second layout region C 2 are arranged in parallel in the second direction
- the second direction is perpendicular to the first direction.
- the first direction is an extension direction of the read data bus RD and the write data bus WR that are connected to the DQ terminal.
- the first bank group BG 0 , the second bank group BG 1 , the third bank group, and the fourth bank group are commonly connected to the read data bus RD and the write data bus WR
- the read data bus RD includes a plurality of read data lines
- the write data bus WR includes a plurality of write data lines
- the plurality of read data lines and the plurality of write data lines extend in the second direction.
- each layout block corresponds to one bank group, and is responsible for reading and writing of the corresponding bank group.
- each layout block corresponds to two bank groups, and enables alternate reading and writing. Furthermore, the integrated circuit structure 61 and the integrated circuit structure 62 having a smaller layout area achieve a smaller layout area of the central region.
- FIG. 7 is a schematic diagram of a memory structure according to another embodiment of the present disclosure.
- the first layout region C 1 and the second layout region C 2 can also be arranged in parallel in the first direction.
- the embodiment shown in FIG. 6 can be prioritized in the floor plan of the central region.
- the data-shared bus parts are extended by improving the drive circuit structure for the read and write data buses and the data lines between the different BGs and the layout design, and the BG control logic is optimized by merging the read drive units and the write control units, so that the circuit structure for driving the read and write buses can be simplified, and the area of the layout design can be saved.
- the design according to the embodiments of the present disclosure can be applied to circuits for driving DDR4 central data bus and BG data lines, but is not limited to this scope, and circuit systems including data bus control and distribution data can all use this design.
- modules or units of the device for execution are mentioned in the detailed description above, this division is not mandatory.
- the features and functions of two or more modules or units described above may be embodied in one module or unit.
- the features and functions of a module or unit described above may be further divided into a plurality of modules or units to be embodied.
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Abstract
Description
-
- a first bank group BG0 and a second bank group BG1 sharing one set of data read and write
drive circuits 1. The data read and writedrive circuits 1 includes: - a
write control module 11, connected to a write data bus WR, the first read and write data bus RW1, and the second read and write data bus RW2, and configured to write data of the write data bus WR into the first bank group BG0 through the first read and write data bus RW1, or write data of the write data bus WR into the second bank group BG1 through the second read and write data bus RW2; and - a
read control module 12, connected to a read data bus RD, the first read and write data bus RW1, and the second read and write data bus RW2, and configured to read data of the first bank group BG0 onto the read data bus RD through the first read and write data bus RW1, or read data of the second bank group BG1 onto the read data bus RD through the second read and write data bus RW2.
- a first bank group BG0 and a second bank group BG1 sharing one set of data read and write
-
- a
write control unit 111, connected to the write data bus WR; - a first
write drive unit 112, a first terminal of the firstwrite drive unit 112 being connected to thewrite control unit 111, and a second terminal of the firstwrite drive unit 112 being connected to the first bank group BG0 through the first read and write data bus RW1; and - a second
write drive unit 113, a first terminal of the secondwrite drive unit 113 being connected to thewrite control unit 111, and a second terminal of the secondwrite drive unit 113 being connected to the second bank group BG1 through the second read and write data bus RW2.
- a
-
- a first
read control unit 121, a first terminal of the firstread control unit 121 being connected to the first bank group BG0 through the first read and write data bus RW1; - a second
read control unit 122, a first terminal of the secondread control unit 122 being connected to the second bank group BG1 through the second read and write data bus RW2; and - a
read drive unit 123, connected to a second terminal of the firstread control unit 121, a second terminal of the secondread control unit 122, and the read data bus RD.
- a first
-
- the first bank group BG0 and the second bank group BG1, jointly arranged in a first layout region C1, and sharing one set of the
integrated circuit structure 61 according to the embodiments shown inFIG. 1 toFIG. 5 , theintegrated circuit structure 61 being arranged in the first layout region C1; and - a third bank group BG2 and a fourth bank group BG3, jointly arranged in a second layout region C2, and sharing another set of the
integrated circuit structure 62 according to the embodiments shown inFIG. 1 toFIG. 5 , theintegrated circuit structure 62 being arranged in the second layout region C2.
- the first bank group BG0 and the second bank group BG1, jointly arranged in a first layout region C1, and sharing one set of the
Claims (18)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210210773.7 | 2022-03-04 | ||
| CN202210210773.7A CN114582381A (en) | 2022-03-04 | 2022-03-04 | Integrated circuit structure and memory structure |
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| US20230282271A1 US20230282271A1 (en) | 2023-09-07 |
| US11972792B2 true US11972792B2 (en) | 2024-04-30 |
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| CN115620773B (en) * | 2022-10-11 | 2026-02-13 | 长鑫存储技术有限公司 | Semiconductor structure and memory |
| CN116543804B (en) * | 2023-07-07 | 2023-11-24 | 长鑫存储技术有限公司 | Drive control circuit and memory |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170285998A1 (en) * | 2016-03-31 | 2017-10-05 | Qualcomm Incorporated | Efficient memory bank design |
| US20190347219A1 (en) | 2018-05-09 | 2019-11-14 | Micron Technology, Inc. | Memory devices having a reduced global data path footprint and associated systems and methods |
| US20210406123A1 (en) * | 2020-06-24 | 2021-12-30 | Micron Technology, Inc. | Apparatuses, systems, and methods for error correction |
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2022
- 2022-03-04 CN CN202210210773.7A patent/CN114582381A/en active Pending
- 2022-06-01 US US17/804,910 patent/US11972792B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170285998A1 (en) * | 2016-03-31 | 2017-10-05 | Qualcomm Incorporated | Efficient memory bank design |
| US20190347219A1 (en) | 2018-05-09 | 2019-11-14 | Micron Technology, Inc. | Memory devices having a reduced global data path footprint and associated systems and methods |
| US20210406123A1 (en) * | 2020-06-24 | 2021-12-30 | Micron Technology, Inc. | Apparatuses, systems, and methods for error correction |
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| US20230282271A1 (en) | 2023-09-07 |
| CN114582381A (en) | 2022-06-03 |
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