US1149974A - Lithographic plate and the process for producing the same. - Google Patents

Lithographic plate and the process for producing the same. Download PDF

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US1149974A
US1149974A US87142714A US1914871427A US1149974A US 1149974 A US1149974 A US 1149974A US 87142714 A US87142714 A US 87142714A US 1914871427 A US1914871427 A US 1914871427A US 1149974 A US1149974 A US 1149974A
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layer
plate
copper
thin
lithographic
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US87142714A
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Clifton Chisholm
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/71—Ceramic products containing macroscopic reinforcing agents
    • C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
    • C04B35/80—Fibres, filaments, whiskers, platelets, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12035—Fiber, asbestos, or cellulose in or next to particulate component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12069—Plural nonparticulate metal components
    • Y10T428/12076—Next to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component

Definitions

  • My invention relates to lithographic printing plates and the process for producing the same wherein a highly flexible and resilient base is provided with an extremely hard granular metallic surface; and the objects of my invention are, first, to provide an improved lithographic plate having a hard flexible granular printing surface with a resilient elastic base or backing, said base being adapted to absorb the shock of a type bar and prevent the indentation of the hard printing surface; second, to provide an improved lithographic plate that may be cheaply produced; third, to provide an improved plate that is-highly flexible so that the same may be easily rolled around a typewriter or similar platen of small diameter; and fourth, to provide an improved plate of the character described having an extremely hard flexible granular surface adapted to readily retain moisture and ink such as is used in connection with the offset lithographic process.
  • a sheet of comparatively thin celluloid plate A is painted with a suitable volatile solvent, such as acetone or the like,
  • a further plating of copper is electrolytically deposited thereon, as disclosed in Fig. 3 of the drawings, for the purpose of increasing the conductivityof the cathode thus formed in order that a plating of aliarder and more porous metal G, preferably nickel, may be electrolytically deposited thereon, as disclosed in Fig. 4 of the drawings, such electrolytical deposition constituting the next step of the process,"and also for the purpose of presenting a smooth surface, the purpose of which will be hereinafter more fully set forth.
  • the electrolytical deposition of the nickel is to provide a hard, thin, non-oxidizing, absorbent surface C of a thickness suitable for lithographic purposes but not thick enough to destroy the physical properties of -the celluloid base.
  • the granular surface is provided for the purpose of ell'cctively retaining such moisture and ink as is needed for the lithographic printing process and may be produced either chemically or mechanically.
  • a lithographic printing plate produced by the above described process will possess extreme flexibility and resiliency as well as extreme hardness of surface, which characteristics are essential for good sharp reproductions.
  • the flexibility and resiliency of the celluloid base will tend to prolong the life of the, hard granular printing surface and at the same time will provide an elastic base which will readily support the thin layer of electrolytically deposited nickel C, which will yield readily and not strain or crack the thin nickel layer C when the plate is bent or rolled around a platen of small diameter.
  • the resiliency of the celluloid base A also provides an elastic cushion ar-
  • an eflicient plate, suitable for the purpose may beprovided by omitting the final or nickel plating and the printing done directly from the smooth copper surface. I have found also from actual experiment that for. light work where a small number of copies are to be produced, an efficient plate suitable for the purpose may be provided by omitting the electrolytically disposed second layer of copper.
  • a lithographic plate comprising afiexible resilient base; a layer of powdered copper embedded in the surface of the base; and a layer of thin hard metal imposed upon the layer of copper.
  • a lithographic plate comprising a flexible resilient base; a layer of powdered copper embedded in the surface of the base; and
  • a lithographic plate comprising a flexible resilient celluloid base; a layer of pow dered copper embedded in the surface of the base; and a thin layer of hard metal imposed upon the layer of copper.
  • a lithographic plate comprising aflex ible resilient celluloid base; a layer of powdered copper embedded in the surface of the celluloid base; and a thin layer of nickel imposed upon the layer of copper.
  • a lithographic plate comprising a flexible resilient celluloid base; a thin layer of powdered copper embedded in the surface of the celluloid base; an electrolytically depos-' -ited second layer of copper imposed upon the'layei' of powdered copper; and a thin layer of hard metal imposed upon the electrolytically deposited layer of copper.
  • a lithographic plate comprising a flexible resilient celluloid base; a thin layer of powdered copper embedded in the surface of the celluloid base; an electrolytically def posited second layer of copper on the first mentioned layer; and a thin layer of nickel electrolytically deposited upon the second mentioned layer of copper.
  • a lithographic plate comprising a resilient flexible celluloid base'; a thin layer of powdered copper embedded in the surface of the celluloid base; a second layer of electrolytically deposited copper upon the first mentioned layer; and a thin granular layer of hard metal deposited upon the second mentioned layer.
  • a lithographic plate comprising a resilient flexible celluloid base; a thin layerof the celluloid base a second layerof electrotioned layer.
  • lithographic plates which consists in partially dissolving the surface of a thin resilient flexible plate, applying to such partially 'dissolved surface a thin layer of powdered copper in order to form a cathode, and electrolytically deposit-.
  • lithographic plates which consists in partially dissolving the surface of a thin celluloid plate, applying to such partially dissolved surface a thin layer of powdered copper in order to forma cathode, electrolytically depositing asecond thin layer of copper on the cathode, and electrolytically depositing a thin layer of hard metal on the electrolytically deposited copper.
  • lithographic plates which consists in partially dissolving the surface of a thin celluloid plate, applying to such partially dissolved surface a thin layer of owdered copper in order to form a catho e, electrolytically depositing on the powdered copper a second thin layer of copper, and electrolytically depositing a thin granular layer of'hard metal on the electrolytically deposited copper.
  • lithographic v plates which consists in partially dissolving the surface of a tliin celluloid plate, applying to such partially dissolved surface a thin layer of powdered copper so as to form a cathode, electrolytically depositing on the powdered copper a second thin layer of copper, and electrolytically depositing on the second layer of copper a thin granular layer of nickel.
  • lithographic plates which consists in partially dissolving the surface of a thin celluloid plate with a solvent having particles of powdered copper suspended therein so as to form a cathode, and electrolytically depositing on the cathode a thin layer of hard metal.

Description

C. CHISHOL LITHOGRAPHIC PLATE AND TH OCESS UCING THE SAME.
APPLICATIO ED NOV. 9,1
1,149,974, Patented Aug. 10, 1915.
MZIIEEEBS v [in/5177171 Hi5 2177f.
CLIFTON CHISHOLM, OF SAN FRANCISCO, CALIFORNIA.
LITHOGRAPHIC PLATE AND THE PROCESS FOR PRODUCING THE SAME.
Specification of Letters Patent.
Patented Aug. to, 1915.
Application filed November 9, 1914. Serial N 0. 871,427.
To all whom it may concern Be it known that I, CLIFTON CHIsHoLM, a citizen of the United States, residing in the city and county of San Francisco and State of California, have invented a new and useful Improvement in Lithographic Plates and the Process for Producing the Same, of which the following is a specification.
My invention relates to lithographic printing plates and the process for producing the same wherein a highly flexible and resilient base is provided with an extremely hard granular metallic surface; and the objects of my invention are, first, to provide an improved lithographic plate having a hard flexible granular printing surface with a resilient elastic base or backing, said base being adapted to absorb the shock of a type bar and prevent the indentation of the hard printing surface; second, to provide an improved lithographic plate that may be cheaply produced; third, to provide an improved plate that is-highly flexible so that the same may be easily rolled around a typewriter or similar platen of small diameter; and fourth, to provide an improved plate of the character described having an extremely hard flexible granular surface adapted to readily retain moisture and ink such as is used in connection with the offset lithographic process.
I accomplished these several features by means of the process and plate hereinafter described, reference being had to the drawings forming'a part of the present specificat-ion wherein like characters of reference used to designate similar parts throughout the said specification and drawings, and in which Figure l is a plan view of a lithographic plate constructed in accordance with my process, a portion of the hard metallic surface being broken away in order to disclose the cathode thereon which is in turn partly broken away in order to disclose the resilient elastic base; and Figs. 2, 3 and 4 are greatly enlarged sectional views of the plate disclosing various stages of the process hereinafter more fully set forth. I
In order to provide an improved lithographic plate of extreme flexibility and resiliency having a hard granular surface thereon a sheet of comparatively thin celluloid plate A is painted with a suitable volatile solvent, such as acetone or the like,
mixed with a very finely powdered metal B,
rates the said particles become fixed therein so that a greatly magnified section of the plate A would appear as illustrated in Fig. 2 of the drawings. After a suitable cathode is thus secured to the surface of the plateA a further plating of copper is electrolytically deposited thereon, as disclosed in Fig. 3 of the drawings, for the purpose of increasing the conductivityof the cathode thus formed in order that a plating of aliarder and more porous metal G, preferably nickel, may be electrolytically deposited thereon, as disclosed in Fig. 4 of the drawings, such electrolytical deposition constituting the next step of the process,"and also for the purpose of presenting a smooth surface, the purpose of which will be hereinafter more fully set forth. The electrolytical deposition of the nickel is to provide a hard, thin, non-oxidizing, absorbent surface C of a thickness suitable for lithographic purposes but not thick enough to destroy the physical properties of -the celluloid base. The granular surface is provided for the purpose of ell'cctively retaining such moisture and ink as is needed for the lithographic printing process and may be produced either chemically or mechanically.
A lithographic printing plate produced by the above described process will possess extreme flexibility and resiliency as well as extreme hardness of surface, which characteristics are essential for good sharp reproductions. The flexibility and resiliency of the celluloid base will tend to prolong the life of the, hard granular printing surface and at the same time will provide an elastic base which will readily support the thin layer of electrolytically deposited nickel C, which will yield readily and not strain or crack the thin nickel layer C when the plate is bent or rolled around a platen of small diameter. The resiliency of the celluloid base A also provides an elastic cushion ar- For short runs, 'where a small number of copies are to be produced, an eflicient plate, suitable for the purpose, may beprovided by omitting the final or nickel plating and the printing done directly from the smooth copper surface. I have found also from actual experiment that for. light work where a small number of copies are to be produced, an efficient plate suitable for the purpose may be provided by omitting the electrolytically disposed second layer of copper.
Having thus described my invention, what I claim as new and desire to secure by Letters Patent is- 1 1. A lithographic plate comprising afiexible resilient base; a layer of powdered copper embedded in the surface of the base; and a layer of thin hard metal imposed upon the layer of copper. v
2. A lithographic plate comprising a flexible resilient base; a layer of powdered copper embedded in the surface of the base; and
a thin layer of nickel imposed upon th layer of copper. 3. A lithographic plate comprising a flexible resilient celluloid base; a layer of pow dered copper embedded in the surface of the base; and a thin layer of hard metal imposed upon the layer of copper.
4, A lithographic plate comprising aflex ible resilient celluloid base; a layer of powdered copper embedded in the surface of the celluloid base; and a thin layer of nickel imposed upon the layer of copper.
5. A lithographic plate comprising a flexible resilient celluloid base; a thin layer of powdered copper embedded in the surface of the celluloid base; an electrolytically depos-' -ited second layer of copper imposed upon the'layei' of powdered copper; and a thin layer of hard metal imposed upon the electrolytically deposited layer of copper.
6. A lithographic plate comprising a flexible resilient celluloid base; a thin layer of powdered copper embedded in the surface of the celluloid base; an electrolytically def posited second layer of copper on the first mentioned layer; and a thin layer of nickel electrolytically deposited upon the second mentioned layer of copper.
7. A lithographic plate comprising a resilient flexible celluloid base'; a thin layer of powdered copper embedded in the surface of the celluloid base; a second layer of electrolytically deposited copper upon the first mentioned layer; and a thin granular layer of hard metal deposited upon the second mentioned layer.
8. A lithographic plate comprising a resilient flexible celluloid base; a thin layerof the celluloid base a second layerof electrotioned layer.
9. The step in the process of producing lithographic plates which consists in partially dissolving the surface'of a thin celluloid plate, applying to such partially dissolved surface a thin layer of powdered copper. I
10. The process of producing lithographic plates which consists in partially dissolving the surface ofa thin celluloid plate, applying to such partially dissolved surface a thin layer of powderedmetal, and electroof nickel deposited upon the second menlytically depositing on the powdered metal a thin layer of hard metal.
11. The process of producing lithographic plates which consists in pa tially dissolving the surface of a thin celluloid plate, applying to such partially dissolved surface a thin layer of powdered copper, and electrolyti- 'cally depositing onthe powdered cop-pera thin layer of hard metal. 1
12. The process of producing lithographic plates which consists in partially dissolving .the surface of a thin resilient, fl 'Xible plate,
applying to such partially disso ved surface a thin layer of powdered metal in order to form a cathode, and electrolytically depositing on the cathode a thin layer of hard metal.
. 13. The process of producing lithographic plates which consists in partially dissolving the surface of a thin resilient flexible plate, applying to such partially 'dissolved surface a thin layer of powdered copper in order to form a cathode, and electrolytically deposit-.
ing on the cathode a thin granular layer of hard metal.
14. The process of producing lithographic plates which consists in partially dissolving the surface of a thin celluloid plate, applying to such partially dissolved surface a thin layer of powdered copper in order to forma cathode, electrolytically depositing asecond thin layer of copper on the cathode, and electrolytically depositing a thin layer of hard metal on the electrolytically deposited copper.
15. The process of producing lithographic plates which consists in partially dissolving the surface of a thin celluloid plate, applying to such partially dissolved surface a thin layer of owdered copper in order to form a catho e, electrolytically depositing on the powdered copper a second thin layer of copper, and electrolytically depositing a thin granular layer of'hard metal on the electrolytically deposited copper.
16. The process of producing lithographic v plates which consists in partially dissolving the surface of a tliin celluloid plate, applying to such partially dissolved surface a thin layer of powdered copper so as to form a cathode, electrolytically depositing on the powdered copper a second thin layer of copper, and electrolytically depositing on the second layer of copper a thin granular layer of nickel.
17. The process of producing lithographic plateswhich consists in partially dissolving the surface of a thin celluloid plate with a solvent having particles of powdered copper suspended therein so as to form a cathode, and electrolytically depositing on the cathode a thin layer of hard metal.
18. The process of producing lithographic plates which consists in partially dissolving the surface of a thin celluloid plate with a volatile solvent having particles of powdered copper suspended therein so as to embed the said particles within the surface of thus the plate when the solvent evaporates,
on the cathode a thln granular layer of nickel.
In witness whereof I hereunto set my signature in the presence of two subscribing 5 witnesses.
' CLIFTUN CHISHOLM. Witnesses:
IRENE Downer, CHAS. F. DUISENBERG.
US87142714A 1914-11-09 1914-11-09 Lithographic plate and the process for producing the same. Expired - Lifetime US1149974A (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2506165A (en) * 1945-11-07 1950-05-02 Everett D Mccurdy Method of forming designs in resinous plastic articles
US2566998A (en) * 1948-11-05 1951-09-04 Charles E Bloom Bucky grid and method of making same
US2663663A (en) * 1952-01-10 1953-12-22 Westinghouse Electric Corp Thermosetting synthetic resin laminate with a predetermined roughened surface and process for producing the same
US2690401A (en) * 1951-06-07 1954-09-28 Gen Am Transport Chemical nickel plating on nonmetallic materials
US2719481A (en) * 1951-07-30 1955-10-04 Direct Image Offset Corp Lithographic printing process
US2721154A (en) * 1949-06-24 1955-10-18 Ward Blenkinsop & Co Ltd Production of conducting layers upon electrical insulating materials
US2737541A (en) * 1951-02-17 1956-03-06 Roger S Coolidge Storage battery electrodes and method of making the same
US2783193A (en) * 1952-09-17 1957-02-26 Motorola Inc Electroplating method
US2882631A (en) * 1952-09-05 1959-04-21 Boone Philip Display materials, devices and systems
US3192063A (en) * 1963-12-16 1965-06-29 Internat Assemblix Corp Method of forming decorative objects from foamed thermoplastic resins
US20170258671A1 (en) * 2014-11-03 2017-09-14 Rearm Inc. Limb rehabilitation device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2506165A (en) * 1945-11-07 1950-05-02 Everett D Mccurdy Method of forming designs in resinous plastic articles
US2566998A (en) * 1948-11-05 1951-09-04 Charles E Bloom Bucky grid and method of making same
US2721154A (en) * 1949-06-24 1955-10-18 Ward Blenkinsop & Co Ltd Production of conducting layers upon electrical insulating materials
US2737541A (en) * 1951-02-17 1956-03-06 Roger S Coolidge Storage battery electrodes and method of making the same
US2690401A (en) * 1951-06-07 1954-09-28 Gen Am Transport Chemical nickel plating on nonmetallic materials
US2719481A (en) * 1951-07-30 1955-10-04 Direct Image Offset Corp Lithographic printing process
US2663663A (en) * 1952-01-10 1953-12-22 Westinghouse Electric Corp Thermosetting synthetic resin laminate with a predetermined roughened surface and process for producing the same
US2882631A (en) * 1952-09-05 1959-04-21 Boone Philip Display materials, devices and systems
US2783193A (en) * 1952-09-17 1957-02-26 Motorola Inc Electroplating method
US3192063A (en) * 1963-12-16 1965-06-29 Internat Assemblix Corp Method of forming decorative objects from foamed thermoplastic resins
US20170258671A1 (en) * 2014-11-03 2017-09-14 Rearm Inc. Limb rehabilitation device

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