US11404838B2 - Preformed solder-in-pin system - Google Patents

Preformed solder-in-pin system Download PDF

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Publication number
US11404838B2
US11404838B2 US17/321,745 US202117321745A US11404838B2 US 11404838 B2 US11404838 B2 US 11404838B2 US 202117321745 A US202117321745 A US 202117321745A US 11404838 B2 US11404838 B2 US 11404838B2
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preformed solder
connector
guide fixture
pins
cavity
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US20210273393A1 (en
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Dennis J. Johnson
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Onanon Inc
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Onanon Inc
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Publication of US20210273393A1 publication Critical patent/US20210273393A1/en
Priority to US17/873,423 priority patent/US12034263B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/86—Parallel contacts arranged about a common axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00—Four or more poles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Definitions

  • Example embodiments in general relate to a preformed solder-in-pin system for use with electrical connectors.
  • Solder-type connectors have been used for many years to serve as electrical interfaces between circuits and components. Such connectors typically have multiple conductive connector pins or sockets that fit within a housing to provide a seal and structural support for the pins (or sockets) that mate with corresponding sockets or pins in a mating connector.
  • connection of wires to the connector pins is made is with wires soldered to cavities or “cups” in the backs of the pins or sockets.
  • solder is typically melted into the cavities and then later melted again to install the wires, with each step typically done by hand.
  • every manual step such as melting solder into the pins and then hand soldering wires into the pins, can be time consuming, and further, each time solder is heated, it can be degraded.
  • An example embodiment is directed to a preformed solder-in-pin system.
  • the preformed solder-in-pin system includes a connector pin with a preformed solder member positioned within a cavity formed at one end of the connector pin.
  • the connector pin generally comprises a first end and a second end, with an elongated portion proximate the second end, the elongated portion typically designed to mate with another connector.
  • the connector pin may be made of any metal with suitable electrical and mechanical properties for use in connectors, such as copper, brass, steel, palladium, or alloys of various metals.
  • the connector pin may be made of a single metal, an alloy, or have an alloy base (such as a copper alloy base) and be plated with another metal, such as gold or nickel.
  • the connector pin may comprise an upper portion proximate the first end.
  • the connector pin may further comprise a cavity extending into the first end toward the second end, the cavity comprising an opening proximate the first end.
  • the upper portion may be configured to receive a preformed solder member within the cavity, the solder member typically being pressed into place to tightly and completely fill the cavity, without having been first melted. Accordingly, it is only necessary to melt the solder once, which can limit degradation of the solder compared to solder that is melted multiple times.
  • FIG. 1A is a perspective view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown prior to insertion in the connector pin.
  • FIG. 1B is a perspective view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown installed in the connector pin.
  • FIG. 1C is a perspective view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
  • FIG. 1D is a top view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
  • FIG. 2 is a perspective view of a preformed solder member in accordance with an example embodiment.
  • FIG. 3A is a sectional view of a connector pin in accordance with an example embodiment.
  • FIG. 3B is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed in the connector pin.
  • FIG. 3C is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
  • FIG. 3D is a sectional view of a female-type connector pin in accordance with an example embodiment.
  • FIG. 4A is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed in the connector pin prior to being pressed into a cavity.
  • FIG. 4B is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
  • FIG. 5 is a perspective view of a connector grommet with multiple connector pins installed in accordance with an example embodiment.
  • FIG. 6 is a perspective view of three connector grommets positioned in a connector holder in accordance with an example embodiment.
  • FIG. 7 is a perspective view of a guide fixture in accordance with an example embodiment.
  • FIG. 8 is a perspective view of a guide fixture positioned over a connector holder in accordance with an example embodiment.
  • FIG. 9 is a top view of a guide fixture positioned over a connector holder with preformed solder members on the guide fixture in accordance with an example embodiment.
  • FIG. 10 is another top view of a guide fixture positioned over a connector holder with preformed solder members on the guide fixture in accordance with an example embodiment.
  • FIG. 11 is a sectional view of a guide fixture positioned over a connector grommet with preformed solder members accordance with an example embodiment.
  • FIG. 12 is a sectional view of a connector grommet with multiple connector pins and preformed solder members installed in accordance with an example embodiment, with a press plate.
  • FIG. 13 is a sectional view of a connector grommet with multiple connector pins and preformed solder members installed and pressed into place, in accordance with an example embodiment.
  • FIG. 14 is a perspective view of a connector grommet with multiple connector pins with wires installed in accordance with an example embodiment.
  • An example connector pin 10 with preformed solder member 30 generally comprises a first end 12 and a second end 14 of the pin, with an elongated portion 16 proximate the second end 14 , the elongated portion 16 typically of the configuration to mate with another connector.
  • the connector pin 10 may be made of any metal with suitable electrical and mechanical properties for use in connectors, such as copper, brass, steel, palladium, or alloys of various metals.
  • the connector pin 10 may be made of a single metal, an alloy, or have an alloy base (such as a copper alloy base) and be plated with another metal, such as gold or nickel.
  • the connector pin 10 may comprise an upper portion 18 proximate the first end 12 .
  • the upper portion 18 may be configured to receive a wire.
  • the connector pin 10 may further comprise a cavity 20 extending into the first end 12 toward the second end 14 , the cavity 20 comprising an opening 22 proximate the first end 12 .
  • the connector pin may also include a preformed solder member positioned in the cavity 20 , the preformed solder member 30 having a solder member first end 32 , a solder member second end 34 , and a sidewall 36 that fits within the cavity.
  • the preformed solder member 30 is not melted into the cavity 20 , but pressed into it, so that it takes the shape of, and substantially fills, the cavity 20 . Further, because it is pressed in with considerable force, and has a volume that is close to the exact volume of the cavity 20 , when the solder member 30 is installed, the cavity is substantially free of voids.
  • the elongated portion 16 of the connector pin may be either a male or female type connector element, and may thus mate with a complementary connector type.
  • the connector pin's elongated portion 16 may comprise a first cylindrical section and the upper portion 18 may comprise a second cylindrical section, wherein the second cylindrical section has a greater diameter than the first cylindrical section.
  • the first cylindrical section may comprise substantially the entire length of the elongated portion. It is also possible for the upper portion 18 and the elongated portion 16 to have the same diameter, which is often (but not always) the case with female type connector pins.
  • the opening 22 is the only opening in the upper portion 18 of the connector pin 10 .
  • the cavity 20 may also comprise a main portion 24 that is cylindrical and coaxial with the second cylindrical section.
  • the end of the cavity 20 opposite the opening may have different shapes, as desired by design or as a result of how the cavity 20 is formed.
  • the preformed solder member 30 will take the shape of the cavity 20 (including the taper portion), and fill it, when the solder member 30 is inserted and pressed into place. To accomplish this filling, the preformed solder member 30 will preferably have the same volume as the cavity 20 , regardless of shape.
  • the first end 12 of connector pin 10 may comprise an upper surface 19 that is ring-shaped and planar, which will result when the cavity 20 is drilled in the center of the connector pin 10 , in a coaxial manner.
  • the preformed solder member 30 When the preformed solder member 30 is pressed into the cavity 20 , it may comprise a first surface 38 that is substantially coplanar with the upper surface 19 of the connector pin 10 , proximate the first end 12 of the connector pin 10 .
  • the cavity 20 of the connector pin may be substantially free of voids once the preformed solder member 30 is inserted and installed. Air trapped within cavities in solder pins is undesirable, because the air can expand rapidly when the solder is heated and melted. This usually necessitates placement of a small weep hole toward the bottom of a solder cavity to allow air to escape. A weep hole is not necessary with the example embodiments described herein.
  • This method can take the place of, for example, using a pick-and-place machine for initial insertion of solder preforms into connector pins.
  • multiple connector pins can be installed into a connector grommet 50 , of the type that will hold the pins in position when a connector is fully assembled.
  • the method involves using a connector holder 40 and a guide fixture 70 that is aligned just above the connector grommets 50 that have pins 10 installed in them.
  • a connector holder 40 and a guide fixture 70 may accommodate three connector grommets.
  • the guide fixture 70 may have openings 74 for the solder preforms to fit through, which are held in alignment with the connector pins 10 , so that only one solder preform will fit through each opening 74 .
  • the fixture 70 is held in a registered position above the connector holder 40 by alignment pins 42 .
  • an example method includes the steps of placing a large quantity of preforms 30 in a fixture comprising the connector holder 40 , connector grommets 50 , and guide fixture 70 . This overall assembly is then placed on a shaker table, and with a few strokes of a brush to sweep the preformed solder members 30 over the preform openings 74 , the preformed solder members will relatively quickly drop through the openings 74 and into all the connector pins 10 in the connector grommets 50 .
  • the guide fixture 70 can be separated from the connector holder 40 , and the connector holder 40 can be used to further complete the process.
  • the connector holder 40 can be positioned under a press, and a press plate 60 can exert pressure on the tops of the preforms 30 to force them fully into the cavities 20 in multiple connector pins (for example, all the pins in three connectors at a time).
  • the preformed solder members 30 can deform and, because they have a volume that is essentially the same as that of the cavity, will completely, or substantially completely, fill the cavities 20 in the connector pins 10 . This process is aided by the fact that solder is considerably softer than the metal from which each connector pin is made.
  • an example connector pin 10 suitable for use with a preformed solder member 30 generally comprises a first end 12 and a second end 14 of the pin, with an elongated portion 16 proximate the second end 14 , the elongated portion 16 typically of the configuration to mate with another connector.
  • the connector pin 10 may be made of any metal with suitable electrical and mechanical properties for use in connectors, such as copper, brass, steel, palladium, or alloys of various metals.
  • the connector pin 10 may be made of a single metal, an alloy, or have an alloy base (such as a copper alloy base) and be plated with another metal, such as gold or nickel.
  • the connector pin 10 may comprise an upper portion 18 proximate the first end 12 .
  • the connector pin 10 may further comprise a cavity 20 extending into the first end 12 toward the second end 14 , the cavity 20 comprising an opening 22 proximate the first end 12 .
  • the upper portion 18 may be configured to receive a wire, specifically, once solder has been inserted into the cavity 20 , it can be used to solder a conductive wire to the pin.
  • the elongated portion 16 of the connector pin may be either a male or female type connector element, and may thus mate with a complementary connector type.
  • the connector pin's elongated portion 16 may comprise a first cylindrical section and the upper portion 18 may comprise a second cylindrical section, wherein the second cylindrical section has a greater diameter than the first cylindrical section.
  • the first cylindrical section may comprise substantially the entire length of the elongated portion. It is also possible for the upper portion 18 and the elongated portion 16 to have the same diameter, which is often (but not always) the case with female type connector pins.
  • the opening 22 is the only opening in the upper portion 18 of the connector pin 10 .
  • This is not usually the case with solder-type connector pins, for the following reason:
  • air is often trapped within the cup. Air trapped within cavities in solder pins is undesirable, because the air can expand rapidly when the solder is subsequently heated and melted. Avoiding this situation is typically done by the placement of a small weep hole toward the bottom of a solder cavity to allow air to escape. A weep hole is not necessary with the example embodiments described herein. Because the preformed solder members 30 are pressed into place, the cavity 20 of the connector pin may be substantially free of voids once the preformed solder member 30 is inserted and installed.
  • the connector pin cavity 20 in the upper portion 18 of the pin, may also comprise a main portion 24 that is cylindrical and coaxial with the second cylindrical section, as would be created by drilling the pin to create the cavity 20 .
  • the end of the cavity 20 opposite the opening may have different shapes, as dictated by design or simply as a result of how the cavity 20 is formed.
  • the preformed solder member 30 will take the shape of the cavity 20 (including the taper portion), and fill it, when the solder member 30 is inserted and pressed into place. To accomplish this filling, the preformed solder member 30 will preferably have the same volume, or very nearly the same volume, as the cavity 20 , regardless of the cavity's shape.
  • the preformed solder members 30 generally comprise a first end 32 , a second end 34 , and a sidewall 36 .
  • the solder member 30 may be cylindrical, and dimensioned to fit within the cavities 20 of the connector pins of the example embodiments as shown in FIG. 1A .
  • the preformed solder members are preferably formed without bends, burrs or deformations, so that they fit within the cavities 20 . For example, wound solder can first be straightened and then cut with a blade.
  • the preformed solder members 30 may typically extend above the top surfaces 19 of the connector pins 10 , supported, for example, by the taper portion 26 of the cavity.
  • the solder members may extend, for example, about 12% to about 15% above the top of connector pin surface 19 before being pressed into place.
  • the preformed solder members 30 may be very close in volume to the volume of the cavity 20 in the connector pins they are to be installed in. As a result, if the solder members 30 are pressed firmly into place in the cavities, the result will be that the preforms fill the cavities substantially free of air voids within the cavity, since the softer solder will deform and take the shape of the cavity when under pressure.
  • the drawings are not necessarily to scale, different lengths and diameters of preformed solder members may be used.
  • the preformed solder members 30 may be made with many solder alloys, such as environmentally safe alloys (e.g., tin, silver, & copper), or tin and lead alloys as well.
  • environmentally safe alloys e.g., tin, silver, & copper
  • tin and lead alloys as well.
  • the preformed solder-in-pin system is first created by inserting multiple precision-cut preformed solder members 30 into connector pins 10 for which they are designed. As discussed, different lengths and diameters of preformed solder members can be used, with connector pin cavities 20 sized and shaped accordingly to accommodate the preforms.
  • multiple preformed solder members 30 can be inserted into multiple connector pins 10 in a highly efficient manner, operating on multiple pins at once, rather than inserting and compressing the preformed solder members in place one at a time.
  • multiple connector pins 10 can be installed into a connector grommet 50 , of the type that will hold the pins in position when a connector is fully assembled (i.e., the grommet and pins are part of the assembled connector). This subassembly of a connector is best shown in FIG. 5 .
  • the method involves using a connector holder 40 and a guide fixture 70 that is aligned just above the connector grommets 50 that have pins 10 installed in them.
  • a connector holder 40 may be configured to hold three connector grommets 50 , with pins 10 installed, in place.
  • the connector holder 40 may have alignment pins 42 positioned for indexing as described herein. As an example, multiple grommets/pins can be processed at once.
  • a guide fixture 70 having the same size and shape, generally, as the connector holder 40 , may be used in installing preformed solder members 30 in multiple connector pins 10 . More specifically, in an example embodiment, the guide fixture 70 may be positioned above a connector holder 40 , and held in precise register with alignment holes 72 into which the alignment pins 42 of the connector holder 40 will fit. So assembled, the entire assembly may be placed on a shaker table as shown in FIG. 8 .
  • the guide fixture 70 has multiple preform openings 74 , as best shown in FIGS. 7 and 11 , which are aligned with the installed connector pins 10 in grommets 50 . Only one solder preform 30 will fit through each opening 74 , but the openings 74 are sized so that the preforms 30 will easily fit and thus readily drop into place in the positioned pins 10 . Once in place on a shaker table, a very large number of preformed solder members 30 are placed on the guide fixture 70 , and the shaker table is turned on so that the members 30 will also vibrate freely (see, e.g., FIG. 9 ).
  • each preform 30 will extend above the top surface of each pin, typically by about 12-15%, but this amount will of course vary depending on the chosen dimensions of the pin cavities 20 and the preformed solder members 30 .
  • the guide fixture 70 can be separated from the connector holder 40 , and the connector holder 40 can be used to further complete the process.
  • the connector holder 40 can be positioned under a press, as shown in FIGS. 4A-B and 12 - 13 , and a press plate 60 can exert pressure on the tops of the preforms 30 to force them fully into the cavities 20 in multiple connector pins (for example, all the pins in three connectors at a time).
  • the preformed solder members 30 will deform and, because they have a volume that is essentially the same as that of the cavity, will completely, or substantially completely, fill the cavities 20 in the connector pins 10 , as best shown in FIG. 4B , where the voids that existed before the pressing operation (shown in 4 A) are no longer present. This process is aided by the fact that solder is considerably softer than the metal from which each connector pin is made.
  • the resulting connector assembly can then have wires soldered to the connector pins 10 by, for example, melting the solder and inserting wires while it is still molten, resulting in the assembly shown in FIG. 14 , comprising the grommet 50 , connector pins 10 , and one or more wires corresponding to each connector pin. Because the preformed solder members are pressed, rather than melted, into place in the pins 10 before attaching wires, the solder only needs to be melted once to make a complete connector, which is desirable because solder can degrade each time it is melted, and prolonged periods at higher temperatures can also cause dissolution of the base material of the connector pins.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

A method for inserting preformed solder members into connector pins for use with electrical connectors. The method generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are substantially eliminated. The method allows for inserting solder members in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that solder members can be inserted into large numbers of connector pins that are pre-installed in connector grommets, largely simultaneously.

Description

CROSS REFERENCE TO RELATED APPLICATIONS
The present application is a continuation of U.S. application Ser. No. 17/139,279 filed on Dec. 31, 2020, which is a continuation of U.S. application Ser. No. 16/297,116 filed on Mar. 8, 2019 now issued as U.S. Pat. No. 10,886,685. Each of the aforementioned patent applications, and any applications related thereto, is herein incorporated by reference in their entirety.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
Not applicable to this application.
BACKGROUND Field
Example embodiments in general relate to a preformed solder-in-pin system for use with electrical connectors.
Related Art
Any discussion of the related art throughout the specification should in no way be considered as an admission that such related art is widely known or forms part of common general knowledge in the field.
Solder-type connectors have been used for many years to serve as electrical interfaces between circuits and components. Such connectors typically have multiple conductive connector pins or sockets that fit within a housing to provide a seal and structural support for the pins (or sockets) that mate with corresponding sockets or pins in a mating connector.
One common way that connections of wires to the connector pins are made is with wires soldered to cavities or “cups” in the backs of the pins or sockets. To facilitate the assembly of such connectors, which can have a high number of pins or sockets, solder is typically melted into the cavities and then later melted again to install the wires, with each step typically done by hand. With high-density connectors, every manual step, such as melting solder into the pins and then hand soldering wires into the pins, can be time consuming, and further, each time solder is heated, it can be degraded.
SUMMARY
An example embodiment is directed to a preformed solder-in-pin system. The preformed solder-in-pin system includes a connector pin with a preformed solder member positioned within a cavity formed at one end of the connector pin. The connector pin generally comprises a first end and a second end, with an elongated portion proximate the second end, the elongated portion typically designed to mate with another connector. The connector pin may be made of any metal with suitable electrical and mechanical properties for use in connectors, such as copper, brass, steel, palladium, or alloys of various metals. The connector pin may be made of a single metal, an alloy, or have an alloy base (such as a copper alloy base) and be plated with another metal, such as gold or nickel.
In some example embodiments, the connector pin may comprise an upper portion proximate the first end. The connector pin may further comprise a cavity extending into the first end toward the second end, the cavity comprising an opening proximate the first end. The upper portion may be configured to receive a preformed solder member within the cavity, the solder member typically being pressed into place to tightly and completely fill the cavity, without having been first melted. Accordingly, it is only necessary to melt the solder once, which can limit degradation of the solder compared to solder that is melted multiple times.
There has thus been outlined, rather broadly, some of the embodiments of the preformed solder-in-pin system in order that the detailed description thereof may be better understood, and in order that the present contribution to the art may be better appreciated. There are additional embodiments of the preformed solder-in-pin system that will be described hereinafter and that will form the subject matter of the claims appended hereto. In this respect, before explaining at least one embodiment of the preformed solder-in-pin system in detail, it is to be understood that the preformed solder-in-pin system is not limited in its application to the details of construction or to the arrangements of the components set forth in the following description or illustrated in the drawings. The preformed solder-in-pin system is capable of other embodiments and of being practiced and carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein are for the purpose of the description and should not be regarded as limiting.
BRIEF DESCRIPTION OF THE DRAWINGS
Example embodiments will become more fully understood from the detailed description given herein below and the accompanying drawings, wherein like elements are represented by like reference characters, which are given by way of illustration only and thus are not limitative of the example embodiments herein.
FIG. 1A is a perspective view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown prior to insertion in the connector pin.
FIG. 1B is a perspective view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown installed in the connector pin.
FIG. 1C is a perspective view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
FIG. 1D is a top view of a preformed solder-in-pin system in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
FIG. 2 is a perspective view of a preformed solder member in accordance with an example embodiment.
FIG. 3A is a sectional view of a connector pin in accordance with an example embodiment.
FIG. 3B is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed in the connector pin.
FIG. 3C is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
FIG. 3D is a sectional view of a female-type connector pin in accordance with an example embodiment.
FIG. 4A is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed in the connector pin prior to being pressed into a cavity.
FIG. 4B is a sectional view of a connector pin in accordance with an example embodiment with a preformed solder member shown installed and pressed into the connector pin.
FIG. 5 is a perspective view of a connector grommet with multiple connector pins installed in accordance with an example embodiment.
FIG. 6 is a perspective view of three connector grommets positioned in a connector holder in accordance with an example embodiment.
FIG. 7 is a perspective view of a guide fixture in accordance with an example embodiment.
FIG. 8 is a perspective view of a guide fixture positioned over a connector holder in accordance with an example embodiment.
FIG. 9 is a top view of a guide fixture positioned over a connector holder with preformed solder members on the guide fixture in accordance with an example embodiment.
FIG. 10 is another top view of a guide fixture positioned over a connector holder with preformed solder members on the guide fixture in accordance with an example embodiment.
FIG. 11 is a sectional view of a guide fixture positioned over a connector grommet with preformed solder members accordance with an example embodiment.
FIG. 12 is a sectional view of a connector grommet with multiple connector pins and preformed solder members installed in accordance with an example embodiment, with a press plate.
FIG. 13 is a sectional view of a connector grommet with multiple connector pins and preformed solder members installed and pressed into place, in accordance with an example embodiment.
FIG. 14 is a perspective view of a connector grommet with multiple connector pins with wires installed in accordance with an example embodiment.
 DETAILED DESCRIPTION
A. Overview.
An example connector pin 10 with preformed solder member 30 generally comprises a first end 12 and a second end 14 of the pin, with an elongated portion 16 proximate the second end 14, the elongated portion 16 typically of the configuration to mate with another connector. The connector pin 10 may be made of any metal with suitable electrical and mechanical properties for use in connectors, such as copper, brass, steel, palladium, or alloys of various metals. The connector pin 10 may be made of a single metal, an alloy, or have an alloy base (such as a copper alloy base) and be plated with another metal, such as gold or nickel.
In some example embodiments, the connector pin 10 may comprise an upper portion 18 proximate the first end 12. The upper portion 18 may be configured to receive a wire. The connector pin 10 may further comprise a cavity 20 extending into the first end 12 toward the second end 14, the cavity 20 comprising an opening 22 proximate the first end 12.
The connector pin may also include a preformed solder member positioned in the cavity 20, the preformed solder member 30 having a solder member first end 32, a solder member second end 34, and a sidewall 36 that fits within the cavity. Typically, the preformed solder member 30 is not melted into the cavity 20, but pressed into it, so that it takes the shape of, and substantially fills, the cavity 20. Further, because it is pressed in with considerable force, and has a volume that is close to the exact volume of the cavity 20, when the solder member 30 is installed, the cavity is substantially free of voids.
In an example embodiment, the elongated portion 16 of the connector pin may be either a male or female type connector element, and may thus mate with a complementary connector type. The connector pin's elongated portion 16 may comprise a first cylindrical section and the upper portion 18 may comprise a second cylindrical section, wherein the second cylindrical section has a greater diameter than the first cylindrical section. The first cylindrical section may comprise substantially the entire length of the elongated portion. It is also possible for the upper portion 18 and the elongated portion 16 to have the same diameter, which is often (but not always) the case with female type connector pins.
In another example embodiment, the opening 22 is the only opening in the upper portion 18 of the connector pin 10. The cavity 20 may also comprise a main portion 24 that is cylindrical and coaxial with the second cylindrical section. The end of the cavity 20 opposite the opening may have different shapes, as desired by design or as a result of how the cavity 20 is formed. For example, it is possible for the cavity 20 to have a flat bottom, which would result from its formation by milling. More typically, it may also have a taper portion 26 opposite the opening, which could result from the cavity 20 being formed with a drill bit. Regardless of the cavity shape, the preformed solder member 30 will take the shape of the cavity 20 (including the taper portion), and fill it, when the solder member 30 is inserted and pressed into place. To accomplish this filling, the preformed solder member 30 will preferably have the same volume as the cavity 20, regardless of shape.
The first end 12 of connector pin 10 may comprise an upper surface 19 that is ring-shaped and planar, which will result when the cavity 20 is drilled in the center of the connector pin 10, in a coaxial manner. When the preformed solder member 30 is pressed into the cavity 20, it may comprise a first surface 38 that is substantially coplanar with the upper surface 19 of the connector pin 10, proximate the first end 12 of the connector pin 10.
In another example embodiment, the cavity 20 of the connector pin may be substantially free of voids once the preformed solder member 30 is inserted and installed. Air trapped within cavities in solder pins is undesirable, because the air can expand rapidly when the solder is heated and melted. This usually necessitates placement of a small weep hole toward the bottom of a solder cavity to allow air to escape. A weep hole is not necessary with the example embodiments described herein.
Also disclosed is a method of inserting multiple preformed solder members 30 into multiple connector pins 10 in a highly efficient manner, operating on multiple pins at once, rather than inserting and compressing the preformed solder members in place one at a time. This method can take the place of, for example, using a pick-and-place machine for initial insertion of solder preforms into connector pins. To use the method, multiple connector pins can be installed into a connector grommet 50, of the type that will hold the pins in position when a connector is fully assembled. The method involves using a connector holder 40 and a guide fixture 70 that is aligned just above the connector grommets 50 that have pins 10 installed in them.
As an example, multiple grommets/pins can be processed at once. More specifically, in an example embodiment, a connector holder 40 and a guide fixture 70 may accommodate three connector grommets. The guide fixture 70 may have openings 74 for the solder preforms to fit through, which are held in alignment with the connector pins 10, so that only one solder preform will fit through each opening 74. The fixture 70 is held in a registered position above the connector holder 40 by alignment pins 42.
Rather than work with individual solder preforms, an example method includes the steps of placing a large quantity of preforms 30 in a fixture comprising the connector holder 40, connector grommets 50, and guide fixture 70. This overall assembly is then placed on a shaker table, and with a few strokes of a brush to sweep the preformed solder members 30 over the preform openings 74, the preformed solder members will relatively quickly drop through the openings 74 and into all the connector pins 10 in the connector grommets 50.
Once the pins 10 all have preformed solder members 30 in their cavities, the guide fixture 70 can be separated from the connector holder 40, and the connector holder 40 can be used to further complete the process. In the next step, the connector holder 40 can be positioned under a press, and a press plate 60 can exert pressure on the tops of the preforms 30 to force them fully into the cavities 20 in multiple connector pins (for example, all the pins in three connectors at a time). As a result, the preformed solder members 30 can deform and, because they have a volume that is essentially the same as that of the cavity, will completely, or substantially completely, fill the cavities 20 in the connector pins 10. This process is aided by the fact that solder is considerably softer than the metal from which each connector pin is made.
B. Connector Pin.
As best shown in FIGS. 1A-1C, an example connector pin 10 suitable for use with a preformed solder member 30 generally comprises a first end 12 and a second end 14 of the pin, with an elongated portion 16 proximate the second end 14, the elongated portion 16 typically of the configuration to mate with another connector. The connector pin 10 may be made of any metal with suitable electrical and mechanical properties for use in connectors, such as copper, brass, steel, palladium, or alloys of various metals. The connector pin 10 may be made of a single metal, an alloy, or have an alloy base (such as a copper alloy base) and be plated with another metal, such as gold or nickel.
In some example embodiments, the connector pin 10 may comprise an upper portion 18 proximate the first end 12. The connector pin 10 may further comprise a cavity 20 extending into the first end 12 toward the second end 14, the cavity 20 comprising an opening 22 proximate the first end 12. The upper portion 18 may be configured to receive a wire, specifically, once solder has been inserted into the cavity 20, it can be used to solder a conductive wire to the pin.
In an example embodiment, the elongated portion 16 of the connector pin may be either a male or female type connector element, and may thus mate with a complementary connector type. The connector pin's elongated portion 16 may comprise a first cylindrical section and the upper portion 18 may comprise a second cylindrical section, wherein the second cylindrical section has a greater diameter than the first cylindrical section. The first cylindrical section may comprise substantially the entire length of the elongated portion. It is also possible for the upper portion 18 and the elongated portion 16 to have the same diameter, which is often (but not always) the case with female type connector pins.
As shown in FIG. 3A, in another example embodiment, the opening 22 is the only opening in the upper portion 18 of the connector pin 10. This is not usually the case with solder-type connector pins, for the following reason: When solder is placed in more traditional solder cups of connector pins, air is often trapped within the cup. Air trapped within cavities in solder pins is undesirable, because the air can expand rapidly when the solder is subsequently heated and melted. Avoiding this situation is typically done by the placement of a small weep hole toward the bottom of a solder cavity to allow air to escape. A weep hole is not necessary with the example embodiments described herein. Because the preformed solder members 30 are pressed into place, the cavity 20 of the connector pin may be substantially free of voids once the preformed solder member 30 is inserted and installed.
As also shown in FIG. 3A, the connector pin cavity 20, in the upper portion 18 of the pin, may also comprise a main portion 24 that is cylindrical and coaxial with the second cylindrical section, as would be created by drilling the pin to create the cavity 20. The end of the cavity 20 opposite the opening may have different shapes, as dictated by design or simply as a result of how the cavity 20 is formed. For example, it is possible for the cavity 20 to have a flat bottom, which would result from its formation by milling. More typically, it can have a taper portion 26 opposite the opening, which could result from the cavity 20 being formed by drilling. Regardless of the cavity shape, the preformed solder member 30 will take the shape of the cavity 20 (including the taper portion), and fill it, when the solder member 30 is inserted and pressed into place. To accomplish this filling, the preformed solder member 30 will preferably have the same volume, or very nearly the same volume, as the cavity 20, regardless of the cavity's shape.
C. Preformed Solder Member.
As shown in FIG. 2, the preformed solder members 30 generally comprise a first end 32, a second end 34, and a sidewall 36. In an example embodiment, the solder member 30 may be cylindrical, and dimensioned to fit within the cavities 20 of the connector pins of the example embodiments as shown in FIG. 1A. The preformed solder members are preferably formed without bends, burrs or deformations, so that they fit within the cavities 20. For example, wound solder can first be straightened and then cut with a blade.
As shown in FIGS. 1B and 3B, once inserted into a cavity 20, but before being pressed into position, the preformed solder members 30 may typically extend above the top surfaces 19 of the connector pins 10, supported, for example, by the taper portion 26 of the cavity. The solder members may extend, for example, about 12% to about 15% above the top of connector pin surface 19 before being pressed into place.
By design, the preformed solder members 30 may be very close in volume to the volume of the cavity 20 in the connector pins they are to be installed in. As a result, if the solder members 30 are pressed firmly into place in the cavities, the result will be that the preforms fill the cavities substantially free of air voids within the cavity, since the softer solder will deform and take the shape of the cavity when under pressure. Although the drawings are not necessarily to scale, different lengths and diameters of preformed solder members may be used.
The preformed solder members 30 may be made with many solder alloys, such as environmentally safe alloys (e.g., tin, silver, & copper), or tin and lead alloys as well.
D. Operation of Preferred Embodiment.
In use, the preformed solder-in-pin system is first created by inserting multiple precision-cut preformed solder members 30 into connector pins 10 for which they are designed. As discussed, different lengths and diameters of preformed solder members can be used, with connector pin cavities 20 sized and shaped accordingly to accommodate the preforms.
As discussed briefly above, multiple preformed solder members 30 can be inserted into multiple connector pins 10 in a highly efficient manner, operating on multiple pins at once, rather than inserting and compressing the preformed solder members in place one at a time. To use the method, multiple connector pins 10 can be installed into a connector grommet 50, of the type that will hold the pins in position when a connector is fully assembled (i.e., the grommet and pins are part of the assembled connector). This subassembly of a connector is best shown in FIG. 5.
The method involves using a connector holder 40 and a guide fixture 70 that is aligned just above the connector grommets 50 that have pins 10 installed in them. As best shown in FIG. 6, in an example embodiment, a connector holder 40 may be configured to hold three connector grommets 50, with pins 10 installed, in place. The connector holder 40 may have alignment pins 42 positioned for indexing as described herein. As an example, multiple grommets/pins can be processed at once.
Also, a guide fixture 70, having the same size and shape, generally, as the connector holder 40, may be used in installing preformed solder members 30 in multiple connector pins 10. More specifically, in an example embodiment, the guide fixture 70 may be positioned above a connector holder 40, and held in precise register with alignment holes 72 into which the alignment pins 42 of the connector holder 40 will fit. So assembled, the entire assembly may be placed on a shaker table as shown in FIG. 8.
The guide fixture 70 has multiple preform openings 74, as best shown in FIGS. 7 and 11, which are aligned with the installed connector pins 10 in grommets 50. Only one solder preform 30 will fit through each opening 74, but the openings 74 are sized so that the preforms 30 will easily fit and thus readily drop into place in the positioned pins 10. Once in place on a shaker table, a very large number of preformed solder members 30 are placed on the guide fixture 70, and the shaker table is turned on so that the members 30 will also vibrate freely (see, e.g., FIG. 9). Next, an operator may use a brush or other device to sweep the preformed solder members across the preform openings 74, as shown in FIG. 10. After just a few seconds of this procedure, every exposed, unfilled connector pin cavity 20 will have a preform 30 in it, as shown in FIG. 11. As shown in FIGS. 4A, 11, and 12, the top of each preform 30 will extend above the top surface of each pin, typically by about 12-15%, but this amount will of course vary depending on the chosen dimensions of the pin cavities 20 and the preformed solder members 30.
Once the pins 10 all have preformed solder members 30 in their cavities, the guide fixture 70 can be separated from the connector holder 40, and the connector holder 40 can be used to further complete the process. In the next step, the connector holder 40 can be positioned under a press, as shown in FIGS. 4A-B and 12-13, and a press plate 60 can exert pressure on the tops of the preforms 30 to force them fully into the cavities 20 in multiple connector pins (for example, all the pins in three connectors at a time). As a result, the preformed solder members 30 will deform and, because they have a volume that is essentially the same as that of the cavity, will completely, or substantially completely, fill the cavities 20 in the connector pins 10, as best shown in FIG. 4B, where the voids that existed before the pressing operation (shown in 4A) are no longer present. This process is aided by the fact that solder is considerably softer than the metal from which each connector pin is made.
The resulting connector assembly can then have wires soldered to the connector pins 10 by, for example, melting the solder and inserting wires while it is still molten, resulting in the assembly shown in FIG. 14, comprising the grommet 50, connector pins 10, and one or more wires corresponding to each connector pin. Because the preformed solder members are pressed, rather than melted, into place in the pins 10 before attaching wires, the solder only needs to be melted once to make a complete connector, which is desirable because solder can degrade each time it is melted, and prolonged periods at higher temperatures can also cause dissolution of the base material of the connector pins.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although methods and materials similar to or equivalent to those described herein can be used in the practice or testing of the preformed solder-in-pin system, suitable methods and materials are described above. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety to the extent allowed by applicable law and regulations. The preformed solder-in-pin system may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it is therefore desired that the present embodiment be considered in all respects as illustrative and not restrictive. Any headings utilized within the description are for convenience only and have no legal or limiting effect.

Claims (19)

What is claimed is:
1. A method of inserting a preformed solder member into a connector pin, comprising:
aligning a preform opening of a guide fixture with an upper opening of the connector pin, wherein the preform opening of the guide fixture is above the upper opening of the connector pin;
positioning a preformed solder member on the guide fixture on a side of the guide fixture that is opposite to the connector pin; and
vibrating the guide fixture such that the preformed solder member drops through the preform opening of the guide fixture and into the upper opening of the connector pin.
2. The method of claim 1, further comprising the step of positioning the guide fixture above the connector pin.
3. The method of claim 1, further comprising the step of positioning the connector pin below the guide fixture.
4. The method of claim 1, further comprising the step of moving the preformed solder member to near the preform opening of the guide fixture while the guide fixture is vibrated.
5. The method of claim 4, where the step of moving the preformed solder member is comprised of sweeping the preformed solder member with a brush.
6. The method of claim 1, further comprising the step of positioning the guide fixture on a shaker table.
7. The method of claim 1, wherein the guide fixture is held in alignment with the upper opening of the connector pin by a plurality of alignment pins.
8. The method of claim 1, further comprising the step of pressing the preformed solder member into the upper opening of the connector pin such that the preformed solder member is in contact with an enclosed bottom end of a cavity in the connector pin, wherein there are no air voids between the enclosed bottom end of the cavity and the preformed solder member.
9. The method of claim 8, wherein pressing the preformed solder member into the upper opening comprises pressing the preformed solder member into the upper opening of the connector pin until a first surface of the preformed solder member is substantially coplanar with an upper surface of the connector pin.
10. A method of inserting a plurality of preformed solder members into a corresponding plurality of connector pins, comprising:
aligning a plurality of preform openings of a guide fixture with a corresponding plurality of upper openings of the corresponding plurality of connector pins, wherein the plurality of preform openings of the guide fixture are above the corresponding plurality of upper openings of the corresponding plurality of connector pins;
positioning the plurality of preformed solder members on the guide fixture on a side of the guide fixture that is opposite to the plurality of connector pins; and
vibrating the guide fixture such that the plurality of preformed solder members each drop through one of the plurality of preform openings of the guide fixture into one of the corresponding plurality of upper openings of the corresponding plurality of connector pins.
11. The method of claim 10, further comprising the step of positioning the guide fixture above the corresponding plurality of connector pins.
12. The method of claim 10, further comprising the step of positioning the corresponding plurality of connector pins below the guide fixture.
13. The method of claim 10, further comprising the step of moving the plurality of preformed solder members to near the plurality of preform openings of the guide fixture while the guide fixture is vibrated.
14. The method of claim 13, where the step of moving the plurality of preformed solder members is comprised of sweeping the plurality of preformed solder members with a brush.
15. The method of claim 10, further comprising the step of positioning the guide fixture on a shaker table.
16. The method of claim 10, wherein the guide fixture is held in alignment with the corresponding plurality of upper openings of the corresponding plurality of connector pins by a plurality of alignment pins.
17. The method of claim 10, further comprising the step of pressing the plurality of preformed solder members into the corresponding plurality of upper openings of the corresponding plurality of connector pins such that each preformed solder member of the plurality of preformed solder members is in contact with an enclosed bottom end of a cavity in each corresponding connector pin of the plurality of connector pins, wherein there are no air voids between the enclosed bottom ends of each cavity and each corresponding preformed solder member.
18. The method of claim 17, wherein pressing the plurality of preformed solder members into the corresponding plurality of upper openings comprises pressing the plurality of preformed solder members into the corresponding plurality of upper openings of the corresponding plurality of connector pins until a first surface of the plurality of preformed solder members is substantially coplanar with an upper surface of the corresponding plurality of connector pins.
19. A method of inserting a plurality of preformed solder members that are solid and cylindrical into a plurality of connector pins, wherein each connector pin comprises an upper opening into a cavity, each cavity extending into a first end toward a second end of each connector pin, wherein each preformed solder member comprises a solder member first end, a solder member second end, and a sidewall that fits within each cavity, the method comprising:
positioning the guide fixture on a shaker table;
aligning a guide fixture such that a plurality of preform openings in the guide fixture are aligned with a plurality of upper openings of the plurality of connector pins, wherein the plurality of preform openings are above the plurality of upper openings of the plurality of connector pins;
placing the plurality of preformed solder members on a side of the guide fixture that is opposite to the plurality of connector pins;
sweeping the plurality of preformed solder members over the guide fixture with a brush;
vibrating the guide fixture while sweeping the plurality of preformed solder members over the guide fixture such that the plurality of preformed solder members drop through the plurality of preform openings and into the plurality of upper openings of the plurality of connector pins; and
pressing the plurality of preformed solder members into the plurality of upper openings of the plurality of connector pins such that each preformed solder member of the plurality of preformed solder members is in contact with an enclosed bottom end of a cavity in each corresponding connector pin of the plurality of connector pins, wherein there are no air voids between the enclosed bottom ends of each cavity and each corresponding preformed solder member.
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* Cited by examiner, † Cited by third party
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US20220368095A1 (en) * 2019-03-08 2022-11-17 Onanon, Inc. Preformed Solder-in-Pin System

Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1694149A (en) * 1925-03-21 1928-12-04 Dubilier Condenser Corp Electrical resistance
US3326442A (en) * 1965-05-06 1967-06-20 Arthur P Fattor Electrical conductor connectors with pre-placed solder
US3852517A (en) * 1972-06-12 1974-12-03 Raychem Corp Conductive insert for heat recoverable electrical connector
US4421368A (en) * 1981-07-31 1983-12-20 Western Electric Company, Inc. Lead-receiving socket, multi-socket assembly incorporating same and method of effecting circuit interconnections therewith
US4539621A (en) * 1982-12-20 1985-09-03 Motorola, Inc. Integrated circuit carrier and assembly
US4663815A (en) * 1985-06-21 1987-05-12 Associated Enterprises, Inc. A method and apparatus for surface mount compatible connector system with mechanical integrity
US4687280A (en) * 1984-04-27 1987-08-18 Raychem Corporation Heat activatable sealing piston
US4767344A (en) * 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4852252A (en) * 1988-11-29 1989-08-01 Amp Incorporated Method of terminating wires to terminals
US4984359A (en) * 1988-07-21 1991-01-15 Amp Incorporated Method of making a solder containing electrical connector
US5000691A (en) * 1987-06-11 1991-03-19 Telefonaktiebolaget L M Ericsson Pin fastened to a printed circuit board by soldering
US5046957A (en) * 1990-06-25 1991-09-10 Amp Incorporated Solder plate assembly and method
US5147223A (en) * 1990-09-21 1992-09-15 Amp Incorporated Electrical connector containing components and method of making same
US5163856A (en) * 1989-10-20 1992-11-17 Metcal, Inc. Multipin connector
US5269056A (en) * 1992-09-16 1993-12-14 Oea, Inc. Laser welding of wire strands to an electrode pin
US5480325A (en) * 1994-05-27 1996-01-02 Tandy Corporation Coaxial connector plug and method for assembly
US5772454A (en) * 1995-11-03 1998-06-30 The Whitaker Corporation Wire to board contact terminal
US5782401A (en) * 1996-08-28 1998-07-21 R. J. Tower Corporation Automated system and method for welding a first metal part to a second metal part
US5808259A (en) * 1995-07-31 1998-09-15 Spinner; Howard Thick film apparatus and method for customizing IC test PCB
US6137075A (en) * 1998-11-06 2000-10-24 C&M Technologies Group, Inc. Method and apparatus for producing an electrical bond between conductors and electrical connector contacts
US6142787A (en) * 1998-05-29 2000-11-07 Molex Incorporated Electrical connector assembly with mating assist lever
US6309260B1 (en) * 2000-02-11 2001-10-30 Quick Cable Corp. Solder-in-place connector
WO2002017436A1 (en) 2000-08-23 2002-02-28 Shannon John K Jr Solder-in-place axial-type connector
US6392888B1 (en) * 2000-12-07 2002-05-21 Foxconn Precision Components Co., Ltd. Heat dissipation assembly and method of assembling the same
US20020077003A1 (en) * 2000-12-20 2002-06-20 Berg Technology, Inc. Electrical connector having an electrical contact with a formed solder cup
KR200291242Y1 (en) 2002-07-11 2002-10-09 문인환 A soldering device of pin and cable for axle cable
US20030203660A1 (en) * 2002-04-24 2003-10-30 Kassa Kenneth E. Surface mount socket contact providing uniform solder ball loading and method
US6818839B2 (en) * 2001-03-30 2004-11-16 J.S.T. Mfg. Co., Ltd. Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
US6822867B2 (en) * 2001-06-29 2004-11-23 Intel Corporation Electronic assembly with solderable heat sink and methods of manufacture
US20040253852A1 (en) * 2003-06-13 2004-12-16 Regnier Kent E. Electrical connector solder terminal
US6887104B2 (en) * 2002-11-12 2005-05-03 Hon Hai Precision Ind. Co., Ltd. Cable end connector assembly and the method of making the same
US6945814B2 (en) * 2003-12-30 2005-09-20 Ati Industrial Automation, Inc. Multi-position electrical connector for robotic tool changer
US6974615B2 (en) * 2001-03-30 2005-12-13 J.S.T. Mfg. Co., Ltd. Binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting the binding member to coaxial cable or the electric connector
US20080155823A1 (en) * 2004-07-07 2008-07-03 Andre Heinzel Method for Connecting at Least One Wire to a Contact Element
US20080280495A1 (en) * 2007-05-10 2008-11-13 Hon Hai Precision Ind. Co., Ltd. Connector assembly with improved solder tails
US20110113626A1 (en) * 2008-03-12 2011-05-19 Commscope, Inc. Of North Carolina Cable and Connector Assembly Apparatus and Method of Use
US7973239B2 (en) * 2007-03-20 2011-07-05 Sumitomo Electric Industries, Ltd. Ultrafine-coaxial-wire harness, connecting method thereof, circuit-board-connected body, circuit-board module, and electronic apparatus
JP2012084686A (en) 2010-10-12 2012-04-26 Toyota Industries Corp Connection structure between wiring members
US20120181075A1 (en) * 2011-01-14 2012-07-19 Hon Hai Precision Industry Co., Ltd. Flexible flat cable assembly and method of manufacturing the same
US20140201989A1 (en) * 2013-01-24 2014-07-24 Andrew Llc Soldered Connector and Cable Interconnection Method and Apparatus
US20140218147A1 (en) * 2013-02-04 2014-08-07 Nec Tokin Corporation Magnetic core, inductor and module including inductor
US20150229088A1 (en) * 2013-10-23 2015-08-13 Onanon, Inc. Robotic Wire Termination System
US20150290736A1 (en) * 2012-09-05 2015-10-15 Gm Global Technology Operation Llc Welding wire feeding device and method
US9904259B2 (en) * 2011-04-05 2018-02-27 Kawasaki Jukogyo Kabushiki Kaisha Plate member reversing system and reversing/transfer method thereof
US20200287341A1 (en) * 2019-03-08 2020-09-10 Onanon, Inc. Preformed Solder-in-Pin System

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6607860B2 (en) * 2001-01-24 2003-08-19 Ewd, L.L.C. Serviceable fused battery terminal
US7037370B2 (en) * 2003-02-06 2006-05-02 Mearini Gerald T Free-standing diamond structures and methods
US6979238B1 (en) * 2004-06-28 2005-12-27 Samtec, Inc. Connector having improved contacts with fusible members
JP4338204B2 (en) * 2005-03-30 2009-10-07 Ｔｄｋ株式会社 Soldering method, soldering apparatus, joining method and joining apparatus
US7754343B2 (en) * 2005-08-17 2010-07-13 Oracle America, Inc. Ternary alloy column grid array
JPWO2009144846A1 (en) * 2008-05-30 2011-10-06 イビデン株式会社 Solder ball mounting method
US7837522B1 (en) * 2009-11-12 2010-11-23 Samtec, Inc. Electrical contacts with solder members and methods of attaching solder members to electrical contacts
US9728926B2 (en) * 2010-11-22 2017-08-08 Commscope Technologies Llc Method and apparatus for radial ultrasonic welding interconnected coaxial connector
US20140178513A1 (en) * 2012-12-23 2014-06-26 Robert Richard Matthews Non ionic/electrolyte, liquid/gaseous, mechanically refined/nanoparticle dispersion Building Materials/High Wear-Heat Resistant Part Brushes, Windings, Battery Cells, Brake Pads, Die Cast Molding, Refrigeration, Polarized/Integrated Optical, Spectrometric Processors, Central Processor Unit Processors, Electronic Storage Media, Analogous Series/Parallel Circuit Generators/Transceivers, Particulate Matter PM Carbonaceous-Polyamide, Crystalline Silica, and Cellulosic Filament Extraction/Miners Suit
JP6402936B2 (en) * 2015-06-19 2018-10-10 株式会社オートネットワーク技術研究所 TERMINAL, TERMINAL WITH HEAT-MELTING MEMBER AND METHOD FOR PRODUCING ELECTRIC WIRE
CN108028502B (en) * 2015-11-10 2020-07-17 康普技术有限责任公司 Interface between coaxial cable and connector and method for forming interface
US11088066B2 (en) * 2018-03-19 2021-08-10 Tactotek Oy Multilayer structure and related method of manufacture for electronics
DE112020001190T5 (en) * 2019-03-12 2021-12-02 Smiths Interconnect Americas, Inc. ONE-PIECE SOCKET CONTACT
DE102019112328A1 (en) * 2019-05-10 2020-11-12 Auto-Kabel Management Gmbh Electrical connection console for vehicle power supply line

Patent Citations (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1694149A (en) * 1925-03-21 1928-12-04 Dubilier Condenser Corp Electrical resistance
US3326442A (en) * 1965-05-06 1967-06-20 Arthur P Fattor Electrical conductor connectors with pre-placed solder
US3852517A (en) * 1972-06-12 1974-12-03 Raychem Corp Conductive insert for heat recoverable electrical connector
US4421368A (en) * 1981-07-31 1983-12-20 Western Electric Company, Inc. Lead-receiving socket, multi-socket assembly incorporating same and method of effecting circuit interconnections therewith
US4539621A (en) * 1982-12-20 1985-09-03 Motorola, Inc. Integrated circuit carrier and assembly
US4687280A (en) * 1984-04-27 1987-08-18 Raychem Corporation Heat activatable sealing piston
US4663815A (en) * 1985-06-21 1987-05-12 Associated Enterprises, Inc. A method and apparatus for surface mount compatible connector system with mechanical integrity
US4767344A (en) * 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
US5000691A (en) * 1987-06-11 1991-03-19 Telefonaktiebolaget L M Ericsson Pin fastened to a printed circuit board by soldering
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US4984359A (en) * 1988-07-21 1991-01-15 Amp Incorporated Method of making a solder containing electrical connector
US4852252A (en) * 1988-11-29 1989-08-01 Amp Incorporated Method of terminating wires to terminals
US5163856A (en) * 1989-10-20 1992-11-17 Metcal, Inc. Multipin connector
US5046957A (en) * 1990-06-25 1991-09-10 Amp Incorporated Solder plate assembly and method
US5147223A (en) * 1990-09-21 1992-09-15 Amp Incorporated Electrical connector containing components and method of making same
US5269056A (en) * 1992-09-16 1993-12-14 Oea, Inc. Laser welding of wire strands to an electrode pin
US5480325A (en) * 1994-05-27 1996-01-02 Tandy Corporation Coaxial connector plug and method for assembly
US5808259A (en) * 1995-07-31 1998-09-15 Spinner; Howard Thick film apparatus and method for customizing IC test PCB
US5772454A (en) * 1995-11-03 1998-06-30 The Whitaker Corporation Wire to board contact terminal
US5782401A (en) * 1996-08-28 1998-07-21 R. J. Tower Corporation Automated system and method for welding a first metal part to a second metal part
US6142787A (en) * 1998-05-29 2000-11-07 Molex Incorporated Electrical connector assembly with mating assist lever
US6137075A (en) * 1998-11-06 2000-10-24 C&M Technologies Group, Inc. Method and apparatus for producing an electrical bond between conductors and electrical connector contacts
US6309260B1 (en) * 2000-02-11 2001-10-30 Quick Cable Corp. Solder-in-place connector
WO2002017436A1 (en) 2000-08-23 2002-02-28 Shannon John K Jr Solder-in-place axial-type connector
US6392888B1 (en) * 2000-12-07 2002-05-21 Foxconn Precision Components Co., Ltd. Heat dissipation assembly and method of assembling the same
US20020077003A1 (en) * 2000-12-20 2002-06-20 Berg Technology, Inc. Electrical connector having an electrical contact with a formed solder cup
US6974615B2 (en) * 2001-03-30 2005-12-13 J.S.T. Mfg. Co., Ltd. Binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting the binding member to coaxial cable or the electric connector
US6818839B2 (en) * 2001-03-30 2004-11-16 J.S.T. Mfg. Co., Ltd. Electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
US6822867B2 (en) * 2001-06-29 2004-11-23 Intel Corporation Electronic assembly with solderable heat sink and methods of manufacture
US20030203660A1 (en) * 2002-04-24 2003-10-30 Kassa Kenneth E. Surface mount socket contact providing uniform solder ball loading and method
KR200291242Y1 (en) 2002-07-11 2002-10-09 문인환 A soldering device of pin and cable for axle cable
US6887104B2 (en) * 2002-11-12 2005-05-03 Hon Hai Precision Ind. Co., Ltd. Cable end connector assembly and the method of making the same
US20040253852A1 (en) * 2003-06-13 2004-12-16 Regnier Kent E. Electrical connector solder terminal
US6945814B2 (en) * 2003-12-30 2005-09-20 Ati Industrial Automation, Inc. Multi-position electrical connector for robotic tool changer
US20080155823A1 (en) * 2004-07-07 2008-07-03 Andre Heinzel Method for Connecting at Least One Wire to a Contact Element
US7973239B2 (en) * 2007-03-20 2011-07-05 Sumitomo Electric Industries, Ltd. Ultrafine-coaxial-wire harness, connecting method thereof, circuit-board-connected body, circuit-board module, and electronic apparatus
US20080280495A1 (en) * 2007-05-10 2008-11-13 Hon Hai Precision Ind. Co., Ltd. Connector assembly with improved solder tails
US20110113626A1 (en) * 2008-03-12 2011-05-19 Commscope, Inc. Of North Carolina Cable and Connector Assembly Apparatus and Method of Use
US8234783B2 (en) 2008-03-12 2012-08-07 Andrew, Llc Method for attaching a connector to a coaxial cable
JP2012084686A (en) 2010-10-12 2012-04-26 Toyota Industries Corp Connection structure between wiring members
US20120181075A1 (en) * 2011-01-14 2012-07-19 Hon Hai Precision Industry Co., Ltd. Flexible flat cable assembly and method of manufacturing the same
US9904259B2 (en) * 2011-04-05 2018-02-27 Kawasaki Jukogyo Kabushiki Kaisha Plate member reversing system and reversing/transfer method thereof
US20150290736A1 (en) * 2012-09-05 2015-10-15 Gm Global Technology Operation Llc Welding wire feeding device and method
US20140201989A1 (en) * 2013-01-24 2014-07-24 Andrew Llc Soldered Connector and Cable Interconnection Method and Apparatus
US20140218147A1 (en) * 2013-02-04 2014-08-07 Nec Tokin Corporation Magnetic core, inductor and module including inductor
US20150229088A1 (en) * 2013-10-23 2015-08-13 Onanon, Inc. Robotic Wire Termination System
US20200287341A1 (en) * 2019-03-08 2020-09-10 Onanon, Inc. Preformed Solder-in-Pin System

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PCT International Preliminary Report on Patentability for PCT/US2015/027111; dated Nov. 2, 2017.
PCT International Search Report and Written Opinion for PCT/US2015/027111; dated Jul. 30, 2015.
PCT International Search Report and Written Opinion for PCT/US2019/021805; dated May 28, 2019.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220368095A1 (en) * 2019-03-08 2022-11-17 Onanon, Inc. Preformed Solder-in-Pin System
US12034263B2 (en) * 2019-03-08 2024-07-09 Onanon, Inc. Preformed solder-in-pin system

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US20210126416A1 (en) 2021-04-29
US11050206B2 (en) 2021-06-29
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US12034263B2 (en) 2024-07-09
US11695244B2 (en) 2023-07-04

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