US11302879B2 - Flexible display substrate and manufacturing method therefor, and display apparatus - Google Patents

Flexible display substrate and manufacturing method therefor, and display apparatus Download PDF

Info

Publication number
US11302879B2
US11302879B2 US16/620,559 US201816620559A US11302879B2 US 11302879 B2 US11302879 B2 US 11302879B2 US 201816620559 A US201816620559 A US 201816620559A US 11302879 B2 US11302879 B2 US 11302879B2
Authority
US
United States
Prior art keywords
base substrate
flexible base
auxiliary layer
bending region
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US16/620,559
Other versions
US20200243779A1 (en
Inventor
Lu Liu
Pao Ming Tsai
Peng Cai
Hong Li
Dejun BU
Jianwei Li
Liqiang Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Assigned to BOE TECHNOLOGY GROUP CO., LTD. reassignment BOE TECHNOLOGY GROUP CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BU, DEJUN, CAI, PENG, CHEN, LIQIANG, LI, HONG, LI, JIANWEI, LIU, LU, TSAI, PAO MING
Publication of US20200243779A1 publication Critical patent/US20200243779A1/en
Application granted granted Critical
Publication of US11302879B2 publication Critical patent/US11302879B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
    • H01L51/0097—
    • H01L51/56—
    • H01L2251/5338—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the disclosure relates to the technical field of semiconductors, in particular to a flexible display substrate and a manufacturing method therefor, and a display apparatus.
  • a part in the bezel of the flexible display panel is generally bent to a back face of a display device, which generally requires a part of a film layer in a bending region be removed to reduce bending stress. In a process of removing the part of the film layer, it is liable to cause poor or complicated workmanship and the like.
  • An embodiment of the disclosure provides a flexible display substrate having a bending region, the flexible display substrate including:
  • a first flexible base substrate disposed on the back film
  • a second flexible base substrate disposed on one side of the first flexible base substrate facing away from the back film;
  • auxiliary layer disposed between the first flexible base substrate and the second flexible base substrate, where at least part of the auxiliary layer in the bending region is decomposed when satisfying a preset condition, and the other film layers except the auxiliary layer are maintained at the original state in the preset condition.
  • the satisfying a preset condition includes being irradiated by light with a preset wavelength.
  • the auxiliary layer is a non-crystalline silicon layer.
  • the light with a preset wavelength is a laser with a wavelength ranging from 500 nm to 560 nm.
  • a gap is provided between the first flexible base substrate and the second flexible base substrate in the bending region, and the gap is formed by decomposing at least part of the auxiliary layer in the bending region when satisfying the preset condition.
  • the flexible display substrate further includes a stress balancing layer disposed between the auxiliary layer and the second flexible base substrate.
  • the stress balancing layer is a silicon oxide film layer or a silicon nitride film layer.
  • the flexible display substrate has a groove structure in the bending region and the groove structure extends to the auxiliary layer from the back film.
  • the embodiment of the disclosure further discloses a flexible display apparatus, including the flexible display substrate provided in the embodiment of the disclosure.
  • the embodiment of the disclosure further discloses a manufacturing method for a flexible display substrate having a bending region, the manufacturing method including:
  • the step of decomposing at least part of the auxiliary layer in the bending region specifically includes: irradiating the auxiliary layer in the bending region by light with a preset wavelength.
  • the step of forming an auxiliary layer on a first flexible base substrate specifically includes: forming a non-crystalline silicon layer on the first flexible base substrate.
  • the step of decomposing at least part of the auxiliary layer in the bending region specifically includes: irradiating the non-crystalline silicon layer in the bending region with a laser with a wavelength ranging from 500 nm to 560 nm.
  • the step of removing the back film and the first flexible base substrate in the bending region specifically includes: performing laser cutting along an edge of the gap formed by decomposing the auxiliary layer to cut off the back film and the first flexible base substrate in the bending region.
  • the manufacturing method further includes: forming a stress balancing layer on one side of the auxiliary layer facing away from the first flexible base substrate.
  • FIG. 1 is a structural schematic diagram of a flexible display substrate provided by some embodiments of the disclosure.
  • FIG. 2 is a specific structural schematic diagram of a flexible display substrate provided by some embodiments of the disclosure.
  • FIG. 3 is a specific structural schematic diagram of a flexible display apparatus provided by some embodiments of the disclosure.
  • FIG. 4 is a manufacturing flow chart of a flexible display substrate provided by some embodiments of the disclosure.
  • FIG. 5 is a structural schematic diagram in which a first flexible base substrate is manufactured provided by some embodiments of the disclosure.
  • FIG. 6 is a structural schematic diagram in which an auxiliary layer and a stress balancing layer are manufactured provided by some embodiments of the disclosure.
  • FIG. 7 is a structural schematic diagram in which a second flexible base substrate is manufactured provided by some embodiments of the disclosure.
  • FIG. 8 is a structural schematic diagram in which a light emitting layer and a packaging layer are formed on a second flexible base substrate provided by some embodiments of the disclosure.
  • FIG. 9 is a structural schematic diagram in which a back film is formed on one side of a first flexible substrate facing away from an auxiliary layer provided by some embodiments of the disclosure.
  • FIG. 10 is a structural schematic diagram of a flexible display substrate with all of the auxiliary layer in a bending region being decomposed provided by some embodiments of the disclosure;
  • FIG. 11 is a structural schematic diagram of a flexible display substrate with a back film and a first flexible base substrate in a bending region being removed provided by some embodiments of the disclosure.
  • an embodiment of the disclosure provides a flexible display substrate having a bending region 9 , the flexible display substrate including:
  • a first flexible base substrate 2 disposed on the back film 1 ;
  • a second flexible base substrate 4 disposed on the side of the first flexible base substrate 2 facing away from the back film 1 ;
  • an auxiliary layer 3 disposed between the first flexible base substrate 2 and the second flexible base substrate 4 , where at least part of the auxiliary layer 3 in the bending region 9 may be decomposed in a preset condition, and the other film layers except the auxiliary layer 3 are maintained at the original state in the preset condition; that is, when satisfying the preset condition, the auxiliary layer 3 may be decomposed and the other film layers except the auxiliary layer 3 , e.g. the back film 1 , the first flexible base substrate 2 are not affected, but maintained at the original state.
  • the auxiliary layer 3 is provided between two layers of base substrates (the first flexible base substrate 2 and the second flexible base substrate 4 ).
  • the auxiliary layer 3 may be decomposed in the preset condition, such that when the flexible display substrate is bent, the auxiliary layer 3 in the bending region 9 may be firstly decomposed, such that a gap is formed in the bending region 9 between the first flexible base substrate 2 and the auxiliary layer 3 .
  • the back film 1 and the first flexible base substrate 2 in the bending region 9 can be removed conveniently, thereby reducing bending stress generated during bending.
  • the technical process for removing a part of a film layer in the bending region can be simplified and the problem that an upper circuit is easily damaged since it is difficult to bend the flexible display substrate having two layers of base substrates in a bending region is relieved.
  • satisfying a preset condition includes being irradiated by light with a preset wavelength, i.e. at least part of the auxiliary layer 3 in the bending region 9 may be decomposed when being irradiated by the light with a preset wavelength.
  • at least part of the auxiliary layer 3 in the bending region 9 may be decomposed at a preset temperature, that is to say, any processing manner that enables the auxiliary layer 3 to be decomposed while the other film layers except the auxiliary layer 3 to be maintained at the original state may be used as the preset condition of the disclosure.
  • any film layer which can be decomposed in a preset condition may be used as the auxiliary layer 3 of the disclosure.
  • the material of the auxiliary layer 3 may be non-crystalline silicon, and preset light is a laser with a wavelength ranging from 500 nm to 560 nm.
  • the first flexible base substrate 2 and the second flexible base substrate 4 may both be polyimide base substrates.
  • the light with a preset wavelength is a laser with a wavelength of 515 nm.
  • the laser of 515 nm can penetrate a polyimide base substrate and be absorbed by the non-crystalline silicon, such that the non-crystalline silicon can be decomposed.
  • the auxiliary layer 3 is a non-crystalline silicon layer, it facilitates the cutting in the bending region of the flexible display substrate and further plays a packaging role of an inorganic layer in a display region simultaneously.
  • a part of the auxiliary layer 3 in the bending region 9 may be decomposed in the preset condition as shown in FIG. 2 ; and all of the auxiliary layer 3 in the bending region 9 may also be decomposed in the preset condition as shown in FIG. 3 .
  • the auxiliary layer 3 may be removed according to a specific actual requirement in a manufacturing process, which is not limited herein.
  • the flexible display substrate may further have a stress balancing layer 5 between the auxiliary layer 3 and the second flexible base substrate 4 .
  • the stress balancing layer 5 may be a silicon oxide film layer or a silicon nitride film layer.
  • a bonding layer 6 may be further provided between the back film 1 and the first flexible base substrate 2 , and the back film 1 and the first flexible base substrate 2 are bonded through the bonding layer 6 .
  • the first flexible base substrate 2 and the second flexible base substrate 4 may specifically be polyimide base substrates.
  • the back film 1 may specifically be polyethylene terephthalate (PET), polyethylene naphthalate two formic acid glycol (PEN), cycloolefin polymer (COP), acrylic and other plastic film layers.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate two formic acid glycol
  • COP cycloolefin polymer
  • a gap 11 is provided in the bending region 9 between the first flexible base substrate 2 and the stress balancing layer 5 .
  • the gap 11 is formed by decomposing a part of the auxiliary layer 3 in the bending region 9 when satisfying the preset condition.
  • the flexible display substrate After the back film 1 and the first flexible base substrate 2 in the bending region 9 are removed and before the flexible display substrate 2 is bent towards one side of the back film 1 along the bending region, the flexible display substrate has a groove structure 12 in the bending region 9 , and the groove structure 12 extends to the auxiliary layer 3 from the back film 1 , as shown in FIG. 11 .
  • the embodiment of the disclosure further provides a flexible display apparatus, including the above flexible display substrate provided by the embodiment of the disclosure.
  • the embodiment of the disclosure further provides a manufacturing method for a flexible display substrate.
  • the flexible display substrate has a bending region
  • the manufacturing method includes the steps as follows.
  • Step 101 forming an auxiliary layer on a first flexible base substrate.
  • the step of forming an auxiliary layer on a first flexible base substrate may specifically include: forming a non-crystalline silicon auxiliary layer on a first flexible base substrate.
  • the manufacturing method may further include: forming a first flexible base substrate on a support plate.
  • Step 102 forming a second flexible base substrate on one side of the auxiliary layer facing away from the first flexible base substrate.
  • the manufacturing method may further include: forming a stress balancing layer on one side of the auxiliary layer facing away from the first flexible base substrate.
  • a silicon oxide film layer or a silicon nitride film layer may be formed on one side of the auxiliary layer facing away from the first flexible base substrate.
  • Step 103 forming a back film on one side of the first flexible base substrate facing away from the auxiliary layer.
  • the manufacturing method may further include: separating the first flexible base substrate from the support plate.
  • the manufacturing method may further include: sequentially forming a light emitting layer and a packaging layer on the second flexible base substrate.
  • the light emitting layer may include an anode, an organic electroluminescent material layer and a cathode layer, etc.; and a specific packaging layer may be a film layer with an organic layer and an inorganic layer superposed with each other.
  • the step of forming a back film on one side of the first flexible base substrate facing away from the auxiliary layer may specifically include: forming a bonding layer on one side of the first flexible base substrate facing away from the auxiliary layer, and bonding the back film to the first flexible base substrate through the bonding layer.
  • Step 104 decomposing at least part of the auxiliary layer in the bending region.
  • the step of decomposing at least part of the auxiliary layer in the bending region may specifically include: irradiating light with a preset wavelength to the auxiliary layer in the bending region.
  • a laser with a wavelength ranging from 500 nm to 560 nm is adopted for irradiating a non-crystalline silicon layer in the bending region.
  • Step 105 removing the back film and the first flexible base substrate in the bending region.
  • the step of removing the back film and the first flexible base substrate in the bending region may specifically include: performing laser cutting along an edge of the gap formed by decomposing the auxiliary layer to cut off the back film and the first flexible base substrate in the bending region.
  • Step 1 a first flexible base substrate 2 is formed on a support plate 10 .
  • a schematic diagram in which a first flexible base substrate 2 is formed on a support plate 10 is shown in FIG. 5 .
  • Step 2 an auxiliary layer 3 is formed on the first flexible base substrate 2 , where the specific material of the auxiliary layer 3 may be non-crystalline silicon.
  • a schematic diagram in which an auxiliary layer 3 is formed on the first flexible base substrate 2 is shown in FIG. 6 .
  • Step 3 a stress balancing layer 5 is formed on the auxiliary layer 3 , where the specific material of the stress balancing layer may be silicon oxide.
  • a schematic diagram in which a stress balancing layer 5 is formed on the auxiliary layer 3 is shown in FIG. 6 .
  • Step 4 a second flexible base substrate 4 is formed on the auxiliary layer 3 .
  • a schematic diagram in which a second flexible base substrate 4 is formed on the auxiliary layer 3 is shown in FIG. 7 .
  • Step 5 a light emitting layer 7 and a packaging layer 8 are sequentially formed on the second flexible base substrate 4 .
  • Step 6 the first flexible base substrate 2 is separated from the support plate 10 .
  • Step 7 a bonding layer 6 is formed on one side of the first flexible base substrate 2 facing away from the auxiliary layer 3 , and the back film 1 is bonded to the first flexible base substrate 1 through the bonding layer 6 .
  • a schematic diagram in which the back film 1 is formed is shown in FIG. 9 .
  • Step 8 a laser with wavelength of 515 nm is used to irradiate the auxiliary layer 3 (the non-crystalline silicon layer) in the bending region 9 to decompose a part of the auxiliary layer 3 (the non-crystalline silicon layer) in the bending region 9 , and a gap 11 between the auxiliary layer 3 and the first flexible base substrate 1 is formed.
  • a schematic diagram in which the auxiliary layer 3 in the bending region 9 is decomposed is shown in FIG. 10 .
  • Step 9 cutting is performed along an edge of the bending region 9 on one side of the back film 1 facing away from the first flexible base substrate 2 with a laser cutting technique to cut off the back film 1 and the first flexible base substrate 2 as well as the other film layers between the back film 1 and the first flexible base substrate 2 in the bending region 9 so as to form a groove structure 12 .
  • a schematic diagram in which the back film 1 and the first flexible base substrate 2 in the bending region 9 are cut off is shown in FIG. 11 .
  • Step 10 the flexible display substrate is bent towards one side of the back film in the bending region.
  • the embodiment of the disclosure provides the above flexible display substrate and the manufacturing method therefor, and the display apparatus.
  • the auxiliary layer is provided between two layers of base substrates, and the auxiliary layer may be decomposed in the preset condition.
  • the auxiliary layer in the bending region may be firstly decomposed, such that a gap is formed in the bending region between the first flexible base substrate and the auxiliary layer. Further, by performing cutting along an edge of the bending region, the back film and the first flexible base substrate in the bending region can be removed conveniently, thereby reducing bending stress generated during bending.
  • the technical process for removing a part of a film layer in the bending region can be simplified, and the problem that that an upper circuit is easily damaged since it is difficult to bend the flexible display substrate having two layers of base substrates in a bending region is relieved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A flexible display substrate and a manufacturing method therefor, and a display apparatus, for relieving the problem that it is difficult to bend the flexible display substrate in a bending region to damage an upper circuit. The flexible display substrate comprises a back film, a first flexible base substrate located above the back film, and a second flexible base substrate located on one side of the first flexible base substrate facing away from the back film. The flexible display substrate has a bending region. An auxiliary layer is further provided between the first flexible base substrate and the second flexible base substrate. At least part of the auxiliary layer in the bending region can be decomposed in a preset condition, wherein the other film layers except the auxiliary layer are maintained at the original status in the preset condition.

Description

CROSS-REFERENCE TO RELATED APPLICATION
The disclosure is a US National Stage of International Application No. PCT/CN2018/109936, filed on Oct. 12, 2018, which claims priority to a Chinese Patent Application No. 201711017792.3, filed to the Chinese Patent Office on Oct. 26, 2017 and entitled “FLEXIBLE DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS”, the contents of which are incorporated by reference herein in its entirety.
FIELD
The disclosure relates to the technical field of semiconductors, in particular to a flexible display substrate and a manufacturing method therefor, and a display apparatus.
BACKGROUND
In order to enable a flexible display panel to have a narrow bezel, a part in the bezel of the flexible display panel is generally bent to a back face of a display device, which generally requires a part of a film layer in a bending region be removed to reduce bending stress. In a process of removing the part of the film layer, it is liable to cause poor or complicated workmanship and the like.
SUMMARY
An embodiment of the disclosure provides a flexible display substrate having a bending region, the flexible display substrate including:
a back film;
a first flexible base substrate, disposed on the back film;
a second flexible base substrate, disposed on one side of the first flexible base substrate facing away from the back film; and
an auxiliary layer, disposed between the first flexible base substrate and the second flexible base substrate, where at least part of the auxiliary layer in the bending region is decomposed when satisfying a preset condition, and the other film layers except the auxiliary layer are maintained at the original state in the preset condition.
Optionally, the satisfying a preset condition includes being irradiated by light with a preset wavelength.
Optionally, the auxiliary layer is a non-crystalline silicon layer.
Optionally, the light with a preset wavelength is a laser with a wavelength ranging from 500 nm to 560 nm.
Optionally, a gap is provided between the first flexible base substrate and the second flexible base substrate in the bending region, and the gap is formed by decomposing at least part of the auxiliary layer in the bending region when satisfying the preset condition.
Optionally, the flexible display substrate further includes a stress balancing layer disposed between the auxiliary layer and the second flexible base substrate.
Optionally, the stress balancing layer is a silicon oxide film layer or a silicon nitride film layer.
Optionally, the flexible display substrate has a groove structure in the bending region and the groove structure extends to the auxiliary layer from the back film.
The embodiment of the disclosure further discloses a flexible display apparatus, including the flexible display substrate provided in the embodiment of the disclosure.
The embodiment of the disclosure further discloses a manufacturing method for a flexible display substrate having a bending region, the manufacturing method including:
forming an auxiliary layer on a first flexible base substrate;
forming a second flexible base substrate on one side of the auxiliary layer facing away from the first flexible base substrate;
forming a back film on one side of the first flexible base substrate facing away from the auxiliary layer;
decomposing at least part of the auxiliary layer in the bending region; and
removing a back film and a first flexible base substrate in the bending region.
Optionally, the step of decomposing at least part of the auxiliary layer in the bending region specifically includes: irradiating the auxiliary layer in the bending region by light with a preset wavelength.
Optionally, the step of forming an auxiliary layer on a first flexible base substrate specifically includes: forming a non-crystalline silicon layer on the first flexible base substrate.
Optionally, the step of decomposing at least part of the auxiliary layer in the bending region specifically includes: irradiating the non-crystalline silicon layer in the bending region with a laser with a wavelength ranging from 500 nm to 560 nm.
Optionally, the step of removing the back film and the first flexible base substrate in the bending region specifically includes: performing laser cutting along an edge of the gap formed by decomposing the auxiliary layer to cut off the back film and the first flexible base substrate in the bending region.
Optionally, before the step of forming a second flexible base substrate, the manufacturing method further includes: forming a stress balancing layer on one side of the auxiliary layer facing away from the first flexible base substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a structural schematic diagram of a flexible display substrate provided by some embodiments of the disclosure;
FIG. 2 is a specific structural schematic diagram of a flexible display substrate provided by some embodiments of the disclosure;
FIG. 3 is a specific structural schematic diagram of a flexible display apparatus provided by some embodiments of the disclosure;
FIG. 4 is a manufacturing flow chart of a flexible display substrate provided by some embodiments of the disclosure;
FIG. 5 is a structural schematic diagram in which a first flexible base substrate is manufactured provided by some embodiments of the disclosure;
FIG. 6 is a structural schematic diagram in which an auxiliary layer and a stress balancing layer are manufactured provided by some embodiments of the disclosure;
FIG. 7 is a structural schematic diagram in which a second flexible base substrate is manufactured provided by some embodiments of the disclosure;
FIG. 8 is a structural schematic diagram in which a light emitting layer and a packaging layer are formed on a second flexible base substrate provided by some embodiments of the disclosure;
FIG. 9 is a structural schematic diagram in which a back film is formed on one side of a first flexible substrate facing away from an auxiliary layer provided by some embodiments of the disclosure;
FIG. 10 is a structural schematic diagram of a flexible display substrate with all of the auxiliary layer in a bending region being decomposed provided by some embodiments of the disclosure;
FIG. 11 is a structural schematic diagram of a flexible display substrate with a back film and a first flexible base substrate in a bending region being removed provided by some embodiments of the disclosure.
 DETAILED DESCRIPTION OF EMBODIMENTS
Implementation processes in embodiments of the disclosure will be described below in details by combining with accompanying figures of the specification. It needs to note that the same or similar marker from the beginning to the end represents the same or similar element or an element with the same or similar function. Embodiments described below in reference to accompanying figures are exemplary, and used for interpreting the disclosure only, instead of being understood as limitations to the disclosure.
Referring to FIG. 1, an embodiment of the disclosure provides a flexible display substrate having a bending region 9, the flexible display substrate including:
a back film 1;
a first flexible base substrate 2, disposed on the back film 1;
a second flexible base substrate 4, disposed on the side of the first flexible base substrate 2 facing away from the back film 1; and
an auxiliary layer 3, disposed between the first flexible base substrate 2 and the second flexible base substrate 4, where at least part of the auxiliary layer 3 in the bending region 9 may be decomposed in a preset condition, and the other film layers except the auxiliary layer 3 are maintained at the original state in the preset condition; that is, when satisfying the preset condition, the auxiliary layer 3 may be decomposed and the other film layers except the auxiliary layer 3, e.g. the back film 1, the first flexible base substrate 2 are not affected, but maintained at the original state.
Specifically, in the above flexible display substrate provided in the embodiment of the disclosure, the auxiliary layer 3 is provided between two layers of base substrates (the first flexible base substrate 2 and the second flexible base substrate 4). The auxiliary layer 3 may be decomposed in the preset condition, such that when the flexible display substrate is bent, the auxiliary layer 3 in the bending region 9 may be firstly decomposed, such that a gap is formed in the bending region 9 between the first flexible base substrate 2 and the auxiliary layer 3. Further, by performing cutting along an edge of the bending region 9, the back film 1 and the first flexible base substrate 2 in the bending region 9 can be removed conveniently, thereby reducing bending stress generated during bending. As such, the technical process for removing a part of a film layer in the bending region can be simplified and the problem that an upper circuit is easily damaged since it is difficult to bend the flexible display substrate having two layers of base substrates in a bending region is relieved.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, satisfying a preset condition includes being irradiated by light with a preset wavelength, i.e. at least part of the auxiliary layer 3 in the bending region 9 may be decomposed when being irradiated by the light with a preset wavelength. Alternatively, at least part of the auxiliary layer 3 in the bending region 9 may be decomposed at a preset temperature, that is to say, any processing manner that enables the auxiliary layer 3 to be decomposed while the other film layers except the auxiliary layer 3 to be maintained at the original state may be used as the preset condition of the disclosure. For the auxiliary layer 3, any film layer which can be decomposed in a preset condition may be used as the auxiliary layer 3 of the disclosure.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, the material of the auxiliary layer 3 may be non-crystalline silicon, and preset light is a laser with a wavelength ranging from 500 nm to 560 nm.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, the first flexible base substrate 2 and the second flexible base substrate 4 may both be polyimide base substrates.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, the light with a preset wavelength is a laser with a wavelength of 515 nm.
Since when a green laser with the wavelength of 515 nm irradiates a non-crystalline silicon layer with high hydrogen content, the laser of 515 nm can penetrate a polyimide base substrate and be absorbed by the non-crystalline silicon, such that the non-crystalline silicon can be decomposed. Moreover, when the auxiliary layer 3 is a non-crystalline silicon layer, it facilitates the cutting in the bending region of the flexible display substrate and further plays a packaging role of an inorganic layer in a display region simultaneously.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, a part of the auxiliary layer 3 in the bending region 9 may be decomposed in the preset condition as shown in FIG. 2; and all of the auxiliary layer 3 in the bending region 9 may also be decomposed in the preset condition as shown in FIG. 3. Specifically, the auxiliary layer 3 may be removed according to a specific actual requirement in a manufacturing process, which is not limited herein.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, referring to FIG. 2, the flexible display substrate may further have a stress balancing layer 5 between the auxiliary layer 3 and the second flexible base substrate 4.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, the stress balancing layer 5 may be a silicon oxide film layer or a silicon nitride film layer.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, a bonding layer 6 may be further provided between the back film 1 and the first flexible base substrate 2, and the back film 1 and the first flexible base substrate 2 are bonded through the bonding layer 6.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, the first flexible base substrate 2 and the second flexible base substrate 4 may specifically be polyimide base substrates.
Optionally, in the above flexible display substrate provided by the embodiment of the disclosure, the back film 1 may specifically be polyethylene terephthalate (PET), polyethylene naphthalate two formic acid glycol (PEN), cycloolefin polymer (COP), acrylic and other plastic film layers.
It needs to be interpreted that for the flexible display substrate provided by the embodiment of the disclosure, since the auxiliary layer 3 in the bending region 9 needs to be decomposed firstly, then cutting is performed along an edge of the bending region 9 to cut off the back film 1 and the first flexible base substrate 2 in the bending region 9, and afterwards, the flexible display substrate is bent towards one side of the back film 1 along the bending region 9, different shape structures can be provided at different stages.
For example, with removing a part of the auxiliary layer 3 in the bending region 9 as an example, referring to FIG. 10, after the auxiliary layer 3 in the bending region 9 is decomposed and before the back film 1 and the first flexible base substrate 2 in the bending region 9 are removed, a gap 11 is provided in the bending region 9 between the first flexible base substrate 2 and the stress balancing layer 5. The gap 11 is formed by decomposing a part of the auxiliary layer 3 in the bending region 9 when satisfying the preset condition.
After the back film 1 and the first flexible base substrate 2 in the bending region 9 are removed and before the flexible display substrate 2 is bent towards one side of the back film 1 along the bending region, the flexible display substrate has a groove structure 12 in the bending region 9, and the groove structure 12 extends to the auxiliary layer 3 from the back film 1, as shown in FIG. 11.
Based on the same inventive concept, the embodiment of the disclosure further provides a flexible display apparatus, including the above flexible display substrate provided by the embodiment of the disclosure.
Based on the same inventive concept, the embodiment of the disclosure further provides a manufacturing method for a flexible display substrate. Referring to FIG. 4, the flexible display substrate has a bending region, and the manufacturing method includes the steps as follows.
Step 101: forming an auxiliary layer on a first flexible base substrate.
Optionally, the step of forming an auxiliary layer on a first flexible base substrate may specifically include: forming a non-crystalline silicon auxiliary layer on a first flexible base substrate.
During specific implementation, before the step of forming an auxiliary layer on a first flexible base substrate, the manufacturing method may further include: forming a first flexible base substrate on a support plate.
Step 102: forming a second flexible base substrate on one side of the auxiliary layer facing away from the first flexible base substrate.
Optionally, before the step of forming a second flexible base substrate on one side of the auxiliary layer facing away from the first flexible base substrate, the manufacturing method may further include: forming a stress balancing layer on one side of the auxiliary layer facing away from the first flexible base substrate.
Specifically, a silicon oxide film layer or a silicon nitride film layer may be formed on one side of the auxiliary layer facing away from the first flexible base substrate.
Step 103: forming a back film on one side of the first flexible base substrate facing away from the auxiliary layer.
During specific implementation, before the step of forming a back film on one side of the first flexible base substrate facing away from the auxiliary layer, the manufacturing method may further include: separating the first flexible base substrate from the support plate.
Further, before the step of separating the first flexible base substrate from the support plate, the manufacturing method may further include: sequentially forming a light emitting layer and a packaging layer on the second flexible base substrate.
Specifically, the light emitting layer may include an anode, an organic electroluminescent material layer and a cathode layer, etc.; and a specific packaging layer may be a film layer with an organic layer and an inorganic layer superposed with each other.
Optionally, the step of forming a back film on one side of the first flexible base substrate facing away from the auxiliary layer may specifically include: forming a bonding layer on one side of the first flexible base substrate facing away from the auxiliary layer, and bonding the back film to the first flexible base substrate through the bonding layer.
Step 104: decomposing at least part of the auxiliary layer in the bending region.
Optionally, the step of decomposing at least part of the auxiliary layer in the bending region may specifically include: irradiating light with a preset wavelength to the auxiliary layer in the bending region.
Optionally, a laser with a wavelength ranging from 500 nm to 560 nm is adopted for irradiating a non-crystalline silicon layer in the bending region.
Step 105: removing the back film and the first flexible base substrate in the bending region.
Optionally, the step of removing the back film and the first flexible base substrate in the bending region may specifically include: performing laser cutting along an edge of the gap formed by decomposing the auxiliary layer to cut off the back film and the first flexible base substrate in the bending region.
For describing the manufacturing method for the flexible display substrate provided in the disclosure in more details, examples are listed as follows by combining with FIGS. 5 to 11.
Step 1: a first flexible base substrate 2 is formed on a support plate 10. A schematic diagram in which a first flexible base substrate 2 is formed on a support plate 10 is shown in FIG. 5.
Step 2: an auxiliary layer 3 is formed on the first flexible base substrate 2, where the specific material of the auxiliary layer 3 may be non-crystalline silicon. A schematic diagram in which an auxiliary layer 3 is formed on the first flexible base substrate 2 is shown in FIG. 6.
Step 3: a stress balancing layer 5 is formed on the auxiliary layer 3, where the specific material of the stress balancing layer may be silicon oxide. A schematic diagram in which a stress balancing layer 5 is formed on the auxiliary layer 3 is shown in FIG. 6.
Step 4: a second flexible base substrate 4 is formed on the auxiliary layer 3. A schematic diagram in which a second flexible base substrate 4 is formed on the auxiliary layer 3 is shown in FIG. 7.
Step 5: a light emitting layer 7 and a packaging layer 8 are sequentially formed on the second flexible base substrate 4. A schematic diagram in which a light emitting layer 7 and a packaging layer 8 are sequentially formed on the second flexible base substrate 4 is shown in FIG. 8.
Step 6: the first flexible base substrate 2 is separated from the support plate 10.
Step 7: a bonding layer 6 is formed on one side of the first flexible base substrate 2 facing away from the auxiliary layer 3, and the back film 1 is bonded to the first flexible base substrate 1 through the bonding layer 6. A schematic diagram in which the back film 1 is formed is shown in FIG. 9.
Step 8: a laser with wavelength of 515 nm is used to irradiate the auxiliary layer 3 (the non-crystalline silicon layer) in the bending region 9 to decompose a part of the auxiliary layer 3 (the non-crystalline silicon layer) in the bending region 9, and a gap 11 between the auxiliary layer 3 and the first flexible base substrate 1 is formed. A schematic diagram in which the auxiliary layer 3 in the bending region 9 is decomposed is shown in FIG. 10.
Step 9: cutting is performed along an edge of the bending region 9 on one side of the back film 1 facing away from the first flexible base substrate 2 with a laser cutting technique to cut off the back film 1 and the first flexible base substrate 2 as well as the other film layers between the back film 1 and the first flexible base substrate 2 in the bending region 9 so as to form a groove structure 12. A schematic diagram in which the back film 1 and the first flexible base substrate 2 in the bending region 9 are cut off is shown in FIG. 11.
Step 10: the flexible display substrate is bent towards one side of the back film in the bending region.
The embodiment of the disclosure provides the above flexible display substrate and the manufacturing method therefor, and the display apparatus. The auxiliary layer is provided between two layers of base substrates, and the auxiliary layer may be decomposed in the preset condition. When the flexible display substrate is bent, the auxiliary layer in the bending region may be firstly decomposed, such that a gap is formed in the bending region between the first flexible base substrate and the auxiliary layer. Further, by performing cutting along an edge of the bending region, the back film and the first flexible base substrate in the bending region can be removed conveniently, thereby reducing bending stress generated during bending. As such, the technical process for removing a part of a film layer in the bending region can be simplified, and the problem that that an upper circuit is easily damaged since it is difficult to bend the flexible display substrate having two layers of base substrates in a bending region is relieved.
Obviously, those skilled in the art can make various modifications and deformations to the disclosure, without separating them from the spirit and scope of the disclosure. By doing this, if these modifications and deformations of the disclosure belong to the scope of the claims and equivalent techniques in the disclosure, the disclosure also intends to include these modifications and deformations.

Claims (13)

The invention claimed is:
1. A flexible display substrate having a display area and a bezel area, wherein a bending region is provided in the bezel area, and the flexible display substrate comprises:
a back film;
a first flexible base substrate, disposed on the back film;
a second flexible base substrate, disposed on one side of the first flexible base substrate facing away from the back film; and
an auxiliary layer, disposed between the first flexible base substrate and the second flexible base substrate;
wherein when light with a preset wavelength is irradiating at the bending region, at least part of the auxiliary layer in the bending region is decomposed; wherein:
when part of the auxiliary layer in the bending area is decomposed, a first gap is formed between the first flexible base substrate and the auxiliary layer; and
when all the auxiliary layer in the bending area is decomposed, a second gap is formed between the first flexible base substrate and the second flexible base substrate;
after the first gap or the second gap is formed, removing the back film and the first flexible base substrate in the bending region.
2. The flexible display substrate of claim 1, wherein the auxiliary layer is a non-crystalline silicon layer.
3. The flexible display substrate of claim 1, wherein the light with the preset wavelength is a laser with a wavelength ranging from 500 nm to 560 nm.
4. The flexible display substrate of claim 1, wherein the flexible display substrate further comprises a stress balancing layer disposed between the auxiliary layer and the second flexible base substrate.
5. The flexible display substrate of claim 4, wherein the stress balancing layer is a silicon oxide film layer or a silicon nitride film layer.
6. The flexible display substrate of claim 1, wherein the flexible display substrate has a groove structure in the bending region, and the groove structure extends to the auxiliary layer from the back film.
7. A flexible display apparatus, wherein the flexible display apparatus comprises the flexible display substrate of claim 1.
8. A manufacturing method for the flexible display substrate of claim 1, wherein the manufacturing method comprises:
forming the auxiliary layer on the first flexible base substrate;
forming the second flexible base substrate on one side of the auxiliary layer facing away from the first flexible base substrate; and
forming the back film on one side of the first flexible base substrate facing away from the auxiliary layer.
9. The manufacturing method of claim 8, further comprising:
decomposing at least part of the auxiliary layer in the bending region;
wherein the step of decomposing at least part of the auxiliary layer in the bending region specifically comprises: irradiating the auxiliary layer in the bending region by light with a preset wavelength.
10. The manufacturing method of claim 9, wherein the step of forming an auxiliary layer on a first flexible base substrate specifically comprises: forming a non-crystalline silicon layer on the first flexible base substrate.
11. The manufacturing method of claim 10, wherein the step of decomposing at least part of the auxiliary layer in the bending region specifically comprises: irradiating the non-crystalline silicon layer in the bending region with a laser with a wavelength ranging from 500 nm to 560 nm.
12. The manufacturing method of claim 8, further comprising:
removing a back film and a first flexible base substrate in the bending region, after decomposing at least part of the auxiliary layer in the bending region;
wherein the step of removing the back film and the first flexible base substrate in the bending region specifically comprises: performing laser cutting along an edge of the gap formed by decomposing the auxiliary layer to cut off the back film and the first flexible base substrate in the bending region.
13. The manufacturing method of claim 8, wherein before the step of forming a second flexible base substrate, the manufacturing method further comprises: forming a stress balancing layer on one side of the auxiliary layer facing away from the first flexible base substrate.
US16/620,559 2017-10-26 2018-10-12 Flexible display substrate and manufacturing method therefor, and display apparatus Active 2038-11-10 US11302879B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201711017792.3A CN107768413B (en) 2017-10-26 2017-10-26 A flexible display substrate, a display device and a manufacturing method thereof
CN201711017792.3 2017-10-26
PCT/CN2018/109936 WO2019080718A1 (en) 2017-10-26 2018-10-12 Flexible display substrate and manufacturing method therefor, and display apparatus

Publications (2)

Publication Number Publication Date
US20200243779A1 US20200243779A1 (en) 2020-07-30
US11302879B2 true US11302879B2 (en) 2022-04-12

Family

ID=61271528

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/620,559 Active 2038-11-10 US11302879B2 (en) 2017-10-26 2018-10-12 Flexible display substrate and manufacturing method therefor, and display apparatus

Country Status (3)

Country Link
US (1) US11302879B2 (en)
CN (1) CN107768413B (en)
WO (1) WO2019080718A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220199943A1 (en) * 2020-05-27 2022-06-23 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate, manufacturing method thereof, and display device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107768413B (en) * 2017-10-26 2020-12-01 京东方科技集团股份有限公司 A flexible display substrate, a display device and a manufacturing method thereof
CN108470521B (en) * 2018-03-29 2021-02-26 京东方科技集团股份有限公司 Display panel, display device and manufacturing method thereof
CN109215511B (en) * 2018-10-22 2021-09-21 京东方科技集团股份有限公司 Preparation method of flexible display panel, flexible display panel and display device
CN109638052B (en) * 2018-12-15 2021-05-07 武汉华星光电半导体显示技术有限公司 Flexible substrate, flexible display panel and manufacturing method thereof
CN112309989B (en) * 2020-10-27 2022-05-03 武汉华星光电半导体显示技术有限公司 Substrate manufacturing method, substrate and display device
CN113809266A (en) * 2021-09-16 2021-12-17 京东方科技集团股份有限公司 Display substrate, manufacturing method thereof and display device
CN116634814B (en) * 2023-05-24 2024-06-28 绵阳惠科光电科技有限公司 Display panel, manufacturing method thereof and spliced display

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8815620B2 (en) 2012-08-07 2014-08-26 Samsung Display Co., Ltd. Flexible organic light-emitting display device and method of manufacturing the same
US20140308804A1 (en) * 2011-11-29 2014-10-16 Panasonic Corporation Method for forming crystalline thin-film and method for manufacturing thin film transistor
US20160211350A1 (en) 2015-01-21 2016-07-21 Samsung Display Co., Ltd. Manufacturing method of flexible display device
US20170047547A1 (en) * 2015-08-13 2017-02-16 Lg Display Co., Ltd. Flexible display device
CN106684243A (en) 2017-02-15 2017-05-17 厦门天马微电子有限公司 Flexible display panel and display device
CN107086010A (en) 2017-04-19 2017-08-22 京东方科技集团股份有限公司 Electronic device manufacturing method and electronic device
CN107170778A (en) 2017-05-12 2017-09-15 京东方科技集团股份有限公司 A kind of flexible base board preparation method, flexible base board, display panel and display device
US20170271625A1 (en) * 2015-09-28 2017-09-21 Boe Technology Group Co., Ltd. Method for forming display substrate for display panel
CN107768413A (en) 2017-10-26 2018-03-06 京东方科技集团股份有限公司 A kind of flexible display substrates, display device and preparation method thereof
US20180284523A1 (en) * 2017-03-28 2018-10-04 Japan Display Inc. Display device
US20190081080A1 (en) * 2017-02-24 2019-03-14 Boe Technology Group Co., Ltd. Array substrate, method for fabricating the same and display device

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140308804A1 (en) * 2011-11-29 2014-10-16 Panasonic Corporation Method for forming crystalline thin-film and method for manufacturing thin film transistor
US8815620B2 (en) 2012-08-07 2014-08-26 Samsung Display Co., Ltd. Flexible organic light-emitting display device and method of manufacturing the same
US20160211350A1 (en) 2015-01-21 2016-07-21 Samsung Display Co., Ltd. Manufacturing method of flexible display device
CN105810102A (en) 2015-01-21 2016-07-27 三星显示有限公司 Manufacturing method of flexible display device
US20170047547A1 (en) * 2015-08-13 2017-02-16 Lg Display Co., Ltd. Flexible display device
US20170271625A1 (en) * 2015-09-28 2017-09-21 Boe Technology Group Co., Ltd. Method for forming display substrate for display panel
CN106684243A (en) 2017-02-15 2017-05-17 厦门天马微电子有限公司 Flexible display panel and display device
US10181568B2 (en) 2017-02-15 2019-01-15 Xiamen Tianma Micro-Electronics Co., Ltd. Flexible display panel and display device
US20190081080A1 (en) * 2017-02-24 2019-03-14 Boe Technology Group Co., Ltd. Array substrate, method for fabricating the same and display device
US20180284523A1 (en) * 2017-03-28 2018-10-04 Japan Display Inc. Display device
CN107086010A (en) 2017-04-19 2017-08-22 京东方科技集团股份有限公司 Electronic device manufacturing method and electronic device
US20180304575A1 (en) 2017-04-19 2018-10-25 Boe Technology Group Co., Ltd. Electronic apparatuses and methods for manufacturing an electronic apparatus
CN107170778A (en) 2017-05-12 2017-09-15 京东方科技集团股份有限公司 A kind of flexible base board preparation method, flexible base board, display panel and display device
CN107768413A (en) 2017-10-26 2018-03-06 京东方科技集团股份有限公司 A kind of flexible display substrates, display device and preparation method thereof

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Chinese First Office Action issued in Chinese Application No. 201711017792.3 dated Feb. 3, 2019.
Chinese Second Office Action issued in Chinese Application No. 201711017792.3 dated Jul. 22, 2019.
Decision of Rejection issued in Chinese Application No. 201711017792.3 dated Nov. 8, 2019.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220199943A1 (en) * 2020-05-27 2022-06-23 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate, manufacturing method thereof, and display device
US12004367B2 (en) * 2020-05-27 2024-06-04 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate, manufacturing method thereof, and display device
US12446449B2 (en) 2020-05-27 2025-10-14 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate and display device

Also Published As

Publication number Publication date
CN107768413B (en) 2020-12-01
CN107768413A (en) 2018-03-06
US20200243779A1 (en) 2020-07-30
WO2019080718A1 (en) 2019-05-02

Similar Documents

Publication Publication Date Title
US11302879B2 (en) Flexible display substrate and manufacturing method therefor, and display apparatus
CN104752443B (en) Substrate support plate, flexible display panels and corresponding manufacture method, flexible display apparatus
KR101971202B1 (en) Organic light emitting display apparatus and the manufacturing method thereof
CN108695446B (en) Stripping method of flexible display panel
US9485857B2 (en) Flat panel display apparatus and method for manufacturing the same
US20200168849A1 (en) Method of peeling mother protective film, method of manufacturing organic light-emitting display apparatus, and organic light emitting display apparatus manufactured using the same
US10081173B2 (en) Film peeling apparatus and a method of peeling film
CN111211251B (en) Method for peeling off mother protective film and method for manufacturing organic light emitting display device using the same
CN109830621B (en) Flexible substrate and manufacturing method thereof, flexible display substrate and manufacturing method thereof
US20210376302A1 (en) Method and apparatus for producing flexible oled device
JP5968150B2 (en) Wafer processing method
US20200058886A1 (en) Method for preparing flexible oled display panel and motherboard structure thereof
US20090189151A1 (en) Method for separating a non-emission region from a light emission region within an organic light emitting diode (oled)
CN112713253A (en) Display panel, preparation method thereof and preparation method of display device
US10978651B2 (en) Method and apparatus for producing flexible OLED device
US20210050559A1 (en) Method for manufacturing display device
KR101894330B1 (en) Method for Manufacturing Flexible Display
US11958206B2 (en) Cutting apparatus and method of manufacturing display device by using same
JP2000124159A (en) Method for manufacturing semiconductor device
JP6290010B2 (en) Wafer dividing method
CN110571355B (en) Method for attaching barrier film on display panel, barrier film and display panel
JP5559623B2 (en) Split method
US20250253182A1 (en) Method for manufacturing semiconductor device
JP2014078606A (en) Semiconductor device manufacturing method
US7442580B2 (en) Manufacturing method of a package structure

Legal Events

Date Code Title Description
AS Assignment

Owner name: BOE TECHNOLOGY GROUP CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, LU;TSAI, PAO MING;CAI, PENG;AND OTHERS;REEL/FRAME:051214/0045

Effective date: 20191129

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4