US1075661A - Lead alloy. - Google Patents

Lead alloy. Download PDF

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Publication number
US1075661A
US1075661A US71727412A US1912717274A US1075661A US 1075661 A US1075661 A US 1075661A US 71727412 A US71727412 A US 71727412A US 1912717274 A US1912717274 A US 1912717274A US 1075661 A US1075661 A US 1075661A
Authority
US
United States
Prior art keywords
alloy
lead
tape
per cent
lead alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US71727412A
Inventor
Charles P Mcconnell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Priority to US71727412A priority Critical patent/US1075661A/en
Application granted granted Critical
Publication of US1075661A publication Critical patent/US1075661A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • C22C11/08—Alloys based on lead with antimony or bismuth as the next major constituent
    • C22C11/10—Alloys based on lead with antimony or bismuth as the next major constituent with tin

Description

I 110' Drawing.
To aZZ whom; it may concern UNITED STAWENT OFFICE.
CHARLES r. McCONNELL, on NEW YORK, N. Y.,.ASSIG1\TOR T0 .wEs'rERN ELECTRIC COMPANY, on NEW YORK, N. Y., A CORPORATION OF ILLINoIs.
LEAD ALLOY.
Specification of Letters Patent.
Be it known that I, CHARLES PcMGOON- NELL, a citizen of the United-States, residing at 314 West Ninety-ninth street, New York city, inthe'county of New York, State of New York, have invented a certain new and useful Lead Alloy, of which the follow-. ing is a full, clear, and exact description.
The subject of my invention is a lead al- J loy particularly suitable as the material for so-called tape used for winding electrical conductors such as telephone swjtchboard cables, although said alloymay be used for other purposes.
Prior to my invention, tape of the kind above mentioned-was usually made entirely of lead rolled to a'th'ickness of substantially '.0O6 of an inch and having a width of substantially .75 of an inch. When made of the alloy hereinafter described, said tape need be only about one-half as thick to obtain the same or greater strength as the tape just mentioned, and its width may be increased by one-thii'd. That is, when my alloy is used, a satisfactory tape need have. a thickness of onl approximately .003 of an inch, and its wi th can be 1 inch. It is evident thereforethat, compared with the old lead tape, a material saving in lead is effe'cted by the use of my alloy; and .it is a fact that this saving is largely in excess of the cost of the metals which are added to form the alloy. g
The alloy which forms the subject of my invention is composed of lead, antimonyand I tin. After careful investigation I have found that when my alloy is used for the manufacture of. tape for winding telephone cables, its preferred composition and the maximum and minimum permissible amounts of the metals forming the alloy are as given in the following table.
Having thus described my invention, what Patented Oct. 14., 1913. Application fil ed August 27, 1912. Serial No. 717,274.
Preferred. Maximum. Minimum.
Lead.....-..... 95.00% 96.75% 92.25% 'Antimony 4. o 6.00% 3. a Tin .50% .75% A .25
I claim and desire to secure by Letters Pat-' ent is:
1. A11 alloy composed of 93.25 to 96.75 I
.per cent. lead, 3 to 6 per cent. antimony, and .25to .75 of one per cent. tin.
2. An alloy composed of, approximately, 95 per cent. lead, 4.5 .5 of one per cent. tin.
3. As an article of manufacture a thin me tallic tape for winding electrical conductors oomposed of an alloy of approximately 95 per cent. lead, 4.5 per cent. antimony and .5 of one er cent. of, tin.
In w1tness.whereof, I hereunto subscr be my name this 26th day of August A. D., 1912. I I
CHARLES P. cooN ELL.
Witnesses: y
ELLA EDLER -WALTER F. HOFFMAN."
per cent. antimony, and
US71727412A 1912-08-27 1912-08-27 Lead alloy. Expired - Lifetime US1075661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US71727412A US1075661A (en) 1912-08-27 1912-08-27 Lead alloy.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71727412A US1075661A (en) 1912-08-27 1912-08-27 Lead alloy.

Publications (1)

Publication Number Publication Date
US1075661A true US1075661A (en) 1913-10-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
US71727412A Expired - Lifetime US1075661A (en) 1912-08-27 1912-08-27 Lead alloy.

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4112141A (en) * 1976-05-06 1978-09-05 Nissan Motor Company, Limited Method of using filling solder for automobile body
US4769514A (en) * 1985-04-11 1988-09-06 The Furukawa Electric Co., Ltd. Lead alloy foil for laminated tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4112141A (en) * 1976-05-06 1978-09-05 Nissan Motor Company, Limited Method of using filling solder for automobile body
US4769514A (en) * 1985-04-11 1988-09-06 The Furukawa Electric Co., Ltd. Lead alloy foil for laminated tape

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