CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a Continuation Application of U.S. application Ser. No. 15/628,214, filed Jun. 20, 2017, which is based on and claims priority to Chinese Patent Application Serial Nos. 201620892146.6 and 201610675796.X, filed on Aug. 16, 2016, the entire contents of which are incorporated herein by reference.
FIELD
The present disclosure relates to a field of terminals, and more particularly to an input assembly and a terminal.
BACKGROUND
In the related art, some mobile phones include a fingerprint chip package structure and a decoration enclosure, and the fingerprint chip package structure is received in the decoration enclosure, so that the mobile phone has a good appearance. However, a position where the fingerprint chip package structure is received in the decoration enclosure is difficult to be determined, thus resulting in a low assembling efficiency when disposing the fingerprint chip package structure in the decoration enclosure.
SUMMARY
According to a first aspect of embodiments of the present disclosure, there is provided an input assembly, including a decoration enclosure and a fingerprint chip package structure. The decoration enclosure includes a decoration ring and a support rim extending inwards from an inner wall of the decoration ring. The fingerprint chip package structure is received in the decoration ring and supported on the support rim. The decoration enclosure includes a flange extending outwards from an outer wall of the decoration ring, the flange and the decoration ring are separately formed, the decoration ring includes a muff-coupling portion connected to the support rim, and the flange is fitted over the muff-coupling portion. The flange includes a first protrusion and a second protrusion coupled to the first protrusion, the first protrusion includes a first portion and a second portion, the second portion is coupled to the first portion and the second protrusion, the second portion protrudes beyond the first portion and the second protrusion, the first portion and the second protrusion extend in a longitudinal direction of a touch panel, and the second portion extends in a traverse direction of the touch panel. A top surface of the first protrusion is flush with a top surface of the second protrusion, and a thickness of the first portion is larger than a thickness of the second protrusion. The fingerprint chip package structure includes a package body and a fingerprint identification chip received in the package body. The package body has a bottom surface and a lateral surface connected to the bottom surface, the package body defines a recessed portion at a junction of the bottom surface and the lateral surface, and the support rim is received in the recessed portion.
According to a second aspect of embodiments of the present disclosure, there is provided a terminal, including an input assembly. The input assembly includes a decoration enclosure and a fingerprint chip package structure. The decoration enclosure includes a decoration ring and a support rim extending inwards from an inner wall of the decoration ring. The fingerprint chip package structure is received in the decoration ring and supported on the support rim. The decoration enclosure includes a flange extending outwards from an outer wall of the decoration ring, the flange and the decoration ring are separately formed, the decoration ring includes a muff-coupling portion connected to the support rim, and the flange is fitted over the muff-coupling portion. The flange includes a first protrusion and a second protrusion coupled to the first protrusion, the first protrusion includes a first portion and a second portion, the second portion is coupled to the first portion and the second protrusion, the second portion protrudes beyond the first portion and the second protrusion, the first portion and the second protrusion extend in a longitudinal direction of a touch panel, and the second portion extends in a traverse direction of the touch panel. A top surface of the first protrusion is flush with a top surface of the second protrusion, and a thickness of the first portion is larger than a thickness of the second protrusion. The fingerprint chip package structure includes a package body and a fingerprint identification chip received in the package body. The package body has a bottom surface and a lateral surface connected to the bottom surface, the package body defines a recessed portion at a junction of the bottom surface and the lateral surface, and the support rim is received in the recessed portion.
Additional aspects and advantages of embodiments of present disclosure will be given in part in the following descriptions, become apparent in part from the following descriptions, or be learned from the practice of the embodiments of the present disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
These and/or other aspects and advantages of embodiments of the present disclosure will become apparent and more readily appreciated from the following descriptions made with reference to the drawings.
FIG. 1 is a plan view of a terminal according to embodiments of the present disclosure.
FIG. 2 is a sectional view of an input assembly according to embodiments of the present disclosure.
FIG. 3 is an isometric view of a decoration enclosure according to embodiments of the present disclosure.
FIG. 4 is a sectional view of a decoration enclosure according to embodiments of the present disclosure.
FIG. 5 is a plan view of a decoration enclosure according to embodiments of the present disclosure.
FIG. 6 is an exploded perspective view of a decoration enclosure according to embodiments of the present disclosure.
FIG. 7 is another exploded perspective view of a decoration enclosure according to embodiments of the present disclosure.
FIG. 8 is a perspective view of a fingerprint chip package structure according to embodiments of the present disclosure.
FIG. 9 is a sectional view of a fingerprint chip package structure according to embodiments of the present disclosure.
FIG. 10 is a plan view of a fingerprint chip package structure according to embodiments of the present disclosure.
DETAILED DESCRIPTION
Reference will be made in detail to embodiments of the present disclosure. The same or similar elements and the elements having same or similar functions are denoted by like reference numerals throughout the descriptions. The embodiments described herein with reference to drawings are explanatory, illustrative, and used to generally understand the present disclosure. The embodiments shall not be construed to limit the present disclosure.
In the specification, it is to be understood that terms such as “central”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “upper”, “lower”, “front”, “rear”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise” and “counterclockwise” should be construed to refer to the orientation as then described or as illustrated in the drawings under discussion. These relative terms are for convenience of description and do not require that the present disclosure be constructed or operated in a particular orientation. In addition, terms such as “first” and “second” are used herein for purposes of description and are not intended to indicate or imply relative importance or significance or to imply the number of indicated technical features. Thus, the feature defined with “first” and “second” may comprise one or more of this feature. In the description of the present disclosure, “a plurality of” means two or more than two, unless specified otherwise.
In the present disclosure, unless specified or limited otherwise, the terms “mounted”, “connected”, “coupled”, “fixed” and the like are used broadly, and may be, for example, fixed connections, detachable connections, or integral connections; may also be mechanical or electrical connections; may also be direct connections or indirect connections via intervening structures; may also be inner communications of two elements, which can be understood by those skilled in the art according to specific situations.
In the present disclosure, unless specified or limited otherwise, a structure in which a first feature is “on” or “below” a second feature may include an embodiment in which the first feature is in direct contact with the second feature, and may also include an embodiment in which the first feature and the second feature are not in direct contact with each other, but are contacted via an additional feature formed therebetween. Furthermore, a first feature “on”, “above” or “on top of” a second feature may include an embodiment in which the first feature is right or obliquely “on”, “above” or “on top of” the second feature, or just means that the first feature is at a height higher than that of the second feature; while a first feature “below”, “under” or “on bottom of” a second feature may include an embodiment in which the first feature is right or obliquely “below”, “under” or “on bottom of” the second feature, or just means that the first feature is at a height lower than that of the second feature.
Various embodiments and examples are provided in the following description to implement different structures of the present disclosure. In order to simplify the present disclosure, certain elements and settings will be described. However, these elements and settings are only by way of example and are not intended to limit the present disclosure. In addition, reference numerals may be repeated in different examples in the present disclosure. This repeating is for the purpose of simplification and clarity and does not refer to relations between different embodiments and/or settings. Furthermore, examples of different processes and materials are provided in the present disclosure. However, it would be appreciated by those skilled in the art that other processes and/or materials may be also applied.
As illustrated in
FIG. 1 and
FIG. 2, an
input assembly 100 according to embodiments of the present disclosure includes a
touch panel 10, a
decoration enclosure 20 and a fingerprint
chip package structure 30.
The
input assembly 100 according to embodiments of the present disclosure can be applied to a
terminal 1000, and the
terminal 1000 can be configured as an electronic device such as a mobile phone or a tablet. It can be understood that, the
terminal 1000 includes but is not limited to examples in the present embodiment. In some embodiments, the
terminal 1000 further includes a
screen 80 configured to display content and a flexible
screen circuit board 50 coupled to the
screen 80.
In some embodiments, the
touch panel 10 is located above the
screen 80, and includes an
upper surface 12 and a
lower surface 14, as illustrated in
FIG. 2. The
upper surface 12 is opposite to the
lower surface 14. It can be understood that, the
upper surface 12 of the
touch panel 10 is a facade of the
input assembly 100, facing to a user. The user can make gesture operations (for example clicking or sliding) on the
upper surface 12, so as to control the terminal
1000 to achieve corresponding functions.
The
touch panel 10 can be made of light-transparent materials, such as glasses, ceramics or sapphires. As the
touch panel 10 is configured as an input part of the terminal
1000, the
touch panel 10 always suffers contacts, such as impacts or scratches. For example, when the user puts the terminal
1000 into his/her pocket, the
touch panel 10 can be scratched and damaged by keys in the pocket of the user.
Therefore, the
touch panel 10 can be made of materials having high hardness, for example the above-mentioned sapphires. Certainly, a protecting cover plate can be attached on the
upper surface 12 of the
touch panel 10, so as to prevent the
touch panel 10 from being scratched.
Furthermore, the
touch panel 10 includes a
display region 15 intended for the user to view the content displayed in the
screen 80 and a
non-display region 16 for receiving the fingerprint
chip package structure 30. In general, a middle region of the
touch panel 10 is configured as the
display region 15, and the
non-display region 16 is arranged at a periphery of the
display region 15. For example, the
non-display region 16 is located at a top side or a bottom side of the
display region 15.
As the
touch panel 10 is made of the light-transparent materials, thus, the user can view content displayed in the
screen 80 of the terminal
1000 through the
display region 15.
For allowing the terminal
1000 to have a better appearance, ink can be sprayed on a
lower surface 14 of the
non-display region 16. The ink can have a color such as white, black or blue, and so on. A specific color can be set according to actual requirements. The ink can not only satisfy requirements of the user for
terminals 1000 having various colors, but also shield structures inside the terminal
1000 so as to reach an effect of beautifying the
terminal 1000.
In some embodiments, a shape of the
touch panel 10 can be designed specifically according to a shape of the terminal
1000, for example being configured as a rounded rectangle.
Furthermore, the
touch panel 10 has a mounting
hole 17 therein. In the present embodiment, the mounting
hole 17 is configured as a through hole running through the
upper surface 12 and the
lower surface 14. In other embodiments, the mounting
hole 17 can be configured a blind hole formed in the
lower surface 14.
In the present embodiment, the mounting
hole 17 is configured to have a long circle shape. Certainly, in other embodiments, the mounting
hole 17 can have various shapes according to specific requirements, for example a round or oval shape. Therefore, examples of the shape of the mounting
hole 17 in the present embodiment cannot be construed to limit the present disclosure.
In some embodiments, the
decoration enclosure 20 is fitted in the mounting
hole 17 and fixedly coupled to the
touch panel 10. The fingerprint
chip package structure 30 is accommodated in the
decoration enclosure 20 and fixedly coupled to the
decoration enclosure 20.
In general, a receiver of the terminal
1000 is disposed in a top region of the
terminal 1000. Therefore, for preventing the mounting
hole 17 from having an interference with the receiver, in some embodiments, the mounting
hole 17 is provided in a bottom region of the
touch panel 10, thereby providing a relatively large design space for the mounting
hole 17. Furthermore, the mounting
hole 17 is provided in the
non-display region 16 of the
touch panel 10.
In some embodiments, the mounting
hole 17 is formed in the middle of the bottom region of the
touch panel 10, so that the
touch panel 10 presents an approximately symmetrical structure. Thus, the terminal
1000 has a better appearance and is easy to be operated by the user.
When the mounting
hole 17 is configured as the through hole, during manufacture of the
input assembly 100, the
decoration enclosure 20 can be mounted into the mounting
hole 17 from underneath of the
touch panel 10 firstly, and then an adhesive is dispensed in a gap between an inner wall of the mounting
hole 17 and the
decoration enclosure 20, so that the
decoration enclosure 20 is fixedly coupled to the
touch panel 10.
Subsequently, the fingerprint
chip package structure 30 is mounted into the
decoration enclosure 20 from above of the
touch panel 10, and the fingerprint
chip package structure 30 is fixedly coupled to the
decoration enclosure 20 through the adhesive.
When the mounting
hole 17 is configured as the blind hole, the fingerprint
chip package structure 30 can be mounted into the
decoration enclosure 20 firstly, then the
decoration enclosure 20 carried with the fingerprint
chip package structure 30 can be mounted into the mounting
hole 17, and the adhesive can be used to adhere and fix the
decoration enclosure 20 to the
touch panel 10.
As illustrated in
FIGS. 3-5, in some embodiments, the
decoration enclosure 20 includes a
decoration ring 21 and a
support rim 22. The support rim
22 extends inwards from an
inner wall 211 of the
decoration ring 21.
The support rim
22 of the
decoration enclosure 20 according to embodiments of the present disclosure can support and position the fingerprint
chip package structure 30, thereby improving an assembling efficiency of the fingerprint
chip package structure 30 and the
decoration enclosure 20.
That is to say, the fingerprint
chip package structure 30 is supported on the
support rim 22. When the fingerprint
chip package structure 30 is mounted into the
decoration ring 21, the fingerprint
chip package structure 30 can be pressed from top to down. If the fingerprint
chip package structure 30 cannot be moved any more, it indicates that the fingerprint
chip package structure 30 abuts against the
support rim 22 and is mounted to a preset location.
In some embodiments, the
decoration ring 21 defines an
accommodating hole 212, and the
support rim 22 is located in the
accommodating hole 212. The
accommodating hole 212 can be configured to have a straight cylinder shape, or that is to say, the
inner wall 211 is configured to be straight, so that the fingerprint
chip package structure 30 is easy to be mounted in the
accommodating hole 212 rapidly.
The
accommodating hole 212 and the
support rim 22 can be formed by removing materials from the parts through cutting process, or can be formed by casting.
For ensuring the strength of the
decoration enclosure 20, in some embodiments, materials of the
decoration enclosure 20 can be metal, for example stainless steel materials, thereby satisfying strength requirements of the
decoration enclosure 20 as well as providing a corrosion resistance and improving a service life of the
decoration enclosure 20. Certainly, the
decoration enclosure 20 can also be made of other materials, such as plastics.
In some embodiments, furthermore, the fingerprint
chip package structure 30 is accommodated in the
decoration ring 21 and supported on the
support rim 22.
In some embodiments, the
support rim 22 is perpendicular to the
inner wall 211 of the
decoration ring 21.
Thus, the
support rim 22 is easy to be formed, thereby reducing a production cost of the
decoration ring 21. In addition, when the
input assembly 100 is manufactured, the
support rim 22 is located in a horizontal position, and the
inner wall 211 of the
decoration ring 21 is located in a vertical position, so that a surface of the fingerprint
chip package structure 30 fitted with the
support rim 22 is a horizontal surface, thereby simplifying a structure of the fingerprint
chip package structure 30 supported on the
support rim 22.
In some embodiments, the
decoration ring 21 includes a first
bottom surface 213 connected to the
inner wall 211, and a
lower surface 221 of the
support rim 22 is flush with the first
bottom surface 213.
Among the decoration rings
21 having a same height, the
decoration ring 21 having an arrangement described above has a relatively large accommodating space, so as to ensure that the fingerprint
chip package structure 30 can be accommodated in the
decoration ring 21.
Or, that is to say, in the case that the fingerprint
chip package structure 30 has a constant thickness, a height of the
decoration ring 21 is relatively small, thus reducing a height of the
input assembly 100, thereby providing a design basis for reducing a thickness of the
terminal 1000.
In some embodiments, the
decoration ring 21 includes a
top wall 214. The
top wall 214 is connected to the
inner wall 211. The
top wall 214 includes a guiding
surface 2142 facing towards an interior of the
decoration enclosure 20.
In this way, the guiding
surface 2142 can guide a finger of the user to enter the
decoration ring 21 smoothly, so as to perform fingerprint identification operations, thereby improving an accuracy of the user performing the fingerprint identification operations. Furthermore, the guiding
surface 2142 can be coated with a shiny metal layer (such as a chromium layer), so that the
decoration ring 21 has a better appearance.
In some embodiments, the guiding
surface 2142 can be configured as an annular surface, thereby facilitating the user to place the finger thereof in the
decoration ring 21 from respective directions, so as to press the fingerprint
chip package structure 30 and perform the fingerprint identification operations.
In some embodiments, the
support rim 22 has a
hole 222 therein.
Thus, the
hole 222 contributes to a routing layout of a flexible
fingerprint circuit board 40 coupled to the fingerprint
chip package structure 30. For example, the flexible
fingerprint circuit board 40 can run through the
hole 222 so as to be coupled to the fingerprint chip package structure
30 (as illustrated in
FIG. 2).
In some embodiments, the
hole 222 is configured to have a rounded rectangle shape. A
side wall 2221 surrounding the
hole 222 has a
groove 2222 along an axial direction (i.e. a left-right direction illustrated in
FIG. 1) of the
hole 222, and the
groove 2222 is communicated with the
hole 222.
For example, as illustrated in
FIG. 2, after being coupled to the fingerprint
chip package structure 30, the flexible
fingerprint circuit board 40 firstly extends in a direction towards the
groove 2222, then is bent and extends in an opposite direction running away from the
groove 2222. Therefore, the
groove 2222 can prevent the flexible
fingerprint circuit board 40 from producing an interference with the
side wall 2221, thereby facilitating wiring of the flexible
fingerprint circuit board 40.
In some embodiments, the
decoration enclosure 20 includes a
flange 23 extending outwards from an
outer wall 215 of the
decoration ring 21.
Thus, the
flange 23 can abut against the
lower surface 14 of the
touch panel 10, thereby increasing a connecting area between the
decoration enclosure 20 and the
touch panel 10, and improving the reliability of fixedly connecting the
decoration enclosure 20 with the
touch panel 10.
In addition, when the
decoration enclosure 20 is mounted into the mounting
hole 17 from bottom to top, if the
flange 23 abuts against the
lower surface 14 of the
touch panel 10, it indicates that the
decoration enclosure 20 is mounted to a preset position. Therefore, the
flange 23 is provided to improve the assembling efficiency of the
input assembly 100 and to reduce the production cost of the
input assembly 100.
In some embodiments, a sealing sheet can be provided between the
flange 23 and the
lower surface 14, so as to prevent water from entering the terminal
1000 through a gap between the
decoration enclosure 20 and the mounting
hole 17, thereby improving a water resistance effect of the
terminal 1000.
In embodiments illustrated in
FIGS. 3-5, the
flange 23 and the
decoration ring 21 are integrally formed. However, in embodiments illustrated in
FIG. 6 and
FIG. 7, the
flange 23 and the
decoration ring 21 are separately formed. In some embodiments, the
decoration ring 21 includes a muff-
coupling portion 24, and the muff-
coupling portion 24 is connected to the
support rim 22. The
flange 23 is fitted over the muff-
coupling portion 24. Since the
flange 23 and the
decoration ring 21 are separately formed, production difficulties of the
decoration enclosure 20 can be reduced, so that uniformity of each
decoration enclosure 20 can be improved when the
decoration enclosure 20 is put into mass production.
In some embodiments, the muff-
coupling portion 24 can have a through
hole 24 a through which the flexible
fingerprint circuit board 40 can run.
In some embodiments, the muff-
coupling portion 24 includes a connecting
rim 241 and a
bearing plate 242. The connecting
rim 241 is connected to the
support rim 22 and the
bearing plate 242. The connecting
rim 241 is substantially perpendicular to the
support rim 22. The bearing
plate 242 is substantially perpendicular to the connecting
rim 241. The connecting
rim 241 has the through
hole 24 a.
The muff-
coupling portion 24 is hollow so as to accommodate a part or a whole of the fingerprint
chip package structure 30. In some embodiments, the fingerprint
chip package structure 30 can be supported on the
bearing plate 242.
As illustrated in
FIGS. 3-5 again, in some embodiments, the
flange 23 is perpendicular to the
outer wall 215 of the
decoration ring 21.
Thus, the manufacturing process of the
decoration enclosure 20 is easy, and a contact area of the
decoration enclosure 20 and the
touch panel 10 can also be improved, in which the contact area is used for connection between the
decoration enclosure 20 and the
touch panel 10.
In some embodiments, the
flange 23 includes a
first protrusion 231 and a
second protrusion 232 coupled to the
first protrusion 231. The
first protrusion 231 includes a
first portion 2311 and a
second portion 2312. The
second portion 2312 is coupled to the
first portion 2311 and the
second protrusion 232. The
second portion 2312 protrudes beyond the
first portion 2311 and the
second protrusion 232, that is, an outer edge of the
second portion 2312 has a larger distance from the
outer wall 215 of the
decoration ring 21 than outer edges of the
first portion 2311 and the
second protrusion 232.
After the
decoration enclosure 20 is mounted in the mounting
hole 17, the
first portion 2311 and the
second protrusion 232 extend along a traverse direction of the
touch panel 10 and the
second portion 2312 extends along a longitudinal direction of the
touch panel 10.
As the
non-display region 16 has a relatively large arrangement space in the traverse direction, the
second portion 2312 can protrude beyond the
first portion 2311 and the
second protrusion 232, so as to increase a connecting area of the
flange 23 and the
touch panel 10.
In addition, widths of the
first portion 2311 and the
second protrusion 232 are relatively small, thereby avoiding a longitudinal size of the
non-display region 16 of the
touch panel 10 from being increased due to the widths of the
first portion 2311 and the
second protrusion 232, such that an area ratio of the
display region 15 to the
touch panel 10 will not be reduced, and thus the appearance of the terminal
1000 will not be affected.
In some embodiments, a
top surface 231 a of the
first protrusion 231 is flush with a
top surface 232 a of the
second protrusion 232, and a thickness of the
first portion 2311 is larger than a thickness of the
second protrusion 232.
In some embodiments, when the
decoration enclosure 20 is mounted in the mounting
hole 17, the
second protrusion 232 is closer to the
display region 15, compared to the
first portion 2311. Or, that is to say, the
first portion 2311 is away from the
display region 15, and the
second protrusion 232 is close to the
display region 15.
As there are more parts in a portion of the
input assembly 100 close to the
display region 15, the
second protrusion 232 will not have an interference with other parts close to the
display region 15 due to the small thickness of the second protrusion
232 (as illustrated in
FIG. 2).
As illustrated in
FIG. 2, an orthographic projection of the
decoration enclosure 20 in the
lower surface 14 of the
touch panel 10 overlaps orthographic projections of the flexible
screen circuit board 50 coupled to the
screen 80 of the terminal
1000 and of other parts in the
lower surface 14 of the
touch panel 10, as indicated by a region limited between two dotted lines in
FIG. 2, while the
second protrusion 232 will not have an interference with the flexible
screen circuit board 50 and the other parts due to the small thickness of the
second protrusion 232, so that the
decoration enclosure 20 can be closer to the
display region 15 and even can be partially or entirely in the
display region 15 of the
touch panel 10, thus reducing an area ratio of the
non-display region 16 to the
touch panel 10 and improving the area ratio of the
display region 15 to the
touch panel 10.
In some embodiments, the orthographic projection of the
decoration enclosure 20 in the
lower surface 14 of the
touch panel 10 may completely overlap the orthographic projection of the flexible
screen circuit board 50 in the
lower surface 14 of the
touch panel 10, but the present disclosure is not limited to this. For example, in other embodiments, the orthographic projection of the
decoration enclosure 20 in the
lower surface 14 of the
touch panel 10 may partially overlap the orthographic projection of the flexible
screen circuit board 50 in the
lower surface 14 of the
touch panel 10.
In some embodiments, the
decoration ring 21 is configured to have a long circle shape. The
outer wall 215 of the
decoration ring 21 includes two
straight segments 2151 in parallel and two
curved segments 2152 each coupled to the two
straight segments 2151. The
first portion 2311 is provided to one of the two
straight segments 2151, and the
second portion 2312 is provided to each
curved segment 2152. As illustrated in
FIG. 5, two
second portions 2312 are provided, and the two
second portions 2312 are provided to the two
curved segments 2152 respectively.
Thus, the
decoration ring 21 has the better appearance. In some embodiments, the two
curved segments 2152 are arrayed in two lines along the traverse direction (for example the left-right direction illustrated in
FIG. 1) of the
touch panel 10, and the two
straight segments 2151 are arrayed in two lines along the longitudinal direction (perpendicular to the traverse direction) of the
touch panel 10.
In some embodiments, a shape of the
second portion 2312 is matched with a shape of the
curved segment 2152.
For example, an outer contour of the
second portion 2312 also has an arc shape, and the
second portion 2312 and the
curved segment 2152 are substantially concentrically arranged, so that the
decoration enclosure 20 has a more compact structure.
As illustrated in
FIG. 8-
FIG. 10, in some embodiments, the fingerprint
chip package structure 30 includes a
package body 31 and a
fingerprint identification chip 32.
The
package body 31 includes a second
bottom surface 311 and a
lateral surface 312 connected to the second
bottom surface 311, and a recessed
portion 33 is formed at a junction of the second
bottom surface 311 and the
lateral surface 312. The
fingerprint identification chip 32 is received in the
package body 31.
In the fingerprint
chip package structure 30 according to embodiments of the present disclosure, the recessed
portion 33 can be fitted with the
support rim 22 of the
decoration enclosure 20, thereby positioning the fingerprint
chip package structure 30, and further improving the assembling efficiency of the fingerprint
chip package structure 30.
In addition, since the recessed
portion 33 is fitted with the
support rim 22, a thickness of the fingerprint
chip package structure 30 can be reduced, thus facilitating miniaturization of the terminal
1000 to which the fingerprint
chip package structure 30 is applied.
In some embodiments, when the user performs an operation to unlock the terminal
1000 via a fingerprint, the finger can be put in a position corresponding to the
fingerprint identification chip 32. A signal of the
fingerprint identification chip 32 is transmitted through the
package body 31 so as to collect and identify a fingerprint pattern of the user, and then the fingerprint pattern of the user is matched with a prestored fingerprint pattern. If the matching is successful, the terminal
1000 is unlocked.
In some embodiments, a surface of the
fingerprint identification chip 32 facing towards the finger of the user is provided with a sensing pixel array, so as to collect the fingerprint pattern of the user. The
package body 31 packages the
fingerprint identification chip 32, so as to reduce influences of other interference signals on the sensing pixel array when the sensing pixel array collects the fingerprint pattern, thus improving an accuracy of the identification.
In some embodiments, the recessed
portion 33 is configured to be fitted with the
support rim 22, that is to say, the
support rim 22 is configured to be accommodated in the recessed
portion 33, so that the fingerprint
chip package structure 30 is supported on the
support rim 22 through the recessed
portion 33.
In the present embodiment, the recessed
portion 33 is configured to be annular. Correspondingly, the
support rim 22 also is configured to be annular, so that the recessed
portion 33 can accommodate the
support rim 22.
In other embodiments, a plurality of recessed
portions 33 spaced apart from one another along a circumferential direction of the junction of the second
bottom surface 311 and the
lateral surface 312 can be provided, and correspondingly, a plurality of support rims
22 spaced apart from one another along the circumferential direction can be also provided. The plurality of recessed
portions 33 are fitted with the plurality of support rims
22 correspondingly.
For example, three recessed
portions 33 can be provided, and two adjacent recessed
portions 33 are spaced apart from each other by 120° along the circumferential direction. Three support rims
22 can also be provided, and the three
support rims 22 are corresponding to the three recessed
portions 33 with respect to the structural position.
In some embodiments, the shape and the number of the recessed
portion 33 are not limited to the above-discussed cases, as long as the recessed
portion 33 is fitted with the
support rim 22, so that the
support rim 22 can support the fingerprint
chip package structure 30. Therefore, the above-mentioned examples cannot be construed to limit the present disclosure.
Certainly, in some embodiments, when the thickness of the fingerprint
chip package structure 30 is relatively small, the recessed
portion 33 can be omitted from the fingerprint
chip package structure 30.
Thus, the recessed
portion 33 can be defined by the
first package portion 313 and the
second package portion 314. For example, the
package body 31 can be provided with the recessed
portion 33 by cutting off materials from the
package body 31, i.e. via the cutting process, or the recessed
portion 33 can also be directly formed together with the
package body 31 by casting.
In some embodiments, for forming the recessed
portion 33, a cross-section area of the
first package portion 313 is smaller than a cross-section area of the
second package portion 314.
In some embodiments, the
first package portion 313 is received in the
hole 222, and the
second package portion 314 is supported on the
support rim 22.
In some embodiments, the
fingerprint identification chip 32 is received in the
first package portion 313.
Thus, a circuit junction of the
fingerprint identification chip 32 is easy to be exposed, so as to be coupled to the flexible
fingerprint circuit board 40.
In some embodiments, a shape and a size of the
first package portion 313 are matched with a shape and a size of the
fingerprint identification chip 32.
Or, that is to say, the shape of the
fingerprint identification chip 32 is similar to or same with the shape of the
first package portion 313. For example, the
fingerprint identification chip 32 is configured to have a cuboid shape and the
first package portion 313 is configured to have a cuboid or a rounded cuboid shape.
The size of the
first package portion 313 is slightly larger than the size of the
fingerprint identification chip 32, so as to achieve an effect of packaging the
fingerprint identification chip 32. Thus, the fingerprint
chip package structure 30 has the more compact structure.
In some embodiments, the
first package portion 313 has the rounded cuboid shape.
Thus, the
package body 31 can be better fitted with the
fingerprint identification chip 32. Furthermore, the shape of the
first package portion 313 is matched with a shape of the
hole 222, that is to say, the
hole 222 also has the rounded cuboid shape.
In some embodiments, the
second package portion 314 includes a
top surface 3141 connected to the
lateral surface 312. The fingerprint
chip package structure 30 includes a
cover plate 34 fixed on the
top surface 3141 of the
second package portion 314. For example, the
cover plate 34 can be fixed on the
top surface 3141 of the
second package portion 314 through adhesive.
When the user performs the fingerprint identification operation, the finger can press on the
cover plate 34. The
cover plate 34 can protect the
package body 31 from being damaged, so as to improve the reliability of the fingerprint
chip package structure 30.
As the
cover plate 34 suffers touches frequently, the
cover plate 34 can be made of materials having high hardness, for example the sapphires materials mentioned above.
In some embodiments, a shape and a size of the
cover plate 34 are matched with a shape and a size of the
top surface 3141 of the
second package portion 314.
For example, the
top surface 3141 is configured to have a long circle shape, and the
cover plate 34 is also configured to have a long circle shape. An area of the
cover plate 34 is slightly larger than an area of the
top surface 3141 of the
second package portion 314. Thus, the
cover plate 34 can cover the
second package portion 314 entirely.
In some embodiments, a sealing
member 60 is provided between the
second package portion 314 and the
support rim 22. The sealing
member 60 is configured to seal a gap between the
second package portion 314 and the
support rim 22. For example, the sealing
member 60 is made of silica gel (as illustrated in
FIG. 2).
Thus, the sealing
member 60 can prevent foreign matters (such as water and dust) from entering the terminal
1000 from a gap between the fingerprint
chip package structure 30 and the
decoration enclosure 20, thereby improving the waterproof and dustproof effects of the
terminal 1000.
In some embodiments, the recessed
portion 33 includes a
first surface 331 and a
second surface 332 connected to the
first surface 331, and the
first surface 331 is perpendicular to the
second surface 332.
Thus, the recessed
portion 33 is easy to be formed, and the
first surface 331 is easy to be connected to the
support rim 22. The
first surface 331 is perpendicular to the
second surface 332, so that the
package body 31 is configured to have a stepped shape.
In some embodiments, the sealing
member 60 is between the
first surface 331 and the
support rim 22.
In some embodiments, a junction of the
first surface 331 and the
second surface 332 is configured to be a transition fillet.
Thus, defects (such as cracks) are not easy to occur at the junction of the
first surface 331 and the
second surface 332 and the recessed
portion 33 is easy to be formed.
Reference throughout this specification to “an embodiment”, “some embodiments”, “one embodiment”, “another example”, “an example”, “a specific example” or “some examples” means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. Thus, the appearances of the phrases such as “in some embodiments”, “in one embodiment”, “in an embodiment”, “in another example”, “in an example”, “in a specific example” or “in some examples” in various places throughout this specification are not necessarily as illustrated in the same embodiment or example of the present disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
Although explanatory embodiments have been illustrated and described, it would be appreciated by those skilled in the art that the above embodiments cannot be construed to limit the present disclosure, and changes, alternatives, and modifications can be made in the embodiments without departing from spirit, principles and scope of the present disclosure.