TWM644242U - Test facility for printed circuit board - Google Patents

Abstract

A test facility for printed circuit board includes a probe assembly and a support plate. The probe assembly includes a fixed substrate. The fixed substrate is provided with a plurality of fixed holes, each of which is provided with a test probe, and both ends of the test probe protrude from the fixed substrate. The fixed base is made of elastic material. The support plate is fixedly connected to the fixed base plate. The test facility for printed circuit board can match larger test probes on the premise of ensuring that the fixed substrate does not crack, so as to ensure stable test performance and not easily damage the test probes, so as to increase the service life of the test facility for printed circuit board.

Description

Test facility for printed circuit boards

The present invention relates to the technical field of printed circuit board (Printed Circuit Board, PCB) testing, for example, relates to a testing mechanism for PCB.

With the rapid development of electronic technology, the functions of electronic technology are becoming more and more powerful, which requires electronic technology to have stable performance. PCB is an important electronic component and a support for electronic components. The electrical performance of PCB directly affects the stability of electronic product functions. Therefore, in the production process of the PCB, it is necessary to test the electrical performance of the PCB.

In the related art, probes are arranged on the substrate, and the electrical properties of the electronic components are tested by using the probes to touch the electronic components of the PCB. However, when the electronic components of the PCB are small and dense, the gaps between the probes on the corresponding substrate to be tested will also be small, resulting in insufficient strength of the substrate between the probes and easy cracking. However, if you want to prevent the substrate from cracking, you need to choose a small-sized probe, thereby increasing the gap between the probe and the probe, and the small-sized probe will cause poor contact and poor contact due to the small contact area during testing. Problems such as increased on-resistance affect the accuracy of the test.

The present invention provides a PCB testing mechanism, which can match a larger-sized test probe on the premise of ensuring that the fixed substrate does not crack, so as to ensure stable test performance, and the test probe is not easily damaged and has a long service life.

The present invention provides a PCB testing mechanism, comprising: a probe assembly, the probe assembly includes a fixed substrate, the fixed substrate is provided with a plurality of fixing holes, each of the fixing holes is provided with a test probe, In addition, both ends of the test probe protrude from the fixed base plate, the fixed base plate is made of elastic material; a support plate, the support plate is fixedly connected with the fixed base plate.

In one or more embodiments, the diameter of the fixing hole is smaller than the outer diameter of the test probe.

In one or more embodiments, a plurality of the fixing holes are arranged in an array.

In one or more embodiments, the side of the support plate facing the fixed substrate is provided with metal traces, and the metal traces abut against a plurality of the test probes to supply power to the test probes .

In one or more embodiments, the support plate is provided with a plurality of the metal traces, and each of the metal traces abuts a part of the test probes.

In one or more embodiments, the fixed substrate and the support plate are fixed by glue.

In one or more embodiments, the testing mechanism further includes a base and a positioning assembly, the support plate is slidably arranged on the base in the vertical direction, the positioning assembly is arranged on the base, and the positioning assembly configured to position the PCB.

In one or more embodiments, the positioning assembly includes two positioning pieces slidably disposed on the base, and the two positioning pieces can approach or move away from each other.

In one or more embodiments, the support plate is provided with a guide post, the base is provided with a guide hole, and the guide post is inserted into the guide hole.

In one or more embodiments, the support plate is provided with a limiting column, and the limiting column is configured to abut against the base.

The present invention provides a PCB testing mechanism. In this test mechanism, the test probes penetrate the fixed substrate, so that the test probes can touch the electronic components of the PCB to test the electronic components. Since the fixed substrate is made of elastic material, holes with small intervals can be opened to The fixed test probe can not only keep the fixed substrate from cracking, but also match the larger test probe to ensure the stable contact between the test probe and the electronic component and the contact area is sufficient.

The test mechanism can match the test probe with a larger size under the premise of ensuring that the fixed substrate does not crack, so as to ensure stable test performance, and the test probe is not easily damaged and has a long service life.

100: PCB, printed circuit board

101: Electronic components

1:Probe assembly

2: support plate

3: Metal wiring

4: base

5: Positioning components

11: Fixed substrate

12: Test probe

13: Fixing hole

21: guide column

22: limit column

41: Pilot hole

51: Positioning piece

52: Locking screw

Fig. 1 is a schematic structural view of the testing mechanism of the PCB provided by the present invention; Fig. 2 is a schematic structural view of the probe assembly provided by the present invention; Fig. 3 is a schematic structural view of the support plate and metal wiring provided by the present invention.

This model is submitted to China Patent Office on December 28, 2022, and the application number is the priority of the Chinese patent application of 202223549479.3, and the entire content of this model is incorporated in this model by reference.

Embodiments of the present invention are described below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions pieces. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, the terms "centre", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientation or position The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be understood as a limitation of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance. Wherein, the terms "first position" and "second position" are two different positions.

Unless otherwise specified and limited, the terms "mounted", "connected", "connected" and "fixed" should be interpreted in a broad sense, for example, it may be a fixed connection or a detachable connection; it may be a mechanical connection or a Electrical connection; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. The meanings of the above terms in the present model can be understood according to the actual situation.

Unless otherwise specified and limited, a first feature being "on" or "under" a second feature may include that the first feature is in direct contact with the second feature, and may also include that the first feature and the second feature are not in direct contact but through additional feature contacts between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the level of the first feature is higher than that of the second feature. "Below", "below" and "under" the first feature on the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the level height of the first feature is smaller than that of the second feature.

The technical solutions of the present invention will be described below in conjunction with the accompanying drawings and through implementation.

Probes are arranged on the substrate, and the electronic components of the PCB are contacted by the probes to test the electrical performance of the electronic components. However, when the electronic components of the PCB are small and dense, the corresponding The gap between the probes will also be small, resulting in insufficient strength of the substrate between the probes and easy cracking. To prevent cracking of the substrate, it is necessary to select small-sized probes to increase the gap between the probes, and small-sized probes will cause poor contact and conduction due to the small contact area during testing. Problems such as increased resistance will affect the accuracy of the test. Moreover, small-sized probes are also more likely to break during use, which affects the service life.

This embodiment provides a test mechanism for PCB, as shown in Figure 1 and Figure 2, the test mechanism includes a probe assembly 1 and a support plate 2, the probe assembly 1 includes a fixed substrate 11, the fixed substrate 11 is provided with a plurality of fixed Holes 13, each fixing hole 13 is provided with a test probe 12, and both ends of the test probe 12 protrude from the fixed substrate 11, the fixed substrate 11 is made of elastic material, and the support plate 2 is fixedly connected to the fixed substrate 11 .

In this test mechanism, the test probe 12 penetrates the fixed substrate 11, so that the test probe 12 can contact the electronic component 101 of the PCB 100 to test the electronic component 101. Since the fixed substrate 11 is made of elastic material, it can be opened. Fixing the test probes 12 with holes at small intervals can not only keep the fixed substrate 11 from cracking, but also match the larger test probes 12 to ensure stable contact between the test probes 12 and the electronic component 101 and a sufficient contact area. The support plate 2 can support the fixed substrate 11 to prevent the fixed substrate 11 from being deformed due to its own elasticity, thereby ensuring that the test probe 12 can abut against the electronic component 101 .

The test mechanism can match the test probe 12 with a larger size under the premise of ensuring that the fixed substrate 11 does not crack, so as to ensure stable test performance, and the test probe 12 is not easily damaged and has a long service life. Exemplarily, the fixed substrate 11 is made of silicone.

Exemplarily, the diameter of the fixing hole 13 is smaller than the outer diameter of the test probe 12 . After the test probe 12 is inserted into the fixing hole 13, it can be fixed by the fixed substrate 11 to ensure the stability of the test probe 12, and prevent the test probe 12 from retracting the fixed substrate 11 after contacting the electronic component 101. The accuracy and stability are guaranteed.

Exemplarily, a plurality of fixing holes 13 are arranged in an array. When the test probes 12 pass through the corresponding fixing holes 13 and are fixed on the fixed substrate 11, a plurality of test probes 12 are also arranged in an array. Since the deformation of the fixed substrate 11 at each test probe 12 is the same, then The test probes 12 arranged in an array make the overall deformation of the fixed substrate 11 more uniform, and there will be no phenomenon of excessive local deformation, so that the fixed substrate 11 is in a stable state as a whole, and the mutual position of the test probes 12 can also be guaranteed. relatively stable. Exemplarily, a plurality of fixing holes 13 are arranged in rows and columns.

As shown in FIG. 3 , metal wires 3 are provided on the side of the support plate 2 facing the fixed substrate 11 , and the metal wires 3 abut against a plurality of test probes 12 to supply power to the test probes 12 . The test probes 12 can directly contact the metal wires 3 and be connected to an external circuit through the metal wires 3 , so that the electronic component 101 can be tested. The metal wiring 3 has a simple structure and is flat, saving space. Since both ends of the test probe 12 protrude from the fixed substrate 11 , the reliability of the connection between the test probe 12 and the metal wiring 3 can be ensured.

Exemplarily, the supporting board 2 is provided with a plurality of metal wires 3 , and each metal wire 3 abuts part of the test probes 12 . A plurality of electronic components 101 are generally arranged on the PCB 100, and part of the test probes 12 corresponding to each metal trace 3 is configured to test one of the electronic components 101, so multiple metal traces 3 pass through the test probes 12 connected to each other at the same time. Testing multiple electronic components 101 greatly improves testing efficiency.

Exemplarily, the fixed substrate 11 and the support plate 2 are fixed by glue. Since the fixed base plate 11 is made of elastic material, it is not suitable to fix the fixed base plate 11 with the support plate 2 by means of screws or the like, otherwise the fixed base plate 11 may be easily deformed and affect the accuracy of the test. However, using glue for fixing does not have this problem, and can improve the efficiency of fixing the fixing substrate 11 to the support plate 2 and reduce the cost.

Since the size of the test probe 12 and the electronic component 101 are small, the relative position between the probe assembly 1 and the PCB 100 needs to be relatively accurate when the probe assembly 1 approaches the PCB 100 to prevent the test probe 12 from being unable to contact The corresponding electronic component 101 occurs. As shown in Figure 1, to achieve this Purpose, the test mechanism also includes a base 4 and a positioning assembly 5 , the support plate 2 is slidably disposed on the base 4 along the vertical direction, the positioning assembly 5 is disposed on the base 4 , and the positioning assembly 5 is configured to position the PCB 100 .

The positioning assembly 5 of the base 4 can position the PCB 100 to fix the PCB 100 on the base 4, so when the probe assembly 1 moves downward with the support plate 2, the relative position between the probe assembly 1 and the PCB 100 can be guaranteed accuracy.

As shown in FIG. 1 , the positioning assembly 5 includes two positioning pieces 51 slidably disposed on the base 4 , and the two positioning pieces 51 can approach or move away from each other. When the PCB 100 needs to be positioned, the two positioning members 51 can approach each other and engage the PCB 100 to complete the positioning. Moreover, after testing a PCB 100 , when replacing a PCB 100 of the same type, no re-positioning is required, and only a new PCB 100 needs to be placed between two positioning parts 51 , which greatly improves the testing efficiency.

Exemplarily, the positioning assembly 5 further includes locking screws 52 that correspond one-to-one to the positioning pieces 51 , and the locking screws 52 pass through the corresponding positioning pieces 51 and are screwed to the base 4 . The locking screw 52 can fix the positioning part 51 on the base 4, so that the position of the positioning part 51 will not change, thereby ensuring that the position of the PCB100 will not change when the PCB100 of the same type is replaced, ensuring that the PCB100 and the probe assembly 1 The accuracy of the relative position between.

As shown in Figure 1, the test mechanism includes two sets of positioning assemblies 5, and wherein the positioning elements 51 of one set of positioning assemblies 5 slide along the first direction, the positioning elements 51 of the other set of positioning assemblies 5 slide along the second direction, and the positioning elements 51 of the other set of positioning assemblies 5 slide along the second direction. One direction is perpendicular to the second direction. The positioning pieces 51 of the two sets of positioning components 5 can engage with the PCB 100 from two different directions, which improves the accuracy of the position of the PCB 100 .

However, although the position of the PCB 100 is fixed by the positioning component 5 , the position accuracy between the support plate 2 and the base 4 is not high, which may easily cause a certain deviation between the probe component 1 and the PCB 100 . As shown in FIG. 1 and FIG. 3 , in order to solve this problem, the support plate 2 is provided with a guide post 21 , the base 4 is provided with a guide hole 41 , and the guide post 21 is inserted into the guide hole 41 . When the support plate 2 moves downward, before the probe assembly 1 abuts against the electronic component 101 of the PCB 100, the guide post 21 is inserted into the guide hole 41 preferentially, so that the support plate 2 With fine positioning, the relative positions of the support plate 2 , the base 4 and the PCB 100 are all fixed at this time, thereby improving the accuracy of the relative positions between the probe assembly 1 and the PCB 100 .

As shown in FIG. 3 , the support plate 2 is provided with a limiting column 22 , and the limiting column 22 is configured to abut against the base 4 . When the test probe 12 of the probe assembly 1 abuts against the corresponding electronic component 101, the limit post 22 abuts against the base 4 to limit the stroke of the support plate 2, preventing the support plate 2 from continuing to press down and causing Test probe 12 or PCB 100 is damaged.

According to the idea of the present invention, there will be changes in the implementation mode and application scope, and the contents of this specification should not be understood as limiting the present invention.

100: PCB, printed circuit board

101: Electronic components

1:Probe assembly

2: support plate

4: base

5: Positioning components

21: guide column

22: limit column

41: Pilot hole

51: Positioning piece

52: Locking screw

Claims (10)

A test mechanism for a printed circuit board, comprising: a probe assembly, the probe assembly includes: a fixed substrate, the fixed substrate is provided with a plurality of fixed holes, each of which is provided with a test probe , and both ends of the test probe protrude from the fixed substrate, the fixed substrate is made of an elastic material; a support plate, the support plate is fixedly connected to the fixed substrate. The testing mechanism for a printed circuit board according to claim 1, wherein the diameter of the fixing hole is smaller than the outer diameter of the test probe. The testing mechanism for printed circuit boards according to claim 1, wherein a plurality of the fixing holes are arranged in an array. The test mechanism for printed circuit boards according to claim 1, wherein a metal trace is provided on the side of the support plate facing the fixed substrate, and the metal trace abuts against a plurality of the test probes to Power is supplied to the test probes. The testing mechanism for printed circuit boards according to claim 4, wherein the supporting board is provided with a plurality of the metal traces, and each of the metal traces abuts part of the test probes. The testing mechanism for printed circuit boards according to claim 4, wherein the fixed substrate and the support plate are fixed by glue. The testing mechanism for printed circuit boards according to any one of claims 1 to 6, wherein the testing mechanism further includes a base and a positioning component, and the support plate is slidably arranged on the base along the vertical direction, The positioning component is arranged on the base, and the positioning component is configured to position the printed circuit board. The testing mechanism for printed circuit boards as claimed in claim 7, wherein the positioning assembly includes two positioning pieces slidably disposed on the base, and the two positioning pieces can approach or move away from each other. The testing mechanism for printed circuit boards as claimed in claim 7, wherein the support plate is provided with a guide post, the base is provided with a guide hole, and the guide post is inserted into the guide hole. The testing mechanism for printed circuit boards according to claim 7, wherein the support plate is provided with a limiting column, and the limiting column is configured to abut against the base.