TWM594151U - Three dimensional projecting device with dual light sources - Google Patents
Three dimensional projecting device with dual light sources Download PDFInfo
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本揭露是有關於一種二光源合一的三維成像投射裝置。 The present disclosure relates to a three-dimensional imaging projection device with two light sources in one.
隨著光學技術的蓬勃發展,結構光(structured light)進而被應用於許多領域,例如:3D輪廓重現、距離量測、防偽辨識等領域。然而,現有的技術中,結構光之產生方式可由雷射通過繞射光學元件(Diffractive optical element;DOE)產生。 With the vigorous development of optical technology, structured light has been used in many fields, such as: 3D contour reproduction, distance measurement, anti-counterfeiting identification and other fields. However, in the prior art, the structure light can be generated by laser through a diffractive optical element (DOE).
然而,若三維成像投射裝置只有單一光源,由於光源與繞射光學元件之間的距離與焦距有關,且此距離會受限於光學透鏡其下方的支撐件高度,因此容易產生光不足的問題,且不利3D輔助功能。 However, if the three-dimensional imaging projection device has only a single light source, since the distance between the light source and the diffractive optical element is related to the focal length, and this distance is limited by the height of the support member under the optical lens, it is easy to cause the problem of insufficient light. And disadvantageous 3D auxiliary functions.
本新型之一技術態樣為一種二光源合一的三維成像投射裝置。 One technical aspect of the present invention is a three-dimensional imaging projection device combining two light sources.
根據本新型一實施方式,一種二光源合一的三維 成像投射裝置包含支撐件、第一發光源、承載結構、第二發光源與光學透鏡。支撐件具有底板與在底板上的側壁,側壁圍繞出容置空間。第一發光源設置於支撐件的底板上。承載結構設置於支撐件的底板上。第二發光源設置於承載結構上,使第二發光源的位置高於第一發光源的位置。光學透鏡設置於側壁的頂面上,且覆蓋第一發光源與第二發光源。 According to an embodiment of the present invention, a three-dimensional unity of two light sources The imaging projection device includes a support, a first light source, a bearing structure, a second light source and an optical lens. The supporting member has a bottom plate and a side wall on the bottom plate, and the side wall surrounds the accommodating space. The first light source is arranged on the bottom plate of the support. The bearing structure is arranged on the bottom plate of the support. The second light source is arranged on the supporting structure, so that the position of the second light source is higher than the position of the first light source. The optical lens is disposed on the top surface of the side wall and covers the first light source and the second light source.
在本新型一實施方式中,上述光學透鏡的底面具有第一繞射微結構與第二繞射微結構,第一繞射微結構與第一發光源重疊,第二繞射微結構與第二發光源重疊。 In an embodiment of the present invention, the bottom surface of the optical lens has a first diffractive microstructure and a second diffractive microstructure, the first diffractive microstructure overlaps the first light source, and the second diffractive microstructure and the second The light sources overlap.
在本新型一實施方式中,上述第二發光源與第二繞射微結構之間的距離小於第一發光源與第一繞射微結構之間的距離。 In an embodiment of the present invention, the distance between the second light emitting source and the second diffractive microstructure is smaller than the distance between the first light emitting source and the first diffractive microstructure.
在本新型一實施方式中,上述第二發光源的底面高於第一發光源的頂面。 In an embodiment of the present invention, the bottom surface of the second light-emitting source is higher than the top surface of the first light-emitting source.
在本新型一實施方式中,上述第二發光源較第一發光源接近光學透鏡。 In an embodiment of the present invention, the second light emitting source is closer to the optical lens than the first light emitting source.
在本新型一實施方式中,上述承載結構包含第一導體與第二導體。第一導體位於支撐件的底板上與第二發光源下方,且電性連接第二發光源。第二導體與第一導體分開且電性連接第二發光源。第二導體位於第一導體與第一發光源之間。 In an embodiment of the present invention, the load-bearing structure includes a first conductor and a second conductor. The first conductor is located on the bottom plate of the support and below the second light source, and is electrically connected to the second light source. The second conductor is separated from the first conductor and electrically connected to the second light source. The second conductor is located between the first conductor and the first light source.
在本新型一實施方式中,上述承載結構更包含絕緣體。絕緣體位於第一導體與第二導體之間。 In an embodiment of the present invention, the load-bearing structure further includes an insulator. The insulator is located between the first conductor and the second conductor.
在本新型一實施方式中,上述第一發光源與第二發光源為垂直腔表面發射雷射(VCSEL)。 In an embodiment of the present invention, the first light source and the second light source are vertical cavity surface emitting laser (VCSEL).
在本新型一實施方式中,上述光學透鏡的底面具有透明導電層,二光源合一的三維成像投射裝置更包含複數個導電路徑。導電路徑位於支撐件中,每一導電路徑具有頂端與底端,頂端延伸至側壁的頂面,底端延伸至底板的底面,其中導電路徑的頂端電性連接透明導電層。 In an embodiment of the present invention, the bottom surface of the optical lens has a transparent conductive layer, and the three-dimensional imaging projection device combining two light sources further includes a plurality of conductive paths. The conductive paths are located in the support. Each conductive path has a top end and a bottom end. The top end extends to the top surface of the side wall and the bottom end extends to the bottom surface of the bottom plate. The top end of the conductive path is electrically connected to the transparent conductive layer.
在本新型一實施方式中,上述二光源合一的三維成像投射裝置更包含複數個絕緣層。絕緣層分別圍繞導電路徑的頂端。 In an embodiment of the present invention, the three-dimensional imaging projection device combining two light sources further includes a plurality of insulating layers. The insulating layers respectively surround the top ends of the conductive paths.
在本新型上述實施方式中,由於二光源合一的三維成像投射裝置具有第二發光源及設置於底板上的承載結構,且第二發光源設置於承載結構上,因此第二發光源的位置會高於第一發光源的位置。如此一來,第二發光源較第一發光源接近光學透鏡,且第二發光源的垂直位置只會與承載結構的高度有關,不會受限於光學透鏡其下方的支撐件高度,可作為補光的光源,並用於3D輔助功能。此外,第二發光源與承載結構的配置並不會影響第一發光源與光學透鏡之間的距離,因此不影響二光源合一的三維成像投射裝置之主光源(即第一發光源)的焦距。 In the above embodiment of the present invention, since the three-dimensional imaging projection device with two light sources in one has a second light source and a supporting structure provided on the bottom plate, and the second light source is provided on the supporting structure, the position of the second light source It will be higher than the position of the first light source. In this way, the second light source is closer to the optical lens than the first light source, and the vertical position of the second light source is only related to the height of the supporting structure, and is not limited to the height of the support under the optical lens. Light source for fill light and used for 3D auxiliary functions. In addition, the configuration of the second light source and the bearing structure does not affect the distance between the first light source and the optical lens, so it does not affect the main light source (i.e., the first light source) of the three-dimensional imaging projection device with two light sources in one focal length.
100、100a、100b‧‧‧二光源合一的三維成像投射裝置 100, 100a, 100b ‧‧‧ Three-dimensional imaging projection device combining two light sources
110‧‧‧支撐件 110‧‧‧Support
112‧‧‧底板 112‧‧‧Bottom plate
113‧‧‧底面 113‧‧‧Bottom
114‧‧‧側壁 114‧‧‧Sidewall
115‧‧‧頂面 115‧‧‧Top
120‧‧‧第一發光源 120‧‧‧First light source
121‧‧‧頂面 121‧‧‧Top
123‧‧‧導線 123‧‧‧wire
130‧‧‧第二發光源 130‧‧‧Second light source
132‧‧‧底面 132‧‧‧Bottom
133‧‧‧導線 133‧‧‧wire
140‧‧‧承載結構 140‧‧‧bearing structure
142‧‧‧第一導體 142‧‧‧First conductor
144‧‧‧第二導體 144‧‧‧second conductor
146‧‧‧絕緣體 146‧‧‧Insulator
150‧‧‧光學透鏡 150‧‧‧Optical lens
151‧‧‧底面 151‧‧‧Bottom
152‧‧‧第一繞射微結構 152‧‧‧The first diffraction microstructure
154‧‧‧第二繞射微結構 154‧‧‧Second diffraction microstructure
156‧‧‧透明導電層 156‧‧‧Transparent conductive layer
160‧‧‧導電路徑 160‧‧‧conductive path
162‧‧‧頂端 162‧‧‧Top
164‧‧‧底端 164‧‧‧Bottom
170‧‧‧絕緣層 170‧‧‧Insulation
2-2‧‧‧線段 2-2‧‧‧Line
d‧‧‧間隙 d‧‧‧Gap
H1、H2‧‧‧距離 H1, H2‧‧‧Distance
S‧‧‧容置空間 S‧‧‧accommodation space
第1圖繪示根據本新型一實施方式之二光源合一的三維成像投射裝置的上視圖。 FIG. 1 shows a top view of a three-dimensional imaging projection device with two light sources in one according to an embodiment of the present invention.
第2圖繪示第1圖之二光源合一的三維成像投射裝置沿線段2-2的剖面圖。 FIG. 2 is a cross-sectional view along line 2-2 of the three-dimensional imaging projection device in which the two light sources in FIG. 1 are integrated.
第3圖繪示根據本新型一實施方式之二光源合一的三維成像投射裝置的剖面圖,其剖面位置與第2圖相同。 FIG. 3 is a cross-sectional view of a three-dimensional imaging projection device with two light sources in one according to an embodiment of the present invention, and the cross-sectional position is the same as FIG. 2.
第4圖繪示根據本新型一實施方式之二光源合一的三維成像投射裝置的剖面圖,其剖面位置與第2圖相同。 FIG. 4 is a cross-sectional view of a three-dimensional imaging projection device with two light sources in one according to an embodiment of the present invention, and the cross-sectional position is the same as FIG. 2.
以下將以圖式揭露本新型之複數個實施方式,為明確說明,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本新型。也就是說,在本新型部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 In the following, a plurality of embodiments of the present invention will be disclosed in the form of diagrams. For clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the new model, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and elements will be shown in a simple schematic manner in the drawings.
第1圖繪示根據本新型一實施方式之二光源合一的三維成像投射裝置100的上視圖。第2圖繪示第1圖之二光源合一的三維成像投射裝置100沿線段2-2的剖面圖。同時參閱第1圖與第2圖,二光源合一的三維成像投射裝置100包含支撐件110、第一發光源120、承載結構140、第二發光源130與光學透鏡150。支撐件110具有底板112與在底板112上的側壁114。支撐件110的側壁114圍繞出容置空間S。第一發光源120設置於支撐件110的底板112上。承載結構140設置於支撐件110的底板112上,且第二發光源130設置於承載結構140上。
FIG. 1 illustrates a top view of a three-dimensional
由於承載結構140具有高度,因此第二發光源130的位置會高於第一發光源120的位置。換句話說,第二發光源130較第一發光源120接近光學透鏡150。在本實施方式中,第
二發光源130的底面132高於第一發光源120的頂面121。此外,光學透鏡150設置於支撐件110的側壁114的頂面115上,且光學透鏡150覆蓋第一發光源120與第二發光源130。
Since the supporting
在本實施方式中,支撐件110可以為陶瓷杯體,使得支撐件110具有導熱性佳、絕緣、高硬度、高熔點等優點。第一發光源120與第二發光源130可以為垂直腔表面發射雷射(VCSEL),但並不用以限制本新型。第一發光源120與第二發光源130可分別做為二光源合一的三維成像投射裝置100的主光源與輔助光源。舉例來說,第二發光源130可用於補光與3D輔助等功能。
In this embodiment, the
由於二光源合一的三維成像投射裝置100具有第二發光源130及設置於底板112上的承載結構140,且第二發光源130設置於承載結構140上,因此第二發光源130的位置會高於第一發光源120的位置。如此一來,第二發光源130較第一發光源120接近光學透鏡150,且第二發光源130的垂直位置只會與承載結構140的高度有關,不會受限於光學透鏡150其下方支撐件110的高度,可作為補光的光源,並用於3D輔助功能。此外,第二發光源130與承載結構140的配置並不會影響第一發光源120與光學透鏡150之間的距離,因此不影響二光源合一的三維成像投射裝置100之主光源(即第一發光源120)的焦距。
Since the three-dimensional
在本實施方式中,光學透鏡150的底面151具有第一繞射微結構152與第二繞射微結構154。第二發光源130與第二繞射微結構154之間的距離H2小於第一發光源120與第一
繞射微結構152之間的距離H1。第一繞射微結構152與第一發光源120重疊,第二繞射微結構154與第二發光源130重疊。如此一來,第一發光源120的光線可通過第一繞射微結構152,第二繞射微結構154的光線可通過第二繞射微結構154,以形成多個繞射圖案投射於待偵測物體的表面,例如用於人臉辨識。
In this embodiment, the
此外,在本實施方式中,承載結構140包含第一導體142與第二導體144。第一導體142位於支撐件110的底板112上與第二發光源130下方,且電性連接第二發光源130。第二導體144與第一導體142分開一間隙d,且第二導體144電性連接第二發光源130。第二導體144位於第一導體142與第一發光源120之間。第一導體142與第二導體144彼此電性絕緣。第一導體142可電性連接第二發光源130的負極,而第二導體144可利用導線133連接第二發光源130的正極,但並不用以限制本新型。
In addition, in this embodiment, the carrying
在本實施方式中,電源裝置可經由支撐件110之底板112中的導電通道電性連接第一導體142的底部與第二導體144的底部,以對第二發光源130供電。相似地,電源裝置亦可經由支撐件110之底板112中的導電通道電性連接第一發光源120的負極與連接其正極的導線123,以對第一發光源120供電。
In this embodiment, the power supply device can be electrically connected to the bottom of the
應瞭解到,已敘述過的元件連接關係、材料與功效將不再重複贅述,合先敘明。在以下敘述中,將說明其他形式的二光源合一的三維成像投射裝置。 It should be understood that the connection relationship, materials and functions of the components that have been described will not be repeated again, and will be described first. In the following description, other types of three-dimensional imaging projection apparatuses combining two light sources will be described.
第3圖繪示根據本新型一實施方式之二光源合一的三維成像投射裝置100a的剖面圖,其剖面位置與第2圖相同。二光源合一的三維成像投射裝置100a包含支撐件110、第一發光源120、承載結構140、第二發光源130與光學透鏡150。與第2圖實施方式不同的地方在於,二光源合一的三維成像投射裝置100a的承載結構140更包含絕緣體146。絕緣體146位於第一導體142與第二導體144之間,使第一導體142與第二導體144電性絕緣。也就是說,絕緣體146取代了第2圖之第一導體142與第二導體144之間的間隙d。
FIG. 3 is a cross-sectional view of a three-dimensional
第4圖繪示根據本新型一實施方式之二光源合一的三維成像投射裝置100b的剖面圖,其剖面位置與第2圖相同。二光源合一的三維成像投射裝置100b包含支撐件110、第一發光源120、承載結構140、第二發光源130與光學透鏡150。與第3圖實施方式不同的地方在於,二光源合一的三維成像投射裝置100b的光學透鏡150的底面151具有透明導電層156,且二光源合一的三維成像投射裝置100b更包含複數個導電路徑160。導電路徑160位於支撐件110中。
FIG. 4 is a cross-sectional view of a three-dimensional
每一導電路徑160具有頂端162與底端164。導電路徑160的頂端162延伸至支撐件110的側壁114的頂面115,導電路徑160的底端164延伸至底板112的底面113。當光學透鏡150安裝時,導電路徑160的頂端162由光學透鏡150覆蓋而電性連接透明導電層156。當光學透鏡150移除時,導電路徑160的頂端162是裸露的。在本實施方式中,二光源合一的三維成像投射裝置100b更包含複數個絕緣層170。絕緣層170分
別圍繞導電路徑160的頂端162。
Each
當二光源合一的三維成像投射裝置100b應用於電子裝置(例如手機)中,可在電子裝置設置感測單元來電性連接導電路徑160的底端164,以偵測具有透明導電層156之光學透鏡150的電阻。當光學透鏡150受外力撞擊或其他因素破裂時,感測單元便可利用導電路徑160偵測到光學透鏡150的電阻差異,並將此訊號傳送到第一發光源120與第二發光源130的電源裝置,使其對第一發光源120與第二發光源130進行斷電。由於通過破裂之光學透鏡150出光的光線具有過高的能量,會對人眼產生傷害。也就是說,二光源合一的三維成像投射裝置100b可進一步防止第一發光源120與第二發光源130的光線通過破裂的光學透鏡150直接射入人眼,避免對人眼造成傷害。
When the three-dimensional
雖然本新型已以實施方式揭露如上,然其並非用以限定本新型,任何熟習此技藝者,在不脫離本新型之精神和範圍內,當可作各種之更動與潤飾,因此本新型之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed as above by way of implementation, it is not intended to limit the present invention. Anyone who is familiar with this skill can make various modifications and retouching without departing from the spirit and scope of the present invention, so the protection of the present invention The scope shall be as defined in the appended patent application scope.
100‧‧‧二光源合一的三維成像投射裝置 100‧‧‧Three-dimensional imaging projection device with two light sources in one
110‧‧‧支撐件 110‧‧‧Support
112‧‧‧底板 112‧‧‧Bottom plate
113‧‧‧底面 113‧‧‧Bottom
114‧‧‧側壁 114‧‧‧Sidewall
115‧‧‧頂面 115‧‧‧Top
120‧‧‧第一發光源 120‧‧‧First light source
121‧‧‧頂面 121‧‧‧Top
123‧‧‧導線 123‧‧‧wire
130‧‧‧第二發光源 130‧‧‧Second light source
132‧‧‧底面 132‧‧‧Bottom
133‧‧‧導線 133‧‧‧wire
140‧‧‧承載結構 140‧‧‧bearing structure
142‧‧‧第一導體 142‧‧‧First conductor
144‧‧‧第二導體 144‧‧‧second conductor
150‧‧‧光學透鏡 150‧‧‧Optical lens
151‧‧‧底面 151‧‧‧Bottom
152‧‧‧第一繞射微結構 152‧‧‧The first diffraction microstructure
154‧‧‧第二繞射微結構 154‧‧‧Second diffraction microstructure
d‧‧‧間隙 d‧‧‧Gap
H1、H2‧‧‧距離 H1, H2‧‧‧Distance
S‧‧‧容置空間 S‧‧‧accommodation space
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW108216172U TWM594151U (en) | 2019-12-04 | 2019-12-04 | Three dimensional projecting device with dual light sources |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108216172U TWM594151U (en) | 2019-12-04 | 2019-12-04 | Three dimensional projecting device with dual light sources |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM594151U true TWM594151U (en) | 2020-04-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW108216172U TWM594151U (en) | 2019-12-04 | 2019-12-04 | Three dimensional projecting device with dual light sources |
Country Status (1)
Country | Link |
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TW (1) | TWM594151U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI783409B (en) * | 2021-03-16 | 2022-11-11 | 大陸商廣州立景創新科技有限公司 | Complex diffuser, illumination module and three-dimensional scanning device |
-
2019
- 2019-12-04 TW TW108216172U patent/TWM594151U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI783409B (en) * | 2021-03-16 | 2022-11-11 | 大陸商廣州立景創新科技有限公司 | Complex diffuser, illumination module and three-dimensional scanning device |
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