TWM591245U - Solid state disk expansion card - Google Patents

Solid state disk expansion card Download PDF

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Publication number
TWM591245U
TWM591245U TW108211088U TW108211088U TWM591245U TW M591245 U TWM591245 U TW M591245U TW 108211088 U TW108211088 U TW 108211088U TW 108211088 U TW108211088 U TW 108211088U TW M591245 U TWM591245 U TW M591245U
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Taiwan
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heat dissipation
solid
bottom plate
heat
hard disk
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TW108211088U
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Chinese (zh)
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周曜芳
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周曜芳
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Priority to TW108211088U priority Critical patent/TWM591245U/en
Publication of TWM591245U publication Critical patent/TWM591245U/en

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Abstract

一種固態硬碟擴充卡,包括有一卡體,該卡體上設置有至少一低連接座與一高連接座,使該低連接座與高連接座分別插置有第一M.2固態硬碟與第二M.2固態硬碟;該第一、第二M.2固態硬碟之間設置有一散熱底板,該散熱底板超過該第二M.2固態硬碟長度的一端設置有散熱鰭片,該散熱鰭片上設置有風扇,該第二M.2固態硬碟外側並鎖固在該散熱底板上設置有一散熱蓋板,該散熱蓋板上也設置有散熱鰭片;藉由上述結構,可在該卡體上裝置複數個M.2固態硬碟,增加使用容量並維持工作的穩定性。 A solid-state hard disk expansion card includes a card body provided with at least a low connection seat and a high connection seat, so that the low connection seat and the high connection seat are respectively inserted with a first M.2 solid-state hard disk And a second M.2 solid state drive; a heat dissipation bottom plate is disposed between the first and second M.2 solid state drives, and the end of the heat dissipation bottom plate exceeding the length of the second M.2 solid state drive is provided with heat dissipation fins , A fan is provided on the heat dissipation fin, and a heat dissipation cover plate is provided on the outside of the second M.2 solid-state hard disk and locked on the heat dissipation bottom plate, and the heat dissipation cover plate is also provided with heat dissipation fins; A plurality of M.2 solid-state hard drives can be installed on the card body to increase the use capacity and maintain the stability of the work.

Description

固態硬碟擴充卡 Solid State Drive Expansion Card

本創作屬於固態硬碟擴充卡,特別指一種可以安裝多個M.2固態硬碟的擴充卡。 This creation belongs to a solid-state hard drive expansion card, especially refers to an expansion card that can install multiple M.2 solid-state drives.

M.2規格的固態硬碟(SSD)具有速度快、體積小的優點,加上價格逐漸下降,故已成為許多人在購買或升級電腦時優先考慮的一環。 The M.2 specification solid state drive (SSD) has the advantages of fast speed and small size, and the price has gradually dropped, so it has become a priority for many people when buying or upgrading computers.

然而,受限於空間配置,常見的電腦主機板只會提供少量M.2介面的連接座,因此大幅限制安裝M.2固態硬碟的數量,造成電腦的效能無法有效提升。 However, due to space constraints, common computer motherboards will only provide a small number of M.2 interface connectors, which greatly limits the number of M.2 solid-state drives installed, resulting in the inability of the computer to effectively improve the performance.

為此,業界已有提供介面卡形式的固態硬碟擴充卡,可利用介面卡插槽加裝M.2固態硬碟,大幅提高儲存容量,滿足使用者的需求。 To this end, the industry has provided solid-state hard disk expansion cards in the form of interface cards. M.2 solid-state hard drives can be installed in the interface card slots to greatly increase the storage capacity and meet the needs of users.

然而,考慮散熱問題,習知硬碟擴充卡所能安裝的M.2固態硬碟數量有限,半高(Low Profile)的硬碟擴充卡只能安裝兩個M.2固態硬碟,全高(Full Height)也只能安裝四個,否則熱量難以排除,容易干擾M.2固態硬碟的運作其至造成錯誤。 However, considering the heat dissipation problem, the number of M.2 solid-state drives that can be installed in conventional hard drive expansion cards is limited. Low-profile (Low Profile) hard drive expansion cards can only install two M.2 solid-state drives, full-height ( Full Height) can only be installed four, otherwise the heat is difficult to remove, and it is easy to interfere with the operation of the M.2 solid state drive and cause errors.

因此,創作人考慮習知技術缺點,即研究如何在硬碟擴充卡 的有限空間上強化散熱功能,進而獲得本件固態硬碟擴充卡。 Therefore, the creator considers the shortcomings of the conventional technology, that is, how to expand the card in the hard disk The heat dissipation function is strengthened in the limited space, and then this solid-state hard disk expansion card is obtained.

本創作的主要目的在於改善固態硬碟擴充卡上的散熱能力,以增加可以安裝的M.2固態硬碟數量,滿足大量資料的儲存需求。 The main purpose of this creation is to improve the heat dissipation capacity of the solid-state hard drive expansion card to increase the number of M.2 solid-state drives that can be installed to meet the storage needs of large amounts of data.

本創作的另一目的在於提供一種外觀平整、結構穩定的固態硬碟擴充卡,方便於裝置在電腦中並維持長期穩定的工作。 Another purpose of this creation is to provide a solid-state hard disk expansion card with a flat appearance and a stable structure, which is convenient to install in a computer and maintain long-term stable work.

為達到上述目的,本創作提供一種固態硬碟擴充卡,包括有:一卡體、一低連接座、一高連接座、一散熱底板以及一散熱蓋板。 To achieve the above purpose, the present invention provides a solid-state hard disk expansion card, including: a card body, a low connection base, a high connection base, a heat dissipation bottom plate and a heat dissipation cover plate.

該卡體底部具有連接介面卡插槽的端子,該低連接座設置在該卡體上,其具有第一槽口以插置一第一M.2固態硬碟,該高連接座設置在該低連接座的該第一槽口相反方向的該卡體上,且該高連接座具有高於該低連接座的第二槽口,用以插置一第二M.2固態硬碟,該散熱底板設置在該第一、第二M.2固態硬碟之間並鎖固在該卡體上,該散熱底板超過該第二M.2固態硬碟長度的一端設置有散熱鰭片,該散熱鰭片上設置有風扇,該散熱蓋板設置在該第二M.2固態硬碟外側並鎖固在該散熱底板上,該散熱蓋板上設置有散熱鰭片。 The bottom of the card body has a terminal connected to the interface card slot, the low connection seat is provided on the card body, it has a first slot to insert a first M.2 solid state hard disk, the high connection seat is provided on the The first connection slot of the low connection seat is opposite to the card body, and the high connection seat has a second slot higher than the low connection seat for inserting a second M.2 solid-state hard disk, the The heat dissipation bottom plate is disposed between the first and second M.2 solid-state hard disks and is locked on the card body, and the end of the heat dissipation bottom plate exceeding the length of the second M.2 solid-state hard disk is provided with heat dissipation fins. The heat dissipation fin is provided with a fan, the heat dissipation cover is arranged outside the second M.2 solid-state hard disk and is locked on the heat dissipation bottom plate, and the heat dissipation cover is provided with heat dissipation fins.

藉由上述結構,可在該卡體上裝置複數個M.2固態硬碟,增加使用容量並維持工作的穩定性。 With the above structure, a plurality of M.2 solid-state hard disks can be installed on the card body to increase the use capacity and maintain the stability of the work.

更進一步,該散熱蓋板與該散熱底板的該散熱鰭片排列方式一致,使該散熱蓋板鎖固至該散熱底板時,該散熱蓋板與該散熱底板的該 散熱鰭片完全連接以利排除熱量。 Furthermore, the heat dissipation cover plate and the heat dissipation bottom plate are arranged in the same way, so that when the heat dissipation cover plate is locked to the heat dissipation bottom plate, the heat dissipation cover plate and the heat dissipation bottom plate The heat sink fins are fully connected to facilitate heat removal.

更進一步,該散熱蓋板的該散熱鰭片高度低於該散熱底板的該散熱鰭片,使該散熱蓋板鎖固至該散熱底板時,該散熱蓋板與該散熱底板的該散熱鰭片頂部保持齊平。 Furthermore, the height of the heat dissipation fins of the heat dissipation cover plate is lower than that of the heat dissipation bottom plate. When the heat dissipation cover plate is locked to the heat dissipation base plate, the heat dissipation cover plate and the heat dissipation fins of the heat dissipation base plate Keep the top flush.

更進一步,該風扇設置位置對正該卡體上的晶片或電路等發熱元件。 Furthermore, the position of the fan is aligned with the heating element such as the chip or circuit on the card body.

更進一步,該散熱底板的該散熱鰭片設置有凹口,該風扇埋設於該凹口內。 Furthermore, the heat dissipation fin of the heat dissipation bottom plate is provided with a recess, and the fan is buried in the recess.

更進一步,該低連接座、該高連接座、該散熱底板、該散熱蓋板、該第一M.2固態硬碟、該第二M.2固態硬碟同時設置在該卡體的兩側。 Furthermore, the low connection base, the high connection base, the heat dissipation bottom plate, the heat dissipation cover plate, the first M.2 solid state drive, and the second M.2 solid state drive are simultaneously arranged on both sides of the card body .

更進一步,至少以一螺桿穿置該卡體的兩側以固定該散熱底板、該散熱蓋板。 Furthermore, at least one screw penetrates both sides of the card body to fix the heat dissipation bottom plate and the heat dissipation cover plate.

100‧‧‧卡體 100‧‧‧card body

110‧‧‧端子 110‧‧‧terminal

120‧‧‧晶片 120‧‧‧chip

200‧‧‧低連接座 200‧‧‧Low connection seat

210‧‧‧第一槽口 210‧‧‧First notch

300‧‧‧高連接座 300‧‧‧High connection seat

310‧‧‧第二槽口 310‧‧‧Second notch

400‧‧‧散熱底板 400‧‧‧cooling bottom plate

410‧‧‧散熱鰭片 410‧‧‧cooling fins

420‧‧‧風扇 420‧‧‧Fan

430‧‧‧凹口 430‧‧‧Notch

500‧‧‧散熱蓋板 500‧‧‧Cooling cover

510‧‧‧散熱鰭片 510‧‧‧cooling fins

610‧‧‧第一M.2固態硬碟 610‧‧‧ First M.2 solid state drive

620‧‧‧第二M.2固態硬碟 620‧‧‧ Second M.2 SSD

700‧‧‧螺桿 700‧‧‧screw

710‧‧‧螺絲 710‧‧‧screw

720‧‧‧管柱 720‧‧‧Tube

圖1為本創作的立體分解圖;圖2為本創作的低連接座、第一M.2固態硬碟、散熱底板配置示意圖;圖3為本創作的高連接座、第二M.2固態硬碟、散熱蓋板配置示意圖;圖4為本創作的立體組合圖;圖5為本創作應用於全高(Full Height)的規格以安裝多個固態硬碟的示意圖;以及 圖6為本創作同時裝配兩側結構的示意圖。 Figure 1 is a three-dimensional exploded view of the creation; Figure 2 is a configuration diagram of the low connection base, the first M.2 solid state drive, and the heat dissipation bottom plate of the creation; Figure 3 is a high connection base and the second M.2 solid state creation of the creation Schematic diagram of hard disk drive and heat dissipation cover configuration; Figure 4 is a three-dimensional combination drawing of the creation; Figure 5 is a schematic diagram of the creation applied to the Full Height specification to install multiple solid state hard drives; and Figure 6 is a schematic diagram of the two-sided structure of the creative assembly.

以下將結合附圖對本創作的構思、具體結構及產生的技術效果作進一步說明,以充分地瞭解本創作的目的、特徵和效果。 The concept, specific structure and technical effects of this creation will be further described below with reference to the drawings to fully understand the purpose, characteristics and effects of this creation.

參閱圖1至圖4所示,本創作是提供一種固態硬碟擴充卡,包括有:一卡體100、一低連接座200、一高連接座300、一散熱底板400以及一散熱蓋板500。 Referring to FIG. 1 to FIG. 4, this creation provides a solid-state hard disk expansion card, including: a card body 100, a low connection base 200, a high connection base 300, a heat dissipation bottom plate 400 and a heat dissipation cover 500 .

該卡體100提供安裝空間,其底部具有連接介面卡插槽的端子110;該低連接座200設置在該卡體100上,其具有第一槽口210以插置一第一M.2固態硬碟610;該高連接座300設置在該低連接座200的該第一槽口210相反方向的該卡體100上,該高連接座300具有高於該低連接座200的第二槽口310,用以插置一第二M.2固態硬碟620;該散熱底板400設置在該第一、第二M.2固態硬碟620之間並鎖固在該卡體100上,該散熱底板400超過該第二M.2固態硬碟620長度的一端設置有散熱鰭片410,該散熱鰭片410上設置有風扇420;以及該散熱蓋板500,設置在該第二M.2固態硬碟620外側並鎖固在該散熱底板400上,該散熱蓋板500上設置有散熱鰭片510。 The card body 100 provides an installation space, and the bottom of the card body has a terminal 110 connected to an interface card slot; the low connection seat 200 is disposed on the card body 100 and has a first slot 210 to insert a first M.2 solid state Hard disk 610; the high connection seat 300 is disposed on the card body 100 in the opposite direction of the first slot 210 of the low connection seat 200, the high connection seat 300 has a second slot higher than the low connection seat 200 310, for inserting a second M.2 solid state drive 620; the heat dissipation bottom plate 400 is disposed between the first and second M.2 solid state drives 620 and locked on the card body 100, the heat dissipation An end of the bottom plate 400 that exceeds the length of the second M.2 solid-state drive 620 is provided with heat dissipation fins 410, and a fan 420 is provided on the heat dissipation fins 410; and the heat dissipation cover 500 is provided on the second M.2 solid state The outer side of the hard disk 620 is locked on the heat dissipation bottom plate 400, and the heat dissipation cover 500 is provided with heat dissipation fins 510.

經由前述結構完成的本創作,該第一M.2固態硬碟610、第二 M.2固態硬碟620的熱量可以分別由該散熱底板400與該散熱蓋板500上的該散熱鰭片410、510導引發散,維持工作的穩定性;因此,可以安裝更多的M.2固態硬碟,提供更多的硬碟使用容量。 The first M.2 SSD 610 and the second The heat of the M.2 solid state drive 620 can be caused by the heat dissipation fins 410, 510 on the heat dissipation bottom plate 400 and the heat dissipation cover 500, respectively, to maintain the stability of the work; therefore, more M can be installed. 2Solid-state hard drives, providing more hard drive capacity.

如前述實施例的該卡體100為半高(Low Profile)的規格,其至少可安裝四個M.2固態硬碟;或者,如圖5所示,該卡體100若為全高(Full Height)的規格,更可一次安裝八個以上的M.2固態硬碟(圖中示出四個該第二M.2固態硬碟620)。 As shown in the previous embodiment, the card body 100 has a low profile specification, and at least four M.2 solid state drives can be installed; or, as shown in FIG. 5, if the card body 100 is full height (Full Height) ) Specification, more than eight M.2 SSDs (four of the second M.2 SSDs 620 shown in the figure) can be installed at a time.

前述卡體100、散熱底板400與散熱蓋板500的鎖固方式主要為螺絲710,空隙處則加裝管柱720支持,這些是常見的應用,在此不多加贅述。 The locking methods of the card body 100, the heat dissipation bottom plate 400 and the heat dissipation cover plate 500 are mainly screws 710, and a post 720 is added to support the gaps. These are common applications and will not be repeated here.

為維持散熱效果,該散熱蓋板500與該散熱底板400的該散熱鰭片410、510排列方式一致,使該散熱蓋板500鎖固至該散熱底板400時,該散熱蓋板500與該散熱底板400的該散熱鰭片410、510完全連接;或者,該散熱蓋板500的該散熱鰭片510高度低於該散熱底板400的該散熱鰭片410,使該散熱蓋板500鎖固至該散熱底板400時,該散熱蓋板500與該散熱底板400的該散熱鰭片410、510頂部保持齊平;藉由前述設計,該散熱蓋板500與該散熱底板400自外觀看來只有一整塊的散熱鰭片,有利於傳導並排除熱量。 In order to maintain the heat dissipation effect, the heat dissipation cover 500 and the heat dissipation fins 410 and 510 of the heat dissipation bottom plate 400 are arranged in the same manner. When the heat dissipation cover 500 is locked to the heat dissipation bottom plate 400, the heat dissipation cover 500 and the heat dissipation The heat dissipation fins 410, 510 of the bottom plate 400 are completely connected; or, the height of the heat dissipation fins 510 of the heat dissipation cover 500 is lower than the heat dissipation fins 410 of the heat dissipation bottom plate 400, so that the heat dissipation cover 500 is locked to the When the heat dissipation bottom plate 400, the heat dissipation cover plate 500 and the top of the heat dissipation fins 410, 510 of the heat dissipation bottom plate 400 are kept flush; by the foregoing design, the heat dissipation cover plate 500 and the heat dissipation bottom plate 400 only have a complete appearance from the appearance The block's heat dissipation fins help to conduct and remove heat.

同樣為了增加散熱,該風扇420設置位置對正該卡體100上的晶片120或電路等發熱元件;實際上,該散熱底板400的該散熱鰭片410設置有凹口430, 該風扇埋設於該凹口430內,使該散熱鰭片410傳來的熱量直接進入該風扇420的工作區域,提高散熱功能。 In order to increase heat dissipation, the fan 420 is positioned to align with the chip 120 or circuit heating elements on the card body 100; in fact, the heat dissipation fin 410 of the heat dissipation base 400 is provided with a recess 430, The fan is embedded in the recess 430 so that the heat transferred from the heat dissipation fin 410 directly enters the working area of the fan 420 to improve the heat dissipation function.

請參閱圖6所示,本創作可進一步擴充,將該低連接座200、該高連接座300、該散熱底板400、該散熱蓋板500、該第一M.2固態硬碟610、該第二M.2固態硬碟620同時設置在該卡體100的兩側。 Please refer to FIG. 6, the creation can be further expanded, the low connection base 200, the high connection base 300, the heat dissipation bottom plate 400, the heat dissipation cover 500, the first M.2 solid state drive 610, the first Two M.2 solid-state hard disks 620 are disposed on both sides of the card body 100 at the same time.

為維持兩側裝配的方便與穩定性,至少以一螺桿700穿置該卡體100的兩側以固定該散熱底板400、該散熱蓋板500。 In order to maintain the convenience and stability of assembly on both sides, at least one screw 700 is passed through both sides of the card body 100 to fix the heat dissipation bottom plate 400 and the heat dissipation cover 500.

上列詳細說明係針對本創作之一可行實施例之具體說明,惟該實施例並非用以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The above detailed description is a specific description of a feasible embodiment of this creation, but this embodiment is not intended to limit the patent scope of this creation. Any equivalent implementation or change that does not deviate from the spirit of this creative art should be included in The patent scope of this case.

100‧‧‧卡體 100‧‧‧card body

110‧‧‧端子 110‧‧‧terminal

120‧‧‧晶片 120‧‧‧chip

200‧‧‧低連接座 200‧‧‧Low connection seat

210‧‧‧第一槽口 210‧‧‧First notch

300‧‧‧高連接座 300‧‧‧High connection seat

310‧‧‧第二槽口 310‧‧‧Second notch

400‧‧‧散熱底板 400‧‧‧cooling bottom plate

410‧‧‧散熱鰭片 410‧‧‧cooling fins

420‧‧‧風扇 420‧‧‧Fan

430‧‧‧凹口 430‧‧‧Notch

500‧‧‧散熱蓋板 500‧‧‧Cooling cover

510‧‧‧散熱鰭片 510‧‧‧cooling fins

610‧‧‧第一M.2固態硬碟 610‧‧‧ First M.2 solid state drive

620‧‧‧第二M.2固態硬碟 620‧‧‧ Second M.2 SSD

700‧‧‧螺桿 700‧‧‧screw

710‧‧‧螺絲 710‧‧‧screw

Claims (7)

一種固態硬碟擴充卡,包括有:一卡體,其底部具有連接介面卡插槽的端子;至少一低連接座,設置在該卡體上,其具有第一槽口以插置一第一M.2固態硬碟;至少一高連接座,設置在該低連接座的該第一槽口相反方向的該卡體上,該高連接座具有高於該低連接座的第二槽口,用以插置一第二M.2固態硬碟;一散熱底板,設置在該第一、第二M.2固態硬碟之間並鎖固在該卡體上,該散熱底板超過該第二M.2固態硬碟長度的一端設置有散熱鰭片,該散熱鰭片上設置有風扇;以及一散熱蓋板,設置在該第二M.2固態硬碟外側並鎖固在該散熱底板上,該散熱蓋板上設置有散熱鰭片。 A solid-state hard disk expansion card includes: a card body with a terminal connected to an interface card slot at the bottom; at least one low-connecting seat, provided on the card body, having a first slot to insert a first M.2 solid state drive; at least one high connection seat, which is arranged on the card body in the opposite direction of the first slot of the low connection seat, the high connection seat has a second slot higher than the low connection seat, It is used to insert a second M.2 solid-state hard disk; a heat-dissipating bottom plate is arranged between the first and second M.2 solid-state hard disks and is locked on the card body, and the heat-dissipating bottom plate exceeds the second One end of the length of the M.2 solid-state hard disk is provided with a heat-dissipating fin, and a fan is provided on the heat-dissipating fin; and a heat-dissipating cover plate is provided outside the second M.2 solid-state hard disk and is locked on the heat-dissipating bottom plate. The heat dissipation cover plate is provided with heat dissipation fins. 如請求項1所述的一種固態硬碟擴充卡,其中,該散熱蓋板與該散熱底板的該散熱鰭片排列方式一致,使該散熱蓋板鎖固至該散熱底板時,該散熱蓋板與該散熱底板的該散熱鰭片完全連接以利排除熱量。 The solid-state hard disk expansion card according to claim 1, wherein the heat-dissipating cover plate and the heat-dissipating fin of the heat-dissipating bottom plate are arranged in the same manner, so that when the heat-dissipating cover plate is locked to the heat-dissipating bottom plate, the heat-dissipating cover plate The heat dissipation fins of the heat dissipation bottom plate are completely connected to facilitate heat removal. 如請求項1所述的一種固態硬碟擴充卡,其中,該散熱蓋板的該散熱鰭片高度低於該散熱底板的該散熱鰭片,使該散熱蓋板鎖固至該散熱底板時,該散熱蓋板與該散熱底板的該散熱鰭片頂部保持齊平。 The solid-state hard disk expansion card according to claim 1, wherein the height of the heat dissipation fins of the heat dissipation cover is lower than the heat dissipation fins of the heat dissipation bottom plate, so that the heat dissipation cover is locked to the heat dissipation bottom plate, The heat dissipation cover plate is flush with the top of the heat dissipation fins of the heat dissipation bottom plate. 如請求項1所述的一種固態硬碟擴充卡,其中,該風扇設置位置對正該卡體上的晶片或電路等發熱元件。 The solid-state hard disk expansion card according to claim 1, wherein the fan is positioned to align the chip or circuit heating element on the card body. 如請求項1所述的一種固態硬碟擴充卡,其中,該散熱底板的該散熱鰭片設置有凹口,該風扇埋設於該凹口內。 The solid-state hard disk expansion card according to claim 1, wherein the heat dissipation fin of the heat dissipation bottom plate is provided with a recess, and the fan is buried in the recess. 如請求項1所述的一種固態硬碟擴充卡,其中,該低連接座、該高連接 座、該散熱底板、該散熱蓋板、該第一M.2固態硬碟、該第二M.2固態硬碟同時設置在該卡體的兩側。 The solid-state hard disk expansion card according to claim 1, wherein the low connection base and the high connection The base, the heat dissipation bottom plate, the heat dissipation cover plate, the first M.2 solid-state hard disk, and the second M.2 solid-state hard disk are simultaneously disposed on both sides of the card body. 如請求項6所述的一種固態硬碟擴充卡,其中,至少以一螺桿穿置該卡體的兩側以固定該散熱底板、該散熱蓋板。 The solid-state hard disk expansion card according to claim 6, wherein at least one screw is inserted through both sides of the card body to fix the heat dissipation bottom plate and the heat dissipation cover plate.
TW108211088U 2019-08-21 2019-08-21 Solid state disk expansion card TWM591245U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI875465B (en) * 2024-02-05 2025-03-01 富世達股份有限公司 Electronic card retaining device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI875465B (en) * 2024-02-05 2025-03-01 富世達股份有限公司 Electronic card retaining device

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