TWM581040U - Foam molded body - Google Patents

Foam molded body Download PDF

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Publication number
TWM581040U
TWM581040U TW107212000U TW107212000U TWM581040U TW M581040 U TWM581040 U TW M581040U TW 107212000 U TW107212000 U TW 107212000U TW 107212000 U TW107212000 U TW 107212000U TW M581040 U TWM581040 U TW M581040U
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TW
Taiwan
Prior art keywords
foamed
molded body
particles
semi
shoe
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TW107212000U
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Chinese (zh)
Inventor
蕭錦勳
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薩摩亞商盛隆材料科技有限公司
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Priority to TW107212000U priority Critical patent/TWM581040U/en
Publication of TWM581040U publication Critical patent/TWM581040U/en

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Abstract

The present utility model provides a foam molded body, including: a foamed structure foamed from a plurality of half-foamed granules of thermoplastic polyurethanes (TPU), and at least one embedded component of a material or its product that is not affected by microwave. The embedded component is squeezed to be fixed and embedded in the foam structure that is formed from the half-foamed granules squeezed and fused with each other at surface after foaming.

Description

發泡成型體 Foamed molded body

本新型涉及一種發泡成型體。具體而言,本新型涉及一種具鑲嵌元件的發泡成型體。 The present invention relates to a foamed molded body. In particular, the present invention relates to a foamed molded body having an inlaid element.

塑橡膠成型體在現代已廣泛地運用於各種領域中,以製備各種用具或產品。例如,玩具、鞋子、汽車零件、電子零件等。承上,一般常見使用射出成型以高溫加熱熔化塑膠再注入模具中,藉以製成各種塑橡膠成型體。然而,此過程中需要配置射出成型機及相對耐高溫的模具,使得整體程序的設置規格和成本提高。此外,射出成型之高溫亦不利於在製備塑橡膠成型體時加入須另外鑲嵌於塑橡膠成型體中的構件。因此,需要積極開發各種建構之塑橡膠成型體、製備此類塑橡膠成型體的製備方法、以及其相對應適用於各種設計或產品的細部工序。 Plastic rubber molded bodies have been widely used in various fields in the world to prepare various utensils or products. For example, toys, shoes, auto parts, electronic parts, etc. According to the above, it is common to use injection molding to heat and melt the plastic at a high temperature and then inject it into a mold to form various plastic rubber molded bodies. However, in this process, it is necessary to arrange an injection molding machine and a relatively high-temperature resistant mold, so that the setting specifications and costs of the overall program are improved. In addition, the high temperature of the injection molding is also disadvantageous in that a member to be additionally embedded in the plastic rubber molded body is added in the preparation of the plastic rubber molded body. Therefore, it is necessary to actively develop variously constructed plastic rubber molded bodies, a preparation method for preparing such a plastic rubber molded body, and a detailed process corresponding to various designs or products.

承上所述,為提供其他建構之塑橡膠成型體,台灣專利公開案TW 201736423 A提出了一種可用於進行發泡之可發泡組合物、其發泡造粒生成之發泡熱可塑性聚氨酯(TPU)顆粒、以及其製成之微波成型體及對應製造方法;台灣專利公開案TW 201736450 A提出了一種在物體表面部分形 成微波成型體的方法及其製成的微波成型體;且台灣專利公開案TW 201736093 A提出了一種相對應形成微波成型鞋的方法及其製成的微波成型鞋。上述台灣專利公開案中揭示幾種造粒時特別設計調整顆粒顏色或顆粒硬度之發泡顆粒材料,且揭示可藉由黏著層與所述發泡顆粒材料相黏合或可藉由可因微波加熱熔融而與所述發泡顆粒材料相熔接之配件或物體。然而,本新型進一步提出依據微波加熱之性質而可應用的材料及發泡時的多樣配置架構,以求更進一步地提供可製備各種細部結構及配置之微波成型體的方法及其成品。 As described above, in order to provide other structural plastic molded bodies, Taiwan Patent Publication No. TW 201736423 A proposes a foamable composition which can be used for foaming, and foamed thermoplastic polyurethane which is formed by foaming and granulation ( TPU) particles, and the microwave molded body thereof and the corresponding manufacturing method thereof; Taiwan Patent Publication No. TW 201736450 A proposes a partial shape on the surface of the object A method of forming a microwave molded body and a microwave molded body thereof; and a method for forming a microwave molded shoe and a microwave molded shoe thereof are proposed in Taiwan Patent Publication No. TW 201736093 A. The above-mentioned Taiwan Patent Publication discloses several foamed particulate materials specially designed to adjust the particle color or the particle hardness during granulation, and discloses that the adhesive layer can be adhered to the foamed particulate material or can be heated by microwaves. An accessory or object that is melted to fuse with the foamed particulate material. However, the present invention further proposes materials that can be applied depending on the nature of microwave heating and various configurations of foaming, in order to further provide a method and a finished product thereof for preparing various microstructures and configurations of microwave molded bodies.

為解決上述問題,本新型的一實施例提供一種製作發泡成型體的方法。所述方法包含:設置步驟,將發泡基礎材料置入不會受到微波影響的模具中,其中,該發泡基礎材料包含複數個熱可塑性聚氨酯(TPU)的半發泡顆粒及至少一鑲嵌元件,且該鑲嵌元件係為不會受到微波影響之材料或其製成品;以及發泡步驟,對該模具以微波方式進行加熱,使該模具中該些半發泡顆粒受微波作用產生溫度提昇而進行發泡並相互擠壓,令該鑲嵌元件受擠壓而固定,經冷卻脫模後形成鑲嵌有該鑲嵌元件之發泡成型體。 In order to solve the above problems, an embodiment of the present invention provides a method of producing a foamed molded body. The method includes a step of disposing a foamed base material into a mold that is not affected by microwaves, wherein the foamed base material comprises a plurality of semi-foamed particles of thermoplastic polyurethane (TPU) and at least one inlaid component And the inlaid component is a material that is not affected by microwaves or a finished product thereof; and a foaming step, the mold is heated in a microwave manner, so that the semi-foamed particles in the mold are subjected to microwave action to increase the temperature The foaming is carried out and pressed against each other, and the inlaid member is pressed and fixed, and after being released by cooling, a foamed molded body in which the inlaid member is embedded is formed.

根據本新型之另一實施例,提供一種由上述方法所製成之發泡成型體,且其中鑲嵌元件受擠壓而固定鑲嵌於由該些半發泡顆粒經發泡而表面相互擠壓熔接之發泡結構中。 According to another embodiment of the present invention, there is provided a foamed molded body produced by the above method, and wherein the inlaid member is pressed and fixedly embedded in the surface of the semi-expanded particles by being foamed and the surfaces are pressed against each other. In the foamed structure.

根據本新型之再一實施例,提供一種由上述方法所製成之鞋 體部件。該鞋體部件為具有鞋體部件形狀之發泡成型體,且該鑲嵌元件受擠壓而固定鑲嵌於由該些半發泡顆粒經發泡而表面相互擠壓熔接之發泡結構中。 According to still another embodiment of the present invention, a shoe made by the above method is provided Body parts. The shoe body member is a foam molded body having a shape of a shoe body member, and the inlaid member is pressed and fixedly embedded in a foamed structure in which the semi-foamed particles are foamed and the surfaces are pressed and welded to each other.

根據本新型之又一實施例,提供一種發泡成型體,其包含由複數個熱可塑性聚氨酯(TPU)的半發泡顆粒所發泡形成之發泡結構、以及為不會受到微波影響之材料或其製成品之至少一鑲嵌元件。其中,該鑲嵌元件受擠壓而固定鑲嵌於由該些半發泡顆粒經發泡而表面相互擠壓熔接之該發泡結構中。 According to still another embodiment of the present invention, there is provided a foamed molded body comprising a foamed structure formed by foaming of a plurality of semi-foamed particles of thermoplastic polyurethane (TPU), and a material which is not affected by microwaves Or at least one inlaid component of its finished product. Wherein, the inlaid component is pressed and fixedly embedded in the foamed structure in which the semi-expanded particles are foamed and the surfaces are pressed and welded to each other.

依據本新型之實施例所提供之製作發泡成型體的方法、發泡成型體及鞋體部件,有別於一般高溫射出成型可同時於微波發泡時進行與發泡成型體之主體具有相異性質且不會受到微波影響之鑲嵌元件之鑲嵌,且從而可獲得具鑲嵌元件且與整體結構一體成型的發泡成型體。藉此,可以簡化的製程更多樣地設置各種鑲嵌元件,且所製成之成品可具有更完整的整合外型,從而提升了發泡成型體的精緻性及應用性。 The method for producing a foamed molded body, the foamed molded body and the shoe body member provided by the embodiment of the present invention are different from the general high-temperature injection molding and can be simultaneously formed with the main body of the foamed molded body during microwave foaming. The inlay of the inlaid component which is different in nature and which is not affected by the microwave, and thus the foamed molded body having the inlaid component and integrally formed with the integral structure can be obtained. Thereby, the simplified process can set various kinds of inlaid components more, and the finished product can have a more complete integrated appearance, thereby improving the refinement and applicability of the foamed molded body.

10‧‧‧方法 10‧‧‧ method

25、25’、25”‧‧‧發泡結構 25, 25', 25" ‧ ‧ foam structure

S100‧‧‧設置步驟 S100‧‧‧Setting steps

S200‧‧‧發泡步驟 S200‧‧‧Foaming step

r1、r2、r3‧‧‧區塊 R1, r2, r3‧‧‧ blocks

r1’、r2’、r3’‧‧‧部分 R1’, r2’, r3’‧‧‧ part

h1、h2、h3‧‧‧硬度 H1, h2, h3‧‧‧ hardness

A1、A2、A1’、A2’‧‧‧區段 Sections A1, A2, A1’, A2’‧‧‧

100‧‧‧模具 100‧‧‧Mold

110‧‧‧模槽 110‧‧‧Mold groove

120‧‧‧上蓋 120‧‧‧Upper cover

200、200’‧‧‧發泡基礎材料 200,200’‧‧‧Foam base materials

205、205’‧‧‧半發泡顆粒 205, 205'‧‧‧ semi-expanded particles

210‧‧‧第一顆粒 210‧‧‧First granule

220‧‧‧第二顆粒 220‧‧‧Second particles

250、251、252‧‧‧發泡結構 250, 251, 252‧‧‧ foaming structure

300‧‧‧微波 300‧‧‧ microwave

400、400’、400”‧‧‧發泡成型體 400, 400', 400" ‧ ‧ foam molded body

401、402‧‧‧顆粒交界 401, 402‧‧‧ granule junction

450‧‧‧延伸部分 450‧‧‧Extension

500‧‧‧隔板 500‧‧‧ partition

510‧‧‧基座 510‧‧‧Base

600、600’‧‧‧鑲嵌元件 600, 600’‧‧‧Inlay components

700‧‧‧膜狀元件 700‧‧‧membrane components

710‧‧‧圖案 710‧‧‧ pattern

710’‧‧‧標示圖案 710’‧‧‧ mark pattern

720‧‧‧包覆空間 720‧‧‧wrapped space

721‧‧‧主體空間 721‧‧‧ main body space

722‧‧‧延伸區間 722‧‧‧Extension

800‧‧‧鞋楦 800‧‧‧shoes

805‧‧‧鞋楦底部 805‧‧‧ shoe bottom

900‧‧‧鞋面 900‧‧‧ vamp

905、915‧‧‧發泡成型體 905, 915 ‧ ‧ foam molded body

910‧‧‧外層 910‧‧‧ outer layer

920‧‧‧裏層 920‧‧‧ inner layer

1000、2000、3000‧‧‧鞋子 1000, 2000, 3000‧‧‧ shoes

圖1係為根據本新型之一實施例之製作發泡成型體的方法的流程圖。 1 is a flow chart of a method of making a foam molded body according to an embodiment of the present invention.

圖2A至圖2C係為根據本新型之一實施例設置包含有鑲嵌元件之發泡基礎材料之示意圖。 2A-2C are schematic views of a foamed base material comprising inlaid elements in accordance with an embodiment of the present invention.

圖2D係為根據本新型之一實施例以微波方式加熱發泡之示 意圖。 2D is a diagram showing heating by microwave in accordance with an embodiment of the present invention. intention.

圖2E係為由圖2A至圖2D所示之方法所製成之發泡成型體的示意圖。 Fig. 2E is a schematic view of a foam molded body produced by the method shown in Figs. 2A to 2D.

圖2F係為根據本新型之一實施例藉由具有鞋體部件形狀之模具所製成之發泡成型體之示意圖。 2F is a schematic view of a foam molded body produced by a mold having a shape of a shoe body member according to an embodiment of the present invention.

圖3A係為根據本新型之另一實施例設置包含有鑲嵌元件之發泡基礎材料之示意圖。 3A is a schematic illustration of the provision of a foamed base material comprising inlaid elements in accordance with another embodiment of the present invention.

圖3B係為根據本新型之另一實施例以微波方式加熱發泡之示意圖。 Fig. 3B is a schematic view showing the foaming by microwave heating according to another embodiment of the present invention.

圖4A係為根據本新型之另一實施例設置包含有鑲嵌元件之發泡基礎材料之示意圖。 4A is a schematic illustration of the provision of a foamed base material comprising inlaid elements in accordance with another embodiment of the present invention.

圖4B係為根據本新型之另一實施例以微波方式加熱發泡之示意圖。 Fig. 4B is a schematic view showing the foaming by microwave heating according to another embodiment of the present invention.

圖5A至圖5D係為根據本新型之又一實施例設置包含有鑲嵌元件及不同粒徑範圍之半發泡顆粒的發泡基礎材料之示意圖。 5A to 5D are schematic views showing the provision of a foamed base material comprising inlaid elements and semi-expanded particles of different particle size ranges according to still another embodiment of the present invention.

圖5E係為根據本新型之又一實施例以微波方式加熱發泡之示意圖。 Fig. 5E is a schematic view showing the foaming by microwave heating according to still another embodiment of the present invention.

圖6係為由圖5A至圖5E所示之方法所製成之發泡成型體的示意圖。 Fig. 6 is a schematic view showing a foam molded body produced by the method shown in Figs. 5A to 5E.

圖7A及圖7B係為根據本新型之再一實施例設置包含有鑲嵌元件及不同粒徑範圍之半發泡顆粒的發泡基礎材料以及以微波方式加熱發泡之示意圖。 7A and 7B are schematic views showing the provision of a foamed base material comprising inlaid elements and semi-expanded particles of different particle size ranges and foaming by microwave heating according to still another embodiment of the present invention.

圖8係為根據本新型之一實施例設置發泡基礎材料及膜狀元件之示意圖。 Figure 8 is a schematic illustration of the provision of a foamed base material and a film element in accordance with an embodiment of the present invention.

圖9係為圖8之配置藉由以微波方式加熱發泡所生成之發泡成型體的示意圖。 Fig. 9 is a schematic view showing the foam molded body produced by the microwave heating by foaming in the arrangement of Fig. 8.

圖10A至圖10D係為根據本新型之再一實施例設置發泡基礎材料及膜狀元件之示意圖。 10A to 10D are schematic views showing the provision of a foamed base material and a film-like member according to still another embodiment of the present invention.

圖10E係為根據本新型之再一實施例以微波方式加熱發泡之示意圖。 Fig. 10E is a schematic view showing the foaming by microwave heating according to still another embodiment of the present invention.

圖11係為由圖10A至圖10E所示之方法所製成之發泡成型體的示意圖。 Fig. 11 is a schematic view showing a foam molded body produced by the method shown in Figs. 10A to 10E.

圖12A及圖12B係為根據本新型之另一實施例之設置發泡基礎材料及鞋楦與鞋面之示意圖。 12A and 12B are schematic views showing the provision of a foam base material and a shoe last and an upper according to another embodiment of the present invention.

圖13係為圖12A及圖12B之配置藉由以微波方式加熱發泡所生成之鞋體部件以及鞋體部件與鞋面黏合的示意圖。 Fig. 13 is a schematic view showing the arrangement of the shoe body member and the shoe body member which are formed by the microwave heating and foaming in the arrangement of Figs. 12A and 12B.

圖14係為根據本新型之第一變化實施例之設置發泡基礎材料及鞋楦與鞋面之示意圖。 Figure 14 is a schematic view showing the provision of a foamed base material and a shoe last and an upper according to a first variant embodiment of the present invention.

圖15係為圖14之配置藉由以微波方式加熱發泡所生成之鞋體部件與鞋墊以及鞋體部件與鞋面黏合的示意圖。 Fig. 15 is a schematic view showing the arrangement of the shoe body member and the insole and the shoe body member which are formed by the microwave heating and foaming in the arrangement of Fig. 14 and the upper.

圖16係為根據本新型之第二變化實施例之設置發泡基礎材料及鞋楦與鞋面之示意圖。 Figure 16 is a schematic view showing the provision of a foamed base material and a shoe last and an upper according to a second variant embodiment of the present invention.

圖17係為圖16之配置藉由以微波方式加熱發泡所生成之鞋體部件與鞋墊以及鞋體部件與鞋面黏合的示意圖。 Figure 17 is a schematic view showing the arrangement of the shoe body member and the insole and the shoe body member bonded to the upper by the microwave heating and foaming in the configuration of Figure 16;

下文中將描述各種實施例,且所屬技術領域中具有通常知識者在參照說明搭配圖式下,應可輕易理解本新型之精神與原則。然而,雖然在文中會具體說明一些特定實施例,這些實施例僅作為例示性,且於各方面而言皆非視為限制性或窮盡性意義。因此,對於所屬技術領域中具有通常知識者而言,在不脫離本新型之精神與原則下,對於本新型之各種變化及修改應為顯而易見且可輕易達成的。 Various embodiments will be described hereinafter, and the spirit and principles of the present invention should be readily understood by those of ordinary skill in the art. However, the specific embodiments are to be considered as illustrative and not restrictive or limiting. Therefore, various changes and modifications of the present invention are obvious and can be readily achieved without departing from the spirit and scope of the invention.

參照圖1,根據本新型之一實施例,製作發泡成型體的方法10包含設置發泡基礎材料之設置步驟S100、以及使發泡基礎材料發泡的發泡步驟S200。例如,連同圖1參照圖2A至圖2C,根據本實施例之方法10,設置步驟S100中先將發泡基礎材料200置入不會受到微波影響的模具100中(亦即,放入模具100之模槽110中)。具體而言,不會受到微波影響可例如不會被以微波方式加熱且可耐受周遭由於微波加熱所導致之溫度提昇。詳細而言,過於透明之低損失材料使得微波容易逕行穿透而無法被吸收、或完全不透明之材料如金屬導體使得微波全部被反射而無法穿透,此類無法藉由以微波方式加熱之材料若不會由於周邊其他材料溫度提昇而變性或產生變化(例如發泡)下,皆為不受微波影響之材料。相對而言,對微波敏感之高損失材料由於透明度恰好可使微波進入一段距離後才吸收,因此可藉由吸收微波而被加熱,是會被微波影響之材料。另外,即便本身無法直接吸收微波而被加熱,但在周邊其他材料吸收微波而溫度提昇下會受到影響而變性或產生變化(如發泡)下,則為會被微波影響之材料。 Referring to Fig. 1, a method 10 of fabricating a foamed molded article according to an embodiment of the present invention includes a step S100 of providing a foamed base material, and a foaming step S200 of foaming the foamed base material. For example, referring to FIG. 2A to FIG. 2C, in accordance with the method 10 of the present embodiment, the foaming base material 200 is first placed in the mold 100 that is not affected by the microwave in the step S100 (ie, placed in the mold 100). In the cavity 110). In particular, it is not affected by microwaves, for example, it can not be heated by microwaves and can withstand the temperature rise caused by microwave heating. In detail, an ultra-transparent low-loss material makes it easy for a microwave to penetrate but cannot be absorbed, or a completely opaque material such as a metal conductor causes the microwave to be totally reflected and cannot penetrate, such a material that cannot be heated by microwaves If it is not denatured or changes (such as foaming) due to the temperature rise of other materials in the surrounding area, it is a material that is not affected by microwaves. Relatively speaking, the high-loss material sensitive to microwaves can absorb the microwaves just after a certain distance, so it can be heated by absorbing microwaves, which is a material that will be affected by microwaves. In addition, even if it is not capable of directly absorbing microwaves, it is heated. However, when other materials in the periphery absorb microwaves and the temperature is increased, the materials are affected by denaturation or change (such as foaming), which is a material that is affected by microwaves.

承上所述,根據本新型之一實施例,發泡基礎材料200包含可在微波時直接被加熱而發泡或藉由其他相鄰設置之材料被加熱所導致之溫度提昇而發泡之複數個半發泡顆粒205及不受微波影響之至少一鑲嵌元件600。舉例而言,發泡基礎材料200中之半發泡顆粒205可為可以微波方式加熱而發泡之高損失材料。或者是,在半發泡顆粒205為難以以微波方式進行加熱之材料之情況下,發泡基礎材料200中可進一步加入容易吸收微波之添加劑(如Al2O3-SiC等),使得半發泡顆粒205可藉著周遭之添加劑吸收微波而加熱造成之溫度提昇而進行發泡。 As described above, according to an embodiment of the present invention, the foamed base material 200 comprises a plurality of foaming base materials which can be directly heated by microwaves to be foamed or which are heated by other adjacently disposed materials. The semi-expanded particles 205 and at least one inlaid element 600 that are not affected by the microwave. For example, the semi-expanded particles 205 in the foamed base material 200 may be high loss materials that can be heated by microwave heating. Alternatively, in the case where the semi-expanded particles 205 are materials which are difficult to be heated by microwaves, an additive which easily absorbs microwaves (for example, Al 2 O 3 -SiC, etc.) may be further added to the foamed base material 200 to make the semi-finished material The granules 205 can be foamed by the temperature increase caused by the absorption of microwaves by the surrounding additives.

在此,不會受到微波影響的模具100,例如可為受微波作用而不會產生溫度提昇之材質所製成的模具100,以及/或者為可耐受高溫而不變形之材質所製成的模具100。此外,模具100(模具100之模槽110)可具有各種預期形狀,藉以生成具有預期形狀之發泡成型體,且可為一體成型的構件或為多個構件組裝而成。 Here, the mold 100 which is not affected by the microwave may be, for example, a mold 100 made of a material which is subjected to microwave action without causing temperature rise, and/or a material which can withstand high temperature without deformation. Mold 100. Further, the mold 100 (the mold groove 110 of the mold 100) may have various desired shapes to thereby produce a foam molded body having a desired shape, and may be an integrally formed member or assembled for a plurality of members.

根據本新型之一些實施例,半發泡顆粒205可由聚氨酯(PU)、熱可塑性聚氨酯(TPU)或熱可塑性彈性體(TPE)所製成,且可為具有發泡能力且經過一定程度發泡後所形成之一定大小之顆粒。具體而言,此些半發泡顆粒205可由聚氨酯(PU)、熱可塑性聚氨酯(TPU)或熱可塑性彈性體(TPE)材料經塑型後加入發泡劑混合且經過不完全的發泡所製成,且仍保有發泡能力。例如,半發泡顆粒205可為發泡熱塑性聚氨基甲酸酯(亦即,發泡熱可塑性聚氨酯(TPU))經半發泡而形成。然而,本新型不限於此,且半發泡顆粒205可為藉由任何方式製備經一定程度發泡而具有顆粒型態,且仍保有發泡能力的顆粒。 According to some embodiments of the present invention, the semi-expanded particles 205 may be made of polyurethane (PU), thermoplastic polyurethane (TPU) or thermoplastic elastomer (TPE), and may have foaming ability and foam to some extent. A certain size of particles formed afterwards. Specifically, the semi-expanded particles 205 may be molded from a polyurethane (PU), a thermoplastic polyurethane (TPU) or a thermoplastic elastomer (TPE) material, and then added to a foaming agent and mixed by incomplete foaming. And still retain foaming ability. For example, the semi-expanded particles 205 may be formed by foaming a thermoplastic polyurethane (i.e., a foamed thermoplastic polyurethane (TPU)) by semi-foaming. However, the present invention is not limited thereto, and the semi-expanded particles 205 may be particles prepared by any means to have a certain degree of foaming and having a particle form while still retaining the foaming ability.

詳細而言,根據本實施例,配置於模具100中之半發泡顆粒205可包含具有第一粒徑範圍之複數個第一顆粒210。由於根據本新型之各實施例所使用之顆粒之形狀可能非為正球體而是為接近球體,粒徑係定義為顆粒之最大長軸長度。承上,於較佳實施例中,第一粒徑範圍之中間值實質上等於第一顆粒210之平均粒徑。然而,由於製程公差等因素,複數個第一顆粒210之間可能具有粒徑差異,且其平均粒徑不一定等於中間值。此外,上述具有大致均等之粒徑的第一顆粒210僅為示例。亦即,根據本新型之其他實施例,可依據需求及設計配置半發泡顆粒205以包含具有不同粒徑範圍的各種顆粒,且此將於下文中進一步說明。 In detail, according to the present embodiment, the semi-expanded particles 205 disposed in the mold 100 may include a plurality of first particles 210 having a first particle size range. Since the shape of the particles used in accordance with various embodiments of the present invention may not be a true sphere but a near sphere, the particle size is defined as the largest major axis length of the particles. In the preferred embodiment, the intermediate value of the first particle size range is substantially equal to the average particle size of the first particles 210. However, due to factors such as process tolerances, a plurality of first particles 210 may have a difference in particle size, and an average particle diameter thereof is not necessarily equal to an intermediate value. Further, the above first particles 210 having a substantially uniform particle diameter are merely examples. That is, in accordance with other embodiments of the present invention, the semi-expanded particles 205 can be configured to include various particles having different particle size ranges, as desired and designed, and as will be further explained below.

承上,一鑲嵌元件600可與該些半發泡顆粒205共同排列於該模具100中。例如,根據本實施例,在設置步驟S100中如圖2A及圖2B依序所示,可先將半發泡顆粒205置放到一定程度再於預期位置置入至少一鑲嵌元件600,然後再繼續填充半發泡顆粒205,使得鑲嵌元件600受半發泡顆粒205包圍。其中,鑲嵌元件600可由不會受到微波影響之材料所製成。例如,鑲嵌元件600可由無法藉由以微波方式進行加熱之材料所製成,且因此鑲嵌元件600在微波後仍可保留原有之性質及型態。 The inlaid component 600 can be arranged in the mold 100 together with the semi-expanded particles 205. For example, according to the present embodiment, in the setting step S100, as shown in FIG. 2A and FIG. 2B in sequence, the semi-expanded particles 205 may be placed to a certain extent and then at least one inlay element 600 is placed at a desired position, and then The semi-expanded particles 205 are continued to be filled such that the inlaid member 600 is surrounded by the semi-expanded particles 205. Among them, the inlaid component 600 can be made of a material that is not affected by microwaves. For example, the inlaid component 600 can be made of a material that cannot be heated by microwaves, and thus the inlaid component 600 can retain its original properties and profile after microwaves.

根據一較佳實施例,參照圖2C,模具100可進一步包含一上蓋120,且在如圖2A及圖2B所示置入發泡基礎材料200後,可藉由設置上蓋120於模具100上以界定發泡基礎材料200可發泡成型的空間。 According to a preferred embodiment, referring to FIG. 2C, the mold 100 may further include an upper cover 120, and after the foaming base material 200 is placed as shown in FIGS. 2A and 2B, the upper cover 120 may be disposed on the mold 100. A space in which the foamed base material 200 can be foam molded is defined.

接著,連同圖1及圖2A至圖2C參照圖2D,根據本實施例之方法10,發泡步驟S200包含對模具100以微波方式進行加熱,使模具100中該些半發泡顆粒205受微波作用產生溫度提昇而進行發泡並相互擠壓。亦即,可 藉由微波300共同加熱模具100以及其中包含上述之半發泡顆粒205(亦即,第一顆粒210)及鑲嵌元件600之發泡基礎材料200。藉此,該些半發泡顆粒205可進行發泡(例如由於微波所導致之本身溫度提昇或添加劑等周遭材料所導致之溫度提昇而發泡),且該鑲嵌元件600不會被微波所影響,例如不會藉由微波方式加熱而發泡。結果,參照圖2E,經發泡後之半發泡顆粒205可由於發泡而表面相互擠壓來熔接形成為一發泡結構25,令其中的鑲嵌元件600亦受擠壓而固定。因此,經冷卻脫模後即可形成一體成型包含發泡結構25及鑲嵌元件600的發泡成型體400。其中,發泡成型體400並非散落零碎的,且整體觀之為整合的一物件。同時,鑲嵌元件600可在保有原有形狀和功能性質下,作為相異材質鑲嵌於一體成型的發泡成型體400之發泡結構25中。亦即,鑲嵌元件600可受擠壓而固定鑲嵌於由該些半發泡顆粒205經發泡而表面相互擠壓熔接之發泡結構25中。 Next, referring to FIG. 2D together with FIG. 1 and FIG. 2A to FIG. 2C, according to the method 10 of the embodiment, the foaming step S200 includes heating the mold 100 in a microwave manner, so that the semi-foamed particles 205 in the mold 100 are subjected to microwaves. The effect is to increase the temperature and foam and squeeze each other. That is, The mold 100 and the foamed base material 200 including the above-described semi-expanded particles 205 (i.e., the first particles 210) and the inlaid member 600 are collectively heated by the microwaves 300. Thereby, the semi-expanded particles 205 can be foamed (for example, foamed due to temperature rise caused by microwaves or temperature increase caused by surrounding materials such as additives), and the inlaid element 600 is not affected by microwaves. For example, it is not foamed by microwave heating. As a result, referring to Fig. 2E, the foamed semi-expanded particles 205 can be welded to each other by foaming to form a foamed structure 25, so that the inlaid member 600 therein is also pressed and fixed. Therefore, the foamed molded body 400 including the foamed structure 25 and the insert member 600 can be integrally formed by cooling and demolding. Among them, the foamed molded body 400 is not scattered and fragmented, and is viewed as an integrated object as a whole. At the same time, the inlaid component 600 can be embedded as a dissimilar material in the foamed structure 25 of the integrally formed foamed molded body 400 while retaining the original shape and functional properties. That is, the inlaid member 600 may be pressed and fixedly embedded in the foamed structure 25 which is foamed by the semi-expanded particles 205 and which are mutually pressed and welded.

根據本新型之一些實施例,舉例而言,上述之鑲嵌元件600可包含晶片、金屬片,或由不具極性而無法以微波方式進行加熱之材質或其他不會被微波所影響之材質所製成之任何物件等,且可作用為發泡成型體400之成品中之裝飾物或功能構件。例如,根據本新型之一些實施例,鑲嵌元件600可為GPS追蹤晶片。因此,可追蹤具有發泡成型體400所製成之物品的對象的即時行蹤。 According to some embodiments of the present invention, for example, the above-described mosaic component 600 may comprise a wafer, a metal sheet, or a material that is not polarized and cannot be heated by microwaves or other materials that are not affected by microwaves. Any object or the like, and can function as a decorative or functional member in the finished product of the foam molded body 400. For example, in accordance with some embodiments of the present invention, the tessellation element 600 can be a GPS tracking wafer. Therefore, the instantaneous disappearance of the object having the article made of the foamed molded body 400 can be traced.

承上,上述之發泡成型體400依據設置步驟S100中所使用的模具100的形狀不同而可有各種不同的形狀,進而可製成各種產品。舉例而言,發泡成型體可作為鞋體部件。例如,參照圖2F,根據本新型之其他實施例之製作發泡成型體的方法,模具100之模槽110呈一鞋體部件形狀。因此, 當類似於上述進行設置步驟S100及發泡步驟S200後,發泡成型體400’可具有鞋體部件形狀(例如,鞋中底、鞋大底或鞋墊)而為包含鑲嵌元件600及發泡結構25’之一鞋體部件。亦即,鞋體部件為具有鞋體部件形狀之發泡成型體400’,且鑲嵌元件600受擠壓而固定鑲嵌於由該些半發泡顆粒205經發泡而表面相互擠壓熔接之發泡結構25’中。 The above-mentioned foam molded body 400 can have various shapes depending on the shape of the mold 100 used in the installation step S100, and can be made into various products. For example, a foam molded body can be used as a shoe body part. For example, referring to FIG. 2F, in accordance with another embodiment of the present invention, the mold cavity 110 of the mold 100 is in the shape of a shoe body member. therefore, After the setting step S100 and the foaming step S200 are performed similarly to the above, the foamed molded body 400' may have a shoe body member shape (for example, a midsole, a shoe outsole or an insole) to include the inlaid member 600 and the foamed structure. One of the 25' shoe parts. That is, the shoe body member is a foam molded body 400' having the shape of the shoe body member, and the inlaid member 600 is pressed and fixedly fitted to the hair which is foamed by the semi-foamed particles 205 and the surfaces are pressed and welded to each other. In the bubble structure 25'.

如上所述,根據一實施例,鑲嵌元件600可為GPS追蹤晶片。因此,在此情況下,可追蹤穿戴發泡成型體400’所製成之鞋體部件的鞋子的運動賽事參賽選手或有自理能力障礙之對象的即時行蹤。 As noted above, according to an embodiment, the tessellation component 600 can be a GPS tracking wafer. Therefore, in this case, the real-time whereabouts of the sports event entrant or the object having the self-care ability of the shoe wearing the shoe body member made of the foam molded body 400' can be traced.

接著,將參照圖3A及圖3B說明根據本新型設置發泡基礎材料200及以微波方式進行發泡之另一實施例。 Next, another embodiment in which the foamed base material 200 is provided according to the present invention and foamed in a microwave manner will be described with reference to FIGS. 3A and 3B.

具體而言,參照圖3A,為了使鑲嵌元件600確切設置於預期位置,可在設置步驟S100中運用一或多個定位元件例如基座510來置放鑲嵌元件600,並將置放鑲嵌元件600之基座510放置於模具100中以與該些半發泡顆粒205共同排列。藉此,使得該鑲嵌元件600可藉由該定位元件所定位。在此,定位元件例如基座510可由類似於半發泡顆粒205之半發泡材料所製成。因此,定位元件毋須在發泡步驟S200前取出,且可於如圖3B所示之該發泡步驟S200中與該些半發泡顆粒205共同藉由以微波方式加熱以進行發泡。 In particular, referring to FIG. 3A, in order to accurately set the inlay element 600 to the desired position, one or more positioning elements, such as the base 510, may be utilized to position the inlaid element 600 in the setting step S100, and the inlaid element 600 is placed. The pedestal 510 is placed in the mold 100 to be aligned with the semi-expanded particles 205. Thereby, the inlay element 600 can be positioned by the positioning element. Here, the positioning element, such as the base 510, can be made of a semi-foamed material similar to the semi-expanded particles 205. Therefore, the positioning member is not required to be taken out before the foaming step S200, and may be foamed by microwave heating together with the semi-foamed particles 205 in the foaming step S200 as shown in Fig. 3B.

根據上文所述,在設置步驟S100中設置鑲嵌元件600可運用各種方式,例如可使用基座510作為定位元件。除此之外,參照圖4A及圖4B,根據本新型之其他實施例,亦可在設置步驟S100中運用一或多個隔板500作為定位元件來定位鑲嵌元件600,且隔板500亦可由類似於半發泡顆粒205之 半發泡材料所製成。因此,該些隔板500毋須在發泡步驟S200前取出,且可於該發泡步驟S200中與該些半發泡顆粒205共同以微波方式加熱以進行發泡(例如由於微波所導致之本身溫度提昇或添加劑等周遭材料所導致之溫度提昇而發泡)。藉此,隔板500會與該些半發泡顆粒205表面相互熔接,而形成一體成型鑲嵌有鑲嵌元件600的發泡成型體。 According to the above, the setting of the inlay element 600 in the setting step S100 can be performed in various ways, for example, the base 510 can be used as the positioning element. In addition, referring to FIG. 4A and FIG. 4B, in accordance with other embodiments of the present invention, one or more spacers 500 may be used as positioning elements to position the inlaid component 600 in the setting step S100, and the spacer 500 may also be Similar to semi-expanded particles 205 Made of semi-foamed material. Therefore, the separators 500 are not required to be taken out before the foaming step S200, and may be microwave-heated together with the semi-foamed particles 205 in the foaming step S200 for foaming (for example, due to microwaves) The temperature rises or the temperature caused by the surrounding materials such as additives increases and foams). Thereby, the separator 500 is welded to the surfaces of the semi-foamed particles 205 to form a foam molded body in which the inlaid member 600 is integrally formed.

承上所述,於設置步驟S100中,鑲嵌元件600可在不具定位元件或具有各種定位元件之情況下設置。亦即,上文中直接鑲嵌所述鑲嵌元件600或利用基座510或隔板500鑲嵌所述鑲嵌元件600之方法皆僅為舉例,且根據不同實施例,可使用上述以外之方式來鑲嵌所述鑲嵌元件600。 As described above, in the setting step S100, the inlaid component 600 can be disposed without the positioning component or with various positioning components. That is, the method of directly embedding the damascene element 600 or embedding the damascene element 600 by the pedestal 510 or the spacer 500 is merely an example, and according to different embodiments, the method may be embedded in a manner other than the above. Mosaic component 600.

進一步,藉由類似於上述圖4A及圖4B所述之隔板500,亦可另外將模具100分成不同區塊。例如,如圖5A至圖5E所示之一實施例,可利用隔板500將模具100之模槽110分成不同區塊r1、r2及r3。接著,再分別置入具有第一粒徑範圍之複數個第一顆粒210及具有第二粒徑範圍之複數個第二顆粒220於模具100藉由該些隔板500所區隔之不同區塊r1、r2及r3中。亦即,半發泡顆粒205可包含:具有第一粒徑範圍之複數個第一顆粒210、以及具有第二粒徑範圍之複數個第二顆粒220,且第一顆粒210及第二顆粒220可分開設置於不同區塊中。 Further, the mold 100 can be additionally divided into different blocks by a spacer 500 similar to that described above with reference to FIGS. 4A and 4B. For example, as one of the embodiments shown in Figures 5A through 5E, the die plate 110 of the mold 100 can be divided into different blocks r1, r2, and r3 using the spacer 500. Then, a plurality of first particles 210 having a first particle size range and a plurality of second particles 220 having a second particle size range are respectively placed in different blocks of the mold 100 separated by the partitions 500. In r1, r2 and r3. That is, the semi-expanded particles 205 may include: a plurality of first particles 210 having a first particle size range, and a plurality of second particles 220 having a second particle size range, and the first particles 210 and the second particles 220 Can be set separately in different blocks.

承上,根據本實施例,第一粒徑範圍之中間值實質上大於第二粒徑範圍之中間值。亦即,第一顆粒210實質上大於第二顆粒220。於較佳實施例中,第一粒徑範圍之中間值實質上等於第一顆粒210之平均粒徑,且第二粒徑範圍之中間值實質上等於第二顆粒220之平均粒徑。然而,由於製程公差等因素,複數個第一顆粒210之間或複數個第二顆粒220之間可能具 有粒徑差異,且其平均粒徑不一定等於中間值。 According to the present embodiment, the intermediate value of the first particle size range is substantially greater than the intermediate value of the second particle size range. That is, the first particles 210 are substantially larger than the second particles 220. In a preferred embodiment, the intermediate value of the first particle size range is substantially equal to the average particle size of the first particles 210, and the intermediate value of the second particle size range is substantially equal to the average particle size of the second particles 220. However, due to factors such as process tolerances, a plurality of first particles 210 or a plurality of second particles 220 may have There is a difference in particle size, and the average particle diameter is not necessarily equal to the intermediate value.

如上所述,具有不同尺寸之該些第一顆粒210與該些第二顆粒220可分別設置於模具100中之不同區塊。舉例而言,第一顆粒210可被設置於區塊r1及區塊r3,且第二顆粒220可被設置於區塊r2。然而,上述皆僅為示例,且模具100中可分成其他形式之多個不同的區塊,且第一顆粒210及第二顆粒220可分別地配置於不同的區塊中。另外,根據本新型之其他實施例,亦可能依據上述原則進一步包含其他各種不同粒徑範圍之顆粒,且此些顆粒與第一顆粒210及第二顆粒220區分另外配置於各別不同之區塊中,且本新型不限於此。 As described above, the first particles 210 and the second particles 220 having different sizes may be disposed in different blocks in the mold 100, respectively. For example, the first particles 210 may be disposed in the block r1 and the block r3, and the second particles 220 may be disposed in the block r2. However, the above are merely examples, and the mold 100 may be divided into a plurality of different blocks in other forms, and the first particles 210 and the second particles 220 may be respectively disposed in different blocks. In addition, according to other embodiments of the present invention, it is also possible to further include other particles of different particle size ranges according to the above principles, and the particles are different from the first particles 210 and the second particles 220 and are additionally disposed in different blocks. The present invention is not limited thereto.

當如上所述依序如圖5A至圖5B所示設置好發泡基礎材料200後,可進行發泡步驟S200。其中,如圖5C所示,在發泡步驟S200前可先將隔板500取離,接著再如圖5D及圖5E所示,蓋上上蓋120並進行以微波方式加熱以進行發泡(例如由於微波所導致之本身溫度提昇或添加劑等周遭材料所導致之溫度提昇而發泡)之發泡步驟S200。藉此,該些半發泡顆粒205表面相互熔接形成為一發泡結構25”,而形成如圖6所示之一體成型包含鑲嵌元件600及發泡結構25”的發泡成型體400。然而,在此,若隔板500由類似於半發泡顆粒205之半發泡材料所製成時,則該些隔板500可毋須在發泡步驟S200前取出,且可於該發泡步驟S200中與該些半發泡顆粒205共同以微波方式加熱以進行發泡(例如由於微波所導致之本身溫度提昇或添加劑等周遭材料所導致之溫度提昇而發泡)。藉此,隔板500可與該些半發泡顆粒205表面相互熔接,而形成如圖6所示之一體成型鑲嵌有鑲嵌元件600的發泡成型體400。 After the foamed base material 200 is sequentially disposed as shown in FIGS. 5A to 5B as described above, the foaming step S200 may be performed. As shown in FIG. 5C, the separator 500 may be removed before the foaming step S200, and then, as shown in FIG. 5D and FIG. 5E, the upper cover 120 is covered and microwave-heated for foaming (for example, The foaming step S200 of foaming due to the temperature rise caused by the microwave itself or the temperature increase caused by the surrounding material such as the additive. Thereby, the surfaces of the semi-expanded particles 205 are welded to each other to form a foamed structure 25", and the foamed molded body 400 including the inlaid member 600 and the foamed structure 25" is formed as shown in FIG. However, here, if the separator 500 is made of a semi-foamed material similar to the semi-expanded particles 205, the separators 500 may be removed before the foaming step S200, and the foaming step may be performed. In S200, the semi-foamed particles 205 are heated together in a microwave manner to perform foaming (for example, foaming due to temperature rise caused by microwaves or temperature increase caused by surrounding materials such as additives). Thereby, the separator 500 can be welded to the surfaces of the semi-foamed particles 205 to form a foam molded body 400 in which the inlaid member 600 is integrally molded as shown in FIG.

其中,參照圖6,對應於原先設置第一顆粒210之區塊r1之半發泡顆粒205形成為發泡成型體400之第一部分r1’,對應於原先設置第二顆粒220之區塊r2之半發泡顆粒205形成為發泡成型體400之第二部分r2’,且對應於原先設置第一顆粒210之區塊r3之半發泡顆粒205形成為發泡成型體400之第三部分r3’。承上,由較小的第二顆粒220所形成之第二部分r2’相對於由較大的第一顆粒210所形成之第一部分r1’及第三部分r3’具有較高之密度。因此,第二部分r2’相對於第一部分r1’及第三部分r3’可具有較高的硬度。詳言之,第二部分r2’之硬度h2可高於第一部分r1’之硬度h1及第三部分r3’之硬度h3。亦即,由該些第一顆粒210所發泡形成之部分之硬度會小於由該些第二顆粒220所發泡形成之部分之硬度。另外,雖然於本實施例中僅使用了第一顆粒210及第二顆粒220來形成具有兩種不同硬度或柔軟度鑲嵌有鑲嵌元件600的發泡成型體400,根據本新型之其他實施例,在預期發泡成型體400之各部分應具有三種以上之硬度或柔軟度時,亦可相應於上述原則增加具有其他粒徑範圍之其他顆粒,且本新型不限於此。 Referring to FIG. 6, the semi-foamed particles 205 corresponding to the block r1 where the first particles 210 are originally disposed are formed as the first portion r1' of the foamed molded body 400, corresponding to the block r2 where the second particles 220 are originally disposed. The semi-expanded particles 205 are formed as the second portion r2' of the foam molded body 400, and the semi-foamed particles 205 corresponding to the block r3 in which the first particles 210 are originally disposed are formed as the third portion r3 of the foam molded body 400. '. The second portion r2' formed by the smaller second particles 220 has a higher density with respect to the first portion r1' and the third portion r3' formed by the larger first particles 210. Therefore, the second portion r2' can have a higher hardness with respect to the first portion r1' and the third portion r3'. In detail, the hardness h2 of the second portion r2' may be higher than the hardness h1 of the first portion r1' and the hardness h3 of the third portion r3'. That is, the hardness of the portion formed by the first particles 210 may be less than the hardness of the portion formed by the second particles 220. In addition, although only the first particles 210 and the second particles 220 are used in the present embodiment to form the foamed molded body 400 having the two different hardnesses or softness inlaid with the inlaid member 600, according to other embodiments of the present invention, When it is expected that each portion of the foam molded body 400 should have three or more hardnesses or softnesses, other particles having other particle diameter ranges may be added corresponding to the above principle, and the present invention is not limited thereto.

此外,根據本新型之部分實施例,參照圖6,在完成之發泡成型體400中可看到由半發泡顆粒205表面相互熔接所形成之顆粒交界。舉例而言,可觀察到由該些第一顆粒210所發泡形成之第一部分r1’及第三部分r3’中之顆粒交界401,且可觀察到由該些第二顆粒220所發泡形成之第二部分r2’中之顆粒交界402。承上,由該些第一顆粒210所發泡形成之部分之顆粒交界401之密度可低於由該些第二顆粒220所發泡形成之部分之顆粒交界402之密度。另外,根據本新型之一些實施例,發泡成型體400之發泡結構25”之顆粒交界可能以肉眼難以辨別,或甚至發泡後表面相互熔接程度很高而 消弭了顆粒交界。因此,上述對顆粒交界之敘述僅為示例,且本新型不限於此。 Further, according to some embodiments of the present invention, referring to Fig. 6, in the completed foamed molded body 400, the grain boundary formed by the mutual fusion of the surfaces of the semi-expanded particles 205 can be seen. For example, the particle boundary 401 in the first portion r1' and the third portion r3' formed by the foaming of the first particles 210 can be observed, and it can be observed that the second particles 220 are foamed. The particle boundary 402 in the second portion r2'. The density of the particle boundaries 401 formed by the foaming of the first particles 210 may be lower than the density of the particle boundaries 402 of the portions formed by the second particles 220. In addition, according to some embodiments of the present invention, the particle boundary of the foamed structure 25" of the foamed molded body 400 may be difficult to distinguish by the naked eye, or even after the foaming, the surfaces are welded to each other to a high degree. Eliminate the grain boundary. Therefore, the above description of the particle boundary is merely an example, and the present invention is not limited thereto.

承上所述,可基於需求及設計來配置製備鑲嵌有鑲嵌元件600之發泡成型體400之各部分硬度或柔軟度。舉例而言,當依據上述方式形成如圖2F所示之鞋體部件的發泡成型體400’時,可基於預期穿戴者足部之舒適度等因素來控制硬度或柔軟度。例如,可使生成之鞋體部件(例如,鞋中底、鞋大底或鞋墊)之較柔軟的部分可對應於穿戴者之腳掌預期接觸鞋體的部分以增加穿戴舒適度,且使較硬的部分對應於穿戴者之腳掌預期不會接觸鞋體的部分以增加支持性。然而,上述皆僅為示例,且本新型不限於此。 As described above, the hardness or softness of each portion of the foam molded body 400 in which the inlaid component 600 is mounted can be configured based on the demand and design. For example, when the foam molded body 400' of the shoe body member as shown in Fig. 2F is formed in the above manner, the hardness or softness can be controlled based on factors such as the comfort of the wearer's foot. For example, the softer portion of the resulting shoe body component (eg, midsole, outsole, or insole) may correspond to the portion of the wearer's sole that is intended to contact the body of the shoe to increase wear comfort and make it harder The portion corresponds to the portion of the wearer's foot that is not expected to contact the body of the shoe to increase support. However, the above are merely examples, and the present invention is not limited thereto.

此外,上述各實施例中設置發泡基礎材料200之方式在不相互衝突下可進行各種組合及變化。舉例而言,參照圖7A及圖7B,可類似於上述圖3A及圖3B之方式以基座510安置鑲嵌元件600並以類似於圖5A至圖5E之方式設置隔板500(且可選擇性不取離隔板500)及具有不同粒徑範圍之顆粒來發泡形成一體成型鑲嵌有鑲嵌元件600的發泡成型體400。然而,此僅為示例,且根據本新型之不同實施例可具有其他組合及變化。 Further, the manner in which the foamed base material 200 is provided in each of the above embodiments can be variously combined and changed without conflicting with each other. For example, referring to FIG. 7A and FIG. 7B, the inlaid component 600 can be disposed in the susceptor 510 in a manner similar to that described above in FIGS. 3A and 3B and the spacer 500 can be disposed in a manner similar to that of FIGS. 5A-5E (and optionally The foamed molded body 400 in which the insert member 600 is integrally formed is integrally molded without being separated from the separator 500) and particles having different particle diameter ranges. However, this is merely an example, and other combinations and variations are possible in accordance with various embodiments of the present invention.

進一步,根據本新型之其他實施例,亦可在設置步驟S100中局部設置一或多個膜狀元件700於該模具100中以與該些半發泡顆粒205(例如,第一顆粒210及/或第二顆粒220)接觸。其中,膜狀元件700例如可包含可以微波方式進行加熱的材質。舉例而言,膜狀元件700可包含類似於半發泡顆粒205或可與半發泡顆粒205在微波後黏合之材質。例如,膜狀元件700可包含PU、TPU或TPE等材質。因此,在微波後,膜狀元件700可與發泡之半發泡顆粒205黏合。 Further, according to other embodiments of the present invention, one or more film-like members 700 may be partially disposed in the mold 100 in the setting step S100 to form the semi-expanded particles 205 (for example, the first particles 210 and/or Or the second particles 220) are in contact. Among them, the film element 700 may include, for example, a material that can be heated by microwaves. For example, the film element 700 may comprise a material similar to the semi-expanded particles 205 or may be bonded to the semi-expanded particles 205 after microwaves. For example, the film element 700 may comprise a material such as PU, TPU or TPE. Therefore, after the microwave, the film member 700 can be bonded to the foamed semi-foamed particles 205.

承上,舉例而言,參照圖8,除了上述半發泡顆粒205及鑲嵌元件600以外,可在設置步驟S100中進一步設置具有圖案710之膜狀元件700於模具100中。在此,為了方便顯示起見,圖8之模具100係為可透視的,且模具100定義模槽110之壁體係薄到可以忽視。 For example, referring to FIG. 8, in addition to the above-described semi-expanded particles 205 and the inlaid member 600, the film-like member 700 having the pattern 710 may be further disposed in the mold 100 in the setting step S100. Here, for convenience of display, the mold 100 of FIG. 8 is fluoroscopy, and the mold 100 defines the wall system of the cavity 110 to be negligible.

承上所述,參照圖9,在發泡步驟S200後,該些半發泡顆粒205表面相互熔接形成為發泡結構250,令其中的鑲嵌元件600亦受擠壓而固定,進而形成一體成型包含有發泡結構250及鑲嵌元件600的發泡成型體400。另外,膜狀元件700本身可與半發泡顆粒205表面相互熔接,且原先在膜狀元件700上之圖案710會相對應地附著在發泡成型體400之發泡結構250上(發泡成型體400的外觀如同「印製」圖案710)。亦即,經發泡後形成之發泡成型體400上具有對應於該圖案710之標示圖案710’。例如,此標示圖案710’可為標示內部鑲嵌元件600之種類的標示或說明,或可為任意裝飾圖案。詳細而言,根據一實施例,膜狀元件700可為非發泡材料,且可為與熱可塑性聚氨酯(TPU)具有相同或類似質性的材料。因此,當以微波方式加熱膜狀元件700時其表面僅會稍微熔融,進而與半發泡材料(例如半發泡顆粒205)在其被微波後發泡產生擠壓時形成接著力。在此情況下,由於膜狀元件700並未發泡,故不會造成該膜狀元件700變形,使得圖案710原來的位置亦不會改變或受到影響。藉此,可在發泡步驟S200後形成對應於該圖案710之標示圖案710’。此外,根據另一實施例,膜狀元件700可為非發泡材料且可非為與熱可塑性聚氨酯(TPU)具有相同或類似質性的材料。因此,當以微波方式加熱後膜狀元件700之表面不會有熔融的情況(如保鮮膜)。在此情況下,膜狀元件700與半發泡材料(例如半發泡顆粒205)在其被微波後發泡產生擠壓時, 雖不易達成穩固接著但仍可被半發泡材料包覆與定位,故圖案710原來的位置亦不會改變或受到影響。藉此,可在發泡步驟S200後形成對應於該圖案710之標示圖案710’。然而,上述皆僅為示例,且本新型不限於此。 With reference to FIG. 9, after the foaming step S200, the surfaces of the semi-foamed particles 205 are welded to each other to form a foamed structure 250, so that the inlaid member 600 is also pressed and fixed, thereby forming an integral molding. The foamed molded body 400 including the foamed structure 250 and the insert member 600. In addition, the film member 700 itself may be welded to the surface of the semi-expanded particles 205, and the pattern 710 originally on the film member 700 may be correspondingly attached to the foam structure 250 of the foam molded body 400 (foam molding). The body 400 looks like a "printed" pattern 710). That is, the foamed molded body 400 formed by foaming has an indication pattern 710' corresponding to the pattern 710. For example, the logo pattern 710' can be an indication or description of the type of interior inlay element 600, or can be any decorative pattern. In detail, according to an embodiment, the film-like member 700 may be a non-foamed material, and may be a material having the same or similar properties as the thermoplastic polyurethane (TPU). Therefore, when the film-like member 700 is heated in a microwave manner, its surface is only slightly melted, and further, an adhesion force is formed with the semi-foamed material (for example, the semi-foamed particles 205) when it is foamed by the microwave to be pressed. In this case, since the film member 700 is not foamed, the film member 700 is not deformed, so that the original position of the pattern 710 is not changed or affected. Thereby, the marking pattern 710' corresponding to the pattern 710 can be formed after the foaming step S200. Further, according to another embodiment, the film-like member 700 may be a non-foamed material and may not be a material having the same or similar properties as the thermoplastic polyurethane (TPU). Therefore, the surface of the film-like member 700 does not melt when heated by microwaves (e.g., wrap film). In this case, when the film-like member 700 and the semi-foamed material (for example, the semi-foamed particles 205) are foamed by the microwave to be pressed, Although it is not easy to achieve stability, but can still be covered and positioned by the semi-foamed material, the original position of the pattern 710 will not change or be affected. Thereby, the marking pattern 710' corresponding to the pattern 710 can be formed after the foaming step S200. However, the above are merely examples, and the present invention is not limited thereto.

根據本新型之又一實施例,膜狀元件700之至少之一可為防水透濕膜(未於圖式中示出)。具體而言,防水透濕膜可協助使人體之汗水以水蒸氣的形式排出,且可協助隔絕外界的水液體的滲入。舉例而言,防水透濕膜可具有1000-2000mm以上之防水能力,及具有2000-3000g/m2/24hr以上之透濕性。然而,上述僅為示例,且防水透濕膜可依據需求及預期來設計而具備各種程度的防水能力及透濕性。 According to yet another embodiment of the present invention, at least one of the membranous elements 700 can be a waterproof, moisture permeable film (not shown in the drawings). Specifically, the waterproof and moisture permeable film can assist in discharging the sweat of the human body in the form of water vapor, and can assist in isolating the infiltration of the external water liquid. For example, the waterproof moisture permeable film may have a water repellency of 1000-2000 mm or more, and a moisture permeability of 2000-3000 g/m 2 /24 hr or more. However, the above is merely an example, and the waterproof and moisture permeable film can be designed to have various degrees of water repellency and moisture permeability according to needs and expectations.

承上,根據本新型之一實施例,該防水透濕膜可包含或可由可以微波方式進行加熱之材質所製成,且可例如包含與半發泡顆粒205性質類似的材料。例如,防水透濕膜可包含不會發泡或發泡能力可忽略之聚氨酯(PU)、熱可塑性聚氨酯(TPU)或熱可塑性彈性體(TPE)等材質。如上所述,在發泡步驟S200前,可進一步以防水透濕膜包覆至少一部分發泡基礎材料200。因此,由於與半發泡顆粒205之材質具有共通性,在發泡步驟S200過後,防水透濕膜可與所形成之發泡成型體400之發泡結構250之至少一部分表面熔接或被包覆固定。亦即,發泡成型體400之發泡結構250之至少一部分可被相互熔接之大致保持原性質或原結構之防水透濕膜所隔絕或包覆,從而提高所形成之發泡成型體400之至少一部分的防水透濕能力。 According to an embodiment of the present invention, the waterproof moisture permeable film may comprise or may be made of a material that can be heated by microwaves, and may, for example, comprise a material similar in nature to the semi-expanded particles 205. For example, the waterproof and moisture permeable film may comprise a material such as polyurethane (PU), thermoplastic polyurethane (TPU) or thermoplastic elastomer (TPE) which does not foam or has a negligible foaming ability. As described above, at least a portion of the foamed base material 200 may be further coated with a waterproof moisture permeable film before the foaming step S200. Therefore, due to the commonality with the material of the semi-expanded particles 205, after the foaming step S200, the waterproof and moisture-permeable film can be welded or coated with at least a part of the surface of the foamed structure 250 of the formed foamed molded body 400. fixed. That is, at least a part of the foamed structure 250 of the foamed molded body 400 can be insulated or coated by the waterproof and moisture permeable film which is substantially welded to the original or original structure, thereby improving the formed foamed molded body 400. At least a portion of the waterproof and moisture permeable ability.

另外,根據本新型之再一實施例,膜狀元件700之至少之一可包含可藉由以微波方式加熱而進行發泡之可發泡材料。藉此,可用於依據預期設計來形成發泡成型體400之各種細部結構或形狀。 Further, according to still another embodiment of the present invention, at least one of the film-like members 700 may include a foamable material that can be foamed by microwave heating. Thereby, it can be used to form various detailed structures or shapes of the foamed molded body 400 in accordance with the intended design.

具體而言,參照圖10A至圖10E,膜狀元件700之至少之一可包含可發泡材料或可以微波方式進行加熱而部分熔融而熔接其他材料的材料,且可包覆定義包覆空間720。其中,如圖10A至圖10B依序所示,可將包含鑲嵌元件600與該些半發泡顆粒205之發泡基礎材料200設置於由該膜狀元件700所包覆定義之該包覆空間720中。接著,如圖10C及圖10D依序所示,可將膜狀元件700閉合並將內部有發泡基礎材料200之閉合膜狀元件700設置於模具100中,並以上蓋120加蓋模具100以準備進行發泡。承上,在設置步驟S100完成時,所述包覆空間720中可包含有設置半發泡顆粒205之主體空間721、以及無設置該些半發泡顆粒205的延伸區間722。 Specifically, referring to FIG. 10A to FIG. 10E, at least one of the film-like members 700 may include a foamable material or a material that can be heated by microwaves to be partially melted to weld other materials, and may define a cladding space 720. . Wherein, as shown in FIG. 10A to FIG. 10B, the foaming base material 200 including the inlaid component 600 and the semi-expanded particles 205 may be disposed on the cladding space defined by the film-like component 700. 720. Next, as shown in FIG. 10C and FIG. 10D, the film-like member 700 can be closed and the closed film-like member 700 having the foamed base material 200 inside can be placed in the mold 100, and the upper cover 120 is covered with the mold 100. Prepare for foaming. The cover space 720 may include a main body space 721 in which the semi-expanded particles 205 are disposed, and an extension interval 722 in which the semi-expanded particles 205 are not disposed.

接著,連同圖10A至圖10D參照圖10E,當上述配置進行發泡步驟S200時,半發泡顆粒205會沿著膜狀元件700所定義之包覆空間720發泡膨脹,且因此半發泡顆粒205發泡膨脹之一部分會延伸填充延伸區間722。藉此,參照圖11,可藉由膜狀元件700,使得插設鑲嵌元件600所可能造成之發泡成型體400”外型之不均勻性降低且使得發泡成型體400”之細緻度提高。 Next, referring to FIG. 10E together with FIGS. 10A to 10D, when the above-described configuration is performed in the foaming step S200, the semi-foamed particles 205 are foamed and expanded along the cladding space 720 defined by the film-like member 700, and thus semi-foamed. One portion of the foamed expansion of the particles 205 extends to fill the extension section 722. Therefore, referring to FIG. 11, the unevenness of the appearance of the foamed molded body 400" caused by the insertion of the insert member 600 can be reduced by the film-like member 700, and the fineness of the foamed molded body 400" can be improved. .

詳細而言,如圖10A至圖11所示,當直接或藉由其他輔助定位元件插設鑲嵌元件600時,設置鑲嵌元件600之垂直區段A1(虛線標示)可能相較於相鄰之垂直區段A2(虛線標示)具有不同之半發泡顆粒205之數量,且可能造成發泡結構外型之不均勻性。承上,根據本實施例,可藉由膜狀元件700界定預期外型來降低此不均勻性的可能性,進而完成預期之發泡成型體400”之外型。例如,如圖11所示,發泡成型體400”之區段A1’及A2’(虛線標示)可具有大致相等之高度。 In detail, as shown in FIG. 10A to FIG. 11, when the inlaid element 600 is inserted directly or by other auxiliary positioning elements, the vertical section A1 (marked by a broken line) of the setting inlaid element 600 may be compared with the adjacent vertical. Section A2 (indicated by the dashed line) has a different number of semi-expanded particles 205 and may cause non-uniformity in the appearance of the foamed structure. According to the present embodiment, the possibility of reducing the unevenness can be reduced by defining the desired shape of the film member 700, thereby completing the desired appearance of the molded foam body 400. For example, as shown in FIG. The sections A1' and A2' (indicated by broken lines) of the foamed molded body 400" may have substantially equal heights.

此外,如圖11所示,所完成之發泡成型體400”可具有由該些 半發泡顆粒205發泡而填充延伸區間722所形成之延伸部分450。亦即,可藉由膜狀元件700之配置來產生預期之發泡成型體400”之發泡結構的細部結構或形狀。例如,發泡成型體400”之發泡結構可形成自兩側邊緣微凸之凸緣(延伸部分450)。上述之凸緣可作為鞋體部件之兩側凸緣,藉此可提升鞋體部件與鞋子其他部分如鞋面之連接強度或可加強足部兩側之鞋體的保護強度。然而,上述僅為示例,且本新型不限於在此所示出之包覆空間720的形狀和所生成之發泡成型體400”的形狀。 Further, as shown in FIG. 11, the completed foamed molded body 400" may have these The semi-expanded particles 205 are foamed to fill the extended portion 450 formed by the extended section 722. That is, the detailed structure or shape of the foamed structure of the intended foamed molded body 400" can be produced by the configuration of the film-like member 700. For example, the foamed structure of the foamed molded body 400" can be formed from both side edges. A slightly convex flange (extension portion 450). The flanges described above can be used as flanges on both sides of the shoe body member, thereby enhancing the strength of the connection of the shoe body member to other portions of the shoe such as the upper or enhancing the protective strength of the shoe body on both sides of the foot. However, the above is merely an example, and the present invention is not limited to the shape of the covering space 720 shown here and the shape of the formed foam molded body 400".

如上所述,由於根據本新型之製作發泡成型體之方法及製備之發泡成型體可用於製造鞋體部件,根據本新型之其他實施例,可在完成發泡成型體(亦即鞋體部件)之同時進一步與鞋體之其他部分連接或製成鞋體的其他部分。因此,可進一步簡化製程與減少製備時間或成本。 As described above, since the method for producing a foam molded body according to the present invention and the prepared foam molded body can be used for manufacturing a shoe body member, according to other embodiments of the present invention, the foam molded body (that is, the shoe body can be completed) The part) is further joined to other parts of the shoe body or made to other parts of the shoe body. Therefore, the process can be further simplified and the preparation time or cost can be reduced.

具體而言,參照圖12A及圖12B,類似於圖2F,模具100之模槽110可具有鞋體部件之形狀。承上,在發泡步驟S200前,可進一步包含設置套有鞋面900之鞋楦800於模具100上。在此,鞋楦800設置於模具100上是相對概念,且不限定於鞋楦800設置於模具100由重力方向所界定之上方。例如,可如圖12A所示之實施例,在設置步驟S100使包含半發泡顆粒205及鑲嵌元件600之發泡基礎材料200被設置於模具100中之後,再配置套有鞋面900之鞋楦800於模具100之上(亦即,重力方向上方)。或者是,可如圖12B所示之實施例,先配置套有鞋面900之鞋楦800於模具100上(亦即,重力方向下方),且藉由模具100和套有鞋面900之鞋楦800之鞋楦底部805界定放置發泡基礎材料200之模槽110。接著,使包含半發泡顆粒205及鑲嵌元件600之發泡基礎材料200設置於模具100中,且被套有鞋面900之鞋楦800之鞋楦底部805 所承載。 Specifically, referring to Figures 12A and 12B, similar to Figure 2F, the mold cavity 110 of the mold 100 can have the shape of a shoe body member. It is noted that, before the foaming step S200, the shoe last 800 with the upper 900 may be further disposed on the mold 100. Here, the setting of the shoe last 800 on the mold 100 is a relative concept, and is not limited to the shoe last 800 being disposed above the mold 100 defined by the direction of gravity. For example, in the embodiment shown in FIG. 12A, after the foaming base material 200 including the semi-expanded particles 205 and the inlaid member 600 is placed in the mold 100, the shoe covered with the upper 900 is disposed. The crucible 800 is above the mold 100 (i.e., above the direction of gravity). Alternatively, as shown in FIG. 12B, the shoe last 800 with the upper 900 is first disposed on the mold 100 (ie, below the direction of gravity), and the mold 100 and the shoe with the upper 900 are provided. The last bottom 805 of the 楦800 defines a cavity 110 in which the foamed base material 200 is placed. Next, the foamed base material 200 including the semi-expanded particles 205 and the inlaid member 600 is placed in the mold 100, and the last bottom 805 of the last 800 of the upper 900 is covered. Hosted.

如上所述,如圖12A及圖12B所示,在發泡步驟S200前,可進一步設置套有鞋面900之鞋楦800於模具100上,使得鞋面900之至少一部分接觸該些半發泡顆粒205,且使設置於模具100的該些半發泡顆粒205沿著鞋楦800之鞋楦底部805分佈。因此,當接續於發泡步驟S200中藉由在一固定空間內以微波方式進行加熱使半發泡顆粒205發泡時,半發泡顆粒205可藉由發泡而使表面相互熔接形成一發泡結構251,令其中的鑲嵌元件600亦受擠壓而固定,並同時沿著鞋楦800之鞋楦底部805與鞋面900進行黏合。亦即,在對應於鞋楦800之鞋楦底部805處可形成與鞋面900黏合之一體成型包含發泡結構251及鑲嵌元件600的鞋體部件(亦即,發泡成型體400’)。因此,在發泡步驟S200後,去除鞋楦800即可形成如圖13所示之結合鞋面900與具鑲嵌元件600之鞋體部件之鞋子1000,而毋須在形成鞋體部件後另外進行鞋體部件與鞋面900黏合之工序。 As shown in FIG. 12A and FIG. 12B, before the foaming step S200, the shoe last 800 of the upper 900 may be further disposed on the mold 100 such that at least a portion of the upper 900 contacts the semi-foaming. The particles 205 and the semi-foamed particles 205 disposed on the mold 100 are distributed along the last bottom 805 of the last 800. Therefore, when the semi-expanded particles 205 are foamed by microwave heating in a fixed space following the foaming step S200, the semi-expanded particles 205 can be welded to each other to form a hair by foaming. The bubble structure 251 is such that the inlaid element 600 therein is also pressed and fixed, and simultaneously bonded to the upper 900 along the last bottom 805 of the last 800. That is, a shoe body member (i.e., a foam molded body 400') including the foam structure 251 and the insert member 600 may be formed integrally with the upper 900 at a shoe bottom 805 corresponding to the last 800. Therefore, after the foaming step S200, the shoe last 800 is removed to form the shoe 1000 of the shoe upper 900 and the shoe body component with the inlaid component 600 as shown in FIG. 13, without separately performing the shoe after forming the shoe body component. The process of bonding the body member to the upper 900.

根據本新型之一些實施例,為了使鞋體部件在形成同時更順利地與鞋面900黏合,鞋面900可包含不會發泡或發泡能力可忽略之PU、TPU或TPE等材質。例如,鞋面900可由PU、TPU或TPE之紗線所織成。然而,在可與鞋體部件(亦即,發泡成型體400’)黏合下本新型不限於此。 According to some embodiments of the present invention, in order to make the shoe body member more smoothly bonded to the upper 900 while being formed, the upper 900 may include a material such as PU, TPU or TPE which does not foam or has a negligible foaming ability. For example, upper 900 may be woven from a yarn of PU, TPU or TPE. However, the present invention is not limited to this, which can be bonded to the shoe body member (i.e., the foam molded body 400').

另外,雖未於圖中示出,但根據本新型之其他實施例,亦可在發泡步驟S200前鋪設鞋大底材料或鞋大底於半發泡顆粒205。舉例而言,可在未設置鞋楦800及鞋面900下單純鋪設鞋大底材料或鞋大底於半發泡顆粒205上,亦可在設置有鞋楦800及鞋面900下相反於鞋楦800和鞋面900在半發泡顆粒205之另一面鋪設鞋大底材料或鞋大底。另外,當鞋大底材料或鞋 大底係為零散的且未完整鋪設於整個發泡基礎材料200之一表面上時,可依據預期鞋大底呈現之圖樣來鋪設鞋大底材料或鞋大底於發泡基礎材料200之表面上。藉此,可在發泡步驟S200中選擇性地同時形成表面相互熔接之鞋大底、發泡成型體400’(例如,作為鞋中底之發泡成型體400’)及鞋面900。 Further, although not shown in the drawings, according to other embodiments of the present invention, the shoe outsole material or the shoe sole may be laid on the semi-foamed particles 205 before the foaming step S200. For example, the shoe sole material or the sole of the shoe may be simply laid on the semi-foamed particles 205 without the shoe last 800 and the upper 900, or may be opposite to the shoe provided with the shoe last 800 and the upper 900. The 楦800 and the upper 900 are laid on the other side of the semi-expanded particles 205 with a shoe outsole material or a shoe outsole. Also, when the shoe outsole material or shoes When the outsole is scattered and not completely laid on the surface of one of the foamed base materials 200, the outsole material or the sole of the shoe may be laid on the surface of the foamed base material 200 according to the pattern presented by the intended outsole. on. Thereby, in the foaming step S200, the shoe outsole having the surfaces welded to each other, the foam molded body 400' (for example, the foam molded body 400' as the midsole), and the upper 900 can be selectively formed at the same time.

根據本新型之一些實施例,為了使鞋體部件(亦即,發泡成型體400’)在形成同時更順利地與鞋大底或鞋大底材料黏合,大底或鞋大底材料可包含不會發泡或發泡能力可忽略之PU、TPU或TPE等材質。然而,在可與鞋體部件(亦即,發泡成型體400’)黏合下,本新型不限於此。 According to some embodiments of the present invention, in order to make the shoe body member (ie, the foam molded body 400') more smoothly bonded to the outsole or the outsole material while forming, the outsole or outsole material may comprise Non-foaming or foaming materials with negligible PU, TPU or TPE. However, the present invention is not limited thereto, as it can be bonded to the shoe body member (i.e., the foam molded body 400').

接著,將繼續參照圖14及圖15說明基於設置鞋楦800之上述實施例之第一變化實施例。具體而言,參照圖14,當設置有套有鞋面900之鞋楦800時,在發泡步驟S200前,可進一步包含沿著鞋楦800之鞋楦底部805在鞋面900與鞋楦800之間另外分佈鋪設與設置於模具100中之半發泡顆粒205相同或不同之半發泡顆粒205’。亦即,可沿著鞋楦800之鞋楦底部805在鞋面900與鞋楦800之間另外分佈鋪設包含半發泡顆粒205’之發泡基礎材料200’。因此,半發泡顆粒205’在發泡步驟S200中亦隨之被以微波方式加熱而進行發泡(例如由於微波所導致之本身溫度提昇或添加劑等周遭材料所導致之溫度提昇而發泡)。如圖15所示,上述經過發泡之半發泡顆粒205’所形成之發泡結構252可獨立於發泡成型體400’另外形成整合一體成型的發泡成型體905。 Next, a first modified embodiment of the above embodiment based on the provision of the last 800 will be described with continued reference to FIGS. 14 and 15. Specifically, referring to FIG. 14, when the shoe last 800 with the upper 900 is provided, before the foaming step S200, the last bottom 805 of the last 800 may be further included in the upper 900 and the last 800. Further, semi-expanded particles 205' which are the same as or different from the semi-expanded particles 205 provided in the mold 100 are disposed. That is, the foamed base material 200' comprising the semi-expanded particles 205' may be additionally distributed between the upper 900 and the last 800 along the last bottom 805 of the last 800. Therefore, the semi-expanded particles 205' are also foamed by microwave heating in the foaming step S200 (for example, foaming due to temperature rise due to microwaves or temperature increase caused by surrounding materials such as additives) . As shown in Fig. 15, the foamed structure 252 formed by the above-mentioned foamed semi-expanded particles 205' can be separately formed into an integrally molded foam molded body 905 independently of the foamed molded body 400'.

如圖14所示,根據部分實施例,該發泡基礎材料200’亦可類似上述原則及方式包含一鑲嵌元件600’。在此情況下,所形成之發泡成型體905亦可鑲嵌有鑲嵌元件600’。 As shown in Fig. 14, according to some embodiments, the foamed base material 200' may comprise a damascene element 600' similar to the above principles and manner. In this case, the formed foamed molded body 905 may also be inlaid with the inlaid member 600'.

根據一實施例,所述發泡成型體905可為圖14之配置進行發泡步驟S200後所形成之鞋子2000的鞋墊。亦即,可藉由單一發泡步驟S200,而同時形成鑲嵌有鑲嵌元件600之鞋體部件(亦即,發泡成型體400’)、選擇性鑲嵌有鑲嵌元件600’之鞋墊(亦即,發泡成型體905)並黏合鞋體部件(亦即,發泡成型體400’)與鞋面900。 According to an embodiment, the foamed molded body 905 may be the insole of the shoe 2000 formed after the foaming step S200 is configured as shown in FIG. That is, the shoe body member (that is, the foam molded body 400') inlaid with the insert member 600 and the insole selectively embedded with the insert member 600' can be simultaneously formed by a single foaming step S200 (ie, The foam molded body 905) is bonded to the shoe body member (that is, the foam molded body 400') and the upper 900.

根據本新型之一些實施例,鑲嵌元件600’可為與鑲嵌元件600相同或不同之不會被微波所影響之物件。舉例而言,在作為鞋墊之情況下,鑲嵌元件600’可為量測血壓、體脂或用於記步之晶片。然而,上述僅為示例,且本新型不限於此。 In accordance with some embodiments of the present invention, the inlaid component 600' can be the same or a different object than the inlaid component 600 that is not affected by the microwave. For example, in the case of an insole, the inlaid element 600' can be a blood pressure, body fat, or wafer for step counting. However, the above is merely an example, and the present invention is not limited thereto.

另外,下文中將參照圖16及圖17說明基於設置鞋楦800之上述實施例之第二變化實施例。其中,根據第二變化實施例,鞋楦800上可套有雙層鞋面900,且上述發泡成型體之結構可進一步形成於雙層鞋面900之間。詳細而言,參照圖16,套在鞋楦800上的鞋面900具有包含外層910及裏層920之雙層結構。進一步,類似於上述參照圖14及圖15所述之第一變化實施例,在發泡步驟S200前,可包含沿著鞋楦800之鞋楦底部805在鞋面900之裏層920與外層910之間另外分佈鋪設與設置於模具100中之半發泡顆粒205相同或不同之半發泡顆粒205’。亦即,可沿著鞋楦800之鞋楦底部805在鞋面900之裏層920與外層910之間另外分佈鋪設包含半發泡顆粒205’之發泡基礎材料200’。因此,半發泡顆粒205’在發泡步驟S200中亦隨之被以微波方式加熱而進行發泡(例如由於微波所導致之本身溫度提昇或添加劑等周遭材料所導致之溫度提昇而發泡)。如圖17所示,上述經過發泡之半發泡顆粒205’所形成之發泡結構252可獨立於發泡成型體400’另外形成整合一體成型的發泡 成型體915。 In addition, a second modified embodiment based on the above embodiment of the shoe last 800 will be described hereinafter with reference to FIGS. 16 and 17. Wherein, according to the second modified embodiment, the shoe last 800 may be covered with a double-layer upper 900, and the structure of the above-mentioned foam molded body may be further formed between the double-layer uppers 900. In detail, referring to FIG. 16, the upper 900 that fits over the last 800 has a two-layer structure including an outer layer 910 and an inner layer 920. Further, similar to the first variant embodiment described above with reference to FIGS. 14 and 15, prior to the foaming step S200, the inner layer 920 and the outer layer 910 of the upper 900 may be included along the last bottom 805 of the last 800. Further, semi-expanded particles 205' which are the same as or different from the semi-expanded particles 205 provided in the mold 100 are disposed. That is, the foamed base material 200' comprising the semi-expanded particles 205' may be additionally disposed between the inner layer 920 and the outer layer 910 of the upper 900 along the last bottom 805 of the last 800. Therefore, the semi-expanded particles 205' are also foamed by microwave heating in the foaming step S200 (for example, foaming due to temperature rise due to microwaves or temperature increase caused by surrounding materials such as additives) . As shown in Fig. 17, the foamed structure 252 formed by the above-mentioned foamed semi-expanded particles 205' can be separately formed into an integrally molded foam independently of the foamed molded body 400'. Molded body 915.

如圖16所示,根據部分實施例,該發泡基礎材料200’亦可類似上述原則及方式包含一鑲嵌元件600’。在此情況下,所形成之發泡成型體915亦可鑲嵌有鑲嵌元件600’。其中,鑲嵌元件600’的細節與上述參照圖14及圖15所述相同或類似,且在此將不再贅述。 As shown in Fig. 16, according to some embodiments, the foamed base material 200' may comprise a damascene element 600' similar to the above principles and manner. In this case, the formed foamed molded body 915 may also be inlaid with the inlaid member 600'. The details of the inlaid component 600' are the same as or similar to those described above with reference to FIGS. 14 and 15, and will not be described again herein.

根據一實施例,所述發泡成型體915可為圖16之配置進行發泡步驟S200後所形成之鞋子3000的鞋墊或填充物。亦即,可藉由單一發泡步驟S200,而同時形成鑲嵌有鑲嵌元件600之鞋體部件(亦即,發泡成型體400’)、選擇性鑲嵌有鑲嵌元件600’之鞋墊或填充物(亦即,發泡成型體915)並黏合鞋體部件(亦即,發泡成型體400’)與鞋面900。 According to an embodiment, the foam molded body 915 may be an insole or a filler of the shoe 3000 formed after the foaming step S200 is performed in the configuration of FIG. That is, the shoe body member (that is, the foam molded body 400') inlaid with the insert member 600, and the insole or filler selectively embedded with the insert member 600' can be simultaneously formed by a single foaming step S200. That is, the foam molded body 915) adheres to the shoe body member (that is, the foam molded body 400') and the upper 900.

此外,雖未於圖式中示出,基於設置鞋楦800之上述實施例之第三變化實施例,亦可在無形成發泡成型體400’之情況下依據上述原則直接形成發泡成型體905或發泡成型體915,且可相應地在其內部設置鑲嵌元件600’。或者是,基於設置鞋楦800之上述實施例之第四變化實施例,亦可在無形成發泡成型體400’之情況下依據上述原則同時直接形成發泡成型體905及發泡成型體915,且可相應地在其至少之一內部設置鑲嵌元件600’。又或是,基於設置鞋楦800之上述實施例之第五變化實施例,亦可同時形成發泡成型體400’、發泡成型體905及發泡成型體915,且可相應地在其至少之一內部設置鑲嵌元件600及/或600’。承上,所屬技術領域中具有通常知識者可依據上述原則相應地進行各種變化。 Further, although not shown in the drawings, based on the third modified embodiment of the above-described embodiment in which the last 800 is provided, the foamed molded body may be directly formed according to the above principle without forming the foamed molded body 400'. 905 or foamed molded body 915, and the inlaid element 600' may be disposed inside thereof accordingly. Alternatively, based on the fourth modified embodiment of the above embodiment in which the shoe last 800 is provided, the foamed molded body 905 and the foamed molded body 915 may be directly formed simultaneously according to the above principle without forming the foamed molded body 400'. And the inlaid element 600' can be disposed within at least one of its interiors accordingly. Alternatively, based on the fifth modified embodiment of the above embodiment in which the shoe last 800 is provided, the foamed molded body 400', the foamed molded body 905, and the foamed molded body 915 may be simultaneously formed, and correspondingly at least One of the interiors is provided with inlaid elements 600 and/or 600'. It is to be understood that those skilled in the art can make various changes in accordance with the above principles.

進一步,雖然未於圖式中示出,如上文中所述之防水透濕膜亦可在設置有鞋楦800及鞋面900的實施例中運用。具體而言,防水透濕膜可 同時包覆一部分發泡基礎材料200及一部分鞋面900,且在發泡步驟S200後與形成之鞋體部件(亦即,發泡成型體400’)及鞋面900黏合,而可作用以使該部分鞋體部件(亦即,發泡成型體400’)及該部分鞋面900具有防水透濕能力。類似地,防水透濕膜亦可如上應用於其他一併形成的發泡成型體上,且在此將不再贅述。 Further, although not shown in the drawings, the waterproof moisture permeable film as described above may also be utilized in the embodiment in which the last 800 and the upper 900 are provided. Specifically, the waterproof and moisture permeable film can be At the same time, a part of the foamed base material 200 and a part of the upper 900 are coated, and after the foaming step S200, the formed shoe part (ie, the foamed molded body 400') and the upper 900 are bonded to act to make The portion of the shoe body member (i.e., the foam molded body 400') and the portion of the upper 900 have waterproof and moisture permeable capabilities. Similarly, the waterproof and moisture permeable film can also be applied to other foamed molded bodies formed as described above, and will not be described herein.

綜上所述,根據本新型之各實施例,可藉由設置條件相對便宜及簡單之微波加熱製程,以整合之程序完成具鑲嵌元件之發泡成型體或鞋體部件。詳細而言,根據本新型之各實施例所進行之微波加熱製程相較於例如習知之射出成型製程,由於毋須以高溫來熔融基礎材料故可縮短製程時間並節省能源,進而大幅減少生產成本。進一步,微波加熱係使加熱對象短時間內由內部到整體一起發熱,相較於習知由外向內加熱的方式較為快速且加熱均勻,使得最終生產之產品之均質性可得以提高,且微結構不易受到破壞而可保留有較佳微結構及其對應功能性質。因此,可提升製成產品之性能及良率,且所製備之發泡成型體或鞋體部件可具有所需之鑲嵌元件、細部結構、形狀或性質。藉此,可提升或改善發泡成型體之應用性及適用性。 In summary, according to various embodiments of the present invention, the foamed molded body or the shoe body member with the inlaid component can be completed by an integrated procedure by setting a relatively inexpensive and simple microwave heating process. In detail, the microwave heating process performed according to various embodiments of the present invention can shorten the process time and save energy, and thus greatly reduce the production cost, because the injection molding process is not required to be melted at a high temperature because of the conventional injection molding process. Further, the microwave heating system causes the heating object to heat up from the inside to the whole in a short time, and the method of heating from the outside to the inside is faster and uniform in heating, so that the homogeneity of the finally produced product can be improved, and the microstructure is improved. It is not easily damaged and retains the preferred microstructure and its corresponding functional properties. Therefore, the properties and yield of the finished product can be improved, and the prepared foam molded body or shoe body member can have a desired inlaid member, detail structure, shape or property. Thereby, the applicability and applicability of the foamed molded body can be improved or improved.

上文中所述僅為本新型之一些較佳實施例。應注意的是,在不脫離本新型之精神與原則下,本新型可進行各種變化及修改。所屬技術領域中具有通常知識者應明瞭的是,本新型由所附申請專利範圍所界定,且在符合本新型之意旨下,各種可能置換、組合、修飾及轉用等變化皆不超出本新型由所附申請專利範圍所界定之範疇。 The foregoing description is only some of the preferred embodiments of the present invention. It should be noted that various changes and modifications can be made in the present invention without departing from the spirit and scope of the invention. It should be apparent to those skilled in the art that the present invention is defined by the scope of the appended claims, and that various changes, combinations, modifications, and alterations may be made without departing from the scope of the present invention. The scope defined by the scope of the appended patent application.

Claims (8)

一種發泡成型體,其包含:一發泡結構,由複數個熱可塑性聚氨酯(TPU)的半發泡顆粒所發泡形成;以及至少一鑲嵌元件,為不會受到微波影響之材料或其製成品,且該鑲嵌元件受擠壓而固定鑲嵌於由該些半發泡顆粒經發泡而表面相互擠壓熔接之該發泡結構中。 A foamed molded body comprising: a foamed structure formed by foaming a plurality of semi-foamed particles of thermoplastic polyurethane (TPU); and at least one inlaid component, which is a material that is not affected by microwaves or a system thereof The finished product, and the inlaid member is pressed and fixedly embedded in the foamed structure in which the semi-expanded particles are foamed and the surfaces are extrusion-welded to each other. 如請求項1所述之發泡成型體,其中該些半發泡顆粒具有一第一粒徑範圍之複數個第一顆粒及具有一第二粒徑範圍之複數個第二顆粒,其中,該第一粒徑範圍之中間值實質上大於該第二粒徑範圍之中間值,且由該些第一顆粒所發泡形成之部分之硬度小於由該些第二顆粒所發泡形成之部分之硬度。 The foamed molded body according to claim 1, wherein the semi-expanded particles have a plurality of first particles of a first particle size range and a plurality of second particles having a second particle size range, wherein The intermediate value of the first particle size range is substantially greater than the intermediate value of the second particle size range, and the hardness of the portion formed by the first particles is less than the portion formed by the second particles. hardness. 如請求項1所述之發泡成型體,其進一步包含與該些半發泡顆粒表面相互熔接或黏合之一或多個膜狀元件。 The foamed molded article according to claim 1, which further comprises one or more film-like members which are welded or bonded to the surfaces of the semi-foamed particles. 如請求項3所述之發泡成型體,其中該些膜狀元件之至少之一之圖案相對應地附著在該發泡成型體上。 The foamed molded body according to claim 3, wherein a pattern of at least one of the film-like members is correspondingly attached to the foamed molded body. 如請求項3所述之發泡成型體,其中該些膜狀元件之至少之一為一防水透濕膜。 The foamed molded article according to claim 3, wherein at least one of the film-like members is a waterproof and moisture-permeable film. 如請求項3所述之發泡成型體,其中該些膜狀元件之至少之一包覆該發泡結構。 The foamed molded body according to claim 3, wherein at least one of the film-like members covers the foamed structure. 如請求項1所述之發泡成型體,其中該發泡成型體為具有一鞋體 部件形狀之一鞋體部件。 The foamed molded body according to claim 1, wherein the foamed molded body has a shoe body One of the shape of the part of the shoe body. 如請求項7所述之發泡成型體,其中該鞋體部件以熔接之形式與一鞋面之至少一部分黏合。 The foam molded body according to claim 7, wherein the shoe body member is bonded to at least a portion of an upper in a welded form.
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