TWM557449U - Circuit board material feeding equipment - Google Patents
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- TWM557449U TWM557449U TW106217450U TW106217450U TWM557449U TW M557449 U TWM557449 U TW M557449U TW 106217450 U TW106217450 U TW 106217450U TW 106217450 U TW106217450 U TW 106217450U TW M557449 U TWM557449 U TW M557449U
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- 238000012545 processing Methods 0.000 claims abstract description 75
- 238000007689 inspection Methods 0.000 claims abstract description 25
- 238000012546 transfer Methods 0.000 claims description 52
- 238000005553 drilling Methods 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000010330 laser marking Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 238000004458 analytical method Methods 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
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Abstract
本案係揭露一種電路板投料設備,包含:一投料區,用以放置一電路板;一X光定位裝置,包括:一檢查平台,具有相對的一第一側與一第二側,並設置於一第一置放台上;一發光單元,設置於該第一側,用以於該檢查平台上形成一感光範圍;一影像攝錄單元,設置於該第二側,用以拍攝該感光範圍內的一感測影像;及一處理控制單元,用以接收並分析該感測影像;一第一傳送單元,設置於與第一置放台相對的一第二置放台上,用以傳送該電路板於該投料區、該X光定位裝置及一待送區之間;其中該處理控制單元連接並依據該感測影像控制該第一傳送單元,將該電路板調整為一正確送料位置,並將該電路板傳送至該待送區。The present invention discloses a circuit board feeding device comprising: a feeding area for placing a circuit board; an X-ray positioning device comprising: an inspection platform having a first side and a second side opposite to each other a light-emitting unit is disposed on the first side for forming a light-sensing range on the inspection platform; an image-recording unit is disposed on the second side for capturing the light-sensing range a sensing image; and a processing control unit for receiving and analyzing the sensing image; a first transmitting unit disposed on a second placing table opposite to the first placing table for transmitting The circuit board is disposed between the feeding area, the X-ray positioning device and a waiting area; wherein the processing control unit is connected and controls the first transmitting unit according to the sensing image to adjust the circuit board to a correct feeding position And transferring the board to the to-be-sent zone.
Description
本創作係關於一種投料設備,更特別的是關於一種包含X光定位裝置的電路板投料設備。The present invention relates to a feeding device, and more particularly to a circuit board feeding device including an X-ray positioning device.
一般印刷電路板可為由六層、八層、十六層、六十四層等基板所組成的多層板。多層之印刷電路板在壓合製程完成後,由於表面包覆之銅箔會遮住原先基板上的定位孔(靶標孔),因此對於內部各板層間用於對準的定位孔,須使用例如光透視並整合影像及電控技術,正確導引出這些定位孔,並於後續製程(例如CNC機械鑽孔、雷射鑽孔及自動曝光等)以該等定位孔作為製程中的基準依據,才能順利完成全部的作業。Generally, the printed circuit board may be a multi-layer board composed of a substrate of six layers, eight layers, sixteen layers, and sixty-four layers. After the embossing process of the multi-layer printed circuit board, since the surface-coated copper foil covers the positioning holes (target holes) on the original substrate, for the positioning holes for alignment between the internal slab layers, for example, The fluoroscopy and integration of image and electronic control technology, correctly guide these positioning holes, and in the subsequent processes (such as CNC mechanical drilling, laser drilling and automatic exposure, etc.) with these positioning holes as the benchmark basis in the process, In order to complete all the work smoothly.
習知用於確認印刷電路板之定位孔的方式,係將電路板放置於檢查的機台面上,透過人力檢查並調整該電路板的位置,且同樣透過人力將該電路板送至後端處理裝置進行處理。The method for confirming the positioning hole of the printed circuit board is to place the circuit board on the inspection machine surface, check and adjust the position of the circuit board by manpower, and also send the circuit board to the back end through human power. The device is processed.
然而,這樣的方式不僅耗費人力、時間,也容易受到工作人員之疲累程度影響,造成失誤增加的機率,進而增加生產成本。在訴求自動化的趨勢下,這樣的機台與操作方式明顯已不合時宜。However, such an approach not only consumes manpower, time, but also is easily affected by the fatigue of the staff, resulting in an increased chance of mistakes, thereby increasing production costs. Under the trend of appealing to automation, such machines and operating methods are obviously out of date.
本創作之一目的在於提出一種可自動化將電路板調整至正確位置並傳送至後端處理裝置進行處理的電路板投料設備,能有效取代人力以解決習知技術的問題。One of the aims of the present invention is to propose a circuit board feeding device that can automatically adjust the circuit board to the correct position and transmit it to the back end processing device for processing, which can effectively replace the manpower to solve the problems of the prior art.
為達上述目的及其他目的,本創作提出一種電路板投料設備,包含:一投料區,用以放置一電路板;一X光定位裝置,用以分析該電路板的位置,該X光定位裝置包括:一檢查平台,具有相對的一第一側與一第二側,該檢查平台設置於一第一置放台上;一發光單元,設置於該第一側,用以於該檢查平台上形成一感光範圍;一影像攝錄單元,設置於該第二側,用以拍攝該感光範圍內的一感測影像;及一處理控制單元,用以接收並分析該感測影像;一第一傳送單元,設置於與第一置放台相對的一第二置放台上,用以傳送該電路板於該投料區、該X光定位裝置及一待送區之間;其中該處理控制單元連接並依據該感測影像控制該第一傳送單元,將該電路板調整為一正確送料位置,並將該電路板傳送至該待送區。To achieve the above and other objects, the present invention proposes a circuit board feeding device comprising: a feeding area for placing a circuit board; and an X-ray positioning device for analyzing the position of the circuit board, the X-ray positioning device The method includes: an inspection platform having a first side and a second side, the inspection platform is disposed on a first placement table; and an illumination unit is disposed on the first side for the inspection platform Forming a photosensitive range; an image recording unit disposed on the second side for capturing a sensing image in the photosensitive range; and a processing control unit for receiving and analyzing the sensing image; a transfer unit is disposed on a second placement table opposite to the first placement table for transferring the circuit board between the feeding area, the X-ray positioning device and a waiting area; wherein the processing control unit Connecting and controlling the first transmitting unit according to the sensing image, adjusting the circuit board to a correct feeding position, and transmitting the circuit board to the to-be-sending area.
於本創作之一實施例中,該第一傳送單元為一六軸機械手臂。In an embodiment of the present invention, the first transfer unit is a six-axis robot arm.
於本創作之一實施例中,該電路板投料設備更包含:複數第二傳送單元,各該第二傳送單元係用以將位於該待送區之電路板傳送至對應的後端處理裝置。In an embodiment of the present invention, the circuit board feeding device further includes: a plurality of second transmitting units, each of the second transmitting units configured to transfer the circuit board located in the to-be-sent area to the corresponding back-end processing device.
於本創作之一實施例中,該第一傳送單元為一六軸機械手臂,而各該第二傳送單元為一三軸機械手臂。In one embodiment of the present invention, the first transfer unit is a six-axis robot arm, and each of the second transfer units is a three-axis robot arm.
於本創作之一實施例中,該投料區被區分為複數子投料區,該等子投料區用以放置不同型號的電路板。In one embodiment of the present invention, the feed zone is divided into a plurality of sub-feed zones for placing different types of circuit boards.
於本創作之一實施例中,該待送區被區分為複數子待送區,該等子待送區用以放置對應之不同型號的電路板。In an embodiment of the present invention, the to-be-sent area is divided into a plurality of sub-sending areas for placing corresponding different types of circuit boards.
於本創作之一實施例中,該等後端處理裝置包括鑽靶機、自動裁磨線、曝光機、雷射鑽孔機、自動光學檢查(Automated Optical Inspection, AOI)、X光檢測機、雷射打標機、電鍍線定位機、Open/Short測試機。In an embodiment of the present invention, the back end processing device includes a drilling target machine, an automatic cutting line, an exposure machine, a laser drilling machine, an automated optical inspection (AOI), an X-ray inspection machine, Laser marking machine, plating line positioning machine, Open/Short testing machine.
藉此,由於本創作所提出之電路板投料設備不需要透過人力便能檢查並調整電路板的位置,並將電路板以正確的位置傳送至後端處理裝置進行處理,不僅節省人力與時間,也可有效避免由於人力失誤造成生產成本增加的問題。Therefore, the circuit board feeding device proposed by the present invention can check and adjust the position of the circuit board without manpower, and transfer the circuit board to the back end processing device for processing in the correct position, thereby saving manpower and time. It can also effectively avoid the problem of increased production costs due to human error.
為充分瞭解本創作,茲藉由下述具體之實施例,並配合所附之圖式,對本創作做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本創作的目的、特徵及功效。須注意的是,本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本創作的精神下進行各種修飾與變更。另外,本創作所附之圖式僅為簡單示意說明,並非依實際尺寸的描繪。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的技術範圍。說明如後:In order to fully understand the creation, a detailed description of the creation will be made by the following specific examples and with the accompanying drawings. Those skilled in the art can understand the purpose, features and effects of the present disclosure by the contents disclosed in the present specification. It should be noted that the present invention may be implemented or applied by other different embodiments. The details of the present specification may also be based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. In addition, the drawings attached to the present invention are merely illustrative and not drawn to actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention. The description is as follows:
圖1係為本創作一實施例之電路板投料設備100的部分俯視圖。如圖1所示,該電路板投料設備100包含一投料區10、一X光定位裝置20以及一第一傳送單元31。該投料區10例如為一放置平台,用以放置一電路板90。舉例而言,該電路板90可被集中放於一收板機(例如L-RACK)中,且該收板機被置放於該投料區10內。該X光定位裝置20係用以分析該電路板90的位置,而該第一傳送單元31用以傳送該電路板90於該投料區10、該X光定位裝置20及一待送區40之間。在本創作實施例中,該X光定位裝置20連接該第一傳送單元31,且該第一傳送單元31可依據該X光定位裝置20的分析結果將該電路板90調整為一正確送料位置,並將該電路板90傳送並放置於該待送區40。1 is a partial plan view of a circuit board feeding device 100 according to an embodiment of the present invention. As shown in FIG. 1, the circuit board feeding device 100 includes a feeding area 10, an X-ray positioning device 20, and a first conveying unit 31. The feeding zone 10 is, for example, a placement platform for placing a circuit board 90. For example, the circuit board 90 can be centrally placed in a capping machine (e.g., L-RACK) and placed in the dosing area 10. The X-ray positioning device 20 is configured to analyze the position of the circuit board 90, and the first transmitting unit 31 is configured to transmit the circuit board 90 to the feeding area 10, the X-ray positioning device 20, and a waiting area 40. between. In the present embodiment, the X-ray positioning device 20 is connected to the first transmitting unit 31, and the first transmitting unit 31 can adjust the circuit board 90 to a correct feeding position according to the analysis result of the X-ray positioning device 20. And the circuit board 90 is transferred and placed in the to-be-sending area 40.
要注意的是,該待送區40可例如與該投料區10類似,為一放置平台,用以放置被調整為正確送料位置的該電路板90;或者,該待送區40可例如為一後端處理裝置50(見圖4)的一部分,亦即,於該第一傳送單元31依據該X光定位裝置20的分析結果將該電路板90調整為一正確送料位置後,便可直接將該電路板90送入該後端處理裝置50進行處理。It is to be noted that the to-be-supplied area 40 can be, for example, similar to the feeding area 10, as a placement platform for placing the circuit board 90 adjusted to the correct feeding position; or the to-be-sending area 40 can be, for example, a A portion of the back end processing device 50 (see FIG. 4), that is, after the first transfer unit 31 adjusts the circuit board 90 to a correct feeding position according to the analysis result of the X-ray positioning device 20, The circuit board 90 is fed to the back end processing device 50 for processing.
圖2係為本創作一實施例之X光定位裝置20的示意圖。在本實施例中,該X光定位裝置20可包含一檢查平台21、一發光單元23、一影像攝錄單元25及一處理控制單元(未繪示)。如圖1、圖2所示,該檢查平台21設置於一第一置放台71上,且該檢查平台21具有相對的一第一側21-1與一第二側21-2,該發光單元23設置於該第一側21-1,該影像攝錄單元25設置於該第二側21-2,亦即,該發光單元23與該影像攝錄單元25分別設置於該檢查平台21相對的兩側。在圖2所示之實施例中,該發光單元23係位於該檢查平台21之上,而該影像攝錄單元25係位於該檢查平台21之下,但本創作並未限定於此。在其他實施例中,該發光單元23與該影像攝錄單元25的位置也可以互換。FIG. 2 is a schematic diagram of an X-ray positioning device 20 according to an embodiment of the present invention. In this embodiment, the X-ray positioning device 20 can include an inspection platform 21, a lighting unit 23, an image recording unit 25, and a processing control unit (not shown). As shown in FIG. 1 and FIG. 2, the inspection platform 21 is disposed on a first placement table 71, and the inspection platform 21 has a first side 21-1 and a second side 21-2. The unit 23 is disposed on the first side 21-1, and the image capturing unit 25 is disposed on the second side 21-2, that is, the light emitting unit 23 and the image capturing unit 25 are respectively disposed on the inspection platform 21 On both sides. In the embodiment shown in FIG. 2, the illumination unit 23 is located above the inspection platform 21, and the image recording unit 25 is located below the inspection platform 21, but the creation is not limited thereto. In other embodiments, the positions of the light emitting unit 23 and the image capturing unit 25 are also interchangeable.
在本實施例中,該發光單元23為一X光光源,用以於該檢查平台21上形成一感光範圍22(或稱一視野(field of view, FOV)),該感光範圍22可例如為一A4尺寸大小(約31 cm x 25 cm),但本創作並未限定於此。在本創作實施例中,該感光範圍22可依照實際需求調整,並未限定於上述尺寸。該影像攝錄單元25例如為一CCD鏡頭,用以拍攝該感光範圍22內的一感測影像。舉例來說,當一電路板被該第一傳送單元31傳送至該X光定位裝置20的檢查平台21上,經由該發光單元23發射一X光光源,該影像攝錄單元25即可拍攝到該電路板於該感光範圍22內所形成的一感測影像。此外,該處理控制單元係用以接收並分析該感測影像。In this embodiment, the light-emitting unit 23 is an X-ray source for forming a light-sensing range 22 (or a field of view (FOV)) on the inspection platform 21, and the light-sensing range 22 can be, for example, One A4 size (approx. 31 cm x 25 cm), but this creation is not limited to this. In the present embodiment, the photographic range 22 can be adjusted according to actual needs, and is not limited to the above size. The image capturing unit 25 is, for example, a CCD lens for capturing a sensing image in the photosensitive range 22. For example, when a circuit board is transmitted to the inspection platform 21 of the X-ray positioning device 20 by the first transmission unit 31, an X-ray source is emitted through the illumination unit 23, and the image recording unit 25 can capture the image. A sensing image formed by the board within the photographic range 22. In addition, the processing control unit is configured to receive and analyze the sensing image.
如圖1所示,在本實施例中,該第一傳送單元31設置於一第二置放台72上,該第二置放台72與該第一置放台71相對,而該第一傳送單元31例如為一六軸機械手臂。該第一傳送單元31可例如以吸附的方式吸持該電路板90,並能旋轉或翻轉該電路板90,以將該電路板90調整為一正確送料位置。該X光定位裝置20的處理控制單元連接該第一傳送單元31,且該處理控制單元係依據該感測影像控制該第一傳送單元31調整該電路板90,將該電路板90調整為一正確送料位置,並控制該第一傳送單元31將該電路板傳送並放置於該待送區40。舉例來說,該第一傳送單元31可直接將該電路板傳送至該待送區40、調整該電路板90的位置或翻轉該電路板90。As shown in FIG. 1 , in the embodiment, the first transmitting unit 31 is disposed on a second placing table 72 , and the second placing table 72 is opposite to the first placing table 71 , and the first The transport unit 31 is, for example, a six-axis robot arm. The first transfer unit 31 can hold the circuit board 90, for example, in an adsorbed manner, and can rotate or flip the circuit board 90 to adjust the circuit board 90 to a proper feed position. The processing control unit of the X-ray positioning device 20 is connected to the first transmitting unit 31, and the processing control unit controls the first transmitting unit 31 to adjust the circuit board 90 according to the sensing image, and adjusts the circuit board 90 to one. The feed position is correctly controlled, and the first transfer unit 31 is controlled to transfer and place the board in the to-be-supplied area 40. For example, the first transfer unit 31 can directly transfer the circuit board to the to-be-sent zone 40, adjust the position of the circuit board 90, or flip the circuit board 90.
圖3A至圖3D係為本創作一實施例中,該第一傳送單元31將一電路板90自該投料區10傳送至該X光定位裝置20(的檢查平台21上)的四種情況。在本實施例中,後端處理裝置50例如為一鑽靶機,該X光定位裝置20(之處理控制單元)可依據圖3A~圖3D的四種情況,控制該第一傳送單元31對該電路板90進行不同的作動,以確保後續將該電路板90傳送至該後端處理裝置50時,係以正確的位置進行投料。3A to 3D show four cases in which the first transfer unit 31 transfers a circuit board 90 from the feeding zone 10 to the (inspection platform 21 of the X-ray positioning device 20). In this embodiment, the back end processing device 50 is, for example, a drill target machine, and the processing control unit of the X-ray positioning device 20 can control the first transfer unit 31 according to the four situations of FIG. 3A to FIG. 3D. The board 90 performs different actuations to ensure that the subsequent feeding of the board 90 to the back end processing unit 50 is performed at the correct location.
在本實施例中,該電路板90可包含兩個定位孔A1、A2與一防呆孔B,如圖3A~圖3D所示,該等定位孔A1、A2與該防呆孔B的連線係構成一直角三角形。該X光定位裝置20可先檢查該等定位孔A1、A2的位置,再檢查該定位孔A1與該防呆孔B的位置;或者,可先檢查該定位孔A1與該防呆孔B的位置,再檢查該等定位孔A1、A2的位置,以對該電路板90的位置進行適當的調整。以下將進行詳細說明。In this embodiment, the circuit board 90 can include two positioning holes A1, A2 and a foolproof hole B. As shown in FIG. 3A to FIG. 3D, the positioning holes A1 and A2 are connected to the blind hole B. The line system forms a right-angled triangle. The X-ray positioning device 20 may first check the positions of the positioning holes A1 and A2, and then check the position of the positioning hole A1 and the anti-dwelling hole B; or, the positioning hole A1 and the anti-dwelling hole B may be inspected first. Position, and then check the positions of the positioning holes A1, A2 to appropriately adjust the position of the circuit board 90. The details will be described below.
圖3A所示之電路板90係以正面901朝上,且該等定位孔A1、A2與該防呆孔B的位置即為將該電路板90傳送至該後端處理裝置50(例如:鑽靶機)可直接進行處理的正確位置。亦即,當該第一傳送單元31將該電路板90自該投料區10傳送至該X光定位裝置20的檢查平台21上,經該發光單元23發出一光線(X光),而該影像攝錄單元25所拍攝到該電路板90於該感光範圍22內形成的感測影像如圖3A所示時,該處理控制單元係控制該第一傳送單元31直接將該電路板90傳送至該待送區40。The circuit board 90 shown in FIG. 3A is directed upward with the front side 901, and the positions of the positioning holes A1, A2 and the anti-scratch hole B are the transfer of the circuit board 90 to the rear end processing device 50 (for example: drilling The target machine can be processed directly in the correct position. That is, when the first transmitting unit 31 transmits the circuit board 90 from the feeding area 10 to the inspection platform 21 of the X-ray positioning device 20, a light (X-ray) is emitted through the light-emitting unit 23, and the image is emitted. When the recording unit 25 captures the sensing image formed by the circuit board 90 in the photosensitive range 22, as shown in FIG. 3A, the processing control unit controls the first transmitting unit 31 to directly transfer the circuit board 90 to the Waiting area 40.
在某些實施例中,該處理控制單元可依據該感測影像控制該第一傳送單元31旋轉該電路板90。In some embodiments, the processing control unit can control the first transmitting unit 31 to rotate the circuit board 90 according to the sensing image.
圖3B所示之電路板90係以正面901朝上,且該等定位孔A1、A2與該防呆孔B的位置係與將該電路板90傳送至該後端處理裝置50(例如:鑽靶機)可進行處理的正確位置相差180度。因此,當該影像攝錄單元25所拍攝到該電路板90於該感光範圍22內形成的感測影像如圖3B所示時,該處理控制單元係控制該第一傳送單元31將該電路板90先旋轉180度後,再傳送至該待送區40。The circuit board 90 shown in FIG. 3B has the front side 901 facing upward, and the positions of the positioning holes A1, A2 and the foolproof hole B are transmitted to the circuit board 90 to the rear end processing device 50 (for example: drilling The correct position at which the target machine can be processed differs by 180 degrees. Therefore, when the image capturing unit 25 captures the sensing image formed by the circuit board 90 in the photosensitive range 22 as shown in FIG. 3B, the processing control unit controls the first transmitting unit 31 to control the circuit board. 90 is rotated 180 degrees before being transferred to the to-be-sent zone 40.
在其他實施例中,該處理控制單元可依據該感測影像控制該第一傳送單元31翻轉該電路板90。In other embodiments, the processing control unit can control the first transmitting unit 31 to flip the circuit board 90 according to the sensing image.
圖3C所示之電路板90係以背面902朝上,由於該X光定位裝置20係檢查該等定位孔A1、A2的位置以及該定位孔A1與該防呆孔B的位置,該處理控制單元即可判斷無論如何旋轉該電路板90皆無法調整到正確的送料位置。因此,當該影像攝錄單元25所拍攝到該電路板90於該感光範圍22內形成的感測影像如圖3C所示時,該處理控制單元係控制該第一傳送單元31將該電路板90翻轉為正面,再傳送至該待送區40。The circuit board 90 shown in FIG. 3C has the back surface 902 facing upward. Since the X-ray positioning device 20 checks the positions of the positioning holes A1 and A2 and the positions of the positioning holes A1 and the foolproof holes B, the process control is performed. The unit can determine that the board 90 cannot be adjusted to the correct feed position anyway. Therefore, when the image capturing unit 25 captures the sensing image formed by the circuit board 90 in the photosensitive range 22 as shown in FIG. 3C, the processing control unit controls the first transmitting unit 31 to control the circuit board. The 90 is turned to the front side and then transferred to the waiting area 40.
圖3D所示之電路板90同樣為背面902朝上,但該等定位孔A1、A2與該防呆孔B的位置係與圖3C所示的位置相差180度。同樣地,由於該X光定位裝置20係檢查該等定位孔A1、A2的位置以及該定位孔A1與該防呆孔B的位置,該處理控制單元即可判斷無論如何旋轉該電路板90皆無法調整到正確的送料位置。因此,當該影像攝錄單元25所拍攝到該電路板90於該感光範圍22內形成的感測影像如圖3D所示時,該處理控制單元係控制該第一傳送單元31將該電路板90翻轉為正面,再將該電路板90旋轉180度後,才傳送至該待送區40。The circuit board 90 shown in FIG. 3D also has the back surface 902 facing upward, but the positions of the positioning holes A1, A2 and the foolproof holes B are 180 degrees out of the position shown in FIG. 3C. Similarly, since the X-ray positioning device 20 checks the positions of the positioning holes A1 and A2 and the positions of the positioning holes A1 and the foolproof holes B, the processing control unit can determine that the circuit board 90 is rotated anyway. Unable to adjust to the correct feeding position. Therefore, when the image capturing unit 25 captures the sensing image formed by the circuit board 90 in the photosensitive range 22 as shown in FIG. 3D, the processing control unit controls the first transmitting unit 31 to control the circuit board. The 90 is turned to the front side, and the board 90 is rotated 180 degrees before being transferred to the to-be-sending area 40.
要注意的是,雖然前述實施例係以該後端處理裝置50為一鑽靶機進行說明,但本創作並未限定於此。任何須將電路板90調整至正確的送料位置才可進行投料的後端處理裝置50,皆可於前端作業中透過本創作之X光定位裝置20以及第一傳送單元31將該電路板90調整至正確的送料位置,在此不多加贅述。It is to be noted that although the foregoing embodiment has been described with the back end processing device 50 as a drill target machine, the present creation is not limited thereto. Any back end processing device 50 that needs to adjust the circuit board 90 to the correct feeding position to perform feeding can adjust the circuit board 90 through the X-ray positioning device 20 and the first transfer unit 31 in the front end operation. To the correct feeding position, I will not repeat them here.
圖4係為本創作一實施例之電路板投料設備100的部分俯視圖。如圖4所示,該電路板投料設備100更包含複數第二傳送單元32、32’,在本實施例中,各該第二傳送單元32、32’係用以將位於該待送區40之電路板90傳送至對應的後端處理裝置50、50’。4 is a partial plan view of the circuit board feeding device 100 of the present embodiment. As shown in FIG. 4, the circuit board feeding device 100 further includes a plurality of second transfer units 32, 32'. In this embodiment, each of the second transfer units 32, 32' is used to be located in the to-be-sent area 40. The circuit board 90 is transferred to the corresponding back end processing device 50, 50'.
舉例來說,各該第二傳送單元32、32’為一三軸機械手臂,由於該第一傳送單元31(六軸機械手臂)已依據該X光定位裝置20的分析結果將該電路板90調整為一正確的送料位置並送至該待送區40,因此,各該第二傳送單元32(、32’)只需將位於該待送區40之電路板90傳送至對應的後端處理裝置50(、50’),便可對該電路板90進行後續處理。For example, each of the second transfer units 32, 32' is a three-axis robot arm, and the first transfer unit 31 (six-axis robot arm) has the circuit board 90 according to the analysis result of the X-ray positioning device 20. Adjusted to a correct feeding position and sent to the waiting area 40, therefore, each of the second transfer units 32 (, 32') only needs to transfer the circuit board 90 located in the waiting area 40 to the corresponding back end processing. Subsequent processing of the board 90 can be performed by the device 50 (, 50').
在本實施例中,係透過各該第二傳送單元32(、32’)將位於該待送區40之電路板90傳送至對應的後端處理裝置50(、50’),而非透過該第一傳送單元31將已被調整為正確位置之電路板90直接傳送至後端處理裝置50(、50’),這是為了使該電路板投料設備100中的各裝置進行分工,達成更有效率的處理。In this embodiment, the circuit board 90 located in the to-be-sent area 40 is transmitted to the corresponding back-end processing device 50 (, 50') through each of the second transfer units 32 (, 32') instead of transmitting the same. The first transfer unit 31 directly transfers the circuit board 90 that has been adjusted to the correct position to the back end processing device 50 (, 50') in order to divide the devices in the circuit board feeding device 100 into a division. Efficiency processing.
舉例來說,在這樣的分工操作下,由於該第一傳送單元31只需負擔將該電路板90調整為一正確的送料位置的工作,而將該電路板90傳送至對應的後端處理裝置50的工作係由該第二傳送單元32進行處理,當該第一傳送單元31將已調整為正確的送料位置的該電路板90送至該待送區40後,便可繼續傳送(並調整)另一片電路板91,與此同時,位於該待送區40的電路板90亦同步地由該第二傳送單元32送至對應的一後端處理裝置50,該後端處理裝置50便可開始進行後續處理。For example, under such a division operation, since the first transfer unit 31 only has to work to adjust the circuit board 90 to a correct feed position, the circuit board 90 is transferred to the corresponding back end processing device. The operation of 50 is processed by the second transfer unit 32. When the first transfer unit 31 sends the circuit board 90 adjusted to the correct feed position to the to-be-sent area 40, the transfer can be continued (and adjusted). Another circuit board 91, at the same time, the circuit board 90 located in the to-be-sending area 40 is also synchronously sent by the second transfer unit 32 to a corresponding back-end processing device 50, and the back-end processing device 50 can Start the follow-up process.
當該後端處理裝置50進行後續處理的期間,該第一傳送單元31便可將該另一片電路板91調整為一正確的送料位置並送至該待送區40,接著,由該第二傳送單元32’將位於該待送區40的電路板91送至對應的一後端處理裝置50’。後方將有更詳細的說明。During the subsequent processing by the backend processing device 50, the first transfer unit 31 can adjust the other chip board 91 to a correct feeding position and send it to the to-be-sending area 40, and then, by the second The transfer unit 32' sends the circuit board 91 located in the to-be-supplied area 40 to a corresponding back-end processing device 50'. A more detailed description will be given later.
在一實施例中,該投料區10被區分為複數子投料區,該等子投料區用以放置不同型號的電路板。類似地,該待送區40亦可被區分為複數子待送區,該等子待送區用以放置對應之不同型號的電路板。舉例來說,前述電路板90、91可為不同型號的電路板,而對應之後端處理裝置50、50’亦可為不同的處理機台,分別對電路板90、91進行不同的後續處理。要注意的是,該等子投料區、該等子待送區及對應之後端處理裝置的數量可依據電路板90、91的種類(數量)進行調整,亦即,在此實施例中,該電路板投料設備100可同時處理複數個不同型號的電路板,可更有效地節省人力與時間。In one embodiment, the feed zone 10 is divided into a plurality of sub-feed zones for placing different types of circuit boards. Similarly, the to-be-sending area 40 can also be divided into a plurality of sub-sending areas for placing corresponding different types of circuit boards. For example, the circuit boards 90 and 91 may be different types of circuit boards, and the corresponding rear end processing devices 50, 50' may be different processing machines, and the circuit boards 90 and 91 are respectively subjected to different subsequent processing. It should be noted that the number of the sub-feeding areas, the sub-to-be-sending areas, and the corresponding rear-end processing devices may be adjusted according to the type (number) of the circuit boards 90, 91, that is, in this embodiment, The circuit board feeding device 100 can process a plurality of different types of circuit boards at the same time, which can save manpower and time more effectively.
在本創作之實施例中,該等後端處理裝置50、50’可例如包括鑽靶機、自動裁磨線、曝光機、雷射鑽孔機、自動光學檢查(Automated Optical Inspection, AOI)、X光檢測機、雷射打標機、電鍍線定位機、Open/Short測試機等。電路板90在進入這些後端處理裝置50、50’前,皆需要先進行定位並調整為正確的位置後,才可放入這些後端處理裝置50、50’中進行後續處理。亦即,本創作之電路板投料設備100可應用於前述各種後端處理裝置50、50’的前端,確保電路板90係以正確的位置放入該等後端處理裝置50、50’中。In the embodiment of the present invention, the back end processing devices 50, 50' may include, for example, a drilling target machine, an automatic cutting line, an exposure machine, a laser drilling machine, an Automated Optical Inspection (AOI), X-ray detector, laser marking machine, plating line positioning machine, Open/Short testing machine, etc. Before entering the back end processing devices 50, 50', the circuit board 90 needs to be positioned and adjusted to the correct position before being placed in the back end processing devices 50, 50' for subsequent processing. That is, the circuit board feeding device 100 of the present invention can be applied to the front ends of the various back end processing devices 50, 50' described above, ensuring that the circuit board 90 is placed in the back end processing devices 50, 50' in the correct position.
圖5至圖11係為透過圖4所示之電路板投料設備100進行投料的流程。首先,如圖5所示,該第一傳送單元31將一電路板90從該投料區10傳送至該X光定位裝置20,由該X光定位裝置20分析該電路板90(見圖2、3),並依據該X光定位裝置20的分析結果,由該第一傳送單元31將該電路板90調整為一正確的送料位置。5 to 11 are flows through the circuit board feeding device 100 shown in Fig. 4. First, as shown in FIG. 5, the first transfer unit 31 transfers a circuit board 90 from the feeding zone 10 to the X-ray positioning device 20, and the X-ray positioning device 20 analyzes the circuit board 90 (see FIG. 3), and according to the analysis result of the X-ray positioning device 20, the circuit board 90 is adjusted to a correct feeding position by the first transmitting unit 31.
接著,如圖6所示,該第一傳送單元31將已調整為正確的送料位置的該電路板90送至該待送區40中,對應一後端處理裝置50的子待送區41。如圖7所示,該第二傳送單元32係接手該電路板90,準備將其運送至該後端處理裝置50進行處理。Next, as shown in FIG. 6, the first transfer unit 31 feeds the circuit board 90, which has been adjusted to the correct feed position, into the to-be-sent zone 40, corresponding to the sub-to-be-sending zone 41 of a back-end processing device 50. As shown in Figure 7, the second transfer unit 32 picks up the circuit board 90 and is ready to transport it to the back end processing device 50 for processing.
接著,如圖8所示,該第二傳送單元32將該電路板90運送至該後端處理裝置50進行處理。在該後端處理裝置50對該電路板90進行處理的期間,該第一傳送單元31同步地將一電路板91從該投料區10傳送至該X光定位裝置20,由該X光定位裝置20分析該電路板91,並依據該X光定位裝置20的分析結果,由該第一傳送單元31將該電路板91調整為一正確的送料位置。Next, as shown in FIG. 8, the second transfer unit 32 transports the circuit board 90 to the back end processing device 50 for processing. While the back end processing device 50 is processing the circuit board 90, the first transfer unit 31 synchronously transfers a circuit board 91 from the feeding area 10 to the X-ray positioning device 20, by the X-ray positioning device. The circuit board 91 is analyzed 20, and the circuit board 91 is adjusted to a correct feeding position by the first transfer unit 31 in accordance with the analysis result of the X-ray positioning device 20.
接著,如圖9所示,該第一傳送單元31將已調整為正確的送料位置的該電路板91送至該待送區40中,對應一後端處理裝置50’的子待送區42。如圖10所示,該第二傳送單元32’係接手該電路板91,準備將其運送至該後端處理裝置50’進行處理。Next, as shown in FIG. 9, the first transfer unit 31 sends the circuit board 91 that has been adjusted to the correct feed position to the to-be-sending area 40, corresponding to the sub-to-be-sending area 42 of a back-end processing device 50'. . As shown in Fig. 10, the second transfer unit 32' picks up the circuit board 91 and is ready to transport it to the back end processing device 50' for processing.
如圖11所示,在該後端處理裝置50’對該電路板91進行處理的期間,該第一傳送單元31同步地準備將一電路板92從該投料區10傳送至該X光定位裝置20,後續步驟將依上述方式持續進行。As shown in FIG. 11, during the processing of the circuit board 91 by the back end processing device 50', the first transfer unit 31 is synchronously prepared to transfer a circuit board 92 from the feeding area 10 to the X-ray positioning device. 20. The subsequent steps will continue as described above.
要注意的是,在圖5至圖11所示的實施例中,該等電路板90、91、92可為相同型號的電路板,因此,該等電路板90、91、92可存放於該投料區10中相同的位置,且該等後端處理裝置50、50’可進行相同的處理製程。It should be noted that in the embodiment shown in FIGS. 5 to 11, the circuit boards 90, 91, 92 may be the same type of circuit boards, and therefore, the circuit boards 90, 91, 92 may be stored in the board. The same position in the feeding zone 10, and the back end processing devices 50, 50' can perform the same processing process.
然於其他實施例中,該等電路板90、91、92亦可為不同型號的電路板,因此,該等電路板90、91、92可存放於該投料區10之不同的子投料區中,且該等後端處理裝置50、50’可進行不同的處理製程。In other embodiments, the circuit boards 90, 91, 92 may also be different types of circuit boards. Therefore, the circuit boards 90, 91, 92 may be stored in different sub-feed areas of the feeding area 10. And the backend processing devices 50, 50' can perform different processing processes.
承上述說明,由於本創作所提出之電路板投料設備100,不需要透過人力便能檢查並調整電路板的位置,以將電路板以正確的位置傳送至後端處理裝置進行處理,不僅節省人力與時間,也可有效避免由於人力失誤造成生產成本增加的問題。且在某些實施例中,可透過該等第二傳送單元與該第一傳送單元進行分工使該電路板投料設備中可同步對不同的電路板進行處理,亦可同時進行不同的後續製程,使整個製程更有效率。According to the above description, since the circuit board feeding device 100 proposed by the present invention can check and adjust the position of the circuit board without manpower, the circuit board can be transferred to the back end processing device for processing in the correct position, thereby saving labor. And time, can also effectively avoid the problem of increased production costs due to human error. In some embodiments, the second transfer unit and the first transfer unit can be divided to enable different circuit boards to be processed synchronously in the circuit board feeding device, and different subsequent processes can be performed simultaneously. Make the entire process more efficient.
本創作在上文中已以實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本創作,而不應解讀為限制本創作之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本創作之範疇內。因此,本創作之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in the above embodiments, and it should be understood by those skilled in the art that this embodiment is only used to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.
100‧‧‧電路板投料設備
10‧‧‧投料區
20‧‧‧X光定位裝置
21‧‧‧檢查平台
21-1‧‧‧第一側
21-2‧‧‧第二側
22‧‧‧感光範圍
23‧‧‧發光單元
25‧‧‧影像攝錄單元
31‧‧‧第一傳送單元
32、32’‧‧‧第二傳送單元
40‧‧‧待送區
41、42‧‧‧子待送區
71‧‧‧第一置放台
72‧‧‧第二置放台
90、91、92‧‧‧電路板
901‧‧‧正面
902‧‧‧背面
A1、A2‧‧‧定位孔
B‧‧‧防呆孔100‧‧‧Circuit feeding equipment
10‧‧‧Feeding area
20‧‧‧X-ray positioning device
21‧‧‧Check platform
21-1‧‧‧ first side
21-2‧‧‧ second side
22‧‧‧Photosensitive range
23‧‧‧Lighting unit
25‧‧‧Video Recording Unit
31‧‧‧First transmission unit
32, 32'‧‧‧second transmission unit
40‧‧‧Send area
41, 42‧‧‧Children's waiting area
71‧‧‧First placement table
72‧‧‧Second stage
90, 91, 92‧‧‧ circuit boards
901‧‧‧ positive
902‧‧‧Back
A1, A2‧‧‧ positioning holes
B‧‧‧Anti-deep hole
[圖1]係為本創作一實施例之電路板投料設備的部分俯視圖。 [圖2]係為本創作一實施例之X光定位裝置的示意圖。 [圖3A]至[圖3D]係為本創作一實施例中,該第一傳送單元將一電路板自該投料區傳送至該檢查裝置(的檢查平台上)的四種情況。 [圖4]係為本創作一實施例之電路板投料設備的部分俯視圖。 [圖5]至[圖11]係為透過圖4所示之電路板投料設備進行投料的流程。1 is a partial plan view of a circuit board feeding device according to an embodiment of the present invention. FIG. 2 is a schematic diagram of an X-ray positioning device according to an embodiment of the present invention. [Fig. 3A] to [Fig. 3D] are the four cases in which the first transfer unit transfers a circuit board from the feeding area to the inspection platform of the inspection apparatus. Fig. 4 is a partial plan view showing a circuit board feeding device of an embodiment of the present invention. [Fig. 5] to [Fig. 11] are flows through the circuit board feeding device shown in Fig. 4.
Claims (7)
Priority Applications (1)
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TW106217450U TWM557449U (en) | 2017-11-23 | 2017-11-23 | Circuit board material feeding equipment |
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Application Number | Priority Date | Filing Date | Title |
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TW106217450U TWM557449U (en) | 2017-11-23 | 2017-11-23 | Circuit board material feeding equipment |
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Publication Number | Publication Date |
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TWM557449U true TWM557449U (en) | 2018-03-21 |
Family
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Country | Link |
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TW (1) | TWM557449U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111102917A (en) * | 2018-10-26 | 2020-05-05 | 得力富企业股份有限公司 | Centroid detection equipment for circuit boards |
-
2017
- 2017-11-23 TW TW106217450U patent/TWM557449U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111102917A (en) * | 2018-10-26 | 2020-05-05 | 得力富企业股份有限公司 | Centroid detection equipment for circuit boards |
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