TWM480712U - Clamping device for mounting motion sensing chip - Google Patents

Description

Interposer for mounting a motion sensing wafer

The present invention relates to an interposing device, and more particularly to an interposing device for mounting a motion sensing wafer.

With the development of science and technology, more and more sports events are moving toward the trend of manpower reduction and automation. For example, motion sensing chips are the best example. Motion-sensing chips are often attached to the athletes and set up a signal receiving system at each level to calculate the movement information of the player's time, ranking, number of turns, speed, etc., which can be greatly simplified through automated facilities. The manpower required and the accuracy and fairness of information measurement.

However, motion-sensing chips are prone to interference due to contact with the human body, which causes errors in the transmitted information, reduces the accuracy and fairness of the measurement, and has a significant impact on the event.

Accordingly, it is an object of the present invention to provide an interposer for mounting a motion sensitive wafer and spacing the motion sensitive wafer from the human body.

Therefore, the clamping device for mounting the motion sensing chip of the present invention can be clamped on a user's clothing, and the clamping device comprises a sheet. a clamping seat and a clamping member extending outwardly from the clamping seat and engageable with respect to the clamping seat. The clamping seat and the clamping member are matched to be sandwiched on the garment to expose the clamping member to the outside of the garment. The motion sensing wafer is disposed on the clamping device and faces the direction of travel of the user.

The utility model has the advantages that the motion sensing wafer is disposed on the clamping device, and the motion sensing wafer is oriented toward the user and does not directly touch the user, thereby avoiding the human body from generating the motion sensing wafer. Interference to improve measurement accuracy.

1‧‧‧Clamping device

11‧‧‧Clip seat

111‧‧‧ openings

12‧‧‧Clamping parts

121‧‧‧Installation surface

122‧‧‧ pattern

123‧‧‧Back

13‧‧‧Combination unit

14‧‧‧Reinforcement unit

131‧‧‧First joint

132‧‧‧Second joint

2‧‧‧Users

21‧‧‧ Clothing

211‧‧‧ clothes

212‧‧‧ pants

213‧‧‧ hat

214‧‧‧ shoes

3‧‧‧Motion sensor chip

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a perspective view showing a preferred embodiment of the present invention for mounting a motion sensing wafer; 2 is a side view for assistance in explaining FIG. 1; FIG. 3 to FIG. 6 are schematic views showing different embodiments of the clamping device in the preferred embodiment; and FIGS. 7 to 10 are perspective views. A number of different aspects of the preferred embodiment are illustrated.

Referring to FIG. 1 , FIG. 2 , and FIG. 3 , a preferred embodiment of the present invention for mounting a motion sensing wafer is provided on a garment 21 of a user 2 . The clamping device 1 is Made of plastic steel and comprising a clip 11 which is in the form of a sheet and surrounds an opening 111, and a clip 11 is outwardly a clamping member 12 extending and slidable relative to the holder 11 to shield the opening 111, a coupling unit 13 between the clamping seat 11 and the clamping member 12, and a clamping member 12 disposed on the clamping member 12 A reinforcing unit 14 for sandwiching the garment 21 is provided. The clamping member 12 includes a mounting surface 121 facing the direction of travel of the user 2, a pattern 122 disposed on the mounting surface 121, and a back surface 123 opposite the mounting surface 121. The coupling unit 13 includes a first coupling member 131 disposed on the clamping seat 11, and is disposed on the clamping member 12 and engages with the first coupling member 131 to enable the clamping seat 11 and the clamping portion The piece 12 is openably coupled to the second coupling member 132. The reinforcing unit 14 is disposed on the back surface 123 of the clamping member 12 for reinforcing the bonding strength with the clothing 21.

The holder 11 and the holder 12 are matched to be sandwiched on the garment 21 to expose the holder 12 to the outside of the garment 21, and the motion sensing wafer 3 is spaced apart from the pattern 122. On the mounting surface 121 and facing the direction of travel of the user 2. The clamping device 1 can be placed on the pockets, neckline, cuffs, belts, brims, and shoes of different types of apparel 21, such as clothes 211, pants 212, hats 213, and shoes 214, as shown in FIGS. 3-6. Different positions such as tongue, but not limited to this.

In the preferred embodiment, the pattern 122 may be an advertisement or trademark provided by a sponsor to increase recognition and versatility. The bonding unit 13 can be a male and female buckle, a devil felt, and a magnetic buckle, or other functionally similar components. The reinforcing unit 14 can be a clip, a pin, or other functionally similar component. The clamping device 1 may also have a shape as shown in FIG. 7 to FIG. 10, and is not limited thereto.

In summary, the clamping device 1 is made of plastic steel, and can improve the clamping force, and the clamping member 12 is exposed on the clothing 21 through the clamping seat 11 and the clamping member 12 is exposed thereto. The motion sensing wafer 3 attached to the mounting surface 121 of the clamping member 12 is spaced apart from the human body toward the traveling direction of the user 2 to avoid interference, and the pattern 122 is The identification and the aesthetics are improved, and the combination of the unit 13 and the reinforcing unit 14 increases the stability and versatility of the combination, so that the object of the present invention can be achieved.

However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the patent specification, All remain within the scope of this new patent.

1‧‧‧Clamping device

11‧‧‧Clip seat

111‧‧‧ openings

12‧‧‧Clamping parts

121‧‧‧Installation surface

122‧‧‧ pattern

123‧‧‧Back

13‧‧‧Combination unit

14‧‧‧Reinforcement unit

131‧‧‧First joint

132‧‧‧Second joint

3‧‧‧Motion sensor chip

Claims (8)

An interposing device for mounting a motion sensing chip, which can be clamped on a user's clothing, the clamping device comprising a clip-shaped holder, and an outer portion extending from the holder and being opposite to the a clamping member that is engaged with the clamping seat, the clamping seat and the clamping member are matched to be clamped on the garment to expose the clamping member to the outside of the garment, and the motion sensing wafer is disposed on the clamping device Up and toward the direction of travel of the user. The clamping device for mounting a motion sensing wafer according to claim 1, wherein the clamping member comprises a mounting surface facing the traveling direction of the user, and a motion sensing chip opposite to the back surface of the mounting surface It is disposed on the mounting surface of the clamping member. The clamping device for mounting a motion sensing wafer according to claim 2, further comprising a bonding unit between the clamping seat and the clamping member, the bonding unit comprising a first combination disposed on the clamping seat And a second coupling member disposed on the clamping member and engageable with the first coupling member to openably engage the clamping seat and the clamping member. The clamping device for mounting a motion sensing wafer according to claim 3, wherein the bonding unit is selected from a male and female buckle, a devil felt, and a magnetic buckle. The clamping device for mounting the motion sensing wafer according to claim 3, further comprising a reinforcing unit disposed on the back side of the clamping member for clamping the clothing. The clamping device for mounting a motion sensing wafer according to claim 5, wherein the reinforcing unit is selected from a clip and a pin. The clamping device for mounting a motion sensing wafer according to claim 2, wherein the clamping member further comprises a pattern disposed on the mounting surface spaced apart from the motion sensing wafer. The device for mounting a motion-sensing wafer according to claim 1, wherein the material of the clamping device is plastic steel.