五、新型說明： 【新型所屬之技術領域】 本創作係與-種空調設備有關，更詳而言之，其係利用至少一致 冷明片於·•熱對流通道及—冷卻通道内產生兩種高低溫度不同之流動 空氟，藉以進行空氣溫度調節之設備。 【先前技術】 習用空調設備如冷氣機大多糊壓縮機對冷行壓縮，再由管 路通過冷凝器、膨脹閥、蒸發器等組件，產生預設溫度之流動空氣以 進行空氣溫度靖’但由於-赌職本身具有—定之贿且加上 相關的管路、冷❹、膨脹紐料組件造成配置不易，且其組 成複雜4發生故障’且轉檢測較不容S ;而舰機運轉之同時容 易產生低頻噪音，不但會影響到環境生活品質長時間處於嗓音環境 下也亦使人身體健康受到影響；再者，使用冷媒作為空調手段一直存 在有破壞大自然環境之疑慮。 【新型内容】 傳統習用之空調設備大多採用冷媒壓縮機產生低溫空氣以作為溫 度調節之方式，但壓縮機本身具有一定之趙積、相關管路及控制零組 件複雜、故障維修不易等問題，加上冷媒具有破壞大自然環境之疑慮 因此’本創作係提供-種具有高效率、構成簡單、不易故障維修方 便且無任何環保危害的具致冷晶片之冷暖氣機設備。 本創作一種具致冷晶片之冷暖氣機設備，其係包含有： -機殼’其⑽具有—熱對流通道及一冷卻通道該熱對流通道 M392331 係於該機殼表面設有複數散熱孔及至少一散熱風口；而該冷卻通道係 於該機殼表面設有複數冷卻孔及至少一冷卻風口； 一熱傳導模組，其係於該熱對流通道鄰接該冷卻通道處設有一熱 傳導塊’該熱傳導塊更連接設有一熱擴散鰭片組，該熱擴散鰭片組於 對應該散熱風口處設有至少一散熱風扇； 一冷卻傳導模組，其係於該冷卻通道鄰接該熱對流通道處設有一 冷卻傳導塊’該冷卻傳導塊更連接設有一冷卻擴散鰭片組，該冷卻散 鰭片組於對應該冷卻風口處設有至少一冷卻風扇； 謂 至少一致冷晶片’該致冷晶片係設於該熱傳導塊與該冷卻傳導塊 間’且該致冷晶片係包含有一致熱端及一致冷端，該致熱端係連接於 該熱傳導塊’而該致冷端係連接於該冷卻傳導塊。 本創作之主要目的係在於：利用該致冷晶片作為溫度調節之來 源’其構成簡單、所佔空間體積甚小、維修方便，亦無噪音污染之問 題產生，且其免除掉習用冷媒管路配置之問題，可方便配置以應用於 各種不同目的與場所。 | 本創作之第二目的係在於：該熱傳導塊與該熱擴散鰭片組以及該 冷卻傳導塊與該冷卻擴散鰭片組係為鋁擠型一體成型者，可具有相當 良好之熱傳導效果，當該熱擴散鰭片將熱量傳導至該熱對流通道或該 冷卻擴散鰭片組自該冷卻通道吸熱時，可達到更佳之熱交換效率。 本創作之第三目的係在於：該熱對流通道及該冷卻通道係為垂直 上下對應設置，利用熱對流之方式可加速該熱傳導模組之散熱效果， 避免熱量累積於該致冷晶片之致熱端，使該致冷晶片之致冷端能產生 4 更佳之制冷效果。 本創作之第四目的係在於：該熱傳導塊與該機殼間設有—第一阻 隔件且該冷卻傳導塊與該機殼間設有_第二_件俾使得該熱對 流通道及該冷魏為相互_，且於域料塊_冷卻傳導塊 間及該致冷明片周圍之容置空間内更進一步填充設有隔熱材料，俾使 得該熱對流通道及該冷卻通道内之空氣不會因為機朗之熱對流或熱 傳導，降低冷卻或加熱之效果。 【實施方式】 為便於說明本創作於上述新型内容一搁中所表示的中心思想兹 以具想實施例表達。實施例巾各鮮同物件係按適於綱之比例、尺 寸、變形量或位移量而描緣，而非按實際元件的比例予讀製合先 敘明。且以下的說明中’類似的元件是以相_編號來表示。 如第-圖〜第四圖圖面所示，本創作一種具致冷晶片之冷暖氣機設 備，其係包含有一機殼1〇、一熱傳導模組2〇、一冷卻傳導模組3〇、 以及至少一致冷晶片40 ; 該機殼1〇内部係具有一熱對流通道Ή及一冷卻通道12，該熱對 流通道11及該冷純道12係為垂直上τ對應設置者，且該熱對流通 道11於該機殼10設有複數散熱孔111及至少一散熱風口 112，各散 熱孔111之垂直尚度係高於該散熱風口 112 ;而該冷卻通道12係於該 機殼10表面設有複數冷卻孔121及至少一冷卻風口 122 ,各冷卻孔 121之垂直高度係低於該冷卻風口彳22 ; 該熱傳導模組20係於該熱對流通道μ鄰接該冷卻通道12處設有 M392331 一熱傳導塊21 ’該熱傳導塊21更連接設有一熱擴散鰭片組22，該熱 擴散鰭片組22係設置於該熱傳導塊21上方，且該熱擴散鰭片組22於 對應該散熱風口 112處設有至少一散熱風扇23 ; 該冷卻傳導模組30係於該冷卻通道12鄰接該熱對流通道11處設 有一冷卻傳導塊31，該冷卻傳導塊31更連接設有一冷卻擴散鰭片組 32，該冷卻擴散鰭片組32係設置於該冷卻傳導塊31下方，且該冷卻 散鰭片組32於對應該冷卻風口 122處設有至少一冷卻風扇33 ; 其中，該冷卻傳導塊31係為一 L型截面塊體，且該熱傳導塊21 φ 係為形狀相對應之倒L型截面塊鱧，該熱傳導塊21與該冷卻傳導塊 31係於該機殼10内相對向設置，俾以於兩者間形成一容置空間5〇 ; 再者’該熱傳導塊21與該機殼1〇間係以一第一阻隔塊24連接固定， 且該冷卻傳導塊31與該機殼1〇間係以一第二阻隔塊34連接固定，藉 此該機殼10被區分為上下垂直相對之該熱對流通道11及該冷卻通道 12 ’俾使得該熱對流通道11及該冷卻通道12係為相互阻隔且不相流 通者； 籲 該致冷晶片40係設於該熱傳導塊21與該冷卻傳導塊31間之容置 空間50内，且該致冷晶片40係包含有一致熱端41及一致冷端42 , 該致熱端41係連接於該熱傳導塊21，而該致冷端42係連接於該冷卻 傳導塊31 ;而該冷卻傳導塊31與該熱傳導塊21間及該致冷晶片40 周圍之容置空間50内係填充設有一隔熱材料51。 再者’該機殼10上凹設有一控制槽13，該控制槽13俾可供一控 制器60置者。該控制器60係與該致冷晶片40、該散熱風扇23及該 6 M392331 冷卻風扇33電性相連接，俾以控制各裝置作動或停止者。 明瞭上述本創作詳細結構後，以下係針對本創作之動作原理逐一 詳細說明： 如第五關面所示，其係為本創作實施於—卫作機台以進行供應 冷卻空氣之f施狀態，該機殼1G上可設有連接裝置⑽其附掛於該工 作機台上，該冷卻風口 122與該等冷卻孔121係與該工作機台内部相 連通；由於該致冷晶片40内部係由複數具一 N型半導體及一 p型半 導體所連成之熱電偶所組成，當電流由N型半導體流向p型半導體時 會吸收熱量，而當電流由P型半導體流向N型半導體時會釋出熱量； 因此’當控制器60控制該致冷晶片40通電運作時，該致冷晶片4〇可 將該致冷端42之熱量移轉至該致熱端41，因而使得與其相連接之該 冷卻傳導塊31與該冷卻擴散鰭片組32溫度開始下降，而該熱傳導塊 21與該熱擴散鰭片組22之溫度則開始提高； 同時該冷卻風扇33亦開始運作以帶動該冷卻通道之空氣流 動，而自該工作機台内將需降溫之空氣導入該冷卻通道12，並藉由該 冷卻擴散鰭片組32與需降溫之空氣產生熱交換降溫，再將降溫後之冷 卻空氣排放至工作機台内，藉此達到降低工作機台溫度之效果；此外， 該散熱風扇23亦同時運作以帶動該熱對流通道μ内之空氣開始流 動，並自機殼10外部將冷空氣導入熱對流通道彳彳内，藉由該熱擴散 鰭片組22與外界導入之冷空氣產生熱交換，使外界導入之空氣受熱升 溫’再將溫度升高後之熱空氣排出至外界，藉此以將不需要之廢熱排 除至大氣。 7 M392331 由於該致冷晶月40主要疋利用N型半導體及p型半導趙通電後 所產生之熱量移轉以進行升溫或降溫，該致冷晶片之致熱端及 致冷端42於相同電壓及電流之條件下，係維持一穩定之溫差。當該致 熱端41之溫度越低時，該致冷端42之降溫效果越好。 因此，本創作係將該熱對流通道11及該冷卻通道12採垂直上下 對應設置，利用熱對流之方式可加速該熱傳導模組2〇之散熱效果，避 免熱量累積於該致冷晶片40之致熱端41，使該致冷晶片4〇之致冷端 42此產生更佳之制冷效果，有效維持該致冷晶片之降溫效果。再鲁 者，為增加本創作之熱交換效率，該熱傳導塊21與該熱擴散鰭片組22 係為一體成型製造，例如該熱傳導塊21與該熱擴散鰭片22組係可為 鋁擠型一體成型者，且該冷卻傳導塊31與該冷卻擴散鰭片組32亦可 為一體成型製造，例如該冷卻傳導塊31與該冷卻擴散鰭片組32係可 為鋁擠型-體成型者。藉此，該熱傳導塊21與該熱擴散則22間以 及該冷卻傳導塊31與該冷卻擴散鰭片組32間係可具有相當良好之熱 傳導效果，當該熱擴散鰭片22將熱量傳導至該熱對流通道Ή或該冷· 卻擴散錄片組32自該冷卻通道12吸熱時，可達到更佳之熱交換效率。 此外，該熱傳導塊21與該機殼10間設有該第一阻隔件24，且該 冷卻傳導塊31與該機殼10間設有該第二阻隔件34，俾使得該熱對流 通道11及該冷卻通道12係為相互分隔設計者，且一般空氣遇熱時會 上升、冷部時會下降，而藉由該熱對流通道11位於該冷卻通道12上 方之設計’可確保該熱對流通道11及該冷卻通道12内之空氣不會因 為對流產生熱量交換；再者，於該熱傳導塊21與該冷卻傳導塊31間 8 M392331 及該致冷晶片40周圍之容置空間5〇内更進一步填充設有隔熱材料 51 ’俾使得該熱傳導塊21與該冷卻傳導塊31間不會再次發生熱量交 換、降低冷卻或加熱之效果，且該第―_件24及該第二阻隔件料 亦可為隔歸質，_免該熱料塊21與該冷卻料塊31錢殼1〇 發生熱傳導。V. New description: [New technology field] This creation department is related to a kind of air-conditioning equipment. In more detail, it uses at least two identical cold and cold convection channels and two cooling channels to generate two A kind of equipment that regulates air temperature by using high and low temperature and different flow of empty fluorine. [Prior Art] Conventional air conditioning equipment, such as air-conditioner, mostly compresses the compressor for cold compression, and then passes the pipeline through the condenser, expansion valve, evaporator and other components to generate the flow air of the preset temperature to perform the air temperature. - The gambling job itself has a certain bribe and the related pipelines, cold heading, and expansion of the button components make the configuration difficult, and its composition is complicated. 4 The failure occurs, and the rotation detection is less than S; while the ship is easy to produce while running. Low-frequency noise will not only affect the quality of environmental life. It also affects people's health when they are in a vocal environment for a long time. Moreover, the use of refrigerant as an air-conditioning method has always had doubts about the destruction of the natural environment. [New content] Most of the conventional air-conditioning equipment use refrigerant compressor to generate low-temperature air as a way of temperature regulation, but the compressor itself has certain problems such as Zhao product, related pipelines and control components, and difficult maintenance. The above-mentioned refrigerant has the doubt that it destroys the natural environment. Therefore, this creation provides a cold-heating machine with a cold chip that is highly efficient, simple in construction, easy to repair, and free from any environmental hazards. The present invention relates to a cold-heating device with a cooling chip, which comprises: a casing (10) having a heat convection passage and a cooling passage. The heat convection passage M392331 is provided with a plurality of heat dissipation on the surface of the casing. a hole and at least one heat dissipating vent; wherein the cooling channel is provided with a plurality of cooling holes and at least one cooling vent on the surface of the casing; a heat conducting module is disposed at the heat convection channel adjacent to the cooling channel and is provided with a heat conducting block The heat conducting block is further connected to be provided with a heat diffusion fin group, wherein the heat diffusion fin group is provided with at least one heat dissipating fan at a corresponding heat dissipating air outlet; a cooling conduction module is connected to the cooling channel adjacent to the heat pair a cooling conduction block is disposed at the road. The cooling conduction block is further connected with a cooling diffusion fin group, and the cooling fin assembly is provided with at least one cooling fan at the corresponding cooling air outlet; The wafer is disposed between the heat conducting block and the cooling conductive block and the cooling chip comprises a uniform hot end and a uniform cold end, the heating end being connected to the heat conducting block and the cooling is The end is connected to the cooling conductive block. The main purpose of this creation is to use the cold-formed wafer as a source of temperature regulation, which is simple in structure, small in space occupied, easy to maintain, and free from noise pollution, and it eliminates the use of conventional refrigerant piping. The problem can be easily configured to be applied to various purposes and places. The second object of the present invention is that the heat conduction block and the heat diffusion fin group and the cooling diffusion block and the cooling diffusion fin group are integrally formed by aluminum extrusion, and have a relatively good heat conduction effect. The heat diffusion fins conduct heat to the heat convection passage or the cooling diffusion fin group absorbs heat from the cooling passage to achieve better heat exchange efficiency. The third purpose of the present invention is that the heat convection channel and the cooling channel are vertically arranged correspondingly, and the heat convection can accelerate the heat dissipation effect of the heat conduction module to avoid heat accumulation on the refrigerant chip. The hot end enables the cold end of the cooled wafer to produce a better cooling effect. The fourth object of the present invention is to provide a first barrier between the heat conducting block and the casing, and a second component between the cooling conductive block and the casing such that the heat convection passage and the The cold Wei is mutually _, and is further filled with a heat insulating material in the accommodating space between the domain block_cooling conductive block and the cooling slab, so that the heat convection channel and the cooling channel are The air does not convect or heat the heat due to the heat of the machine, reducing the effect of cooling or heating. [Embodiment] For the convenience of description, the central idea expressed in the above novel content is expressed in the preferred embodiment. The various articles of the embodiment towel are drawn according to the proportion, size, deformation or displacement of the suitable articles, and are not described in the actual components. And the similar elements in the following description are denoted by phase number. As shown in the figure of FIG. 4 to FIG. 4, the present invention provides a cooling and heating device with a cooling chip, which comprises a casing 1 , a heat conduction module 2 , a cooling conduction module 3 , And at least one of the cold wafers 40; the inner casing 1 has a heat convection passage Ή and a cooling passage 12, and the heat convection passage 11 and the cold passage 12 are vertically τ corresponding to the setter, and the The heat convection channel 11 is provided with a plurality of heat dissipation holes 111 and at least one heat dissipation vent 112 in the casing 10. The vertical radii of each of the heat dissipation holes 111 is higher than the heat dissipation vent 112; and the cooling channel 12 is attached to the casing 10 The surface is provided with a plurality of cooling holes 121 and at least one cooling vent 122. The vertical height of each cooling hole 121 is lower than the cooling vent 22; the heat conducting module 20 is disposed adjacent to the cooling channel 12 There is a heat transfer block 21 of the M392331. The heat conduction block 21 is further connected with a heat diffusion fin group 22, and the heat diffusion fin group 22 is disposed above the heat conduction block 21, and the heat diffusion fin group 22 is disposed to dissipate heat. At least one cooling fan 23 is disposed at the tuyere 112; the cooling transmission The module 30 is disposed on the cooling channel 12 adjacent to the heat convection channel 11 and is provided with a cooling conductive block 31. The cooling conductive block 31 is further connected with a cooling diffusion fin group 32. The cooling diffusion fin group 32 is disposed on the cooling diffusion block 31. The cooling conductive block 31 is disposed under the cooling fins 32, and the cooling fins 122 are provided with at least one cooling fan 33; wherein the cooling conducting block 31 is an L-shaped block, and the heat conducting block 21 φ is an inverted L-shaped block 形状 corresponding to the shape, the heat conducting block 21 and the cooling conductive block 31 are disposed opposite to each other in the casing 10 to form an accommodating space 5 两者 between the two; Furthermore, the heat conducting block 21 and the casing 1 are connected and fixed by a first blocking block 24, and the cooling conducting block 31 and the casing 1 are connected and fixed by a second blocking block 34. The casing 10 is divided into the heat convection passage 11 and the cooling passage 12 ′ that are vertically opposed to each other such that the heat convection passage 11 and the cooling passage 12 are mutually blocked and not circulated; The cold wafer 40 is disposed between the heat conduction block 21 and the cooling conduction block 31. The cooling film 40 includes a uniform hot end 41 and a uniform cold end 42 connected to the heat conducting block 21, and the cooling end 42 is connected to the cooling conducting block. A heat insulating material 51 is filled in the accommodating space 50 between the cooling conductive block 31 and the heat conducting block 21 and around the cooling chip 40. Furthermore, the casing 10 is recessed with a control slot 13 which can be placed by a controller 60. The controller 60 is electrically connected to the cooling chip 40, the cooling fan 23, and the 6 M392331 cooling fan 33 to control the operation or stop of each device. After clarifying the above detailed structure of the creation, the following is a detailed description of the action principle of the creation: As shown in the fifth level, it is implemented in the creation machine to supply the cooling air. The casing 1G may be provided with a connecting device (10) attached to the working machine, and the cooling air port 122 and the cooling holes 121 are connected to the working machine table; since the cooling chip 40 is internally A plurality of thermocouples having an N-type semiconductor and a p-type semiconductor are combined to absorb heat when the current flows from the N-type semiconductor to the p-type semiconductor, and are released when the current flows from the P-type semiconductor to the N-type semiconductor. Heat; therefore, when the controller 60 controls the operation of the refrigerating wafer 40, the refrigerating wafer 4 can transfer the heat of the refrigerating end 42 to the heating end 41, thereby causing the cooling to be connected thereto. The temperature of the conductive block 31 and the cooled diffusion fin group 32 begins to decrease, and the temperature of the heat conduction block 21 and the heat diffusion fin group 22 starts to increase; meanwhile, the cooling fan 33 also starts to operate to drive the air of the cooling channel. Moving, the air to be cooled is introduced into the cooling passage 12 from the working machine, and the cooling diffusion fin group 32 is cooled by heat exchange with the air to be cooled, and then the cooling air after cooling is discharged to work. In the machine, the effect of reducing the temperature of the working machine is achieved; in addition, the cooling fan 23 also operates to drive the air in the heat convection channel μ to start flowing, and introduces cold air into the heat pair from outside the casing 10. In the flow channel, the heat diffusion fin group 22 exchanges heat with the cold air introduced from the outside, so that the air introduced by the outside is heated and heated, and then the hot air after the temperature is raised is discharged to the outside, thereby Unwanted waste heat is removed to the atmosphere. 7 M392331 Since the cooling crystal 40 is mainly subjected to heat transfer generated by energization of the N-type semiconductor and the p-type semiconductor, the heating and cooling ends 42 of the refrigerating wafer are the same. Under the condition of voltage and current, a stable temperature difference is maintained. When the temperature of the heating terminal 41 is lower, the cooling effect of the cooling terminal 42 is better. Therefore, in the present invention, the heat convection passage 11 and the cooling passage 12 are vertically disposed correspondingly, and the heat convection can accelerate the heat dissipation effect of the heat conduction module 2 to prevent heat from accumulating in the refrigerant wafer 40. The heating end 41 causes the cooling end 42 of the refrigerating wafer 4 to produce a better cooling effect, effectively maintaining the cooling effect of the refrigerating wafer. In order to increase the heat exchange efficiency of the present invention, the heat conduction block 21 and the heat diffusion fin group 22 are integrally formed. For example, the heat conduction block 21 and the heat diffusion fin 22 may be aluminum extruded. The integrally formed one, and the cooling conductive block 31 and the cooling diffusion fin group 32 may also be integrally formed. For example, the cooling conductive block 31 and the cooling diffusion fin group 32 may be aluminum extruded body-formers. Thereby, the heat conduction block 21 and the heat diffusion layer 22 and the cooling conduction block 31 and the cooling diffusion fin group 32 can have a relatively good heat conduction effect, when the heat diffusion fin 22 conducts heat to the A better heat exchange efficiency can be achieved when the heat convection passage or the cold diffusion recording set 32 absorbs heat from the cooling passage 12. In addition, the first blocking member 24 is disposed between the heat conducting block 21 and the casing 10, and the second blocking member 34 is disposed between the cooling conducting block 31 and the casing 10 such that the heat convection passage 11 is provided. And the cooling channel 12 is designed to be separated from each other, and generally the air rises when it is hot, and the cold part drops, and the design of the heat convection channel 11 above the cooling channel 12 ensures the heat pair. The air in the flow channel 11 and the cooling channel 12 is not exchanged for heat due to convection; further, 8 M392331 between the heat conducting block 21 and the cooling conductive block 31 and the accommodating space around the cooling chip 40 Further, the insulating material 51 ′ is provided to be filled so that heat exchange between the heat conducting block 21 and the cooling conductive block 31 does not occur again, and cooling or heating is reduced, and the first member 24 and the second blocking member are further disposed. The material may also be partitioned, and the heat block 21 and the cooling block 31 are thermally conductive.
令⑽亚m應用於1作機台之降溫使用，由於本創 作可同時產生冷無種不同溫度之^氣，亦可作為—良好之加熱來 源’例如可作為同時具有冷暖氣之室内空調機。 雖然本創作是以-幫佳實施醜，但精於此技藝者能在不 脫離本創作精神與範訂做各種不_式的改變1上所舉實施例僅 用以說明本創作而已，非_制本創作之妳舉凡柯本創作精 神所從事的種種做或變化，俱屬糊㈣料利範圍。 9 M392331 【圖式簡單說明】 第一圖為本創作之立體外觀組合示意圖。 第二圖為本創作之立體外觀分解示意圖。 第三圖為本創作之剖面示意圖。 第四圖為第三圖之局部放大示意圖。 第五圖為本創作實施於一工作機台之狀態示意圖。 冷卻傳導模組30 冷卻傳導塊31 冷卻擴散鰭片組32 冷卻風扇33 第二阻隔塊34 致冷晶片40 致熱端41 致冷端42 容置空間50 隔熱材料51 控制器60 【主要元件符號說明】 機殼10 熱對流通道11 散熱孔111 散熱風口 112 冷卻通道12 冷卻孔121 冷卻風口 122 控制槽13 熱傳導模組20 熱傳導塊21 熱擴散鰭片組22 散熱風扇23 第一阻隔塊24Let (10) sub-m be used for the cooling of the machine. Since this creation can simultaneously produce cold and different temperatures, it can also be used as a good heating source. For example, it can be used as an indoor air conditioner with both air conditioning and heating. Although this creation is based on the implementation of the ugly, but the skilled person can do without deviating from the spirit of the creation and the various changes made by the model. The embodiment is only used to illustrate the creation, not _ The creations and changes in the creation of the spirit of the creation of the book are all in the form of profit. 9 M392331 [Simple description of the diagram] The first picture is a schematic diagram of the three-dimensional appearance of the creation. The second figure is a schematic exploded view of the three-dimensional appearance of the creation. The third picture is a schematic cross-sectional view of the creation. The fourth figure is a partial enlarged view of the third figure. The fifth figure is a schematic diagram of the state in which the creation is implemented on a working machine. Cooling conduction module 30 Cooling conduction block 31 Cooling diffusion fin group 32 Cooling fan 33 Second blocking block 34 Cooling wafer 40 Heating end 41 Cooling end 42 accommodating space 50 Insulation material 51 Controller 60 [Main component symbol Description] Case 10 Thermal convection channel 11 Cooling hole 111 Cooling vent 112 Cooling channel 12 Cooling hole 121 Cooling vent 122 Control slot 13 Thermal conduction module 20 Thermal conduction block 21 Thermal diffusion fin set 22 Cooling fan 23 First blocking block 24